WO2008026516A1 - Unité de composant électrique - Google Patents

Unité de composant électrique Download PDF

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Publication number
WO2008026516A1
WO2008026516A1 PCT/JP2007/066465 JP2007066465W WO2008026516A1 WO 2008026516 A1 WO2008026516 A1 WO 2008026516A1 JP 2007066465 W JP2007066465 W JP 2007066465W WO 2008026516 A1 WO2008026516 A1 WO 2008026516A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrical component
component unit
capacitor
case
heat transfer
Prior art date
Application number
PCT/JP2007/066465
Other languages
English (en)
Japanese (ja)
Inventor
Akio Yoshimoto
Mitsuhiro Tanaka
Original Assignee
Daikin Industries, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Daikin Industries, Ltd. filed Critical Daikin Industries, Ltd.
Publication of WO2008026516A1 publication Critical patent/WO2008026516A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/08—Cooling arrangements; Heating arrangements; Ventilating arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor

Definitions

  • the present invention relates to an electrical component unit that houses electrical components including a capacitor.
  • Electrolytic capacitors are used in electrical component units that incorporate an inverter smoothing circuit or the like (see, for example, Patent Documents 1 to 3).
  • Patent Document 1 Japanese Utility Model Publication No. 5-77930
  • Patent Document 2 JP-A-6-104143
  • Patent Document 3 Japanese Patent Laid-Open No. 2005-10246
  • the electrolytic capacitor is one of the electrical components having the shortest lifetime, and the lifetime of the electrolytic capacitor often becomes the lifetime of the electrical component unit. Therefore, there is a demand for further extending the life of electrolytic capacitors.
  • an object of the present invention is to provide an electrical component unit capable of suppressing a temperature rise of a capacitor.
  • a first aspect of the electrical component unit (1A; IB; 1C; ID; IF; 1G) according to the present invention includes a capacitor (11), a substrate (19) on which the capacitor is mounted, and the substrate Case (2)
  • a second aspect of the electrical component unit according to the present invention is the first aspect, wherein the heat transfer member (15 8; 158) is a portion (16A) that reaches the outside of the case. It is characterized by having.
  • a third aspect of the electrical component unit according to the present invention is the second aspect, wherein the heat transfer member (15A; 15B) is a heat dissipating member (30) provided outside the case. It is characterized by being connected to.
  • a fourth aspect of the electrical component unit according to the present invention is the third aspect, wherein the heat transfer member (15A; 15B) includes a portion (16A) that reaches the outside of the case. It is connected to the heat radiating member through an insulating material (17) provided between the heat radiating member (30).
  • a fifth aspect of the electrical component unit according to the present invention is the first aspect, wherein the case is formed of an insulating material, and the heat transfer member (15C) has one end thereof. In (16C), it is embedded in the case from the inside of the case to a predetermined position (P1) between the inner surface (SA) and the outer surface (SB) of the case.
  • a sixth aspect of the electrical component unit according to the present invention is the first aspect thereof, wherein the heat transfer member (51) includes a recess (52), and the capacitor is It is characterized by being placed in close contact with the recess.
  • a seventh aspect of the electrical component unit according to the present invention is the sixth aspect, wherein the capacitor passes through the notch or the through hole of the substrate and is in close contact with the recess. It is arranged so that it may be arranged.
  • An eighth aspect of the electrical component unit according to the present invention is the first, second, fifth, sixth or
  • a ninth aspect of the electrical component unit according to the present invention is any one of the first to eighth aspects, wherein the heat transfer member is in close contact with the capacitor via an insulating material.
  • a tenth aspect of the electrical component unit (1H) according to the present invention includes a capacitor (11) and the capacitor. And a case (20) for housing the substrate.
  • the case has a recess (22) on the inner surface, and the capacitor is in close contact with the recess. It is arranged.
  • An eleventh aspect of the electrical component unit according to the present invention is the tenth aspect thereof, wherein the concave portion (22) is a concave portion having a substantially circular arc cross section, and the capacitor ( 11
  • a twelfth aspect of the electrical component unit according to the present invention is the tenth aspect thereof, wherein the concave portion (22) is a substantially semi-cylindrical concave portion, and the capacitor ( 11) The outer peripheral curved surface is in close contact with the recess.
  • a thirteenth aspect of the electrical component unit according to the present invention is any one of the tenth to twelfth aspects, wherein the capacitor passes through the notch or the through hole of the substrate. , And so as to be in close contact with the recess.
  • a fourteenth aspect of the electrical component unit according to the present invention is any one of the tenth to thirteenth aspects, and further includes a heat dissipating member (30) in contact with the outer surface of the case. It is characterized by.
  • a fifteenth aspect of the electrical component unit according to the present invention is any one of the tenth to fourteenth aspects, and further includes a heat dissipating member (30) in contact with the outer surface of the case. It is characterized by.
  • a sixteenth aspect of the electrical component unit according to the present invention is any one of the tenth to fifteenth aspects, wherein the capacitor is in close contact with the heat transfer member via an insulating material. It is characterized by.
