WO2008123437A1 - 導電膜及びその製造方法 - Google Patents

導電膜及びその製造方法 Download PDF

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Publication number
WO2008123437A1
WO2008123437A1 PCT/JP2008/056150 JP2008056150W WO2008123437A1 WO 2008123437 A1 WO2008123437 A1 WO 2008123437A1 JP 2008056150 W JP2008056150 W JP 2008056150W WO 2008123437 A1 WO2008123437 A1 WO 2008123437A1
Authority
WO
WIPO (PCT)
Prior art keywords
conductive film
producing
smoothing
same
silver metal
Prior art date
Application number
PCT/JP2008/056150
Other languages
English (en)
French (fr)
Inventor
Akira Ichiki
Makoto Kusuoka
Original Assignee
Fujifilm Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corporation filed Critical Fujifilm Corporation
Priority to CN2008800107321A priority Critical patent/CN101647074B/zh
Priority to US12/594,120 priority patent/US8071271B2/en
Priority to KR1020097020408A priority patent/KR101340119B1/ko
Publication of WO2008123437A1 publication Critical patent/WO2008123437A1/ja

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00Apparatus or processes specially adapted for manufacturing conductors or cables
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • H05K3/106Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam by photographic methods
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0094Shielding materials being light-transmitting, e.g. transparent, translucent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0094Shielding materials being light-transmitting, e.g. transparent, translucent
    • H05K9/0096Shielding materials being light-transmitting, e.g. transparent, translucent for television displays, e.g. plasma display panel
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01Tools for processing; Objects used during processing
    • H05K2203/0104Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15Position of the PCB during processing
    • H05K2203/1545Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Silver Salt Photography Or Processing Solution Therefor (AREA)

Abstract

 導電膜の製造方法は、支持体上に銀塩を含有する銀塩含有層を有する感光材料を露光し、現像処理することにより金属銀部を形成する金属銀形成工程と、前記金属銀部を平滑化処理する平滑化処理工程とを有する。そして、前記平滑化処理をカレンダーロールにより行う。この場合、前記カレンダーロールによる前記平滑化処理を線圧力1960N/cm(200kgf/cm)以上で行う。これにより、電磁波を遮蔽する上で有効な導電膜の製造において、現像後のフイルムの表面抵抗を低減させることができる。
PCT/JP2008/056150 2007-03-30 2008-03-28 導電膜及びその製造方法 WO2008123437A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2008800107321A CN101647074B (zh) 2007-03-30 2008-03-28 导电膜及其生产方法
US12/594,120 US8071271B2 (en) 2007-03-30 2008-03-28 Conductive film and method for producing the same
KR1020097020408A KR101340119B1 (ko) 2007-03-30 2008-03-28 도전성 필름 및 그 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007093209A JP5192713B2 (ja) 2007-03-30 2007-03-30 導電膜及びその製造方法
JP2007-093209 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008123437A1 true WO2008123437A1 (ja) 2008-10-16

Family

ID=39830922

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/056150 WO2008123437A1 (ja) 2007-03-30 2008-03-28 導電膜及びその製造方法

Country Status (5)

Country Link
US (1) US8071271B2 (ja)
JP (1) JP5192713B2 (ja)
KR (1) KR101340119B1 (ja)
CN (1) CN101647074B (ja)
WO (1) WO2008123437A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011131500A (ja) * 2009-12-24 2011-07-07 Fujifilm Corp 導電膜形成用感光材料、及び導電膜の製造方法
JP2012018763A (ja) * 2010-07-06 2012-01-26 Fujifilm Corp 導電膜の製造方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8034542B2 (en) * 2006-03-28 2011-10-11 Fujifilm Corporation Conductive film and manufacturing method thereof, and transparent electromagnetic shielding film
JP5207728B2 (ja) * 2006-12-21 2013-06-12 富士フイルム株式会社 導電膜およびその製造方法
WO2009125855A1 (ja) 2008-04-11 2009-10-15 富士フイルム株式会社 発熱体
EP2264360A4 (en) 2008-04-11 2015-11-25 Fujifilm Corp FRONT PANEL FOR A VEHICLE LIGHTING ARMATURE, METHOD FOR PRODUCING THE FRONT PANEL AND ELECTRIC HEATING STRUCTURE
JP2010199052A (ja) * 2009-02-02 2010-09-09 Fujifilm Corp 導電膜の製造方法
JP2011018028A (ja) * 2009-06-10 2011-01-27 Fujifilm Corp 導電膜形成用感光材料、導電膜および導電膜の製造方法
JP5629077B2 (ja) * 2009-09-29 2014-11-19 富士フイルム株式会社 導電膜の製造方法
US20140367620A1 (en) * 2013-06-17 2014-12-18 Ronald Anthony Gogle Method for improving patterned silver conductivity
US11999883B2 (en) * 2018-07-06 2024-06-04 Swift Textile Metalizing LLC Lightweight RF shielding conductive elastomeric tape
CN110952081B (zh) * 2018-09-27 2022-04-29 Imec 非营利协会 用于形成互连部的方法和溶液
CN114002174B (zh) * 2021-09-26 2023-09-15 陕西新时代生物转化检测有限公司 一种精确测定银离子含量的紫外吸收光谱法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116491A (ja) * 1997-06-26 1999-01-22 Dainippon Printing Co Ltd プラズマディスプレイパネル用厚膜パターンの形成方法
WO2006088059A1 (ja) * 2005-02-15 2006-08-24 Fujifilm Corporation 透光性導電性膜、透光性電磁波シールド膜および光学フィルターならびにディスプレイ用フィルターの製造方法
JP2006290948A (ja) * 2005-04-07 2006-10-26 Fuji Photo Film Co Ltd 防眩フィルム及び該防眩フィルムを有する合わせガラス
JP2006336057A (ja) * 2005-05-31 2006-12-14 Fujifilm Holdings Corp 導電性膜の製造方法及びその製造装置並びに透光性電磁波シールド膜及びプラズマディスプレーパネル
JP2007129205A (ja) * 2005-09-30 2007-05-24 Fujifilm Corp 導電性膜の製造方法及び導電性膜製造用感光材料
WO2007088896A1 (ja) * 2006-01-31 2007-08-09 Fujifilm Corporation 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル
JP2007235115A (ja) * 2006-01-31 2007-09-13 Fujifilm Corp 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル

