WO2007139981A2 - Linearly distributed semiconductor workpiece processing tool - Google Patents

Linearly distributed semiconductor workpiece processing tool Download PDF

Info

Publication number
WO2007139981A2
WO2007139981A2 PCT/US2007/012582 US2007012582W WO2007139981A2 WO 2007139981 A2 WO2007139981 A2 WO 2007139981A2 US 2007012582 W US2007012582 W US 2007012582W WO 2007139981 A2 WO2007139981 A2 WO 2007139981A2
Authority
WO
WIPO (PCT)
Prior art keywords
transport
transport chamber
module
chamber
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/012582
Other languages
English (en)
French (fr)
Other versions
WO2007139981A3 (en
Inventor
William Holtkamp
Izya Kremerman
Christopher Hoffmeister
Richard Pickreign
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Azenta Inc
Original Assignee
Brooks Automation Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Brooks Automation Inc filed Critical Brooks Automation Inc
Priority to JP2009513224A priority Critical patent/JP5706085B2/ja
Publication of WO2007139981A2 publication Critical patent/WO2007139981A2/en
Publication of WO2007139981A3 publication Critical patent/WO2007139981A3/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306Horizontal transfer of a single workpiece
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H10P72/0456Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers in-line arrangement
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0451Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402Mechanical parts of transfer devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3404Storage means