  • the heat generated in the capacitor is transferred to the case via the heat transfer member, so that high heat dissipation efficiency can be obtained. Therefore, it is possible to suppress the temperature rise of the capacitor.
  • the heat transfer member has a portion that reaches the outside of the case, so that a high heat dissipation effect can be obtained.
  • the heat generated in the capacitor is Since it is transmitted to the heat radiating member via the heat transfer member, high heat radiation efficiency can be obtained.
  • the remaining part from the predetermined position to the outer surface of the case exhibits an insulating function, so there is no need to separately provide an insulating member.
  • the capacitor can come into contact with the recess existing on the opposite side of the mounting surface of the substrate.
  • the heat generated by the capacitor is transferred to the heat dissipation member via the heat transfer member and the case, so that high heat dissipation and heat dissipation efficiency can be obtained. And force S.
  • the capacitor is disposed in close contact with the concave portion on the inner surface of the case, so that high heat dissipation efficiency can be obtained. Therefore, it is possible to suppress the temperature rise of the capacitor.
  • the outer peripheral curved surface of the capacitor having a substantially cylindrical shape is in close contact with the concave portion having a substantially arc-shaped cross section. it can.
  • the capacitor can come into contact with a recess existing on the opposite side of the mounting surface of the substrate.
  • the projecting portion has a thickness for mounting the substantially cylindrical capacitor, and the substrate arrangement of the case Surface bump It is possible to make the portions other than the protruding portion relatively thin.
  • the heat generated in the capacitor is
  • FIG. 1 is a cross-sectional view showing an electrical component unit according to the first embodiment.
  • FIG. 2 is a partially enlarged view of FIG.
  • FIG. 3 is a top view showing a state where the L-shaped member is in close contact with the capacitor.
  • FIG. 4 is a cross-sectional view showing an electrical component unit according to a second embodiment.
  • FIG. 5 is a perspective view showing a heat transfer member.
  • FIG. 6 is an enlarged cross-sectional view of the vicinity of the capacitor of the electrical component unit according to the third embodiment.
  • FIG. 7 is an exploded cross-sectional view showing an electrical component unit according to a fourth embodiment.
  • FIG. 8 is a cross-sectional view of an electrical component unit according to a fourth embodiment.
  • FIG. 9 is a side view of an electrical component unit according to the fourth embodiment.
  • FIG. 10 is a side view showing an electrical component unit according to the fifth embodiment.
  • FIG. 11 is a top view showing a heat transfer member according to a fifth embodiment.
  • FIG. 12 is an exploded sectional view showing an electrical component unit according to the sixth embodiment.
  • FIG. 13 is a cross-sectional view of an electrical component unit according to a sixth embodiment.
  • FIG. 14 is a cross-sectional view of an electrical component unit according to a seventh embodiment.
  • FIG. 15 is an exploded cross-sectional view showing an electrical component unit according to an eighth embodiment.
  • FIG. 16 is a cross-sectional view showing an electrical component unit according to an eighth embodiment.
  • FIG. 17 is a side view of an electrical component unit according to the eighth embodiment.
  • FIG. 18 is a cross-sectional view of an electrical component unit according to a modification.
  • FIG. 19 is a cross-sectional view of an electrical component unit according to another modification.
  • FIG. 20 is a cross-sectional view of an electrical component unit according to another modification.
  • FIG. 21 is a cross-sectional view of an electrical component unit according to yet another modification.
  • FIG. 1 is a cross-sectional view showing an electrical component unit 1 (also referred to as 1A) according to the first embodiment
  • FIG. 2 is a partially enlarged view of FIG.
  • the electrical component unit 1A includes an electrical component 10, a heat transfer member 15 (also referred to as 15A), a substrate 19, a case 20 (also referred to as 20A), and a heat dissipation member 30. It has.
  • the electrical component 10 is mounted on a substrate 19 and is, for example, a capacitor (here, an electrolytic capacitor) 11. Further, the electrical component 10 and the substrate 19 are accommodated in the case 20A.
  • the electrical component 10 includes a substantially cylindrical capacitor 11, and may also include various types of electronic components 12 other than the capacitor. These electrical components 10 are fixed to the substrate 19 by soldering or the like.
  • the substrate 19 is fixed to the case 20A at a predetermined position inside the case 20A. Specifically, the substrate 19 is fixed in a state of being slightly lifted (separated) from the bottom surface of the case 20A, for example, by arranging spacers (not shown) at the four corners thereof.
  • the bottom surface of the case 20A is also a surface on which the substrate 19 is arranged, and is also referred to as “substrate arrangement surface” or “arrangement surface”.
  • the case 20A is a box mainly formed of resin, and is molded in a state of being integrated with the heat transfer member 15A, as will be described later. Further, the heat dissipating member 30 is disposed on the outer surface of the case 20A so as to be in contact with the case 20A over almost the entire bottom surface of the case 20A.
