WO2008123248A1 - 基材付絶縁シート、多層プリント配線板、半導体装置および多層プリント配線板の製造方法 - Google Patents

基材付絶縁シート、多層プリント配線板、半導体装置および多層プリント配線板の製造方法 Download PDF

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Publication number
WO2008123248A1
WO2008123248A1 PCT/JP2008/055576 JP2008055576W WO2008123248A1 WO 2008123248 A1 WO2008123248 A1 WO 2008123248A1 JP 2008055576 W JP2008055576 W JP 2008055576W WO 2008123248 A1 WO2008123248 A1 WO 2008123248A1
Authority
WO
WIPO (PCT)
Prior art keywords
base
circuit board
printed circuit
insulating layer
layer printed
Prior art date
Application number
PCT/JP2008/055576
Other languages
English (en)
French (fr)
Inventor
Michio Kimura
Original Assignee
Sumitomo Bakelite Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Company, Ltd. filed Critical Sumitomo Bakelite Company, Ltd.
Priority to JP2009509114A priority Critical patent/JPWO2008123248A1/ja
Priority to CN2008800090829A priority patent/CN101637070B/zh
Publication of WO2008123248A1 publication Critical patent/WO2008123248A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0264—Peeling insulating layer, e.g. foil, or separating mask
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)

Abstract

　多層プリント配線板の絶縁層に用いた場合に、基材を絶縁シートから無理なく剥離することができ、絶縁層のひび割れや脱落などを引き起こすことのない基材付絶縁シート、多層プリント配線板、及び、半導体装置を提供する。 　多層プリント配線板の絶縁層を形成するために用いられる基材付絶縁シートであって、樹脂組成物からなる絶縁層が基材上に設けられてなり、該絶縁層を被接着面に加熱加圧して接着し、且つ、上記絶縁層を加熱硬化させた後に、上記絶縁層から上記基材を剥離する剥離強度が、０．２ｋＮ／ｍ以下であり、絶縁層を加熱硬化後に基材から剥離して用いられるものであることを特徴とする基材付絶縁シート、並びに、樹脂組成物からなる絶縁層が基材上に設けられてなり、該絶縁層を被接着面に６０～１６０°C、０．２～５ＭＰａで０．５～１５分間、加熱加圧した時に、２０°Cにおいて、上記絶縁層から上記基材を剥離する剥離強度が、０．０５ｋＮ／ｍ以下であることを特徴とする基材付絶縁シート。
PCT/JP2008/055576 2007-03-29 2008-03-25 基材付絶縁シート、多層プリント配線板、半導体装置および多層プリント配線板の製造方法 WO2008123248A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009509114A JPWO2008123248A1 (ja) 2007-03-29 2008-03-25 基材付絶縁シート、多層プリント配線板、半導体装置および多層プリント配線板の製造方法
CN2008800090829A CN101637070B (zh) 2007-03-29 2008-03-25 带基材绝缘片、多层印刷布线板、半导体装置和多层印刷布线板的制造方法

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007-089244 2007-03-29
JP2007-089223 2007-03-29
JP2007089244 2007-03-29
JP2007089223 2007-03-29

Publications (1)

Publication Number Publication Date
WO2008123248A1 true WO2008123248A1 (ja) 2008-10-16

Family

ID=39830741

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055576 WO2008123248A1 (ja) 2007-03-29 2008-03-25 基材付絶縁シート、多層プリント配線板、半導体装置および多層プリント配線板の製造方法

Country Status (4)

Country Link
JP (1) JPWO2008123248A1 (ja)
KR (1) KR20090123944A (ja)
CN (1) CN101637070B (ja)
WO (1) WO2008123248A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211085A (ja) * 2014-04-24 2015-11-24 味の素株式会社 回路基板の製造方法
JP2019016811A (ja) * 2018-10-09 2019-01-31 味の素株式会社 回路基板の製造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6709669B2 (ja) * 2016-04-20 2020-06-17 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
WO2021046722A1 (zh) * 2019-09-10 2021-03-18 中国科学院深圳先进技术研究院 一种高温绝缘胶膜材料及其制备方法
CN113141702A (zh) * 2020-01-17 2021-07-20 广东生益科技股份有限公司 一种绝缘片、包含其的印制电路板、半导体装置和埋入式元器件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0623840A (ja) * 1985-08-02 1994-02-01 Mitsui Petrochem Ind Ltd 多層プリント配線基板製造用ポリ４−メチル−１−ペンテン製表面粗化フィルム及びシートの製造方法
JP2000223805A (ja) * 1999-02-03 2000-08-11 Tomoegawa Paper Co Ltd 回路用積層材
JP2004249557A (ja) * 2003-02-19 2004-09-09 Sumitomo Bakelite Co Ltd 積層板の製造方法
JP2005263857A (ja) * 2004-03-16 2005-09-29 Sunstar Eng Inc 容易に加熱分解しうる一液型湿気硬化性ウレタン系組成物
JP2005286089A (ja) * 2004-03-30 2005-10-13 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JP2006274218A (ja) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4117690B2 (ja) * 1996-12-26 2008-07-16 味の素株式会社 多層プリント配線板用接着フィルムを用いた多層プリント配線板の製造方法
JP4300687B2 (ja) * 1999-10-28 2009-07-22 味の素株式会社 接着フィルムを用いた多層プリント配線板の製造法
JP4752190B2 (ja) * 2004-04-26 2011-08-17 三菱化学株式会社 粘着フィルム又はシート
JP2006028275A (ja) * 2004-07-14 2006-02-02 Tokai Rubber Ind Ltd 保護フィルム付プリプレグシートおよびその製造方法
JP2006124433A (ja) * 2004-10-26 2006-05-18 Matsushita Electric Works Ltd 樹脂シート及び成形品

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0623840A (ja) * 1985-08-02 1994-02-01 Mitsui Petrochem Ind Ltd 多層プリント配線基板製造用ポリ４−メチル−１−ペンテン製表面粗化フィルム及びシートの製造方法
JP2000223805A (ja) * 1999-02-03 2000-08-11 Tomoegawa Paper Co Ltd 回路用積層材
JP2004249557A (ja) * 2003-02-19 2004-09-09 Sumitomo Bakelite Co Ltd 積層板の製造方法
JP2005263857A (ja) * 2004-03-16 2005-09-29 Sunstar Eng Inc 容易に加熱分解しうる一液型湿気硬化性ウレタン系組成物
JP2005286089A (ja) * 2004-03-30 2005-10-13 Sumitomo Bakelite Co Ltd 多層プリント配線板の製造方法
JP2006274218A (ja) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015211085A (ja) * 2014-04-24 2015-11-24 味の素株式会社 回路基板の製造方法
JP2019016811A (ja) * 2018-10-09 2019-01-31 味の素株式会社 回路基板の製造方法

Also Published As

Publication number Publication date
CN101637070A (zh) 2010-01-27
CN101637070B (zh) 2012-02-01
KR20090123944A (ko) 2009-12-02
JPWO2008123248A1 (ja) 2010-07-15

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