WO2023087188A1 - 一种刚柔电路板、电路板组件和电子设备 - Google Patents

一种刚柔电路板、电路板组件和电子设备 Download PDF

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Publication number
WO2023087188A1
WO2023087188A1 PCT/CN2021/131304 CN2021131304W WO2023087188A1 WO 2023087188 A1 WO2023087188 A1 WO 2023087188A1 CN 2021131304 W CN2021131304 W CN 2021131304W WO 2023087188 A1 WO2023087188 A1 WO 2023087188A1
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Prior art keywords
circuit board
rigid
layer
rcc
flexible circuit
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PCT/CN2021/131304
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English (en)
French (fr)
Inventor
汤永科
刘文奎
陈海军
Original Assignee
华为技术有限公司
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Application filed by 华为技术有限公司 filed Critical 华为技术有限公司
Priority to CN202180100145.7A priority Critical patent/CN117616557A/zh
Priority to PCT/CN2021/131304 priority patent/WO2023087188A1/zh
Publication of WO2023087188A1 publication Critical patent/WO2023087188A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers

Definitions

  • the present application relates to the technical field of circuit boards, in particular to a rigid-flex circuit board, a circuit board assembly and electronic equipment.
  • FCCL Flexible Copper Clad Laminate
  • FCCL is made of film materials such as polyester (PET) or polyimide (PI), which makes FCCL more flexible and easy to bend. But at the same time, it also leads to high material cost of FCCL.
  • FCCL needs to be processed by special equipment, which limits the processing capacity of manufacturers and affects the output supply of FCCL.
  • the flexible area of the rigid-flex circuit board also adopts the structural form of a semi-flexible board (Semi-Flex PCB).
  • the semi-flexible board is made of reinforced materials such as glass fiber, the material cost of the semi-flexible board is relatively low. But at the same time, the bending performance of the semi-flexible board is poor, and the number of bending times generally does not exceed 5 times. Since the semi-flexible board is prone to breakage, the semi-flexible board needs a larger bending radius when bending, which affects the spatial layout and structural design of the rigid-flex circuit board.
  • Embodiments of the present application provide a rigid-flex circuit board, a circuit board assembly, and an electronic device, which are used to solve the problem that the flexible area of the rigid-flex circuit board has either high material cost or poor bending performance.
  • a rigid-flex circuit board includes a flexible circuit board and a rigid circuit board.
  • the flexible circuit board includes at least one layer of first resin-coated copper foil RCC.
  • the first RCC includes a copper foil layer and a resin layer coated on the copper foil layer.
  • the rigid circuit board is laminated on the flexible circuit board and electrically connected with the flexible circuit board.
  • the flexible circuit board can use a resin layer and a copper foil layer to form the first resin-coated copper foil RCC.
  • the rigid circuit board and the flexible circuit board are laminated and electrically connected. Since the resin is relatively soft, it has better bending performance than reinforced materials such as glass fiber, so that the flexible circuit board made of the first RCC is easier to bend than the semi-flexible board. Therefore, the flexible circuit board is not easy to break, and the bending radius can be smaller than that of the semi-flexible circuit board, which is beneficial to the spatial layout and structural design of the rigid-flexible circuit board.
  • the resin has a lower material cost than film materials such as polyester (PET) or polyimide (PI). And the resin only needs to be coated on the surface of the copper foil layer, which can also reduce the processing difficulty of the flexible circuit board.
  • the rigid-flex circuit board includes two rigid circuit boards, and the two rigid circuit boards are respectively a first rigid circuit board and a second rigid circuit board. Wherein, the first rigid circuit board and the second rigid circuit board are respectively arranged at two ends of the flexible circuit board. Arranging two rigid circuit boards in the rigid-flex circuit board can electrically connect more electronic devices to the rigid circuit board, thereby improving the function of the rigid-flex circuit board.
  • the flexible circuit board further includes at least two layers of the first RCC stacked. Two adjacent layers of first RCCs are respectively the first layer RCC and the second layer RCC. Wherein, the copper foil layer in the first RCC is in contact with the resin layer in the second RCC.
  • the multi-layer first RCC is arranged in the flexible circuit board, which is beneficial to the wiring of the flexible circuit board.
  • the copper foil layer in the first RCC can be used as a wiring layer
  • the copper foil layer in the second RCC can be used as a signal reference layer.
  • the first layer of RCCs is closer to the rigid circuit board than the second layer of RCCs, and the thickness of the resin layer in the first layer of RCCs is greater than that of the resin layer in the second layer of RCCs.
  • the thickness of the resin layer in the first layer of RCC is greater and it is closer to the rigid circuit board. Therefore, the first layer of RCC can be closer to the bending center than the second layer of RCC. In this way, the bending radius of the first layer of RCC is smaller and less likely to break.
  • the thickness of the resin layer in the first RCC is 50-100 microns, and the thickness of the resin layer in the second RCC is 20-50 microns.
  • the thickness design of the resin layer in the first layer RCC and the second layer RCC is not only beneficial to the bending of the flexible circuit board, but also beneficial to the impedance control of the copper foil layer in the first layer RCC and the second layer RCC.
  • the rigid circuit board includes a stacked structure of copper clad laminates and at least one layer of second resin-coated copper foil RCC.
  • the second RCC includes a copper foil layer and a resin layer coated on the copper foil layer.
  • the first RCC and the second RCC are arranged symmetrically on the surface of the copper-clad laminate stack structure, and the second RCC is electrically connected to the copper-clad laminate stack structure.
  • the copper-clad laminate stack structure includes at least two layers of copper-clad laminates stacked, and a dielectric layer located between two adjacent layers of copper-clad laminates. In this way, the laminated structure of the rigid circuit board is arranged symmetrically, so that the force on the rigid circuit board during lamination is more uniform, which is beneficial to ensure the production quality of the rigid circuit board.
  • the resin layers in the first RCC and the second RCC are respectively in contact with the copper foil layer in the stacked structure of the copper clad laminate. In this way, the first RCC and the second RCC can be directly pressed and formed with the copper-clad laminate stack structure at one time, which is beneficial to improving the production efficiency of the rigid-flex circuit board.
  • the rigid-flex circuit board further includes vias.
  • the via hole runs through the copper foil layer of the flexible circuit board and the copper foil layer of the rigid circuit board, and the hole wall of the via hole is plated with conductive metal.
  • the electrical connection between the flexible circuit board and the rigid circuit board is realized.
  • the rigid-flex circuit board further includes a first solder resist layer and a second solder resist layer.
  • the first solder resist layer is arranged on the side of the rigid circuit board away from the flexible circuit board, and the second solder resist layer is arranged on the side of the flexible circuit board away from the rigid circuit board.
  • the first solder resist layer and the second solder resist layer can prevent non-pad parts from invading solder, thereby preventing soldering short circuit.
  • the flexible circuit board has two opposite surfaces. Rigid circuit boards are respectively laminated on two surfaces of the flexible circuit board, and the rigid circuit board is electrically connected to the flexible circuit board. In this way, the flexible circuit board is located in the middle of the rigid circuit board, which is beneficial to protect the flexible circuit board.
  • the material of the resin layer is epoxy resin.
  • Epoxy resin has a mature preparation process, is easy to obtain, and is cheap, and is suitable for the manufacture of the resin layer in the first RCC.
