WO2008126690A1 - 電磁波シールドシート及びｒｆｉｄプレート - Google Patents

電磁波シールドシート及びｒｆｉｄプレート Download PDF

Info

Publication number
WO2008126690A1
WO2008126690A1 PCT/JP2008/055877 JP2008055877W WO2008126690A1 WO 2008126690 A1 WO2008126690 A1 WO 2008126690A1 JP 2008055877 W JP2008055877 W JP 2008055877W WO 2008126690 A1 WO2008126690 A1 WO 2008126690A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic shield
shield sheet
sheet
electromagnetic
rfid plate
Prior art date
Application number
PCT/JP2008/055877
Other languages
English (en)
French (fr)
Inventor
Munetomo Nakamura
Yuji Koyamashita
Original Assignee
Kabushiki Kaisha Asahi Rubber
Kabushiki Kaisha Fine Rubber Kenkyuusho
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushiki Kaisha Asahi Rubber, Kabushiki Kaisha Fine Rubber Kenkyuusho filed Critical Kabushiki Kaisha Asahi Rubber
Priority to JP2009509164A priority Critical patent/JPWO2008126690A1/ja
Priority to EP08722916A priority patent/EP2131642A1/en
Priority to US12/528,107 priority patent/US20100096181A1/en
Publication of WO2008126690A1 publication Critical patent/WO2008126690A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/042—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B25/08—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B25/00—Layered products comprising a layer of natural or synthetic rubber
    • B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/106—Carbon fibres, e.g. graphite fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/107—Ceramic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206—Insulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/40—Properties of the layers or laminate having particular optical properties
    • B32B2307/41—Opaque
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2425/00—Cards, e.g. identity cards, credit cards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2519/00—Labels, badges
    • B32B2519/02—RFID tags

Abstract

　電磁波遮蔽効果に優れ、厚さを薄くしても十分な遮蔽効果を奏し、軽量化も可能であり、更に、優れた成形性、可撓性、柔軟性を付与することも可能で、異なる形状の電源ボックスや内壁、あるいは空間に対しても所望する形状で遮蔽することも可能で、種々の形状の電子機器などに用いて電磁波を遮蔽することも可能な電磁波シールドシート及びこれを利用したＲＦＩＤプレートを提供する。 　高分子物質に導電性物質を配合した高分子組成物層を備えた電磁波シールドシートであって、誘電率の異なる高分子組成物層１、２、３を二層以上積層した電磁波シールドシートＡ及びこれとＩＣ、アンテナ回路とを積層したＲＦＩＤプレート。
PCT/JP2008/055877 2007-03-29 2008-03-27 電磁波シールドシート及びｒｆｉｄプレート WO2008126690A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009509164A JPWO2008126690A1 (ja) 2007-03-29 2008-03-27 電磁波シールドシート及びｒｆｉｄプレート
EP08722916A EP2131642A1 (en) 2007-03-29 2008-03-27 Electromagnetic shield sheet and rfid plate
US12/528,107 US20100096181A1 (en) 2007-03-29 2008-03-27 Electromagnetic shield sheet and rfid plate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007087118 2007-03-29
JP2007-087118 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008126690A1 true WO2008126690A1 (ja) 2008-10-23

Family

ID=39863797

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055877 WO2008126690A1 (ja) 2007-03-29 2008-03-27 電磁波シールドシート及びｒｆｉｄプレート

Country Status (4)

