WO2008081890A1 - 脱アルコール縮合反応用触媒及びそれを用いたオルガノポリシロキサンの製造方法 - Google Patents

脱アルコール縮合反応用触媒及びそれを用いたオルガノポリシロキサンの製造方法 Download PDF

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Publication number
WO2008081890A1
WO2008081890A1 PCT/JP2007/075173 JP2007075173W WO2008081890A1 WO 2008081890 A1 WO2008081890 A1 WO 2008081890A1 JP 2007075173 W JP2007075173 W JP 2007075173W WO 2008081890 A1 WO2008081890 A1 WO 2008081890A1
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WO
WIPO (PCT)
Prior art keywords
catalyst
condensation reaction
organopolysiloxane
dealcoholization condensation
same
Prior art date
Application number
PCT/JP2007/075173
Other languages
English (en)
French (fr)
Inventor
Yasushi Sugiura
Masanori Sakai
Original Assignee
Dow Corning Toray Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co., Ltd. filed Critical Dow Corning Toray Co., Ltd.
Priority to EP07860395A priority Critical patent/EP2116563A4/en
Priority to US12/521,057 priority patent/US8030429B2/en
Priority to JP2008552161A priority patent/JP5356830B2/ja
Publication of WO2008081890A1 publication Critical patent/WO2008081890A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/0234—Nitrogen-, phosphorus-, arsenic- or antimony-containing compounds
    • B01J31/0235—Nitrogen containing compounds
    • B01J31/0239—Quaternary ammonium compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0836—Compounds with one or more Si-OH or Si-O-metal linkage
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C07F7/0872—Preparation and treatment thereof
    • C07F7/0874—Reactions involving a bond of the Si-O-Si linkage
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C07F7/0872—Preparation and treatment thereof
    • C07F7/0876—Reactions involving the formation of bonds to a Si atom of a Si-O-Si sequence other than a bond of the Si-O-Si linkage
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2231/00—Catalytic reactions performed with catalysts classified in B01J31/00
    • B01J2231/70—Oxidation reactions, e.g. epoxidation, (di)hydroxylation, dehydrogenation and analogues
    • B01J2231/76—Dehydrogenation

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Silicon Polymers (AREA)
  • Catalysts (AREA)

Abstract

　本発明では、ケイ素原子結合ヒドロキシ基とケイ素原子結合アルコキシ基との脱アルコール縮合反応によりオルガノポリシロキサンを製造するにあたり、水酸化アルキルアンモニウム化合物又はそのシラノレート等の第４級アンモニウムイオン含有化合物を触媒として使用する。本発明の脱アルコール縮合反応触媒は使用後の除去が容易で、且つ、安定であるので、同触媒を用いてオルガノポリシロキサンを製造するにあたり、複雑な製造工程を必要とせず、また、多量の触媒を使用する必要がない。
PCT/JP2007/075173 2006-12-28 2007-12-27 脱アルコール縮合反応用触媒及びそれを用いたオルガノポリシロキサンの製造方法 WO2008081890A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
EP07860395A EP2116563A4 (en) 2006-12-28 2007-12-27 CATALYST FOR DEALCOOLIZATION CONDENSATION REACTION AND PROCESS FOR PRODUCTION OF ORGANOPOLYSILOXANE USING THE SAME
US12/521,057 US8030429B2 (en) 2006-12-28 2007-12-27 Catalyst for dealcoholization condensation reaction and method for producing organopolysiloxane using the same
JP2008552161A JP5356830B2 (ja) 2006-12-28 2007-12-27 脱アルコール縮合反応用触媒及びそれを用いたオルガノポリシロキサンの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006354812 2006-12-28
JP2006-354812 2006-12-28

Publications (1)

Publication Number Publication Date
WO2008081890A1 true WO2008081890A1 (ja) 2008-07-10

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/075173 WO2008081890A1 (ja) 2006-12-28 2007-12-27 脱アルコール縮合反応用触媒及びそれを用いたオルガノポリシロキサンの製造方法

Country Status (6)

