WO2008100101A1 - Carte sonde comprenant une pluralité de connecteurs et procédé de fixation par adhésion des connecteurs sur la carte sonde - Google Patents

Carte sonde comprenant une pluralité de connecteurs et procédé de fixation par adhésion des connecteurs sur la carte sonde Download PDF

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Publication number
WO2008100101A1
WO2008100101A1 PCT/KR2008/000890 KR2008000890W WO2008100101A1 WO 2008100101 A1 WO2008100101 A1 WO 2008100101A1 KR 2008000890 W KR2008000890 W KR 2008000890W WO 2008100101 A1 WO2008100101 A1 WO 2008100101A1
Authority
WO
WIPO (PCT)
Prior art keywords
connectors
substrate
socket
contact
probe card
Prior art date
Application number
PCT/KR2008/000890
Other languages
English (en)
Inventor
Jung-Hoon Lee
Original Assignee
Phicom Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phicom Corporation filed Critical Phicom Corporation
Priority to CN2008800049720A priority Critical patent/CN101611486B/zh
Priority to JP2009549529A priority patent/JP2010519508A/ja
Publication of WO2008100101A1 publication Critical patent/WO2008100101A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester

Definitions

  • Example embodiments of the present invention relate to a probe card for inspecting a semiconductor device and/or a flat panel display device and a method of bonding connectors in the probe card, and more particularly, relate to a probe card including a plurality of connectors and a method of bonding the connectors to a substrate of the probe card.
  • Semiconductor devices are generally manufactured through a series of unit processes such as a fab process, an electrical die sorting (EDS) process and a packaging process.
  • Various electric circuits and devices are fabricated on a semiconductor substrate such as a silicon wafer in the fab process, and electrical characteristics of the electric circuits are inspected and defective chips are detected in the wafer in the EDS process. Then, the devices are individually separated from the wafer and each device is sealed in an epoxy resin and packaged into an individual semiconductor device in the packaging process.
  • a repairable defective chip is regenerated in a repair process and an irreparable defective chip is removed from the wafer prior to an assembly process of the packaging process. Accordingly, the EDS process significantly reduces the cost of the assembly process, to thereby increase production yields of semiconductor devices.
  • a well-known apparatus for the EDS process includes a probe card in which a plurality of probes is installed. Each of the probes makes contact with a conductive pad of an inspection object, such as a wafer, and detects electrical signals from the inspection object.
  • FIG. 1 is a cross-sectional view illustrating a conventional probe card.
  • a conventional probe card 1 includes a first substrate structure 10 having a connection hole 14, a second substrate structure 20 having a contact pad 22 at an upper portion thereof and a plurality of probes (not shown) making direct contact with an inspection object, and a connector 30 connecting the first and second substrate structures 10 and 20.
  • the connector 30 includes an elastic portion 32 that is capable of being elastically deformed and makes point contact with the contact pad 22, and a securing portion 34 that is inserted into the connection hole 14 and is secured to the first substrate structure 10.
  • the elastic portion 32 of the connector 30 makes contact with the contact pad 22 in a direction perpendicular to a top surface of the contact pad 22.
  • the conventional probe card includes a plurality of the connectors 30, and the heights of the connectors 30 are different from one another in accordance with the horizontal level of the first structure 10, the horizontal level of the second structure 20 and a surface profile of the inspection object with which the probe comes into contact. A compression force is applied to the connectors 30 toward the contact pad 22, and thus the connectors 30 are forced to make contact with the contact pad 22.
  • the elastic deformation of the connectors 30 requires elongation of the elastic portion 32, and the elongation of the elastic portion 32 may lead to an increase in electrical resistance and a reduction in the electrical performance of the connectors 30. Disclosure of Invention
  • the present invention provides a probe card in which a lower substrate may be prevented from being deformed by a vertical external force caused through a connector.
  • the present invention also provides a method of bonding the connector to the lower substrate of the probe card.
  • a probe card comprising a first substrate structure, a second substrate structure and a plurality of connectors.
  • the first substrate structure has a plurality of first connection holes and a first conductive layer is located on an inner surface of each of the first connection holes and is connected to a signal line in the first substrate structure.
