WO2008066127A1 - Machine frigorifique - Google Patents

Machine frigorifique Download PDF

Info

Publication number
WO2008066127A1
WO2008066127A1 PCT/JP2007/073089 JP2007073089W WO2008066127A1 WO 2008066127 A1 WO2008066127 A1 WO 2008066127A1 JP 2007073089 W JP2007073089 W JP 2007073089W WO 2008066127 A1 WO2008066127 A1 WO 2008066127A1
Authority
WO
WIPO (PCT)
Prior art keywords
condensing unit
temperature
cooled
heat transfer
cooling
Prior art date
Application number
PCT/JP2007/073089
Other languages
English (en)
Japanese (ja)
Inventor
Junpei Yuyama
Shuichi Yamasaki
Mitsuki Terashima
Taku Komuro
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to EP07849920.9A priority Critical patent/EP2090850B1/fr
Priority to CN2007800433909A priority patent/CN101542219B/zh
Priority to JP2008547035A priority patent/JPWO2008066127A1/ja
Priority to KR1020097010913A priority patent/KR101121232B1/ko
Priority to US12/516,449 priority patent/US20100031693A1/en
Publication of WO2008066127A1 publication Critical patent/WO2008066127A1/fr

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F25D19/006—Thermal coupling structure or interface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/17—Re-condensers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
    • F25B9/14—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the cycle used, e.g. Stirling cycle
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D2400/00—General features of, or devices for refrigerators, cold rooms, ice-boxes, or for cooling or freezing apparatus not covered by any other subclass
    • F25D2400/02—Refrigerators including a heater