Country Link
US (1) US8030429B2 (ja)
EP (1) EP2116563A4 (ja)
JP (1) JP5356830B2 (ja)
CN (3) CN104130414A (ja)
TW (1) TW200900143A (ja)
WO (1) WO2008081890A1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2290030A1 (en) * 2009-08-24 2011-03-02 Nitto Denko Corporation Composition for thermosetting silicone resin
JP2012180464A (ja) * 2011-03-02 2012-09-20 Arakawa Chem Ind Co Ltd チオール基含有シルセスキオキサンの製造方法ならびにチオール基含有シルセスキオキサンを含む硬化性樹脂組成物、当該硬化物、およびこれらから誘導される各種物品
EP2584013A1 (en) 2011-10-17 2013-04-24 Shin-Etsu Chemical Co., Ltd. Silicone release coating composition of condensation reaction curing type
JP2018028041A (ja) * 2016-08-19 2018-02-22 信越化学工業株式会社 硬化性シリコーン樹脂組成物

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7389061B2 (ja) 2018-08-24 2023-11-29 ダウ シリコーンズ コーポレーション ヒドロキシル末端ポリジオルガノシロキサンの縮合重合のため方法
US11136436B2 (en) 2018-08-24 2021-10-05 Dow Silicones Corporation Method for condensation polymerization of hydroxyl-terminated polydiorganosiloxanes
CN111630019A (zh) 2018-10-26 2020-09-04 瓦克化学股份公司 可固化有机聚硅氧烷组合物
WO2020223864A1 (en) * 2019-05-06 2020-11-12 Wacker Chemie Ag Polyorganosiloxane and thermally conductive silicone composition thereof
CN113785004A (zh) * 2019-05-06 2021-12-10 瓦克化学股份公司 聚有机硅氧烷的制备方法
CN111333843B (zh) * 2020-03-31 2022-06-24 橙天新材料(广州)有限公司 一种烷氧基封端聚硅氧烷的制备方法

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JPH04225031A (ja) 1990-12-27 1992-08-14 Toray Dow Corning Silicone Co Ltd オルガノポリシロキサンの製造方法
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JPH04225031A (ja) 1990-12-27 1992-08-14 Toray Dow Corning Silicone Co Ltd オルガノポリシロキサンの製造方法
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JP2006328231A (ja) 2005-05-26 2006-12-07 Nagase Chemtex Corp 光素子用封止樹脂組成物
JP2007056146A (ja) * 2005-08-25 2007-03-08 Nagase Chemtex Corp 光素子用封止樹脂組成物
JP4621602B2 (ja) 2006-02-06 2011-01-26 株式会社東芝 リチウム漏洩検知装置
JP2008008935A (ja) * 2006-06-27 2008-01-17 Seiko Epson Corp 配向膜、配向膜の形成方法、電子デバイス用基板、液晶パネルおよび電子機器

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2290030A1 (en) * 2009-08-24 2011-03-02 Nitto Denko Corporation Composition for thermosetting silicone resin
JP2011042760A (ja) * 2009-08-24 2011-03-03 Nitto Denko Corp 熱硬化性シリコーン樹脂用組成物
JP2012180464A (ja) * 2011-03-02 2012-09-20 Arakawa Chem Ind Co Ltd チオール基含有シルセスキオキサンの製造方法ならびにチオール基含有シルセスキオキサンを含む硬化性樹脂組成物、当該硬化物、およびこれらから誘導される各種物品
EP2584013A1 (en) 2011-10-17 2013-04-24 Shin-Etsu Chemical Co., Ltd. Silicone release coating composition of condensation reaction curing type
US9096776B2 (en) 2011-10-17 2015-08-04 Shin-Etsu Chemical Co., Ltd. Silicone release coating composition of condensation reaction curing type
JP2018028041A (ja) * 2016-08-19 2018-02-22 信越化学工業株式会社 硬化性シリコーン樹脂組成物

Also Published As

Publication number Publication date
US8030429B2 (en) 2011-10-04
CN104130413A (zh) 2014-11-05
CN101646717A (zh) 2010-02-10
EP2116563A4 (en) 2010-04-21
CN104130414A (zh) 2014-11-05
EP2116563A1 (en) 2009-11-11
JPWO2008081890A1 (ja) 2010-04-30
TW200900143A (en) 2009-01-01
US20100063236A1 (en) 2010-03-11
JP5356830B2 (ja) 2013-12-04

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