Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
  • B29C66/72—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined
  • B29C66/723—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the structure of the material of the parts to be joined being multi-layered
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/80—General aspects of machine operations or constructions and parts thereof
  • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
  • B29C66/836—Moving relative to and tangentially to the parts to be joined, e.g. transversely to the displacement of the parts to be joined, e.g. using a X-Y table
  • B29C66/8362—Rollers, cylinders or drums moving relative to and tangentially to the parts to be joined
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/90—Measuring or controlling the joining process
  • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
  • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
  • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/90—Measuring or controlling the joining process
  • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
  • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
  • B29C66/9141—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature
  • B29C66/91421—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the temperature of the joining tools
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/90—Measuring or controlling the joining process
  • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
  • B29C66/914—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux
  • B29C66/9161—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux
  • B29C66/91641—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time
  • B29C66/91643—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile
  • B29C66/91645—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux by controlling or regulating the temperature, the heat or the thermal flux by controlling or regulating the heat or the thermal flux, i.e. the heat flux the heat or the thermal flux being non-constant over time following a heat-time profile by steps
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/90—Measuring or controlling the joining process
  • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
  • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
  • B29C66/9241—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force or the mechanical power
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/90—Measuring or controlling the joining process
  • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
  • B29C66/929—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools characterized by specific pressure, force, mechanical power or displacement values or ranges
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/90—Measuring or controlling the joining process
  • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
  • B29C66/934—Measuring or controlling the joining process by measuring or controlling the speed by controlling or regulating the speed
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/90—Measuring or controlling the joining process
  • B29C66/93—Measuring or controlling the joining process by measuring or controlling the speed
  • B29C66/939—Measuring or controlling the joining process by measuring or controlling the speed characterised by specific speed values or ranges
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
  • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
  • B32B27/24—Layered products comprising a layer of synthetic resin characterised by the use of special additives using solvents or swelling agents
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
  • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
  • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
  • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
  • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
  • B32B37/0023—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality around holes, apertures or channels present in at least one layer
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
  • B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/04—Interconnection of layers
  • B32B7/06—Interconnection of layers permitting easy separation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
  • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
  • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
  • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
  • B41J2/01—Ink jet
  • B41J2/135—Nozzles
  • B41J2/16—Production of nozzles
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
  • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
  • G03F7/004—Photosensitive materials
  • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
  • B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
  • B29C65/18—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
  • B29C65/78—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus
  • B29C65/7858—Means for handling the parts to be joined, e.g. for making containers or hollow articles, e.g. means for handling sheets, plates, web-like materials, tubular articles, hollow articles or elements to be joined therewith; Means for discharging the joined articles from the joining apparatus characterised by the feeding movement of the parts to be joined
  • B29C65/7888—Means for handling of moving sheets or webs
  • B29C65/7894—Means for handling of moving sheets or webs of continuously moving sheets or webs
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
  • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
  • B29C66/472—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially flat
  • B29C66/4722—Fixing strips to surfaces other than edge faces
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
  • B29C66/47—Joining single elements to sheets, plates or other substantially flat surfaces
  • B29C66/474—Joining single elements to sheets, plates or other substantially flat surfaces said single elements being substantially non-flat
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
  • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
  • B29C66/00—General aspects of processes or apparatus for joining preformed parts
  • B29C66/90—Measuring or controlling the joining process
  • B29C66/91—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux
  • B29C66/919—Measuring or controlling the joining process by measuring or controlling the temperature, the heat or the thermal flux characterised by specific temperature, heat or thermal flux values or ranges
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
  • B29L2016/00—Articles with corrugations or pleats
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
  • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
  • B29L2031/00—Other particular articles
  • B29L2031/767—Printing equipment or accessories therefor
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2250/00—Layers arrangement
  • B32B2250/24—All layers being polymeric
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/30—Properties of the layers or laminate having particular thermal properties
  • B32B2307/308—Heat stability
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/70—Other properties
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/70—Other properties
  • B32B2307/732—Dimensional properties
  • B32B2307/734—Dimensional stability
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B2307/00—Properties of the layers or laminate
  • B32B2307/70—Other properties
  • B32B2307/748—Releasability
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
  • Y10T156/10—Methods of surface bonding and/or assembly therefor
  • Y10T156/1002—Methods of surface bonding and/or assembly therefor with permanent bending or reshaping or surface deformation of self sustaining lamina
  • Y10T156/1043—Subsequent to assembly