Definitions

  • the present invention relates to a refrigerator.
  • GM refrigerators are used for measuring sample physical properties in a cryogenic environment near 4K, measuring various physical quantities using sensors that utilize the cryogenic environment, and the like.
  • This refrigerator cools non-cooled materials to extremely low temperatures by repeatedly compressing and expanding (refrigeration cycle) a refrigerant gas such as He gas.
  • a temperature amplitude is generated on the placement surface of the object to be cooled. In order to cool the object to be cooled stably, it is desired to reduce this temperature amplitude.
  • Patent Document 1 discloses a regenerator that houses helium gas or helium gas and liquid helium, a compressed helium gas supply unit, and the cold accumulator provided in a cooling unit to which an object to be cooled is attached.
  • An ultra-low temperature refrigerator including a helium gas introducing / exhausting means for connecting a gas is disclosed!
  • Patent Document 2 discloses a cryogenic temperature provided with a helium gas introduction pipe for introducing a necessary amount of helium gas at room temperature, a capacitor chamber for liquefying helium gas, and a liquid helium chamber for storing liquefied liquid helium.
  • a temperature damper is disclosed.
  • Patent Document 1 Japanese Patent No. 2773793
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2004-76955
  • the cryogenic temperature damper of Patent Document 2 has a complicated structure, and since the heat transfer path from the coolant is long and non-axisymmetric, cooling may be uneven and unstable.
  • the present invention has been made in order to solve the above-described problems, and includes a placement surface for an object to be cooled.
  • the purpose of the present invention is to provide a refrigerator that can reduce the temperature amplitude of the product and that can cool the object to be cooled uniformly and stably.
  • the refrigerator of the present invention includes a cooling stage for cooling an object to be cooled; a He condensing unit on which the object to be cooled is mounted; a reservoir filled with He gas that communicates with the He condensing unit; And a heat transfer buffer made of a material having a lower thermal conductivity than that of the He condensing unit, which is disposed between the cooling stage and the He condensing unit.
  • the pulsating power of heat flow caused by the refrigeration cycle of the refrigerator is absorbed by the evaporation and condensation (phase transition) of He in the He condensation section.
  • the heat transfer buffer acts as a heat flow restricting mechanism, transmission of temperature amplitude in the cooling stage is suppressed. As a result, the temperature amplitude on the placement surface of the object to be cooled can be reduced.
  • the cooling stage, the heat transfer buffer material, the He condensing portion, and the object to be cooled are continuously arranged coaxially, the object to be cooled can be uniformly and stably cooled.
  • the He condensing part may be made of a material having a thermal conductivity of 200 W / (m * K) or more at a temperature in the vicinity of 4K.
  • the force S can efficiently cool the object to be cooled P with the liquid He condensed in the He condensing unit.
  • the heat transfer buffer may be made of a material having a thermal conductivity of less than 100 W / (m.K) at a temperature in the vicinity of 4K.
  • the volume of the He condensing part may be not less than lOcc and not more than lOOcc.
  • the He condensing part can be made compact.
  • the volume of the reservoir may be not less than 5 times and not more than 100 times the volume of the He condensing part.
  • the server while ensuring the storage capacity of He gas necessary for cooling the object to be cooled, the server can be made compact.
  • the pressure of the He gas filled in the reservoir is 0. IMPa or more at room temperature.
  • Fins may be erected on the inner surface of the He condensation section.
  • a porous structure may be attached to the inner surface of the He condensation unit.
  • Concavities and convexities may be formed on a contact surface between the heat-transfer buffer material and the cooling stage or the He condensation unit.
  • the contact area between the heat transfer buffer material and the cooling stage or the He condensing portion is reduced, so that transmission of temperature amplitude in the cooling stage is suppressed.
  • the temperature amplitude on the placement surface of the object to be cooled can be reduced.
  • a temperature sensor and a heater mounted on the He condensing unit; and a control unit that drives the heater based on a measurement result of the temperature sensor may be further provided.
  • the heater when the temperature of the He condensing unit falls below a predetermined value, the heater can be driven to return the temperature of the He condensing unit to the predetermined value. Therefore, the temperature amplitude on the mounting surface of the object to be cooled can be reduced.
  • the provision of the heat transfer buffer prevents the temperature amplitude from being transmitted in the cooling stage, and as a result, it is possible to reduce the temperature amplitude on the placement surface of the object to be cooled.
  • the cooling stage, the heat transfer buffer, the He condensing part, and the object to be cooled are continuously arranged coaxially, the object to be cooled can be uniformly and stably cooled.
  • FIG. 1 is a schematic configuration diagram of a refrigerator according to a first embodiment of the present invention.
  • FIG. 2 is a graph showing the relationship between the temperature of the second cooling stage and the temperature amplitude.
  • FIG. 3 is a graph showing the relationship between the volume ratio of liquid He and the temperature amplitude in the He condensation section. It is.
  • FIG. 4 is a graph showing the relationship between the temperature of the second cooling stage and the refrigerating capacity.
  • FIG. 5 is a graph showing the relationship between the cooling time and the temperature of the second cooling stage.
  • FIG. 6 is a schematic configuration diagram in the vicinity of a He condensing part of a refrigerator according to a second embodiment of the present invention.
  • FIG. 7 is a schematic configuration diagram in the vicinity of a He condensing part of a refrigerator according to a third embodiment of the present invention.