  • the second substrate structure has a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof.
  • Each of the connectors includes a first contact portion and a second contact portion. The first contact portion is secured to the contact pad of the second substrate structure and the second contact portion is inserted into each of the first connection holes and makes contact with the first conductive layer in each of the first connection holes.
  • the first contact portion is secured to the contact pad by a solder.
  • the second contact portion is shaped into a ring, so that the first conductive layer makes point contact with the second contact portion at least two locations thereof.
  • the second contact portion is shaped into an O -ring.
  • the probe card may further include a socket positioned at a lower surface of the first substrate structure and having a second connection hole into which each of the connectors is inserted.
  • the second conductive layer is located on an inner surface of the second connection hole and is connected to a signal line in the first substrate.
  • the socket includes a first sub-socket secured to the lower surface of the first substrate structure, and a second sub-socket coupled to the first sub-socket and sliding with respect to the first sub-socket, so that the connectors inserted into the first connection holes are secured to the first substrate structure due to the sliding of the second sub-socket with respect to the first sub-socket.
  • each of the first connection holes is connected to the second connection hole.
  • the second contact portion has substantially the same size as the first and the second contact holes.
  • the diameter of the second connection hole of the socket is smaller than that of each of the connectors.
  • another probe card comprising a first substrate structure having a plurality of signal lines, a second substrate structure, a plurality of connectors and a socket.
  • the second substrate structure has a contact pad at an upper portion thereof and a plurality of probes that make contact with an inspection object at a lower portion thereof.
  • the connectors are secured to the contact pad of the second substrate structure.
  • the socket is positioned at a lower surface of the first substrate structure and has a plurality of connection holes into which the connectors are inserted, respectively.
  • a conductive layer is located on an inner surface of each of the connection holes and is connected to a signal line in the first substrate structure.
  • the socket includes a first sub-socket secured to the lower surface of the first substrate structure and a second sub-socket coupled to the first sub-socket and sliding with respect to the first sub-socket, so that each of the connectors inserted into the connection holes are secured to the first substrate structure due to the sliding of the second sub-socket with respect to the first sub-socket.
  • connection hole is shaped into a bar, and the diameters of the connection holes are larger than those of the connectors.
  • the connector is firmly secured to the second substrate and is movingly secured to the first substrate in such a manner that the connector may slide along the connection hole penetrating through the first substrate, so that no external force may be applied to the second substrate structure by the connector despite the displacement of the first and second substrate structures, to thereby prevent the deformation of the second substrate structure.
  • the connector is secured to the contact pad by the solder, to thereby minimize contact failures between the connector and the contact pad.
  • the connector may not need to be elastically deformed, and thus the connector may have a larger cross- sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of a probe card may be sufficiently increased.
  • a method of bonding a connector to a substrate of a probe card A guide plate including a plurality of stacked plates is provided.
  • the guide plate includes a plurality of penetrating holes penetrating through each of the plates.
  • a plurality of connectors is inserted into the penetrating holes, respectively.
  • the connectors are coupled to the guiding plate by sliding one of the plates with respect to other plates, and the connectors coupled to the guiding plate is secured to an upper surface of a substrate including a plurality of probes at a lower surface thereof.
  • the guiding plate is uncoupled from the connectors, and the guiding plate is separated from the connectors.
  • the connectors are secured to the upper surface of the substrate through the following steps.
  • a plurality of solders is formed on an upper surface of the substrate, and the connectors coupled with the guiding plate are brought into contact with the solders, respectively.
  • the solders are heated, to thereby be reflowed, and then are cooled by a cooling process.
  • a gap distance between the solders is substantially the same as a gap distance between the penetrating holes.
  • a connector is firmly secured to a second substrate and is movingly secured to a first substrate in such a manner that the connector may slide along a connection hole penetrating the first substrate. That is, the connector may be restricted in a horizontal direction of the first substrate, and move without any constraints in a vertical direction of the first substrate. Therefore, no external force may be applied to the second substrate structure by the connector despite the displacement of the first and second substrate structures, to thereby prevent the deformation of the second substrate structure.