Definitions

• the present invention covers a method for forming a precise fine space formed by laying a film on a substrate having a precision fine recess, a method for producing a member having a precision fine space, and a substrate having a precision fine recess.
• the uppermost surface of the stage covering the outer periphery of the substrate is made higher than the uppermost surface of the stage on which the substrate is placed, and a precise fine space in which a film is laid on the substrate.
• Forming method forming method of precise fine space in which base material and film are in contact with each other, and laying while maintaining constant pressure per unit contact area of contact portion, manufacturing method of member having precision fine space, and precision
• the present invention relates to a photosensitive laminated film that is laid on a base material having fine concave portions and serves as a top plate portion.
• Patent Document 1 discloses a method for forming a continuous fine fine space of an ink pool that supplies ink to an ink pressure chamber, and includes a side wall of each space. Discloses a method of forming a precise fine space by laminating a plurality of plate-like members having large and small holes to form a layer and integrating them with an adhesive.
• Patent Document 2 a metal layer is formed on a resin film, the metal layer is intermittently removed using sandblasting and etching treatment, and a plate is formed so as to surround the obtained recess.
• a method for forming an ink pressure chamber by bonding members is disclosed.
• Patent Document 1 Japanese Patent Laid-Open No. 2001-63052
• Patent Document 2 Japanese Patent Laid-Open No. 11-342607
• the conventional method for forming a precise fine space has a problem that the number of parts to be used is large and the manufacturing accuracy is strict, which increases the number of manufacturing steps.
• the selectivity of the materials used is narrow, and as a result, it has been difficult to improve production efficiency and reduce production costs.
• the present invention provides a method for forming a precision fine space in which the shape and volume of the precision fine space are constant, a method for manufacturing a member having the precision fine space, and the top of the precision fine recess. It aims at providing the photosensitive laminated
• the inventors of the present invention have made extensive studies in order to solve the above problems.
• the uppermost surface of the second stage covering the outer periphery of the first stage on which the substrate is placed is made higher than the uppermost surface of the first stage, or the unit of the contact portion where the substrate and the film are in contact with each other. It has been found that by making the pressure per contact area constant, the film does not enter the fine fine recesses, and the present invention has been completed. More specifically, the present invention provides the following.
• a first aspect of the present invention is a method for forming a precision fine space having a step of laying a film on a substrate having a precision fine recess, and the substrate is placed on the first stage, A step of setting the uppermost surface of the second stage covering the outer periphery of the first stage to be higher than the uppermost surface of the first stage, and a step of laying a film on the substrate.
• This is a method for forming a precise fine space.
• base material having precision fine recesses refers to a base material on which at least one precision fine recess is formed on the surface.
• the step of laying the film includes: This is a method for forming a precise fine space, characterized in that it is a step of laying while maintaining a constant pressure per unit contact area of a contact portion in contact with.
• the substrate and the film are in contact with each other!
• the pressure per unit contact area of the contact part By laying while controlling the pressure per unit contact area of the contact part to be constant, the shape and volume of the precise fine space at the periphery of the substrate and the precise fine space at the center of the substrate are constant. To do Can do.
• pressure per unit contact area means that when a base material and a film are brought into contact with each other in order to lay a film on a substrate, the pressure exerted on the contact portion is brought into direct contact with the film. The pressure divided by the area of the contact area is!
• a third aspect of the present invention is a film used in the above-described method for forming a precise fine space, wherein the photosensitive composition layer is formed by laminating a photosensitive composition layer and a support film. It is a laminated film.
• a fourth aspect of the present invention is a method for producing a member having a precision fine space having a step of laying a film on a substrate having a precision fine recess, and the base material is mounted on the first stage.
• a slack of the film can be prevented when a film is laid on a substrate, and a member having a precise fine space having a certain shape and volume is produced. can do.
• the film is laid out in a method for producing a member having a precision fine space having a step of laying a film on a substrate having a precision fine recess.
• Manufacturing a member having a precise fine space characterized in that the step is a step of laying while maintaining a constant pressure per unit contact area of a contact portion where the substrate and the film come into contact with each other Is the method.