  • FIG. 8 is a schematic configuration diagram in the vicinity of a He condensing unit of a refrigerator according to a fourth embodiment of the present invention.
  • FIG. 9 is a schematic configuration diagram in the vicinity of a He condensing unit of a refrigerator according to a fifth embodiment of the present invention.
  • FIG. 1 is a schematic configuration diagram of a refrigerator according to the first embodiment of the present invention.
  • the refrigerator 1 according to the present embodiment includes a second cooling stage 14 that cools the object 40 to be cooled, a He condensing unit 20 on which the object 40 to be cooled is mounted, and a He gas 50 that communicates with the He condensing unit 20.
  • a heat transfer buffer 16 made of a material having a lower thermal conductivity than that of the He condensation section 20 disposed between the second cooling stage 14 and the He condensation section 20, It is equipped with.
  • the refrigerator 1 mainly includes a compressor 4, a main body 2, and a cooling unit 15.
  • the compressor 4 compresses low-pressure He gas supplied from the low-pressure pipe 8 into high-pressure He gas, and supplies it to the high-pressure pipe 6.
  • the main body 2 continuously switches the connection between the high pressure pipe 6 and the low pressure pipe 8 and the He gas flow path in the cooling section 15 described below by the power of a motor or the like.
  • a cooling unit 15 is provided continuously to the main body unit 2.
  • the cooling unit 15 is disposed inside the vacuum chamber 10 maintained in a vacuum environment, and generates cold by the expansion of He gas flowing through the inside.
  • the cooling unit 15 is provided with a first cooling unit 11, a first cooling stage 12, a second cooling unit 13 and a second cooling stage 14 in this order.
  • the first cooling part 11 and the second cooling part 13 are formed in a columnar shape, and the first cooling stage 12 and the second cooling stage 14 are formed in a disk shape and are arranged coaxially.
  • a He gas flow path (not shown) is formed inside the cooling unit 15.
  • the high-pressure He gas supplied to the He gas flow path undergoes endothermic expansion at the second cooling stage 14 and changes to low-pressure He gas.
  • a heat transfer buffer 16 is provided between the lower surface of the second cooling stage 14 and the He condensing unit 20 described later.
  • the heat transfer buffer 16 is formed in a plate shape having a diameter of about several tens of mm and a thickness of about 2 mm, for example.
  • the heat transfer buffer 16 is made of a stainless material or the like whose thermal conductivity at a temperature in the vicinity of 4K is lower than that of the He condensing unit 20 described later.
  • the heat transfer buffer 16 is made of a material having a thermal conductivity of less than 100 W / (mK) at a temperature in the vicinity of 4 K, the temperature amplitude of the second cooling stage 14 is transmitted to the He condensation unit 20. The power S can be suppressed.
  • a He condensing unit 20 on which the object to be cooled 40 is placed is provided on the lower surface of the heat transfer buffer 16.
  • the He condensing unit 20 is made of a material such as Cu, Ag, or A1 whose thermal conductivity at a temperature in the vicinity of 4K is higher than that of the heat transfer buffer 16 described above.
  • the He condensing part 20 is formed of oxygen-free copper.
  • the He condensing unit 20 is made of a material having a thermal conductivity of 200 W / (mK) or higher at a temperature in the vicinity of 4K, the liquid 40 condensed in the He condensing unit 20 efficiently cools the object 40 to be cooled. can do.
  • the He condensing unit 20 is formed in a cylindrical shape with both ends sealed, and can store liquid He therein. If the volume of the He condensing part 20 is not less than lOcc and not more than lOOcc, the He condensing part 20 can be made compact while ensuring the storage capacity of the liquid He necessary for cooling the object 40 to be cooled. In this embodiment, the volume of the He condensing part 20 is set to 40 cc.
  • a table 41 is disposed on the lower surface of the He condensing unit 20.
  • the lower surface of the table 41 is a cooling position where the 1S object 40 is placed.
  • the table 41 is made of a material having the same physical properties as the He condensing unit 20.
  • an In foil or the like is applied between the He condensing unit 20 and the table 41, and between the table 41 and the object to be cooled 40, and the He condensing unit 20 and the table 41 are fastened. Yes.
  • the object to be cooled 40 without providing the table 41 may be applied to the He condensing unit 20 in good thermal contact.
  • the second cooling stage 14, the heat transfer buffer 16, the He condensing unit 20, and the object to be cooled 40 of the cooling unit 15 described above constitute a heat transfer channel from the object to be cooled.
  • the cooling loss can be reduced, and the object to be cooled 40 can be efficiently cooled to the target temperature in a short time.
  • the heat transfer flow path can be axisymmetric, and the entire object to be cooled 40 can be cooled uniformly and stably.
  • a narrow tube 32 extends from the He condensing unit 20 and is always connected to a reservoir 30 disposed outside the vacuum chamber 10.
  • the volume of the reservoir 30 is preferably 5 to 100 times the volume of the He condensing unit 20.
  • the volume of the reservoir 30 is set to 3250 cc.
  • the interior of the reservoir 30 is filled with He gas.
  • the pressure of the He gas 0. IMPa or more 1. Desirably OMPa or less.
  • the reservoir 30 is filled with He gas 50 having a pressure of 0.4 MPa at room temperature.
  • a heat anchor 34 for exchanging heat with the first cooling stage 12 is formed in the middle portion of the narrow tube 32! /.
  • the operation of the refrigerator 1 according to this embodiment will be described.
  • the high-pressure He gas supplied from the compressor 4 to the cooling unit 15 undergoes endothermic expansion in the second cooling stage 14 and changes to low-pressure He gas.
  • the main body 2 continuously switches the connection between the high pressure pipe 6 and the low pressure pipe 8 and the He gas flow path of the cooling section 15. Thereby, compression and expansion (refrigeration cycle) of He gas are repeated, and the temperature of the second cooling stage 14 becomes extremely low.
  • a He condensing unit 20 is provided below the second cooling stage 14. Second cooling stage