  • the connector is secured to a contact pad by a solder, to thereby minimize contact failures between the connector and the contact pad.
  • the connector may not need to be elastically deformed, and thus the connector may have a larger cross-sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of a probe card may be sufficiently increased.
  • a plurality of connectors may be simultaneously bonded to accurate locations on a contact pad on a bottom substrate, thereby improving the efficiency and reliability of the bonding process of the connector.
  • the connectors may be accurately bonded to desired positions, respectively, using the guide plate.
  • FIG. 1 is a cross-sectional view illustrating a conventional probe card
  • FIG. 2 is a cross-sectional view illustrating a probe card in accordance with an example embodiment of the present invention
  • FIG. 3 is a partially enlarged view of a portion A in FIG. 2;
  • FIG. 4 is a cross-sectional view illustrating a probe card in accordance with another example embodiment of the present invention.
  • FIG. 5 is a partially enlarged view of a portion A' in FIG. 4;
  • FIG. 6 is a cross-sectional view illustrating a probe card in accordance with still another example embodiment of the present invention.
  • FIG. 7 is a partially enlarged view of a portion A" in FIG. 6;
  • FIGS. 8 to 13 are cross-sectional views illustrating a method of bonding the connector in the probe card in accordance with an example embodiment of the present invention. Best Mode for Carrying Out the Invention
  • FIG. 2 is a cross-sectional view illustrating a probe card in accordance with an example embodiment of the present invention
  • FIG. 3 is a partially enlarged view of a portion A in FIG. 2.
  • a probe card 100 includes first and second substrate structures 110 and 120, a connector 130, a securing plate 140 and a horizontal level-controlling member 150.
  • the first substrate structure 110 includes a plurality of signal lines (not shown) in the interior thereof and includes a plurality of connection holes 112.
  • the connection holes 112 connect to the signal lines and penetrate through the first substrate structure 110.
  • a conductive layer 114 is formed on an inner surface of the connection holes.
  • the conductive layer 114 may comprise a conductive material such as copper (Cu).
  • the signal lines are electrically connected to an additional tester (not shown).
  • the second substrate structure 120 is positioned below the first substrate structure
  • a bottom substrate 122 includes a contact pad 124, a probe 126 and a signal line 128.
  • the bottom substrate 122 may be shaped into a plate and have a smaller size than the first substrate structure 110.
  • a plurality of the contact pads 124 is arranged on a top surface of the bottom substrate 122, and comprises conductive materials.
  • a plurality of the probes 126 is protruded from a bottom surface of the bottom substrate 122.
  • the probe 122 may be formed separately from the bottom substrate 122, and may be installed onto the bottom surface of the bottom substrate 122. Otherwise, the probe 122 may be formed on the bottom surface of the bottom substrate 122 in one body. While the present example embodiment discloses a cantilever-type probe, a vertical-type probe or any other configuration known to one of the ordinary skill in the art may also be utilized in place of or in conjunction with the cantilever-type probe.
  • the signal line 128 is positioned in the interior of the bottom substrate 122, and the probe 126 is electrically connected to the contact pad 124.
  • the signal line 128 may include multilayer wirings, each of which is electrically connected with one another through a contact plug or a via.
  • a capacitor may be connected to the signal line 128.
  • the capacitor may be positioned on a top surface or the bottom surface of the bottom substrate 122. Otherwise, the capacitor may also be positioned in the interior of the bottom substrate 122. Noise in an electrical signal or distorted signals passing through the signal line 128 may be grounded by the capacitor, to thereby prevent the noise and distortion of the electrical signal. In addition, when input power is insufficiently applied to an inspection object, the capacitor may also compensate for the shortage of the input power.
  • the connector 130 electrically connects the first and second substrate structures 110 and 120 with each other.
  • the connector 130 may electrically connect the conductive layer 114 of each of the connection holes 112 and the contact pad 124, and may comprise a conductive material such as a metal.
  • the connector 130 may include a first contact portion
  • the first contact portion 132 may be shaped into a square block, and the second contact portion 134 may be shaped into a hook, as shown in FIGS. 2 and 3.