• the shape and volume of the fine fine space in the peripheral portion of the base material and the fine fine space in the central portion of the base material can be made constant.
• the uppermost surface of the second stage is made higher than the uppermost surface of the first stage.
• the precision obtained from the precision micro-recesses at the center and the peripheral micro-recesses is obtained.
• the shape and volume of the fine space can be controlled to be constant. As a result, a precise fine space having a constant shape and volume can be efficiently formed, and a member having a precise fine space having a constant shape and volume can be efficiently produced.
• a top plate portion with excellent dimensional accuracy by laying a photosensitive laminated film on a substrate and then photocuring it.
• a photosensitive laminated film as the top plate, it is possible to easily form a highly precise, fine space with high sensitivity, small volume shrinkage during heat curing, good dimensional stability. I was able to do it.
• FIG. 1 is a diagram showing the shape of a precise fine space.
• FIG. 2A is a cross-sectional view of a process of laying while pressing a film so as to cover a precision fine recess.
• FIG. 2B is a plan view of a process of laying a film while pressing the film so as to cover a precision fine recess.
• FIG. 3A is a cross-sectional view of a process of laying a film while pressing a film so as to cover a precision fine recess when there is no second stage.
• FIG. 3B is a plan view of a process of laying a film while pressing the film so as to cover a precision fine recess when there is no second stage.
• FIG. 4 is a diagram showing the overall flow of a process of laying a film while pressing the film so as to cover a precision fine recess.
• FIG. 5 is a three-dimensional view of a first stage and a second stage used in the method for forming a precision fine space and the method for producing a member having a precision fine space according to the present invention.
• FIG. 6 is a cross-sectional view taken along the line AA ′ of FIG.
• FIG. 7 is a diagram showing a state where the contact portion is laid while moving on the base material and the film. Explanation of symbols
• the first embodiment of the present invention is the uppermost surface of the second stage 2 covering the outer periphery of the first stage 1 on which the substrate 4 having the precision fine recesses 41 is placed. Is set to be higher than the uppermost surface of the first stage 1, and then the photosensitive laminated film 5 is laid on the base material 4 by the contact member 3.
• the film 5 sags on the base material 4, and the shape and volume of the precision micro-space obtained from the precision micro-cavity 41 in the base material 4 cannot be controlled uniformly. In other words, the problem that the shape and volume of a plurality of precise minute spaces cannot be made constant can be solved.
• the second embodiment of the present invention is characterized in that the pressure per unit contact area of the contact portion where the substrate 4 and the film 5 come into contact with each other is controlled to be constant.
• the film is a photosensitive laminated film. Even when a film other than the photosensitive laminated film is used, the present invention can be implemented by the same manufacturing method and forming method, and the gist of the invention is not limited.
• FIG. 4 is a diagram showing the overall flow of the method for forming a precision fine space and the method for producing a member having a precision fine space according to the present invention.
• the first embodiment and the second embodiment of the present invention will be described separately.
• the base material 4 having the precision fine recess 41 is placed on the first stage 1, and the second stage 2 covering the outer periphery of the first stage 1 has the uppermost surface of the second stage 2 as the first surface. It is adjusted to be higher than the top surface of stage 1.
• the photosensitive composition layer 52 in the photosensitive laminated film 5 becomes a top plate portion of the precision fine recess 41, and the photosensitive laminated film 5 is a photosensitive composition layer 52 and a supporting film that supports the photosensitive composition layer 52. 51 and a protective film 53 for protecting the photosensitive composition layer 52 are laminated.
• a contact member 3 for laying the photosensitive laminated film 5 on the substrate 4 is provided on the first stage 1. In order to lay the photosensitive laminated film 5 on the base material 4, press it with the contact member 3 as necessary.
• the precision fine recesses 41 formed on the substrate 4 can be formed by using a known method as appropriate according to the purpose of use, etc. High sensitivity and small volume shrinkage during heat curing In order to form a precise fine space with high accuracy, it is preferable to form the precise fine recess 41 by a photoresist pattern.
• the height (depth) of the precision fine recess 41 is not particularly limited, but the shape or the like that is preferably 0.1 m to lmm is not particularly limited. Further, the precision fine recess 41 is a recess having a force width of 1 mm or less and a depth of 1 mm or less that can be appropriately changed according to the purpose of use.
• a member having a precise fine space is mainly formed in an electronic component, for example, a liquid discharge head such as a SAW filter, an ink jet head, a resist droplet discharge head, a DNA droplet discharge head, a micro pump, It can be used for micro optical arrays, micro switches, microphone port relays, optical switches, micro flow meters, pressure sensors, etc.
