1227568 案號 92109277 年（C月曰 修正 五、發明說明（1) 【發明所屬之技術領域】 本發明「一種基板型白光二 提供另一較佳可行之基板性白光 法，藉以提升整體基板型白光二 控制成品之聚光性以及色澤。 【先前技術】 按，一般白光二極體之原理 有色光透過特定光波波長之螢光 波與螢光層光波之波長結合成白 白光效果；故，白光二極體之主 以及具有特定光波波長之榮光層 而習用之白光二極體之製造 將藍光晶片黏著在一基體上（其 為燈泡型或基板型之不同，而係 應用在基板型發光二極體之製造 基板），並以1 5 0 °C 之溫度加熱1 進而將藍光晶片定置在基體上， 與基體電路接點之聯結，接著在 藍光晶片覆蓋，並經1 3 0 °C 之溫 型，再於透明膠之上層覆蓋一螢 度烘烤一小時使螢光膠定型後。 即完成使藍光晶片所產生之 之榮光膠射出’令監光晶片之光 合成白光波長範圍，而得以呈現 惟，習用白光二極之製作過 極體之製 二極體， 極體之產 造方法」，旨在 結構以及製造方 能，以及可有效 乃係令藍 層射出， 光波長範 要結構組 〇 方法，係 基體係因 為碗杯或 ，故此處 .5小時， 再利用金 基體上層 度烘烤二 光膠，並 有色光透 波與螢光 白光效果 程中，需 光晶片所產生之 使藍光晶片之光 圍，而得以呈現 成即為藍光晶片 先利用導電銀膠 為二極體形式係 基板，本案乃係 所指之基體係為 使導電銀膠定型 線構成藍光晶片 注入透明膠而將 小時使透明膠定 經過1 5 0 °C 之溫 過特定光波波長 膠光波之波長結 之發光二極體。 要經過多次透明1227568 Case No. 92109277 (Rev. C of the fifth month, description of the invention (1) [Technical field to which the invention belongs] The present invention "a substrate-type white light II provides another better and feasible substrate-based white light method, thereby improving the overall substrate-type white light Second, control the condensing and color of the finished product. [Previous technology] According to the principle of general white light diodes, colored light passes through a specific light wave wavelength and the wavelength of the fluorescent layer light wave to form a white and white light effect; therefore, the white light diode The main body of the body and the conventional white light diode with a glorious layer with a specific wavelength of light are manufactured by attaching a blue light chip to a substrate (which is different from a bulb type or a substrate type, and is applied to a substrate type light emitting diode). Manufacture the substrate), and heat 1 at 150 ° C, then place the blue light wafer on the base, connect with the circuit contacts of the base, then cover the blue light wafer, and pass the temperature type of 130 ° C, then Cover the upper layer of transparent glue with a fluorescent bake for one hour to set the fluorescent glue. That is, the glory glue produced by the blue light wafer is completed to emit the light of the monitor light wafer. The white light wavelength range is synthesized, and it can be presented. However, the white light diode is used to make the polar body. The polar body is produced. The purpose is to structure and manufacture, and it is effective to make the blue layer emit. The light wavelength range is based on the structure group 0 method, because the base system is a cup or cup, so here. 5 hours, then use the upper layer of the gold substrate to bake the two-light glue, and colored light transmission and fluorescent white light effect range, light is required. The light surrounding the blue light wafer produced by the wafer can be presented as a blue light wafer. Firstly, a conductive silver glue is used as the substrate of the diode system. This case refers to the base system for the conductive silver glue forming line to form a blue light wafer. Inject the transparent glue and let the transparent glue pass through a temperature of 150 ° C for a certain time to pass the light-emitting diode of the wavelength of the light wave of the glue.