  • the second contact portion 134 may be shaped into an O -ring.
  • the first contact portion 132 is secured to the contact pad 124 by a solder, and thus the connector 130 is secured to the second substrate structure 120.
  • the second contact portion 134 is inserted into each of the connection holes 112.
  • the hook-shaped second contact portion 134 is inserted into each of the connection holes 112 using a shrink-fit method, to thereby be compressed in the connection holes 112.
  • the conductive layer 114 makes contact with the second contact portion 134 at least two points, because the second contact portion 134 is shaped into a hook. Any modifications of the shape of the second contact portion 134 would lead to an increase of the number of contact points of the second contact portion 134 and the conductive layer 114, as would be known to one of the ordinary skill in the art.
  • the connector 130 is secured to the second substrate structure 120 and is movably connected to the first substrate structure 110, so that the connector 130 may move up and down while maintaining the contact with the first substrate structure 110. That is, although the first and second substrate structures 110 and 120 are not parallel with each other or one of the first and second substrate structures 110 and 120 moves up and down, the second contact portion 134 of the connector 130 maintains the physical contact with the conductive layer 114 while moving up and down. As a result, no external vertical force is applied to the second substrate structure 120 by the connector 130 because the connector 130 slides along the conductive layer 114, to thereby prevent deformation of the second substrate structure 120.
  • the connector 130 is secured to the contact pad 124 by the solder 136, thereby minimizing contact failures between the connector 130 and the contact pad 124. Furthermore, the connector 130 may not need to be elastically deformed, thereby reducing the length of the connector 130. As a result, the electrical resistance of the connector 130 may be sufficiently reduced, to thereby improve the electrical performance of the probe card 100.
  • the second contact portion 134 may have any other modifications in shape, such as an O -ring, only if the second contact portion 134 makes contact with the conductive layer 114, as would be known to one of the ordinary skill in the art.
  • the securing plate 140 secures the first and second substrate structures 110 and 120 with each other, and includes a first plate 141, a second plate 142, a third plate 143, a leaf spring 144 and a plurality of bolts (not shown).
  • the first plate 141 is shaped into a disk, and is positioned on an upper surface of the first substrate structure 110.
  • the second plate 142 is shaped into a ring, and is positioned at a peripheral portion of a lower surface of the first substrate structure 110.
  • the first plate 141, the first substrate structure 110 and the second plate 142 are secured to one another by a first bolt 145.
  • the third plate 143 is shaped into a ring smaller than the second plate 142, and surrounds a sidewall of the second substrate structure 120.
  • the leaf spring 144 makes contact with the second and third plates 142 and 143.
  • the second plate 142 and the leaf spring 144 are secured to each other by a second bolt 146, and the third plate 143 and the leaf spring 144 are secured to each other by a third bolt 147.
  • the horizontal level-controlling member 150 penetrates the first plate 141 and the first substrate structure 110, and makes contact with an upper surface of the second substrate structure 120.
  • a thickness of the bottom substrate 122 of the second substrate structure 120 is varied in a longitudinal direction, the probes 126 may be difficult to position at the same level even though the first and second substrate structures 110 and 120 are positioned at the same level.
  • the horizontal level- controlling member 150 controls an amount of external force applied to the upper surface of the second substrate structure 120 in such a manner that the tips of the probes 126 are positioned at the same level, to thereby control the horizontal level of the lower surface of the second substrate structure 120.
  • FIG. 4 is a cross-sectional view illustrating a probe card in accordance with another example embodiment of the present invention
  • FIG. 5 is a partially enlarged view of a portion A' in FIG. 4.
  • a probe card 200 includes first and second substrate structures 210 and 220, a connector 230, a securing plate 240, a horizontal level-controlling member 250 and a socket 260.
  • the probe card 200 of the present embodiment has substantially the same structure as the probe card 100 described with reference to FIGS. 2 and 3, except for the connector 230 and the socket 260, and thus any further detailed descriptions on the first and second substrate structures 210 and 220, the securing plate 240 and the horizontal level-controlling member 250 are omitted hereinafter.