Definitions

  • the exemplary embodiments described herein relate to semiconductor workpiece processing tools and, more particularly, to processing tools having a linear arrangement.
  • conventional processing apparatus may use a radial processing module arrangement.
  • a schematic plan view of a conventional substrate processing apparatus is shown in FIG. 9. As can been seen, the processing modules of the apparatus in FIG. 9 are placed radially around the transport chamber of the processing apparatus.
  • the transport apparatus which is a conventional two or three axis of movement apparatus (e.g. Z 1 ⁇ , T Axis) is centrally located in the transport chamber to transport substrates between processing modules.
  • throughput of the conventional processing apparatus is limited by the handling rate of the transport apparatus.
  • a substrate processing apparatus includes a transport chamber capable of holding an isolated atmosphere therein and communicably connected to a charging station for loading and unloading a substrate into the apparatus, a transport system inside the transport chamber for transporting the substrate and an array of processing chamber modules distributed alongside the transport chamber and communicably connected to the transport chamber to allow the substrate to be transferred therebetween.
  • the transport chamber is capable of being linearly elongated longitudinally and includes at least one transport chamber node, each of which is capable of being communicably connected in series to at least another transport chamber node of the transport chamber for effecting the elongation, and of tying at least two chamber modules of the apparatus to each other, each node having a resident substrate transport arm therein for transporting the substrate between the transport chamber node and the at least two chamber modules and a substrate buffer, communicably connected to the at least one transport chamber node, buffering the substrate.
  • a substrate processing apparatus includes a transport chamber with an opening for loading and unloading a substrate to and from the transport chamber, the transport chamber comprising a first transport chamber module, a second transport chamber module and a third transport chamber module, each of which is capable of holding an isolated atmosphere therein and is communicably connectable to each other for transferring the substrate therebetween, and when the first and second transport chamber modules are connected to each other, the transport chamber has a longitudinal linearly elongated shape.
  • the processing apparatus further includes a transport system located in the transport chamber and having a substrate transport arm movably mounted in a longitudinally fixed location within each of the first, second and third transport chamber modules, an array of processing chamber modules distributed alongside the transport chamber and communicably connected to the transport chamber to allow the substrate to be transferred therebetween and at least one substrate buffer module selectably connectable to at least one of the first, second or third transport chamber modules, wherein the longitudinal linearly elongated shape of the transport chamber has a selectably variable longitudinal length effected by selectable connection of at least one of the second and the third transport chamber modules to the first transport chamber module, wherein selectable connection of the third transport chamber module to either the first or second transport chamber modules depends on the substrate buffer module being connected between the first and second transport chamber modules.
  • a substrate processing apparatus includes a charging station with a port for loading and unloading a substrate from the apparatus, a transport chamber capable of holding an isolated atmosphere therein and communicably connected to the charging station to allow passage of the substrate in between, a transport system inside the transport chamber for transporting the substrate and an array of processing chamber modules distributed alongside the transport chamber and coininunicably connected to the transport chamber to allow the substrate to be transferred therebetween.
  • the transport chamber is capable of being linearly elongated longitudinally and includes at least one transport chamber module, with an always resident substrate transport arm therein, the transport chamber module being interfaced and communicably connected to the charging station and capable of being communicably connected to at least another transport chamber module so that the charging station, the at least one transport chamber module and the at least another transport chamber module are arranged in series longitudinally and a pass through substrate buffer, interfaced and communicably connected to the at least one transport chamber module so that the at least one transport chamber module is interposed between the charging station and the at least one transport chamber module.
  • a substrate processing apparatus includes a transport chamber module with a chamber capable of being isolated from outside atmosphere, and having a transport arm mounted inside the chamber, the transport arm having an end effector for holding and transporting a substrate, and having a pivot joint located in a substantially fixed location relative to the transport chamber module.
  • the substrate processing apparatus further includes another transport chamber module, with another chamber capable of being isolated from outside atmosphere, and having another transport arm mounted inside the other chamber, the other transport arm having another end effector for holding and transporting the substrate, and having another pivot joint located in a substantially fixed location relative to the other transport chamber module, the other transport chamber module being connectable to the chamber module to form a linearly- elongated transport chamber and a linear array of processing modules extending along and connected to the linearly elongated transport chamber so that the substrate may be transported between the linearly elongated transport chamber and at least one processing module of the linear array.
  • the transport arm and the other transport arm cooperate with each other to form a travel lane, extending longitudinally through the linearly elongated transport chamber, along which the substrate is transported.
  • FIG. 1 is a schematic plan view of a substrate processing apparatus incorporating features of the present invention in accordance with a first exemplary embodiment
  • FIG. 2 is a schematic plan view of a transport chamber module of the processing apparatus in Fig. 1;
  • FIG. 2A is an elevation view of the transport chamber module in Fig. 2;
  • Fig. 3 is a schematic plan view of a portion of the transport chamber of the processing apparatus in Fig. 1;
  • FIG. 4 is another schematic plan view of the transport chamber of the processing apparatus in accordance with another exemplary embodiment
  • FIG. 4A is a schematic elevation view of the transport chamber in Fig. 4, and Fig. 4B is another elevation view of the transport chamber as viewed from a different direction perpendicular to the view direction in Fig. 4A;
  • FIG. 4B is another schematic elevation view of the transport chamber in accordance with another exemplary embodiment
  • FIG. 4C is still another schematic elevation view of the transport chamber in accordance with another exemplary embodiment
  • FIG. 4D is yet another schematic elevation view of the transport chamber in accordance with yet another exemplary embodiment
  • FIG. 5 is a schematic plan view of the processing apparatus in accordance with another exemplary embodiment
  • FIG. 6 is a another schematic plan view of the processing apparatus in accordance with another exemplary embodiment
  • Fig. 7 is a still another schematic plan view of the processing apparatus in accordance with another exemplary embodiment
  • FIG. 8 is a schematic elevation view of the apparatus in accordance with another exemplary- embodiment
  • FIG. 9 is a schematic elevation view of a portion of the processing apparatus in accordance with still yet another exemplary embodiment.
  • Fig. 10 is another schematic elevation view of another portion of the apparatus.
  • FIG. 2 there is shown a schematic plan view of a substrate processing apparatus 10 incorporating features of the present invention.
  • the present invention will be described with reference to the embodiments shown in the drawings, it should be understood that the present invention can be embodied in many alternate forms of embodiments.
  • any suitable size, shape or type of elements or materials could be used.
  • the workpiece processing system 10, or tool generally has a processing section 13 and an interface section 12.
  • the interface and processing sections of the tool 10 are connected to each other and allow transport of workpieces in between.
  • the workpieces S illustrated in the figures are exemplary and may be for example 450 mm, 300 mm, or 200 mm wafers, reticles, mask, flat panels for displays, or any other desired workpiece item.
  • the processing section 13 of the tool may have processing modules or chambers, such as material deposition (CVD, PVD, copper implantation, epitaxial silicon, dielectric deposition, rapid thermal processing, ion implantation, etching, chemical mechanical polishing, metrology, .electroplating, etc.) for processing the workpieces S in accordance with a desired processing protocol.
  • the processing modules may be linked by a workpiece transport chamber 16 (see also Fig. 5) in which the workpieces may be transported between desired processing modules according to the processing protocol .
  • the transport chamber has a transport robot 20 capable of moving the workpieces therein and to the process modules.
  • the process modules and the transport chamber are capable of being atmospherically isolated from the exterior atmosphere in order to maintain atmosphere within the transport chamber the same as the processing modules, or suitable for workpieces being transferred between processing modules.
  • the transport chamber may have an inert gas (e.g. N 2 ) atmosphere or may hold a vacuum (or near vacuum atmosphere) .
  • the tool interface section 12 provides a workpiece loading/unloading interface between the tool processing section 13 and its isolatable atmosphere and the tool exterior. The tool interface section thus allows workpieces, that may be transported in carriers outside the tool, to be unloaded from the carrier into the tool and vice versa.
  • the transport chamber may be made up of transport chamber modules, that may be connected end to end for example to form a linearly elongated transport chamber.
  • the transport chamber length is thus variable by adding or removing transport chamber modules .
  • the transport chamber modules may have entry/exit gate valves capable of isolating desired transport chamber module from adjoining portions of the transport chambers.
  • Tool interface sections similar to section 12 may. be positioned at any desired locations along the linearly elongated transport chamber as will be described below, allowing workpieces to be loaded or unloaded at a desired location in the tool.
  • Processing modules may be distributed along the length of the transport chamber.
  • the processing modules may be stacked in a direction angled to the length of the chamber.
  • the transport chamber modules may have entry/exit gate valves to isolate desired transport chamber modules from the processing modules.
  • the transport system 20 is distributed through transport chamber.
  • a number of the transport chamber modules may each have an integral movable arm having a fixed interface/mount to the module and movable end effector capable of holding and moving workpieces linearly along the transport chamber and between transport chamber and process modules.
  • Transport arms in different transport chamber modules may cooperate to form at least a portion of the linearly distributed transport system. Operation of the transport system, processing modules, processing section, interface section and any other portions of the tool may be controlled by controller 400.
  • Controller 400 depicted schematically in Fig. 1, may have a distributed or clustered control architecture, a suitable example of which is described and shown in U.S. Application Serial No. 11/178,615, filed 7/11/05 incorporated by reference herein in its entirety.
  • the transport chamber and transport system therein may be arranged to define multiple workpiece travel lanes within the transport chamber as will be described in greater detail below.
  • the travel lanes may be polarized or dedicated within the transport chamber for advance and return of workpieces .
  • the transport chamber may also have intermediate load locks allowing different sections of the transport chamber to hold different atmospheres, and allow workpieces to transit between the different atmospheric sections of the transport chamber.
  • the transport chamber may have an entry/exit station (s), where workpieces may be inserted/removed from a desired location of the transport chamber.
  • the entry/exit station may be located at an opposite end from the interface section 12 or other desired position in the transport chamber.
  • the entry exit station (s) of the transport chamber may communicate with a workpiece express transit passage linking entry/exit station of the transport chamber with a remote tool interface section 12 (see also Figs. 5 and 8).
  • the express transit passage may be independent of and isolatable from the transport chamber 16.
  • the express transit passage may communicate with one or more of the interface section 12 so that workpieces may be transported between the interface section and transit passage. Workpieces, may be rapidly placed into an advanced section of the tool and returned to the interface section 12 after processing via the express transit passage, without affecting the transport chamber, and resulting in a reduction of work in process (WIP) .
  • the transport chamber may also have intermediate entry/exit stations, a number of which may communicate with the express transit passage so that workpieces may be transported therebetween. This allows workpieces to be inserted or removed at desired intermediate portions of the process without affecting the process stream as will be described further below.
  • the interface section 12 is shown for example purposes at an end of the transport chamber of the tool 10. In alternate embodiments, the interface section of the tool may be located as desired including for example at an intermediate location along the transport chamber, between the ends of the transport chamber.
  • Fig. 1 shows a tool 10 with one interface section connected to the transport chamber. In alternate embodiments, the tool may have any desired number of interface sections connected to the transport chamber.
  • the interface section 12 shown in Fig. 1 has an exemplary configuration and in alternate embodiments the interface section may have any desired configuration/arrangement.
  • the interface section 12 generally has a closure or chamber 14 and a load port(s) LP (one is shown for example purposes only and the chamber may have any desired number of loadports) .
  • the chamber 14 is communicably connected with the transport chamber 16 so that workpieces may be transported between interface section chamber 14 and transport chamber 16.
  • the chamber 14 of the interface section may be an environmental module, with a controlled air system for example having fan(s) and particulate filter (s) to maintain desired cleanliness conditions within chamber 14.
  • the interface section chamber may be referred to as the environmental chamber.
  • the load port LP provides a controlled port ⁇ not shown) through which workpieces may be loaded and unloaded from the chamber 14 of the interface section without compromise of the controlled environmental conditions and environment inside the environmental chamber 14.
  • a load lock (not shown in Fig. 1, but see Fig. 4) may be provided to transition between environmental chamber 14 and transport chamber 16.
  • An example of a suitable environmental interface section is disclosed in U.S. Patent Application Serial No.
  • the controlled port of the load port provides an opening into the interface section through which workpieces are transported into arid out of the interface section, and hence, into and out of the tool 10.
  • the controlled port opening may have a door or closure (not shown) closing, or at least partially blocking the opening, to maintain the controlled environment in the interface section 12 when workpieces are not being loaded/unloaded from the interface section.
  • the port door is closed when workpieces are not being loaded/unloaded.
  • the workpieces may be transported outside the tool inside carriers or containers such as FOUP(S), SMIF (s) or other workpiece container.
  • Fig. 1 shows a FOUP C mated to the load port.
  • the load port may be arranged to mate with any desired carrier.
  • the container when the workpiece container C is mated to the load port, the container may be sealed to the controlled port of the load port, so that the port door may be opened. With the port sealed by the container, the port door, and the closure (not shown) of the container C (closing the container opening through which workpieces are loaded into the container) may be removed, for example simultaneously without exposure of potentially contaminated closure surfaces to the chamber interior, thereby opening the container C to the environmental chamber 14.
  • the environmental chamber 14 is connected to transport chamber 16 at chamber face 14R, and the load port LP is located on the opposite chamber face 14F.
  • the load port LP may have a container support CS for supporting container (s) mated to the load port.
  • the container support CS extends from chamber face 14F, and the transport chamber 16, environmental chamber 14 and load port LP are arranged substantially in line along axis X for example purposes.
  • the transport chamber environmental chamber and load port may not be aligned.
  • the load port (and its container support) may be located on a face of the environmental chamber that positions the load port transverse or angled to the alignment axis of the interface section and transport chamber.
  • the container support may be positioned to allow container interface with a suitable automated container transport system (not shown) , such as an overhead or floor mounted automated material handling system (AMHS) , a conveyor system or autonomous or rail guided vehicles.
  • a suitable automated container transport system such as an overhead or floor mounted automated material handling system (AMHS) , a conveyor system or autonomous or rail guided vehicles.
  • Containers may also be loaded manually on the load port container support.
  • the workpiece containers may be reduced WIP containers suitable examples of which are described and shown in U.S. Patent Application Serial No. 11/207,231, filed 8/19/05, incorporated by reference herein in its entirety.
  • the load port door and container closure may be passive, (i.e. passive locking features without movable features) , suitable examples of which are described and shown in U.S. Patent Application titled "Reduced Capacity Carrier, Transport, Load Port, Buffer System", filed November 3, 2005.
  • the interface section chamber may be for example connected to suitable environmental control systems (e.g. suction source/roughing pump, vent to atmosphere, vent to transport chamber) to allow .the interface section to operate as a load lock (i.e. capable of transition between the atmosphere inside the transport chamber 16 and that of the workpiece container C) .
  • the interface section 12 mates directly to the transport chamber (as shown in Fig. 1) without any intervening load locks .
  • the interface section has a workpiece transport 15 for moving workpieces from the container C mated to the load port, to the transport chamber 16.
  • the transport 15 is located inside the interface section chamber 14, and may have for example multiple independently movable end effectors for independently moving multiple workpieces .
  • the transport 15 may have for example multiple independently movable end effectors for independently moving multiple workpieces .
  • the transport 15 is illustrated for example as a multi-articulated link arm, that may have three (3), four (4) , five (5) or six (6) degrees of freedom ⁇ for example two independently movable end effectors ⁇ , r) and combined Z motion) .
  • the interface section may be provided with any suitable workpiece transport apparatus.
  • the interface section may also include workpiece station (s) A such as an aligner station, buffer station, metrology station and any other desired handling station for workpiece (s) S.
  • module 18 may have multiple interfaces, for mating for example to interface sections (similar to section 12), load lock modules, process modules, workpiece station modules, other transport chamber modules, or any other desired module, and may have an integral workpiece transport apparatus arranged in the module to provide multiple independent travel lanes for workpiece (s) S within the individual module and between the individual module and adjoining transport chamber modules.
  • the transport chamber module 18 has a casing 24 that is capable of holding an isolated atmosphere as will be described below.
  • the casing 24 has a generally hexahedron shape, though in alternate embodiments the casing may have any suitable shape, (e.g. more or fewer lateral sides or round perimeter) .
  • the casing 24 may include a frame 22F for structural support of module systems and components.
  • the frame may be a one piece member (i.e. unitary construction) made of metal such as stainless steel or aluminum alloy, and formed by any suitable forming process, such as forging.
  • a suitable example of a chamber casing is disclosed in U.S. Patent Application Serial No. 11/070,443, filed March 2, 2005, incorporated by reference herein in its entirety.
  • the frame 22F may define portions of the casing (e.g.
  • the frame may also define the mating surfaces of the module interfaces and openings in the casing for communication and workpiece passage to adjoining modules.
  • the frame may further define access openings 240 for user accessing the interior of the module as will be described below.
  • the casing frame of the transport chamber module may have any other desired shape and arrangement.
  • the casing 24 of the transport chamber module in this exemplary embodiment has interfaces 28F, 28B, 28L, 28R on lateral sides of the casing. In alternate embodiments, there may be more or fewer interfaces.
  • the module casing 24, and the interfaces 28F, 28B, 28L, 28R thereon, are shown as being substantially symmetrical with respect to both axes of symmetry X, Y. Moreover, the interfaces 28F, 28B, 28L, 28R may be similar to each other. This allows the module 18 to be joined to other portions/modules of the transport chamber in any orientation.
  • the module may be oriented to present interfaces 28F, 28B for mating to adjoining transport chamber modules (see for example Figs. 1 and 3).