Country Link
US (1) US20100096181A1 (ja)
EP (1) EP2131642A1 (ja)
JP (1) JPWO2008126690A1 (ja)
WO (1) WO2008126690A1 (ja)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077592A (ja) * 2011-09-29 2013-04-25 Shachihata Inc 電波抑制体とこの電波抑制体を具備した電子機器及び電波抑制用部品
JP2013245329A (ja) * 2012-05-29 2013-12-09 Dow Corning Toray Co Ltd 導電性室温硬化型フルオロシリコーンゴム組成物
JP2014165363A (ja) * 2013-02-26 2014-09-08 Nitto Denko Corp 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2016086133A (ja) * 2014-10-28 2016-05-19 シヤチハタ株式会社 電波吸収材、並びにその電波吸収材を具備する電子機器、自動料金収受システム、及び車載レーダー装置
JP2017501590A (ja) * 2013-11-13 2017-01-12 アーク・テクノロジーズ・インコーポレーテツド 多−層吸収材
WO2017111122A1 (ja) * 2015-12-25 2017-06-29 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体、並びにこれらの製造方法
WO2017110096A1 (ja) * 2015-12-25 2017-06-29 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体
JP2017152583A (ja) * 2016-02-25 2017-08-31 シヤチハタ株式会社 電波吸収材
WO2017169672A1 (ja) * 2016-03-30 2017-10-05 株式会社巴川製紙所 電波吸収用粘着シート
WO2018100975A1 (ja) * 2016-11-29 2018-06-07 パナソニックＩｐマネジメント株式会社 複合コイルモジュールおよび磁性シート
JP2019176143A (ja) * 2018-03-26 2019-10-10 積水テクノ成型株式会社 樹脂成形体
JP2020111679A (ja) * 2019-01-11 2020-07-27 株式会社巴川製紙所 両面粘着シート
WO2021010439A1 (ja) * 2019-07-17 2021-01-21 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物
JP2021018814A (ja) * 2020-07-06 2021-02-15 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物
WO2021085508A1 (ja) * 2019-10-31 2021-05-06 関西ペイント株式会社 ミリ波吸収性を有する構造体