  • the He gas inside the He condensing unit 20 is condensed and liquefied to generate liquid He 52.
  • the liquid He is generated so that the volume ratio with respect to the He condensing unit 20 is 30% or less (for example, about 20%).
  • the heat transfer buffer 16 made of a material is provided between the second cooling stage 14 and the He condensing unit 20 and has a lower thermal conductivity than that of the He condensing unit 20. ! / Since the heat transfer buffer 16 acts as a heat flow restricting mechanism, it is possible to suppress the temperature amplitude force e transmitted to the condensing unit 20 in the second cooling stage 14. Therefore, the temperature amplitude on the mounting surface of the object to be cooled can be reduced.
  • FIG. 2 is a graph showing the relationship between the temperature of the second cooling stage and the temperature amplitude.
  • the temperature amplitude was measured for three types of device configurations. Specifically, (1) the temperature amplitude (diamond plot) of the He condensing unit 20 when the second cooling stage 14, the heat transfer buffer 16 and the He condensing unit 20 are provided as in the present embodiment, and (2 ) Second cooling without heat transfer buffer 16 The temperature amplitude (triangular plot) of the He condensation unit 20 when the stage 14 and the He condensation unit 20 are provided, and (3) the second cooling stage 14 when the heat transfer buffer 16 and the He condensation unit 20 are not provided. Temperature amplitude (round plot) was measured.
  • the horizontal axis indicates the temperature at the cooling position (temperature amplitude measurement position) where the object is placed.
  • the volume of the reservoir 30 was set to 3 250 cc, the filling pressure of the He gas into the reservoir 30 was set to 0.4 MPa, and the volume ratio of the liquid He inside the He condensing unit 20 was set to 20%.
  • the magnitude of the temperature amplitude of each device configuration was in the order of (3)> (2)> (1).
  • the higher the temperature at the cooling position the greater the difference in temperature amplitude between each device configuration.
  • the temperature amplitude of the He condensing unit 20 was suppressed to ⁇ 9mK. From the above measurement results, (3) Compared to the device configuration with only the second cooling stage 14, (2) The device configuration with the addition of the He condensing unit 20 significantly reduces the temperature amplitude, and (1) Heat transfer It was confirmed that the temperature amplitude was further reduced in the system configuration with the buffer material 16 and the He condensing unit 20 added compared to (2).
  • FIG. 3 is a graph showing the relationship between the volume ratio of liquid He and the temperature amplitude in the He condensation section.
  • the volume of Rizzano 30 was set to 3250cc, the maximum filling pressure of He gas into the reservoir 30 was set to 0 ⁇ 48 MPa, and the temperature at the cooling position was set to 4.2K.
  • the magnitude of the temperature amplitude was (2)> (1).
  • the temperature amplitude increased when there was no liquid He, but the temperature amplitude decreased when liquid He existed even a little.
  • the temperature amplitude of the He condensation unit 20 was suppressed to ⁇ 9 mK in all cases. From the above, it was confirmed that even a small amount of liquid He has the effect of greatly reducing the temperature amplitude.
  • the inventor of the present application investigated a difference in refrigerating capacity depending on the presence or absence of the heat transfer buffer 16.
  • Fig. 4 is a graph showing the relationship between the temperature at the cooling position and the refrigeration capacity at the cooling position.
  • the volume ratio of liquid He inside the He condensing unit 20 was set to 20%.
  • FIG. 5 is a graph showing the relationship between the cooling time and the temperature at the cooling position.
  • the refrigerator according to the present embodiment is configured such that the He condensing unit 20 on which the object to be cooled 40 is placed is placed between the He cooling unit 20 and the second cooling stage 14.
  • the heat transfer buffer 16 made of a material having a lower thermal conductivity than the condensing unit 20 is provided. According to this configuration, the pulsation power of heat flow caused by the refrigeration cycle of the refrigerator 1 is absorbed by the evaporation and condensation (phase transition) of He in the He condensing unit 20.
  • the heat transfer buffer 16 acts as a heat flow restricting mechanism, the transmission of the temperature amplitude in the second cooling stage 14 is suppressed, and as a result, the temperature amplitude on the mounting surface of the object 40 to be cooled is reduced. be able to.
  • the heat transfer buffer 16, the He condensing section 20, and the object to be cooled 40 are continuously arranged coaxially, the heat transfer flow path from the object to be cooled is axisymmetric and has a short distance. Become. Therefore, uniform and stable cooling of the object to be cooled 40 becomes possible.
  • the reservoir 30 filled with the He gas 50 can be downsized. Further, the filling pressure of the He gas 50 to the reservoir 30 at room temperature can be lowered. As a result, even if the refrigerator 1 is stopped and the liquid He52 in the He condensing unit 20 is vaporized, the reservoir 30 and the He condensing unit can be prevented from becoming high pressure. [0039] (Second Embodiment)
  • FIG. 6 is a schematic configuration diagram in the vicinity of the He condensing unit of the refrigerator according to the present embodiment.
  • fins 222 and 224 force S are erected on the inner surfaces 221 and 223 of the He condensing unit 220. Note that detailed description of portions having the same configuration as in the first embodiment is omitted.
  • a He condensing unit 220 is disposed between the second cooling stage 14 and the object 40 to be cooled.
  • the He condensing unit 220 is a cylindrical hollow container made of a material such as Cu, Ag, or A1, and the inside thereof is filled with He gas 50.
  • the He condensing unit 220 is cooled by the second cooling stage 14, the He gas is condensed and the liquid He52 is generated.
  • the object to be cooled 40 is cooled by the liquid He52.
  • each of the fins 222 and 224 is preferably made of a material having high thermal conductivity, like the He condensing unit 220.
  • the fins 222 and 224 may be formed integrally with the He condensing unit 220, or may be formed separately and fixed to the He condensing unit 220.