1227568 案號 92109277 年（υ月β曰 修正 五、發明說明（2) 絕緣膠、螢光膠之塗佈、加熱烘烤步驟，不但使整體製造 過程趨於繁複，且無法生產體積更小之產品，而無法使白 光二極體之產能提升，且在製造過程中因為不容易控制絕 緣膠與螢光膠因為之厚度，而將使白光二極體之成品出現 聚光性、色澤不一致之缺點。 【發明内容】 本發明「一種基板型白光二極體之製造方法」，乃係 利用固晶膠將藍光晶片固設在基板上烘烤（以1 5 0 °C 之溫 度加熱1 . 5小時） ’並且由金線構成監光晶片與基板電路 接點之聯結，其完成金線聯結步驟之基板即置於一經過預 熱之模具中，令基板上之藍光晶片嵌入模孔，再於模具中 填入含有螢光粉之螢光膠粉或膠餅，其螢光膠粉或膠餅即 受模具之加熱作用而呈濃液狀並受壓力作用注入模孔中與 藍光晶片結合，且混於螢光膠中之螢光粉逐漸流向模具所 固定的模槽，並覆蓋於藍光晶片之表層，同時螢光膠粉或 膠餅即轉成為黃色絕緣膠之性質，而在冷卻定型後，即完 成基板型白光二極體之製作。 尤其，藉由螢光膠之螢光粉組成比例，即可有效控制 白光二極體之品質得以一致者。 【實施方式】 為能使 貴審查委員清楚本發明之結構組成，以及整 體運作方式，茲配合圖式說明如下： 本發明「一種基板型白光二極體之製造方法」，其白 光二極體之基本結構組成如第一圖所示，乃係在一基板（ 1 0 )上固設有一藍光晶片（2 0 )，其藍光晶片（1 0 ) 並由金線1227568 Case No. 92109277 (Amended in June, β, V. Description of Invention (2) The steps of coating and heating and baking of insulating glue and fluorescent glue, not only make the overall manufacturing process more complicated, but also cannot produce products with smaller size. It is impossible to increase the production capacity of the white light diode, and because it is not easy to control the thickness of the insulating glue and the fluorescent glue during the manufacturing process, the finished products of the white light diode will have the disadvantages of light concentration and inconsistent color. [Summary of the invention] The present invention "a method for manufacturing a substrate-type white light diode" is a method in which a blue light chip is fixed on a substrate and baked using a solid state adhesive (heated at a temperature of 150 ° C for 1.5 hours). 'And the gold wire constitutes the connection between the light-monitoring wafer and the circuit contacts of the substrate. The substrate that has completed the gold wire connection step is placed in a preheated mold, so that the blue light wafer on the substrate is embedded in the mold hole, and then in the mold. Filled with fluorescent powder or cake containing fluorescent powder, the fluorescent powder or cake is heated by the mold to form a thick liquid and is pressed into the mold hole to be combined with the blue light chip and mixed in Fluorescent The fluorescent powder in the medium gradually flows to the mold groove fixed by the mold and covers the surface layer of the blue light wafer. At the same time, the fluorescent glue powder or cake is converted into a yellow insulating glue. After cooling and setting, the substrate-type white light is completed. Production of diodes. In particular, the composition of fluorescent powder can effectively control the quality of white light diodes. [Embodiment] In order to make your review committee clear the structure of the invention As well as the overall operation mode, the following description is given in conjunction with the drawings: In the present invention "a method for manufacturing a substrate-type white light diode", the basic structure of the white light diode is as shown in the first figure, and is based on a substrate ( 10) a blue light chip (2 0) is fixed on the blue light chip (1 0), and a blue wire
案號92109277_年㈧月4日 修正_ 五、發明說明（3) (3 0 )構成與基板（1 0 )電路接點之聯結，且該藍光晶片（2 0 ) 之表層披覆有具特定光波波長之螢光層（40)，整體藍光晶 片（2 0 )包含金線（3 0 )與螢光層（4 0 )則係由一黃色絕緣層（ 5 0 )加以包覆，藉以基板（1 0 )電路接點之通電作用下，藍 光晶片（2 0 )所產生之藍色光即透過特定光波波長之螢光層 (40)射出，令藍光晶片（20)之4 3 0 mm〜4 7 5腿光波與螢光層 (4 0 )光波之波長結合成白光波長範圍，而得以呈現白光效 果。 另外，本發明之基板型白光二極體製造方法如第二圖 所示，係包括有下列步驟： A、 利用固晶膠將藍光晶片固設在基板上，並以1 5 0 °C 之 溫度加熱1 . 5小時，將藍光晶片定置在基板上； B、 利用由金線構成藍光晶片與基板電路接點之聯結。 C、 將有螢光粉及透明絕緣膠之螢光膠粉或膠餅灌注於與 完成藍光晶片與金線處，並在持續加熱、加壓 （150 °C之溫度5 0 0〜8 0 0秒）之作用下令螢光膠與基板相結 合定型。 其中，在螢光膠粉或膠餅受熱之定型過程中，即令混 於絕緣透明膠中之螢光粉逐漸朝向藍光晶片沉澱，並覆蓋 於藍光晶片之表層而成為螢光層，同時螢光膠即轉成為黃 色絕緣膠之性質，而成為黃色絕緣層之結構，即完成白光 二極體之製作。 