  • a second aspect of the present application provides a circuit board assembly, including a chip and the rigid-flex circuit board according to any embodiment of the first aspect.
  • the chip is arranged on the surface of the rigid circuit board and electrically connected with the rigid circuit board.
  • a third aspect of the present application provides an electronic device, including a casing and the circuit board assembly according to any one of the embodiments of the second aspect, where the circuit board assembly is installed in the casing.
  • FIG. 1 is a schematic structural diagram of a circuit board assembly in an electronic device in the related art
  • Fig. 2 is the control flowchart of circuit board assembly in Fig. 1;
  • FIG. 3A is a schematic structural diagram of a circuit board assembly provided in an embodiment of the present application.
  • FIG. 3B is a schematic structural diagram of another circuit board assembly provided by the embodiment of the present application.
  • FIG. 4A is a schematic cross-sectional structure diagram of the flexible circuit board in FIG. 3A;
  • 4B is a schematic cross-sectional structure diagram of a flexible circuit board in the related art
  • 4C is a schematic cross-sectional structure diagram of another flexible circuit board in the related art.
  • FIG. 5A is a schematic cross-sectional structure diagram of the rigid-flex circuit board in FIG. 3A;
  • FIG. 5B is a schematic cross-sectional structure diagram of the rigid-flex circuit board in FIG. 5A at the via hole position;
  • FIG. 6 is a schematic structural view of the first embodiment of the rigid-flex circuit board in FIG. 3A;
  • FIG. 7 is a schematic structural diagram of a second embodiment of the rigid-flex circuit board in FIG. 3A;
  • Fig. 8 is a schematic diagram of the three-dimensional structure of the rigid-flex circuit board in Fig. 7;
  • FIG. 9 is a schematic structural diagram of a third embodiment of the rigid-flex circuit board in FIG. 3A;
  • Fig. 10 is a structural schematic view of the rigid-flex circuit board in Fig. 9 when it is bent;
  • Fig. 11 is a schematic structural diagram of a fourth embodiment of the rigid-flex circuit board in Fig. 3A;
  • Fig. 12 is a schematic structural diagram of a fifth embodiment of the rigid-flex circuit board in Fig. 3A;
  • FIG. 13 is a schematic structural diagram of a sixth embodiment of the rigid-flex circuit board in FIG. 3A .
  • first”, second, etc. are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features.
  • a feature defined as “first”, “second”, etc. may expressly or implicitly include one or more of that feature.
  • orientation terms such as “upper”, “lower”, “left”, “right”, “horizontal” and “vertical” are defined relative to the schematic placement orientations of components in the drawings, It should be understood that these directional terms are relative concepts, which are used for description and clarification relative to each other, and which may change accordingly according to changes in the orientation in which components are placed in the drawings.
  • connection should be understood in a broad sense, for example, “connection” can be a fixed connection, a detachable connection, or an integral body; it can be a direct connection, or It can be connected indirectly through an intermediary.
  • the present application provides an electronic device, which may include a mobile phone, a computer, a tablet, a television, a solid-state hard disk, an instrument, a meter, or a display screen, and other electronic products with circuit board components.
  • the embodiments of the present application do not place special limitations on the specific forms of the foregoing electronic devices.
  • the above-mentioned electronic device 01 is used as an example for illustration.
  • the electronic device 01 may include a casing 100 and a circuit board assembly 02 , and the circuit board assembly 02 may be installed in the casing 100 .
  • a data interface 110 such as a USB Type-C interface or a Lightning interface may be provided on the housing 100 for connecting a data line for data transmission.
  • the data interface 110 can be electrically connected with the circuit board assembly 02 .
  • the SSD can electrically connect the data interface 110 with a host interface of an external electronic device through a data cable.
  • the host interface can be connected to the power supply through a DC/DC converter, so that the SSD can store data from external electronic devices through the data interface 110, or transmit the data stored inside the SSD to external electronic devices through the data interface 110.
  • the aforementioned external electronic devices may be electronic products such as computers, tablets, mobile phones, televisions, or display screens. The embodiments of the present application do not specifically limit the specific form of the external electronic device.
  • the above-mentioned circuit board assembly 02 may include a circuit board 200a and a plurality of chips 300 disposed on the circuit board 200a.
  • the plurality of chips 300 may include a controller, a cache chip (Dynamic Random Access Memory, DRAM), and a flash memory chip NAND.
  • DRAM Dynamic Random Access Memory
  • the controller processes the data from the external electronic device, it is stored in at least one of the DRAM and the flash memory chip NAND.
  • the controller processes the data of at least one of the DRAM and the flash memory chip NAND, and then sends it to the external electronic device.
  • Chips 300 such as the controller, DRAM, and flash memory chips NAND may be electrically connected to pads on the circuit board 200a (shown in FIG. 1 ) through their own pins.
  • the entire SSD is electrically connected to an external electronic device (such as a host computer of a computer) through a data cable, so as to realize the function of storing data in the SSD.
  • SSDs have rapidly shifted from 2T to 4T, 8T or even larger capacities.
  • Limited by the capacity of a single flash memory chip NAND SSD can only increase the capacity by increasing the number of flash memory chip NAND.
  • the rigid-flex circuit board 200 b may include a flexible circuit board 210 and two rigid circuit boards 220 electrically connected.
  • the flexible circuit board 210 can be bent, flexed and folded relative to the rigid circuit board 220 according to the spatial layout requirements, and can move in three-dimensional space.
  • a plurality of chips 300 may be respectively electrically connected to the upper surfaces A of the two rigid circuit boards 220 in the Z direction.
  • a plurality of chips 300 may also be electrically connected to the lower surfaces B of the two rigid circuit boards 220 in the Z direction.
  • multiple chips 300 can also be electrically connected to the upper surface A (shown in FIG. 3A ) and the lower surface B of the two rigid circuit boards 220 respectively. Therefore, the purpose of increasing the number of chips 300 and increasing the storage capacity is achieved by increasing the layout density of the chips 300 .
  • the rigid-flex circuit board 200 b can be bent by the flexible circuit board 210 .
  • the flexible circuit board 210 can be bent in an arc, so that two rigid circuit boards 220 are stacked along the Z direction, so that the size of the housing 100 (shown in FIG. 1 ) in the XOY plane can be saved to optimize The spatial layout of the circuit board assembly 02.
  • the flexible circuit board 210 may include two first layers of resin coated copper (Resin Coated Copper, RCC) 20, and the two first RCCs 20 are stacked.
  • RCC resin coated copper
  • one of the first layers of RCCs 20 may be referred to as a first layer of RCCs 21
  • the other layer of first RCCs 20 may be referred to as a second layer of RCCs 22 .
  • Each layer of the first RCC 20 may include a copper foil layer 201 and a resin layer 202 that are stacked.
  • the resin layer 202 may be coated on one of the two opposite surfaces of the copper foil layer 201 .
  • the copper foil layer 201 in the first layer RCC21 is in contact with the resin layer 202 in the second layer RCC22.
  • a resin layer 202 is disposed between two adjacent copper foil layers 201 in the flexible circuit board 210 .
  • the resin layer 202 can be used as a dielectric layer of the flexible circuit board 210 .