  • the first fin 222 is formed from the bottom surface 221 of the He condensing unit 220 toward the ceiling surface 223. This makes it possible to increase the contact area between the inner surface of the He condensing unit 220 and the liquid He52. Therefore, the force S can efficiently cool the object 40 to be cooled placed on the He condensing unit 220.
  • the second fin 224 is formed from the ceiling surface 223 to the bottom surface 221 of the He condensing unit 220. As a result, the contact area between the inner surface of the He condensing unit 220 and the He gas 50 can be increased. Therefore, it is measured by the power that efficiently cools and condenses the He gas 50 inside the He condensing unit 220.
  • FIG. 7 is a schematic configuration diagram in the vicinity of the He condensing unit of the refrigerator according to the present embodiment.
  • a porous structure 322 is attached to the inner surface of the He condensing unit 320. Note that the detailed description of the same parts as in the first embodiment will be given. I will omit the description.
  • a porous structure 322 is attached to the inner surface of the He condensation section 320.
  • the porous structure 322 is made of a mesh, a foam metal, a sintered metal, or the like.
  • the porous structure 322 may be filled in the entire inner side of the He condensing part 320 or may be filled only in a part.
  • the porous structure 322 is attached to the inner surface of the He condensing portion 320 with an adhesive or the like so as to keep a good thermal contact with the inner surface of the He condensing portion 320.
  • the porous structure 322 By providing the porous structure 322, it becomes possible to increase the contact area between the inner surface of the He condensation section 320 and the liquid He52. Therefore, the object to be cooled 40 placed on the He condensing unit 320 can be efficiently cooled. Further, by providing the porous structure 322, the contact area between the inner surface of the He condensing section 320 and the He gas 50 can be increased. Therefore, the He gas 50 inside the He condensing section 320 can be efficiently cooled and condensed.
  • FIG. 8 is a schematic configuration diagram in the vicinity of the He condensing unit of the refrigerator according to the present embodiment.
  • unevenness 18 is formed on the contact surface of the heat transfer buffer 16 with the second cooling stage 14. Note that detailed description of portions having the same configuration as in the first embodiment is omitted.
  • the heat transfer buffer 16 has a low thermal conductivity! /, And is made of a stainless material or the like! Concavities and convexities 18 are formed on the contact surface with the second cooling stage 14.
  • the irregularities 18 may be formed regularly or irregularly (randomly).
  • the unevenness 18 may be formed in a pyramid shape so as to be in point contact with the second cooling stage 14, or the unevenness 18 may be formed in a frustum shape so as to be in surface contact with the second cooling stage 14.
  • the projections and recesses 18 may be formed in a triangular shape so as to be in line contact with the second cooling stage 14, and the projections and depressions 18 may be formed in a trapezoidal shape in cross section so as to be in surface contact with the second cooling stage 14.
  • the contact area between the heat transfer buffer material 16 and the second cooling stage 14 is reduced. .
  • the heat transfer buffer 16 and the second cooling stage 14 are in full contact with each other. Since the heat flow throttling function is strengthened, it is possible to suppress the temperature amplitude in the second cooling stage 14 from being transmitted to the He condensation unit 420. Therefore, it is possible to reduce the temperature amplitude on the surface on which the object to be cooled is placed.
  • the unevenness 18 is formed on the contact surface of the heat transfer buffer 16 with the second cooling stage 14.
  • the unevenness is formed on the contact surface of the second cooling stage 14 with the heat transfer buffer 16. May be.
  • unevenness may be formed on the contact surface of the heat transfer buffer material 16 with the He condensing portion 420, or unevenness may be formed on the contact surface of the He condensing portion 420 with the heat transfer buffer material 16. That is, it is only necessary that irregularities be formed on the contact surface between the second cooling stage 14 or the He condensing section 420 and the heat transfer buffer material 16. In any case, it is possible to suppress the temperature amplitude in the second cooling stage 14 from being transmitted to the He condensing unit 420. Accordingly, it is possible to reduce the temperature amplitude on the surface on which the object to be cooled is placed.
  • FIG. 9 is a schematic configuration diagram in the vicinity of the He condensing unit of the refrigerator according to the present embodiment.
  • the refrigerator according to the present embodiment includes a temperature sensor 64 and a heater 66 attached to the He condensing unit 520, and a control unit 62 that drives the heater 66 based on the measurement result of the temperature sensor 64. . Note that detailed description of portions having the same configuration as in the first embodiment is omitted.
  • the temperature sensor 64 is mounted in the vicinity of the placement surface of the object 40 to be cooled in the He condensing unit 520.
  • the He condensing unit 520 is provided with a heater 66 equipped with a heating wire or the like. These temperature sensor 64 and heater 66 are connected to the control unit 62.
  • the control unit 62 drives the heater 66 based on the measurement result of the temperature sensor 64. That is, the output signal of the temperature sensor 64 is converted into the drive current of the heater 66, and the feedback current is passed through the heater 66, so that the temperature pulsation caused by the heat generation is controlled to be minimized.
  • the set temperature of the mounting surface of the object to be cooled 40 is compared with the measured temperature of the temperature sensor 64.
  • the He condensing unit 520 is heated by driving the heater.
  • the temperature of the mounting surface of the object to be cooled 40 is raised to the set temperature. It becomes possible to return at a time. Therefore, the temperature amplitude on the placement surface of the object to be cooled 40 can be reduced.