  • the orientation of the module may be rotated (in this example about 90°) so that interfaces 28L, 28R may mate to other in line transport chamber modules.
  • the arrangement symmetry of the interfaces on the module casing and the similarity of the individual interfaces to each other allows any module having a complementing mating interface to be mated to any interface of the transport chamber module 18.
  • any desired module having a complementing mating interface such as another transport module.
  • one transport chamber module 18 may have another transport chamber module mated to interface 28R, and the other transport chamber module may be mated to a process module PM at an interface similar to interface 28R, but be mated to yet another transport chamber module at an interface similar to interface 28F. This will be described in greater detail below.
  • each interface 28L, 28R, 28F, 28B may be provided with position and inclination control surfaces and features, schematically represented in Fig. 2 as lines FL, FR (only lines FL, FR are shown in Fig. 2 for example purposes) .
  • the position and inclination surfaces and features FL, FR on the module may be of any suitable kind, such kinematic coupling features, suitable examples of which are described and shown in U.S. Patent Application Serial No. 11/154,787, filed June 15, 2005, incorporated by reference herein in its entirety.
  • each interchangeable transport chamber module is substantially similar to module 18 with respect to positioning features and mating interfaces, and hence the following description will refer to all such modules for convenience as modules 18.
  • the position/inclination control surfaces and features FL, FR of each respective interface define a repeatable spatial position (e.g. along X, Y, Z axis, the Z-axis is out of the page in Fig. 2) and attitude (rotation about X, Y, Z axis) of the given interface 28F, 28B, 28L, 28R for each interchangeable transport chamber module.
  • each of the modules 18 may have a module reference datum, and the control surfaces/features FL, FR may be established relative to the module reference datum.
  • the reference datum may be, for example, the workpiece transport plane W ⁇ see Fig. 2A) , though any other desired reference datum common to the modules may be used.
  • the transport chamber module defines multiple workpiece travel lanes A, R.
  • the workpiece plane W corresponds to lane A for example purposes, and in alternate embodiments the workpiece transport plane corresponding to any travel lane may be used as the reference datum of the module.
  • the module reference datum W may be established (for each module ,18) from a global reference datum, as will also be described below.
  • the result as may be realized, is a constancy or repeatability of position and attitude of each module reference datum W, and of the control surfaces/features FL, FR of the module interfaces.
  • the control surface/features on each module interface may be established relative to the module reference datum using for example a reference bench or jig (see Fig. 9) , with suitable datum features.
  • the reference jig may have one or more base datum surfaces providing the basis for the module reference datum (e.g. workpiece transport planes W) .
  • the base datum surfaces (or features) may be determined from the desired global reference datum, such as the FAB facility floor.
  • the reference jig may also have registration datum features, such as datum surfaces, laser position registration system or optical position registration system, at a fixed predetermined position and attitude relative to the base datum surfaces of the jig.
  • the registration datum features are used to set the control surface/features FL, FR of the interfaces 28L, 28R, 28F, 28B of each module 18.
  • the module may be positioned on the reference jig so that it is in a desired position relative to the basis datum of the reference jig.
  • the interface control surface/features FL, FR of each desired interface 28L, 28R, 28F, 28B on the module may then be placed in final positions using the registration datum features.
  • control feature FL, FR is a vertical planar surface (s) (such as may be used with a three (3) point contact coupling to level the module) then the surface may be adjusted ⁇ using suitable forming processes such as machining stock, or adjusting mechanical connections) so that its planarity and vertical planar orientation matches the position and attitude of the corresponding registration datum features of the reference jig.
  • similar control surface (s) /feature (s) of each interface of each module 18 will have substantially the same positions and angular orientations with respect to the module reference datum, that is in turn substantially common to all modules.
  • any suitable reference datum system may be used to repeatably establish the control surface (s) /feature (s) of the module interfaces.
  • transport chamber module 18 has an integral workpiece transport apparatus 26.
  • the apparatus 26 may have one or more end effector (s) 32 (one is shown in Fig 2 for example purposes) capable of holding and moving workpiece (s) S as desired (for example in the directions indicated by arrows r, ⁇ and also in the Z (vertical/direction) .
  • the transport apparatus is a multi-articulated link transport arm similar to robot arm 15 in the interface section 12, except as otherwise described below.
  • the workpiece transport apparatus in the transport chamber module may be of any other suitable configuration.
  • the transport arm 26 in this exemplary embodiment may have a drive section operably connected to the desired links of the transport arm to provide the arm with for example, three (3), four (4), five (5), six (6) or more degrees of freedom.
  • the degrees of freedom depend on the number of independently driven links, the number of arm end effectors and whether the arm is capable of indexing or vertical (Z axis - out of the plane of Fig. 2) motion.
  • a transport arm with a single end effector, two (2) independently movable links (e.g. independent rotation about shoulder 26S and independent rotation about elbow 26E) and indexing capability (Z axis) has three (3) degrees of freedom.
  • the transport arm and its drive section may be packaged as a module 26M for mounting to the frame 22F of the transport chamber module 18.
  • the transport arm module 26M may be a "drop-in" module that may be installed or removed as a unit, such as via access opening 240 ⁇ see Fig. 2) .
  • the transport arm module 26M may have mounts (not shown) that engage desired attachment sections (not shown) on the transport chamber module frame 22F.
  • the transport arm module 26 may also have deterministic position control features, such as kinematic couplings that cooperate with complementing features 36 on frame 22F providing for repeatable positioning of the transport arm module 26M in the transport chamber module. This enables the transport arm module 26M in a transport chamber module to be freely interchangeable with other similar transport arm modules, and conversely allows the transport arm module to be mounted in any transport chamber module with substantially no post installation adjustment.
  • the position control features 34 of the transport arm module and complementing features 36 of the module frame 22F are established in a repeatable position relative to the module reference datum, such as the workpiece transport plane W (see also Fig. 2A) .
  • the complementing features 36 of the transport chamber module frame 22F may be set using a reference jig 200 (see also Fig. 9) in a similar manner to that described before for the control features FL, FR of the module exterior interfaces 28L, 28R, 28F, 28B.
  • the control features 34 on the arm module 26M may also be established in a similar manner.
  • a reference jig 200A (see Fig. 10), of the same type as the reference jig 200 used for the module frame or of any other desired different type, may be used.
  • the reference jig 200A may have a base reference datum W (provided in any suitable manner) established from a global reference datum G' .
  • the base reference datum W and global reference datums G' in the jig 200A for the transport arm module 26M are the same as the base reference W and global reference datums G' of the reference jig 200 used for the chamber module frame 22F.
  • the global reference datum for both jigs may be the FAB floor, and the base reference datum the representative position for what shall become the workpiece transport plane W (see Fig. 2A) .
  • the base reference datum (s) used to establish the position determination features 36, 34 respectively on the chamber module frame 22F and the arm module 26M is substantially the same or common datum.
  • the reference jig for the transport arm module 26M also has registration datum features R34 used to set the control features 34 on the arm module 26M.
  • the transport arm module 26M may be positioned on the reference jig 200A (see Fig. 10) so that a desired portion of the end effector 32 (see also Fig. 2) , such as the workpiece support surface (not shown) is aligned with the base reference datum W (which as noted before corresponds in this embodiment to the workpiece transport plane W) .
  • the pivot axis Zi, Z 2 , Z 3 , of the pivot links may be set to ensure that the end effector 32 (i.e. its workpiece support surface/plane) remains aligned with the base reference datum W during r, ⁇ motion (see Fig. 2) of the arm 26.
  • the control features 34 on the arm module 26M are defined with any suitable forming or adjusting process to match the position of the registration datum features R34 on the jig 200A.
  • control features 34 of each arm module 26M are in a repeatable position.
  • the deterministic positioning configuration and repeatable position of the cooperative control features 36, 34 respectively on the chamber frame 22F and arm module 26M allow not only for rapid installation with accurate positioning of the arm module 26M in the chamber module 18 substantially without in place adjustment of the arm 26. That also facilitates the interchangeability of arm modules 26M in chamber modules 18, but further allows interchangeability of the arm module 26M with any other component module capable of being mounted inside the chamber module 18 (e.g. an aligner component module, or any other desired workpiece station, buffer module, metrology module, chamber) having position control features similar to control features 34 of the arm module.
  • any other component module capable of being mounted inside the chamber module 18 (e.g. an aligner component module, or any other desired workpiece station, buffer module, metrology module, chamber) having position control features similar to control features 34 of the arm module.
  • chamber module 18 is reconfigurable, capable of being turned for example from a transporter module, to an aligner module, metrology module or any other station module merely by swapping out the interior component modules .
  • each interface 28L, 28R, 28F, 28B of the transport chamber module 18 has an opening 280 therein through which workpieces may be transported in and out of the module.
  • Fig. 2A is a partial cross-sectional view of a representative module 18 in which interface 28L, 28R, 28B of the module are seen.
  • the interfaces 28L, 28R, 28B, 28F are similar, through in alternate embodiments different interfaces may be provided on different sides of the module.
  • each interface is sized to allow workpieces to be transported through the opening, by transport apparatus, along multiple different and separate travel lanes A, R.
  • the interface opening 280 is a single opening and can accommodate two (2) travel lanes A, R that are vertically separated from each other.
  • the opening may be sized to accommodate more than two different and separate travel lanes.
  • the different travel lanes for transporting the workpieces may be separated in any desired direction.
  • each travel lane may extend through a dedicated transfer opening.
  • the opening in one or more of the interfaces may accommodate but a single travel lane.
  • such interfaces may be located on module sides where but one process module is to be mated.
  • the separation between the separate travel lanes A, R is generally sufficient to allow work pieces S, each being transported along a different travel lane by different end effectors (e.g. one workpiece being transported along lane A by one end effector and the other workpiece being transported along lane R by a different end effector) , of the same or different transport apparatus, to pass one another.
  • the openings 280 in the module interfaces may be closable in order to allow the module interior to be isolated from the atmosphere on the other side of a given interface.
  • slot valves may be mounted on the module to seal the opening 280 in the interface.
  • the slot valves may be actuated pneumatically or electrically or by any other suitable actuation system.
  • Control of the slot valve actuation, as well as the other operable systems of the transport chamber module 18 (e.g transport arm 26) may be provided by controller 400 (see Fig. 1) .
  • the module 18 has a communication and power interface 20, shown schematically in Fig. 2, for interfacing the operable systems of the module 18 to the controller 400, and suitable power or actuation systems (e.g. electrical, pneumatic, vacuum, thermal, etc.) as will be described further below.
  • closure of the slot valves blocks the travel lanes A, R.
  • a single slot valve may be used for both travel lanes, or each of the travel lanes A, R. may have a different and separately actuable slot valve. This arrangement may be used when multiple stacked load locks or process modules are mated to one interface as will also be described below. Unused travel lanes through the opening may be sealed off with a closure mounted to the border of the opening and sealing the portion of the opening in which the unused travel lane is disposed.
  • the transport chamber module 18 may have a workpiece station 30 integrated thereto.
  • the workpiece station may be for example an aligner, a buffer, a metrology station, a heating station, a load lock or any other desired station or station combination.
  • the workpiece station may be configured as a sub-module 30M capable of being mounted and removed as a modular unit to the transport chamber module frame 22F.
  • the workpiece station module 3OM is mated to one of the mating interfaces 28R (Figs. 2-2A show the module 3OM at interface 28R and in alternate embodiments the workpiece station module may be located at any interface) .
  • the workpiece station module 30M may be provided with repeatable and position deterministic features (similar to features FL 1 FR on interfaces 28L,
  • the workpiece station 30 is a buffer station.
  • the buffer station in this embodiment has two support shelves/surfaces SSA, SSR, one to correspond to each travel lane through the chamber 18. In alternate embodiments, the buffer station may have more or fewer support shelves.
  • the workpiece station module may be mounted in any other position on the transport chamber module frame and may communicate with the chamber through a dedicated opening different from the workpiece transfer openings in the chamber module interfaces.
  • the workpiece station may be mounted in any other position on the transport chamber module frame and may communicate with the chamber through a dedicated opening different from the workpiece transfer openings in the chamber module interfaces.
  • the workpiece station structure may be integrated into the frame of the transport chamber module, and may not be removable as a module.
  • control and power systems (not shown) of the workpiece station 30 are interfaced, via a suitable coupling to control and power distribution systems (not shown) of the chamber module 18 that in turn are connected to the tool controller and power supplies.
  • control communication signals, and power may be directed to the appropriate systems of the workpiece stationed through the transport chamber module 18. Coupling of the workpiece station systems to the tool controller and power supply may occur automatically when the transport chamber module 18 is tied to the controller and power supply as will be described further below. In alternate embodiments, the workpiece station may be separately connected to the tool controller and power systems. As seen in Fig. 2A, the workpiece station 30 in this embodiment may have a closable opening 3OA through which the workpiece station 30 communicates with the module 18. The side 3OR opposite the communication access 3OA (of side 30C) to the transport chamber module 18 may have another closable opening 30O.
  • Openings 3OA, 300 may be similar to each other and to opening 280, of module 18 described before, sized for allowing multiple workpiece travel lanes (similar to but oriented at an angle to travel lanes A, R) and closable with similar gate/slot valves.
  • Work station 30 may thus be isolated from the transport chamber module 18 (e.g. by closing access opening 30A) .
  • the internal atmosphere of the work station 30 may be varied relative to the transport chamber module and vice versa.
  • the work station 30 may be provided with a vacuum or roughing pump 3OV such as available from Helix Technology Corp., for evacuating the atmosphere of the work station.
  • the atmosphere in the work station may be pumped down independent of the modules.
  • a controllable vent line (not shown) between module 18 and station 30 may allow controlled venting between module and station.
  • the vacuum pump 30V (see Fig. 2) may also be used to simultaneo ⁇ sly evacuate the atmosphere of both module 18 and station 30.
  • the access/opening 2OA may be open and pump 80V draws vacuum in module 18 via work station 30. Opening 300 may thus form the outer closable boundary of module 18, when station module 3OM is mounted to module 18 and communicating through access opening 3 OA.
  • the transport chamber module may be provided with a vacuum pump, and the work station may not have a vacuum pump.
  • the station module may have more or fewer openings on any other desired module sides.
  • the station module may have a positionally deterministic, repeatable located mating interface CRl, similar to position control FR on module frame 22F described before, for repeatable mating or other modules to the station module.
  • any desired module may be mated to the side 3OR of the station module, such as another tool interface section module (similar to module 14, see Fig. 1) or another transport chamber module similar to module 18, or a process module.
  • the transport chamber module 18 may be joined to other similar chamber modules to form the linearly distributed transport chamber 16 of the tool.
  • Each of the modules 18 may form a tool node linking several modules of the tool to each other structurally and operably as will be described further below.
  • the transport chamber 16, and hence, as will be described below, the tool itself is formed using a deterministic positioning approach that eliminates over constraints when mating tool modules together.
  • an initial section or module, of the tool 10 which may be a transport chamber module similar to module 18, or an interface section similar to section 12, or any other desired module or section of the tool 10, having a common reference datum (e.g. wafer transport plane W see Fig.
  • module 18 is shown as the initial module positioning of the initial module MO may be accomplished in any desired manner.
  • a support frame or other structure or device may be used to form a module position base MPB.
  • the support frame may be similar to the automation engine support frame described and shown in U.S. patent Application Serial No.: 11/154,787, filed June 15, 2005 previously incorporated by reference herein.
  • the frame may have a three point support based on the FAB floor, with adjustment capability to globally rotate the frame about axes X, Y (e.g.
  • the support frame may also have deterministic coupling features located from the global datum, which may mate with the position and inclination control features of the interfaces 28L, 28R, 28F, 28B of module 18, or with any other desired portion of the module.
  • the frame supports may be unadjustable, and any mounting adjustment may be provided at the supports engaging the initial module (e.g. adjustable mounts, shims, etc.).
  • the initial module is mated to the positioning base MPB, and the reference datum W alignment relative to the global datum is verified. Misalignment may be eliminated by using the in built adjustment capability of the positioning base MPB.
  • alignment is established when the workpiece transport plane is substantially parallel to the FAB floor.
  • the initial module/section MO of the tool aligned in the desired orientation, other modules and sections of the tool may be joined to the initial module.
  • the positionally deterministic and repeatably located control and positioning features at the module interfaces place the subsequent modules/sections, and internal components, in the desired repeatable orientation/locations on mating to the initial module MO. This substantially eliminates post mating adjustments to establish alignment between joined modules.
  • Fig. 3 shows an example where another transport module 18A (similar to module 18) is mated to a side 3OR of station 30 on initial module MO.
  • Transport module 18A is shown being added to side 3OR of the initial module MO for example purposes, and as may be realized other transport chamber modules may be mated to any desired side of the initial module. Also, modules may be mated to multiple sides of the initial module MO. Further, transport chamber modules may be mated to any one or more desired sides of other modules MI (see Fig. 3) of the transport chamber to linearly extend the transport chamber 16 to any desired length and configuration.
  • Fig. 3 is also helpful in illustrating a transport chamber arrangement in accordance with another exemplary embodiment, wherein each module is part of different linearly extended transport chambers, for example parallel transport chambers 16, 161 having substantially parallel longitudinal axes in the direction of the Y axis shown in Fig. 3.
  • the mating of module 18A and 18 may provide a shunt 16S between different transport chambers (represented respectively by module 18 and module 18A) .
  • the shunt allows transfer with transport arms 26, 26A of workpieces (if desired along different travel lanes similar to lanes A, R) between transport chambers.
  • the position and control features on the respective mating interfaces of the modules 18, 18A enable ready verification of alignment of the workpiece transport planes (similar to plane W) of the transport chambers with each other. For example, if the position control features are properly engageable, then the workpiece transport planes of the different chambers are aligned with each other.
  • the different transport chambers may be isolated from each other by slot valves, similar to slot valves in opening 300 in Fig. 2A.
