WO2008026359A1 - Carte de circuit imprimé flexible - Google Patents
Carte de circuit imprimé flexible Download PDFInfo
- Publication number
- WO2008026359A1 WO2008026359A1 PCT/JP2007/061426 JP2007061426W WO2008026359A1 WO 2008026359 A1 WO2008026359 A1 WO 2008026359A1 JP 2007061426 W JP2007061426 W JP 2007061426W WO 2008026359 A1 WO2008026359 A1 WO 2008026359A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wiring board
- flexible wiring
- impedance control
- characteristic impedance
- control circuit
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
- H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09263—Meander
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09281—Layout details of a single conductor
Definitions
- the present invention relates to a flexible wiring board, and more particularly to a characteristic impedance control circuit for high-frequency signals.
- the flexible wiring board 10 is often incorporated in a small electronic device, and in particular, the cable portion is folded along a fold line indicated by a broken line and incorporated in a device. There is. In this case, the impedance control line 20 is bent at an acute angle at the bent line portion, and the characteristic impedance suddenly changes at the bent portion.
- the characteristic impedance control circuit of the high-frequency circuit formed on the flexible wiring board is a circuit (as disclosed in [Background Art] of Patent Document 1).
- the electromagnetic field distribution is distorted, causing adverse effects on circuit characteristics such as reflection and radiation, and causing other circuits to malfunction.
- Patent Document 1 As a countermeasure, it is possible to form a bent portion in the characteristic impedance control circuit as long as it is on a flat surface (Patent Document 1).
- the electromagnetic field distribution is distorted to cause signal reflection, radiation, etc., which may adversely affect circuit characteristics and cause other circuits to malfunction.
- Patent Document 1 JP 2004-363535 A
- the characteristic impedance control circuit in the high-frequency circuit exhibits the best transmission characteristics in a linear and uniform state.
- bending portions occur three-dimensionally.
- the present invention has been made in consideration of the above-described points, and a flexible wiring board having a wiring structure that can reduce impedance mismatching and reduce transmission loss even when it is three-dimensionally folded.
- the purpose is to provide.
- the present invention provides:
- the bent portion of the characteristic impedance control circuit has an arc shape so that the planar projection shape after the bending follows a tangent line.
- the characteristic impedance control circuit at the bent portion is configured so as to draw a circular arc in which the planar projection shape after bending is along the tangent line. Matching can be reduced.
- FIG. 1A and FIG. IB are explanatory views showing the configuration of Embodiment 1 of the present invention, and FIGS. 1A and 1B are views showing respective states before and after folding.
- FIG. 2A and FIG. 2B are explanatory views showing the configuration of Embodiment 2 of the present invention, and FIG. 2A and FIG. 2B are views showing respective states before and after folding.
- FIG. 3A and FIG. 3B are explanatory views showing the configuration of Embodiment 3 of the present invention, and FIG. 3A and FIG. 3B are views showing respective states before and after folding.
- FIG. 4A and FIG. 4B are explanatory views showing the configuration of Embodiment 4 of the present invention, and FIG. 4A and FIG. 4B are views showing respective states before and after folding.
- FIG. 5A and FIG. 5B are explanatory views showing the configuration of Embodiment 5 of the present invention, and FIG. 5A and FIG. 5B are views showing respective states before and after folding.
- FIG. 6 is an explanatory diagram showing the configuration of the sixth embodiment of the present invention.
- FIG. 7 is an explanatory view showing a characteristic impedance control circuit of a conventional flexible wiring board. Explanation of symbols
- FIG. 1A and 1B show a first embodiment of the present invention.
- FIG. 1A shows a state before bending
- FIG. 1B shows a state after bending.
- the flexible wiring board 10 extends linearly along substantially the center in the width direction, and the planar shape before bending at the substantially center in the longitudinal direction is S-shaped.
- a characteristic impedance control circuit having a bent portion 20A, that is, an impedance control line 20, is provided.
- the central portion of the S-shaped portion constituting the bent portion 20A is parallel to a fold line (imaginary line shown) set obliquely with respect to the flexible wiring board 10. It includes parts and is configured to intersect.
- the planar projection image of the bent portion 20A has an arc shape in which the fold line is a tangent line. is there.
- the overall planar projection image of the impedance control line 20 after the flexible wiring board 10 is bent has an arc shape at the portion in contact with the bending line, and the impedance control line is arranged in a relationship orthogonal to each other.
- the ends of the wire 20 are connected to each other by an arcuate portion.
- the connecting portion between the straight line portion and the arc-shaped portion of the impedance control line 20 is bent as smoothly as possible.
- the impedance control line 20 is moved toward one side in the width direction of the flexible wiring board 10, the size of the arc of the bent portion 20A is adjusted, or the curvature of the arc is continuously changed. That's fine.