Abstract

La présente invention concerne une machine frigorifique avec un étage de refroidissement pour refroidir un objet à refroidir; une section de condensation d'He dans lequel est placé l'objet à refroidir; un réservoir communiquant avec la section de condensation d'He et rempli d'hélium ; et un organe tampon de transfert thermique qui est disposé entre l'étage de refroidissement et la section de condensation d'He et constitué d'un matériau ayant une conductivité thermique inférieure à celle de la section de condensation d'He.
PCT/JP2007/073089 2006-11-30 2007-11-29 Machine frigorifique WO2008066127A1 (fr)

Priority Applications (5)

Application Number Priority Date Filing Date Title
EP07849920.9A EP2090850B1 (fr) 2006-11-30 2007-11-29 Machine frigorifique
CN2007800433909A CN101542219B (zh) 2006-11-30 2007-11-29 冷冻机
JP2008547035A JPWO2008066127A1 (ja) 2006-11-30 2007-11-29 冷凍機
KR1020097010913A KR101121232B1 (ko) 2006-11-30 2007-11-29 냉동기
US12/516,449 US20100031693A1 (en) 2006-11-30 2007-11-29 Refridgerating machine

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006-323772 2006-11-30
JP2006323772 2006-11-30

Publications (1)

Publication Number Publication Date
WO2008066127A1 true WO2008066127A1 (fr) 2008-06-05

Family

ID=39467914

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2007/073089 WO2008066127A1 (fr) 2006-11-30 2007-11-29 Machine frigorifique

Country Status (7)

