WO2008123437A1 - 導電膜及びその製造方法 - Google Patents

導電膜及びその製造方法 Download PDF

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Publication number
WO2008123437A1
WO2008123437A1 PCT/JP2008/056150 JP2008056150W WO2008123437A1 WO 2008123437 A1 WO2008123437 A1 WO 2008123437A1 JP 2008056150 W JP2008056150 W JP 2008056150W WO 2008123437 A1 WO2008123437 A1 WO 2008123437A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive film
producing
smoothing
same
silver metal
Prior art date
Application number
PCT/JP2008/056150
Other languages
English (en)
French (fr)
Inventor
Akira Ichiki
Makoto Kusuoka
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Priority to KR1020097020408A priority Critical patent/KR101340119B1/ko
Priority to US12/594,120 priority patent/US8071271B2/en
Priority to CN2008800107321A priority patent/CN101647074B/zh
Publication of WO2008123437A1 publication Critical patent/WO2008123437A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0094—Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096—Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)

Abstract

　導電膜の製造方法は、支持体上に銀塩を含有する銀塩含有層を有する感光材料を露光し、現像処理することにより金属銀部を形成する金属銀形成工程と、前記金属銀部を平滑化処理する平滑化処理工程とを有する。そして、前記平滑化処理をカレンダーロールにより行う。この場合、前記カレンダーロールによる前記平滑化処理を線圧力１９６０Ｎ／ｃｍ（２００ｋｇｆ／ｃｍ）以上で行う。これにより、電磁波を遮蔽する上で有効な導電膜の製造において、現像後のフイルムの表面抵抗を低減させることができる。
PCT/JP2008/056150 2007-03-30 2008-03-28 導電膜及びその製造方法 WO2008123437A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020097020408A KR101340119B1 (ko) 2007-03-30 2008-03-28 도전성 필름 및 그 제조 방법
US12/594,120 US8071271B2 (en) 2007-03-30 2008-03-28 Conductive film and method for producing the same
CN2008800107321A CN101647074B (zh) 2007-03-30 2008-03-28 导电膜及其生产方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-093209 2007-03-30
JP2007093209A JP5192713B2 (ja) 2007-03-30 2007-03-30 導電膜及びその製造方法

Publications (1)

Publication Number Publication Date
WO2008123437A1 true WO2008123437A1 (ja) 2008-10-16

Family

ID=39830922

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056150 WO2008123437A1 (ja) 2007-03-30 2008-03-28 導電膜及びその製造方法

Country Status (5)

Country Link
US (1) US8071271B2 (ja)
JP (1) JP5192713B2 (ja)
KR (1) KR101340119B1 (ja)
CN (1) CN101647074B (ja)
WO (1) WO2008123437A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011131500A (ja) * 2009-12-24 2011-07-07 Fujifilm Corp 導電膜形成用感光材料、及び導電膜の製造方法
JP2012018763A (ja) * 2010-07-06 2012-01-26 Fujifilm Corp 導電膜の製造方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2007114196A1 (ja) * 2006-03-28 2007-10-11 Fujifilm Corporation 導電膜及びその製造方法、並びに透光性電磁波シールド膜
JP5213433B2 (ja) * 2006-12-21 2013-06-19 富士フイルム株式会社 導電膜およびその製造方法
CA2720899C (en) 2008-04-11 2014-07-15 Fujifilm Corporation Heat generating body
WO2009125854A1 (ja) 2008-04-11 2009-10-15 富士フイルム株式会社 車両灯具用前面カバー及び車両灯具用前面カバーの製造方法、並びに、電熱構造
JP2010199052A (ja) 2009-02-02 2010-09-09 Fujifilm Corp 導電膜の製造方法
JP2011018028A (ja) * 2009-06-10 2011-01-27 Fujifilm Corp 導電膜形成用感光材料、導電膜および導電膜の製造方法
JP5629077B2 (ja) * 2009-09-29 2014-11-19 富士フイルム株式会社 導電膜の製造方法
US20140367620A1 (en) * 2013-06-17 2014-12-18 Ronald Anthony Gogle Method for improving patterned silver conductivity
US10914008B2 (en) * 2018-09-27 2021-02-09 Imec Vzw Method and solution for forming interconnects
CN114002174B (zh) * 2021-09-26 2023-09-15 陕西新时代生物转化检测有限公司 一种精确测定银离子含量的紫外吸收光谱法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116491A (ja) * 1997-06-26 1999-01-22 Dainippon Printing Co Ltd プラズマディスプレイパネル用厚膜パターンの形成方法
WO2006088059A1 (ja) * 2005-02-15 2006-08-24 Fujifilm Corporation 透光性導電性膜、透光性電磁波シールド膜および光学フィルターならびにディスプレイ用フィルターの製造方法
JP2006290948A (ja) * 2005-04-07 2006-10-26 Fuji Photo Film Co Ltd 防眩フィルム及び該防眩フィルムを有する合わせガラス
JP2006336057A (ja) * 2005-05-31 2006-12-14 Fujifilm Holdings Corp 導電性膜の製造方法及びその製造装置並びに透光性電磁波シールド膜及びプラズマディスプレーパネル
JP2007129205A (ja) * 2005-09-30 2007-05-24 Fujifilm Corp 導電性膜の製造方法及び導電性膜製造用感光材料
WO2007088896A1 (ja) * 2006-01-31 2007-08-09 Fujifilm Corporation 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル
JP2007235115A (ja) * 2006-01-31 2007-09-13 Fujifilm Corp 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル

