WO2008126821A1 - へテロ接合を有する半導体装置 - Google Patents

へテロ接合を有する半導体装置 Download PDF

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Publication number
WO2008126821A1
WO2008126821A1 PCT/JP2008/056869 JP2008056869W WO2008126821A1 WO 2008126821 A1 WO2008126821 A1 WO 2008126821A1 JP 2008056869 W JP2008056869 W JP 2008056869W WO 2008126821 A1 WO2008126821 A1 WO 2008126821A1
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WO
WIPO (PCT)
Prior art keywords
hetero junction
semiconductor device
plane
hetero
junction
Prior art date
Application number
PCT/JP2008/056869
Other languages
English (en)
French (fr)
Inventor
Tsutomu Uesugi
Kenji Ito
Osamu Ishiguro
Tetsu Kachi
Masahiro Sugimoto
Original Assignee
Kabushiki Kaisha Toyota Chuo Kenkyusho
Toyota Jidosha Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Toyota Chuo Kenkyusho, Toyota Jidosha Kabushiki Kaisha filed Critical Kabushiki Kaisha Toyota Chuo Kenkyusho
Priority to US12/595,253 priority Critical patent/US8299498B2/en
Publication of WO2008126821A1 publication Critical patent/WO2008126821A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/2003—Nitride compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/20—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds
    • H01L29/201—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys
    • H01L29/205—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only AIIIBV compounds including two or more compounds, e.g. alloys in different semiconductor regions, e.g. heterojunctions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007—Multistep manufacturing processes
    • H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409—Unipolar field-effect transistors
    • H01L29/66446—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET]
    • H01L29/66462—Unipolar field-effect transistors with an active layer made of a group 13/15 material, e.g. group 13/15 velocity modulation transistor [VMT], group 13/15 negative resistance FET [NERFET] with a heterojunction interface channel or gate, e.g. HFET, HIGFET, SISFET, HJFET, HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7786—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface with direct single heterostructure, i.e. with wide bandgap layer formed on top of active layer, e.g. direct single heterostructure MIS-like HEMT
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7788—Vertical transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/778—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface
    • H01L29/7789—Field effect transistors with two-dimensional charge carrier gas channel, e.g. HEMT ; with two-dimensional charge-carrier layer formed at a heterojunction interface the two-dimensional charge carrier gas being at least partially not parallel to a main surface of the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/772—Field effect transistors
    • H01L29/78—Field effect transistors with field effect produced by an insulated gate
    • H01L29/7827—Vertical transistors
    • H01L29/7828—Vertical transistors without inversion channel, e.g. vertical ACCUFETs, normally-on vertical MISFETs

Abstract

　半導体装置１０は、バンドギャップの幅が異なる２種類の窒化物半導体で構成されている第１ヘテロ接合４０ｂと、その第１ヘテロ接合４０ｂに電気的に接続可能であるとともにバンドギャップの幅が異なる２種類の窒化物半導体で構成されている第２ヘテロ接合５０ｂと、第２ヘテロ接合５０ｂに対向しているゲート電極５８を備えている。第１ヘテロ接合４０ｂはｃ面であり、第２ヘテロ接合５０ｂはａ面又はｍ面である。
PCT/JP2008/056869 2007-04-09 2008-04-07 へテロ接合を有する半導体装置 WO2008126821A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/595,253 US8299498B2 (en) 2007-04-09 2008-04-07 Semiconductor device having hetero junction

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007101346A JP4938531B2 (ja) 2007-04-09 2007-04-09 半導体装置
JP2007-101346 2007-04-09

Publications (1)

Publication Number Publication Date
WO2008126821A1 true WO2008126821A1 (ja) 2008-10-23

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PCT/JP2008/056869 WO2008126821A1 (ja) 2007-04-09 2008-04-07 へテロ接合を有する半導体装置

Country Status (3)

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US (1) US8299498B2 (ja)
JP (1) JP4938531B2 (ja)
WO (1) WO2008126821A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012063529A1 (ja) * 2010-11-08 2012-05-18 住友電気工業株式会社 半導体装置およびその製造方法
JP2015018998A (ja) * 2013-07-12 2015-01-29 富士通株式会社 化合物半導体装置及びその製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5504660B2 (ja) * 2009-03-24 2014-05-28 富士通株式会社 化合物半導体装置及びその製造方法
JP5853187B2 (ja) * 2011-05-30 2016-02-09 パナソニックＩｐマネジメント株式会社 スイッチ装置
KR20130014850A (ko) * 2011-08-01 2013-02-12 삼성전자주식회사 파워소자의 제조방법
JP2015099903A (ja) * 2013-10-17 2015-05-28 ローム株式会社 窒化物半導体装置およびその製造方法
KR102137749B1 (ko) * 2014-03-06 2020-07-24 엘지이노텍 주식회사 전력 반도체 소자
JP6444045B2 (ja) * 2014-04-02 2018-12-26 ローム株式会社 半導体装置および半導体装置の製造方法
JP6600984B2 (ja) * 2015-05-18 2019-11-06 日産自動車株式会社 半導体装置及びその製造方法
JP6666305B2 (ja) 2017-06-09 2020-03-13 株式会社東芝 半導体装置及びその製造方法
CN112993007A (zh) * 2019-12-13 2021-06-18 南通尚阳通集成电路有限公司 超结结构及超结器件

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JPH06163928A (ja) * 1992-11-20 1994-06-10 Res Dev Corp Of Japan トンネル注入半導体装置
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JP2006245564A (ja) * 2005-02-07 2006-09-14 Matsushita Electric Ind Co Ltd 半導体装置
JP2008004720A (ja) * 2006-06-22 2008-01-10 Nippon Telegr & Teleph Corp <Ntt> 窒化物半導体を用いたヘテロ構造電界効果トランジスタ

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Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06163928A (ja) * 1992-11-20 1994-06-10 Res Dev Corp Of Japan トンネル注入半導体装置
JP2002198516A (ja) * 2000-12-26 2002-07-12 Fujitsu Ltd Ｈｅｍｔ
JP2004260140A (ja) * 2003-02-06 2004-09-16 Toyota Central Res & Dev Lab Inc Ｉｉｉ族窒化物半導体を有する半導体素子
JP2006100820A (ja) * 2004-09-24 2006-04-13 Internatl Rectifier Corp パワー半導体デバイス
JP2006245564A (ja) * 2005-02-07 2006-09-14 Matsushita Electric Ind Co Ltd 半導体装置
JP2008004720A (ja) * 2006-06-22 2008-01-10 Nippon Telegr & Teleph Corp <Ntt> 窒化物半導体を用いたヘテロ構造電界効果トランジスタ

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012063529A1 (ja) * 2010-11-08 2012-05-18 住友電気工業株式会社 半導体装置およびその製造方法
US8890239B2 (en) 2010-11-08 2014-11-18 Sumitomo Electric Industries, Ltd. Semiconductor device and method for producing the same
JP2015018998A (ja) * 2013-07-12 2015-01-29 富士通株式会社 化合物半導体装置及びその製造方法

Also Published As

Publication number Publication date
US20100117119A1 (en) 2010-05-13
JP4938531B2 (ja) 2012-05-23
US8299498B2 (en) 2012-10-30
JP2008258514A (ja) 2008-10-23

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