Country Link
US (1) US20100031693A1 (fr)
EP (1) EP2090850B1 (fr)
JP (1) JPWO2008066127A1 (fr)
KR (1) KR101121232B1 (fr)
CN (1) CN101542219B (fr)
TW (1) TWI395916B (fr)
WO (1) WO2008066127A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5972640B2 (ja) * 2012-03-30 2016-08-17 出光興産株式会社 冷凍機用潤滑油組成物
JP5972639B2 (ja) 2012-03-30 2016-08-17 出光興産株式会社 冷凍機用潤滑油組成物
GB2502629B (en) * 2012-06-01 2015-03-11 Siemens Plc A closed cryogen cooling system and method for cooling a superconducting magnet
KR101555303B1 (ko) * 2013-05-14 2015-09-25 두산중공업 주식회사 재응축장치, 그 재응축장치용 재응축핀의 온도조절방법, 그 재응축장치를 가지는 냉각장치, 그 냉각장치를 이용한 냉각방법
US9553328B2 (en) 2013-08-26 2017-01-24 e-Zn Inc. Electrochemical system for storing electricity in metals
CN105745553B (zh) * 2013-11-13 2019-11-05 皇家飞利浦有限公司 包括热学有效的跨越系统的超导磁体系统以及用于冷却超导磁体系统的方法
CN104458475B (zh) * 2014-12-05 2017-03-15 北京卫星制造厂 一种航天器热控单机产品载压冷热冲击试验方法
US10297888B2 (en) 2015-05-07 2019-05-21 e-Zn Inc. Method and system for storing electricity in metals
US10145602B2 (en) * 2015-09-02 2018-12-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Active gas-gap heat switch with fast thermal response
CN106679217B (zh) * 2016-12-16 2020-08-28 复旦大学 一种机械振动隔离的液氦再凝聚低温制冷系统
JP2021134951A (ja) * 2020-02-25 2021-09-13 住友重機械工業株式会社 極低温冷凍機および極低温システム
US11394068B2 (en) 2020-11-25 2022-07-19 e-Zn Inc. Electrolyte leakage management in an electrochemical cell

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6195585A (ja) * 1984-10-17 1986-05-14 Hitachi Ltd 冷凍機付きクライオスタツト
JPH0914777A (ja) * 1995-06-29 1997-01-17 Idoutai Tsushin Sentan Gijutsu Kenkyusho:Kk 冷凍機の膨張装置
JPH09287836A (ja) * 1996-02-21 1997-11-04 Daikin Ind Ltd 極低温冷凍機
JPH10132763A (ja) * 1996-11-05 1998-05-22 Mac Sci:Kk Ｘ線回折装置における試料位置自動調整方法
JP2773793B2 (ja) 1993-11-22 1998-07-09 住友重機械工業株式会社 極低温冷凍機
JP2000274966A (ja) * 1999-03-24 2000-10-06 Sumitomo Electric Ind Ltd 熱交換ユニット
JP2002270421A (ja) * 2001-03-14 2002-09-20 Aisin Seiki Co Ltd 磁場装置
JP2004076955A (ja) 2002-08-09 2004-03-11 Sumitomo Heavy Ind Ltd 極低温温度ダンパ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3188830A (en) * 1964-08-03 1965-06-15 Hughes Aircraft Co Thermal oscillation filter
US4479367A (en) * 1981-12-28 1984-10-30 Santa Barbara Research Center Thermal filter
US4694175A (en) * 1985-12-12 1987-09-15 Santa Barbara Research Center Thermal damper for infrared detector
JP3265139B2 (ja) * 1994-10-28 2002-03-11 株式会社東芝 極低温装置
US5606870A (en) * 1995-02-10 1997-03-04 Redstone Engineering Low-temperature refrigeration system with precise temperature control
US5782095A (en) * 1997-09-18 1998-07-21 General Electric Company Cryogen recondensing superconducting magnet
US7266954B2 (en) * 2002-12-16 2007-09-11 Sumitomo Heavy Industries, Ltd Method and device for installing refrigerator
JP4494027B2 (ja) * 2004-01-26 2010-06-30 株式会社神戸製鋼所 極低温装置
DE102004053972B3 (de) * 2004-11-09 2006-07-20 Bruker Biospin Gmbh NMR-Spektrometer mit gemeinsamen Refrigerator zum Kühlen von NMR-Probenkopf und Kryostat
GB0428406D0 (en) * 2004-12-24 2005-02-02 Oxford Instr Superconductivity Cryostat assembly
US20080209919A1 (en) * 2007-03-01 2008-09-04 Philips Medical Systems Mr, Inc. System including a heat exchanger with different cryogenic fluids therein and method of using the same