  • the connector 230 electrically connects the first and second substrate structures 210 and 220 with each other.
  • the connector 230 may electrically connect a first conductive layer 214 of a first connection hole 212 and the contact pad 224, and may comprise a conductive material such as a metal.
  • the connector 230 may include a first contact portion 232 that is secured to the contact pad 224 of the second substrate structure 220 and a second contact portion 234 that is inserted into the first connection hole 212 of the first substrate structure 210 and into a second connection hole 262 of the socket 260.
  • the first contact portion 232 may be shaped into a block and is secured to the contact pad 224 by a solder 236, so that the connector 230 is secured to the second substrate structure 230.
  • the second contact portion 234 is shaped into a bar of which the size is smaller than the first and second connection holes 212 and 262.
  • the socket 260 is positioned at a lower surface of the first substrate structure 210 and has the second connection hole 262 corresponding to the first connection hole 212.
  • the second connection hole 262 is connected to the first connection hole 212, and has a diameter that is substantially the same as that of the first connection hole 212.
  • a second conductive layer 264 is positioned on an inner surface of the second connection hole 262, and is electrically connected to a signal line in the first substrate structure 210.
  • the second conductive layer 264 may comprise a conductive material such as copper (Cu).
  • the socket 260 includes a first sub-socket 260a and a second sub-socket 260b.
  • the first sub-socket 260a is secured to a bottom surface of the first substrate structure 210
  • the second sub-socket 260b is movingly positioned at a lower portion of the first sub-socket 260a with respect to the first sub-socket 260a. Therefore, the second contact portion 234 of the connector 230 is inserted into the first connection hole 212 and the second connection hole 262, and the second sub-socket 260b slides with respect to the first sub-socket 260a, to thereby secure the second contact portion 234 to the socket 260, as shown in FIG. 5. As a result, the second contact portion 234 makes contact with the first and second conductive layers 214 and 264.
  • the gap distance between the first and second substrate structures 210 and 220 may be decreased by the socket 260.
  • the connector 230 may move along the first and second connection holes 212 and 262 while maintaining electrical contact with the first substrate structure 210 and the socket 260. That is, an external force may not be applied to the second substrate structure 220 by the connector 230 despite the displacement of the first and second substrate structures 220 and 230, to thereby prevent the deformation of the second substrate structure 220.
  • the connector 230 is secured to the contact pad 224 by the solder, to thereby minimize contact failures between the connector 230 and the contact pad 224.
  • the connector 230 may not need to be elastically deformed, so that the connector 230 may have a larger cross-sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of the probe card 200 may be sufficiently increased.
  • FIG. 6 is a cross-sectional view illustrating a probe card in accordance with still another example embodiment of the present invention
  • FIG. 7 is a partially enlarged view of a portion A"in FIG. 6.
  • a probe card 300 includes first and second substrate structures 310 and 320, a connector 330, a securing plate 340, a horizontal level-controlling member 350 and a socket 360.
  • the probe card 300 of the present embodiment has substantially the same structure as the probe card 200 described with reference to FIGS. 4 and 5, except for the first substrate structure 310, and thus any further detailed descriptions on the second substrate structures 320, the connector 330, the securing plate 340, the horizontal level- controlling member 350 and the socket 360 are omitted hereinafter.
  • connection hole and conductive layer are installed in the first substrate structure 310, as compared with the first substrate structure 210 in FIGS. 4 and 5 including the first connection hole and the conductive layer. Therefore, the second contact portion 334 of the connector 330 is inserted into the connection hole 362 of the socket 360 and makes contact with a conductive layer 364. The diameter of the second contact portion 334 is smaller than that of the connection hole 362.
  • the connector 330 may move along the connection hole 362 while maintaining the electrical contact with the first substrate structure 310 and the socket 360. That is, an external force may not be applied to the second substrate structure 320 by the connector 330 despite the displacement of the first and second substrate structures 320 and 330, to thereby prevent the deformation of the second substrate structure 320.
  • the connector 330 is secured to the contact pad 324 by the solder, to thereby minimize contact failures between the connector 330 and the contact pad 324.