Families Citing this family (46)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4699388B2 (ja) 2004-12-17 2011-06-08 株式会社ファインラバー研究所 誘電性素材、アンテナ装置、携帯電話機及び電磁波遮蔽体
WO2006064783A1 (ja) * 2004-12-17 2006-06-22 Kabushiki Kaisha Fine Rubber Kenkyuusho 比誘電率の制御方法、誘電体、携帯電話機及び人体ファントムモデル
US7881693B2 (en) * 2006-10-17 2011-02-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP2008165744A (ja) * 2006-12-07 2008-07-17 Semiconductor Energy Lab Co Ltd 半導体装置
JP2008246104A (ja) * 2007-03-30 2008-10-16 Angel Shoji Kk Ｒｆｉｄを内蔵したゲームカードおよびその製造方法
TWI423519B (zh) * 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
CN101466252B (zh) * 2007-12-21 2011-11-30 清华大学 电磁屏蔽层及其制备方法
KR100903687B1 (ko) * 2008-12-30 2009-06-18 두성산업 주식회사 정보유출 방지 및 인식율 향상을 위한 전자여권 케이스
WO2011021368A1 (ja) * 2009-08-20 2011-02-24 パナソニック株式会社 電磁波加熱装置
US8833664B2 (en) * 2009-12-18 2014-09-16 Yu Yung Choi Enhanced performance and security RFID device
WO2012058131A2 (en) * 2010-10-26 2012-05-03 Henkel Corporation Composite film for board level emi shielding
US9484123B2 (en) 2011-09-16 2016-11-01 Prc-Desoto International, Inc. Conductive sealant compositions
KR101337959B1 (ko) * 2012-03-19 2013-12-09 현대자동차주식회사 전자파차폐용 복합재
KR101349029B1 (ko) * 2012-04-04 2014-01-10 현대자동차주식회사 광대역 전자파차폐용 복합재
US9174413B2 (en) 2012-06-14 2015-11-03 International Business Machines Corporation Graphene based structures and methods for shielding electromagnetic radiation
US9413075B2 (en) * 2012-06-14 2016-08-09 Globalfoundries Inc. Graphene based structures and methods for broadband electromagnetic radiation absorption at the microwave and terahertz frequencies
US9656214B2 (en) * 2012-11-30 2017-05-23 Empire Technology Development Llc Graphene membrane laminated to porous woven or nonwoven support
US10300684B2 (en) 2012-12-03 2019-05-28 Illinois Tool Works Inc. Insulation film and method for making insulation film
US9252496B2 (en) 2013-01-11 2016-02-02 Sabic Global Technologies B.V. Methods and compositions for energy dissipation
US9356357B2 (en) 2013-01-11 2016-05-31 Sabic Global Technologies B.V. Methods and compositions for destructive interference
US11907791B2 (en) * 2013-01-18 2024-02-20 Amatech Group Lijited Smart cards with metal layer(s) and methods of manufacture
KR20160002725A (ko) 2013-02-22 2016-01-08 인터페이스 퍼포먼스 메터리얼스 인코포레이티드 경량의 써멀쉴드
JP6073035B2 (ja) * 2013-05-07 2017-02-01 エンパイア テクノロジー ディベロップメント エルエルシー テラヘルツ周波数タグおよびそれらの作製および使用方法
US9942989B2 (en) 2013-11-21 2018-04-10 Illinois Tool Works Inc. Insulation film and method for making insulation film
US10070547B2 (en) * 2014-02-26 2018-09-04 Sparton Corporation Control of electric field effects in a printed circuit board assembly using embedded nickel-metal composite materials
CN106457794A (zh) * 2014-06-23 2017-02-22 伊利诺斯工具制品有限公司 绝缘薄膜及其生产方法
FR3029386A1 (fr) * 2014-11-28 2016-06-03 Commissariat Energie Atomique Blindage magnetique ameliore
JP2018502193A (ja) 2014-12-22 2018-01-25 ブリヂストン アメリカズ タイヤ オペレーションズ、 エルエルシー タイヤ内の無線デバイス用のゴム組成物
JP6278922B2 (ja) * 2015-03-30 2018-02-14 Ｊｘ金属株式会社 電磁波シールド材
WO2017083251A1 (en) 2015-11-09 2017-05-18 Bridgestone Americas Tire Operations, Llc Rubber coating for electronic communication module, electronic module containing same, and related methods
KR20170092238A (ko) * 2016-02-03 2017-08-11 엘지이노텍 주식회사 무선 전력 충전을 위한 자성 차폐재 및 무선 전력 수신 장치
US10885420B2 (en) * 2016-12-14 2021-01-05 Ajay Khoche Package sealing tape types with varied transducer sampling densities
US11138490B2 (en) 2016-12-14 2021-10-05 Ajay Khoche Hierarchical combination of distributed statistics in a monitoring network
US10902310B2 (en) * 2016-12-14 2021-01-26 Trackonomy Systems, Inc. Wireless communications and transducer based event detection platform
US10482369B2 (en) 2016-12-14 2019-11-19 Trackonomy Systems, Inc. Window based locationing of mobile targets using complementary position estimates
KR102405258B1 (ko) * 2018-02-14 2022-06-03 삼성디스플레이 주식회사 표시 장치
KR102036993B1 (ko) * 2018-04-10 2019-10-25 (주)시스템케이 고내열성 및 방수성을 갖는 rfid 태그
DE102018121826A1 (de) * 2018-09-07 2020-03-12 Airbus Defence and Space GmbH Vorrichtung zum Filtern von elektromagnetischer Strahlung, Luft- und Raumfahrzeug und Verfahren zum Herstellen der Vorrichtung
CN109996431B (zh) * 2019-05-05 2023-11-10 江苏铁锚玻璃股份有限公司 高性能屏蔽玻璃及其制备方法
WO2020247354A1 (en) 2019-06-05 2020-12-10 Trackonomy Systems, Inc. Temperature monitoring in cold supply chains
MX2022003135A (es) 2019-09-13 2022-08-04 Trackonomy Systems Inc Método y dispositivo de fabricación de aditivo rollo a rollo.
US11864058B1 (en) 2020-10-04 2024-01-02 Trackonomy Systems, Inc. Flexible tracking device for cables and equipment
CN111967547B (zh) * 2020-07-06 2021-11-05 深圳市成为信息技术有限公司 多标签盘点方法、电子设备及存储介质
TWI766320B (zh) * 2020-07-23 2022-06-01 南亞塑膠工業股份有限公司 預浸片及金屬積層板
US11527148B1 (en) 2020-10-04 2022-12-13 Trackonomy Systems, Inc. Augmented reality for guiding users to assets in IOT applications
US11869994B2 (en) 2020-12-12 2024-01-09 Trackonomy Systems, Inc. Flexible solar-powered wireless communication device

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031686A (ja) 1998-07-09 2000-01-28 Daido Steel Co Ltd 積層型電磁波吸収体およびその製造方法
JP2002043792A (ja) 2000-07-25 2002-02-08 Nishizaki:Kk 電磁波遮蔽シート
JP2002309107A (ja) 2001-04-13 2002-10-23 Jsr Corp 導電性ゴム組成物及びそれを用いた電磁波シールド材
JP2003243878A (ja) * 2002-02-15 2003-08-29 Hitachi Ltd 電磁波吸収材料及びそれを用いた各種製品
JP2005080023A (ja) * 2003-09-01 2005-03-24 Sony Corp 磁芯部材、アンテナモジュール及びこれを備えた携帯型通信端末
WO2006064782A1 (ja) * 2004-12-17 2006-06-22 Kabushiki Kaisha Fine Rubber Kenkyuusho 誘電性素材、アンテナ装置、携帯電話機及び電磁波遮蔽体
JP2006344570A (ja) * 2004-08-06 2006-12-21 Mitsubishi Gas Chem Co Inc 絶縁化超微粉末および高誘電率樹脂複合材料

