WO2008123238A1 - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

Info

Publication number
WO2008123238A1
WO2008123238A1 PCT/JP2008/055554 JP2008055554W WO2008123238A1 WO 2008123238 A1 WO2008123238 A1 WO 2008123238A1 JP 2008055554 W JP2008055554 W JP 2008055554W WO 2008123238 A1 WO2008123238 A1 WO 2008123238A1
Authority
WO
WIPO (PCT)
Prior art keywords
formula
resin composition
hydrogen atom
carbon atoms
alkyl group
Prior art date
Application number
PCT/JP2008/055554
Other languages
English (en)
French (fr)
Inventor
Shinya Tanaka
Yoshitaka Takezawa
Original Assignee
Sumitomo Chemical Company, Limited
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Company, Limited, Hitachi, Ltd. filed Critical Sumitomo Chemical Company, Limited
Priority to CN200880017410A priority Critical patent/CN101720336A/zh
Priority to EP08722764A priority patent/EP2133380A1/en
Priority to US12/450,431 priority patent/US20100160555A1/en
Publication of WO2008123238A1 publication Critical patent/WO2008123238A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Epoxy Resins (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Compounds (AREA)

Abstract

　式（１） （式中、Ａｒ１、Ａｒ２およびＡｒ３はそれぞれ同一または相異なって、下記式（ａ）で示されるいずれかの二価基を表わす。ここで、Ｒは水素原子または炭素数１～８のアルキル基を表わす。） で示されるエポキシ化合物と、 式（２） （式中、Ｒ5は水素原子または炭素数１～８のアルキル基を表わし、Ｑ２は単結合または炭素数１～８の直鎖状アルキレン基を表わす。） で示されるエポキシ化合物とを含むことを特徴とする樹脂組成物。
PCT/JP2008/055554 2007-03-26 2008-03-25 樹脂組成物 WO2008123238A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN200880017410A CN101720336A (zh) 2007-03-26 2008-03-25 树脂组合物
EP08722764A EP2133380A1 (en) 2007-03-26 2008-03-25 Resin composition
US12/450,431 US20100160555A1 (en) 2007-03-26 2008-03-25 Resin composition

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007078666A JP2008239679A (ja) 2007-03-26 2007-03-26 エポキシ樹脂組成物
JP2007-078666 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008123238A1 true WO2008123238A1 (ja) 2008-10-16

Family

ID=39830731

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055554 WO2008123238A1 (ja) 2007-03-26 2008-03-25 樹脂組成物

Country Status (7)

Country Link
US (1) US20100160555A1 (ja)
EP (1) EP2133380A1 (ja)
JP (1) JP2008239679A (ja)
KR (1) KR20090129487A (ja)
CN (1) CN101720336A (ja)
TW (1) TW200844159A (ja)
WO (1) WO2008123238A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018168556A1 (ja) * 2017-03-15 2018-09-20 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5020125B2 (ja) * 2008-03-10 2012-09-05 新神戸電機株式会社 積層板の製造法
JP5750861B2 (ja) * 2009-12-17 2015-07-22 Jnc株式会社 オキシラニル基を有する重合性液晶化合物、重合性液晶組成物および重合体
EP2444450A1 (de) 2010-10-19 2012-04-25 Hinterwaldner Consulting & Partner (Gbr) Zusammensetzungen zur Herstellung abhäsiver Beschichtungen
US9876581B2 (en) * 2016-02-10 2018-01-23 Inphi Corporation Circuit for multi-path interference mitigation in an optical communication system
WO2017209210A1 (ja) * 2016-06-02 2017-12-07 日立化成株式会社 エポキシ樹脂組成物、ｂステージシート、硬化エポキシ樹脂組成物、樹脂シート、樹脂付金属箔、及び金属基板
JP2018030929A (ja) * 2016-08-23 2018-03-01 日立化成株式会社 エポキシ樹脂組成物、樹脂シート、ｂステージシート、硬化物、ｃステージシート、樹脂付金属箔、及び金属基板
EP3763774A4 (en) * 2018-04-27 2021-12-15 Toray Industries, Inc. PREPREGNATE AND COMPOSITE MATERIAL REINFORCED WITH CARBON FIBERS
WO2023128018A1 (ko) * 2021-12-30 2023-07-06 예영준 선박구조체 제조를 위한 카르복실기가 포함된 에폭시 발포 조성물 및 이로부터 형성된 선박구조체