請同時配合參照第三圖及第四圖所示，本發明中係可 同時進行多個白光二極體之製造，如第三圖所示，其基板 (1 0 )上係可同時佈設有多個藍光晶片（2 0 )，且個藍光晶片Case No. 92109277_Amended on 4th of January _ V. Description of the invention (3) (3 0) constitutes the connection with the circuit contact of the substrate (1 0), and the surface layer of the blue light chip (2 0) is covered with a specific The light-wavelength fluorescent layer (40), the overall blue light chip (20) including the gold wire (30) and the fluorescent layer (40) are covered by a yellow insulating layer (50), and the substrate ( 1 0) Under the energization of the circuit contacts, the blue light generated by the blue light chip (20) is emitted through the fluorescent layer (40) of a specific light wavelength, so that the blue light chip (20) is 4 3 0 mm ~ 4 7 The 5-leg light wave and the wavelength of the fluorescent layer (40) light wave are combined into a white light wavelength range, so that a white light effect can be presented. In addition, as shown in the second figure, the method for manufacturing a substrate-type white light diode according to the present invention includes the following steps: A. The blue light wafer is fixed on the substrate by using a solid-state adhesive, and the temperature is 150 ° C. Heating for 1.5 hours, the blue light wafer is set on the substrate; B. The connection between the blue light wafer and the circuit contacts of the substrate is made of gold wire. C. Fluorescent powder or cake with fluorescent powder and transparent insulating glue is poured into and completed the blue light chip and gold wire, and continuously heated and pressurized (temperature of 150 ° C 5 0 0 ~ 8 0 0 Second), the combination of the fluorescent glue and the substrate is set. Among them, during the setting process of the fluorescent glue powder or cake, the fluorescent powder mixed in the insulating transparent glue gradually precipitates toward the blue light chip, and covers the surface layer of the blue light chip to become a fluorescent layer. That is, it turns into the property of yellow insulating glue, and becomes the structure of yellow insulating layer, that is, the production of white light-emitting diode is completed. Please refer to Figures 3 and 4 at the same time. In the present invention, multiple white light-emitting diodes can be manufactured at the same time. As shown in Figure 3, multiple substrates (1 0) can be placed on the substrate at the same time. Blue light chips (2 0), and blue light chips
1227568 五、發明說明 (2 0 )係個別由金線（3 0 )與基板（1 0 )所對應之電路接點 結；並可利用如第四圖及第五圖所示之模具用以進^，嚼 膠粉或膠餅與基板之灌注、定型作業；其中，模具光 由上、下模（6 1 )、（ 6 2 )所對合而成，其基板（1 〇 )即相係 夾設於模具之模座（6 3 )中，且如第四圖及第六圖所示，、應 模具（6 0 )係設有與基板（1 〇 )上之藍光晶片（2 0 )相對合 ^ 孔（6 4 )，各模孔（6 4 )並與一主澆道（6 5 )相通，並在:、、 (65)處設有一擠壓件（6 6)將螢光膠粉或膠餅灌注於 $道 (64)中。 候孔 因此，在進行螢光膠粉或膠餅與基板之灌注、定型作 業時，如第五圖及第六圖所示，即係將固設有藍光晶片（ 20)與金線（30)之基板（1〇)置於經過預熱之模具（6〇)中， 令基板（10)上之藍光晶片（20)嵌入模孔（β4)，再透過擠壓 件（66)將呈固狀之螢光膠粉或膠餅中填入模具（6〇)之主洗 道（65)中，其固狀螢光膠粉或膠餅即受模具（6〇)之加熱作 用而呈濃液狀並受擠壓件（6 6 )壓力作用注入模孔（β 4 )中與 藍光晶片（2 0 )結合’並經過約5 〇 〇 - 8 〇 〇秒之持續加壓加熱 作用下’令螢光膠與基板相結合定型，且在定型過程中混 於螢光膠中之螢光粉即逐漸流向模具所固定的模槽，並覆 蓋於藍光晶片之表層，同時螢光膠即轉成為黃色絕緣膠之 性質，而在冷卻定型後，即完成基板型白光二極體之製作 ，而可進一步依各藍光晶片所屬之基板區域切割成成品。 不但可省去螢光膠、透明絕緣膠之分層塗佈、加熱烤 合步驟所需之工時及工序，進而提升白光二極體之產能； 尤其，藉由螢光膠之螢光粉組成比例，即可有效控制螢光1227568 V. Description of the invention (20) is the circuit junction corresponding to the gold wire (30) and the substrate (10) individually; ^, The pouring and shaping of the chewing gum or cake and the substrate; the mold light is formed by the upper and lower molds (6 1), (6 2), and the substrate (1 0) is the phase clamp It is set in the mold base (6 3) of the mold, and as shown in the fourth and sixth figures, the corresponding mold (60) is provided with a blue light chip (2 0) on the substrate (10). ^ Hole (6 4), each die hole (6 4) is in communication with a main runner (6 5), and an extrusion piece (6 6) is provided at:, (65) to place the fluorescent rubber powder or The gelatin cake is poured into the channel (64). Waiting hole. Therefore, when the fluorescent glue powder or cake and substrate are poured and shaped, as shown in Figures 5 and 6, the blue light chip (20) and gold wire (30) are fixed. The substrate (10) is placed in a preheated mold (60), so that the blue light wafer (20) on the substrate (10) is inserted into the mold hole (β4), and then passes through the extrusion (66) to be solid. The fluorescent glue