  • the workpiece station of one ⁇ of the transport chamber modules 18, 18A may be configured as a load lock (i.e. provided with suitable systems to cycle between different atmospheres such as inert gas, vacuum, etc) .
  • a load lock i.e. provided with suitable systems to cycle between different atmospheres such as inert gas, vacuum, etc.
  • the transport chambers may be vertically stacked or vertically offset with one chamber crossing over the other.
  • the vertically offset transport chambers may be joined to each other by a passage, such as a vertical passage allowing a workpiece to be shuttled in between chambers.
  • the transport arm may be provided with sufficient Z axis travel to allow workpiece transport from one transport chamber to another.
  • the tool interface section 12 (described before) is shown mated to transport chamber module 18.
  • transport chamber module 18 has been described for example purposes only, as forming an initial or base module MO of the tool.
  • the interface section 12 may be mated to the base module MO of the tool transport chamber 18.
  • the interface section may be mated to any desired transport chamber module of the tool.
  • One or more of the interface section (s) 12, ' 12' may be mated to different transport chamber modules along the length of the transport chamber 16 (see also Fig. 5) .
  • the interface section may have position and inclination control features, similar to features F L/ F R of the transport chamber module 18 described before that may cooperate with mating control features F L , F R on the module 18 to place at least the automation engine portion of the interface section in the desired position and orientation relative to the transport chamber module 18 and hence to the whole transport chamber 16, when the interface section and module are joined.
  • the workpiece transport planes similar to plane W in Fig. 2) of the tool interface section 12 and the transport chamber 16 (i.e. the modules forming the transport chamber) are substantially aligned with each other on joining the interface section and transport chamber module to each other.
  • one or more of the workpiece travel lanes may extend from ⁇ the transport chamber 16 to the tool interface section.
  • the workpiece transport plane of the transport arm 15 of the interface section may be aligned with but offset (e.g. vertically offset) from the travel lanes A, R in the transport chamber 16.
  • the tool interface section 12 may be mated to any desired interface 28L, 28R, 28F, 28B of the transport chamber module 18.
  • the tool interface section 12 may be positioned in general alignment with the longitudinal axis X of the linear chamber 16, or may be mated to the transport chamber in a position offset from the longitudinal chamber axis X.
  • the tool interface section 12 may be joined to an end 16E of the transport chamber 16, or at least an end of a portion of the transport chamber (i.e. module 18 in Fig. 1 may be an end module) and the longitudinal axis X of the chamber
  • the interface section or its cassette support (s) CS may be generally facing in but offset (e.g. horizontally) from the longitudinal axis X of the transport chamber.
  • FIG. 6 there is shown a schematic plan view of a workpiece processing system 310, that is similar to system 10, and where the tool interface section 312 (substantially similar to section 12) is mounted to a transport chamber module 318 (substantially similar to module 18) so that the interface section 312 is facing generally towards (e.g. inwards) but is offset from the longitudinal axis X of the transport chamber 316.
  • the transport chamber 316 may be extended by attaching other transport chamber modules 318A, 3181 to interfaces 328R, 328C (i.e.
  • transport chamber module 318A is connected to interface 328R of the module 318 for example purposes (and modules 3181 are connected serially in a similar manner) .
  • Another module XM (shown in phantom in Fig. 6) may be connected to interface 328L, in this embodiment generally opposite module 318A at interface 328R of module 318.
  • Module XM may be another transport chamber module, similar to module 318, or a workpiece transfer station or load lock module joined if desired to module 318 to continue extension of the transport chamber along axis X.
  • the transport chamber 316 may be transverse to the tool interface section 312 and extending on both sides of the interface section 312.
  • the module XM at interface 328L of the transport chamber module 318 may be a processing module (such as metrology, dielectric deposition, etching, lithography, etc. and not a transport chamber module) .
  • module 318 may have still another module XM (shown in phantom) mated to interface 328B, substantially opposite the tool interface section 312.
  • the module XM at the interface 328B may be a transport chamber module (e.g.
  • module 318 similar to module 318, or a transfer, buffer station or load lock module joined to module 318 if desired to extend the linearly elongated transport chamber 316 in the direction of axis Y (see Fig. 6) .
  • the linearly elongated transport chamber in the exemplary embodiment may be given any desired configuration.
  • Additional transport chamber modules, similar to modules 318, XM may be joined to interfaces, similar to interfaces 328L, 328R, 328B of modules XM to continue extending the transport chamber linearly in any desired direction.
  • module 318A may have a module XM, connected to module interface 328BA.
  • Module XMl which is shown in phantom in Fig.
  • module (s) XM, XMl may be workpiece processing modules) (e.g. metrology, material deposition, lithography, etching, etc.) rather than transport chamber modules.
  • the distributed workpiece transport system 320 formed by transport arms 326, 326A, 326i that are similar to transport arm 26 (see also Fig.
  • the transport system 320 may be capable of transporting workpieces through the transport chamber along multiple independent travel lanes allowing workpieces to move in different directions, and pass one another, throughout the linearly elongated transport chamber .
  • the transport system 320 may transport workpieces into/out of the processing modules PM arrayed along the sides of the elongated transport chamber 316.
  • processing modules PM are connected to interfaces 328Bi, 328Fi, 328Ri of transport chamber modules 318i.
  • the transport arms 3261 mounted in the transport chamber modules 3181 are capable of transporting workpieces S into and out of the corresponding processing modules as shown.
  • the processing modules PM may be of any desired type (e.g. epitaxial silicon, material deposition, ion implantation, lithography, etching, rapid thermal processing, polishing, etc.).
  • the processing modules PM arrayed along the sides of the linear transport chamber may be of different types positioned in the linear processing module array in any desired order.
  • the array order may be in accordance with a desired workpiece fabrication protocol associated with a desired workpiece transport direction (e.g. in the direction indicated by arrow A in Fig. 6) through the transport chamber.
  • modules 318, 318A, 3181 of the transport chamber may have slot valves SV (similar to slot valves for closing module opening 280 in Fig. 2A) for isolating the transport chamber module, and hence the transport chamber from the processing module (s) PM adjoined thereto.
  • slot valves SV may isolate modules 328, 328A, 3281 or portions of ' the transport chamber from each other so that the isolated modules/portions may hold different atmospheres.
  • a portion of the transport chamber 316A may have an atmosphere such as an inert gas (N 2 ) or high purity air for example corresponding to the atmosphere of processing modules XMl joined to and communicating directly with that portion of the chamber, and an adjoining portion of transport chamber 316B may hold a different atmosphere, such as vacuum, that may correspond to the processing modules PM joined to and communicating with that portion of the transport chamber.
  • the transport chamber may have a loadlock 316LL (see Fig. 6) between transport chamber modules 328A, 328i with different internal atmospheres, allowing workpiece(s) to pass between the transport chamber modules without compromise of the different internal atmospheres.
  • the loadlock 316LL may be a modular section, for example similar to station module 3OM (see Fig.
  • the loadlock 316LL may have any other desired configuration. Slot valves SV may close transport passage openings thereby isolating the loadlock module from the transport chamber modules 318A, 3181 joined to the loadlock module 316LL.
  • the loadlock module 316LL may have suitable systems (e.g. vacuum connection, vent, etc.) for cycling the atmosphere to match atmospheres of adjoining transport chamber sections.
  • the transport chamber may include any desired number of loadlocks similar to loadlock module 316LL.
  • the processing system 310 may have more than one entry/exit station for inserting and removing workpieces S from the processing system.
  • one entry/exit station is provided by interface section 312 and another entry/exit station is provided by interface section 312A.
  • interface section 312A is generally similar to interface sections 12, 312 described before (see also Fig. 1) .
  • the interface section may have any other desired configuration allowing workpiece(s) to be inserted/removed from the linear transport chamber and the processing system without compromise of the isolated atmosphere inside the transport chamber.
  • the additional interface section 312A may communicate with a material handling system (e.g. an overhead AMHS, conveyor system, ground vehicles, etc.) allowing workpieces to be loaded and unloaded from the additional interface section 312A.
  • tool interface section 312 may be located at an end of the transport chamber 316 (e.g.
  • modules XM connected to the transport chamber module 318 are processing modules, or if no modules XM are connected to the transport chamber module) , or may be located at an intermediate position on the linear transport chamber if the transport chamber 316 extends on both sides of the interface section (e.g. at least one of modules XM is a transport chamber module) .
  • the additional interface section 312A may be positioned at an end (e.g. an opposite to the end with interface section 312) of the transport chamber, or at an intermediate position along the transport chamber.
  • having multiple entry/exit stations on the transport chamber and the tool allows insertion of a workpiece(s) via one station and post processing removal of the workpiece(s) through a different entry/exit station that may be closer to workpiece(s) post processing than the station of entry.
  • workpiece(s) may be inserted into the transport chamber 316 (and tool 310) via interface section 312 and transported, by arms 326, 326A, 3261 of transport system 320 for processing in the direction indicated by arrow A.
  • the workpieces may be located closer to interface section 312A than the interface section 312 of entry. Accordingly, the workpiece(s) may be transported by distributed transport system 320 (e.g.
  • interface section 312A allows entry of the workpiece(s) into the processing system as close as desired to the desired processing modules and bypassing undesired portions of the transport chamber/processing system. This improves throughput of the system with less WIP (compared to conventional systems) and quicker "turnaround" times (e.g. time to process single carrier lot or "hot lot”).
  • the transport chamber 16, 316 may be capable of being provided with any desired length to add any desired number of processing modules.
  • the transport chamber 16, 316 length may be established to provide an optimum number of processing modules for the handling capacity of the processing system, that will be described below, and achieve a maximum throughput for the processing system.
  • the transport chamber may be formed to extend through a portion of the processing facility as illustrated in the exemplary embodiment shown in Fig. 5.
  • Fig. 5 is a schematic plan view of a processing system 510 generally similar to systems 10, 310.
  • Distributed transport system similar to transport system 20, 320 transports substrates or workpiece(s) S through process steps within the fabrication facility 510 through transport chambers 516A-516J.
  • Transport chambers 516A-516J are formed from serially connected transport chamber modules 518 similar to modules 18 described before.
  • Process steps may include epitaxial silicon 630, dielectric deposition 632, photolithography 634, etching 636, ion implantation 638, rapid thermal processing 640, metrology 642, dielectric deposition 644, metal deposition 648, electroplating 650, chemical mechanical polishing 652.
  • more or less processes may be involved or mixed; such as etch, metal deposition, heating and cooling operations in the same sequence.
  • the transport system may be capable of carrying a single or multiple workpiece(s) and may have transfer capability, such as in the case where a transport arm 526 of the transport system has the capability to pick a processed workpiece and place an unprocessed wafer at the same processing or transport chamber module.
  • Valves 654 may be sealed valves or simply conductance type valves depending upon the pressure differential or gas species difference on either side of a given valve 654. In this manner, workpieces may be transferred from one process step to the next. Examples of such pressure or species difference could be for example, clean air on one side and nitrogen on the other; or roughing pressure vacuum levels on one side and high vacuum on the other; or vacuum on one side and nitrogen on the other.
  • Load locks 656 may be capable of transitioning multiple workpieces on multiple workpiece travel lanes. For example, substrate ⁇ s) may be transferred into load lock 656 on shelves (not shown) or otherwise dedicated to a desired travel direction. Additional features 658 such as alignment modules, metrology modules, cleaning modules, process modules (ex: etch, deposition, polish etc..) , thermal conditioning modules or otherwise, may be incorporated in lock 656 or the transport chambers.
  • the transport chamber has multiple entry/exit stations positioned along the chamber length as desired to inert/remove wafers from the tool.
  • the transport chamber may communicate directly with wafer or carrier stockers 662, 664, provided to store and buffer process and or test ' wafers.
  • stockers 662, 664 may not be provided, such as where the transport chamber communicates with lithography tools 634 directly.
  • the processing tool 510 may have an express transit passage or chamber 570.
  • the transit passage 570 is connected at desired locations to the transport chamber 516 and also to one or more tool interfaces 512.
  • the transit passage 570 may have a transport shuttle (s) or vehicle (s) 572 capable of traversing the length of the transit passage.
  • the shuttle 572 may be capable of holding workpiece(s) or a workpiece carrier, and transporting the workpiece (s) or workpiece carrier through the length of the transit passage 572.
  • the transit passage 570 may be a linearly elongated tube capable of holding an isolated atmosphere, such as N 2 or vacuum, or may have an atmosphere of highly clean air, that may be circulated through a desired filtration.
  • the transit passage 572 is schematically depicted as extending along the transport chamber 516.
  • the transit passage 570 has interconnect passages 576, 578 (two are shown for example purposes and in alternate embodiments there may be more or fewer interconnection passages) connecting the transit passage tube to the desired modules 656, 654 of the transport chamber 516.
  • interconnect passage 576 is joined to an intermediate loadlock (LL) module 656, and another interconnect passage 578 may be joined to another LL module 654 located at an end of the linear portion 516C of the transport chamber.
  • the interconnect passage (s) may be joined to any desired portion of the transport chamber 516, such as a transport chamber module 518.
  • the interconnect passages are sized to allow passage of one or more workpieces between the transport chamber 516 and transit passage 570.
  • a transfer system (not shown) for moving the workpieces between the transit passage and transport chamber through the interconnect passage may be provided in the transit passage or transport chamber as will be described in greater detail below.
  • the transit passage 570 may be located in any desired position relative to linear transport chamber 516 to allow the interconnect passages to be joined to the transport chamber.
  • the transit passage may be located above, along side or under the transport chamber.
  • the interconnect passages may be mated to any desired workpiece transit openings of the transport chamber modules, such as side openings similar to the closable openings 280 in interfaces 28L, 28R, 28F, 28B (see Figs.
  • the transit openings may be closed by suitable valves (similar to slot valves 654 for side openings) to isolate the transport chamber atmosphere from the transit passage.
  • the transit passage may have any other desired orientation, such as being angled relative to the transport chamber.
  • the transit passage has a passage 574 that communicates tool interface section 512 to allow workpiece (s) to be loaded/unloaded from shuttle 572 from the interface section.
  • the shuttle 572 is capable of substantially uninterrupted movement within transit passage 570 between for example interface section 512 and interconnect passages 576, 578, may thus transit workpiece (s) in the controlled atmosphere of the transit passage between interface section 512 and the interconnect passages 576, 578, or between passages 576, 578 thereby allowing the workpieces to bypass transport through portions of the transport chamber.
  • the shuttle 572 which may have any desired vehicle configuration, is capable of generating higher workpiece transport speeds than distributed transport system 520. Moreover, by bypassing portions of the transport chamber 516, throughput of the processing tool 510 is increased and WIP is reduced. As may be realized, turnaround time for "hot lots" is also reduced.
  • a single workpiece (“hot lot”) carrier may be loaded, by a FAB AMHS (not shown) , at tool interface section 5120, where the "hot lot" workpiece (s) are to be processed at processing modules PMl and PM2, the workpiece (s) may be picked, by a suitable transfer system (such as an indexer in the interface section) , from the interface section 5120 and placed onto shuttle 572.
  • the shuttle 572 may transit through passage 570 to interconnect passage 576, and the workpiece may be loaded, by another suitable transfer system (not shown) to load lock 656.
  • the workpiece is expressed from the loading location to a portion of the tool 510 proximate to the desired processing steps.
  • the LL 656 may be cycled to allow the transport system 520 access to the workpiece.
  • the workpiece may be moved through the transport chamber 516C by transport system 520 and loaded and unloaded from the desired processing modules PMl, PM2 for processing.
  • the workpiece may be located, for example, near the LL to which interconnect passage 578 is connected. Accordingly, the workpiece may be transported, by transport system 520, to this LL for loading unto shuttle 572.
  • the LL may be cycled to facilitate access for loading the processed workpiece onto the shuttle 572 in the transit passage without compromise of the different atmosphere in the transport chamber 516C.
  • the shuttle 572 may express the processed workpiece to a desired location, such as tool interface section 5120 (via passage 574) or interface section 5121 (via passage 576) for loadout.
  • the express transit passage may have any desired length and configuration, and may communicate to allow workpiece transfer with any desired portion of the processing tool 510 including for example metrology, workpiece stocker (WS) or carrier stocker (CS) sections, lithography sections 634, etc.
  • Tool 410 may have a linear transport chamber 416 extending along axis X.
  • the chamber 416 may be formed by serially connecting chamber modules 18B, 18i (similar to previously described transport chamber modules 18, 18A) in a manner as described before for transport chambers 16, 316.
  • Workpiece transport system 420 (similar to transport systems 20, 320, 520) formed by transport arms 26B, 26i, pivotally mounted in corresponding chamber modules 18B, 18i, is linearly distributed through the transport chamber.
  • the transport chamber 416 may be connected to a tool interface section (not shown) in a manner similar to interface section 12 shown in Fig. 1, or interface sections 312, 312A shown in Fig. 6 to provide the transport chamber with one or more workpiece entry/exit stations as previously described.
  • workpiece stations 3OB, 3Oi (similar to workpiece station 30 also described before) are interstitially located between transport chamber modules 18B, 18i.
  • the tool 410 in this exemplary embodiment also includes a load lock module 56 that enables the transport chamber modules 18B, 18i on opposite sides of the load lock module 56 to have different internal atmospheres.
  • the configuration of the load lock module shown in Fig. 4 is representative and the load lock module may have any desired configuration allowing pass through of workpieces between adjoining transport chamber modules using the corresponding transport arms of the respective modules .
  • the configuration of the load lock module may be similar to the transport chamber module 18 (for example utilizing a similar frame/casing with similar positioning control features FL, FR shown in Fig. 2 and described before) or the workpiece station 30.
  • the load lock module has no integral workpiece transport and workpiece transit of the load lock module is effected with the transport arms 26b, 26i in adjoining chamber modules.
  • the load lock module may have an integral transport arm/mechanism capable of moving the workpiece relative to the transport chamber.
  • the loadlock or adjoining transport chamber modules may have slot valves 54, capable of closing the transit opening, similar to opening 280 (see Fig. 2A) , to selectably isolate the loadlock from the atmospheres of the adjoining transport chamber modules.
  • Processing modules PM, PMA, PMB may be connected to the side interfaces of the transport chamber modules 18B, 18i of the transport chamber. As seen in Fig. 4, the processing modules connected to the transport chamber form linear arrays.
  • the processing modules connected to the transport chamber may also be arranged in vertical stacks or columns.
  • a stack SPM of processing modules PMA, PMR may be connected to transport chamber module 18B.
  • stacked processing modules may be joined to any desired side interface of any desired transport chamber module.
  • Fig. 4B shows a schematic cross sectional view of transport chamber module 18B and the stacked processing modules PMA, PMR joined to side interface 28LB of the transport chamber module.
  • the side mounting interface 28LB of the chamber module 18B has multiple vertically offset workpiece transit openings TO to support corresponding mating of the processing modules.
