TW201232691A - Equipment and operation method for enhancing throughput of wafer rapid thermal processing - Google Patents

Abstract

The present invention provides an equipment and operation method for enhancing the throughput of wafer rapid thermal processing. The equipment comprises at least one processing module, a base body, a front end control interface, and a back end control interface. The processing module comprises at least one processing chamber, a loading end, an unloading end, a robotic arm and a cooling device. The loading end and the unloading end are compound cassettes for accommodating multi-piece graphite carrying trays layer by layer. The multi-piece graphite carrying trays have slots for carrying various sizes of wafers. The cassette is designed to accommodate the multi-piece graphite carrying trays for wafer accommodation, so as to reduce the operations of robotic arm in the process, and may simultaneously conduct the rapid thermal processing on a plurality of wafers, such that the production capability per unit time may be greatly improved, the processing flexibility and equipment compatibility may be increased, the processing time may be reduced, and the wafer broken probability may be reduced.

Description

Λ 201232691 VI. Description of the invention: [Technical field of invention] It is possible to carry a plurality of graphite substrates at the same time. The present invention relates to a device and a method for improving the rapid heat treatment capacity of a wafer. , in particular, changing the structure of the cartridge, ", the disc, which has a groove, a wafer on the graphite retainer. [Prior Art]

Referring to the first and second figures, respectively, the top view of the rapid thermal processing of the conventional technology and the flow chart of the operation method of the rapid thermal processing of the conventional technology, the device i for the rapid thermal processing of the conventional technology includes the base body 10 > The cavity 20, the loading end 35, the unloading end 45, the robot arm 50, the detaching device 65, the front-end control interface 7〇, and the 仏 device 9() 45 are simultaneously fresh-figure-second and the second figure The method s contains: loading step su, loading the wafer ^ 1 = 5' = wafer placed on a graphite carrier (not 4: round = ^ set 9〇 1 ^ hand l5G face (four) of Shi County The graphite carrier disk placed on the fixed wafer is taken out from the process chamber 20 and placed on the 5H cold portion and the separation device 65, with 3===Step 523' to the cooling cum: Set 65 to the butterfly surface; like __, the fine-grained technology of the fast-scale equipment and operation method, with the shortcomings of [s] 3 201232691, for example, can only process a single wafer per unit time, Gif: ί L has only one front-end control interface 70, when it is not convenient to check, in addition, when using - paragraph time, if each element = Problem, and _ _ capacity, product ίί and fortune may occur fragmentation fast = rational 'μ increase productivity of the wafer [invention content] processing capacity equipment contains at least one system borrowing one: jinyangyuan tired of thermal control Interface, and a back end #, base body, a front end of the "loading end", the unloading end, the robot arm and the "process 杈 group system is placed in the base body of the two xv fastball 埶 # earn. 兮 4 side The stop body is dyed and used to set the automatic process parameters. The moon is sent by the main master. The back end of the main body is used to provide - manual drop control + manual control interface to set Hand _ = private control ^ face or signal or - transfer lun ~ parameters and issued - manually execute line w, 隹 -, f #u ' The at least one process module receives the automation:: 夺 仃 仃 automated continuous production And in the at least-process 槿ΐ semi-manual execution of the signal, the manual U Χΐ 式 : type box, the composite cassette 丨:, the type of disc, the multi-piece stone set stone 稷 稷 稷 夕 夕 夕The graphite is carried and the right phase η·+. τ·1 is the same size of the mother of the carrier, but each one can Zhao 1 has different grooves to load wafers of various sizes. She is rich and has a twirling, telescopic and lifting function. The Japanese mechanical arm has a placement and placement action. The arm removes the multi-piece graphite carrier from the opening σ of the loading end. 4 201232691 The supported graphite carrier plate placed in the process chambers is removed from the system. On the device, after the multi-stone ^ Γ ρ, the mechanical arm places the opening σ of the multi-piece graphite bearing ΐίί ^ unit directly* the unloading end to the at least disk, = one step to increase the production capacity, which can be in the same-process module For the operation of the machine, the method of the gamma-enhanced crystallization heat treatment capacity includes the steps, the heat treatment step, the cooling step, and the unloading. In the step of the on-load and the centering, the wafer is loaded in advance. In the groove t of the second, and loaded in the composite card type as the loading end, it is only necessary to remove the loading disk from the loading end by the robot arm; in the money processing step, the mechanical arm will be used; Handle for fast 4 arms with heat convection or Pass' = platen placed into a further compound of the unloading end of each cassette. Ink meter The invention has the advantages that the graphite carrying tray can carry various sizes of crystal-capacitance 'l' by means of the design of the material, and the elasticity of the production process is relatively round. The steps of taking out and placing can save process time and reduce the fragmentation probability of the wafer. [Embodiment] The combination of the figure and the component symbol makes the implementation of this creation more detailed, so that the skilled person can implement it according to the research. , see the second picture, the 4A picture and the 4B gj, respectively, for the improvement of the invention. 5 201232691