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003107729A1 (en) * 2002-06-14 2003-12-24 Laird Technologies, Inc. Composite emi shield

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031686A (ja) 1998-07-09 2000-01-28 Daido Steel Co Ltd 積層型電磁波吸収体およびその製造方法
JP2002043792A (ja) 2000-07-25 2002-02-08 Nishizaki:Kk 電磁波遮蔽シート
JP2002309107A (ja) 2001-04-13 2002-10-23 Jsr Corp 導電性ゴム組成物及びそれを用いた電磁波シールド材
JP2003243878A (ja) * 2002-02-15 2003-08-29 Hitachi Ltd 電磁波吸収材料及びそれを用いた各種製品
JP2005080023A (ja) * 2003-09-01 2005-03-24 Sony Corp 磁芯部材、アンテナモジュール及びこれを備えた携帯型通信端末
JP2006344570A (ja) * 2004-08-06 2006-12-21 Mitsubishi Gas Chem Co Inc 絶縁化超微粉末および高誘電率樹脂複合材料
WO2006064782A1 (ja) * 2004-12-17 2006-06-22 Kabushiki Kaisha Fine Rubber Kenkyuusho 誘電性素材、アンテナ装置、携帯電話機及び電磁波遮蔽体

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013077592A (ja) * 2011-09-29 2013-04-25 Shachihata Inc 電波抑制体とこの電波抑制体を具備した電子機器及び電波抑制用部品
US9704614B2 (en) 2012-05-29 2017-07-11 Dow Corning Toray Co., Ltd. Room temperature-curable electrically conductive fluorosilicone rubber composition
JP2013245329A (ja) * 2012-05-29 2013-12-09 Dow Corning Toray Co Ltd 導電性室温硬化型フルオロシリコーンゴム組成物
JP2014165363A (ja) * 2013-02-26 2014-09-08 Nitto Denko Corp 軟磁性熱硬化性接着フィルム、軟磁性フィルム積層回路基板、および、位置検出装置
JP2017501590A (ja) * 2013-11-13 2017-01-12 アーク・テクノロジーズ・インコーポレーテツド 多−層吸収材
JP2016086133A (ja) * 2014-10-28 2016-05-19 シヤチハタ株式会社 電波吸収材、並びにその電波吸収材を具備する電子機器、自動料金収受システム、及び車載レーダー装置
US20180375215A1 (en) * 2015-12-25 2018-12-27 Zeon Corporation Electromagnetic wave absorption material, electromagnetic wave absorber, and production methods therefor
KR102575899B1 (ko) * 2015-12-25 2023-09-06 니폰 제온 가부시키가이샤 전자파 흡수 재료 및 전자파 흡수체
TWI726963B (zh) * 2015-12-25 2021-05-11 日商日本瑞翁股份有限公司 電磁波吸收材料及電磁波吸收體
CN108370654A (zh) * 2015-12-25 2018-08-03 日本瑞翁株式会社 电磁波吸收材料及电磁波吸收体
KR20180098547A (ko) * 2015-12-25 2018-09-04 니폰 제온 가부시키가이샤 전자파 흡수 재료 및 전자파 흡수체
JPWO2017110096A1 (ja) * 2015-12-25 2018-10-11 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体
WO2017111122A1 (ja) * 2015-12-25 2017-06-29 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体、並びにこれらの製造方法
US11235560B2 (en) 2015-12-25 2022-02-01 Zeon Corporation Electromagnetic wave absorption material and electromagnetic wave absorber
WO2017110096A1 (ja) * 2015-12-25 2017-06-29 日本ゼオン株式会社 電磁波吸収材料及び電磁波吸収体
CN108370654B (zh) * 2015-12-25 2020-02-07 日本瑞翁株式会社 电磁波吸收材料及电磁波吸收体
JP2017152583A (ja) * 2016-02-25 2017-08-31 シヤチハタ株式会社 電波吸収材
WO2017169672A1 (ja) * 2016-03-30 2017-10-05 株式会社巴川製紙所 電波吸収用粘着シート
JPWO2017169672A1 (ja) * 2016-03-30 2019-02-07 株式会社巴川製紙所 電波吸収用粘着シート
WO2018100975A1 (ja) * 2016-11-29 2018-06-07 パナソニックＩｐマネジメント株式会社 複合コイルモジュールおよび磁性シート
CN109997205A (zh) * 2016-11-29 2019-07-09 松下知识产权经营株式会社 复合线圈模块以及磁性片
JP2019176143A (ja) * 2018-03-26 2019-10-10 積水テクノ成型株式会社 樹脂成形体
JP7279994B2 (ja) 2018-03-26 2023-05-23 積水テクノ成型株式会社 樹脂成形体
JP7264645B2 (ja) 2019-01-11 2023-04-25 株式会社巴川製紙所 両面粘着シート
JP2020111679A (ja) * 2019-01-11 2020-07-27 株式会社巴川製紙所 両面粘着シート
JP2021018493A (ja) * 2019-07-17 2021-02-15 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物
WO2021010439A1 (ja) * 2019-07-17 2021-01-21 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物
WO2021085508A1 (ja) * 2019-10-31 2021-05-06 関西ペイント株式会社 ミリ波吸収性を有する構造体
JP2021018814A (ja) * 2020-07-06 2021-02-15 株式会社クラウドナイン 非接触型ｉｃタグを用いたコンテンツ提供物

