Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
  • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/01—Dielectrics
  • H05K2201/0183—Dielectric layers
  • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/0909—Preformed cutting or breaking line
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
  • H05K2201/09—Shape and layout
  • H05K2201/09009—Substrate related
  • H05K2201/09127—PCB or component having an integral separable or breakable part
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
  • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
  • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
  • H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
  • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
  • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/46—Manufacturing multilayer circuits
  • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
  • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
  • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer

Definitions

• the present invention relates to a method for producing a rigid-flexible printed circuit board, wherein at least one rigid region of a printed circuit board is connected via a layer of non-conductive material or a dielectric layer to at least one flexible region of the printed circuit board, wherein after connecting the at least one rigid and flexible region of the printed circuit board is cut through the rigid region of the printed circuit board and a connection is made between the mutually separate, rigid partial regions of the printed circuit board via the flexible region connected thereto.
• the invention further relates to a rigid-flexible printed circuit board, wherein at least one rigid region of a printed circuit board is connected via a layer of non-conductive material or a dielectric layer with at least one flexible region of the printed circuit board, wherein after connecting the at least one rigid and flexible portion of the circuit board, the rigid portion of the circuit board is severed and a connection between the separate, rigid portions over the associated, flexible region can be produced.
• connection points of active components to components of a printed circuit board
• reduction in the size simultaneously providing a reduction in the distance between such connection points is.
• HDI high density interconnects
• Such thick, known layers of non-conductive material or dielectric layers also lead to additional processing or process steps and / or to a more complex design for producing the necessary connections between the rigid and flexible areas of the printed circuit boards, since in particular a corresponding one Pre-fabricating or formatting according to the subsequent separation of the rigid areas of the circuit board is provided.
• the present invention aims to develop both a method of the type mentioned above and a printed circuit board of the type mentioned in such a way that rigid-flexible printed circuit boards for highly complex, electronic components can be produced in a simplified process, which is also aimed at to simplify processing of rigid-flexible printed circuit boards according to the invention.
• a method of the type mentioned is essentially characterized in that in the area of the subsequent severing of the rigid area of the circuit board an area of between the rigid and flexible of a direct connection between the rigid area and the flexible area of the circuit board Provided on the circuit board to be arranged layer of non-conductive material or a dielectric by applying a subsequent adhesion of the layer to be arranged on the rigid region preventing material.
• an area which is free of a connection is provided, which in particular adheres to the rigid and subsequently to - -
• the provision of an area excluded from a connection makes it possible to use layers or layers of nonconductive material or a dielectric which are known per se, in particular a prefabrication and / or formatting in the area of the subsequent severing of the rigid subarea can be dispensed with, preferably according to the invention it is proposed that the layer to be arranged between the rigid region and the flexible region of the circuit board is used essentially without pre-assembly, so that preparatory steps for the preparation of the preparation or layer of non-conductive material or a Dielectric can be simplified.
• the adhesion-preventing material in particular the wax-like paste
• a printing process in particular by screen printing or stencil printing, and optionally one subsequent drying and / or curing is subjected.
• waxy pastes can be applied in the form of a microdispersion in polar or nonpolar organic solvents, as corresponds to a further preferred embodiment of the process according to the invention.
• Hiebei is proposed according to a further preferred embodiment, that the paste polyethylene waxes, polypropylene waxes, Teflon-based waxes and / or mixtures thereof, wherein such waxes according to the requirements, in particular for the subsequent cutting step reliably available.