A top view of the apparatus of the present invention, and an example of the carrier end and the unloading end of the present invention. As shown in the third figure, the present invention improves the tamping fast, and the processing capacity device 2 includes at least a process module, a __ base ^, a front end manipulation interface 70, and a back end manipulation interface 8 〇, the at least one The apparatus 60 includes at least one process chamber 20, a loading end 30, an unloading end 40, and a machine-aged device 60. The at least one process module is placed on the pedestal operation, and the front end is placed at the front end of the _ body 10 for setting the automatic nucleus The basin armature produces an automated execution signal; the back end manipulation interface is 8〇, and the rear end of the hand body 10 is provided to provide a manual manipulation interface or a half-face to slave manual process parameters and issue-manually execute the arm i; Ii = ί=At least one process module receives the automatic execution "When semi-manual execution signal" performs manual mode production or semi-manual

- a secondary back-end control interface 82 for performing a signal test for each system - J: 1 J5 and J number, batch quantity i mother cavity (10), manual process process 4A picture and 4b picture, The process module comprises a two-mirror body 20, a loading mechanism 3, an unloading end 4〇, a mechanical device 60, and the processing chamber 2 is used for rapid heat treatment: the body 20 can be ring-shaped, parallel, array or Each of the I-months and the unloading end* of the multi-bank 都是 is a composite card, and the multi-piece graphite carrier 200 is placed hierarchically in a layered manner. ^^ Each of the trays 200 The appearance of the geometric dimensions are ink f

The bearing plate can be planned to have the same or stone J for performing the multi->{type graphite carrier disk and lifting function, and the at least - wafer 2 〇 2, tearing = graphite bearing robot arm 5 〇 From the loading end 3〇 open ink device _ 轴 line speed thermal annealing ^ and place the cold = disk 200 and the at least one wafer 2 〇 2, Hai ^ type graphite bearing r 1

·) J 6 201232691 The carrier plate 200 is located on the positioning point (not shown), and in the truss of the process chamber 20 such as the Huaifang\~^, the stone frame is 9nn and is rapidly thermally annealed. Thereafter, the multi-piece ί Ϊ 〇Τ ^ 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 20 The shape and the polygon type of the H ink carrier tray 2GG can be round, elliptical, and moment - ^ This is a device that can quickly reduce the capacity of the product and a radio frequency identification reader (not shown) And the multi-type privately-known 30, that is, the composite cassette, further set a (not shown), so that before the loading or rapid heat treatment can be used, the stomach sputum connection communication Read the error that needs to be entered, to achieve fully automated functions. The sixth figure of the figure i is the top view of the first embodiment and the third embodiment of the present invention for improving the rapid thermal processing of the wafer, respectively, as shown in the fifth figure and the ίί - Step to increase the capacity'. The invention improves the rapid thermal processing of the wafer. The S and the 3 can be placed in the same process module, and the mobile obstruction 55 is set to move the robot arm 50, or the wafer is lifted by the present invention. The equipment for rapid heat treatment capacity 4 sets a plurality of sets of process modules in the same base body. Referring to the seventh figure, a perspective view of the positioning fixture of the present invention is shown. As shown in the seventh figure, on the bottom end 32/42 of the loading end 30 or the unloading end 40 of the present invention, a positioning jig 100' is included for determining the size, the number, and the position of the blank. The positioning jig 100 is a a guiding element 1〇1, an actuating element 1〇3, and a combination of at least one sensing element 105, 107, the guiding element 101 being connected to the actuating element 1〇3, wherein the actuating element 103 moves The sensing element 〇5 is a photo-sensing element, and the sensing element 107 is a pressure sensing element, and the position of the guiding element 101 is sensed by two. Referring to the eighth figure, a flow chart of the operation method for improving the rapid heat treatment capacity of the wafer of the present invention is shown. As shown in the eighth figure, the present invention improves the rapid thermal processing capacity of the wafer in 201232691. In the centering step S3, the "H-loading step coffee" is loaded and loaded in the groove of the multi-stone disk as the loading end, ^ in the heat treatment Steps: loading the plurality of meteorites at least - the wafers by X (four) and taking out the rapid thermal processing; and performing the heat loading of the at least two wafers in the cooling step S3 and the crucible cavity The unit is cooled by heat convection or heat transfer in one, S39, and the mechanical arm is used to put the D-type two-step graphite carrier tray into the unloading end, the multiple pieces of the ^^