• the photosensitive composition layer 52 is exposed by peeling off the protective film 53 that protects the photosensitive composition layer 52 in the middle.
• the photosensitive laminated film 5 is placed on the uppermost surface of the second stage 2 that is adjusted to be higher than the uppermost surface of the first stage 1, and the photosensitive laminated film 5 is laid on the base material 4 with the contact member 3, and photosensitive.
• the conductive laminated film 5 is laid on the substrate 4.
• the shape of the contact member 3 is not particularly limited as long as the photosensitive laminated film 5 can be laid on the substrate 4, but it is preferable to use a roller from the viewpoint of work efficiency and the like.
• FIG. 5 is a three-dimensional view of the first stage 1 and the second stage 2 used in the method for forming a precision fine space and the method for producing a member having the precision fine space of the present invention.
• the stage used in the present invention includes a first stage 1 on which the base material 4 is placed and a second stage 2 which is installed so as to cover the outer periphery of the first stage 1.
• the materials of the first stage 1 and the second stage 2 are not particularly limited, and the materials of the first stage 1 and the second stage 2 may be different. Further, the shape of the first stage 1 is circular in FIG. 1, but may be changed as appropriate depending on the shape of the base material 4 such as a square or a diamond.
• FIG. 6 is a cross-sectional view taken along the line AA ′ of FIG. As shown in Fig. 6, adjust so that the top surface of the second stage 2 is higher than the top surface of the first stage 1.
• the method for adjusting the uppermost surface of the second stage 2 to be higher than the uppermost surface of the first stage 1 is appropriately changed according to the purpose of use.For example, the first stage 1 or the second stage 2 is changed. Examples include a method of moving up and down in the vertical direction and a method of providing a gap member or the like on the second stage 2 so that the uppermost surface of the second stage 2 is higher than the uppermost surface of the first stage 1.
• the first stage 1 or the second stage 2 is moved up and down by fixing the first stage 1 and only the second stage 2 is moved up and down, and the second stage 2 is fixed.
• the height of the uppermost surface of the second stage 2 is 0.1 ⁇ m or higher and is higher than the uppermost surface of the first stage 1.
• the photosensitive laminated film 5 is laid on the substrate 4.
• the pressure for laying the photosensitive laminated film 5 on the substrate 4 with the contact member 3 is 0 to obtain a member having a precision fine space and a precision fine space as shown in FIG. 1 ⁇ It is preferable to be set to IMPa 0.3 to 0.6MPa is more preferable. By setting this pressure to 0. IMPa or more, as shown in FIG. 1 (A), it is possible to prevent a precise fine space from being formed due to insufficient adhesion between the substrate 4 and the light-sensitive laminated film 5. Can do. On the other hand, by setting this pressure to IMPa or less, it is possible to prevent the photosensitive laminated film 5 from entering the precise fine space as shown in FIG. 1 (C).
• the moving speed of the contact member 3 when laying the photosensitive laminated film 5 on the base material 4 can be appropriately changed according to the number of the precision fine recesses 41 included in the base material 4. It is preferably 1 to 5 mZmin. By setting the moving speed of the contact member 3 to 0.1 lmZmin or more, it is possible to prevent the photosensitive laminated film 5 from entering the precise fine space as shown in FIG. The shape and volume of the 41 spaces can be made constant. On the other hand, by setting the moving speed of the contact member 3 to lmZmin or less, as shown in FIG. 1 (A), it is possible to prevent a precise fine space from being formed due to insufficient adhesion between the substrate 4 and the photosensitive laminated film 5. The volume of the space of the plurality of precision fine recesses 41 can be made constant.
• the temperature of the contact member 3 (roller temperature) and the temperature of the first stage 1 when the photosensitive laminated film 5 is laid on the substrate 4 depend on the number of precision fine recesses 41 on the substrate 4 and the like.
• the force that can be appropriately changed is preferably 20 to 80 ° C.
• each temperature By setting each temperature to 20 ° C or higher, as shown in Fig. 1 (A), it is possible to prevent a precise fine space from being formed due to insufficient adhesion between the substrate 4 and the photosensitive laminated film 5.
• the shape and volume of the space of the plurality of precision fine recesses 41 can be made constant.
• by setting each temperature to 80 ° C or less it is possible to prevent the photosensitive laminated film 5 from entering the precise fine space as shown in FIG. 41 spaces
• the volume can be made constant.
• the photosensitive laminated film 5 is laid on the base material 4 by the contact member 3, it is brought into close contact with the base material 4, and the excess photosensitive laminated film 5 is cut off.
• the substrate 4 on which the photosensitive laminated film 5 adheres is taken out from the first stage 1, and the photosensitive composition layer 52 is exposed through the support film 51 and then subjected to heat treatment, so that the photosensitive composition layer 52 is exposed. Is cured.