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05140138A (ja) * 1991-11-26 1993-06-08 Nippon Kayaku Co Ltd エポキシ樹脂、樹脂組成物及び硬化物
US5811504A (en) 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
WO2005061473A1 (ja) * 2003-12-24 2005-07-07 Sumitomo Chemical Company, Limited エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
JP2006274125A (ja) * 2005-03-30 2006-10-12 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2007078666A (ja) 2005-09-16 2007-03-29 National Institute Of Information & Communication Technology 電磁波形状検出方法及び装置
WO2007142262A1 (ja) * 2006-06-07 2007-12-13 Sumitomo Chemical Company, Limited エポキシ樹脂組成物およびエポキシ樹脂硬化物

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461098A (en) * 1964-03-27 1969-08-12 Union Carbide Corp Polycarbonates of the bisphenol of cyclohexadiene
US5189117A (en) * 1990-08-03 1993-02-23 The Dow Chemical Company Polyurethane from epoxy compound adduct
US6229675B1 (en) * 1993-01-20 2001-05-08 Nippon Petrochemicals Co., Ltd Swing arm actuator for magnetic disk unit
LU88405A1 (de) * 1993-09-08 1995-04-05 Europ Communities Anisotrope Polymere sowie ein Verfahren zu deren Herstellung
DE19504224A1 (de) * 1994-02-23 1995-08-24 Merck Patent Gmbh Flüssigkristallines Material
TW324737B (en) * 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
JP3762436B2 (ja) * 1995-02-17 2006-04-05 メルク パテント ゲゼルシャフト ミット ベシュレンクテル ハフトング ポリマー薄膜
DE59609705D1 (de) * 1995-03-03 2002-10-31 Rolic Ag Zug Photovernetzbare Naphthylderivate
GB2299333B (en) * 1995-03-29 1998-11-25 Merck Patent Gmbh Reactive terphenyls
US5773178A (en) * 1996-09-13 1998-06-30 Japan Synthetic Rubber Co, Ltd. Process for producing a patterned anisotropic polymeric film
US5904984A (en) * 1996-10-17 1999-05-18 Siemens Westinghouse Power Corporation Electrical insulation using liquid crystal thermoset epoxy resins
DE19715993A1 (de) * 1997-04-17 1998-10-22 Clariant Gmbh Polymerlaminate mit erhöhtem Deckvermögen
DE69831186T2 (de) * 1997-04-30 2006-06-08 Jsr Corp. Orientierungsschicht für Flüssigkristall und Verfahren zu ihrer Herstellung
TW410534B (en) * 1997-07-16 2000-11-01 Matsushita Electric Ind Co Ltd Wiring board and production process for the same
US6326555B1 (en) * 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6433317B1 (en) * 2000-04-07 2002-08-13 Watlow Polymer Technologies Molded assembly with heating element captured therein
JP3439726B2 (ja) * 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
US6539171B2 (en) * 2001-01-08 2003-03-25 Watlow Polymer Technologies Flexible spirally shaped heating element
DE60233211D1 (ja) * 2001-02-08 2009-09-17 Honshu Chemical Ind
JP4619770B2 (ja) * 2003-12-24 2011-01-26 住友化学株式会社 エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
JP2008266594A (ja) * 2007-03-26 2008-11-06 Sumitomo Chemical Co Ltd エポキシ樹脂組成物