- the arc shape includes a case of a literal circle having a single curvature, and also includes a case of continuously connecting circles having different curvatures. Since the arc is connected to the straight line portion, it goes without saying that the connecting portion has a curvature different from that of the arc.
- the flexible wiring board 10 Since the flexible wiring board 10 is folded along the folding line and overlapped, the flexible wiring board 10 is actually bent in the thickness direction, and the bent portion 20A is three-dimensionally bent. However, the bending in the thickness direction is negligible and can be virtually ignored.
- the impedance control line 20 is configured in a bent shape with little adverse effect on the characteristic impedance as a whole including the bent portion 20A.
- FIG. 2A and FIG. 2B show a second embodiment of the present invention, such that the fold line crosses the flexible wiring board 10 in the width direction so that the flexible wiring board 10 is folded back in the longitudinal direction.
- the bent portion 20A is configured as an S-shape formed by connecting substantially semicircles in opposite directions so that the planar projection shape after bending is substantially circular as shown in FIG. 1A (see FIG. 2B). It has been.
- the connecting portion between the bent portion 20A and the straight portion of the impedance control line 20 is configured to be bent smoothly. Therefore, the position of the straight line portion may be shifted to one side in the width direction of the flexible wiring board 10.
- FIG. 3A and FIG. 3B show a third embodiment of the present invention, in which the S-shape of the bent portion 20A is reduced and the straight portions on both sides of the bent portion 20A are connected to the flexible wiring board 10. They are shifted one by one in the width direction ( Figure 3A).
- the impedance control line 20 forms a planar projection shape including only one bent portion including the bent portion 20A.
- FIGS. 4A and 4B show a fourth embodiment of the present invention, in which the S-shape of the bent portion 20A is reduced, and the bending line is formed in the same manner as in the second embodiment of the flexible wiring board 10. It is set to cross the width direction at right angles.
- the bent portion 20A has a semicircular shape connecting two straight portions arranged in parallel.
- FIG. 5A and FIG. 5B show a fifth embodiment of the present invention.
- a reinforcing member is provided inside the bent portion of the flexible wiring board 10. Set 30 and bend gently.
- the degree of bending of the impedance control line 20 becomes moderate, and local stress can be prevented from concentrating on the flexible wiring board 10 and the impedance control line 20.
- FIG. 6A and FIG. 6B show a sixth embodiment of the present invention and show the configuration of the bent portion 20A when a plurality of impedance control lines 20 are arranged in parallel. .
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP07744769A EP2059100B1 (en) | 2006-08-29 | 2007-06-06 | Flexible wiring board |
US12/227,365 US8242373B2 (en) | 2006-08-29 | 2007-06-06 | Flexible wiring board with characteristic impedance control circuit |
CN2007800020840A CN101366324B (zh) | 2006-08-29 | 2007-06-06 | 柔性布线板 |
HK09107147.8A HK1129023A1 (en) | 2006-08-29 | 2009-08-04 | Flexible wiring board |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006-231801 | 2006-08-29 | ||
JP2006231801A JP4781943B2 (ja) | 2006-08-29 | 2006-08-29 | フレキシブル配線板 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2008026359A1 true WO2008026359A1 (fr) | 2008-03-06 |
Family
ID=39135646
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2007/061426 WO2008026359A1 (fr) | 2006-08-29 | 2007-06-06 | Carte de circuit imprimé flexible |
Country Status (7)
Country | Link |
---|---|
US (1) | US8242373B2 (ja) |
EP (1) | EP2059100B1 (ja) |
JP (1) | JP4781943B2 (ja) |
CN (1) | CN101366324B (ja) |
HK (1) | HK1129023A1 (ja) |
TW (1) | TWI391047B (ja) |
WO (1) | WO2008026359A1 (ja) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009289578A (ja) | 2008-05-29 | 2009-12-10 | Makita Corp | 電動工具のバッテリパック |
TW201008428A (en) * | 2008-08-05 | 2010-02-16 | Wintek Corp | Flexible printed circuit board structure |
