WO2008117718A1 - ショットキーバリアダイオードおよびその製造方法 - Google Patents
ショットキーバリアダイオードおよびその製造方法 Download PDFInfo
- Publication number
- WO2008117718A1 WO2008117718A1 PCT/JP2008/055089 JP2008055089W WO2008117718A1 WO 2008117718 A1 WO2008117718 A1 WO 2008117718A1 JP 2008055089 W JP2008055089 W JP 2008055089W WO 2008117718 A1 WO2008117718 A1 WO 2008117718A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- barrier diode
- schottky barrier
- manufacturing
- same
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/60—Schottky-barrier diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/64—Electrodes comprising a Schottky barrier to a semiconductor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/043—Manufacture or treatment of planar diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
- H10D8/01—Manufacture or treatment
- H10D8/051—Manufacture or treatment of Schottky diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
- H10D62/85—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
- H10D62/8503—Nitride Group III-V materials, e.g. AlN or GaN
Landscapes
- Electrodes Of Semiconductors (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA002652948A CA2652948A1 (en) | 2007-03-26 | 2008-03-19 | Schottky barrier diode and method of producing the same |
| EP08722464A EP2043157A4 (en) | 2007-03-26 | 2008-03-19 | SCHOTTKY BARRIER DIODE AND MANUFACTURING METHOD THEREFOR |
| US12/301,944 US20100224952A1 (en) | 2007-03-26 | 2008-03-19 | Schottky barrier diode and method of producing the same |
| JP2009506303A JP5644105B2 (ja) | 2007-03-26 | 2008-03-19 | ショットキーバリアダイオードの製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007078275 | 2007-03-26 | ||
| JP2007-078275 | 2007-03-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2008117718A1 true WO2008117718A1 (ja) | 2008-10-02 |
Family
ID=39788454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2008/055089 Ceased WO2008117718A1 (ja) | 2007-03-26 | 2008-03-19 | ショットキーバリアダイオードおよびその製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20100224952A1 (enExample) |
| EP (1) | EP2043157A4 (enExample) |
| JP (2) | JP5644105B2 (enExample) |
| KR (1) | KR20090127035A (enExample) |
| CN (1) | CN101542736A (enExample) |
| CA (1) | CA2652948A1 (enExample) |
| TW (1) | TW200845401A (enExample) |
| WO (1) | WO2008117718A1 (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011210751A (ja) * | 2010-03-26 | 2011-10-20 | Nec Corp | Iii族窒化物半導体素子、iii族窒化物半導体素子の製造方法、および電子装置 |
| JP2016162785A (ja) * | 2015-02-27 | 2016-09-05 | 豊田合成株式会社 | 半導体装置およびその製造方法 |
| JP2016533028A (ja) * | 2013-07-11 | 2016-10-20 | シックスポイント マテリアルズ, インコーポレイテッド | Iii族窒化物半導体を用いた電子デバイスおよびその製造方法、および該電子デバイスを製作するためのエピタキシャル多層ウエハ |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8772144B2 (en) * | 2011-11-11 | 2014-07-08 | Alpha And Omega Semiconductor Incorporated | Vertical gallium nitride Schottky diode |
| CN103208534A (zh) * | 2013-04-03 | 2013-07-17 | 上海安微电子有限公司 | 一种制程简化的肖特基器件及制造方法 |
| CN103199120A (zh) * | 2013-04-23 | 2013-07-10 | 上海安微电子有限公司 | 一种台平面肖特基势垒二极管及其制备方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4813273B1 (enExample) * | 1968-10-18 | 1973-04-26 | ||
| JPS4822390B1 (enExample) * | 1969-03-18 | 1973-07-05 | ||
| JPS4827504B1 (enExample) * | 1969-08-13 | 1973-08-23 | ||
| JP2005530334A (ja) | 2002-04-30 | 2005-10-06 | クリー・インコーポレーテッド | 高電圧スイッチング素子およびそれを形成するためのプロセス |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3523223A (en) * | 1967-11-01 | 1970-08-04 | Texas Instruments Inc | Metal-semiconductor diodes having high breakdown voltage and low leakage and method of manufacturing |