  • the side interface 28LB is shown having two vertically offset workpiece transit openings TO for example purposes, and in alternate embodiments the module interface may have more workpiece transit openings supporting mating of a commensurate number of processing modules to the given interface of the transport chamber module. As may be realized, processing modules may not be connected at some of the workpiece transit openings. Hence, in alternate embodiments for example, a processing module may be connected to one of the transit openings but not the other.
  • the transport arm 26B of the chamber module 18B has a suitable Z drive 260Z capable of indexing or moving the arm, and in particular the end effector (s) 32B, up and down in the direction indicated by arrow Z.
  • the end effector (s) 32B which is schematically depicted and may be capable of holding one or a batch of workpieces, may be indexed to align with transit openings TO.
  • Transfer of workpieces between transport chamber module 18B and processing modules PMA, PMR may be effected by moving the end effector 32B (via e.g. ⁇ , r arm articulation) in the direction indicated respectively by arrows Y2, Yl in Fig. 4B.
  • the transit openings TO, and hence the workpiece transfer planes to respective processing modules PMA, PMR may be substantially aligned with corresponding workpiece travel lanes A, R in the transport chamber 416 provided by the transport system 420 as will be described below.
  • This allows the transfer arm 26B moving a workpiece through the transport chamber module 18B along a travel lane A, R to transfer the workpiece to a processing module PMA, PMR, and vice versa (e.g. picking a workpiece from processing modules PMA, PMR for moving along a travel lane A, R) without indexing (Z movement) the end effector 32B.
  • the workpiece travel lanes A, R in transport chamber 416 may be polarized, workpieces being transported along travel lane A moving in one direction, for example advancing from a desired origin point such as an entry/exit station and workpieces being transported along travel lane R moving in an opposite direction, for example returning relative to the desired origin.
  • the processing modules PM, PMA, PMR substantially aligned with respective travel lanes A, R may be configured to perform process steps corresponding to the travel direction (e.g. process direction) of aligned travel lane.
  • the process steps of modules PM, PMA, PMR may be related to the chamber travel lane A, R with which the respective process module PM, PMA, PMR are substantially aligned.
  • the process performed by modules PMA, PM aligned substantially with lane A as shown in Fig. 4B
  • the process performed by module PMR corresponds to the process direction defined by lane R.
  • the terms "advancing”, “returning” are used herein merely to help identify that direction of travel along different lanes may be different relative to each other.
  • the travel directions along lanes A, R may be established as desired relative to the transport chamber 416.
  • the process of modules attached to the transport chamber may be independent of the travel lanes A, R in the chamber.
  • utilities such as control signals, power, vacuum, pneumatics, • etc. for the components (e.g. transport chamber modules 18B, 18i, transport arms 26B, 26i, workpiece stations 3OB, 3Oi, load lock module 56, slot valves, etc.) of the tool 410 may be provided from a utility system 80 which is schematically depicted.
  • a utility system 80 which is schematically depicted.
  • the controller C may be communicably connected to utility 80, 680.
  • the utility may include suitable communication links for connecting the controller C with the components of the tool 410, 510.
  • the utility 80 may have coupling 80c configured to receive communication and power interface 21B, 2Ii of the transport chamber module 2IB, 2Ii connected to form the transport chamber 416.
  • the coupling 8OC and interface 21B, 21i may be provided with integral programming to automatically provide a "plug and play" capability on connection of the respective interface 2IB, 2Ii to the corresponding coupling.
  • the coupling and interface may be respectively a USB port and connector.
  • Mating of the interface 21B, 21i to the coupling may automatically identify to the controller C the module configuration, for example module 28B is transport chamber module, with transport arm having (M) degrees of freedom and the control parameters for the transport arm drive section motors, and control instrumentation, identification and control parameters for any other controllable system resident on module 28B, position of module with respect to a desired reference frame (e.g. sixth module of transport chamber) .
  • the information, which is downloaded automatically by controller C on mating interface 2IB, 21i and coupling 80C thus may provide controller with system information and control parameters for all controllable systems of the module being controlled by controller C to enable the controller to communicate and control operation of the module's controllable systems substantially immediately on coupling.
  • the information may also provide the controller C with the geometric parameters defining the transport "space" of the transport chamber 416, incorporating the specific transport chamber module 28B, 28i, for establishing the kinematic equations and commands controlling transport motions.
  • the downloaded information may- allow the controller to establish the spatial coordinates (X, Y, Z) of various features, such as pivot axes (see Fig. 2A) of the transport arm 26B, the transfer openings 280, TO, chamber boundaries, center of workpiece pick, place positions, etc.
  • the information programmed into interface 21B, 21i may be but a portion, or an identifier, sufficient to enable the controller to look up/read the information from a memory location (not shown), of the controller where the control information may have been preprogrammed.
  • the controller may be programmed with lookup tables or an algorithm establishing the X, Y, Z coordinates for kinematic relevant features such as pivot axes of the transport arm 26B, 2 ⁇ i, the locations of workpiece transfer openings, module chamber walls for (i to M) transfer chamber modules. This is facilitated by the interchangeability and position control features of the different transport chamber modules.
  • controller C may also be programmed with the "rough" kinematic command architecture and the fine teach protocol for controlling motion of end effectors on corresponding transport arms (similar to arm 26B) of respective (i to M) transport chamber modules.
  • the interchangeability and position control features of the transport chamber modules allow the "rough" kinematic command architecture for arm control to be established by computational methods, or physically with the transport chamber module disconnected from transport chamber (e.g.
  • the term "rough” is used herein merely to indicate that kinematic commands established without in place teaching of the arm control with the transport chamber module mated to the rest of the transport chamber.
  • An indication to the controller, upon a given interface 21B, 21i coupling, that (M) module has been attached to the transport chamber, may cause the controller to access the corresponding "rough" kinematic command architecture, and if desired fine teach protocol for controlling the motions of the corresponding transport arm and hence of the distributed transport system.
  • the module interface 21B, 21i may be programmed with any other desired information to be downloaded by the controller on coupling.
  • the controller C may further automatically access, or automatically make available to an operator corresponding programming to initialize the respective operable systems/components and query status of the various systems (e.g. slot valves open/shut, transport encoders position, etc.). Similarly, the controller C may automatically lookup and initialize suitable test protocol to verify that the systems (hardware, software) of the added module are operating nominally and if desired actuate module systems to bring them to a "zero" position.
  • the controller may enable display features (not shown) , for example indicating to an operator the addition of the module, the present configuration of the transport chamber and tool, as well as command protocol allowing entry of operator commands, via a desired user interface, to operate the systems on the added module or modify workpiece process protocol carried out by the tool to incorporate the newly available features from the added module.
  • the controller may add or enable features on the display (not shown) schematically representing the module and its relative position in the transport chamber with respect to other modules as well as presence and status of any module systems.
  • Also enabled may be user selectable features such as "soft keys", for initializing test programs, or teaching programs (e.g. fine teaching programming for arm 26B) for the module systems.
  • any desired user interface architecture may be employed, and in alternate embodiments more or fewer features may be enabled by the controller at coupling.
  • FIG. 4A there is shown a schematic elevation view of processing tool 410 such as may be taken along longitudinal axis X of the linear transport chamber 416.
  • Fig. 4A shows tool interface section 12 representatively connected to the transport chamber 416.
  • interface section 12 may define one end of the tool transport chamber 416.
  • the transport chamber 416 may have another workpiece entry/exit station 412 for example at an opposite end from interface station 12.
  • Station 412 may be similar to interface section 12 (see also Fig. 1), though in alternate embodiments the entry/exit station may have any other desired configuration. In other alternate embodiments, other entry/exit stations for inserting/removing workpieces from the transport chamber may be provided.
  • interface section 12 and entry/exit station 412 may allow loading and unloading of workpieces from the tool.
  • workpieces may be loaded into the tool from one end and removed from the other end.
  • the configuration/arrangement of the transport chamber modules 18B, 18i, load lock modules 56A, 56B and workpiece stations forming the transport chamber 416 shown in Fig. 4A is merely exemplary, and in alternate embodiments the transport chamber may have any other desired modular arrangement.
  • station 412 may be a load lock.
  • a load lock module may be located between the end entry/exit station (similar to station 412) or the adjoining transport chamber module (similar to module 18i) may be configured to operate as a load lock.
  • transport chamber modules 18B, 18i have corresponding transport arms 26B, 26i located therein.
  • the transport arms 26B, 26i of the respective transport chamber modules 18B, 18i may cooperate to provide the linearly distributed workpiece transport system 420 in the transport chamber.
  • the transport arms 26B, 26i of the respective chamber modules 18B, 18i may be similar to each other. Accordingly, the transport arms will be described below with particular reference to arm 26B.
  • the transport arms/apparatus of the respective chamber modules may have different configurations.
  • the transport arm 26B may have a general scara configuration, similar to arm 26 seen best in Fig. 2.
  • the transport arm may have any other desired configuration, such as a "frog leg" configuration, and in other alternate embodiments any other desired transport apparatus that is positionally fixed to the transport chamber and having a displaceable end effector may be used.
  • the transport arm 26B may have a single forearm (similar to forearm 26F in Fig. 2) pivotally mounted to upper arm (similar to upper arm 26U in Fig. 2) and with an end effector 32B depending therefrom.
  • the transport arm 26B may have a suitable drive section for providing the arm with three (3) (e.g. independent rotation about shoulder and elbow joints similar to joints 26S, 26E in Fig. 2, and Z axis motion) or four (4) (e.g.
  • the modules 56A, 56, 3Oi located interstitially between transfer chamber modules 18B, 18i may define passive portions of the linearly distributed transport system 420 in transport chamber 416.
  • the interstitial modules, such as load locks 56A, 56 and workpiece station 3Oi may each have stationary workpiece supports/shelves 56S, 56Sl, 56S2, 30Sl, 30S2 that cooperate with ' the transport arms to effect transport or workpieces through the length of the transport chamber along linear axis X of the transport chamber.
  • workpiece (s) may be loaded into the transport chamber 416 by interface section 12.
  • the workpiece (s) may be positioned on the support (s) of load lock module 56A with the transport arm 15 of the interface section.
  • the workpiece(s) , in load lock module 56A may be moved between load lock module 56A and load lock module 56 by the transport arm 26B in module 18B, and in a similar and consecutive manner between load lock 56 and workpiece station 3Oi with arm 26i (in module 18i) and between station 3Oi and station 412 with arm 26i in module 18i. This process may be reversed in whole or in part to move the workpiece (s) in the opposite direction.
  • workpieces may be moved in any direction along axis X and to any position along the transport chamber and may be loaded to and unloaded from any desired module (processing or otherwise) communicating with the transport chamber.
  • interstitial transport chamber modules with static workpiece supports or shelves may not be provided between transport chamber modules 18B, 18i.
  • transport arms of adjoining transport chamber modules may pass off workpieces directly from end effector or one transport arm to end effector of another transport arm to move the workpiece through the transport chamber .
  • the transport arms 26B, 26i and workpiece shelves 56S, 56Sl, 56S2, 30Sl, 30S2, that collectively provide the distributed transport system 420 are configured in this embodiment to allow the transport system 420 to define multiple workpiece travel lanes A, R that are separate from one another.
  • multiple travel lanes A, R are shown for example purposes. In alternate embodiments, there may be more or fewer travel lanes.
  • the workpiece transit openings (similar to opening 280 in Fig.
  • transport chamber modules 18B, 18i and interstitial modules 56A, 56, 3Oi through which the modules communicate with each other and other through which workpiece transit between modules, are sized to accommodate workpiece transit along the multiple travel lanes A, R.
  • the transport arms 26B, 26i in the exemplary embodiment, may be indexed to one Z position to effect movement along one travel lane A, R, and may be indexed to another Z position to effect movement along the other travel lane A, R.
  • the static workpiece shelves 56S, 56Sl, 56S2, 30Sl, 30S2 in the interstitial modules may be positioned to be substantially aligned with the respective travel lanes A, R as shown in Fig. 4A.
  • capacity of the workpiece shelves 56S, 56Sl, 56S2, 30Sl, 30S2 may be commensurate with the workpiece capacity of end effectors 32B, 32i on the as may be realized, capacity of the workpiece shelves 56S,
  • 5651, 56S2, 30Sl, 30S2 may be commensurate with the workpiece capacity of end effectors 32B, 32i on the transport arms. Accordingly, transfer between end effectors 32B, 32i and workpiece shelves 56S, 56Sl,
  • buffer shelves BA, BR may be provided in the interstitial modules 56A, 56, 3Oi to buffer workpieces transported along travel lanes A, R.
  • the position and number of buffer shelves shown in Fig. 4A is merely exemplary, and in alternate embodiments the interstitial modules may have any desired number of buffer shelves positioned in any desired manner.
  • the travel lanes defined in the transport chamber 416 may have polarized travel directions respectively indicated by arrows A, R for the corresponding travel lanes.
  • travel direction along lane A is "advance” /away from tool interface section 12, and the direction along lane R is “return” /towards the tool interface section 12.
  • the travel direction for the respective lanes shown in Fig. 4A are merely exemplary, and in alternate embodiments the travel lanes may have different travel directions. As may be realized, the travel directions are schematically illustrated in Fig. 4A as away from/"advance” along lane A, and “return” /towards along lane R a desired reference location of the transport chamber (in this embodiment the tool interface section 12) .
  • This directional scheme is used through the description to indicate the travel direction along respective lanes A, R in the transport chamber regardless of transport chamber configuration (e.g.
  • the travel direction of the respective lanes A, R is substantially constant through the transport chamber 416.
  • travel direction along lane A is away from interface 12 throughout chamber 416
  • travel direction along lane R is towards interface 12 throughout the chamber.
  • different portions of the travel lane may have different travel directions (e.g. travel on part of a lane may be away from, and travel on an adjoining part of the travel lane may be towards the reference location) .
  • travel directions e.g. travel on part of a lane may be away from, and travel on an adjoining part of the travel lane may be towards the reference location.
  • the workpiece shelves 56S, 56Sl, 56S2, 30Sl, 30S2 may also be polarized in accordance with direction polarization of corresponding travel lanes A, R.
  • workpiece shelves 56Sl, 30Sl that are in this embodiment may be substantially aligned with travel lane A as noted before
  • workpiece shelves 56S2, 30S2 may hold workpieces traveling along lane R.
  • the transport arms 26B, 26i may pick/place the workpiece on shelves 56Sl, 30Sl corresponding to lane A, and when ⁇ moving workpieces along lane R, transport arms 26B, 26i may pick/place the workpieces on shelves 56S2, 30S2.
  • the buffer shelves BA, Br of the interstitial modules 56, 3Oi in the exemplary embodiment may also be polarized in accordance with direction polarization of corresponding travel lanes A, R.
  • Buffer shelves BA may buffer workpieces traveling along lane A
  • buffer shelves BR may buffer workpieces traveling along lane R.
  • workpieces may be transferred between travel lanes by indexing transport arms 26B, 26i as desired.
  • Processing of workpieces with tool 410 may be performed for example by loading the workpieces in tool interface section 12.
  • the workpieces may be carried to tool interface section 12 in a Carrier CAA. Transported by a desired AMHS system and docked with interface section 12 as described before and shown in Fig. 1.
  • the workpieces may be loaded from the Carrier CAA into the transport chamber 416 of the tool by transport arm 15 via load lock 56A.
  • the workpiece processing protocol may use process steps (provided by processing modules PM see Fig. 4) corresponding to, and hence disposed along travel lane A as described previously.
  • the workpieces may be placed on shelve (s) 56Sl of load lock 56A, for travel along lane A.
  • load lock chamber may be a workstation module configured (similar to station 30M) also as a metrology station or a heating/cooling station.
  • the load lock work shelves may have heating/cooling elements for operating on substrates seated thereon. Accordingly when on the shelf the substrate may be heated/cooled.
  • the workpiece(s) may be moved, with arms 26B, 26i, along and in the direction of travel lane A (e.g. away from tool interface section 12) to the desired process steps.
  • the direction of travel lane A moves workpieces away from tool interface section 12 and towards entry/exit station 412.
  • entry/exit station 412 may be used to remove processed workpieces if desired, and thus processes workpieces may be moved along and in the direction of travel lane a to station 412 for unloading from the tool. If the workpiece processing protocol calls for further processing with processing steps corresponding to and arrayed along travel lane R, the workpiece may be indexed from travel lane A to travel lane R as previously described and moved along and in the direction of lane R to the desired processing steps. If removal from the tool 410 is desired via interface section 12, the processed workpieces may be transported along lane R back to interface section 12 for offload.
  • Tool 410' is similar to tool 410 (and tools 10, 310, 510) described previously, except as otherwise noted. Similar features are similarly numbered.
  • Tool 410' may have a linear transport chamber 416" formed by transport chamber modules 18B' , 18i' and interstitial modules such as load lock modules 56A' , 56' and workpiece station 30i' serially connected together as shown.
  • the transport chamber modules 18B' , 18i' are similar to each other and the previously described transport chamber modules 18, 18A, 18B, 18i.
  • Transport chamber modules 18B', 18i' have transport arms 26B' , 26i.
  • the transport arms 26B', 26i' may be similar to each other and will be described in greater detail below with specific reference to arm 2 ⁇ B' .
  • the transport chamber modules may have transport arms with different configurations.
  • Transport arm 26B' in this embodiment has a general scara arm configuration, similar to arm 26 seen best in Fig. 2 except as otherwise noted.
  • the transport arm may have any other desired configuration.
  • arm 26B' may have multiple forearms (two are shown for example) each independently pivotally mounted to an upper arm (similar to mounting of forearm 26F to upper arm 26U shown in Fig. 2) and each having an end effector 32BA', 32BR' depending therefrom.
  • Scara arm 26B' may have three (3) (e.g. independent rotation of upper arm about shoulder joint, (similar to shoulder 26S in Fig. 2) , and independent rotation of each forearm about corresponding elbow joint (similar to elbow 26E in Fig. 2)) or five (5) degrees of freedom (e.g. similar to aforementioned three (3) degrees of freedom plus with independent rotation of each end effector about the wrist joint).
  • the arm may have more or fewer degrees of freedom.
  • transport arm 26B' may not be capable of indexing.
  • one or more of the transport arms in the transport chamber modules of the transport chamber may be capable of indexing.
  • indexers 4561', 4301' may be located in interstitial modules.
  • load lock module 56A' and workpiece station 3Oi' may each have a corresponding indexer 4561', 4301' located therein.
  • the number and location of indexers in the transport chamber 416' shown in Fig. 4C is exemplary. In alternate embodiments, more or fewer modules with indexers may be provided. In other alternate embodiments, the interstitial module with indexers may be positioned in the transport chamber in any desired configuration. As seen in Fig.
  • indexer 4561' may have workpiece shelves) supports 56Sl', 56S2' that (similar to positionally static shelves 56Sl, 56S2) cooperate with transport arm 26B' in the adjoining transport chamber module to transport workpieces through linear transport chamber 416'.
  • the indexer may have more or fewer shelves .