  • the heat dissipating member 30 is formed of a material having high thermal conductivity such as aluminum, copper, or iron.
  • the heat transfer member 15A plays a role of transferring heat generated in the capacitor 11 to the case 20A and the heat dissipation member 30.
  • the heat transfer member 15A is made of a material having high thermal conductivity such as aluminum, copper, or iron.
  • the heat transfer member 15A is configured to include four L-shaped members LA (see FIGS. 2 and 3).
  • 3 is a view (top view) of the state in which four L-shaped members LA are adhered to the outer peripheral side surface of the capacitor 11 as viewed from above.
  • the four L-shaped members LA are arranged along the outer periphery of the capacitor 11 at substantially equal intervals.
  • Each L-shaped member LA of the heat transfer member 15A includes a vertical portion 18A (see FIG. 2) and a horizontal portion 16A formed by being bent substantially perpendicular to the vertical portion 18A. Have it!
  • the heat transfer member 15A is integrally formed with a resin case 20A.
  • the horizontal part 16A and a part (lower part) of the vertical part 18A are embedded in the case 20A, and the remaining part (upper part) of the vertical part 18A is perpendicular to the inner surface SA of the case 20A. Molded in a state protruding upward in the case 20A.
  • the heat transfer member 15A penetrates the bottom surface of the case 20A from the inside to the outside (bottom side) of the case 20A. Then, the heat transfer member 15A and the case 20A are integrally molded in a state where the horizontal portion 16A of the heat transfer member 15A reaches the outside of the case 20A (the heat dissipation member 30 side) (ie, the exposed state). This is an example.
  • the substrate 19 has four through holes HL1 (see FIG. 2 and FIG. 3) corresponding to the respective L-shaped members LA at predetermined positions, respectively, and a total of four vertical portions 18A are respectively provided. Fixed to case 20A in a state of penetrating through the corresponding through hole HL1. Therefore, in a state where the substrate 19 is fixed to the case 20A, the upper portion of the vertical portion 18A of the heat transfer member 15A passes through the through hole HL1 provided in the substrate 19 and protrudes above the substrate 19. . Then, the protruding portion above the substrate (the upper portion of the vertical portion 18A) is in close contact with the outer peripheral side surface of the capacitor disposed on the substrate 19.
  • the heat transfer member 15A has a certain part (here, the vertical part 18A) in close contact with the outer peripheral side surface of the capacitor 11, and the other part (here, the horizontal part 16A, etc.) is the case. Connected to 20A. Therefore, since the heat generated in the capacitor 11 is directly transferred to the case 20A via the heat transfer member 15A, it is possible to obtain higher heat dissipation efficiency than that of the conventional air-cooling type. As a result, the temperature rise of the capacitor 11 can be suppressed.
  • the vertical portions 18A of the four L-shaped members LA are configured to generate an urging force and a biasing force toward the central axis side of the substantially cylindrical capacitor 11 by its elastic force. Therefore, by this urging force, the four L-shaped members LA are stably held on the outer peripheral side surface of the capacitor 11 and are in a state of being stably in close contact with the capacitor 11.
  • the top view of Figure 3 As shown, the upper portion of the vertical portion 18A is formed by being deformed so as to draw an arc curve having a curvature similar to the curvature of the outer peripheral side surface of the capacitor 11 (that is, along the curved surface of the outer peripheral side surface of the capacitor 11). Has been. According to this, the adhesion between the heat transfer member 15A and the capacitor 11 can be further improved. In addition, by holding the capacitor 11 stably, it is possible to prevent lead breakage (of the capacitor 11) due to vibration during transportation.
  • the heat transfer member 15A is connected to a heat radiating member 30 provided outside the case 20A. Since the heat generated in the capacitor 11 is transferred to the heat radiating member 30 via the heat transfer member 15A, higher heat radiating efficiency can be obtained. Specifically, the heat transfer member 15A is connected to the heat radiating member 30 provided outside the case 20A via an insulating material (for example, insulating paper) 17. The connection between the heat transfer member 15A and the heat dissipating member 30 should not be such that the heat transfer between the two is interrupted, and the above-mentioned medium (insulating material 17 etc.) is between the two. It may be in an existing form.
  • the insulating material 17 may be a material having thermal conductivity! /, But is more preferably a material having a relatively high thermal conductivity (high thermal conductivity material). As the insulating material 17, for example, it is preferable to use a high thermal conductive resin.
  • the electrical component unit 1A As described above, according to the electrical component unit 1A, a high heat radiation effect by the heat transfer member 15A or the like can be obtained, so that the temperature rise of the capacitor 11 is suppressed as compared with the conventional air-cooled type. Therefore, the life of the capacitor 11 can be extended. In addition, by using a low temperature grade capacitor 11 as the capacitor 11, it is possible to reduce the cost.
  • an insulating material 17 is provided between the heat transfer member 15A and the heat radiating member 30. This is an example. If it is not necessary to insulate the two, the heat transfer member 15 A and the heat dissipating member 30 without providing the insulating material 17 may be in direct contact with each other! /.
