WO2008123156A1 - 試験装置及び電子デバイス - Google Patents

試験装置及び電子デバイス Download PDF

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Publication number
WO2008123156A1
WO2008123156A1 PCT/JP2008/055321 JP2008055321W WO2008123156A1 WO 2008123156 A1 WO2008123156 A1 WO 2008123156A1 JP 2008055321 W JP2008055321 W JP 2008055321W WO 2008123156 A1 WO2008123156 A1 WO 2008123156A1
Authority
WO
WIPO (PCT)
Prior art keywords
interface circuit
external interface
test pattern
testing apparatus
testing
Prior art date
Application number
PCT/JP2008/055321
Other languages
English (en)
French (fr)
Inventor
Daisuke Watanabe
Toshiyuki Okayasu
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to DE112008000937T priority Critical patent/DE112008000937T5/de
Priority to KR1020097016918A priority patent/KR20090111324A/ko
Priority to CN2008800101984A priority patent/CN101646954B/zh
Priority to JP2009509082A priority patent/JP5186485B2/ja
Publication of WO2008123156A1 publication Critical patent/WO2008123156A1/ja
Priority to US12/512,933 priority patent/US8299810B2/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/31813—Test pattern generators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3183—Generation of test inputs, e.g. test vectors, patterns or sequences
    • G01R31/318385—Random or pseudo-random test pattern
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/317—Testing of digital circuits
    • G01R31/3181—Functional testing
    • G01R31/3185—Reconfiguring for testing, e.g. LSSD, partitioning
    • G01R31/318533—Reconfiguring for testing, e.g. LSSD, partitioning using scanning techniques, e.g. LSSD, Boundary Scan, JTAG
    • G01R31/318544—Scanning methods, algorithms and patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Semiconductor Integrated Circuits (AREA)

Abstract

　デバイス内部の内部回路とデバイス外部との間で信号を受け渡す外部インターフェイス回路を備える被試験デバイスを試験する試験装置であって、外部インターフェイス回路を試験するための試験パターンを、外部インターフェイス回路に入力するパターン発生部と、外部インターフェイス回路に試験パターンを折り返して出力させるインターフェイス制御部と、外部インターフェイス回路が折り返して出力する試験パターンに基づいて、外部インターフェイス回路の良否を判定するインターフェイス判定部とを備える試験装置を提供する。
PCT/JP2008/055321 2007-03-29 2008-03-21 試験装置及び電子デバイス WO2008123156A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
DE112008000937T DE112008000937T5 (de) 2007-03-29 2008-03-21 Prüfgerät und elektronische Vorrichtung
KR1020097016918A KR20090111324A (ko) 2007-03-29 2008-03-21 시험 장치 및 전자 디바이스
CN2008800101984A CN101646954B (zh) 2007-03-29 2008-03-21 测试装置及电子器件
JP2009509082A JP5186485B2 (ja) 2007-03-29 2008-03-21 試験装置
US12/512,933 US8299810B2 (en) 2007-03-29 2009-07-30 Test apparatus and electronic device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007089691 2007-03-29
JP2007-089691 2007-03-29

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US12/512,933 Continuation US8299810B2 (en) 2007-03-29 2009-07-30 Test apparatus and electronic device

Publications (1)

Publication Number Publication Date
WO2008123156A1 true WO2008123156A1 (ja) 2008-10-16

Family

ID=39830653

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055321 WO2008123156A1 (ja) 2007-03-29 2008-03-21 試験装置及び電子デバイス

Country Status (7)

Country Link
US (1) US8299810B2 (ja)
JP (1) JP5186485B2 (ja)
KR (1) KR20090111324A (ja)
CN (1) CN101646954B (ja)
DE (1) DE112008000937T5 (ja)
TW (1) TWI378461B (ja)
WO (1) WO2008123156A1 (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012013446A (ja) * 2010-06-29 2012-01-19 Advantest Corp ピンエレクトロニクス回路およびそれを用いた試験装置
JP2012185036A (ja) * 2011-03-04 2012-09-27 Advantest Corp 試験装置
WO2013060361A1 (en) * 2011-10-25 2013-05-02 Advantest (Singapore) Pte. Ltd. Automatic test equipment
KR101482940B1 (ko) * 2013-09-24 2015-01-14 주식회사 아이에이 내장형 자체 진단 기능을 갖는 반도체 소자 및 이를 이용한 자체 진단 방법
JP6478562B2 (ja) * 2013-11-07 2019-03-06 株式会社半導体エネルギー研究所 半導体装置
US10132860B2 (en) 2016-10-28 2018-11-20 Nxp Usa, Inc. Systems and methods for testing package assemblies
KR102099355B1 (ko) * 2018-11-26 2020-04-10 현대오트론 주식회사 집적회로 진단 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10111343A (ja) * 1996-10-03 1998-04-28 Oki Electric Ind Co Ltd 集積回路
JP2002357642A (ja) * 2001-06-04 2002-12-13 Hitachi Ltd スキャン機能付きセル、半導体集積回路のテスト回路及びテスト方法
JP2004093421A (ja) * 2002-08-30 2004-03-25 Oki Electric Ind Co Ltd テスト回路、そのテスト回路を内蔵した半導体集積回路装置、及びそのテスト方法
WO2005111639A1 (ja) * 2004-05-19 2005-11-24 Advantest Corporation 発振検出装置、及び試験装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2671817B2 (ja) * 1994-08-26 1997-11-05 日本電気株式会社 半導体集積回路の検査方法
JP2001222897A (ja) 2000-02-04 2001-08-17 Advantest Corp 半導体試験装置
JP3446124B2 (ja) * 2001-12-04 2003-09-16 科学技術振興事業団 高速入出力装置を備えた半導体集積回路装置の試験方法及び試験装置
US6917215B2 (en) * 2002-08-30 2005-07-12 Matsushita Electric Industrial Co., Ltd. Semiconductor integrated circuit and memory test method
JP4871559B2 (ja) 2005-09-27 2012-02-08 コヴィディエン・アクチェンゲゼルシャフト 冷却ｒｆアブレーションニードル
US7546504B2 (en) * 2006-08-11 2009-06-09 International Business Machines Corporation System and method for advanced logic built-in self test with selection of scan channels
US7679391B2 (en) * 2008-07-11 2010-03-16 Advantest Corporation Test equipment and semiconductor device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10111343A (ja) * 1996-10-03 1998-04-28 Oki Electric Ind Co Ltd 集積回路
JP2002357642A (ja) * 2001-06-04 2002-12-13 Hitachi Ltd スキャン機能付きセル、半導体集積回路のテスト回路及びテスト方法
JP2004093421A (ja) * 2002-08-30 2004-03-25 Oki Electric Ind Co Ltd テスト回路、そのテスト回路を内蔵した半導体集積回路装置、及びそのテスト方法
WO2005111639A1 (ja) * 2004-05-19 2005-11-24 Advantest Corporation 発振検出装置、及び試験装置

Also Published As

Publication number Publication date
US8299810B2 (en) 2012-10-30
CN101646954B (zh) 2013-07-24
DE112008000937T5 (de) 2010-02-11
US20100026329A1 (en) 2010-02-04
KR20090111324A (ko) 2009-10-26
CN101646954A (zh) 2010-02-10
TWI378461B (en) 2012-12-01
JP5186485B2 (ja) 2013-04-17
JPWO2008123156A1 (ja) 2010-07-15
TW200901212A (en) 2009-01-01

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