Also Published As

Publication number Publication date
JPWO2008126690A1 (ja) 2010-07-22
EP2131642A1 (en) 2009-12-09
US20100096181A1 (en) 2010-04-22

Similar Documents

Publication Publication Date Title
WO2008126690A1 (ja) 電磁波シールドシート及びｒｆｉｄプレート
CN110612187B (zh) 用于制造电子组件的方法及电子组件
Liu et al. Future paper based printed circuit boards for green electronics: fabrication and life cycle assessment
TWI278278B (en) Electromagnetic waves absorber
WO2008090891A1 (ja) 複合磁性体、その製造方法、それを用いた回路基板、及びそれを用いた電子機器
GB2473982A (en) Circuit materials, circuits laminates and method of manufacture thereof
JP2019116103A (ja) 導電材料が埋め込まれた装飾多層表面材、それを用いて作製された固体表面、そのような表面材を作製する方法およびその使用
TW201129475A (en) Multilayer resin sheet and method of producing the same, method of producing cured multilayer resin sheet, and high heat conducting resin sheet laminate and method of producing the same
TW200705463A (en) Electrically conductive polymer resin and method for making same
PH12015500899B1 (en) Coverplay film, flexible printed circuit board using same, and production method therefor
WO2011022188A3 (en) Formation of high electrical conductivity polymer composites with multiple fillers
TW200614084A (en) RFID device with content insensitivity and position insensitivity
ES2531068T3 (es) Componente estructural híbrido de lámina orgánica de plástico apantallado frente a CEM
EP1764214A3 (en) Laminated polyester film, flame-retardant polyester film thereof copper-clad laminated plate and circuit substrate
MY169978A (en) Low dielectric loss thermoset resin system at high frequency for use in electrical components
TW200740331A (en) Hybrid multilayer circuit board and method of manufacturing the same
WO2009008471A1 (ja) 誘電層付銅箔
WO2010065494A3 (en) Anode for an organic electronic device
EP3290453A4 (en) Epoxy resin composition, thermoconductive material precursor, b-stage sheet, prepreg, heat-dissipating material, laminated plate, metal substrate, and printed circuit board
MY169238A (en) Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board
EP2662395A3 (en) Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound
WO2011046809A3 (en) Ic package with non-uniform dielectric layer thickness
WO2006088598A3 (en) Heat spreader for printed circuit boards
WO2008099596A1 (ja) キャリア材料付き層間絶縁膜およびこれを用いる多層プリント回路板
EP2698400A3 (en) Epoxy resin compound and radiant heat circuit board Using the same

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722916

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2009509164

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 12528107

Country of ref document: US

WWE Wipo information: entry into national phase

Ref document number: 2008722916

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE