WO2008114866A1 - Particule métallique fine, procédé de production de celle-ci, dispersion de particules métalliques fines et procédé de production de celle-ci - Google Patents
Particule métallique fine, procédé de production de celle-ci, dispersion de particules métalliques fines et procédé de production de celle-ci Download PDFInfo
- Publication number
- WO2008114866A1 WO2008114866A1 PCT/JP2008/055276 JP2008055276W WO2008114866A1 WO 2008114866 A1 WO2008114866 A1 WO 2008114866A1 JP 2008055276 W JP2008055276 W JP 2008055276W WO 2008114866 A1 WO2008114866 A1 WO 2008114866A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- producing
- fine metal
- same
- dispersion
- metal particles
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/16—Making metallic powder or suspensions thereof using chemical processes
- B22F9/30—Making metallic powder or suspensions thereof using chemical processes with decomposition of metal compounds, e.g. by pyrolysis
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0545—Dispersions or suspensions of nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/056—Submicron particles having a size above 100 nm up to 300 nm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/16—Metallic particles coated with a non-metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01G—COMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
- C01G3/00—Compounds of copper
- C01G3/02—Oxides; Hydroxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/70—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data
- C01P2002/72—Crystal-structural characteristics defined by measured X-ray, neutron or electron diffraction data by d-values or two theta-values, e.g. as X-ray diagram
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/80—Particles consisting of a mixture of two or more inorganic phases
Abstract
L'invention concerne un procédé de production de particules métalliques fines nanométriques qui sont dispersées dans un solvant organique sans utiliser de tensioactif, etc. et un procédé de production de la dispersion. Le procédé de production des particules métalliques fines ou d'une dispersion de celles-ci comprend les étapes consistant à : disperser un composé métallique dans un solvant organique non réducteur, et irradier ensuite le composé métallique dans ce solvant organique à l'aide de lumière laser en agitant la dispersion. Ces particules métalliques fines comportent chacune une structure cœur-enveloppe dans laquelle le cœur est un métal et l'enveloppe est un oxyde métallique.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009505259A JP5571375B2 (ja) | 2007-03-22 | 2008-03-21 | 金属微粒子及びその製造方法、並びに金属微粒子分散液及びその製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007-075471 | 2007-03-22 | ||
JP2007075471 | 2007-03-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008114866A1 true WO2008114866A1 (fr) | 2008-09-25 |
Family
ID=39765966
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/055276 WO2008114866A1 (fr) | 2007-03-22 | 2008-03-21 | Particule métallique fine, procédé de production de celle-ci, dispersion de particules métalliques fines et procédé de production de celle-ci |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5571375B2 (fr) |
TW (1) | TWI499466B (fr) |
WO (1) | WO2008114866A1 (fr) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010097808A (ja) * | 2008-10-16 | 2010-04-30 | Hitachi Chem Co Ltd | 低粘度分散液、これを用いた銅ナノ粒子配線及び複合材料 |
JP2010209366A (ja) * | 2009-03-06 | 2010-09-24 | Dic Corp | 金属ナノ粒子の製造方法 |
WO2011013542A1 (fr) * | 2009-07-30 | 2011-02-03 | 国立大学法人京都大学 | Nanoparticules métalliques, dispersion les contenant et procédé de production de ces particules |
JP2011074485A (ja) * | 2009-09-04 | 2011-04-14 | National Institute Of Advanced Industrial Science & Technology | 球状ナノ粒子の製造方法及び同製造方法によって得られた球状ナノ粒子 |
JP2013129903A (ja) * | 2011-11-21 | 2013-07-04 | Toyota Central R&D Labs Inc | 無機ナノ粒子の製造方法及び無機ナノ粒子分散液 |
