CN101728294A - Method of arranging crystal wafer transfer system - Google Patents
Method of arranging crystal wafer transfer system Download PDFInfo
- Publication number
- CN101728294A CN101728294A CN200810224645A CN200810224645A CN101728294A CN 101728294 A CN101728294 A CN 101728294A CN 200810224645 A CN200810224645 A CN 200810224645A CN 200810224645 A CN200810224645 A CN 200810224645A CN 101728294 A CN101728294 A CN 101728294A
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- Prior art keywords
- wafer transfer
- wafer
- transfer system
- crystal wafer
- manipulator
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Abstract
The invention discloses a method of arranging a crystal wafer transfer system and provides a method which can realize fast and smooth crystal wafer transfer, aiming at the requirements of the crystal wafer transfer system of a quick annealing furnace. The crystal wafer transfer system mainly comprises a three-dimensional motion manipulator, a wafer transfer station, a wafer receiving station, a sealing ring and a cooling table, is particularly suitable for heat treatment devices, such as quick annealing furnaces and belongs to the field of semiconductor manufacture.
Description
Technical field
The present invention relates to a kind of crystal wafer transfer system, relate in particular to a kind of crystal wafer transfer system that is applicable to quick anneal oven, belong to field of manufacturing semiconductor devices.
Technical background
In recent years, along with the development of semiconductor integrated circuit technology and chip technology, in the semiconductor integrated circuit manufacturing technology, integrated level is more and more higher, and circuit scale is increasing, and critical size is more and more littler, and various semiconductor manufacturing equipments are had higher requirement.Quick anneal oven has also proposed very high requirement to it as one of key equipment of semiconductor heat treatment process, requires quick anneal oven to have: whole aircraft reliability is good, the high and low particle contamination of production efficiency, complete machine Automatic Control etc.
The crystal wafer transfer system of quick anneal oven is divided into several stations usually.Wafer is sent into heating cavity from sending the sheet station, and after annealing process was finished, wafer was delivered to cooling stations by manipulator, after cooling stations is cooled to normal temperature, is sent into by manipulator and is subjected to the sheet station.As shown in Figure 1.
Summary of the invention
The present invention be directed to the requirement of the wafer transfer system of quick anneal oven, realize transmitting fast, stably the wafer mode and proposed a kind of energy.
Technical scheme of the present invention is achieved in that
Manipulator is sent into heating cavity from being positioned at the standard film magazine taking-up wafer that send the sheet station, treat technology finish after manipulator its taking-up be placed on the cooling bench cool off, manipulator returns and send the sheet station to get other a slice to send in the heating cavity then, in this sheet intensification heating process, manipulator will be placed on the wafer of cooling bench and send in the standard film magazine that is subjected to the sheet station, sheet is got/sent to the control manipulator alternately at each station, realizes the high efficiency transmission of wafer.
The present invention has following remarkable advantage:
1, the present invention has improved the production efficiency of the quick anneal oven in the unit interval so to a great extent for quick anneal oven provides a wafer transfer system fast.
2, manipulator adopts the wafer holder mode of vacuum suction, the particle contamination of having avoided wafer to slide and cause at body surface, the stationarity of wafer in transmission course is provided simultaneously, guaranteed that wafer in loading and unloading, can not fall down on hand and cause the fragment phenomenon to take place in the handling process from machinery.
Description of drawings
Fig. 1 arranges schematic diagram for the wafer transfer system of patent of the present invention.
Embodiment
The invention will be described further below in conjunction with the drawings and specific embodiments, but not as the qualification to patent of the present invention.
As shown in Figure 1, a kind of novel wafer transfer system, wherein, cooling bench 1 is used for the cooling after wafer takes out from heating cavity, heating cavity 2 is places that wafer technique is handled, sealing ring 3 is to be used for wafer and vacuum environment of terminal clamper formation, so that wafer can be adsorbed on the clamper tightly, manipulator 4 is mechanical devices of three of the multi-joints of transmission wafer, it can be three direction flexible motion, the Z axle motion of vertical direction, the θ motion of direction of rotation and the R motion in the horizontal direction, the motion of three directions makes manipulator can handle the wafer of each platform flexibly.Sending sheet station 5, being subjected to sheet station 6 is to be used for the standard film magazine that the clamping semiconductor fabrication is used.
Specific embodiment of the present invention elaborates content of the present invention.For persons skilled in the art, any conspicuous change that it is done all constitutes the infringement to patent of the present invention, with corresponding legal responsibilities without departing from the premise in the spirit of the present invention.
Claims (2)
1. a method of arranging crystal wafer transfer system is characterized in that: adopt the wafer handling station of several diverse locations, realize the automatic loading and unloading of wafer, improved the transmission efficiency of wafer.
2. realize the location of wafer on manipulator with the form of vacuum suction, guaranteed wafer in transmission course steadily, guaranteed fragment rate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810224645A CN101728294A (en) | 2008-10-22 | 2008-10-22 | Method of arranging crystal wafer transfer system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810224645A CN101728294A (en) | 2008-10-22 | 2008-10-22 | Method of arranging crystal wafer transfer system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101728294A true CN101728294A (en) | 2010-06-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810224645A Pending CN101728294A (en) | 2008-10-22 | 2008-10-22 | Method of arranging crystal wafer transfer system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101728294A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102263047A (en) * | 2011-08-19 | 2011-11-30 | 清华大学 | Wafer thermal buffer stack and method for realizing thermal buffer |
| CN102719895A (en) * | 2011-03-29 | 2012-10-10 | 中国科学院微电子研究所 | Wafer conveying device and wafer conveying method |
| CN106863670A (en) * | 2017-03-27 | 2017-06-20 | 成都蒲江珂贤科技有限公司 | A kind of rubber parts cools down rapid forming equipment |
-
2008
- 2008-10-22 CN CN200810224645A patent/CN101728294A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102719895A (en) * | 2011-03-29 | 2012-10-10 | 中国科学院微电子研究所 | Wafer conveying device and wafer conveying method |
| CN102263047A (en) * | 2011-08-19 | 2011-11-30 | 清华大学 | Wafer thermal buffer stack and method for realizing thermal buffer |
| CN102263047B (en) * | 2011-08-19 | 2013-05-22 | 清华大学 | Wafer thermal buffer stack and method for realizing thermal buffer |
| CN106863670A (en) * | 2017-03-27 | 2017-06-20 | 成都蒲江珂贤科技有限公司 | A kind of rubber parts cools down rapid forming equipment |
| CN106863670B (en) * | 2017-03-27 | 2019-01-04 | 宁海县健牌汽车部件有限公司 | A kind of cooling rapid forming equipment of rubber parts |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Zhao Na Document name: Notification of Passing Preliminary Examination of the Application for Invention |
|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| DD01 | Delivery of document by public notice |
Addressee: Zhao Na Document name: the First Notification of an Office Action |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100609 |