  • Indexer 4561' in this embodiment may also have buffer shelves BA', BR' to buffer workpieces in load lock 56A' .
  • the indexer 4301' in workpiece station 3Oi' is generally similar to indexer 4561' with, for example, workpiece shelves 30Sl', 30S2' and buffer shelf B'.
  • the indexers may have any other desired configuration.
  • load lock module 56' may have workpieces support shelves 456Sl', 456S2' that are positionally static.
  • Workpiece support shelves 456Sl', 456S2' may be substantially similar to workpiece shelves 56Sl, 56S2 shown in Fig. 4A.
  • the tool controller similar to controller C in Fig. 5
  • the tool controller may automatically register, as described before, which interstitial modules 56A' , 56', 3Oi' has an indexer 4561', 4301' the operational parameters of the corresponding indexer (e.g.
  • the tool controller may automatically register the configuration of the transport arms 26B' , 26i' of the transport chamber modules (e.g. whether indexing capability, multiple forearms) and the relevant parameters for operation of the arms .
  • transport arms 26B', 26i', and workpiece shelves 56Sl, 56S2, 30Sl', 30S2' (on indexers 4561', 4301') and static workpiece shelves 456Sl', 456S2' cooperate with each other and define distributed transport system 420' to effect workpiece transport through the transport chamber in the directions indicated by arrows A, R to that described before with respect to tool 410 in Fig. 4A.
  • Transport system 420' is also arranged to define multiple travel lanes A, R.
  • the motion of the end effectors 32BA', 32BR', 32iA' , 32iR' (more specifically the plane of motion) establishes the position (e.g.
  • end effectors 32BA', 32iA' of the transport arms 26B', 26i' locate travel lane A, and the other end effectors 32BR', 32iR' locate travel lane R.
  • the static shelves 456Sl,' 456S2' may respectively be substantially aligned with the travel lanes A, R.
  • the workpiece and buffer shelves 56Sl', 56S2', BA', BR', 30Sl', 30S2', B on the indexers 4561', 4301' may be located as desired.
  • the indexers 4561', 4301' may have sufficient indexing height to transit the workpiece shelves and buffer shelves between positions in substantial alignment with the travel lanes A, R.
  • the indexers may have sufficient number of workpiece or buffer shelves to maintain a workpiece/buffer shelf aligned with each travel lane A, R regardless of index position of the indexer (as shown in Fig. 4C) . This, as may be realized serves to disconnect indexer position from transport capacity. An appropriate shelf, of the indexer, to pick or place a workpiece may be correctly positioned for the arrival of the corresponding end effector so that end effector movement is not dependent on indexer position.
  • the travel lanes A, R defined by transport system 420' in transport chamber 416' may have polarized travel directions.
  • the travel direction convention used for travel lanes A, R in Fig. 4C is merely exemplary and similar to the convention in Fig. 4A (e.g. lane A travels away from tool interface section 12' and lane R travel towards tool interface 12').
  • the travel lanes may be used for bi-directional travel.
  • the end effectors on arms 26B', 26i corresponding to respective travel lanes may be polarized according to the direction polarization of the corresponding travel lanes.
  • end effectors 32BA', 32iA' may transport workpieces on lane A in the direction of lane A (e.g. away from interface section 12'), and end effectors 32 BR' , 32iR' may transport workpieces on lane R in the direction of lane R (e.g. toward interface section 12').
  • the static workpiece shelves 456Sl', 456S2' may also be polarized according to the directional polarization of the corresponding travel lanes as shown in Fig. 4C (and similar to shelves 56Sl; 56S2 in Fig. 4A) . Transition of workpieces between travel lanes A, R may be accomplished with indexers 4561', 4301'.
  • the transport arm 26B' , 26i may be provided with sufficient but limited Z motion to effect picking/placing workpieces onto static workpiece shelves 456Sl', 456S2'.
  • the static shelves may have limited Z motion to allow picking/placing workpieces on the end effectors of the transport arm. Processing of workpieces with tool 410' may be accomplished in a similar manner to that described before with respect to tool 410 ⁇ see Fig. 4A) except that movement of workpieces between lanes A, R is effected with the indexers 4561', 4301'.
  • Tool 810 is generally similar to tool 410' described before and shown in Fig. 4C.
  • Tool 810 has transport chamber 816 that is substantially similar to transport chamber 416'.
  • Transport chamber 816 may have a distributed transport system 820 defined by transport arms 826B, 826i (similar to arms 26, . 26A, 26B, 26Bl), indexers 8561 (similar to indexers 4561, 4301) and workpiece shelves 856S.
  • the transport system 820 may have multiple travel lanes A, R
  • Travel lanes A, R may have polarized travel directions (similar to lane A, R in Figs. 4A-4C) .
  • tool 810 may have an "express" transit passage 870 similar to passage 570 described before and shown in Fig. 5. Similar to passage 570, passage 870 in this embodiment may be a linearly elongated tube capable of holding an isolated atmosphere (e.g. N 2 , vacuum) or a controlled atmosphere (e.g. highly clean air). A vehicle or shuttle is located inside the tube as shown. The tube may be formed from modular tube sections ⁇ not shown) .
  • the transport chamber modules (similar to modules 818B, 818R) and interstitial modules (similar to modules 856A, 856, 856C) may have integral transit tube sections. Assembly of the modules to form the transport chamber simultaneously forms the. continuous transit passage.
  • the tube may have access openings/passages 876, 876' 878 as shown capable of communicating with modules 856, 818i, 856C.
  • the position of the passage 870 relative to the transport chamber 816 shown in Fig. 8 is exemplary, and the passage may be located in any desired position/orientation relative to transport chamber (e.g. above, below, to the side, etc.).
  • the communication passages between tube and transport chamber may be located as described.
  • passage 876 may be connected to a generally intermediate module 856, 818i of the transport chamber, and passage 878 may be connected to a module at an end or proximate an end of the transport chamber 816.
  • modules 856, 856C may be load lock modules
  • module 818i may be a transport chamber module similar to module 18, 18i, 18i' described before.
  • transport arm 826i in module 818i may be capable of indexing in the Z direction sufficiently to transport workpieces between the transport chamber and shuttle 872 in the passage 870 through passage 876'.
  • the indexer 8561 in load lock module 856 may be capable of indexing in the Z direction to effect transfer of workpieces between transport chamber and shuttle 872 in passage 870 through passage 876.
  • Connecting passages 876, 876' 878 may be closable, for example with suitable actuable doors 854 to isolate the transport chamber interior from the atmosphere within the transit passage 870. Accordingly different atmospheres, gas species, and/or pressures may be maintained between the transit passage and transport chamber 816.
  • the passage 870 may . have a controlled/purified high cleanliness air atmosphere, ' similar to (or shared with) an environmental interface section 812.
  • the transport chamber as noted before may have portions holding a vacuum, inert gas,- etc-, commensurate to the processing steps.
  • Shuttle 872 is capable of traversing the length of the transit passage 570 in the direction indicated by arrow Xl.
  • Shuttle 872 may have any suitable vehicle/carriage configuration. Suitable examples of vehicles/carriages are described in U.S. Patent Application Serial No. 10/624,987, incorporated by reference herein in its entirety.
  • the shuttle may be capable of movement, relative to the transit passage, in a movement plane (such as a horizontal or vertical plane) .
  • the transit passage may extend laterally (a direction substantially orthogonal to the passage longitudinal axis) to communicate with multiple (e.g.
  • the shuttle 872 may have a grip or end effector 888 for holding a workpiece(s) .
  • the shuttle grip may be capable of holding a cassette for storing a workpiece (s) and transport the workpiece(s) out of the tool.
  • the shuttle 872 in the exemplary embodiment may have an integral indexer 890 capable of indexing (Z motion) the grip 888 in order to transfer the workpiece between transit passage 870 and transport chamber modules without a resident indexer, such as load lock 856C.
  • a resident indexer such as load lock 856C.
  • the transit passage may communicate through a suitable opening/passage 874 with tool interface section 812 (similar to tool interface section 12, 512 described before) which in this exemplary embodiment forms a workpiece entry/exit station for the transport chamber 816.
  • tool interface section 812 similar to tool interface section 12, 512 described before
  • workpieces. may be loaded/unloaded from the shuttle 872 with the transport arm 815 of the interface section 812.
  • transit passage 870 may provide an express by pass/return for workpieces processed in tool 810 in a similar manner to that described before regarding transit passage 570 in Fig. 5.
  • FIG. 4D there is shown another schematic elevation view of a tool 410'' in accordance with yet another exemplary embodiment.
  • Tool 410'' is generally similar to tool 410, 410' described before and shown in Figs. 4A-4C.
  • Tool 410'' has a transport chamber 416'' that is similar to transport chamber 416, 416' described before.
  • Tool 410'' may also have an express transit passage (not shown) similar to transit passage 870 shown in Fig. 8.
  • express transit passages similar to passages 570, 870 may be provided to any of the previously described embodiments of the processing tool 10, 310, 410, 410'.
  • Transport chamber 416'' may have transport chamber modules 18B'', 18i'' and interstitial modules 56A'', 56'', 3Oi'' linearly arrayed for example in the manner shown in Fig. 4D.
  • Transport system 420'' is distributed through the transport chamber 416'' as will be described further below.
  • Transport chamber modules 18B'', 18i'' are, in this embodiment, similar to each other and except as otherwise noted below, also to transport chamber modules 18, 18B'', 18i described previously. In alternate embodiments, the transport chamber modules may have different configurations. In view of the similarity, in this embodiment, the chamber modules 18B'', 18i'', will be described with specific reference to chamber module 18B' ' . In the exemplary embodiment shown in Fig.
  • the transport chamber module 18B' ' has multiple independent transport arms 26BA'', 26BR''.
  • the transport arms 26BA'', 26BR'' may be independently mounted to the chamber module frame (similar to module frame 22F, see Fig. 2).
  • Fig. 4D shows two (2) independently mounted arms 26BA'', 26BR'' for exemplary purposes, and in alternate embodiments there may be more than two transport arms independently mounted within the transport chamber module.
  • the multiple transport arms 26BA' ' , 26BR' ' may be mounted to different walls, sides within the transport chamber module.
  • the transport arms 26BA'', 26BR'' may be mounted to opposing walls, such as top and bottom walls, of the transport chamber module frame.
  • the transport arms may be mounted to opposing side walls, or to adjacent walls (such as one transport arm being mounted to a bottom wall and another transport arm being mounted to an adjacent side wall, or each transport arm being independently mounted to adjacent side walls) of the transport chamber module.
  • the transport arms 26BA' ' , 26BR' ' in the transport chamber module 18B' ' may be substantially similar to each other, and will be described herein with specific reference to arm 26BA''.
  • the transport arms independently mounted within the transport chamber module may be of different types.
  • Transport arm 26BA' ' schematically shown in Fig. 4C, may be a scara type arm similar to transport arm 26 described before and shown in Fig. 2.
  • the transport arm 26BA' ' may have two (2) or three (3) degrees of freedom movement (e.g. providing ⁇ , r motion, see Fig. 2, of the end effector, 32BA''.
  • the transport arm may also be capable of indexing (Z motion) .
  • the transport arm may have any other desired configuration.
  • Transport arm 26BA' ' may have a modular configuration, similar to transport arm module 26M described before (see Fig. 2) , allowing transport arm 26BA' ' (for example arm linkage and drive section) to be installed/removed from the transport chamber module 18B'' as a modular unit.
  • the transport arm 26BA' ' and transport chamber module frame may each have complementing position control features 34A'', 36A'' similar to features 34, 36 described before, (see Fig. 2) enabling repeatable positioning of the transport arm relative to the module.
  • the other independently mounted transport arm(s) 26BR'' in the transport chamber module may also have position control features 34R'', 36R'' to enable repeatable positioning of each transport arm relative to the module.
  • the position of the transport arms 26BA' ' , 26BR' ' may allow the corresponding end effectors 32BA'', 32BR'' to move along different transport planes.
  • the transport planes, along which the end effectors translate may be related, for example workpieces may be transferred between transport planes, similar to transfer of workpieces between travel lanes A, R described before and also as will be described in greater detail below with specific reference to this exemplary embodiment.
  • the position control features 36A'', 36R' ' on the module frame (similar to frame 22F) corresponding to the respective transport arms 26BA' ' 26BR' ' may each be established from a common reference datum in a manner similar to position control features 36 (see also Fig. 9) . This avoids generating over constraints on locating the transport arms, and hence the workpiece transport planes, relative to each other. Similarly, it avoids overconstraining the positioning of other transport chamber modules and interstitial modules during formation of the transport chamber 416'', in the manner similar to that described before with respect to chamber 16.
  • interstitial modules 56A'', 56'' may be load lock chambers.
  • modules 56A'', 56'' may be similar to each other, and hence will be described below with specific reference to module 56A''.
  • the interstitial modules may have different load lock chamber configurations.
  • module 56A'' has multiple independently isolatable and independently operable load lock chambers 456AA'', 456AR''.
  • Fig. 4D shows two (2) load lock chambers 456AA'', 456AR'' for example purposes. In alternate embodiments more load lock chambers may be provided as desired.
  • Each load lock chamber 456AA'', 456AR'' may communicate independently with the transport chamber module 18B' ' and any other chamber module (e.g. tool interface station 12) between which the load lock chambers transitions.
  • the load lock chambers 456AA' ' , 456AR' ' may be arrayed vertically, such as in a vertical stack.
  • the load lock chambers communicating with the transport chamber module may be vertically and horizontally offset.
  • ⁇ the multiple load lock chamber 456AA' ' , 456AR' ' may be incorporated into a common module 56A' ' thus allowing the multiple load lock chambers to be installed and removed, if desired, as a unit.
  • Each load lock chamber 456AA'', 456AR'' may be configured for example as a sub-module capable of being mated to other load lock chamber submodules, such as in a vertical stack, to form a load lock chamber module assembly that may be for example connected to other transport chamber modules as an integral assembly. Individual load lock chamber submodules may also be separately mounted or removed from transport chamber.
  • Each module 56A' ' , and each load lock chamber sub- module may have a suitable utilities interface (not shown), similar to interface/coupling 21 (see Fig. 2), for connecting the load lock chambers to the tool controller (similar to controller C, see Fig.
  • the multiple load lock chambers may be integrally formed into a common module frame.
  • each load lock chamber may be an independent module.
  • the incorporation of multiple independently isolatable/operable load lock chambers 456AA'', 456AR'' provide "parallel" communication links between isolatable modules of the transport chamber such as transport chamber module 18B' ' and tool interface section 12.
  • parallel is not used to define specific spatial orientation of the communication links, and the travel paths of workpieces through each load lock chamber 456AA'', 456AR'' between interconnected modules 18B'', 12 may not be spatially parallel. Rather “parallel” communication links here means communication links sharing common origin/destination modules and extending generally alongside each other. " ⁇ The availability of the "parallel” communication links allows discretization, or subdivision of communication between the isolated transport chamber modules 18B'', 12 joined by multiple load lock chambers 456AA'', 456AR'' so that portions of the communication process (in other words the process of transiting workpiece between modules 18B'', 12) may be performed substantially simultaneously. For examnip.
  • the load lock chambers 456AA' ' , 456AR' ' may each be substantially simultaneously communicating with a different atmosphere (e.g. chamber 456AA' may be open to tool interface section 12 and chamber 456AR' ' may substantially simultaneously be open to transport chamber module 18B''). Accordingly, the module 56A'' joining transport chamber module 18B' to tool interface section 12 may be simultaneously loaded and unloaded (e.g. loading from one end, unloading from another, or loading from both ends, or unloading from both ends) .
  • the subdivision of the net communication or transit volume (provided by module 56A'') between interconnected modules 18B'', 12 generates smaller pump down volumes as well as allowing substantial simultaneous differential cycling of the transit volume atmospheres (e.g. chamber 456AA' ' may be vented to interface section 12 and chamber 456AR'' may be pumped down or vice versa) .
  • the result as may be realized is increased transport capacity of the transport chamber 416'' and hence increased throughput of tool 410' ' .
  • each load lock chamber 456AA' ' , 456AR' ' may have workpiece shelves for holding workpieces transiting through the respective load lock chambers between tool interface section and transport chamber module.
  • each load lock chamber 456AA' ' 456AR' ' may have (one or more) shelves 456Sl", 456S2" (similar to shelves 56Sl, 56S2, 56Sl', 56S2', described before and shown in Figs. 4A, 4C) that may cooperate with transport arms 26BA' ' , 26BR' ' in the adjoining transport chamber module 18B' ' 1 ⁇ «-r-a ⁇ -,-, « «v+. workpieces through the transport chamber 416''.
  • each load lock chamber 456AA'', 456AR' ' may also have (one or more) buffer shelves 456BA' ' , 456BR' ' for buffering workpieces similar to buffer shelves BA' , RA' (see Fig. 4C) .
  • the workpiece shelves 456Sl'', 456S2'' and buffer shelves 456BA'', 456BR' ' may be mounted on an indexer (similar to indexer 4561') capable of the corresponding shelves in the Z direction relative to the respective load lock chamber.
  • each load lock chamber may have an indexer for indexing the workpiece and buffer shelves therein.
  • one or more of the shelves in the load lock chamber may be positionally static, and the transport arms in the transport chamber module may be capable of indexing. In other alternate embodiments, one or both of the transport arms may be capable of indexing sufficiently so that the arm(s) may access (load/unload) workpieces on one or more shelves in each load lock chamber.
  • the transport arms 26BA' ' , 26BR'', 26iA'', 26iR' ' (in the transport chamber modules 18B', 18i'') and shelves 456Sl'', 456S2'' (in load lock chambers 456AA'', 456AR'', 456A'', 456R'') are arranged to define multiple travel lanes A, R in transport chamber 416'' of tool 410''.
  • transport arms 26BA'', 26iA' ' in cooperation with the shelves 456 Sl'' may define travel lane A along which workpieces may be transported through the linear transport chamber as well as to/from processing modules (similar, to processing modules PMA, PMR, see also Fig. 4D) corresponding to travel lane A as previously described.
  • the transport arms 26BR'', 26iR' ' in cooperation with the shelves 456S2'' may define travel lane R.
  • buffer shelves 456BA'', 456BR'' may buffer workpieces along the corresponding travel lanes A, R.
  • an interstitial module 3Oi'' may have an indexer 4301''.
  • Indexer 4301'' is substantially similar to indexer 4301' described before and shown in Fig. 4C.
  • Indexer 4301'' may have workpiece shelves 30Sl'', 30S2'' and one or more buffer shelves.
  • the indexer 4301'' may be capable of traversing the shelves between the travel lanes A, R and may thus define a switch allowing workpieces to be switched from one travel lane to another.
  • the transport chamber may have more switches, and the switches may have any desirable configuration. Travel lanes A, R in the exemplary embodiment may have polarized travel directions.
  • transport arms and workpiece shelves corresponding to respective travel lanes A, R may be polarized according to the direction polarization of the corresponding travel lanes.
  • transport arms 26BA'', 2OiA'' and shelves 456Sl'', 456BA' ' may transport workpieces on lane A in the dedicated direction of lane A (e.g. away from tool interface section 12 in the exemplary embodiment shown in Fig. 4D).
  • the transport arms 26BR'', 26iR' ' and shelves 456S2'', 456BR'' may transport workpieces on lane R in the dedicated direction of lane R (e.g. towards tool interface section 12) .
  • workpieces may switch travel directions (e.g. from the direction of lane A to the direction of lane R. or VI ⁇ P versa) by switching travel lanes, for example via indexer 4301'' in module 3Oi'' as described before.
  • the tool 10, 310, 410, 410', 410 As may be realized from the exemplary embodiments described herein, the tool 10, 310, 410, 410', 410",
  • Tool 810 is scalable and may be increased or reduced in size by adding or removing modules as desired.
  • the tool may also be provided with any desirable configuration by connecting modules to form the transport chamber in the desired configuration. This is illustrated in the exemplary embodiment shown in Fig. 7.
  • Tool 710 in this embodiment is substantially similar to the tools 10, 30,
  • Tool 710 has a linear transport chamber
  • Tool interface sections 12, 712A may be joined to any transport chamber module 718, in any location or to any interstitial module 756. Similarly any other module
  • transport chamber module e.g. transport chamber module, ' interstitial module, processing module, etc.
  • transport chamber module e.g. transport chamber module, ' interstitial module, processing module, etc.
  • the controller as described before automatically updates the tool configuration and process protocol for the resulting tool .