powder or cake is filled into the main washing channel (65) of the mold (60), and the solid fluorescent glue powder or cake is heated by the mold (60) to become a concentrated liquid. And under the pressure of the extruded part (6 6), it is injected into the die hole (β 4) and combined with the blue light wafer (20), and the continuous pressure heating is performed for about 5000-800 seconds to make the fluorescent light. The glue is fixed with the substrate, and the fluorescent powder mixed in the fluorescent glue during the setting process gradually flows to the mold groove fixed by the mold, and covers the surface layer of the blue light wafer. At the same time, the fluorescent glue is converted into a yellow insulating glue. After cooling and setting, the production of the substrate-type white light diode is completed, and it can be further cut according to the substrate area to which each blue light wafer belongs. Finished. Not only can it save the man-hours and processes required for the layered coating of fluorescent glue, transparent insulating glue, and heating and baking steps, and thus increase the production capacity of white light diodes; especially, it consists of fluorescent powder of fluorescent glue Ratio for effective fluorescent control
1227568 案號 92109277 年\。月巧曰 修正 五、發明說明（5) 膠層之厚度，以使白光二極體之品質得以一致。 如上述，本發明「一種基板型白光二極體之製造方法 」提供基板型白光二極體另一較佳可行之製造方法及結構 ，有效弊除習用基板型白光二極體之絕緣膠與螢光膠因為 厚度不一，而無法有效控制產品之聚光性以及色澤等缺點 ，爰依法提呈發明專利之申請；惟，以上之實施說明及圖 式所示，係本發明較佳實施例之一者，並非以此侷限本發 明，是以，舉凡與本發明之構造、裝置、特徵等近似、雷 同者，均應屬本發明之創設目的及申請專利範圍之内。1227568 case number 92109277 \. Yue Qiao said Correction 5. Description of the invention (5) The thickness of the glue layer, so that the quality of the white light-emitting diode can be consistent. As mentioned above, the "a method for manufacturing a substrate-type white light diode" of the present invention provides another preferred and feasible manufacturing method and structure of a substrate-type white light diode, which effectively eliminates the disadvantages of the insulating glue and fluorescent materials of conventional substrate-type white light diodes. Because of the different thicknesses, the photoresist cannot effectively control the shortcomings of the product, such as light condensing and color, etc., and filed an application for an invention patent according to law; however, the above description of the implementation and the drawings are the preferred embodiments of the invention One is not to limit the present invention, but any similarity to the structures, devices, features, etc. of the present invention should be within the scope of the invention's creation purpose and patent application scope.
1227568 案號92109277 β ^年㈧月日 修正 圖式簡單說明 第一圖係為本發明中整體基板型白光二極體之結構示意圖 〇 第二圖係為本發明之製造流程圖。 第三圖係為本發明中藍光晶片與基板之配置狀態示意圖。 第四圖係為本發明中模具之平面結構示意圖。 第五圖係為本發明中模具之侧面結構示意圖。 第六圖係為本發明中藍光晶片嵌入模孔之狀態剖視圖。 【元件代表符號說明】 (1 0 )基板 (2 0 ) 藍光晶片 (3 0 ) 金線 (40)螢光層 (5 0 ) 黃色絕緣層 (6 0 )模具 (6 1 )上模 (6 2 )下模 (6 3 ) 模座 (6 4 ) 模孔 (6 5 ) 主澆道 (6 6 ) 擠壓件1227568 Case No. 92109277 β ^ Year Month Day Amendment Brief Description of the Drawings The first diagram is a schematic diagram of the structure of the overall substrate-type white light diode in the present invention. The second diagram is a manufacturing flowchart of the present invention. The third figure is a schematic view showing the arrangement state of the blue light wafer and the substrate in the present invention. The fourth figure is a schematic plan view of the mold in the present invention. The fifth figure is a schematic diagram of the side structure of the mold in the present invention. The sixth figure is a sectional view of a state where a blue light wafer is embedded in a die hole in the present invention. [Description of Symbols] (1 0) Substrate (2 0) Blue wafer (3 0) Gold wire (40) Fluorescent layer (50) Yellow insulation layer (60) Mold (6 1) Upper mold (6 2 ) Lower die (6 3) Die holder (6 4) Die hole (6 5) Main runner (6 6) Extrusion
第10頁Page 10