  • the connector 330 may not need to be elastically deformed, and thus the connector 330 may have a larger cross-sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of the probe card 300 may be sufficiently increased.
  • FIGS. 8 to 13 are cross-sectional views illustrating a method of bonding the connector in the probe card in accordance with an example embodiment of the present invention.
  • a guide plate 500 is prepared as a multilayer structure, and a plurality of penetrating holes 510 penetrates the guide plate 500.
  • three plates are stacked in the guide plate 500 for stable bonding of the connector in the probe card.
  • Two plates or four or more plates may also be stacked in the guide plate 500, as would be known to one of the ordinary skill in the art.
  • a gap distance between neighboring penetrating holes is substantially the same as the gap distance between neighboring connectors.
  • the penetrating hole 510 is located to the same position at each of the plates of the guide plate 500, so that the penetrating hole 510 is connected through all of the plates of the guide plate 500.
  • a plurality of the connectors 130 is inserted into the penetrating holes 510 of the guide plate 500, respectively.
  • the height of the guide plate 500 is smaller than that of the connector 130, to thereby allow easy inspection of the insertion of the connector 130 into the penetrating hole 510. That is, the first contact portion 132 of the connector 130, which is shaped into a block, is protruded from a top surface of the guide plate 500, and the second contact portion 134 of the connector 130, which is shaped into a ring, is protruded from a bottom surface of the guide plate 500.
  • one of the plates slides with respect to the other plates in the guide plate 500.
  • a central plate slides with respect to upper and lower plates.
  • the upper or lower plate may also slide with the other plates, as would be known to one the ordinary skill in the art.
  • Non-sliding plates are maintained to be stationary when one of the plates slides.
  • the non- sliding plates are referred to as stationary plates.
  • the sliding plate makes contact with a first sidewall of the connector 130, and an external force is applied to the connector 130 in a first direction parallel with the sliding direction by the sliding plate.
  • the stationary plate makes contact with a second sidewall of the connector 130, opposite to the first sidewall of the connector 130, and a reaction force is applied to the connector 130 in a second direction opposite to the first direction by the stationary plate.
  • the connector 130 is coupled to the guide plate 500 by a coupling force of the external force and the reaction force.
  • a plurality of contact pads 124 is arranged on a top surface of the bottom substrate 122, and a plurality of solders 136 is coated on the contact pads 124, respectively.
  • a paste may be used as the solder 136.
  • a plurality of probes 126 is located at a bottom surface of the bottom substrate 122.
  • a gap distance of the contact pads 124 is substantially the same as that of the penetrating holes 510 of the guide plate 500.
  • the solders 136 may be coated on the contact pad 124 using a mask pattern or an auto dispenser.
  • the bottom substrate 122 and the guide plate 500 are aligned with each other in such a manner that the connectors 130 in the guide plate 500 are located over the contact pads 124 on the bottom substrate 122, respectively. Then, the guide plate 500 moves downward, and thus the connectors 130 make contact with the solders 136 on the contact pads 124, respectively.
  • Each of the solders 136 is heated by heat transfer, to thereby be reflowed by heat, and then is sufficiently cooled.
  • the solder 136 may be cooled by a passive cooling process or by a cooling gas injected thereto. As a result, the connectors are firmly bonded to the contact pads 124 by the solder 136, respectively.
  • the sliding plate of the guide plate 500 returns back to the original location, and the connector 130 is spaced apart from an inner surface of the penetration hole 510 of the guide plate 500, so that the connector 130 is uncoupled from the guide plate 500. Then, the guide plate 500 moves upward, and the connectors 130 are separated from the guide plate 500, thereby completing the bonding of the connectors to the bottom substrate 122. The connector 130 is secured to the bottom substrate 122 through the above bonding process.
  • a plurality of connectors 130 may be simultaneously bonded to the bottom substrate 122. Further, the connector 130 may be bonded to an accurate contact pad 124 on the bottom substrate 122, thereby improving the efficiency and reliability of the bonding process of the connector 130.