The film point is 'by directly inserting the card type; setting the C-capability of P-private flexibility and & preparation, and 35 production steps, thereby saving process time and reducing wafers and placement By adding a back-end control interface, the convenience of the repair or test is improved. More information: === Ming 2 = non-intentional - change, == [Simple description of the diagram] The first diagram is a top view of the equipment for rapid heat treatment of the conventional technology. The figure is a flow chart of the operation method of the rapid heat treatment of the conventional technology. The figure of the embodiment is shown in the first figure of the apparatus for improving the rapid heat treatment capacity of the wafer. 4A and 4B are example views of the loading end and the unloading end of the present invention [S] 8 201232691 The fifth drawing is a top view of the present invention for improving the rapid heat treatment of the wafer. The second photo of X is the top view of the embodiment of the invention for improving the rapid heat treatment capacity of the wafer. w has a second division The seventh figure is a perspective view of the positioning fixture of the present invention. The eighth figure is a flow chart of the operation method of the present invention for improving the rapid heat treatment capacity of a wafer. [Major component symbol description] 1 Conventional technology rapid heat treatment equipment 2 The invention improves the wafer rapid heat treatment capacity equipment 3 The invention improves the wafer rapid heat treatment capacity equipment 4 The invention improves the wafer rapid heat treatment capacity equipment 10 Base body 20 Process chamber 30 Load end 31 Opening 32 Bottom 35 Loading end

40 Unloading end 41 Opening 42 Bottom 45 Unloading end 50 Robot arm 60 Cooling device 65 Cooling and separating device 70 Front-end control interface 80 Rear-end control interface Secondary rear-end control interface Centering device 90 201232691 100 Positioning fixture 101 Guide element 103 Actuating element 105 sensing element 107 sensing element S1 conventional technique rapid heat treatment operation method S11 loading step S13 taking out step S15 placing step S17 centering step S19 heat treatment step S21 cooling step S23 separating step S25 unloading step S3 lifting the wafer fast Operation method of heat treatment capacity S31 Loading and centering step S33 Removal step S35 Heat treatment step S37 Cooling step S39 Unloading step

Claims (1)

-201232691 Qishen's patent scope: 'The equipment for 5 wafer rapid thermal processing capacity, including: one process module' for rapid heat treatment; line ϊ Γ control interface for setting self-moving process parameters and issuing - After the automatic face: S3 (four) = 2 for; j action interface or - semi-manual control to execute the signal; and, > issue - manual execution signal or half manual at least - process module, f :; ί is a composite A cassette, the plurality of multi-piece graphites of the composite day-day yen:: Each of the carriers is the same size. And the 荨 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片 片Wafer--rapid thermal annealing treatment; stone take-out _ line the multi-chip-cooling device, (4) Wei line fast lag fast cooling... rack removal 'placed in the cooling device:, at;=== 201232691 Less-wafer cooling, the cooling of the fresh-keeping view is less - in the unloading end 'The multi-piece graphite carrier can be round: one of the shape and the polygonal type, the multi-piece graphite Carrying grooves of the same or different sizes of the trays to load the wafers of various sizes/, 3.= Please follow the rapid heat treatment capacity of the wafers described in SI item 2, wherein the process chambers The body is arranged in a ring, parallel, array or multi-layer manner. 4 ^Application for the success of the second _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ And placing the multi-L type f ink carrier tray on the fulcrum of the branch of the process chamber, or from Support frame made of the process chamber and the like removed. The end, the lesser unloading end has an 'opening' complex layer and a clamping position 4, the opening is located outside the layer, the positioning j is located at the bottom of the layer, and the rib determines the size, the number, and the position of the blank. = bit element, - guide 51 element and at least - sensing element =, the material is read and connected to the navigation member to drive the guiding secret electric sensing element or the pressure sensitive bottle member, __ the actuating piece s position. • i 隹 专 专 1 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升 提升The equipment for setting the manual production=circle rapid heat treatment capacity further includes a code reading and further including a code on the loading end, the radio frequency identification iron is used to automatically read the data. 7. A method for improving the rapid heat treatment capacity of the wafer The operation method comprises the following steps: [s] 12 201232691 a loading and centering step, in which at least one ink is carried in a groove of the tray, and the at least one 曰U is carried in at least one multi-piece stone one loading terminal Centering; a monthly graphite carrier tray, loaded in a removal step, with a robotic arm from one of the multi-piece graphite carrier trays; x takes a heat treatment step of loading at least one wafer, with the mechanical arm The multi-piece graphite bearing surface is placed in a small-wafer-cooling step, and the robot arm is advanced into a second heat treatment; the small-grain_the multi-piece graphite carrier tray is placed It And carrying out the cold-unloading step on the cold heading device, the m-handling device t puts the cooling chip type graphite carrier disk into an unloading end, and fights at least 5 _ at least the wafer of the loading end And each of the unloading ends is a complex-type; the box is placed in a layered manner, and the at least one crystal is loaded with a stone; wherein each of the multi-piece graphite circular, rectangular and polygonal types has one H side Round, elliptical, with the same or different dimensions to load;;; with ink = end on-step inclusion - bar code or - face sign ^ = standard by a code sensor or a radio frequency identification The method of claim 7, wherein the at least one of the at least the unloading end has an opening, a plurality of layers, and the opening is located in the layer The positioning fixture is located at the bottom of the layer for determining the size, the number, and the position of the blank. The positioning fixture is a combination of an actuating element, a guiding element and at least one sensing element. The 丨 element is connected to the actuating element to drive the guiding element to move, & sensing element 13 201 232691 is a photoelectric sensing element or a pressure sensing element for sensing the position of the actuating element. [s] 14