  • FIG. 4 is a cross-sectional view showing an electrical component unit 1 (also referred to as 1B) according to the second embodiment.
  • the shape and arrangement of the heat transfer member are different from those in the first embodiment. Specifically, a heat transfer member 15B is provided instead of the heat transfer member 15A.
  • the heat transfer member 15B includes a horizontal portion 16B (see Fig. 4) and a vertical portion 18B, and in addition to the bending portion 13B and the bending portion 13B. And a connecting portion 14B connected to the vertical portion 18B.
  • the heat transfer member 15B is configured in a state in which a horizontal portion 16B, a vertical portion 18B, a connection portion 14B, and a bending portion 13B are integrated.
  • the bending portion 13B is processed by bending a thin plate-like member so as to have a substantially cylindrical shape having the same diameter as the outer peripheral side surface of the capacitor 11, and a part of the ring is opened in a top view. It has a shape.
  • the curved portion 13B has a curved surface curved with the same curvature as the outer peripheral side surface of the capacitor 11, and corresponds to a central angle of a predetermined angle (preferably an angle of 180 degrees or more (eg, 270 degrees)) when viewed from above. It has an arc part!
  • the outer peripheral curved surface of the capacitor 11 becomes the bending portion 13B.
  • the capacitor 11 is held in close contact.
  • the bending portion 13B is configured to generate an urging force that surrounds the outer peripheral curved surface of the substantially cylindrical capacitor 11 by its elastic force, and the capacitor 11 is stably generated by the urging force. Retained.
  • This heat transfer member 15B is integrally formed with a resin case 20 (also referred to as 20B).
  • the vertical portion 18B and the horizontal portion 16B of the heat transfer member 15B are embedded in the side wall portion of the case 20B, and the connection portion 14B protrudes horizontally from the side wall portion of the case 20B, and the connection portion 14B.
  • a bending portion 13B is connected to the tip of the head.
  • the heat transfer member 15B is in close contact with the outer peripheral side surface of the capacitor 11 in a certain part (here, the curved portion 13B) and the other part (here, Horizontal part 16B etc.) is connected to case 20B. Therefore, the heat generated in the capacitor 11 is directly transferred to the case 20B via the heat transfer member 15B, so that high heat radiation efficiency can be obtained. Further, since the horizontal portion 16B of the heat transfer member 15B reaches the outer side (here, the bottom surface side) of the case 20B, higher heat radiation efficiency can be obtained.
  • the heat transfer member 15B is connected to the heat dissipating member 30 provided outside the case 20B (specifically, via the insulating material 17). Since the heat generated in the capacitor 11 is transmitted to the heat radiating member 30 via the heat transfer member 15B, higher heat radiating efficiency can be obtained.
  • a separate insulating material for example, insulation
  • paper Explain the case of providing 17! /, But is not limited to this.
  • the third embodiment is a modification of the first embodiment, and the following description will focus on differences from the first embodiment.
  • FIG. 6 is an enlarged cross-sectional view of the vicinity of the capacitor 11 of the electrical component unit 1 (also referred to as 1C) according to the third embodiment.
  • Case 20 (also referred to as 20C) of electrical component unit 1C is formed of an insulating material (resin or the like).
  • the heat transfer member 15 (also referred to as 15C) of the electrical component unit 1C is located between the inner surface SA and the outer surface SB of the case 20C from the inside of the case 20C on one end side (specifically, the portion 16C). It is integrally formed with the case 20C so as to be embedded in the case 20C up to a predetermined position P1.
  • FIG. 7 is an exploded sectional view showing an electrical component unit 1 (also referred to as 1D) according to the fourth embodiment.
  • 8 is a cross-sectional view (specifically, a vertical cross-sectional view of the electrical component unit 1D viewed from the front side) as seen from the same direction as FIG. 7, and
  • FIG. 9 is a side view of the interior of the electrical component unit 1D. It is the side view (partial sectional view) seen from the side.
  • each of the substantially cylindrical capacitors 11 is arranged in such a posture that its axial direction is substantially parallel to the bottom surface of the case (in short, in a laid state).
  • the case is illustrated.
  • the electrical component unit 1D includes an electrical component 10 (see FIG. 1), a substrate 19, a heat transfer member 51, a case 20 (also referred to as 20D), and a heat radiating member. And 30.
  • the electrical component 10 is mounted on the substrate 19 and is a capacitor 11, for example. Further, the heat transfer member 51 is in close contact with the capacitor 11 as described below.
  • the electrical component 10 and the substrate 19 are accommodated in the case 20D. Heat generated in the capacitor 11 mounted on the substrate 19 is released to the outside through the heat transfer member 51, the case 20D, and the heat dissipation member 30.