• the support film 51 is peeled off from the cured photosensitive composition layer 52, and the cured photosensitive composition layer 52 is subjected to main heating by reheating, and a top plate portion is formed on the precision fine recess 41. , To form a precise fine space.
• the curing temperature for curing the photosensitive composition layer 52, the heating temperature for heat treatment, and the like can be appropriately changed according to the substance used for the photosensitive composition layer 52 and the like.
• the step of heat-treating and curing the photosensitive composition layer 52 can be omitted as necessary.
• the base material 4 having the precision fine recess 41 is placed on the first stage 1.
• the photosensitive composition layer 52 in the photosensitive laminated film 5 serves as a top plate portion of the precision fine recess 41, and the photosensitive laminated film 5 is composed of the photosensitive composition layer 52 and the supporting film that supports the photosensitive composition layer 52. 51 and a protective film 53 for protecting the photosensitive composition layer 52 are laminated.
• a contact member 3 for laying a photosensitive laminated film 5 on a substrate 4 is provided on the first stage 1. In order to lay the photosensitive laminated film 5 on the substrate 4, it may be pressed by the contact member 3 if necessary!
• the method for forming the precision fine recess 41 formed in the substrate 4 and the height (depth) of the precision fine recess 41 can be the same as those in the first embodiment.
• FIG. 7 is a diagram showing a state in which the photosensitive laminated film 5 is laid on the base material 4 while the contact member 3 moves on the base material 4 and the photosensitive laminated film 5 while applying pressure. is there.
• the contact member 3 is moved from the point (starting point) where the contact portion between the base material 4 and the photosensitive laminated film 5 (not shown) starts to start to the center of the base material 4,
• the pressure is constant, the pressure per unit contact area of the contact portion gradually coming into contact with the photosensitive laminated film 5 becomes smaller. That is, when the contact portion reaches the center of the substrate 4, the photosensitive laminated film 5
• the pressure per unit contact area of the contact part in contact is minimized. Accordingly, if the pressure at the contact portion is gradually increased from the starting point to the center portion, the pressure per unit contact area of the contact portion in contact with the photosensitive laminated film 5 can be controlled to be constant.
• the contact portion when the contact portion reaches the center of the base material 4 and is moved to a point (end point) where the laying of the photosensitive laminated film 5 is finished on the base material 4, when the pressure of the contact portion is constant, Gradually, the pressure per unit contact area of the contact portion in contact with the substrate 4 and the photosensitive laminated film 5 increases. That is, when the contact portion reaches the end point of the substrate 4, the pressure per unit contact area of the contact portion in contact with the photosensitive laminated film 5 becomes maximum. Therefore, the pressure per unit contact area of the contact portion in contact with the photosensitive laminated film 5 can be controlled to be constant by gradually reducing the pressure at the contact portion toward the end point of the central force.
• FIG. 7 illustrates the case where the base material 4 has a circular shape, but the base material 4 is not limited to the circular shape, and gradually moves from the starting point toward the center. Increase the pressure per unit contact area of the contact part that is in contact with the base material 4 and the photosensitive laminated film 5 and gradually contact the base material 4 and the photosensitive laminated film 5 toward the end point of the central force. The pressure per unit contact area of the contact portion may be reduced.
• the pressure per unit contact area of the contact portion is such that a precision fine space and a member having the precision fine space as shown in FIG. 1 (B) are obtained.
• 0.1 to: LMPaZcm 2 is preferable.
• 0.3 to 0.6 MPaZcm 2 is more preferable.
• the moving speed of the contact member 3 when the photosensitive laminated film 5 is laid on the substrate 4, the temperature of the contact member 3 (roller temperature), and the temperature of the first stage 1 are the above-mentioned first modes. Can be similar.
• the excess photosensitive laminated film 5 that is not in close contact with the substrate 4 is cut out in the same manner as in the first embodiment described above. .
• the substrate 4 to which the photosensitive laminated film 5 is adhered is taken out from the first stage 1 and exposed to the photosensitive composition layer 52 through the support film 51, and then subjected to heat treatment, and the photosensitive composition layer 52 is exposed. Is cured.
• the support film 51 is peeled off from the cured photosensitive composition layer 52, the cured photosensitive composition layer 52 is re-heated to be fully cured, and a top plate portion is formed on the precision fine recess 41, A precise fine space is formed.
• the curing temperature at which the photosensitive composition layer 52 is cured, the heating temperature at which heat treatment is performed, and the like can be appropriately changed according to the substance used for the photosensitive composition layer 52 and the like.