JP5360595B2 (ja) * | 2007-07-31 | 2013-12-04 | 日立金属株式会社 | Cu系配線膜 |
WO2014041956A1 (fr) * | 2012-09-14 | 2014-03-20 | 富士フイルム株式会社 | Procédé de fabrication de couche conductrice et carte de circuits imprimés |
JP2014514451A (ja) * | 2011-04-12 | 2014-06-19 | コリア アトミック エナジー リサーチ インスティチュート | 酸化安定性に優れたコアシェル構造の金属ナノ粒子の製造方法 |
JP2015011900A (ja) * | 2013-06-28 | 2015-01-19 | 古河電気工業株式会社 | 導電性ペースト、及びその製造方法 |
WO2019078100A1 (fr) * | 2017-10-16 | 2019-04-25 | 国立大学法人山形大学 | Procédé de production d'un composite comprenant un métal revêtu de microparticules solides |
JP2020528105A (ja) * | 2017-06-05 | 2020-09-17 | ナノ−ディメンション テクノロジーズ,リミテッド | 金属の幾何学的に離散したナノ粒子組成物の凝集体およびその形成方法 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5088761B1 (ja) * | 2011-11-14 | 2012-12-05 | 石原薬品株式会社 | 銅微粒子分散液、導電膜形成方法及び回路基板 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004259464A (ja) * | 2003-02-24 | 2004-09-16 | Mitsubishi Paper Mills Ltd | 銅/アミン組成物 |
WO2006030605A1 (fr) * | 2004-09-15 | 2006-03-23 | Kyoto University | Microparticule métallique et son procédé de fabrication |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3979344B2 (ja) * | 2003-05-27 | 2007-09-19 | 住友金属鉱山株式会社 | ニッケル粉末の分散水溶液と分散有機溶剤、それらの製造方法及びそれらを用いた導電ペースト |
JP4879473B2 (ja) * | 2004-10-25 | 2012-02-22 | 三井金属鉱業株式会社 | フレーク銅粉及びフレーク銅粉の製造方法並びにフレーク銅粉を含む導電性スラリー |
JP2006316311A (ja) * | 2005-05-12 | 2006-11-24 | Institute Of Physical & Chemical Research | 金属錯イオンの光還元方法 |
JP2008000654A (ja) * | 2006-06-21 | 2008-01-10 | 3R Corp | 粒径200nm以下のナノ粒子の製造方法 |
JP5047706B2 (ja) * | 2006-06-30 | 2012-10-10 | エヌ・イーケムキャット株式会社 | 金属ナノ粒子の製造方法 |
-
2008
- 2008-03-20 TW TW097109904A patent/TWI499466B/zh not_active IP Right Cessation
- 2008-03-21 JP JP2009505259A patent/JP5571375B2/ja not_active Expired - Fee Related
- 2008-03-21 WO PCT/JP2008/055276 patent/WO2008114866A1/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004259464A (ja) * | 2003-02-24 | 2004-09-16 | Mitsubishi Paper Mills Ltd | 銅/アミン組成物 |
WO2006030605A1 (fr) * | 2004-09-15 | 2006-03-23 | Kyoto University | Microparticule métallique et son procédé de fabrication |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5360595B2 (ja) * | 2007-07-31 | 2013-12-04 | 日立金属株式会社 | Cu系配線膜 |
JP2010097808A (ja) * | 2008-10-16 | 2010-04-30 | Hitachi Chem Co Ltd | 低粘度分散液、これを用いた銅ナノ粒子配線及び複合材料 |
JP2010209366A (ja) * | 2009-03-06 | 2010-09-24 | Dic Corp | 金属ナノ粒子の製造方法 |
WO2011013542A1 (fr) * | 2009-07-30 | 2011-02-03 | 国立大学法人京都大学 | Nanoparticules métalliques, dispersion les contenant et procédé de production de ces particules |
CN102470441A (zh) * | 2009-07-30 | 2012-05-23 | 国立大学法人京都大学 | 金属类纳米颗粒、含有该金属类纳米颗粒的分散液及其制造方法 |
JP5119362B2 (ja) * | 2009-07-30 | 2013-01-16 | 国立大学法人京都大学 | 金属系ナノ粒子とそれを含んだ分散液及びその製造方法 |
JP2011074485A (ja) * | 2009-09-04 | 2011-04-14 | National Institute Of Advanced Industrial Science & Technology | 球状ナノ粒子の製造方法及び同製造方法によって得られた球状ナノ粒子 |
JP2015063756A (ja) * | 2009-09-04 | 2015-04-09 | 独立行政法人産業技術総合研究所 | 球状ナノ粒子の製造方法及び同製造方法によって得られた球状ナノ粒子 |
JP2014514451A (ja) * | 2011-04-12 | 2014-06-19 | コリア アトミック エナジー リサーチ インスティチュート | 酸化安定性に優れたコアシェル構造の金属ナノ粒子の製造方法 |
JP2013129903A (ja) * | 2011-11-21 | 2013-07-04 | Toyota Central R&D Labs Inc | 無機ナノ粒子の製造方法及び無機ナノ粒子分散液 |
WO2014041956A1 (fr) * | 2012-09-14 | 2014-03-20 | 富士フイルム株式会社 | Procédé de fabrication de couche conductrice et carte de circuits imprimés |
JP2015011900A (ja) * | 2013-06-28 | 2015-01-19 | 古河電気工業株式会社 | 導電性ペースト、及びその製造方法 |
JP2020528105A (ja) * | 2017-06-05 | 2020-09-17 | ナノ−ディメンション テクノロジーズ,リミテッド | 金属の幾何学的に離散したナノ粒子組成物の凝集体およびその形成方法 |
WO2019078100A1 (fr) * | 2017-10-16 | 2019-04-25 | 国立大学法人山形大学 | Procédé de production d'un composite comprenant un métal revêtu de microparticules solides |
JPWO2019078100A1 (ja) * | 2017-10-16 | 2020-12-17 | 国立大学法人山形大学 | 固体微粒子で被覆された金属を含む複合体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI499466B (zh) | 2015-09-11 |
JPWO2008114866A1 (ja) | 2010-07-08 |
JP5571375B2 (ja) | 2014-08-13 |
TW200902191A (en) | 2009-01-16 |
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