WO2008123237A1 - エポキシ樹脂組成物 - Google Patents

エポキシ樹脂組成物 Download PDF

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Publication number
WO2008123237A1
WO2008123237A1 PCT/JP2008/055553 JP2008055553W WO2008123237A1 WO 2008123237 A1 WO2008123237 A1 WO 2008123237A1 JP 2008055553 W JP2008055553 W JP 2008055553W WO 2008123237 A1 WO2008123237 A1 WO 2008123237A1
Authority
WO
WIPO (PCT)
Prior art keywords
carbon atoms
formula
alkyl group
resin composition
hydrogen atom
Prior art date
Application number
PCT/JP2008/055553
Other languages
English (en)
French (fr)
Inventor
Shinya Tanaka
Yoshitaka Takezawa
Original Assignee
Sumitomo Chemical Company, Limited
Hitachi, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Chemical Company, Limited, Hitachi, Ltd. filed Critical Sumitomo Chemical Company, Limited
Priority to EP08722763A priority Critical patent/EP2133379A1/en
Priority to US12/450,425 priority patent/US20100144926A1/en
Priority to CN2008800172640A priority patent/CN101772527B/zh
Publication of WO2008123237A1 publication Critical patent/WO2008123237A1/ja

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/24Di-epoxy compounds carbocyclic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50Amines
    • C08G59/5033Amines aromatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/246Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using polymer based synthetic fibres
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/032Organic insulating material consisting of one material
    • H05K1/0326Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Compounds (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

 式(1) (式中、R1、R2、R3、R4およびR5は、水素原子または炭素数1~8のアルキル基を表わし、mおよびnは0から4の整数を表す。Arは下記式(a)で示されるいずれかの二価基を表わす。ここで、Rは水素原子または炭素数1~8のアルキル基を表わす。)で示されるエポキシ化合物と式(2) (式中、Qは炭素数1~8の直鎖状アルキレン基を表わし、該直鎖状アルキレン基を構成するメチレン基は、炭素数1~8のアルキル基で置換されていてもよく、また、該メチレン基の間に-O-またはN(R6)-が挿入されていてもよい。ここで、R6は、水素原子または炭素数1~8のアルキル基を表わす。)で示されるエポキシ化合物とを含む樹脂組成物。
PCT/JP2008/055553 2007-03-26 2008-03-25 エポキシ樹脂組成物 WO2008123237A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP08722763A EP2133379A1 (en) 2007-03-26 2008-03-25 Epoxy resin composition
US12/450,425 US20100144926A1 (en) 2007-03-26 2008-03-25 Epoxy resin composition
CN2008800172640A CN101772527B (zh) 2007-03-26 2008-03-25 环氧树脂组合物

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-078665 2007-03-26
JP2007078665 2007-03-26

Publications (1)

Publication Number Publication Date
WO2008123237A1 true WO2008123237A1 (ja) 2008-10-16

Family

ID=39830730

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055553 WO2008123237A1 (ja) 2007-03-26 2008-03-25 エポキシ樹脂組成物

Country Status (7)

Country Link
US (1) US20100144926A1 (ja)
EP (1) EP2133379A1 (ja)
JP (1) JP2008266594A (ja)
KR (1) KR20090129486A (ja)
CN (1) CN101772527B (ja)
TW (1) TW200914483A (ja)
WO (1) WO2008123237A1 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008285671A (ja) * 2007-04-19 2008-11-27 Sumitomo Chemical Co Ltd エポキシ樹脂組成物
WO2013039185A1 (ja) * 2011-09-15 2013-03-21 住友化学株式会社 ベンゾオキサジン化合物およびその製造方法
JP2013227451A (ja) * 2012-04-26 2013-11-07 Hitachi Chemical Co Ltd エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、及びプリント配線板

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008239679A (ja) * 2007-03-26 2008-10-09 Sumitomo Chemical Co Ltd エポキシ樹脂組成物
CN105358624B (zh) * 2013-07-04 2017-06-06 松下知识产权经营株式会社 树脂组合物、预浸料和层压板
JP6452133B2 (ja) * 2015-02-17 2019-01-16 田岡化学工業株式会社 環状炭化水素骨格を有するエポキシ樹脂
WO2017209210A1 (ja) * 2016-06-02 2017-12-07 日立化成株式会社 エポキシ樹脂組成物、bステージシート、硬化エポキシ樹脂組成物、樹脂シート、樹脂付金属箔、及び金属基板
CN112041380A (zh) * 2018-04-27 2020-12-04 东丽株式会社 预浸料坯以及碳纤维增强复合材料
CN112135854B (zh) * 2018-08-27 2023-08-25 三菱瓦斯化学株式会社 环氧树脂、环氧树脂组合物和其固化物

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811504A (en) 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
WO2005061473A1 (ja) * 2003-12-24 2005-07-07 Sumitomo Chemical Company, Limited エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
JP2006273989A (ja) * 2005-03-29 2006-10-12 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2007078665A (ja) 2005-09-16 2007-03-29 Japan Science & Technology Agency 血液エンドトキシン測定方法
WO2007142262A1 (ja) * 2006-06-07 2007-12-13 Sumitomo Chemical Company, Limited エポキシ樹脂組成物およびエポキシ樹脂硬化物