• the process of heat-treating and curing the photosensitive composition layer 52 can be omitted as necessary.
• the photosensitive composition layer 52 becomes a top plate portion of the precision fine recesses 41, and more preferably, the photosensitive composition layer 52 is exposed, cured, etc.
• a member having a precision fine space with excellent dimensional accuracy can be manufactured.
• the photosensitive laminated film 5 used in the present invention may be laminated in the order of the support film 51, the photosensitive composition layer 52, and the protective film 53.
• the protective film 53 various known films such as a polyethylene terephthalate film, a polypropylene film, and a polyethylene film can be used, and these may be used alone or in combination.
• the protective film 53 may not be laminated as necessary.
• the photosensitive composition constituting the photosensitive composition layer 52 is preferably a chemically amplified negative photosensitive resin composition.
• the photosensitive resin composition constituting the photosensitive composition layer 52 preferably used for the photosensitive laminated film 5 of the present invention comprises a polyfunctional epoxy resin and a cationic polymerization initiator.
• U which is preferably a photosensitive resin composition.
• 8-functional bisphenol A novolac-type epoxy resin manufactured by Yuka Shell Epoxy, trade name: Epicoat 157S70
• 4 ⁇ 4 one (2 black mouth benzoyl) felts A combination with phenenolebis (4-funoleololophenolole) sulfo-hexafluoroantimonate (Asahi Denki Kogyo Co., Ltd., trade name: Adekaobomer SP-172) is most preferred.
• the cationic polymerization initiator has a high cation generation efficiency upon irradiation with radiation, the sensitivity of the photosensitive composition layer 52 can be improved by combining it with a polyfunctional epoxy resin that should be contained in a relatively small amount. Can be greatly increased.
• the cationic polymerization initiator is a multifunctional epoxy resin that can efficiently attack the epoxy group in the molecule of the multifunctional epoxy resin, in particular, the multifunctional bisphenol A novolac type epoxy resin to advance the polymerization. Because of its unique compatibility, it has an excellent effect. Furthermore, this combination has the effect of reducing volume shrinkage of the photosensitive composition layer 52 during heat curing.
• the photosensitive composition layer 52 using such a photosensitive resin composition is used, a top plate portion of a precise fine space with excellent dimensional accuracy can be formed, and a certain shape can be formed.
• the cationic polymerization initiator contained in the photosensitive composition layer 52 generates a cation upon irradiation with excimer lasers such as ultraviolet rays, far ultraviolet rays, KrF and ArF, X-rays, and electron rays.
• the cation is a compound that can serve as a polymerization initiator.
• aromatic diazo-um salt, aromatic sulfo- salt, aromatic iodine salt, meta-octane compound, aromatic phospho- It is at least one selected from um salt, silanol and aluminum complex strength, and these may be used alone or in combination.
• cationic polymerization initiator more specifically, as an aromatic sulfone salt-based cationic polymerization initiator, for example, 4- (4-benzoyl thiol) ferrodisulfur hex hexane Fluoroantimonate, 4- (4-benzoylphenylthio) phenol bis (4-hydroxyethyloxyphenyl) sulfo-hexafluoroantimonate, 4- (4-benzoylphenolthiol) ) Ferbis (4-fluorophenyl) sulfohexafluoroantimonate, 4- (4-benzoyl-ferthio) phenolbis ( 4—Chromatic mouth) sulfo-hexafluoroantimonate, 4— ⁇ 4— (3--Benzoyl) phenol thio ⁇ phenol bis (4-fluorophenyl) sulfo-um Hexafluoroantimonate, 4- (4-benzoylphenol)
• Examples of the cationic polymerization initiators based on iodonium salts include diphenyl rhododonium hexafnoreo oral phosphate, diphenylo rhodium hexafnoreo oral antimonate, diphenyl rhododonium tetrafunoleoroborate, diphenyl leuco Donum tetrakis (pentafluorophenol) borate, bis (dodecylphenol) odo-umhexafluorophosphate, bis (dodecylphenol) odo-umhexafluoroantimonate, bis (dodecylphenol) -Le) Jodonium tetrafluoroborate, bis (dodecylsulfol) borate, 4-methylphenyl 4-borate (1-methylinoethyl) Rheod-um Hexafnoreo Mouth Phosphat
• diazonium salt-based cationic polymerization initiator examples include phenyl diazonium hexafluorophosphate, phenol diazo hexafluoroantimonate, and phenol diazo.
• phenyl diazonium hexafluorophosphate examples include phenyl diazonium hexafluorophosphate, phenol diazo hexafluoroantimonate, and phenol diazo.
• -Um tetrafluoroborate, ferrodiazonium tetrakis (pentafluorobenzoyl) borate, etc. may be mentioned, and these may be used alone or in combination.
• composition ratio of the cationic polymerization initiator in the photosensitive composition layer 52 is too high, development of the photosensitive composition layer 52 becomes difficult. Conversely, when the composition ratio is too low, the photosensitive composition layer 52 is photosensitive. The curing time of the composition layer 52 by radiation exposure is increased. Considering these, the composition ratio of the cationic polymerization initiator is preferably 0.1% to 10%, more preferably 0.5% to 5%.
• the photosensitive resin composition constituting the photosensitive composition layer 52 may further contain a polymer linear bifunctional epoxy resin for improving film formability.
• the photosensitive resin composition constituting the photosensitive composition layer 52 may further contain a naphthol type sensitizer.