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6195585A (ja) * 1984-10-17 1986-05-14 Hitachi Ltd 冷凍機付きクライオスタツト
JP2773793B2 (ja) 1993-11-22 1998-07-09 住友重機械工業株式会社 極低温冷凍機
JPH0914777A (ja) * 1995-06-29 1997-01-17 Idoutai Tsushin Sentan Gijutsu Kenkyusho:Kk 冷凍機の膨張装置
JPH09287836A (ja) * 1996-02-21 1997-11-04 Daikin Ind Ltd 極低温冷凍機
JPH10132763A (ja) * 1996-11-05 1998-05-22 Mac Sci:Kk Ｘ線回折装置における試料位置自動調整方法
JP2000274966A (ja) * 1999-03-24 2000-10-06 Sumitomo Electric Ind Ltd 熱交換ユニット
JP2002270421A (ja) * 2001-03-14 2002-09-20 Aisin Seiki Co Ltd 磁場装置
JP2004076955A (ja) 2002-08-09 2004-03-11 Sumitomo Heavy Ind Ltd 極低温温度ダンパ

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2090850A4

Also Published As

Publication number Publication date
CN101542219B (zh) 2012-06-20
TW200839162A (en) 2008-10-01
JPWO2008066127A1 (ja) 2010-03-11
EP2090850B1 (fr) 2016-10-05
EP2090850A4 (fr) 2011-11-23
KR20090085641A (ko) 2009-08-07
US20100031693A1 (en) 2010-02-11
TWI395916B (zh) 2013-05-11
CN101542219A (zh) 2009-09-23
EP2090850A1 (fr) 2009-08-19
KR101121232B1 (ko) 2012-03-22

Similar Documents

Publication Publication Date Title
WO2008066127A1 (fr) Machine frigorifique
JP3347870B2 (ja) 超電導マグネット並びに該マグネット用の蓄冷型冷凍機
GB2504187A (en) Cryogenic cooling apparatus with a thermally linked two-stage refrigerator which operates in a pressure modulated regime that is sensed and controlled.
US7012347B2 (en) Superconducting rotor with cooling system
Bonnet et al. Development and test of a cryogenic pulsating heat pipe and a pre-cooling system
JP2005326138A (ja) 冷却装置およびこれを備えた自動販売機
WO2004085935A1 (fr) Machine de refrigeration a tube d'impulsion
JP5770303B2 (ja) 冷却装置及び方法
EP2085720B1 (fr) Conteneur cryogène avec réfrigérateur intégré
Thummes et al. Approaching the 4He lambda line with a liquid nitrogen precooled two-stage pulse tube refrigerator
JP2009103412A (ja) 蓄冷式冷凍機
WO2002016836A1 (fr) Refroidisseur a cycle de stirling, chambre de refroidissement et refrigerateur
JP2001091173A (ja) 熱搬送装置
JP2006234356A (ja) 低温保持装置およびそのメンテナンス方法
JP3310872B2 (ja) 磁気冷凍機
JP2004069268A (ja) パルスチューブ冷凍機
de Waele Millikelvin Cooling by Expansion of ³He in 4He
JPH07294035A (ja) 超電導磁石装置
Derking et al. Progress in Joule-Thomson microcooling at the University of Twente
Gawali et al. Performance prediction and experimental investigations on integral pulse tube cryocooler for 15 W at 70 K using indigenously developed linear compressor
von Schneidemesser et al. Generation of liquid helium temperatures using a lead regenerator in a GM precooled pulse tube stage
JP2007198627A (ja) スターリング冷却庫
Duband Double stage helium sorption coolers
CN116538745A (zh) 一种基于阶梯活塞脉管制冷机的低温冰箱
JP2005283023A (ja) スターリング冷却庫

Legal Events

Date Code Title Description
WWE Wipo information: entry into national phase

Ref document number: 200780043390.9

Country of ref document: CN

121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07849920

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2008547035

Country of ref document: JP

WWE Wipo information: entry into national phase

Ref document number: 1020097010913

Country of ref document: KR

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2007849920

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2007849920

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 12516449

Country of ref document: US