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JP3388682B2 (ja) 1996-05-23 2003-03-24 日立化成工業株式会社 電磁波シールド性と透明性を有するディスプレイ用フィルムの製造法
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JP2000013088A (ja) 1998-06-26 2000-01-14 Hitachi Chem Co Ltd 電磁波シールドフィルムの製造方法および該電磁波シールドフィルムを用いた電磁波遮蔽体、ディスプレイ
EP1553212B1 (en) * 2002-07-12 2017-08-23 Fujimori Kogyo Co., Ltd. Electromagnetic wave shield material and process for producing the same
JP4807934B2 (ja) 2002-12-27 2011-11-02 富士フイルム株式会社 透光性電磁波シールド膜およびその製造方法
JP4641719B2 (ja) 2002-12-27 2011-03-02 富士フイルム株式会社 透光性電磁波シールド膜の製造方法及び透光性電磁波シールド膜
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US20070015094A1 (en) * 2005-07-13 2007-01-18 Konica Minolta Medical & Graphic, Inc. Electromagnetic wave shielding material, method for manufacturing the same and electromagnetic wave shielding material for plasma display panel
US8513878B2 (en) 2006-09-28 2013-08-20 Fujifilm Corporation Spontaneous emission display, spontaneous emission display manufacturing method, transparent conductive film, electroluminescence device, solar cell transparent electrode, and electronic paper transparent electrode
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Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1116491A (ja) * 1997-06-26 1999-01-22 Dainippon Printing Co Ltd プラズマディスプレイパネル用厚膜パターンの形成方法
WO2006088059A1 (ja) * 2005-02-15 2006-08-24 Fujifilm Corporation 透光性導電性膜、透光性電磁波シールド膜および光学フィルターならびにディスプレイ用フィルターの製造方法
JP2006290948A (ja) * 2005-04-07 2006-10-26 Fuji Photo Film Co Ltd 防眩フィルム及び該防眩フィルムを有する合わせガラス
JP2006336057A (ja) * 2005-05-31 2006-12-14 Fujifilm Holdings Corp 導電性膜の製造方法及びその製造装置並びに透光性電磁波シールド膜及びプラズマディスプレーパネル
JP2007129205A (ja) * 2005-09-30 2007-05-24 Fujifilm Corp 導電性膜の製造方法及び導電性膜製造用感光材料
WO2007088896A1 (ja) * 2006-01-31 2007-08-09 Fujifilm Corporation 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル
JP2007235115A (ja) * 2006-01-31 2007-09-13 Fujifilm Corp 導電性膜の製造方法、並びに、透光性電磁波シールド膜、光学フィルターおよびプラズマディスプレイパネル

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011131500A (ja) * 2009-12-24 2011-07-07 Fujifilm Corp 導電膜形成用感光材料、及び導電膜の製造方法
JP2012018763A (ja) * 2010-07-06 2012-01-26 Fujifilm Corp 導電膜の製造方法

Also Published As

Publication number Publication date
JP2008251417A (ja) 2008-10-16
US8071271B2 (en) 2011-12-06
KR20100014684A (ko) 2010-02-10
CN101647074A (zh) 2010-02-10
JP5192713B2 (ja) 2013-05-08
KR101340119B1 (ko) 2013-12-10
US20100190111A1 (en) 2010-07-29
CN101647074B (zh) 2012-08-22

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