  • the resin in the resin layer 202 can be made of epoxy resin. Of course, it can also be made of other resin materials such as polyvinyl chloride resin or thermosetting cyanate resin. Alternatively, the resin in the resin layer 202 can also be made of a mixture of the above resins. This application does not make special limitations on the specific materials of the resin. These resins are less costly than film materials such as polyester (PET) or polyimide (PI). Moreover, due to the dense molecular structure and strong cohesion of the resin, the bending strength of the resin is also higher. Therefore, the bending performance of the resin is better than that of reinforcing materials such as glass fiber, and the number of bending times can reach at least 10 times, and a smaller bending radius of the flexible circuit board 210 can be realized.
  • PET polyester
  • PI polyimide
  • FCCL Flexible Copper Clad Laminate
  • the flexible circuit board part of FCCL includes copper foil layer and polyester (PET).
  • PTT polyester
  • PI polyimide
  • the rigid circuit board part of FCCL includes a copper foil layer, a core layer (Core) and a prepreg (PP) for connecting multiple layers of copper foil layers.
  • the rigid circuit board of FCCL is press-molded with the flexible circuit board of FCCL through an adhesive layer.
  • FCCL Since the cost of film materials such as polyester (PET) or polyimide (PI) is relatively high, and FCCL requires special equipment for processing, the manufacturing cost of FCCL is compared with the flexible circuit board 210 of the embodiment of the present application. (shown in Figure 4A) is higher.
  • PET polyester
  • PI polyimide
  • the structure of the traditional semi-flex PCB (Semi-Flex PCB) is shown in Figure 4C.
  • the flexible circuit board part and the rigid circuit board part of the semi-flexible board include a copper foil layer, a core layer (Core) and a prepreg (PP). Since the main material of the core layer (Core) and the prepreg (PP) is glass fiber and other reinforcing materials. Therefore, the bending performance of the semi-flexible board is inferior to that of the flexible circuit board 210 of the embodiment of the present application. That is to say, the bending radius of the flexible circuit board 210 in the embodiment of the present application can be smaller than that of the semi-flexible board, and it is less likely to break.
  • the flexible circuit board 210 may also be provided with one layer of the first RCC 20 , or three, four or even more layers of the first RCC 20 .
  • the embodiment of the present application does not impose any special limitation on the number of layers of the first RCC 20 disposed on the flexible circuit board 210 .
  • the copper foil layer 201 in one of the first RCCs 20 can be used as a signal reference layer for carrying power or reference ground signals.
  • Another copper foil layer 201 in the first RCC 20 can be used as a wiring layer.
  • the wiring layer can form one or more metal wirings for carrying electrical signals through processes such as exposure, development, and etching.
  • the flexible circuit board 210 is provided with multiple layers of the first RCC 20 , the flow capacity of the power supply can be improved, thereby improving the power transmission and taking capacity of the flexible circuit board 210 .
  • the flexible circuit board 210 can be routed by bending, so as to achieve the purpose of saving space. Therefore, as shown in FIG. 4A , the entire flexible circuit board 210 can be divided into a bending area 211 and two non-bending areas 212 , and the bending area 211 is located between the two non-bending areas 212 .
  • the two non-bending regions 212 is referred to as a first non-bending region 212a, and the other non-bending region 212 is referred to as a second non-bending region 212b.
  • the surface of the flexible circuit board 210 on the side of the resin layer 202 in the first layer RCC 21 be the first surface 213 .
  • two rigid circuit boards 220 are disposed on the first surface 213 .
  • one rigid circuit board 220 is a first rigid circuit board 221
  • the other rigid circuit board 220 is a second rigid circuit board 222 .
  • the first rigid circuit board 221 is located in the first non-bending area 212a of the flexible circuit board 210 (shown in FIG.
  • the second rigid circuit board 222 is located in the second non-bending area 212b of the flexible circuit board 210 (shown in FIG. 4A ).
  • the two rigid circuit boards 220 are respectively stacked with the flexible circuit board 210 and electrically connected.
  • each rigid circuit board 220 may include a copper-clad laminate stack structure 23 .
  • the copper-clad laminate stack structure 23 may include a plurality of laminated copper-clad laminates and a dielectric layer between two adjacent layers of copper-clad laminates.
  • each copper-clad laminate may include a core layer 203 (Core) and copper foil layers 201 laminated on both sides of the core layer 203 .
  • the copper-clad laminate may be called a double-sided copper-clad laminate.
  • the core layer 203 can be made of reinforced materials such as glass fiber, and the core layer 203 can be used as a rigid skeleton of the rigid circuit board 220 .
  • the copper foil layer 201 in the first RCC 20 may be etched to form the above wiring layer.
  • the copper foil layer 201 in the copper-clad laminate stack structure 23 may also be etched to form the above-mentioned wiring layer. Since the first surface 213 of the flexible circuit board 210 is the resin layer 202 , the copper foil layers 201 on both sides of the copper clad laminate stack structure 23 can be directly press-molded with the flexible circuit board 210 .
  • the first RCC 20 and the copper-clad laminate stack structure 23 can be etched separately, and only one pressing is required to make the first RCC 20 and the copper-clad laminate stack The structure 23 is press-formed.
  • the rigid-flex circuit board 200 b may further include via holes 230 .
  • the via hole 230 runs through the copper foil layer 201 of the flexible circuit board 210 and the copper foil layer 201 of the rigid circuit board 220, and the hole wall of the via hole 230 can be plated with conductive metal (such as copper plating), so as to realize the connection between the flexible circuit board 210 and the rigid circuit board 220. Electrical connections between rigid circuit boards 220 .
  • the via hole 230 can be designed as at least one of the through hole 230a, the blind hole 230b, and the buried hole 230c. limits.
  • the rigid-flex circuit board 200b provided in the embodiment of the present application can be formed by milling. That is, the first rigid circuit board 221 and the second rigid circuit board 222 are not disconnected during lamination, but are continuous structures.
  • the rigid circuit board 220 in the above-mentioned bending area 211 (shown in FIG. 4A ) is milled off with a milling cutter, thereby forming the rigid circuit board 200b as shown in FIG. 5A .
  • the milling cutter mills the rigid circuit board 220
  • the rigid circuit board 220 in the bending area 211 needs to be trimmed several times to remove redundant rigid circuit board 220 .
  • the diaphragm can also be covered between the flexible circuit board 210 and the rigid circuit board 220 in the bending area 211 .
  • the rigid circuit board 220 in the bending area 211 will fall off, so that the rigid circuit board 220 in the bending area 211 is not required to be trimmed several times by the milling cutter, so that the flexible circuit board 210 in the bending area 211 It is smoother and avoids the problem of impedance variation of the flexible circuit board 210 caused by the uneven thickness of the resin layer 202 in the first layer RCC21.
  • This method is called the method of covering and opening the cover.
  • the present application does not impose any special limitation on the specific processing method of the rigid-flex circuit board 200b.
  • the production cost of the rigid-flex circuit board 200b is relatively high due to the relatively high cost of the membrane when the rigid-flex circuit board 200b is processed by covering the film and opening the cover.
  • milling the rigid-flex circuit board 200b is easy to damage the copper foil layer 201 in the first layer RCC21.
  • the thickness of the resin layer 202 in the first RCC21 can be increased to effectively protect the copper foil layer 201 in the first RCC21 and prevent the copper foil layer 201 from being damaged by the milling cutter.