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JP3388682B2 (ja) 1996-05-23 2003-03-24 日立化成工業株式会社 電磁波シールド性と透明性を有するディスプレイ用フィルムの製造法
US6054647A (en) 1997-11-26 2000-04-25 National-Standard Company Grid material for electromagnetic shielding
JP2000013088A (ja) 1998-06-26 2000-01-14 Hitachi Chem Co Ltd 電磁波シールドフィルムの製造方法および該電磁波シールドフィルムを用いた電磁波遮蔽体、ディスプレイ
KR100936527B1 (ko) * 2002-07-12 2010-01-13 후지모리 고교 가부시키가이샤 전자파 차폐재 및 그 제조 방법
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JP4807934B2 (ja) 2002-12-27 2011-11-02 富士フイルム株式会社 透光性電磁波シールド膜およびその製造方法
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JP2006228469A (ja) 2005-02-15 2006-08-31 Fuji Photo Film Co Ltd 導電性膜形成用感光材料、導電性膜、透光性電磁波シールド膜、及びそれらの製造方法
JP2006332459A (ja) 2005-05-27 2006-12-07 Fujifilm Holdings Corp 導電性金属膜形成用感光材料、導電性金属膜の製造方法、導電性金属膜、及びプラズマディスプレイパネル用透光性電磁波シールド膜
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KR101039543B1 (ko) 2006-09-28 2011-06-09 후지필름 가부시키가이샤 자발광 표시 장치, 자발광 표시 장치의 제조 방법, 투명 도전성 필름, 전계 발광 소자, 태양 전지용 투명 전극 및 전자 페이퍼용 투명 전극
JP5213433B2 (ja) 2006-12-21 2013-06-19 富士フイルム株式会社 導電膜およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116491A (ja) * 1997-06-26 1999-01-22 Dainippon Printing Co Ltd プラズマディスプレイパネル用厚膜パターンの形成方法
WO2006088059A1 (ja) * 2005-02-15 2006-08-24 Fujifilm Corporation 透光性導電性膜、透光性電磁波シールド膜および光学フィルターならびにディスプレイ用フィルターの製造方法
JP2006290948A (ja) * 2005-04-07 2006-10-26 Fuji Photo Film Co Ltd 防眩フィルム及び該防眩フィルムを有する合わせガラス
JP2006336057A (ja) * 2005-05-31 2006-12-14 Fujifilm Holdings Corp 導電性膜の製造方法及びその製造装置並びに透光性電磁波シールド膜及びプラズマディスプレーパネル
JP2007129205A (ja) * 2005-09-30 2007-05-24 Fujifilm Corp 導電性膜の製造方法及び導電性膜製造用感光材料
WO2007088896A1 (ja) * 2006-01-31 2007-08-09 Fujifilm Corporation 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル
JP2007235115A (ja) * 2006-01-31 2007-09-13 Fujifilm Corp 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011131500A (ja) * 2009-12-24 2011-07-07 Fujifilm Corp 導電膜形成用感光材料、及び導電膜の製造方法
JP2012018763A (ja) * 2010-07-06 2012-01-26 Fujifilm Corp 導電膜の製造方法

Also Published As

Publication number Publication date
CN101647074A (zh) 2010-02-10
JP2008251417A (ja) 2008-10-16
KR20100014684A (ko) 2010-02-10
JP5192713B2 (ja) 2013-05-08
CN101647074B (zh) 2012-08-22
US8071271B2 (en) 2011-12-06
US20100190111A1 (en) 2010-07-29
KR101340119B1 (ko) 2013-12-10

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