• a naphthol type sensitizer When the sensitivity is high, if there is a gap between the mask and the resist surface, as a result of exposure, the resulting resin pattern will be thicker than the mask dimension. Therefore, this fat phenomenon can be suppressed without lowering the sensitivity.
• the addition of the naphthol type sensitizer in this way is preferable because an error in the resist pattern dimension with respect to the mask pattern dimension can be suppressed.
• Examples of the naphthol type sensitizer include 1 naphthol, 13 naphthol, a naphthol methyl ether, ⁇ -naphthol ether, and the like, from the viewpoint of the effect of suppressing the resist thickness without lowering the sensitivity.
• 1 Naphthol is preferably used.
• composition ratio of the naphthol type sensitizer in the photosensitive composition layer 52 is too high, it is not preferable because it becomes a reverse taper shape and the line width becomes too thin. Considering these, naphtho
• the composition ratio of the sensitizer is preferably 0 to 10%, more preferably 0.1 to 3%.
• the photosensitive resin composition constituting the photosensitive composition layer 52 may further contain a solvent.
• the sensitivity of the photosensitive composition layer 52 can be increased by containing a solvent.
• solvents include propylene glycol monomethyl ether acetate (hereinafter referred to as “PGMEA”), methyl isobutyl ketone (hereinafter referred to as “MIBK”), butylacetate, methyl amyl ketone (2-heptanone), Examples thereof include ethyl acetate and methyl ethyl ketone (hereinafter referred to as “MEK”), and these may be used alone or in combination.
• PGMEA propylene glycol monomethyl ether acetate
• MIBK methyl isobutyl ketone
• MEK methyl amyl ketone
• the photosensitive resin composition constituting the photosensitive composition layer 52 may further contain an oxetane derivative and an epoxy derivative.
• an oxetane derivative or an epoxy derivative When formed into a dry film, by containing an oxetane derivative or an epoxy derivative, the flexibility of the photosensitive composition layer 52 before curing can be increased without lowering the physical properties of the photosensitive composition layer 52 after curing. .
• Such an oxetane derivative is not particularly limited, and examples thereof include 3-ethyl-3-hydroxymethyloxetane, 1,4bis [[((3 ethyl-3-oxeta-l) methoxy] methyl] benzene, di [1 ethyl (3 —Oxetal)] methyl ether and the like, and a plurality of these may be used in combination.
• examples of such epoxy derivatives include bisphenol A type epoxy resins and bisphenol F type epoxy resins having an average molecular weight of 7000 or less, preferably 2000 or less, more preferably 1000 or less. Specific examples include bisphenol A type epoxy resin (“Epicoat 828” average molecular weight 380 manufactured by Japan Epoxy Resin Co., Ltd.).
• the photosensitive composition layer 52 used in the photosensitive laminated film 5 of the present invention may further include, if desired, miscible additives, such as an adhesive resin or plastic for improving pattern performance. It is possible to appropriately add known ingredients such as an agent, a stabilizer, a colorant, and a surfactant as required.
• the thickness of the photosensitive composition layer 52 can be appropriately changed depending on the purpose of use, etc., but is preferably 2 to 500 ⁇ m, more preferably 5 to 200 ⁇ m. .
• the photosensitive composition layer 52 is formed into a dry film shape in which both surfaces are protected by a resin film, and a desired precision fine pattern is formed before pattern exposure. You may make it affix on the base material 4 which has the recessed part 41. FIG.
• the support film 51 supports the photosensitive composition layer 52 before the photosensitive composition layer 52 is completely exposed until it is completely cured. That is, deformation of the photosensitive composition layer 52 is prevented. Therefore, it is necessary to have a predetermined heat shrinkage rate, a predetermined thickness, and a predetermined haze value.
• the support film 51 it is preferable to use a resin film having a longitudinal shrinkage ratio of 0.01 to 1% when heated at 100 ° C for 30 minutes. It is more preferable to use a resin film having a shrinkage rate of less than or less than 3% in longitudinal shrinkage by heating at 200 ° C for 10 minutes. In addition, by setting the vertical shrinkage ratio to 0.01 to 1% or more, the deformation of the photosensitive composition layer 52 can be prevented.
• the thickness is preferably 6 to 350 / ⁇ ⁇ . 10 to more preferably LOO m. Furthermore, a haze value of 0.1 to 5 is preferable, and 0.1 to 3 (at a film thickness of 30 m) is more preferable.
• polyethylene terephthalate is preferable as the material of the support film 51, and polyethylene, polypropylene, and the like can also be used.
• the support film 51 should be demolded so that it can be easily peeled off if necessary!
• the photosensitive laminated film 5 having the photosensitive composition layer 52 is laid on the substrate 4 having the desired precision fine recesses 41, and the photosensitive composition layer 52 that does not peel off the supporting film 51 is patterned with radiation. After the exposure and the application of heat to accelerate the curing, the support film 51 is peeled off and developed with a developing solution. It can be formed without depending on the shape of the substrate 4. As a result, a precise fine space having a constant shape and volume can be formed, and a member having a precise fine space having a constant shape and volume can be manufactured.