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/US2007/012582 2006-05-26 2007-05-24 Linearly distributed semiconductor workpiece processing tool Ceased WO2007139981A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009513224A JP5706085B2 (ja) 2006-05-26 2007-05-24 直線状に分布された半導体部品処理ツール

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/442,511 US8398355B2 (en) 2006-05-26 2006-05-26 Linearly distributed semiconductor workpiece processing tool
US11/442,511 2006-05-26

Publications (2)

Publication Number Publication Date
WO2007139981A2 true WO2007139981A2 (en) 2007-12-06
WO2007139981A3 WO2007139981A3 (en) 2008-11-20

Family

ID=38749688

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/012582 Ceased WO2007139981A2 (en) 2006-05-26 2007-05-24 Linearly distributed semiconductor workpiece processing tool

Country Status (5)

Country Link
US (1) US8398355B2 (https=)
JP (1) JP5706085B2 (https=)
KR (1) KR101564359B1 (https=)
TW (1) TWI497633B (https=)
WO (1) WO2007139981A2 (https=)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7776226B2 (en) 1998-04-21 2010-08-17 Samsung Electronics Co., Ltd. Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
CN110835731A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 一种8腔体立式pecvd-pvd一体化硅片镀膜工艺
CN110835732A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 一种9腔体卧式hwcvd-pvd一体化硅片镀膜工艺
CN110835730A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 7腔体立式hwcvd-pvd一体化硅片镀膜生产工艺
CN110835734A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 一种8腔体卧式pecvd-pvd一体化硅片镀膜工艺

Families Citing this family (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8241701B2 (en) * 2005-08-31 2012-08-14 Lam Research Corporation Processes and systems for engineering a barrier surface for copper deposition
US10086511B2 (en) 2003-11-10 2018-10-02 Brooks Automation, Inc. Semiconductor manufacturing systems
US20070269297A1 (en) 2003-11-10 2007-11-22 Meulen Peter V D Semiconductor wafer handling and transport
WO2006009723A2 (en) * 2004-06-15 2006-01-26 Brooks Automation, Inc. Substrate processing apparatus with removable component module
US8292563B2 (en) * 2004-06-28 2012-10-23 Brooks Automation, Inc. Nonproductive wafer buffer module for substrate processing apparatus
US9117860B2 (en) * 2006-08-30 2015-08-25 Lam Research Corporation Controlled ambient system for interface engineering
US8771804B2 (en) * 2005-08-31 2014-07-08 Lam Research Corporation Processes and systems for engineering a copper surface for selective metal deposition
US20080019806A1 (en) * 2006-07-24 2008-01-24 Nyi Oo Myo Small footprint modular processing system
US9117859B2 (en) * 2006-08-31 2015-08-25 Brooks Automation, Inc. Compact processing apparatus
US20080225772A1 (en) * 2007-03-12 2008-09-18 Shugong Xu Explicit layer two signaling for discontinuous reception
US10541157B2 (en) 2007-05-18 2020-01-21 Brooks Automation, Inc. Load lock fast pump vent
US8272825B2 (en) 2007-05-18 2012-09-25 Brooks Automation, Inc. Load lock fast pump vent
DE102007058052B4 (de) * 2007-11-30 2013-12-05 Von Ardenne Anlagentechnik Gmbh Vakuumbeschichtungsanlage
ITUD20080136A1 (it) * 2008-06-13 2009-12-14 Baccini S P A Impianto per la lavorazione di piastre per circuiti elettronici
US8055373B2 (en) * 2008-09-19 2011-11-08 Inotera Memories, Inc. Automatic wafer storage system and a method for controlling the system
TWI500097B (zh) * 2009-02-23 2015-09-11 韓美半導體股份有限公司 處理半導體封裝體之系統
JP2011114013A (ja) * 2009-11-24 2011-06-09 Sumitomo Electric Ind Ltd 半導体装置の製造装置および半導体装置の製造方法
JP2012009519A (ja) * 2010-06-23 2012-01-12 Hitachi High-Technologies Corp 真空処理装置
TW201232691A (en) * 2011-01-28 2012-08-01 Premtek Int Inc Equipment and operation method for enhancing throughput of wafer rapid thermal processing
IT1404527B1 (it) * 2011-02-24 2013-11-22 Comau Spa Polso di robot articolato.
IT1404528B1 (it) * 2011-02-24 2013-11-22 Comau Spa Polso di robot articolato.
JP5617708B2 (ja) * 2011-03-16 2014-11-05 東京エレクトロン株式会社 蓋体開閉装置
US9184078B2 (en) * 2011-05-07 2015-11-10 Brooks Automation, Inc. Narrow width loadport mechanism for cleanroom material transfer systems
KR101905823B1 (ko) * 2011-07-27 2018-10-08 엘지이노텍 주식회사 웨이퍼 제조 장치 및 웨이퍼 제조 방법
TWI719331B (zh) 2011-10-26 2021-02-21 美商布魯克斯自動機械公司 基板處理系統
KR20140117420A (ko) * 2012-01-03 2014-10-07 어플라이드 머티어리얼스, 인코포레이티드 Si 태양 전지들의 표면 부동태화의 성능 및 안정성을 개선하기 위한 버퍼 층
KR20140116120A (ko) * 2012-01-03 2014-10-01 어플라이드 머티어리얼스, 인코포레이티드 결정질 실리콘 태양 전지들을 패시베이팅하기 위한 진보된 플랫폼
JP6150242B2 (ja) * 2012-12-04 2017-06-21 国立研究開発法人産業技術総合研究所 製造ラインを構成するためのユニットとその組み立て方法
TWI623994B (zh) 2013-07-08 2018-05-11 布魯克斯自動機械公司 具有即時基板定心的處理裝置
TWI709185B (zh) 2013-08-26 2020-11-01 美商布魯克斯自動機械公司 基板搬運裝置
WO2015073647A1 (en) 2013-11-13 2015-05-21 Brooks Automation, Inc. Sealed robot drive
TWI853292B (zh) 2013-11-13 2024-08-21 美商布魯克斯自動機械美國公司 可變磁阻馬達總成
US9673071B2 (en) * 2014-10-23 2017-06-06 Lam Research Corporation Buffer station for thermal control of semiconductor substrates transferred therethrough and method of transferring semiconductor substrates
KR20160071571A (ko) 2014-12-11 2016-06-22 삼성전자주식회사 기판 반송 유닛, 그를 포함하는 기판 처리 장치 및 기판 처리 방법
KR102587203B1 (ko) 2015-07-13 2023-10-10 브룩스 오토메이션 인코퍼레이티드 온 더 플라이 자동 웨이퍼 센터링 방법 및 장치
CN115424964A (zh) 2015-07-13 2022-12-02 博鲁可斯自动化美国有限责任公司 基底传输设备
US10607879B2 (en) 2016-09-08 2020-03-31 Brooks Automation, Inc. Substrate processing apparatus
CN108933097B (zh) * 2017-05-23 2023-06-23 东京毅力科创株式会社 真空输送组件和基片处理装置
US10903107B2 (en) 2017-07-11 2021-01-26 Brooks Automation, Inc. Semiconductor process transport apparatus comprising an adapter pendant
JP2020515026A (ja) * 2018-03-09 2020-05-21 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated 真空処理システムおよび真空処理システムを動作させる方法
US11574830B2 (en) 2018-03-16 2023-02-07 Brooks Automation Us, Llc Substrate transport apparatus
US11535460B2 (en) * 2018-05-31 2022-12-27 Brooks Automation Us, Llc Substrate processing apparatus
US11309404B2 (en) * 2018-07-05 2022-04-19 Applied Materials, Inc. Integrated CMOS source drain formation with advanced control
US10669430B2 (en) * 2018-07-17 2020-06-02 Varian Semiconductor Equipment Associates, Inc. Anti-reflective coating for transparent end effectors
CN110835733A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 一种9腔体立式hwcvd-pvd一体化硅片镀膜工艺
US11192239B2 (en) 2018-10-05 2021-12-07 Brooks Automation, Inc. Substrate processing apparatus
US20200395232A1 (en) * 2019-06-14 2020-12-17 Brooks Automation, Inc. Substrate process apparatus
WO2021178458A1 (en) * 2020-03-03 2021-09-10 Lam Research Corporation Collaborative robot system on a mobile cart with a chamber docking system
TW202347598A (zh) * 2022-05-18 2023-12-01 均華精密工業股份有限公司 可取放多尺吋晶圓之機器手臂
US20240290644A1 (en) * 2023-02-27 2024-08-29 Applied Materials, Inc. Two level vacuum wafer transfer system with robots on each level
US20250022728A1 (en) * 2023-07-10 2025-01-16 Spts Technologies Limited Substrate Processing System
WO2025230551A1 (en) * 2024-04-30 2025-11-06 Brooks Automation Us, Llc Substrate processing apparatus with substrate feed through bypass and method therefor

