WO2008123156A1 - 試験装置及び電子デバイス - Google Patents
試験装置及び電子デバイス Download PDFInfo
- Publication number
- WO2008123156A1 WO2008123156A1 PCT/JP2008/055321 JP2008055321W WO2008123156A1 WO 2008123156 A1 WO2008123156 A1 WO 2008123156A1 JP 2008055321 W JP2008055321 W JP 2008055321W WO 2008123156 A1 WO2008123156 A1 WO 2008123156A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- interface circuit
- external interface
- test pattern
- testing apparatus
- testing
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/31813—Test pattern generators
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
- G01R31/318385—Random or pseudo-random test pattern
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/317—Testing of digital circuits
- G01R31/3181—Functional testing
- G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
- G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
- G01R31/318544—Scanning methods, algorithms and patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Tests Of Electronic Circuits (AREA)
- Semiconductor Integrated Circuits (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE112008000937T DE112008000937T5 (de) | 2007-03-29 | 2008-03-21 | Prüfgerät und elektronische Vorrichtung |
KR1020097016918A KR20090111324A (ko) | 2007-03-29 | 2008-03-21 | 시험 장치 및 전자 디바이스 |
CN2008800101984A CN101646954B (zh) | 2007-03-29 | 2008-03-21 | 测试装置及电子器件 |
JP2009509082A JP5186485B2 (ja) | 2007-03-29 | 2008-03-21 | 試験装置 |
US12/512,933 US8299810B2 (en) | 2007-03-29 | 2009-07-30 | Test apparatus and electronic device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007089691 | 2007-03-29 | ||
JP2007-089691 | 2007-03-29 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/512,933 Continuation US8299810B2 (en) | 2007-03-29 | 2009-07-30 | Test apparatus and electronic device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008123156A1 true WO2008123156A1 (ja) | 2008-10-16 |
Family
ID=39830653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/055321 WO2008123156A1 (ja) | 2007-03-29 | 2008-03-21 | 試験装置及び電子デバイス |
Country Status (7)
Country | Link |
---|---|
US (1) | US8299810B2 (ja) |
JP (1) | JP5186485B2 (ja) |
KR (1) | KR20090111324A (ja) |
CN (1) | CN101646954B (ja) |
DE (1) | DE112008000937T5 (ja) |
TW (1) | TWI378461B (ja) |
WO (1) | WO2008123156A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012013446A (ja) * | 2010-06-29 | 2012-01-19 | Advantest Corp | ピンエレクトロニクス回路およびそれを用いた試験装置 |
JP2012185036A (ja) * | 2011-03-04 | 2012-09-27 | Advantest Corp | 試験装置 |
WO2013060361A1 (en) * | 2011-10-25 | 2013-05-02 | Advantest (Singapore) Pte. Ltd. | Automatic test equipment |
KR101482940B1 (ko) * | 2013-09-24 | 2015-01-14 | 주식회사 아이에이 | 내장형 자체 진단 기능을 갖는 반도체 소자 및 이를 이용한 자체 진단 방법 |
JP6478562B2 (ja) * | 2013-11-07 | 2019-03-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
US10132860B2 (en) | 2016-10-28 | 2018-11-20 | Nxp Usa, Inc. | Systems and methods for testing package assemblies |
KR102099355B1 (ko) * | 2018-11-26 | 2020-04-10 | 현대오트론 주식회사 | 집적회로 진단 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10111343A (ja) * | 1996-10-03 | 1998-04-28 | Oki Electric Ind Co Ltd | 集積回路 |
JP2002357642A (ja) * | 2001-06-04 | 2002-12-13 | Hitachi Ltd | スキャン機能付きセル、半導体集積回路のテスト回路及びテスト方法 |
JP2004093421A (ja) * | 2002-08-30 | 2004-03-25 | Oki Electric Ind Co Ltd | テスト回路、そのテスト回路を内蔵した半導体集積回路装置、及びそのテスト方法 |
WO2005111639A1 (ja) * | 2004-05-19 | 2005-11-24 | Advantest Corporation | 発振検出装置、及び試験装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2671817B2 (ja) * | 1994-08-26 | 1997-11-05 | 日本電気株式会社 | 半導体集積回路の検査方法 |
JP2001222897A (ja) | 2000-02-04 | 2001-08-17 | Advantest Corp | 半導体試験装置 |
JP3446124B2 (ja) * | 2001-12-04 | 2003-09-16 | 科学技術振興事業団 | 高速入出力装置を備えた半導体集積回路装置の試験方法及び試験装置 |
US6917215B2 (en) * | 2002-08-30 | 2005-07-12 | Matsushita Electric Industrial Co., Ltd. | Semiconductor integrated circuit and memory test method |
JP4871559B2 (ja) | 2005-09-27 | 2012-02-08 | コヴィディエン・アクチェンゲゼルシャフト | 冷却rfアブレーションニードル |
US7546504B2 (en) * | 2006-08-11 | 2009-06-09 | International Business Machines Corporation | System and method for advanced logic built-in self test with selection of scan channels |
US7679391B2 (en) * | 2008-07-11 | 2010-03-16 | Advantest Corporation | Test equipment and semiconductor device |
-
2008
- 2008-03-21 CN CN2008800101984A patent/CN101646954B/zh not_active Expired - Fee Related
- 2008-03-21 KR KR1020097016918A patent/KR20090111324A/ko not_active Application Discontinuation
- 2008-03-21 DE DE112008000937T patent/DE112008000937T5/de not_active Withdrawn
- 2008-03-21 WO PCT/JP2008/055321 patent/WO2008123156A1/ja active Application Filing
- 2008-03-21 JP JP2009509082A patent/JP5186485B2/ja active Active
- 2008-03-28 TW TW097111564A patent/TWI378461B/zh active
-
2009
- 2009-07-30 US US12/512,933 patent/US8299810B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10111343A (ja) * | 1996-10-03 | 1998-04-28 | Oki Electric Ind Co Ltd | 集積回路 |
JP2002357642A (ja) * | 2001-06-04 | 2002-12-13 | Hitachi Ltd | スキャン機能付きセル、半導体集積回路のテスト回路及びテスト方法 |
JP2004093421A (ja) * | 2002-08-30 | 2004-03-25 | Oki Electric Ind Co Ltd | テスト回路、そのテスト回路を内蔵した半導体集積回路装置、及びそのテスト方法 |
WO2005111639A1 (ja) * | 2004-05-19 | 2005-11-24 | Advantest Corporation | 発振検出装置、及び試験装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI378461B (en) | 2012-12-01 |
US20100026329A1 (en) | 2010-02-04 |
JP5186485B2 (ja) | 2013-04-17 |
KR20090111324A (ko) | 2009-10-26 |
JPWO2008123156A1 (ja) | 2010-07-15 |
DE112008000937T5 (de) | 2010-02-11 |
US8299810B2 (en) | 2012-10-30 |
CN101646954B (zh) | 2013-07-24 |
CN101646954A (zh) | 2010-02-10 |
TW200901212A (en) | 2009-01-01 |
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