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05140138A (ja) * 1991-11-26 1993-06-08 Nippon Kayaku Co Ltd エポキシ樹脂、樹脂組成物及び硬化物
US5811504A (en) 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
WO2005061473A1 (ja) * 2003-12-24 2005-07-07 Sumitomo Chemical Company, Limited エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
EP1698625A1 (en) 2003-12-24 2006-09-06 Sumitomo Chemical Company, Limited Epoxy compounds and cured epoxy resins obtained by curing the compounds
JP2006274125A (ja) * 2005-03-30 2006-10-12 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2007078666A (ja) 2005-09-16 2007-03-29 National Institute Of Information & Communication Technology 電磁波形状検出方法及び装置
WO2007142262A1 (ja) * 2006-06-07 2007-12-13 Sumitomo Chemical Company, Limited エポキシ樹脂組成物およびエポキシ樹脂硬化物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018168556A1 (ja) * 2017-03-15 2018-09-20 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
JPWO2018168556A1 (ja) * 2017-03-15 2020-01-16 日立化成株式会社 エポキシ樹脂、エポキシ樹脂組成物、エポキシ樹脂硬化物及び複合材料
US11466119B2 (en) 2017-03-15 2022-10-11 Showa Denko Materials Co., Ltd. Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

Also Published As

Publication number Publication date
US20100160555A1 (en) 2010-06-24
CN101720336A (zh) 2010-06-02
KR20090129487A (ko) 2009-12-16
EP2133380A1 (en) 2009-12-16
JP2008239679A (ja) 2008-10-09
TW200844159A (en) 2008-11-16

Similar Documents

Publication Publication Date Title
WO2008123238A1 (ja) 樹脂組成物
TW200704664A (en) Epoxy resin, epoxy resin composition, prepreg and laminated plate using same
WO2008123237A1 (ja) エポキシ樹脂組成物
TW200609261A (en) A thermosetting resin composition and its article
TW200609207A (en) Novel phenol compound and novel epoxy resin derivable from such phenol compound
MY158316A (en) Cyclic carbodiimide compound
WO2008129912A1 (ja) フェニル基置換１，３，５－トリアジン化合物、その製造方法、およびこれを構成成分とする有機電界発光素子
EP2540759A3 (en) Thermosetting resin composition and cured product of the same
TW200801074A (en) Polyfunctional phenylene ether oligomer, derivative thereof, resin composition containing the same, and use thereof
TW200636010A (en) Silicon-containing curable composition and its cured product
TW200732366A (en) Thermosetting resin composition
MX2010012199A (es) Compuesto de cromeno.
TW200626660A (en) Epoxy resin composition and semiconductor device
TW200714628A (en) Adamantane derivative, epoxy resin, and optical electronic member using resin composition comprising them
TW200706694A (en) Water-soluble preflux and use thereof
MX2010002662A (es) Aminoquinolonas espirociclicas como inhibidores de gsk-3.
TW200710125A (en) Polyamide resin, epoxy resin composition and cured product thereof
TW200634432A (en) Photosensitive resin composition for interplayer insulating film
WO2009060681A1 (ja) 有機金属化合物、水分及び酸素捕捉用組成物、硬化体、及び有機ｅｌ素子
EP1454937A3 (en) Epoxy resin curing agent, curable epoxy resin composition and cured products
EP1756124A4 (en) NOVEL SILANE COUPLING AGENT AND METHOD OF MANUFACTURE
WO2009005135A1 (ja) エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化剤組成物
TW200619240A (en) Star polymer, acid-decomposable resin composition, resist composition, and di(meth) acrylate compound
TW200636388A (en) Photosensitive resin composition for forming lens
MY169359A (en) Epoxy resin composition and electronic component device

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200880017410.X

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08722764

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 2008722764

Country of ref document: EP

ENP Entry into the national phase

Ref document number: 20097022145

Country of ref document: KR

Kind code of ref document: A

WWE Wipo information: entry into national phase

Ref document number: 12450431

Country of ref document: US