WO2007140766A9 - Verfahren zum anordnen einer pulverschicht auf einem substrat sowie schichtaufbau mit mindestens einer pulverschicht auf einem substrat - Google Patents

Verfahren zum anordnen einer pulverschicht auf einem substrat sowie schichtaufbau mit mindestens einer pulverschicht auf einem substrat Download PDF

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Publication number
WO2007140766A9
WO2007140766A9 PCT/DE2007/001012 DE2007001012W WO2007140766A9 WO 2007140766 A9 WO2007140766 A9 WO 2007140766A9 DE 2007001012 W DE2007001012 W DE 2007001012W WO 2007140766 A9 WO2007140766 A9 WO 2007140766A9
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
powder layer
layer
powder
arranging
Prior art date
Application number
PCT/DE2007/001012
Other languages
English (en)
French (fr)
Other versions
WO2007140766A2 (de
WO2007140766A3 (de
Inventor
Ute Liepold
Original Assignee
Osram Opto Semiconductors Gmbh
Ute Liepold
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors Gmbh, Ute Liepold filed Critical Osram Opto Semiconductors Gmbh
Priority to EP07722519A priority Critical patent/EP2016208A2/de
Priority to JP2009513545A priority patent/JP2009540551A/ja
Priority to CN200780020781.9A priority patent/CN101460661B/zh
Priority to US12/303,928 priority patent/US8202747B2/en
Publication of WO2007140766A2 publication Critical patent/WO2007140766A2/de
Publication of WO2007140766A3 publication Critical patent/WO2007140766A3/de
Publication of WO2007140766A9 publication Critical patent/WO2007140766A9/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/02—Electrophoretic coating characterised by the process with inorganic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C24/00—Coating starting from inorganic powder
    • C23C24/08—Coating starting from inorganic powder by application of heat or pressure and heat
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/04—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings of inorganic non-metallic material
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D13/00—Electrophoretic coating characterised by the process
    • C25D13/12—Electrophoretic coating characterised by the process characterised by the article coated
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles

Abstract

Die Erfindung betrifft ein Verfahren zum Anordnen einer Pulverschicht mit einem Pulver auf eine Substratoberfläche eines Substrats mit folgenden Verfahrensschritten: a) Bereitstellen des Substrats mit der Substratoberfläche, b) Aufbringen eines Gemisches mit dem Pulver und einem Haftvermittler auf der Substratoberfläche, c) Entfernen des Haftvermittlers und d) Fixieren der Pulverschicht auf der Substratoberfläche.
PCT/DE2007/001012 2006-06-07 2007-06-06 Verfahren zum anordnen einer pulverschicht auf einem substrat sowie schichtaufbau mit mindestens einer pulverschicht auf einem substrat WO2007140766A2 (de)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP07722519A EP2016208A2 (de) 2006-06-07 2007-06-06 Verfahren zum anordnen einer pulverschicht auf einem substrat sowie schichtaufbau mit mindestens einer pulverschicht auf einem substrat
JP2009513545A JP2009540551A (ja) 2006-06-07 2007-06-06 粉末層を基板上に配置する方法並びに少なくとも１つの粉末層を基板上に有する層構造体
CN200780020781.9A CN101460661B (zh) 2006-06-07 2007-06-06 在基材上布置粉末层的方法以及在基材上具有至少一个粉末层的层结构
US12/303,928 US8202747B2 (en) 2006-06-07 2007-06-06 Method for arranging a powder layer on a substrate and layer structure with at least one powder layer on a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102006026481A DE102006026481A1 (de) 2006-06-07 2006-06-07 Verfahren zum Anordnen einer Pulverschicht auf einem Substrat sowie Schichtaufbau mit mindestens einer Pulverschicht auf einem Substrat
DE102006026481.9 2006-06-07

Publications (3)

Publication Number Publication Date
WO2007140766A2 WO2007140766A2 (de) 2007-12-13
WO2007140766A3 WO2007140766A3 (de) 2008-11-13
WO2007140766A9 true WO2007140766A9 (de) 2009-04-16

Family

ID=38663670

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/DE2007/001012 WO2007140766A2 (de) 2006-06-07 2007-06-06 Verfahren zum anordnen einer pulverschicht auf einem substrat sowie schichtaufbau mit mindestens einer pulverschicht auf einem substrat

Country Status (8)

Country Link
US (1) US8202747B2 (de)
EP (1) EP2016208A2 (de)
JP (1) JP2009540551A (de)
KR (1) KR20090028611A (de)
CN (1) CN101460661B (de)
DE (1) DE102006026481A1 (de)
TW (1) TWI385818B (de)
WO (1) WO2007140766A2 (de)

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JP5486688B2 (ja) * 2010-09-15 2014-05-07 ライタイザー コリア カンパニー リミテッド 発光ダイオード及びその製造方法
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EP2610058A4 (de) * 2011-06-07 2014-08-13 Toray Industries Mit einer harzfolie beschichteter körper, herstellungsverfahren dafür und verfahren zur herstellung eines led-chips mit einer phosphorhaltigen harzfolie
JP5287935B2 (ja) 2011-06-16 2013-09-11 東レ株式会社 蛍光体含有シート、それを用いたｌｅｄ発光装置およびその製造方法
US8916409B2 (en) * 2011-10-18 2014-12-23 International Business Machines Corporation Photovoltaic device using nano-spheres for textured electrodes
DE102012207854A1 (de) * 2012-05-11 2013-11-14 Osram Opto Semiconductors Gmbh Optoelektronisches bauelement undverfahren zum herstellen eines optoelektronischen bauelements
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DE102013102482A1 (de) * 2013-03-12 2014-10-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE102013207226A1 (de) * 2013-04-22 2014-10-23 Osram Opto Semiconductors Gmbh Herstellung eines Schichtelements für einen optoelektronischen Halbleiterchip
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EP2860231A1 (de) * 2013-10-08 2015-04-15 Siemens Aktiengesellschaft Verfahren zur Herstellung einer dünnen Lotschicht
DE102015004570A1 (de) * 2014-08-05 2016-02-11 Miranda Fateri Additive Manufacturing Verfahren und Vorrichtung zur Durchführung des Additive Manufacturing Verfahrens
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Also Published As

Publication number Publication date
US8202747B2 (en) 2012-06-19
EP2016208A2 (de) 2009-01-21
DE102006026481A1 (de) 2007-12-13
TW200810154A (en) 2008-02-16
WO2007140766A2 (de) 2007-12-13
JP2009540551A (ja) 2009-11-19
TWI385818B (zh) 2013-02-11
CN101460661B (zh) 2016-10-26
WO2007140766A3 (de) 2008-11-13
US20100224893A1 (en) 2010-09-09
CN101460661A (zh) 2009-06-17
KR20090028611A (ko) 2009-03-18

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