  • the heat transfer member 51 has a substantially rectangular parallelepiped base portion 55, and, as shown in Fig. 8, has a protruding portion 53 that protrudes outward leftward and rightward on each of the upper left and right sides. Yes. Further, on the upper surface side of the base portion 55, a concave portion 52 having a substantially arc-shaped cross section (more specifically, a substantially semi-cylindrical shape) is provided. The number of recesses 52 is determined according to the number of capacitors 11 to be arranged. Here, in order to arrange two capacitors 11, two recesses 52 are provided.
  • Each recess 52 is formed in accordance with the outer shape of the capacitor 11, and each capacitor 11 having a substantially cylindrical shape has a posture in which its axial direction is substantially horizontal (in short, it has been laid down) And in close contact with each recess 52. More specifically, one side (lower side) of the outer peripheral curved surface of the capacitor 11 having a substantially cylindrical shape is arranged so as to be in close contact with the concave portion 52 having a substantially semi-cylindrical shape.
  • the adhesion between the capacitor 11 and the recess 52 is enhanced by adhering the capacitor 11 to the recess 52 with an adhesive.
  • each of the substantially semi-cylindrical recesses 52 has a length in the axial direction that is equal to or greater than (same as here) the axial length of the substantially cylindrical capacitor 11 ( (See Figure 9). Since the capacitor 11 is in contact with the recess 52 over the entire length of the capacitor 11 in the axial direction, high V and heat dissipation efficiency can be obtained.
  • the lead wire 41 of the capacitor 11 is soldered and fixed at a predetermined position on the substrate 19, and the lead wire 41 is electrically connected to a predetermined wiring on the substrate 19. Note that the lead wire 41 is bent at an appropriate position in order to place the capacitor 11 in a lying state.
  • the substrate 19 has a substantially rectangular shape having the same size as the base portion 55 in a top view.
  • Through-hole HL2 is provided, the base portion 55 of the heat transfer member 51 penetrates the substrate 19 in the through-hole HL2, and the bottom surface of the base portion 55 is in contact with the bottom surface (inner bottom surface) of the case 20D. It is arranged with.
  • a substantially prismatic projecting portion 23 projecting upward from the bottom surface of the case 20D is provided at a position corresponding to the projecting portion 53 of the heat transfer member 51.
  • Each protruding portion 23 is provided with a female screw portion (not shown), and the bolt 26 is screwed into the female screw portion with the projecting portion 53 and the substrate 19 sandwiched therebetween, whereby the heat transfer member 51 and The substrate 19 is fixed to the case 20D.
  • the capacitor 11 is arranged so as to pass through the through hole HL2 from the mounting surface side (upper surface side) of the substrate 19 to the other surface side (back surface side) (see FIG. 8 and the like). Therefore, the capacitor 11 can come into contact with the recess 52 that also exists on the opposite side (that is, the lower surface side) of the mounting surface of the substrate 19.
  • the capacitor 11 passes through the through hole HL2, and is on one side (upper side) and the other side of the substrate 19.
  • the force S reduces the size of the electrical component unit 1 in the height direction and reduces the size.
  • the case 20D described above is formed of substantially the same material throughout.
  • the case 20D is made of a material having a high thermal conductivity and is not limited to this, and various materials can be used.
  • a material for the case 20D it is preferable to use a high thermal conductivity material (for example, a high thermal conductivity resin, aluminum, iron, or the like).
  • the case 20D is not limited to this, and the case 20D does not have a high thermal conductivity as long as it has thermal conductivity! /, (That is, a relatively low thermal conductivity) is a general resin. May be formed!
  • the capacitor 11 is disposed in close contact with the recess 52 of the heat transfer member 51, and the bottom surface of the base portion 55 of the heat transfer member 51 is connected to the case 20D. Therefore, the heat from the capacitor 11 is directly transmitted to the heat transfer member 51 including the concave portion 52, further transferred to the case 20D that contacts the heat transfer member 51, and directed to the outside of the electrical component unit 1D. And then released. Therefore, high heat dissipation efficiency can be obtained. Further, in this electrical component unit ID, the heat dissipating member 30 is disposed so as to contact the outer surface of the case 20D. Therefore, heat is further transferred from the case 20D to the heat radiating member 30, whereby higher heat dissipation efficiency can be obtained.
  • FIG. 10 is a side view (partially sectional view) of the interior of the electrical component unit 1E as seen from the same direction as FIG. 9, and FIG. 11 is a top view showing the heat transfer member 51 (also referred to as 51B). is there.
  • the heat transfer member 51B is provided with a hole HL3 for allowing the lead wire 41 to pass therethrough.
  • the heat transfer member 51 is provided with a protruding portion 54 on the back side (right side in FIG. 10) of FIG. 8 in addition to the left and right protruding portions 53 of FIG.
  • the overhang 54 has a total of four through holes HL3.
  • Each through hole HL3 is provided at a position corresponding to each placement position of the lead wire 41 on the substrate 19, and the two lead wires 41 of each capacitor 11 (four lead wires 41 in total) Through hole HL3 penetrates overhang 54. Since this through hole HL3 functions as a hole for positioning the lead wire 41 as described below, good workability can be obtained in the assembly process.