  • a connector is firmly secured to a second substrate and is movingly secured to a first substrate in such a manner that the connector may slide along a connection hole penetrating the first substrate. That is, the connector may be restricted in a horizontal direction of the first substrate, and move without any constraints in a vertical direction of the first substrate. Therefore, no external force may be applied to the second substrate structure by the connector despite the displacement of the first and second substrate structures, to thereby prevent the deformation of the second substrate structure.
  • the connector is secured to a contact pad by a solder, to thereby minimize contact failures between the connector and the contact pad.
  • the connector may not need to be elastically deformed, and thus the connector may have a larger cross-sectional area with a shorter length to thereby reduce electrical resistance. As a result, the electrical performance of a probe card may be sufficiently increased.
  • a plurality of connectors may be simultaneously bonded to an accurate location on a contact pad on a bottom substrate, thereby improving the efficiency and reliability of the bonding process of the connector.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

Dans une carte sonde destinée à inspecter un dispositif à semi-conducteur et un dispositif à écran plat, on trouve des première et seconde structures de substrat et une pluralité de connecteurs. La première structure de substrat présente une pluralité de trous de connexion. Une couche conductrice est disposée sur une surface interne de chacun des trous de connexion et est connectée à une ligne signal dans le premier substrat. La seconde structure de substrat à un plot de contact sur une région supérieure et une pluralité de sondes en contact avec l'objet à inspecter sur une région inférieure. Chacun des connecteurs comprend une première partie de contact fixée au plot de contact de la seconde structure de substrat et une seconde partie de contact insérée dans chacun des trous de connexion, en contact avec la couche conductrice. Ainsi, la seconde structure de substrat peut être protégée contre des déformations dues à une force verticale extérieure exercée par les connecteurs.
PCT/KR2008/000890 2007-02-16 2008-02-15 Carte sonde comprenant une pluralité de connecteurs et procédé de fixation par adhésion des connecteurs sur la carte sonde WO2008100101A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2008800049720A CN101611486B (zh) 2007-02-16 2008-02-15 包括多个连接器的探针卡和将连接器结合至探针卡的基板的方法
JP2009549529A JP2010519508A (ja) 2007-02-16 2008-02-15 プローブカード及び接続体のボンディング方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2007-0016403 2007-02-16
KR1020070016403A KR100855302B1 (ko) 2007-02-16 2007-02-16 프로브 카드 및 접속체 본딩 방법

Publications (1)

Publication Number Publication Date
WO2008100101A1 true WO2008100101A1 (fr) 2008-08-21

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IT201900024946A1 (it) * 2019-12-20 2021-06-20 Technoprobe Spa Testa di misura con un contatto migliorato tra sonde di contatto e fori guida
EP4273559A1 (fr) * 2022-05-03 2023-11-08 MediaTek Inc. Kit de test pour tester un dispositif à tester
US11879934B2 (en) 2021-06-11 2024-01-23 Mediatek Inc. Test kit for testing a device under test

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KR101384714B1 (ko) * 2014-01-14 2014-04-15 윌테크놀러지(주) 반도체 검사장치
KR101421048B1 (ko) * 2014-02-07 2014-07-23 윌테크놀러지(주) 능동소자 칩이 탑재된 반도체 검사 장치
CN108872651B (zh) * 2017-05-08 2021-05-07 旺矽科技股份有限公司 探针卡
KR102261798B1 (ko) * 2020-04-03 2021-06-07 (주)화이컴 프로브 카드 제조용 지그, 이를 포함하는 프로브 정렬 시스템 및 이를 이용하여 제조된 프로브 카드
JP2023076046A (ja) * 2021-11-22 2023-06-01 株式会社日本マイクロニクス プローブ格納治具、プローブ格納システムおよびプローブ格納方法
KR102456905B1 (ko) * 2022-05-31 2022-10-20 주식회사 프로이천 평탄도조절이 가능한 프로브카드

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JP2010519508A (ja) 2010-06-03
KR20080076457A (ko) 2008-08-20
CN101611486A (zh) 2009-12-23
CN101611486B (zh) 2012-09-26
TWI363456B (en) 2012-05-01
KR100855302B1 (ko) 2008-08-29
TW200840150A (en) 2008-10-01

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