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3461098A (en) * 1964-03-27 1969-08-12 Union Carbide Corp Polycarbonates of the bisphenol of cyclohexadiene
US5189117A (en) * 1990-08-03 1993-02-23 The Dow Chemical Company Polyurethane from epoxy compound adduct
US6229675B1 (en) * 1993-01-20 2001-05-08 Nippon Petrochemicals Co., Ltd Swing arm actuator for magnetic disk unit
LU88405A1 (de) * 1993-09-08 1995-04-05 Europ Communities Anisotrope Polymere sowie ein Verfahren zu deren Herstellung
DE19504224A1 (de) * 1994-02-23 1995-08-24 Merck Patent Gmbh Flüssigkristallines Material
TW324737B (en) * 1994-03-30 1998-01-11 Gould Wlectronics Inc Epoxy adhesive composition and copper foil and laminate using the same
WO1996025470A1 (en) * 1995-02-17 1996-08-22 Merck Patent Gmbh Polymeric film
EP0731084B1 (de) * 1995-03-03 2002-09-25 Rolic AG Photovernetzbare Naphthylderivate
GB2299333B (en) * 1995-03-29 1998-11-25 Merck Patent Gmbh Reactive terphenyls
US5773178A (en) * 1996-09-13 1998-06-30 Japan Synthetic Rubber Co, Ltd. Process for producing a patterned anisotropic polymeric film
US5904984A (en) * 1996-10-17 1999-05-18 Siemens Westinghouse Power Corporation Electrical insulation using liquid crystal thermoset epoxy resins
DE19715993A1 (de) * 1997-04-17 1998-10-22 Clariant Gmbh Polymerlaminate mit erhöhtem Deckvermögen
DE69831186T2 (de) * 1997-04-30 2006-06-08 Jsr Corp. Orientierungsschicht für Flüssigkristall und Verfahren zu ihrer Herstellung
TW410534B (en) * 1997-07-16 2000-11-01 Matsushita Electric Ind Co Ltd Wiring board and production process for the same
US6326555B1 (en) * 1999-02-26 2001-12-04 Fujitsu Limited Method and structure of z-connected laminated substrate for high density electronic packaging
US6433317B1 (en) * 2000-04-07 2002-08-13 Watlow Polymer Technologies Molded assembly with heating element captured therein
JP3439726B2 (ja) * 2000-07-10 2003-08-25 住友ベークライト株式会社 被研磨物保持材及びその製造方法
US6539171B2 (en) * 2001-01-08 2003-03-25 Watlow Polymer Technologies Flexible spirally shaped heating element
WO2002062736A1 (fr) * 2001-02-08 2002-08-15 Honshu Chemical Industry Co., Ltd. Diphenol et procede de production de ce diphenol

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5811504A (en) 1995-08-03 1998-09-22 Cornell Research Foundation, Inc. Liquid crystalline epoxy monomer and liquid crystalline epoxy resin containing mesogen twins
WO2005061473A1 (ja) * 2003-12-24 2005-07-07 Sumitomo Chemical Company, Limited エポキシ化合物および該エポキシ化合物を硬化せしめてなるエポキシ樹脂硬化物
EP1698625A1 (en) 2003-12-24 2006-09-06 Sumitomo Chemical Company, Limited Epoxy compounds and cured epoxy resins obtained by curing the compounds
JP2006273989A (ja) * 2005-03-29 2006-10-12 Sumitomo Chemical Co Ltd エポキシ化合物およびエポキシ樹脂硬化物
JP2007078665A (ja) 2005-09-16 2007-03-29 Japan Science & Technology Agency 血液エンドトキシン測定方法
WO2007142262A1 (ja) * 2006-06-07 2007-12-13 Sumitomo Chemical Company, Limited エポキシ樹脂組成物およびエポキシ樹脂硬化物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008285671A (ja) * 2007-04-19 2008-11-27 Sumitomo Chemical Co Ltd エポキシ樹脂組成物
WO2013039185A1 (ja) * 2011-09-15 2013-03-21 住友化学株式会社 ベンゾオキサジン化合物およびその製造方法
JP2013227451A (ja) * 2012-04-26 2013-11-07 Hitachi Chemical Co Ltd エポキシ樹脂組成物、半硬化エポキシ樹脂組成物、硬化エポキシ樹脂組成物、樹脂シート、プリプレグ、積層板、金属基板、及びプリント配線板

Also Published As

Publication number Publication date
KR20090129486A (ko) 2009-12-16
TW200914483A (en) 2009-04-01
US20100144926A1 (en) 2010-06-10
CN101772527A (zh) 2010-07-07
EP2133379A1 (en) 2009-12-16
CN101772527B (zh) 2012-10-10
JP2008266594A (ja) 2008-11-06

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