WO2008133118A1 - 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法 - Google Patents

層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法 Download PDF

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Publication number
WO2008133118A1
WO2008133118A1 PCT/JP2008/057361 JP2008057361W WO2008133118A1 WO 2008133118 A1 WO2008133118 A1 WO 2008133118A1 JP 2008057361 W JP2008057361 W JP 2008057361W WO 2008133118 A1 WO2008133118 A1 WO 2008133118A1
Authority
WO
WIPO (PCT)
Prior art keywords
heat
sensitive adhesive
peelable pressure
sheet
pressure
Prior art date
Application number
PCT/JP2008/057361
Other languages
English (en)
French (fr)
Inventor
Daisuke Shimokawa
Hiroyuki Kondo
Yukio Arimitsu
Tomoko Kishimoto
Original Assignee
Nitto Denko Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corporation filed Critical Nitto Denko Corporation
Priority to US12/450,933 priority Critical patent/US20100119816A1/en
Publication of WO2008133118A1 publication Critical patent/WO2008133118A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H01G4/308—Stacked capacitors made by transfer techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/346—Clay
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/412—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of microspheres
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y10T428/251—Mica
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2861—Adhesive compositions having readily strippable combined with readily readhearable properties [e.g., stick-ons, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

　本発明は、圧力に対して変形しにくく、高温雰囲気下においても凝集力に優れ、熱剥離処理温度に達するまでは適度な粘着力を維持し、加熱により容易に剥離することができる熱剥離型粘着シート及び該粘着シートを使用する電子部品の製造方法を提供することを目的とする。 　本発明において、基材の少なくとも片面に、熱膨張性微小球及び層状珪酸塩を含有する熱剥離性粘着剤層を設けてなる熱剥離型粘着シートにより上記目的を達成する。珪酸塩は、熱剥離性粘着剤層を構成するベースポリマー１００重量部に対して、１～２００重量部配合するのが好ましい。
PCT/JP2008/057361 2007-04-20 2008-04-15 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法 WO2008133118A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US12/450,933 US20100119816A1 (en) 2007-04-20 2008-04-15 Heat-peelabe pressure-sensitive adhesive sheet containing layered silicate and process for the production for electronic components by the use of the sheet

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-111390 2007-04-20
JP2007111390A JP2008266455A (ja) 2007-04-20 2007-04-20 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法

Publications (1)

Publication Number Publication Date
WO2008133118A1 true WO2008133118A1 (ja) 2008-11-06

Family

ID=39925576

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/057361 WO2008133118A1 (ja) 2007-04-20 2008-04-15 層状珪酸塩を含む熱剥離型粘着シート及び該シートを使用する電子部品の製造方法

Country Status (5)

Country Link
US (1) US20100119816A1 (ja)
JP (1) JP2008266455A (ja)
KR (1) KR20100016645A (ja)
TW (1) TW200907011A (ja)
WO (1) WO2008133118A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015021081A (ja) * 2013-07-19 2015-02-02 日東電工株式会社 熱剥離型粘着テープ及び電子部品の切断方法
JP2016029161A (ja) * 2013-03-15 2016-03-03 日東電工株式会社 粘着シート

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011111291A1 (ja) * 2010-03-11 2011-09-15 日本電気株式会社 フレームユニット、実装基板ユニット、及びその製造方法
KR101716505B1 (ko) * 2010-12-10 2017-03-14 주식회사 엘지화학 백라이트 유닛용 점착제 조성물, 백라이트 유닛 및 액정표시 장치
JP2012149181A (ja) * 2011-01-19 2012-08-09 Nitto Denko Corp 両面粘着テープ又はシート、および被着体の加工方法
JP5590054B2 (ja) * 2012-02-07 2014-09-17 株式会社村田製作所 積層セラミック電子部品の製造方法
TWI488930B (zh) * 2012-03-12 2015-06-21 Lg Chemical Ltd 壓感性黏著組成物
JP6054208B2 (ja) 2013-03-04 2016-12-27 日東電工株式会社 熱剥離型粘着シート
JP2015076276A (ja) * 2013-10-09 2015-04-20 日東電工株式会社 電解質膜搬送用粘着シートおよび該粘着シートを用いた燃料電池用膜／電極複合体の製造方法
JP2015097195A (ja) * 2013-10-09 2015-05-21 日東電工株式会社 燃料電池用膜／電極複合体の製造方法
WO2018144280A1 (en) * 2017-02-02 2018-08-09 Ares Materials Inc. Flexible color filter and method of manufacturing
KR102145311B1 (ko) 2018-10-05 2020-08-18 삼성전기주식회사 세라믹 전자 부품
US20220025223A1 (en) 2018-12-13 2022-01-27 Nitto Denko Corporation Pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
WO2020121715A1 (ja) 2018-12-13 2020-06-18 日東電工株式会社 粘着剤組成物および粘着シート
CN113096961B (zh) * 2021-04-12 2023-08-15 中国振华集团云科电子有限公司 一种多层瓷介电容器端面金属化方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004300231A (ja) * 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP2004307677A (ja) * 2003-04-08 2004-11-04 Sekisui Chem Co Ltd 接着剤付き樹脂シート
JP2005079529A (ja) * 2003-09-03 2005-03-24 Murata Mfg Co Ltd セラミック電子部品の製造方法
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6617020B2 (en) * 2001-04-04 2003-09-09 3M Innovative Properties Company Hot melt processable pressure sensitive adhesive comprising organophilic clay plate-like particles, a method of making, and articles made therefrom
CA2474693A1 (en) * 2002-02-06 2003-08-14 Sekisui Chemical Co., Ltd. Resin composition and products containing the same
JP4583749B2 (ja) * 2003-11-26 2010-11-17 日東電工株式会社 感圧性接着シート
US20060251888A1 (en) * 2005-05-06 2006-11-09 Richard Lane Pressure sensitive adhesive (PSA) laminates

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004300231A (ja) * 2003-03-31 2004-10-28 Nitto Denko Corp 熱剥離性両面粘着シート、被着体の加工方法および電子部品
JP2004307677A (ja) * 2003-04-08 2004-11-04 Sekisui Chem Co Ltd 接着剤付き樹脂シート
JP2005079529A (ja) * 2003-09-03 2005-03-24 Murata Mfg Co Ltd セラミック電子部品の製造方法
JP2005344008A (ja) * 2004-06-03 2005-12-15 Nitto Denko Corp 剥離可能な感圧性接着シート

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016029161A (ja) * 2013-03-15 2016-03-03 日東電工株式会社 粘着シート
JP2015021081A (ja) * 2013-07-19 2015-02-02 日東電工株式会社 熱剥離型粘着テープ及び電子部品の切断方法

Also Published As

Publication number Publication date
TW200907011A (en) 2009-02-16
JP2008266455A (ja) 2008-11-06
KR20100016645A (ko) 2010-02-12
US20100119816A1 (en) 2010-05-13

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