  • the circuit board assembly 02 for the rigid-flex circuit board 200b three, four or even more rigid circuit boards 220 may also be arranged on the first surface 213 of the flexible circuit board 210 .
  • the number of stacked copper clad laminates 23 in each rigid circuit board 220 can also be set to two, three or more.
  • the embodiment of the present application does not impose special limitations on the number of rigid circuit boards 220 on the first surface 213 and the number of copper clad laminate stack structures 23 in each rigid circuit board 220 .
  • a greater number of stacked copper-clad laminate structures 23 can also be provided.
  • Adjacent copper-clad laminate stack structures 23 are laminated and connected through prepregs 204 .
  • the rigid-flex circuit board 200b may also be designed as a structure as shown in FIG. 7 . That is, only one layer of the first RCC 20 may be provided in the flexible circuit board 210 . At this time, the first RCC 20 serves as the flexible circuit board 210 . Meanwhile, three rigid circuit boards 220 may also be electrically connected to the first surface 213 of the flexible circuit board 210 , and the three rigid circuit boards 220 are arranged at intervals. As shown in FIG. 8 , the circuit board assembly 02 can also be bent to form an S shape, so as to realize the function of multiple bending of the circuit board assembly 02 . When the spatial area does not have high requirements on the size of the Z direction, the circuit board assembly 02 can be bent multiple times, which can keep the size of the cloth in the XOY plane unchanged, and can integrate more flash memory chips NAND, thereby improving the SSD more capacity.
  • the rigid circuit board 220 may further include a second resin-coated copper foil RCC24.
  • FIG. 9 is illustrated by taking two layers of RCC24 as an example, and this application does not impose any special limitation on the specific number of layers of the second RCC24.
  • the structure of the second RCC 24 may be the same as that of the first RCC 20 , and also includes a copper foil layer 201 and a resin layer 202 coated on the copper foil layer 201 . The difference is that the second RCC 24 and the first RCC 20 can be arranged symmetrically with respect to the copper clad laminate stack structure 23 .
  • the second RCC24 may also be provided with two layers, which are respectively the third layer RCC25 and the fourth layer RCC26.
  • the resin layer 202 in the third RCC25 is in contact with the copper clad laminate stack structure 23
  • the resin layer 202 in the fourth RCC26 is in contact with the copper foil layer 201 in the third RCC25 .
  • the symmetrical arrangement of the first RCC20 and the second RCC24 is beneficial to reduce the deformation of the rigid-flex circuit board 200b during the lamination process.
  • the thickness h 1 of the resin layer 202 in the first RCC 21 can also be designed to be equal to the thickness h 2 of the resin layer 202 in the second RCC 22 .
  • the impedance control of the flexible circuit board 210 can also be realized.
  • the thickness of the resin layer 202 in the first RCC21 may be 50-100 microns, and the thickness of the resin layer 202 in the second RCC22 may be 20-50 microns.
  • the thickness of the resin layer 202 in the first RCC 20 can be designed to be relatively thin.
  • the thickness of the resin layer 202 in the first RCC21 can be designed to be 50 microns
  • the thickness of the resin layer 202 in the second RCC22 can be designed to be 20 microns.
  • the thickness of the resin layer 202 is relatively thin, which can also achieve higher-density routing of the copper foil layer 201 .
  • the thickness of the resin layer 202 in the third layer RCC25 can be compared with that in the first layer RCC21.
  • the thickness of the resin layer 202 is the same.
  • the resin layer 202 in the fourth RCC26 may have the same thickness as the resin layer 202 in the second RCC22.
  • the above is described by taking the rigid circuit boards 220 all disposed on the same side of the flexible circuit board 210 as an example.
  • the rigid-flex circuit board 200b of the embodiment of the present application arranges the rigid circuit board 220 on the same side of the flexible circuit board 210, so that the flexible circuit board 210 is located at the top or bottom of the rigid circuit board 220, so that the bending of the flexible circuit board 210 easier.
  • rigid circuit boards 220 may also be provided on both sides of the flexible circuit board 210 .
  • the flexible circuit board 210 also has a second surface 214 opposite to the first surface 213 .
  • the rigid circuit board 220 can also be stacked on the second surface 214 of the flexible circuit board 210 . Since the second surface 214 is the copper foil layer 201 , a prepreg 204 needs to be disposed between the second surface 214 of the flexible circuit board 210 and the rigid circuit board 220 for connecting the flexible circuit board 210 and the rigid circuit board 220 .
  • the copper-clad laminate stack structure 23 may also adopt a single-sided copper-clad foil structure.
  • the flexible circuit board 210 can adopt two layers of the first RCC20, on the first surface 213 of the flexible circuit board 210, a copper clad laminate stack structure 23 with double-sided copper clad foil can be arranged, and on the second surface 214 of the flexible circuit board 210 A stacked structure 23 of copper-clad laminates with a single-sided copper-clad foil can be provided on it.
  • the core layer 203 in the single-side copper-clad copper-clad laminate stack structure 23 is in contact with the second surface 214 , and the flexible circuit board 210 and the rigid circuit boards 220 on both sides of the flexible circuit board 210 can also be press-molded at one time.
  • the rigid circuit board 220 is disposed on both sides of the flexible circuit board 210 .
  • the flexible circuit board 210 can be bent more easily by increasing the length of the flexible circuit board 210 .
  • the rigid-flex circuit board 200b may also include a first solder resist layer 205 and a second solder resist layer 206.
  • the first solder resist layer 205 is provided on the surface of the rigid circuit board 220 away from the flexible circuit board 210
  • the second solder resist layer 206 is provided on the surface of the flexible circuit board 210 away from the rigid circuit board 220, so as to prevent The role of the rigid-flex circuit board 200b welding short circuit.
  • the rigid-flex circuit board 200b in SSD as an example.
  • the electronic devices such as chips 300 disposed on the rigid-flex circuit board 200b
  • circuit board assemblies 02 with different functions can be formed. Therefore, the rigid-flex circuit board 200b provided in the embodiment of the present application can also be applied to other electronic devices such as mobile phones, computers, tablets, televisions, instruments, meters, or display screens.
  • the embodiment of the present application does not place special limitations on the specific application of the rigid-flex circuit board 200b.