Family Cites Families (64)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3294670A (en) * 1963-10-07 1966-12-27 Western Electric Co Apparatus for processing materials in a controlled atmosphere
US4518078A (en) * 1982-05-24 1985-05-21 Varian Associates, Inc. Wafer transport system
US4624617A (en) * 1984-10-09 1986-11-25 David Belna Linear induction semiconductor wafer transportation apparatus
JPS62114403A (ja) * 1985-11-13 1987-05-26 Fuji Electric Co Ltd 搬送装置
US4917556A (en) * 1986-04-28 1990-04-17 Varian Associates, Inc. Modular wafer transport and processing system
US4836733A (en) * 1986-04-28 1989-06-06 Varian Associates, Inc. Wafer transfer system
US5882165A (en) * 1986-12-19 1999-03-16 Applied Materials, Inc. Multiple chamber integrated process system
JPS63157870A (ja) * 1986-12-19 1988-06-30 Anelva Corp 基板処理装置
US4951601A (en) * 1986-12-19 1990-08-28 Applied Materials, Inc. Multi-chamber integrated process system
US5040484A (en) * 1987-05-04 1991-08-20 Varian Associates, Inc. Apparatus for retaining wafers
US5202716A (en) * 1988-02-12 1993-04-13 Tokyo Electron Limited Resist process system
US4794863A (en) * 1988-03-21 1989-01-03 International Business Machines Corporation Motive structure for transporting workpieces
JPH0221740A (ja) 1988-07-11 1990-01-24 Matsushita Electric Ind Co Ltd 回線制御方法
US5076205A (en) * 1989-01-06 1991-12-31 General Signal Corporation Modular vapor processor system
US5275709A (en) * 1991-11-07 1994-01-04 Leybold Aktiengesellschaft Apparatus for coating substrates, preferably flat, more or less plate-like substrates
US5766360A (en) * 1992-03-27 1998-06-16 Kabushiki Kaisha Toshiba Substrate processing apparatus and substrate processing method
AU4652993A (en) * 1992-06-26 1994-01-24 Materials Research Corporation Transport system for wafer processing line
KR100302012B1 (ko) * 1992-11-06 2001-11-30 조셉 제이. 스위니 미소-환경 콘테이너 연결방법 및 미소-환경 로드 로크
KR970011065B1 (ko) * 1992-12-21 1997-07-05 다이닛뽕 스크린 세이조오 가부시키가이샤 기판처리장치와 기판처리장치에 있어서 기판교환장치 및 기판교환방법
US6296735B1 (en) * 1993-05-03 2001-10-02 Unaxis Balzers Aktiengesellschaft Plasma treatment apparatus and method for operation same
US5417537A (en) * 1993-05-07 1995-05-23 Miller; Kenneth C. Wafer transport device
US5538390A (en) * 1993-10-29 1996-07-23 Applied Materials, Inc. Enclosure for load lock interface
JP3279032B2 (ja) * 1993-12-16 2002-04-30 スズキ株式会社 船外機のエンジン回転数制御装置
TW295677B (https=) * 1994-08-19 1997-01-11 Tokyo Electron Co Ltd
US5651868A (en) * 1994-10-26 1997-07-29 International Business Machines Corporation Method and apparatus for coating thin film data storage disks
US5586585A (en) * 1995-02-27 1996-12-24 Asyst Technologies, Inc. Direct loadlock interface
TW309503B (https=) * 1995-06-27 1997-07-01 Tokyo Electron Co Ltd
JPH0936198A (ja) * 1995-07-19 1997-02-07 Hitachi Ltd 真空処理装置およびそれを用いた半導体製造ライン
KR100310249B1 (ko) * 1995-08-05 2001-12-17 엔도 마코토 기판처리장치
CH691376A5 (de) * 1995-10-17 2001-07-13 Unaxis Balzers Ag Vakuumanlage zur Oberflächenbearbeitung von Werkstücken.
TW318258B (https=) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
TW349897B (en) * 1996-02-02 1999-01-11 Komatsu Mfg Co Ltd Operational robot
US6062798A (en) * 1996-06-13 2000-05-16 Brooks Automation, Inc. Multi-level substrate processing apparatus
US6318951B1 (en) * 1999-07-09 2001-11-20 Semitool, Inc. Robots for microelectronic workpiece handling
TW344847B (en) * 1996-08-29 1998-11-11 Tokyo Electron Co Ltd Substrate treatment system, substrate transfer system, and substrate transfer method
JP3947761B2 (ja) * 1996-09-26 2007-07-25 株式会社日立国際電気 基板処理装置、基板搬送機および基板処理方法
US5894760A (en) * 1997-06-12 1999-04-20 Brooks Automation, Inc. Substrate transport drive system
US6002840A (en) * 1997-09-30 1999-12-14 Brooks Automation Inc. Substrate transport apparatus
KR100265287B1 (ko) * 1998-04-21 2000-10-02 윤종용 반도체소자 제조용 식각설비의 멀티챔버 시스템
US6206176B1 (en) * 1998-05-20 2001-03-27 Applied Komatsu Technology, Inc. Substrate transfer shuttle having a magnetic drive
US6017820A (en) * 1998-07-17 2000-01-25 Cutek Research, Inc. Integrated vacuum and plating cluster system
TW442891B (en) * 1998-11-17 2001-06-23 Tokyo Electron Ltd Vacuum processing system
US6435330B1 (en) * 1998-12-18 2002-08-20 Asyai Technologies, Inc. In/out load port transfer mechanism
JP2000286318A (ja) * 1999-01-27 2000-10-13 Shinko Electric Co Ltd 搬送システム
EP1187183A4 (en) * 1999-04-16 2009-01-14 Tokyo Electron Ltd MANUFACTURE OF A SEMICONDUCTOR PART AND ASSOCIATED MANUFACTURING STRIP
JP4330703B2 (ja) * 1999-06-18 2009-09-16 東京エレクトロン株式会社 搬送モジュール及びクラスターシステム
US6364592B1 (en) * 1999-12-01 2002-04-02 Brooks Automation, Inc. Small footprint carrier front end loader
WO2001075965A1 (fr) * 2000-04-05 2001-10-11 Tokyo Electron Limited Dispositif de traitement
US6641350B2 (en) * 2000-04-17 2003-11-04 Hitachi Kokusai Electric Inc. Dual loading port semiconductor processing equipment
US6297611B1 (en) * 2000-07-06 2001-10-02 Genmark Automation Robot having independent end effector linkage motion
US6962471B2 (en) * 2000-10-26 2005-11-08 Leica Microsystems Jena Gmbh Substrate conveying module and system made up of substrate conveying module and workstation
US6570273B2 (en) * 2001-01-08 2003-05-27 Nikon Corporation Electric linear motor
US6852194B2 (en) * 2001-05-21 2005-02-08 Tokyo Electron Limited Processing apparatus, transferring apparatus and transferring method
US6752585B2 (en) * 2001-06-13 2004-06-22 Applied Materials Inc Method and apparatus for transferring a semiconductor substrate
US6918731B2 (en) * 2001-07-02 2005-07-19 Brooks Automation, Incorporated Fast swap dual substrate transport for load lock
JP4821074B2 (ja) * 2001-08-31 2011-11-24 東京エレクトロン株式会社 処理システム
CN1996553A (zh) 2001-08-31 2007-07-11 阿赛斯特技术公司 用于半导体材料处理系统的一体化机架
US6719517B2 (en) * 2001-12-04 2004-04-13 Brooks Automation Substrate processing apparatus with independently configurable integral load locks
AU2003259203A1 (en) * 2002-07-22 2004-02-09 Brooks Automation, Inc. Substrate processing apparatus
US7988398B2 (en) * 2002-07-22 2011-08-02 Brooks Automation, Inc. Linear substrate transport apparatus
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
US20050223837A1 (en) * 2003-11-10 2005-10-13 Blueshift Technologies, Inc. Methods and systems for driving robotic components of a semiconductor handling system
JP2005243729A (ja) 2004-02-24 2005-09-08 Asyst Shinko Inc 搬送システム
WO2006009723A2 (en) * 2004-06-15 2006-01-26 Brooks Automation, Inc. Substrate processing apparatus with removable component module

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7776226B2 (en) 1998-04-21 2010-08-17 Samsung Electronics Co., Ltd. Multi-chamber system having compact installation set-up for an etching facility for semiconductor device manufacturing
CN110835731A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 一种8腔体立式pecvd-pvd一体化硅片镀膜工艺
CN110835732A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 一种9腔体卧式hwcvd-pvd一体化硅片镀膜工艺
CN110835730A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 7腔体立式hwcvd-pvd一体化硅片镀膜生产工艺
CN110835734A (zh) * 2018-08-17 2020-02-25 中智(泰兴)电力科技有限公司 一种8腔体卧式pecvd-pvd一体化硅片镀膜工艺

Also Published As

Publication number Publication date
TWI497633B (zh) 2015-08-21
TW200805553A (en) 2008-01-16
WO2007139981A3 (en) 2008-11-20
JP5706085B2 (ja) 2015-04-22
US20070274810A1 (en) 2007-11-29
US8398355B2 (en) 2013-03-19
KR20090025270A (ko) 2009-03-10
JP2009538541A (ja) 2009-11-05
KR101564359B1 (ko) 2015-10-29

Similar Documents

Publication Publication Date Title
US8398355B2 (en) Linearly distributed semiconductor workpiece processing tool
JP2009538541A5 (https=)
US9570330B2 (en) Substrate processing apparatus
JP2023062050A (ja) 基板搬送装置の位置補償のための方法および装置
US20070183871A1 (en) Substrate processing apparatus
US7575406B2 (en) Substrate processing apparatus
US7988398B2 (en) Linear substrate transport apparatus
US7607879B2 (en) Substrate processing apparatus with removable component module
KR102512974B1 (ko) 온-더-플라이 기판 센터링을 갖는 처리 장치
US7604449B1 (en) Equipment front end module
JP2022551815A5 (https=)
JP2022551815A (ja) 基板処理装置
US20240178032A1 (en) Substrate transport apparatus
WO1998012736A1 (en) Swap out plate and assembly
KR102793869B1 (ko) 기판 이송 장치
KR102058985B1 (ko) 로드 스테이션
WO2001040085A1 (en) Small footprint carrier front end loader
TWI815803B (zh) 用於基板輸送設備位置補償之方法及設備、基板輸送經驗臂下垂測繪設備、基板輸送設備、和基板處理工具
US11830749B2 (en) Substrate transport apparatus
WO2026035627A1 (en) Load port wafer protrusion apparatus, load port including the apparatus and method therefor

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07795397

Country of ref document: EP

Kind code of ref document: A2

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)
WWE Wipo information: entry into national phase

Ref document number: 2009513224

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE

WWE Wipo information: entry into national phase

Ref document number: 1020087031464

Country of ref document: KR

122 Ep: pct application non-entry in european phase

Ref document number: 07795397

Country of ref document: EP

Kind code of ref document: A2

DPE2 Request for preliminary examination filed before expiration of 19th month from priority date (pct application filed from 20040101)