| NL167277C (nl) * | 1970-08-29 | 1981-11-16 | Philips Nv | Halfgeleiderinrichting met een plaatvorming half- geleiderlichaam met over althans een deel van de dikte van het halfgeleiderlichaam afgeschuinde randen, dat is voorzien van een metalen elektrode die een gelijkrichtende overgang vormt met het halfgeleider- lichaam en werkwijze ter vervaardiging van de halfgeleiderinrichting. |
| JPS5158866A (ja) * | 1974-11-18 | 1976-05-22 | Matsushita Electronics Corp | Shotsutokiishohekigatahandotaisochi oyobi sonoseizohoho |
| JPS5712565A (en) * | 1980-06-26 | 1982-01-22 | Nec Corp | Schottky barrier element |
| JPS5982774A (ja) * | 1982-11-02 | 1984-05-12 | Nec Corp | 半導体装置 |
| JPS59232467A (ja) * | 1983-06-16 | 1984-12-27 | Toshiba Corp | ガ−ドリング付きシヨツトキ−バリヤ−ダイオ−ド |
| GB8413170D0 (en) * | 1984-05-23 | 1984-06-27 | British Telecomm | Production of semiconductor devices |
| JPH08139341A (ja) * | 1994-11-11 | 1996-05-31 | Murata Mfg Co Ltd | ショットキ−バリアダイオ−ド |
| US5895260A (en) * | 1996-03-29 | 1999-04-20 | Motorola, Inc. | Method of fabricating semiconductor devices and the devices |
| DE19804580C2 (de) * | 1998-02-05 | 2002-03-14 | Infineon Technologies Ag | Leistungsdiode in Halbleitermaterial |
| US6362495B1 (en) * | 1998-03-05 | 2002-03-26 | Purdue Research Foundation | Dual-metal-trench silicon carbide Schottky pinch rectifier |
| US7253015B2 (en) * | 2004-02-17 | 2007-08-07 | Velox Semiconductor Corporation | Low doped layer for nitride-based semiconductor device |
| EP1739726A4 (en) * | 2004-03-26 | 2009-08-26 | Kansai Electric Power Co | BIPOLAR SEMICONDUCTOR ELEMENT AND PROCESS FOR ITS MANUFACTURE |
| TWI375994B (en) * | 2004-09-01 | 2012-11-01 | Sumitomo Electric Industries | Epitaxial substrate and semiconductor element |
| JP2007036052A (ja) * | 2005-07-28 | 2007-02-08 | Toshiba Corp | 半導体整流素子 |
| US8026568B2 (en) * | 2005-11-15 | 2011-09-27 | Velox Semiconductor Corporation | Second Schottky contact metal layer to improve GaN Schottky diode performance |
-
2008
- 2008-03-19 EP EP08722464A patent/EP2043157A4/en not_active Withdrawn
- 2008-03-19 JP JP2009506303A patent/JP5644105B2/ja not_active Expired - Fee Related
- 2008-03-19 KR KR1020087027687A patent/KR20090127035A/ko not_active Withdrawn
- 2008-03-19 CN CNA2008800002601A patent/CN101542736A/zh active Pending
- 2008-03-19 US US12/301,944 patent/US20100224952A1/en not_active Abandoned
- 2008-03-19 CA CA002652948A patent/CA2652948A1/en not_active Abandoned
- 2008-03-19 WO PCT/JP2008/055089 patent/WO2008117718A1/ja not_active Ceased
- 2008-03-26 TW TW097110859A patent/TW200845401A/zh unknown
-
2014
- 2014-08-19 JP JP2014166682A patent/JP2014241436A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4813273B1 (enExample) * | 1968-10-18 | 1973-04-26 | ||
| JPS4822390B1 (enExample) * | 1969-03-18 | 1973-07-05 | ||
| JPS4827504B1 (enExample) * | 1969-08-13 | 1973-08-23 | ||
| JP2005530334A (ja) | 2002-04-30 | 2005-10-06 | クリー・インコーポレーテッド | 高電圧スイッチング素子およびそれを形成するためのプロセス |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP2043157A4 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011210751A (ja) * | 2010-03-26 | 2011-10-20 | Nec Corp | Iii族窒化物半導体素子、iii族窒化物半導体素子の製造方法、および電子装置 |
| JP2016533028A (ja) * | 2013-07-11 | 2016-10-20 | シックスポイント マテリアルズ, インコーポレイテッド | Iii族窒化物半導体を用いた電子デバイスおよびその製造方法、および該電子デバイスを製作するためのエピタキシャル多層ウエハ |
| JP2016162785A (ja) * | 2015-02-27 | 2016-09-05 | 豊田合成株式会社 | 半導体装置およびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| CA2652948A1 (en) | 2008-10-02 |
| JP2014241436A (ja) | 2014-12-25 |
| US20100224952A1 (en) | 2010-09-09 |
| KR20090127035A (ko) | 2009-12-09 |
| TW200845401A (en) | 2008-11-16 |
| JPWO2008117718A1 (ja) | 2010-07-15 |
| EP2043157A1 (en) | 2009-04-01 |
| JP5644105B2 (ja) | 2014-12-24 |
| CN101542736A (zh) | 2009-09-23 |
| EP2043157A4 (en) | 2011-11-16 |
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