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Abstract

本申请实施例提供一种刚柔电路板、电路板组件和电子设备，涉及电路板技术领域，用于解决刚柔电路板的柔性区域要么材料成本高，要么弯折性能差的问题。刚柔电路板包括柔性电路板和刚性电路板。柔性电路板包括至少一层第一涂树脂铜箔RCC。第一RCC包括铜箔层和涂覆于铜箔层上的树脂层。刚性电路板层压于柔性电路板上，且与柔性电路板电连接。刚柔电路板用于连接电子元器件。

Description

一种刚柔电路板、电路板组件和电子设备 技术领域
本申请涉及电路板技术领域，尤其涉及一种刚柔电路板、电路板组件和电子设备。
背景技术
相关技术中，刚柔电路板的柔性区域通常选用柔性覆铜板(Flexible Copper Clad Laminate，FCCL)的结构形式。FCCL由于选用聚酯(PET)或聚酰亚胺(PI)等薄膜材料制造而成，使得FCCL的柔性较好且易于弯折。但同时也导致了FCCL的材料成本较高，加之FCCL需要采用特殊的设备进行加工，使得生产厂商的加工能力受限，影响了FCCL的产量供应。
另一方面，刚柔电路板的柔性区域也有采用半柔性板(Semi-Flex PCB)的结构形式。半柔性板由于选用玻璃纤维等增强材料制造而成，使得半柔性板的材料成本较低。但同时也导致了半柔性板的可弯折性能较差，其弯折次数一般不超过5次。由于半柔性板容易发生断裂，因此半柔性板在弯折时需要较大的弯折半径，影响了刚柔电路板的空间布局和结构设计。
发明内容
本申请实施例提供一种刚柔电路板、电路板组件和电子设备，用于解决刚柔电路板的柔性区域要么材料成本高，要么弯折性能差的问题。
为达到上述目的，本申请采用如下技术方案：
本申请的第一方面，提供一种刚柔电路板，该刚柔电路板包括柔性电路板和刚性电路板。柔性电路板包括至少一层第一涂树脂铜箔RCC。第一RCC包括铜箔层和涂覆于铜箔层上的树脂层。刚性电路板层压于柔性电路板上，且与柔性电路板电连接。
由上述可知，本申请的刚柔电路板中，柔性电路板可以采用树脂层与铜箔层组成第一涂树脂铜箔RCC。刚性电路板与柔性电路板层压设置并且电连接。由于树脂较为柔软，相对于玻璃纤维等增强材料具有更好的弯折性能，使得采用第一RCC制成的柔性电路板相对于半柔性板更容易弯折。从而使得柔性电路板不易断裂，并且弯折半径可以相对于半柔性板更小，有利于刚柔电路板的空间布局和结构设计。同时，树脂相对于聚酯(PET)或聚酰亚胺(PI)等薄膜材料的材料成本更低。并且树脂仅需涂覆在铜箔层的表面即可，还能够降低柔性电路板的加工难度。
在一些实施方式中，刚柔电路板包括两个刚性电路板，两个刚性电路板分别为第一刚性电路板和第二刚性电路板。其中，第一刚性电路板和第二刚性电路板分别设置在柔性电路板的两端。在刚柔电路板中设置两个刚性电路板，能够使刚性电路板上电连接更多的电子器件，从而使刚柔电路板的功能更完善。
在一些实施方式中，柔性电路板还包括至少两层层叠设置的第一RCC。相邻两层第一RCC分别为第一层RCC和第二层RCC。其中，第一层RCC中的铜箔层与第二层RCC中的树脂层相接触。在柔性电路板中设置多层第一RCC，有利于柔性电路板 的布线。例如，第一层RCC中的铜箔层可以作为走线层，第二层RCC中的铜箔层可以作为信号参考层。
在一些实施方式中，第一层RCC相对于第二层RCC靠近刚性电路板，第一层RCC中的树脂层的厚度大于第二层RCC中的树脂层的厚度。当刚柔电路板弯折时，由于第一层RCC中的树脂层的厚度更大，且更靠近刚性电路板。因此，使得第一层RCC可以相对于第二层RCC更靠近弯折中心。这样一来，第一层RCC的弯折半径更小，更不容易断裂。
在一些实施方式中，第一层RCC中的树脂层的厚度为50-100微米，第二层RCC中的树脂层的厚度为20-50微米。第一层RCC和第二层RCC中的树脂层的厚度设计，不仅有利于柔性电路板的弯折，而且还有利于第一层RCC和第二层RCC中的铜箔层的阻抗控制。
在一些实施方式中，刚性电路板包括覆铜板堆叠结构以及至少一层第二涂树脂铜箔RCC。第二RCC包括铜箔层和涂覆于铜箔层上的树脂层。第一RCC与第二RCC对称设置于覆铜板堆叠结构的表面，且第二RCC与覆铜板堆叠结构电连接。覆铜板堆叠结构包括层叠设置的至少两层覆铜层压板，以及位于相邻两层覆铜层压板之间的介质层。这样一来，使得刚性电路板的层叠结构对称设置，从而使刚性电路板在层压时的受力更均匀，有利于保证刚柔电路板的生产质量。
在一些实施方式中，第一RCC与第二RCC中的树脂层分别与覆铜板堆叠结构中的铜箔层相接触。这样一来，第一RCC和第二RCC可以直接与覆铜板堆叠结构一次压合成型，有利于提高刚柔电路板的生产效率。
在一些实施方式中，刚柔电路板还包括过孔。过孔贯穿柔性电路板的铜箔层和刚性电路板的铜箔层，且过孔的孔壁镀覆有导电金属。从而实现柔性电路板与刚性电路板之间的电连接。
在一些实施方式中，刚柔电路板还包括第一阻焊层和第二阻焊层。第一阻焊层设置于刚性电路板远离柔性电路板的一侧，第二阻焊层设置于柔性电路板远离刚性电路板的一侧。第一阻焊层和第二阻焊层可以阻止非焊盘部位侵染焊锡，从而起到防止焊接短路的作用。
在一些实施方式中，柔性电路板具有相对设置的两个表面。柔性电路板的两个表面上分别层压有刚性电路板，且刚性电路板与柔性电路板电连接。这样一来，柔性电路板则位于刚性电路板的中间部位，有利于保护柔性电路板。
在一些实施方式中，树脂层的材质为环氧树脂。环氧树脂制备工艺成熟，易于取材，价格便宜，适用于第一RCC中树脂层的制造。
本申请的第二方面，提供一种电路板组件，包括芯片和第一方面任一实施方式的刚柔电路板。芯片设置于刚性电路板的表面，且与刚性电路板电连接。上述刚柔电路板用于电路板组件时，具有与前述实施方式提供的刚柔电路板相同的技术效果，此处不再赘述。
本申请的第三方面，提供一种电子设备，包括壳体和第二方面任一实施方式的电路板组件，电路板组件安装于壳体内。上述电路板组件用于电子设备时，具有与前述实施方式提供的电路板组件相同的技术效果，此处不再赘述。
附图说明
图1为相关技术中电子设备内电路板组件的结构示意图；
图2为图1中电路板组件的控制流程图；
图3A为本申请实施例提供的一种电路板组件的结构示意图；
图3B为本申请实施例提供的另一电路板组件的结构示意图；
图4A为图3A中柔性电路板的剖视结构示意图；
图4B为相关技术中一种柔性电路板的剖视结构示意图；
图4C为相关技术中另一柔性电路板的剖视结构示意图；
图5A为图3A中刚柔电路板的剖视结构示意图；
图5B为图5A中刚柔电路板在过孔位置的剖视结构示意图；
图6为图3A中刚柔电路板的第一种实施方式结构示意图；
图7为图3A中刚柔电路板的第二种实施方式结构示意图；
图8为图7中刚柔电路板的立体结构示意图；
图9为图3A中刚柔电路板的第三种实施方式结构示意图；
图10为图9中刚柔电路板弯折时的结构示意图；
图11为图3A中刚柔电路板的第四种实施方式结构示意图；
图12为图3A中刚柔电路板的第五种实施方式结构示意图；