• the method for forming a precise fine space and the method for producing a member having a precise fine space according to the present invention may be realized by executing a program prepared in advance on a computer such as a personal computer.
• This program may be recorded on a computer-readable recording medium such as a hard disk, CD-ROM, or DVD, and may be executed by reading the recording medium strength by the computer.
• the photosensitive composition layer was prepared by dissolving and mixing 100 parts by weight of epoxy resin (JER157S70 Japan Epoxy Resin) and 3 parts by weight of acid generator (ADEKA OPTMER SP172 ADEKA) in PGMEA. Got.
• the photosensitive composition layer 52 has a thickness of ⁇ 3 ⁇ 430 ⁇ m.
• a polyethylene terephthalate film with a release agent (Purex A53 made by Teijin DuPont Films), and uniformly coats the photosensitive composition layer 52 produced as described above on a support film 51 having a film thickness of 50 / zm, It was dried at 65 ° C for 5 minutes and at 80 ° C for 5 minutes by a hot air convection dryer. Thereafter, a protective film 53 having a film thickness of 25 ⁇ m, which also has a force of polyethylene terephthalate film with a release agent (Purex A31 made by Teijin DuPont Films), is laminated on the photosensitive composition layer 52 to form a photosensitive laminated film 5. Formed.
• a base material 4 having precision fine recesses 41 formed by a photoresist pattern is placed on the first stage 1, the second stage 2 covering the outer periphery of the first stage 1 is moved up and down, and the second stage 2 is The top surface was adjusted to be 0.1 m higher than the top surface of the first stage 1.
• the precision fine recess 41 had a height (depth) of 30 m, a width and a depth of 100 m.
• a roller is used as the contact member 3, the roller roll temperature is 50 ° C, and the moving speed is 0.
• the photosensitive laminated film 5 was laid (laminated) on the base material 4 along the photosensitive laminated film 5.
• the pressure of the roller for laying the photosensitive laminated film 5 and the substrate 4 was 0.5 MPa.
• a circular substrate 4 having a diameter of 300 mm and having precision fine recesses 41 formed by a photoresist pattern was placed on the first stage 1.
• the precision fine recess 41 had a height (depth) of 30 ⁇ m and a width and a depth force S of 100 ⁇ m.
• the photosensitive laminated film 5 from which the protective film 53 was peeled off was placed on the base material 4 having the precision fine recesses 41.
• a roller is used as the contact member 3, the roller roll temperature is 50 ° C, the moving speed is 0.5 mZmin, and the pressure per unit contact area of the roller in contact with the substrate 4 and the photosensitive laminated film 5 is constant.
• the photosensitive laminated film 5 was laid (laminated) on the base material 4 in such a manner. Width roller at this time is in contact with the photosensitive laminated film 5 is lmm, the pressure at the start point and the end point (P1) is 1 X 10 _3 MPa, the pressure in the central portion (P2) was 0. 15 MPa.
• the pressure Pa at the point a where the roller moved 50 mm on the substrate 4 was 223.6 ⁇ 10_3 MPa. Further, the contact area Sa of the roller in contact with the photosensitive laminated film 5 at the point where the roller moved 50 mm on the substrate 4 was 223.6 mm 2 .
• the pressure P2 at the center of the substrate 4 is 0. 15 MPa
• the contact area S is 300 mm 2 der ivy.
• the pressure per unit contact area of the contact part in contact with the photosensitive laminated film 5 at the point where the roller moves in the center part of the substrate 4 is 0. IMPa / cm 2 , and the roller moves over the substrate 4. It was found that the unit contact area of the contact portion where the substrate 4 and the photosensitive laminated film 5 are in contact with each other at a point moved by 50 mm is controlled to be constant.
• Pattern exposure is applied to the photosensitive composition layer 52 of the photosensitive laminated film 5 laid on the substrate 4 by using a parallel light aligner (Mask aligner: manufactured by Canon). HI line, exposure dose 400miZcm 2 ) was performed. The patterning at this time was performed such that the photosensitive composition layer 52 on the upper part of the fine fine recess 41 was cured and the fine fine recess 41 was blocked. After that, it was heated at 90 ° C for 5 minutes (hereinafter referred to as “PEB”) using a hot plate. The support film 51 of the photosensitive laminated film 5 was peeled off, and then developed for 4 minutes by immersion using PGMEA.
• PEB 90 ° C for 5 minutes

Landscapes

• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Physics & Mathematics (AREA)
• Thermal Sciences (AREA)
• Quality & Reliability (AREA)
• Spectroscopy & Molecular Physics (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Laminated Bodies (AREA)
• Materials For Photolithography (AREA)

Priority Applications (2)

Applications Claiming Priority (4)

Publications (1)

Family

ID=38833348

Family Applications (1)

Country Status (4)

Families Citing this family (2)

Citations (3)

Family Cites Families (8)

• 2007
  • 2007-06-14 US US12/304,974 patent/US8187408B2/en active Active
  • 2007-06-14 KR KR1020087030372A patent/KR101085811B1/ko active Active
  • 2007-06-14 WO PCT/JP2007/062044 patent/WO2007148606A1/ja not_active Ceased
  • 2007-06-20 TW TW96122177A patent/TW200831299A/zh unknown

Patent Citations (3)

Also Published As

Similar Documents

Legal Events