• the paste with inorganic and / or organic fillers and additives is provided, as a further preferred Embodiment of the inventive method corresponds.
• the adhesion-preventing material in particular the paste, in a layer thickness of less than 25 microns , in particular less than 20 microns, is applied.
• the milling edges be fixed on the rigid substrate before the application of the subsequent adhesion-preventing material Be formed portion of the circuit board and that the Fräskanten are filled with the subsequent adhesion preventing material, as corresponds to a preferred embodiment of the method according to the invention.
• subsequently known foils or layers can generally be provided for the connection to be provided between the rigid region and the flexible region non-conductive material or a dielectric are used, it being proposed in this context according to a preferred embodiment, that to be arranged between the rigid region and the flexible region of the circuit board layer of non-conductive material or dielectric in a conventional manner of a sheet or foil-like material is formed.
• a sheet-like or film-like material may be formed from known prepregs or RCC films.
• liquid dielectrics may also be used to form such a layer between the rigid and flexible regions of the printed circuit board.
• the thickness of the layer to be arranged between the rigid region and the flexible region of the printed circuit board be less than 50 ⁇ m, in particular less than 40 ⁇ m becomes.
• a use of such thin layers of non-conductive material or a dielectric is also, as already mentioned above, made possible by the fact that in the area of the subsequent severing of the rigid area a pre-fabricating - -
• tion and / or formatting of the layer or film to be arranged is not required due to the release according to the invention before a connection, as corresponds to a preferred embodiment of the invention.
• a multilayer printed circuit board be used at least for the rigid region of the printed circuit board.
• a rigid-flexible printed circuit board of the type mentioned above essentially characterized in that in the subsequent separation of the rigid portion of the printed circuit board one of a direct connection between the rigid region and the flexible region of the printed circuit board Area of the to be arranged between the rigid and flexible region of the circuit board layer of non-conductive material or a dielectric by applying a subsequent adhesion of the layer to be arranged on the rigid region preventing material is provided. It is thus possible to provide a rigid-flexible printed circuit board with simple process steps, wherein an increase in the registration accuracy can be achieved and the subsequent separation of the rigid portion of the printed circuit board is simplified.
• the paste contains polyethylene waxes, polypropylene waxes, Teflon-based waxes and / or mixtures thereof, it being proposed according to a further preferred embodiment that the paste be coated with inorganic and / or or organic fillers and additives.
• the adhesion-preventing material in particular the paste, have a layer thickness of less than 25 ⁇ m, in particular less than 20 ⁇ m, as is a further preferred embodiment - Form of the invention corresponds.
• the materials can be found with materials known per se, in which connection according to a preferred embodiment it is proposed that the between the rigid region and the flexible region of the circuit board to be arranged layer of non-conductive material or dielectric is formed in a conventional manner of a sheet or foil-like material.
• the thickness of the layer to be arranged between the rigid region and the flexible region of the printed circuit board is selected to be less than 50 ⁇ m, in particular less than 40 ⁇ m, as this corresponds to a further preferred embodiment of the rigid-flexible printed circuit board according to the invention.
• FIG. 1 shows a schematic section through an embodiment of a rigid region of a rigid-flexible printed circuit board to be produced according to the invention
• FIG. 2 is a section similar to FIG. 1, showing a section through the rigid region of the rigid-flexible printed circuit board to be produced according to the invention, wherein milling edges are provided in the region of a subsequent severing of the rigid region
• Fig. 3 in a similar to Figs.
• FIG. 4 shows a section similar in turn to the previous figures, wherein a layer of non-conductive material or a dielectric and a flexible region of the rigid-flexible printed circuit board are arranged or fixed on the rigid region;
• Fig. 5 in a turn similar section the inventive rigid-flexible circuit board after a transection of the rigid area.
• FIG. 1 shows a schematic representation of a rigid, multi-layered region 1 of a rigid-flexible printed circuit board to be produced subsequently.
• cutting edges 7 are formed in the region of a subsequent severing of the rigid, multi-layered region 1 of the rigidly flexible printed circuit board to be produced, as indicated in FIG. 2.