图13为图3A中刚柔电路板的第六种实施方式结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述，显然，所描述的实施例仅仅是本申请一部分实施例，而不是全部的实施例。
以下，术语“第一”、“第二”等仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”等的特征可以明示或者隐含地包括一个或者更多个该特征。
此外，本申请中，“上”、“下”、“左”、“右”、“水平”以及“竖直”等方位术语是相对于附图中的部件示意置放的方位来定义的，应当理解到，这些方向性术语是相对的概念，它们用于相对于的描述和澄清，其可以根据附图中部件所放置的方位的变化而相应地发生变化。
在本申请中，除非另有明确的规定和限定，术语“连接”应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或成一体；可以是直接相连，也可以通过中间媒介间接相连。
本申请提供一种电子设备，该电子设备可以包括手机、电脑、平板、电视、固态硬盘、仪器、仪表或者显示屏等具有电路板组件的电子产品。本申请实施例不对上述电子设备的具体形式做特殊限制。以下为了方便说明，如图1所示，以上述电子设备01为固态硬盘(Solid State Drive，SSD)进行举例说明。该电子设备01可以包括壳体100和电路板组件02，电路板组件02可以安装在壳体100内。
其中，如图1所示，壳体100上可以设置USB Type-C接口或者Lightning接口等数据接口110，用于连接传输数据的数据线。该数据接口110可以与电路板组件02电连接。SSD可以通过数据线将数据接口110与外部电子设备的主机接口电连接。主机 接口可以通过DC/DC直流转换器与电源相连接，从而使SSD可以通过数据接口110存储来自外部电子设备的数据，或者将SSD内部存储的数据通过数据接口110传输至外部电子设备。上述外部电子设备可以是电脑、平板、手机、电视或者显示屏等电子产品。本申请实施例并不对外部电子设备的具体形式做特殊限制。
在一些实施方式中，为了使得SSD能够对数据进行存储，如图1所示，上述的电路板组件02可以包括电路板200a以及设置于电路板200a上的多个芯片300。具体的，如图2所示，多个芯片300可以包括控制器、缓存芯片(Dynamic Random Access Memory，DRAM)以及闪存芯片NAND。控制器对来自外部电子设备的数据进行处理后，存储在DRAM和闪存芯片NAND中的至少一个。或者，控制器对DRAM和闪存芯片NAND中至少一个的数据进行处理后，发送至外部电子设备。
其中，控制器、DRAM以及闪存芯片NAND等芯片300，可以通过自身的引脚与电路板200a(图1所示)上的焊盘电连接。整个SSD通过数据线与外部电子设备(例如电脑的主机)电连接，从而实现SSD存储数据的功能。
但是，随着电子产品规格和性能的全面提升，SSD的存储容量从2T快速转移到4T、8T甚至更大的容量。受限于单个闪存芯片NAND的容量，SSD只能通过增加闪存芯片NAND数量的方式以提升容量。为了满足对电路板组件02中闪存芯片NAND数量的要求，需要对电路板200a进行结构设计，以在一定的布件空间内集成更多数量的闪存芯片NAND。
针对上述问题，本申请提供一种如图3A所示的刚柔电路板200b，刚柔电路板200b可以包括电连接的柔性电路板210和两个刚性电路板220。其中，柔性电路板210相对于刚性电路板220可以依照空间布局要求弯折、挠曲、折叠，并能够在三维空间内移动。多个芯片300可以分别电连接在两个刚性电路板220在Z方向的上表面A。
此外，如图3B所示，多个芯片300也可以分别电连接在两个刚性电路板220在Z方向的下表面B。当然，多个芯片300还可以分别电连接在两个刚性电路板220的上表面A(图3A所示)和下表面B。从而通过提高芯片300的布局密度达到提高芯片300数量，增加存储容量的目的。
基于上述刚柔电路板200b的结构设计，刚柔电路板200b可以通过柔性电路板210弯折。例如，如图3A中柔性电路板210可以呈弧形弯折，使得两个刚性电路板220沿Z方向层叠设置，从而可以节省XOY平面内的壳体100(图1所示)尺寸，以优化电路板组件02的空间布局。
在一些实施方式中，如图4A所示，柔性电路板210可以包括两层第一涂树脂铜箔(Resin Coated Copper，RCC)20，两层第一RCC20层叠设置。为了方便说明，上述两层第一RCC20中，其中一层第一RCC20可以称为第一层RCC21，另一层第一RCC20可以称为第二层RCC22。每层第一RCC20可以包括层叠设置的铜箔层201和树脂层202。
在RCC制作过程中，可以在铜箔层201相对设置的两个表面中的其中一个表面上，涂覆树脂层202。此外，第一层RCC21中的铜箔层201与第二层RCC22中的树脂层202相接触。在此情况下，柔性电路板210中相邻两层铜箔层201之间设置有一层树脂层202。该树脂层202可以作为柔性电路板210的介质层。
其中，树脂层202中的树脂可以选用环氧树脂制造而成。当然，也可以选用聚氯乙烯树脂或热固性氰酸脂树脂等其他树脂材料制造而成。或者，树脂层202中的树脂还可以选用上述树脂相混合的材料制成。本申请并不对树脂的具体用料做特殊的限定。上述树脂相对于聚酯(PET)或聚酰亚胺(PI)等薄膜材料的成本更低。并且，由于树脂的分子结构致密，内聚力强，还使得树脂的弯曲强度更高。从而使得树脂相对于玻璃纤维等增强材料的弯折性能更好，可以达到至少10次的弯折次数，可以实现柔性电路板210更小的弯折半径。
传统的柔性覆铜板(Flexible Copper Clad Laminate，FCCL)的结构如图4B所示，FCCL的柔性电路板部分包括铜箔层和聚酯(PET)。当然，也有的FCCL的柔性电路板部分采用聚酰亚胺(PI)等薄膜材料替代聚酯(PET)。FCCL的刚性电路板部分包括铜箔层、芯板层(Core)以及用于连接多层铜箔层的半固化片(PP)，FCCL的刚性电路板通过粘接层与FCCL的柔性电路板压制成型。由于聚酯(PET)或聚酰亚胺(PI)等薄膜材料本身的成本较高，加之FCCL需要采用特殊的设备进行加工，使得FCCL的制造成本相较于本申请实施例的柔性电路板210(图4A所示)更高。
传统的半柔性板(Semi-Flex PCB)的结构如图4C所示，半柔性板的柔性电路板部分和刚性电路板部分均包括铜箔层、芯板层(Core)以及半固化片(PP)。由于芯板层(Core)和半固化片(PP)的主要材料为玻璃纤维等增强材料。因此，使得半柔性板的弯曲性能相对于本申请实施例的柔性电路板210较差。也即是本申请实施例的柔性电路板210弯折半径可以相对于半柔性板的弯折半径更小，更不易断裂。
在另一些实施方式中，根据柔性电路板210的布线要求，柔性电路板210也可以设置一层第一RCC20，或者设置三层、四层甚至更多层数的第一RCC20。本申请实施例并不对柔性电路板210设置的第一RCC20层数做特殊的限制。