  • the lead wire 41 of the capacitor 11 is bent at an appropriate position and penetrates through the through hole HL3 of the heat transfer member 51.
  • the capacitor 11 is bonded and fixed to the heat transfer member 51 in a state where the capacitor 11 is laid in the recess 52 of the heat transfer member 51.
  • the base portion 55 of the heat transfer member 51 is passed through the through hole HL2 (see Fig. 7) of the substrate 19 on which the various electrical components 10 are mounted, and is further passed downward through the through hole HL3.
  • the extending lead wire 41 is further pierced through a through hole (not shown) provided at a predetermined position on the substrate 19. In this state, the lead wire 41 is fixed to the substrate 19 by soldering.
  • the base portion 55 of the heat transfer member 51 is brought into contact with a predetermined position on the bottom surface of the case 20E. Then, in a state where the capacitor 11 is fixed to the heat transfer member 51, the protruding portion 53 of the heat transfer member 51 and the substrate 19 are connected to the case 20E beam Physically, it is fixed to the protrusion 23).
  • the overhanging portion 53 and the substrate 19 are fixed by allowing the borehole 26 to pass through the overhanging portion 53 and the substrate 19 and be screwed into the female screw portion of the projecting portion 23.
  • the electrical component unit 1E is manufactured as described above.
  • the through hole HL3 functions as a positioning hole for the lead wire 41. Therefore, when the heat transfer member 51 on which the capacitor 11 is already mounted is attached to the substrate 19, the lead wire 41 of the capacitor 11 can be easily disposed at a predetermined position on the substrate 19. Therefore, installation work can be performed with good workability.
  • the work of bonding and fixing the capacitor 11 to the recess 52 may be performed after the heat transfer member 51 is combined with the substrate 19 or after the heat transfer member 51 is attached to the case 20E.
  • the fixing work of the capacitor 11 to the substrate 19 may be performed after the heat transfer member 51 is attached to the case 20E.
  • FIG. 12 is an exploded sectional view showing an electrical component unit 1 (also referred to as 1F) according to the sixth embodiment
  • FIG. 13 is a sectional view of the electrical component unit 1F viewed from the same direction as FIG. .
  • one side (lower side) of the outer peripheral curved surface of the capacitor 11 having a substantially cylindrical shape is disposed so as to be in close contact with the substantially semi-cylindrical recess 52.
  • the other side (upper side) of the outer peripheral curved surface of the capacitor 11 is covered with a pressing member 56 having a substantially semi-cylindrical recess 57.
  • the number of recesses 57 is determined according to the number of capacitors 11 to be arranged in the pressing member 56.
  • two concave portions 57 are provided.
  • the pressing member 56 is not limited to a force produced by, for example, pressing a sheet metal, and can be formed of various other materials (for example, resin).
  • the holding member 56 If the insulation between the holding member 56 and the capacitor 11 is required, such as when the material has conductivity (conductivity), an insulating material (for example, insulating paper) is placed between the holding member 56 and the capacitor 11. I ’ll take care of you!
  • the pressing member 56, the heat transfer member 51, and the substrate 19 are fixed to the case 20F by two bolts 26.
  • the two bolts 26 force holding member 56 specifically, the horizontal portions on both the left and right sides
  • the overhanging portion 53, and the substrate 19 are sandwiched and screwed into the female screw portion of the protruding portion 23.
  • the capacitor 11 is sandwiched between the recess 57 of the pressing member 56 and the recess 52 of the heat transfer member 51 and is stably held, and the adhesion between the capacitor 11 and the recess 52 is improved. According to this, only when the capacitor 11 is directly fixed to the recess 52 of the heat transfer member 51 by using an adhesive, the capacitor 11 is connected to the heat transfer member via the cooling grease or the heat conductive sheet. Even in the case of being indirectly fixed to the recess 52 of 51, the adhesion between the capacitor 11 and the recess 52 is improved. By holding the capacitor 11 stably, it is possible to prevent lead breakage (of the capacitor 11) due to vibration during transportation.
  • FIG. 14 is a cross-sectional view of the electrical component unit 1 (also referred to as 1 G ) as viewed from the front side. In this embodiment, a case where a single capacitor 11 is mounted is illustrated.
  • the heat transfer member 51 reaches the outside of the case 20 (in other words, exposed to the outside of the case 20).
  • a heat radiating member 30 is provided so as to be in contact with the heat transfer member 51. According to such a configuration, since the heat transfer member 51 is directly connected to the heat dissipation member 30, a particularly high heat transfer efficiency can be obtained.
  • the present invention is not limited to this.
  • the case 20 bottom as in the other embodiments The heat radiating member 30 may be disposed over substantially the entire surface.
  • FIG. 15 is an exploded sectional view showing an electrical component unit 1 (also referred to as 1H) according to the eighth embodiment.
  • 16 is a cross-sectional view (specifically, a vertical cross-sectional view when the electrical component unit 1H is viewed from the front side) as seen from the same direction as FIG. 15, and
  • FIG. 17 shows the interior of the electrical component unit 1H. It is the side view seen from the side (partial sectional view).