US20100155109A1 (en) * | 2008-12-24 | 2010-06-24 | Ibiden Co., Ltd. | Flex-rigid wiring board and method for manufacturing the same |
US8840271B2 (en) | 2012-07-24 | 2014-09-23 | Abl Ip Holding Llc | In-plane bent printed circuit boards |
CN102946690A (zh) * | 2012-11-01 | 2013-02-27 | 广东欧珀移动通信有限公司 | 制备电路板的方法 |
JP6159434B1 (ja) * | 2016-03-01 | 2017-07-05 | レノボ・シンガポール・プライベート・リミテッド | インターフェースカード接続方法及びフレキシブルプリント基板 |
KR102083801B1 (ko) * | 2018-02-14 | 2020-03-03 | 퍼스트통신 주식회사 | 스트레치 라인 콤바이너 |
CN113630970B (zh) * | 2020-03-05 | 2023-04-25 | 武汉联影智融医疗科技有限公司 | 折叠式柔性可穿戴检测装置及其制作方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0186261U (ja) * | 1987-11-30 | 1989-06-07 | ||
JPH03101184A (ja) * | 1989-09-14 | 1991-04-25 | Canon Electron Inc | 磁気ディスク装置 |
JPH08213722A (ja) * | 1995-02-08 | 1996-08-20 | Alps Electric Co Ltd | フィルムキャリア |
JP2006173310A (ja) * | 2004-12-15 | 2006-06-29 | Sumitomo Bakelite Co Ltd | 回路基板 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3876964A (en) * | 1973-08-23 | 1975-04-08 | Amp Inc | Flat flexible transmission cable |
JPS6486261A (en) | 1987-09-29 | 1989-03-30 | Nec Corp | Memory circuit |
US5262590A (en) * | 1992-04-27 | 1993-11-16 | Sheldahl, Inc. | Impedance controlled flexible circuits with fold-over shields |
US6590466B2 (en) * | 1998-08-31 | 2003-07-08 | Advanced Flexible Circuit Co., Ltd. | Circuit board having shielding planes with varied void opening patterns for controlling the impedance and the transmission time of differential transmission lines |
JP2002204042A (ja) * | 2000-12-28 | 2002-07-19 | Fujikura Ltd | フレキシブルプリント回路 |
US20020189854A1 (en) * | 2001-04-10 | 2002-12-19 | Crumly William R. | Design for long fatigue life in flexible circuits |
US6483713B2 (en) * | 2001-11-20 | 2002-11-19 | St. Jude Children's Research Hospital | Multilayered board comprising folded flexible circuits |
JP4391717B2 (ja) * | 2002-01-09 | 2009-12-24 | 富士通マイクロエレクトロニクス株式会社 | コンタクタ及びその製造方法並びにコンタクト方法 |
US7145411B1 (en) * | 2002-03-18 | 2006-12-05 | Applied Micro Circuits Corporation | Flexible differential interconnect cable with isolated high frequency electrical transmission line |
US6885549B2 (en) * | 2002-04-11 | 2005-04-26 | Dell Products L.P. | System and method for flexible circuits |
JP2004363535A (ja) * | 2003-05-14 | 2004-12-24 | Yazaki Corp | 信号伝送線路及びその設計方法 |
US7531752B2 (en) * | 2003-07-24 | 2009-05-12 | Nec Corporation | Flexible substrate and electronic device |
KR100603761B1 (ko) * | 2004-04-22 | 2006-07-24 | 삼성전자주식회사 | 마이크로웨이브 트랜스폰더 |
TWI246237B (en) * | 2005-02-02 | 2005-12-21 | Benq Corp | Flexible flat cable assembly and electronic device utilizing the same |
KR101124862B1 (ko) * | 2005-07-04 | 2012-03-27 | 엘지전자 주식회사 | 휴대용 단말기와 이에 내장되는 연성회로기판의 커넥터설치 구조 및 방법 |
JP4886603B2 (ja) * | 2007-05-31 | 2012-02-29 | 日東電工株式会社 | プリント配線基板 |
-
2006
- 2006-08-29 JP JP2006231801A patent/JP4781943B2/ja active Active
-
2007
- 2007-06-06 CN CN2007800020840A patent/CN101366324B/zh not_active Expired - Fee Related
- 2007-06-06 US US12/227,365 patent/US8242373B2/en active Active
- 2007-06-06 EP EP07744769A patent/EP2059100B1/en not_active Expired - Fee Related
- 2007-06-06 WO PCT/JP2007/061426 patent/WO2008026359A1/ja active Application Filing
- 2007-08-02 TW TW096128450A patent/TWI391047B/zh active
-
2009
- 2009-08-04 HK HK09107147.8A patent/HK1129023A1/xx not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0186261U (ja) * | 1987-11-30 | 1989-06-07 | ||
JPH03101184A (ja) * | 1989-09-14 | 1991-04-25 | Canon Electron Inc | 磁気ディスク装置 |
JPH08213722A (ja) * | 1995-02-08 | 1996-08-20 | Alps Electric Co Ltd | フィルムキャリア |
JP2006173310A (ja) * | 2004-12-15 | 2006-06-29 | Sumitomo Bakelite Co Ltd | 回路基板 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2059100A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP2059100A4 (en) | 2010-07-21 |
CN101366324A (zh) | 2009-02-11 |
EP2059100A1 (en) | 2009-05-13 |
EP2059100B1 (en) | 2011-09-28 |
HK1129023A1 (en) | 2009-11-13 |
JP2008060114A (ja) | 2008-03-13 |
JP4781943B2 (ja) | 2011-09-28 |
CN101366324B (zh) | 2011-01-05 |
TWI391047B (zh) | 2013-03-21 |
TW200830954A (en) | 2008-07-16 |
US20090236126A1 (en) | 2009-09-24 |
US8242373B2 (en) | 2012-08-14 |
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