当柔性电路板210设置两层第一RCC20时，其中一层第一RCC20中的铜箔层201可以作为信号参考层，用于承载电源或参考地信号。另一层第一RCC20中的铜箔层201可以作为走线层。其中，走线层可以通过曝光、显影、蚀刻等工艺流程，形成一条或多条金属走线，用于承载电信号。此外，当柔性电路板210设置多层第一RCC20时，还能够提高电源的通流能力，从而提高柔性电路板210的输电取电能力。
由上述可知，在一定的空间区域内，柔性电路板210可以通过弯折的方式布线，从而达到节省空间的目的。因此，如图4A所示，整个柔性电路板210还可以划分为弯折区211和两个非弯折区212，弯折区211位于两个非弯折区212之间。以下为了方便说明，将两个非弯折区212中的其中一个非弯折区212称为第一非弯折区212a，另一个非弯折区212称为第二非弯折区212b。
在此基础上，为了将柔性电路板210与刚性电路板220电连接，如图5A所示，由于第一层RCC21中的铜箔层201与第二层RCC22中的树脂层202相接触，可以将柔性电路板210在第一层RCC21中树脂层202一侧的表面作为第一表面213。沿第一表面213的垂直方向(Z方向)，在第一表面213上设置有两个刚性电路板220。其中，一个刚性电路板220为第一刚性电路板221，另一个刚性电路板220为第二刚性电路板222。第一刚性电路板221位于柔性电路板210的第一非弯折区212a(图4A所示)，第二刚性电路板222位于柔性电路板210的第二非弯折区212b(图4A所示)。两个 刚性电路板220分别与柔性电路板210层叠设置且电连接。
以下对刚性电路板220的结构进行举例说明，在本申请的一些实施例中，如图5A所示，每个刚性电路板220可以包括覆铜板堆叠结构23。覆铜板堆叠结构23可以包括多个层叠设置的覆铜层压板以及位于相邻两层覆铜层压板之间的介质层。其中，每个覆铜层压板可以包括芯板层203(Core)以及层压于芯板层203两侧的铜箔层201。在此情况下，该覆铜层压板可以称为双面覆铜层压板。芯板层203可以选用玻璃纤维等增强材料制造而成，芯板层203可以作为刚性电路板220的刚性骨架。
需要注意的是，如图5A所示，第一RCC20在层压之前，可以先将第一RCC20中的铜箔层201蚀刻形成上述走线层。覆铜板堆叠结构23在层压之前，也可以先将覆铜板堆叠结构23中的铜箔层201蚀刻形成上述走线层。由于柔性电路板210的第一表面213为树脂层202，使得覆铜板堆叠结构23两侧的铜箔层201可以直接与柔性电路板210压合成型。由此可知，在加工本申请实施例的刚柔电路板200b时，可以分别将第一RCC20和覆铜板堆叠结构23各自蚀刻完成后，只需要一次压合即可使第一RCC20与覆铜板堆叠结构23压合成型。
需要说明的是，压合后的柔性电路板210与刚性电路板220可以电连接。具体的，如图5B所示，刚柔电路板200b还可以包括过孔230。过孔230贯穿柔性电路板210的铜箔层201和刚性电路板220的铜箔层201，且在过孔230的孔壁可以镀覆导电金属(例如镀铜)，以实现柔性电路板210与刚性电路板220之间的电连接。当然，根据刚柔电路板200b的不同设计需求，过孔230可以设计为通孔230a、盲孔230b和埋孔230c中的至少一个，本申请实施例并不对过孔230的具体结构形式进行特殊的限制。
此外，如图5A所示，本申请实施例提供的刚柔电路板200b可以通过铣加工的方式加工成型。即第一刚性电路板221和第二刚性电路板222在层压时并未断开，而是连续结构。当柔性电路板210与刚性电路板220层压后，采用铣刀将上述弯折区211(图4A所示)的刚性电路板220铣掉，从而形成如图5A所示的刚柔电路板200b。其中，在铣刀对刚性电路板220进行铣加工时，需要对弯折区211的刚性电路板220进行多次的修整，以清除多余的刚性电路板220。
当然，在柔性电路板210与刚性电路板220层压之前，也可以先在弯折区211的柔性电路板210与刚性电路板220之间覆盖隔膜。当铣刀铣至隔膜时，弯折区211的刚性电路板220则脱落，从而无需铣刀对弯折区211的刚性电路板220进行多次的修整，使得弯折区211的柔性电路板210更平整，避免了由于第一层RCC21中树脂层202的厚度不均匀而引起的柔性电路板210阻抗变化的问题。这种方式称为覆膜开盖的方式。本申请并不对刚柔电路板200b的具体加工方式做特殊的限制。
但是，采用覆膜开盖的方式加工刚柔电路板200b，由于隔膜的成本较高，使得刚柔电路板200b的生产成本较高。而采用铣加工的方式加工刚柔电路板200b，又容易损坏第一层RCC21中的铜箔层201。此时，可以增加第一层RCC21中树脂层202的厚度，对第一层RCC21中的铜箔层201起到有效的保护作用，防止铣刀对铜箔层201的损坏。
可以理解的是，根据电路板组件02对刚柔电路板200b的布置要求，柔性电路板210的第一表面213上也可以设置三个、四个甚至更多个数的刚性电路板220。同时， 每个刚性电路板220中覆铜板堆叠结构23的数量也可以设置为两个、三个或者更多。本申请实施例并不对第一表面213上刚性电路板220的数量，以及每个刚性电路板220中覆铜板堆叠结构23的数量做特殊的限制。
示例的，如图6所示，根据刚柔电路板200b的布线要求，沿垂直于柔性电路板210的第一表面213的方向(Z方向)，还可以设置更多数量的覆铜板堆叠结构23。相邻覆铜板堆叠结构23之间通过半固化片204层叠连接。
示例的，还可以将刚柔电路板200b设计为如图7所示的结构。即柔性电路板210中可以仅设置一层第一RCC20。此时，第一RCC20即作为柔性电路板210。同时，在柔性电路板210的第一表面213上还可以电连接三个刚性电路板220，三个刚性电路板220间隔设置。如图8所示，还可以使得电路板组件02弯折形成S形状，从而实现电路板组件02多次弯折的功能。当空间区域对Z方向尺寸要求不高的情况下，电路板组件02多次弯折，能够保持XOY平面内的布件尺寸不变，可以集成更多数量的闪存芯片NAND，从而提升SSD更多的容量。
在一些实施方式中，如图9所示，刚性电路板220还可以包括第二涂树脂铜箔RCC24。图9以两层RCC24为例进行举例说明，本申请并不对第二RCC24的具体层数做特殊的限制。第二RCC24的结构可以与第一RCC20的结构相同，同样包括铜箔层201和涂覆于铜箔层201上的树脂层202。所不同的是，第二RCC24可以与第一RCC20关于覆铜板堆叠结构23对称设置。
具体的，第二RCC24也可以设置有两层，分别为第三层RCC25和第四层RCC26。使第三层RCC25中的树脂层202与覆铜板堆叠结构23相接触，第四层RCC26中的树脂层202与第三层RCC25中的铜箔层201相接触。对称设置的第一RCC20与第二RCC24，有利于减小刚柔电路板200b在层压过程中的变形。
需要说明的是，如图10所示，当第一刚性电路板221与第二刚性电路板222相互靠近弯折时，第一层RCC21的弯折半径r 1小于第二层RCC22的弯折半径r 2。为了使第一RCC20更容易弯折，还可以将第一层RCC21中树脂层202的厚度h 1设计为等于第二层RCC22中树脂层202的厚度h 2。