• rigid area 1 of the circuit board and to be provided for connection to a flexible region of the circuit board and to be arranged layer of non-conductive material or a dielectric is subsequently to the training the Fräskanten 7 arranged in the embodiment shown in the figures, such a adhesion preventing material 8 in the region of the subsequent transection and in the grooves formed by the Fräskanten 7 grooves or grooves.
• the adhesion preventing material may be, for example - -
• a waxy paste 8 may be formed by a waxy paste 8, wherein such a waxy paste 8 is applied or introduced in simple steps, for example by a printing process, in particular by screen printing or stencil printing in the field of subsequent cutting and in the Fräskanten 7.
• a printing process in particular by screen printing or stencil printing in the field of subsequent cutting and in the Fräskanten 7.
• the waxy paste may be provided subsequent to the application of the material or the paste 8, a drying and / or curing process.
• the material or paste 8 can hiebei be applied in the form of a microdispersion in polar or non-polar, organic solvents. Moreover, for ease of processing and ease of handling, the paste 8 is formed, for example, of polyethylene waxes, polypropylene waxes, Teflon-based waxes, and / or mixtures thereof.
• the paste 8 is provided with inorganic and / or organic fillers and / or additives.
• the paste or the material 8 is applied in the region of the subsequent severing with a layer thickness of less than 25 .mu.m, in particular less than 20 .mu.m becomes.
• the paste 8 may alternatively be in the region of the subsequent severing of the rigid, in particular multilayer, region of the printed circuit board be applied, after which then the Fräskanten 7 penetrate the applied material 8.
• this bonding layer 9 for example, from a known film, such as a prepreg or an RCC film, or may be formed by a liquid dielectric.
• a flexible portion 10 of the manufactured, rigid-flexible circuit board is indicated, wherein the flexible portion 10 of the manufactured, rigid-flexible circuit board as well as the rigid portion 1 may be formed multi-layered ,
• the cut-out area in the region of the application of the material 8 on the rigid region 1 of the rigid-flexible printed circuit board to be produced can be found with lower layer thicknesses of the layer 9, the thickness of which, for example, less than 50 microns, especially less than 40 microns, is selected.
• the layer of non-conductive material to be arranged between the rigid region 1 and the flexible region 10 of the rigid-flexible printed circuit board not only can a reduction in the total thickness of the rigid-flexible printed circuit board to be produced be supported, but it can also the positioning and registration accuracy of the areas to be joined together and of subsequent passage openings or micro-vias are increased.
• FIG. 5 shows a section through the rigid-flexible printed circuit board formed from the rigid region 1 and the flexible region 10, wherein a cut-through 11 between the now separate, rigid partial regions 12 and 13 has been made in the region of the milling edges 7.
• a connection between the flexible region 10 of the printed circuit board and the now separated, rigid partial regions 12 and 13 can be achieved by additional microvia or through openings 14.
• adhesion-preventing material or the wax-like paste 8 as well as the non-conductive layer 9 to be arranged between the rigid region 1 or the subsequently separated, rigid regions 12 and 13 and the flexible region 10 of the printed circuit board Material or a dielectric can further easily be taken into account by law prescribed restrictions on the use of certain hazardous substances in electrical and electronic equipment.
• a multi-layer, rigid printed circuit board or a rigid region 1 of the printed circuit board shown in the figures represents only a simplified example of such a multilayer printed circuit board for illustrative purposes, wherein a larger number or plurality of particular conductive layers 2 as well as a microvias contacting 5 or through openings 6 and 14 can be used according to the desired complexity of the component to be produced.

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Structure Of Printed Boards (AREA)
• Laminated Bodies (AREA)
• Manufacturing Of Printed Wiring (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

ID=39367423

Family Applications (1)

Country Status (3)

Cited By (4)

Families Citing this family (10)

Citations (4)

Family Cites Families (1)

• 2007
  • 2007-02-16 AT AT0010007U patent/AT10030U1/de not_active IP Right Cessation
  • 2007-11-30 CN CNU2007203053449U patent/CN201290197Y/zh not_active Expired - Lifetime
• 2008
  • 2008-01-30 WO PCT/AT2008/000028 patent/WO2008098270A1/de active Search and Examination
  • 2008-01-30 CN CN2008800087671A patent/CN101647325B/zh active Active
  • 2008-01-30 CN CN2008800053497A patent/CN101617569B/zh active Active

Patent Citations (4)

Also Published As

Similar Documents

Legal Events