  • the case 20 (also referred to as 20H) of the electrical component unit 1H has a substantially rectangular protruding portion that protrudes upward at a predetermined position in the bottom surface.
  • the protrusions 21 and the like function as heat transfer parts, and the heat generated in the capacitor 11 is released to the outside through the protrusions 21 and the heat dissipation member 30.
  • the case 20H is formed of substantially the same material throughout.
  • the case 20 H is a force that is made of a highly thermally conductive resin, and is not limited to this, and various materials can be used.
  • Case 20H does not have high thermal conductivity as long as it has thermal conductivity! /, (That is, it has relatively low thermal conductivity) and may be formed of a general resin! /, .
  • a high thermal conductivity material for example, a high thermal conductivity resin, aluminum, iron, or the like
  • the case 20H has a recess 22 on its inner surface. Specifically, as shown in FIG. 15 and the like, the protruding portion 21 of the case 20H has a concave portion 22 having a substantially arc-shaped cross section (specifically, a substantially semi-cylindrical shape) on the upper surface side.
  • the number of recesses 22 is determined according to the number of capacitors 11 to be arranged.
  • a single recess 52 is provided.
  • the concave portion 22 for closely attaching the capacitor 11 is provided in the protruding portion 21 protruding from the substrate placement surface of the case 20H.
  • the protrusion 21 having the semi-cylindrical recess 22 has a thickness (a predetermined value larger than the radius of the capacitor 11) for placing the substantially cylindrical capacitor 11 thereon.
  • Projection on the board placement surface of case 20H Portions other than 21 may be relatively thin. In other words, it is not necessary to increase the thickness of the board arrangement surface according to the diameter of the capacitor 11 over the entire board arrangement surface of the case 20H.
  • the substrate 19 (also referred to as 19H) is provided with a through hole HL4 (see FIG. 15).
  • the capacitor 11 existing on the mounting surface side (upper surface side) of the substrate 19H passes through the through hole HL4 and reaches the back surface side (lower surface side) of the substrate 19H, and is opposite to the mounting surface of the substrate 19 (ie, the lower surface). It is arranged in contact with the recess 22 that also exists on the side).
  • the capacitor 11 passes through the through hole HL4, and is on one side (upper surface side) and the other surface side of the substrate 19.
  • the force S reduces the size of the electrical component unit 1 in the height direction and reduces the size.
  • the recess 22 of the case 20H is formed in conformity with the outer shape of the capacitor 11, similarly to the recess 52 of the fourth embodiment.
  • the substantially cylindrical capacitor 11 is arranged so that its axial direction is substantially horizontal (in short, when it is laid down), and its outer peripheral curved surface is in close contact with the recess 22. In this manner, since the capacitor 11 is in direct contact with the case 20H, high heat dissipation efficiency can be obtained.
  • the adhesion between the capacitor 11 and the recess 22 is improved by adhering the capacitor 11 to the recess 22 with an adhesive.
  • the projecting portion 21 of the case 20H has a portion formed in a step shape on both the left and right shoulders. Specifically, the protrusion 21 has a placement surface 24a and a vertical surface 24b. In other words, the protruding portion 21 is also expressed as having a protruding portion 27 that particularly protrudes on the upper surface thereof.
  • the through hole HL4 of the substrate 19H is a hole having a substantially rectangular shape with a size including the convex portion 27 when viewed from above, and the substrate 19H is in a state where the convex portion 27 penetrates the through hole HL4. Then, it is mounted on the mounting surface 24a. Further, the mounting surface 24a is provided with a female screw portion (not shown), and the board 26 is fixed to the case 20H by being screwed into the female screw portion with the bolt 26 sandwiching the board 19 therebetween. Is done.
  • the mounting surface 24a is positioned at the position of the substrate 19H in the vertical direction in FIG.
  • the vertical surface 24b of the convex portion 27 has a function of defining the position of the substrate 19H in the left-right direction of FIG.
  • the convex part 27 of the protruding part 21 penetrates the through hole HL4 of the board 19H, and the board 19H is placed at a position defined by the mounting face 24a and the vertical face 24b, whereby the board on which the capacitor 11 has been mounted.
  • the assembly work of placing 19H on the protrusion 21 can be easily performed.
  • the capacitor 11 is fixed to the concave portion 22 of the protruding portion 21 with an adhesive is illustrated, but the present invention is not limited to this, and as shown in FIG.
  • the capacitor 11 may be fixed using the holding member 56 having
  • the substrate 19 is fixed to the case 20 with the bolts 26 , but the present invention is not limited to this.
  • the substrate 19 may be fixed by using a claw portion 28 provided on the protruding portion 21.
  • the substrate 19 may be fixed to the mounting surface 24a with an adhesive GL.
  • a portion corresponding to the protruding portion 21 of the eighth embodiment may be formed of a material different from that of the case 20.