此外，通过对第一层RCC21和第二层RCC22中的树脂层202的厚度设计，还能够实现对柔性电路板210的阻抗控制。例如，树脂层202的厚度越厚，则柔性电路板210的阻抗越大。反之，树脂层202的厚度越薄，则柔性电路板210的阻抗越小。
可选的，第一层RCC21中的树脂层202的厚度可以为50-100微米，第二层RCC22中的树脂层202的厚度可以为20-50微米。当用作高速数据传输时，第一RCC20中的树脂层202的厚度可以设计偏薄。例如，可以将第一层RCC21中的树脂层202的厚度设计为50微米，可以将第二层RCC22中的树脂层202的厚度设计为20微米。这样一来，有利于柔性电路板210的阻抗控制设计。同时，树脂层202的厚度偏薄，还能够实现铜箔层201更高密的走线。
同时，针对应用在SSD中的电路板组件02，当刚性电路板220的两侧表面均电连接有多个芯片300时，第三层RCC25中的树脂层202的厚度可以与第一层RCC21中的树脂层202的厚度相同。第四层RCC26中的树脂层202的厚度可以与第二层RCC22中的树脂层202的厚度相同。
上述是以刚性电路板220均设置于柔性电路板210的同一侧为例进行的说明。本申请实施例的刚柔电路板200b通过将刚性电路板220设置于柔性电路板210的同一侧，使得柔性电路板210位于刚性电路板220的顶部或者底部，从而使柔性电路板210的弯折更容易。
此外，在另一些实施方式中，如图11所示，还可以在柔性电路板210的两侧均设置刚性电路板220。具体的，柔性电路板210还具有与第一表面213相对设置的第二表面214。在柔性电路板210的第二表面214上也可以层叠设置刚性电路板220。由于第二表面214为铜箔层201，因此需要在柔性电路板210的第二表面214与刚性电路板220之间设置半固化片204，用于连接柔性电路板210和刚性电路板220。
当然，作为另一种实施方式，如图12所示，覆铜板堆叠结构23也可以采用单面覆铜箔的结构形式。示例的，柔性电路板210可以采用两层第一RCC20，在柔性电路板210的第一表面213上可以设置双面覆铜箔的覆铜板堆叠结构23，在柔性电路板210的第二表面214上可以设置单面覆铜箔的覆铜板堆叠结构23。此时，单面覆铜箔的覆铜板堆叠结构23中的芯板层203与第二表面214接触，柔性电路板210以及柔性电路板210两侧的刚性电路板220也能够一次压合成型。
这样一来，刚性电路板220则设置在柔性电路板210的两侧。此时，在柔性电路板210长度相同的情况下，相较于刚性电路板220设置在柔性电路板210同一侧的结构较难弯折。因此，当柔性电路板210的两侧设置有刚性电路板220时，可以通过增加柔性电路板210长度的方式，使柔性电路板210更容易弯折。
为了避免电路板组件02在制作时，刚柔电路板200b的非焊盘部位侵染焊锡，如图13所示，刚柔电路板200b还可以包括第一阻焊层205和第二阻焊层206。其中，第一阻焊层205设置于刚性电路板220远离柔性电路板210的一侧表面，第二阻焊层206设置于柔性电路板210远离刚性电路板220的一侧表面，从而起到防止刚柔电路板200b焊接短路的作用。
上述是以刚柔电路板200b应用于SSD为例进行的说明。当刚柔电路板200b上设置的芯片300等电子器件不同时，能够形成不同功能的电路板组件02。因此，本申请实施例提供的刚柔电路板200b，还可以适用于手机、电脑、平板、电视、仪器、仪表或者显示屏等其他电子设备。本申请实施例并不对刚柔电路板200b的具体应用做特殊的限制。
以上所述，仅为本申请的具体实施方式，但本申请的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本申请揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本申请的保护范围之内。因此，本申请的保护范围应以所述权利要求的保护范围为准。

Claims (13)

  1. 一种刚柔电路板，其特征在于，包括：
    柔性电路板，包括至少一层第一涂树脂铜箔RCC；所述第一RCC包括铜箔层和涂覆于所述铜箔层上的树脂层；以及，
    刚性电路板，层压于所述柔性电路板上，且与所述柔性电路板电连接。
  2. 根据权利要求1所述的刚柔电路板，其特征在于，所述刚柔电路板包括两个所述刚性电路板，所述两个刚性电路板分别为第一刚性电路板和第二刚性电路板；
    其中，所述第一刚性电路板和所述第二刚性电路板分别设置在所述柔性电路板的两端。
  3. 根据权利要求1或2所述的刚柔电路板，其特征在于，所述柔性电路板还包括至少两层层叠设置的所述第一RCC；
    相邻两层所述第一RCC分别为第一层RCC和第二层RCC；其中，所述第一层RCC中的铜箔层与所述第二层RCC中的树脂层相接触。
  4. 根据权利要求3所述的刚柔电路板，其特征在于，所述第一层RCC相对于所述第二层RCC靠近所述刚性电路板，所述第一层RCC中的树脂层的厚度大于所述第二层RCC中的树脂层的厚度。
  5. 根据权利要求4所述的刚柔电路板，其特征在于，所述第一层RCC中的树脂层的厚度为50-100微米，所述第二层RCC中的树脂层的厚度为20-50微米。
  6. 根据权利要求1-5中任意一项所述的刚柔电路板，其特征在于，所述刚性电路板包括覆铜板堆叠结构以及至少一层第二涂树脂铜箔RCC；所述第二RCC包括铜箔层和涂覆于所述铜箔层上的树脂层；
    所述第一RCC与所述第二RCC对称设置于所述覆铜板堆叠结构的表面，且所述第二RCC与所述覆铜板堆叠结构电连接；
    所述覆铜板堆叠结构包括层叠设置的至少两层覆铜层压板，以及位于相邻两层所述覆铜层压板之间的介质层。
  7. 根据权利要求6所述的刚柔电路板，其特征在于，所述第一RCC与所述第二RCC中的树脂层分别与所述覆铜板堆叠结构中的铜箔层相接触。
  8. 根据权利要求6所述的刚柔电路板，其特征在于，所述刚柔电路板还包括过孔；
    所述过孔贯穿所述柔性电路板的铜箔层和所述刚性电路板的铜箔层，且所述过孔的孔壁镀覆有导电金属。
  9. 根据权利要求1-8中任意一项所述的刚柔电路板，其特征在于，所述刚柔电路板还包括第一阻焊层和第二阻焊层；
    所述第一阻焊层设置于所述刚性电路板远离所述柔性电路板的一侧，所述第二阻焊层设置于所述柔性电路板远离所述刚性电路板的一侧。
  10. 根据权利要求1-8中任意一项所述的刚柔电路板，其特征在于，所述柔性电路板具有相对设置的两个表面；
    所述柔性电路板的两个表面上分别层压有所述刚性电路板，且与所述柔性电路板电连接。
  11. 根据权利要求1-8中任意一项所述的刚柔电路板，其特征在于，所述树脂层的 材质为环氧树脂。
  12. 一种电路板组件，其特征在于，包括：
    如权利要求1-11中任意一项所述的刚柔电路板；以及，
    芯片，设置于所述刚性电路板的表面，且与所述刚性电路板电连接。
  13. 一种电子设备，其特征在于，包括：
    壳体；以及，
    如权利要求12所述的电路板组件，安装于所述壳体内。
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