  • a portion corresponding to the protrusion 21 is formed of an aluminum heat transfer member 51C, and the case 20 formed mainly of resin and the heat transfer member are formed.
  • the 51C may be integrally formed.
  • the substrate 19 and the capacitor 11 mounted on the substrate 19 may be assembled to the integrally molded component. According to this, since it is not necessary to form the entire case 20 with the same material, it is possible to appropriately use a high heat transfer material for a portion that preferably has high heat transfer (here, the heat transfer member 51 C). Is possible.
  • the heat transfer member 51 or the protruding portion 21 is disposed across both the one surface side (upper surface side) and the other surface side (lower surface side) of the substrate 19.
  • the heat transfer member or protrusion is below the substrate 19 It exists only on the side! /
  • the capacitor 11 is illustrated as being disposed across both the one surface side (upper surface side) and the other surface side (lower surface side) of the substrate 19. / !, but is not limited to this.
  • the capacitor 11 may be disposed so as to exist only below the substrate 19.
  • the capacitor 11 and the heat transfer member 15 may be brought into close contact with an insulating material (for example, insulating paper) interposed between the capacitor 11 and the heat transfer member 15. That is, the connection between the heat transfer member 15 and the capacitor 11 should not be such that the heat transfer between the two is interrupted. It may be a thing. In other words, it is sufficient that the two are thermally connected. As long as the insulating material has thermal conductivity, it is more preferable that the insulating material is relatively high! / But has a thermal conductivity (high thermal conductive material).
  • an insulating material for example, insulating paper
  • the insulating material for example, it is preferable to employ a high thermal conductive resin. The same applies to the case where the heat transfer member 51 and the capacitor 11 are in close contact with each other, and the heat transfer member 51 and the capacitor 11 are connected with an insulating material interposed between the heat transfer member 51 and the capacitor 11. You may make it closely_contact
  • a fin or the like may be arranged in a part of the case 20 and / or the heat dissipating member 30 to increase the surface area and further improve the heat dissipating performance.
  • the heat radiating member 30 may not be provided. However, by providing the heat radiating member 30, it is possible to further improve the heat radiating efficiency as compared with the case where the heat radiating member 30 is not provided.
  • a notch portion may be provided in the peripheral edge portion of the substrate so that at least one of the heat transfer member 51, the protruding portion 21, the capacitor 11, and the like penetrates. Good.
  • each of the above-described ideas may be applied to an electrical component unit of a type (sealed type) in which an internal space is sealed, which may be applied to an open electrical component unit.
  • a sealed electrical component unit there is a strong demand for suppression of the temperature rise because the temperature rise associated with the sealing tends to be significant.

Abstract

L'unité de composant électrique (1A) selon l'invention est pourvue d'un condensateur (11) ; d'un substrat (19) permettant de monter le condensateur (11) ; d'un boîtier (20A) permettant de stocker le substrat (19) ; et d'un élément de transfert de chaleur (15A) dans lequel une partie (18A) adhère au condensateur (11) et une autre partie (16A) est connectée au boîtier (20A). De préférence, l'élément de transfert de chaleur (15A) est connecté à un élément de dissipation de chaleur (30) agencé à l'extérieur du boîtier (20A).
PCT/JP2007/066465 2006-08-28 2007-08-24 Unité de composant électrique WO2008026516A1 (fr)

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JP2006230916A JP5252793B2 (ja) 2006-08-28 2006-08-28 電装品ユニット

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JP2011091167A (ja) * 2009-10-21 2011-05-06 Yazaki Corp 発熱部品収納体
EP2837880A1 (fr) * 2012-04-09 2015-02-18 Nok Corporation Article moulé en caoutchouc rayonnant isolé
JP2019125640A (ja) * 2018-01-15 2019-07-25 富士電機株式会社 放熱用ブロックおよび電力変換装置

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JP4522458B2 (ja) * 2008-03-04 2010-08-11 トヨタ自動車株式会社 車両用暖房装置
DE102010032297A1 (de) * 2010-07-26 2012-01-26 Sew-Eurodrive Gmbh & Co. Kg Anordnung und Energiespeicher mit einer Anordnung zum Temperieren, insbesondere Kühlen, von wärmeerzeugenden Bauelementen
JP5852975B2 (ja) * 2013-03-01 2016-02-03 日立オートモティブシステムズ株式会社 電力変換装置
CN106133858B (zh) * 2014-04-01 2018-07-24 株式会社安川电机 电容器罩以及电力转换装置
DE102018216646A1 (de) * 2018-09-27 2020-04-02 Robert Bosch Gmbh Kühl- und Halteelement
JP7306279B2 (ja) 2020-01-24 2023-07-11 株式会社デンソー コンデンサモジュールおよび電力変換装置

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EP2837880A1 (fr) * 2012-04-09 2015-02-18 Nok Corporation Article moulé en caoutchouc rayonnant isolé
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JP7069733B2 (ja) 2018-01-15 2022-05-18 富士電機株式会社 放熱用ブロックおよび電力変換装置

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