TWI275132B - Substrate carrying device and substrate processing device having the same - Google Patents

Abstract

A substrate carrying device is provided for carrying a substrate even in a high-temperature state such that the entire tact time can be decreased. A chuck 20 and a horizontal driving mechanism 21 are installed in an unloading chamber 13 of a substrate processing device 10. The chuck 20 chucks a substrate W loaded on a tray 17 and carries it towards a recycle tray 18. The horizontal driving mechanism 21 drives the chuck 20. A plate 30 and an elevator 31 that drives the plate 30 are disposed in the unloading chamber 13. In a case when the chuck 20 is going to chuck the substrate W, the plate 30 vertically moves the substrate W on the tray 17 to chuck the W.

Description

<6pif.doc IX. Description of the Invention: [Technical Field of the Invention] The present invention relates to a substrate handling apparatus for handling substrates. , summer and with the handling device [prior art]

The semiconductor substrate and the glass substrate are versatile. As a method of shortening the overall manufacturing time, the substrate formed into one process is immediately put into the lower-process, and the substrate is finished. For example, a glass plate is formed on the glass substrate, and the cell panel can be recovered quickly, and the film is diced after the film formation (scribi, the solar panel of the 曰曰 type shi shi shi is at a high temperature state. In the middle of the film-forming process, the vacuum chuck of the adsorption section of the adsorption section is used as a synthetic resin. The vacuum chuck method of holding the panel and moving it is not possible because the panel is in a high temperature state. The adsorption unit' requires the panel to be moved in or carried out on the tray that has been processed.

The flow of the panel which is successively processed in succession is stagnant, and this is the production time (tact time) of the entire process. ...&quot;,, 佰, 生产 作为 生产 ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ The device is characterized in that the substrate on which the substrate is held and held, and the substrate on the holding processing tray formed of the heat-resistant material is transferred from the processing tray to the holding member, pif.doc 127513226, moving the H-turn member The prefecture element is transferred to the substrate transfer display in which the substrate held by the mobile unit moved to the recovery tray by the moving unit is transferred to the transfer tray of the recovery tray. The through hole provided on the tray is carried out; the element includes a protrusion through the through hole from the surface of the processing tray, and the bottom of the substrate is supported by the north side of the substrate floating through the processing tray. 'The lifting pin is formed from the processing tray; the crucible and the holding member are configured to engage the holding member. And Ί 出 : : : : : : : : : : : : : : : : : : : : : : : 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将 将Holding the sub-private move to the recovery tray, the processing tray has a partial separation and descending member, and the mounting region is floated by the first lifting member, and the rear end member of the mounting member is joined. After that, the first elevating member is lowered, and the mounting = is transferred to the holding member together with the substrate. Further, the second transfer unit includes a second elevating member that lifts and lowers the recovery tray, and the second elevating and lowering I1 bovine recovery tray, and the mounting member 'held on the holding member and moved to the recovery consumer tray' together with the substrate Transfer to the composition on the recycling tray. In the above substrate transfer device, a cooling unit that cools the substrate transported from the processing tray may be provided on the recovery tray. 1275 lS&amp;if.doc provides a substrate processing apparatus including a storage chamber for storing a processing tray for mounting a mounted substrate, and the above-described substrate transfer using the present invention, even if the substrate is in a high temperature state, For the transfer member formed by the hot n material, the base transport on the processing tray is returned to the bottom of the processing tray. Therefore, the substrate can be smoothly transferred. The sub-month is sufficient to shorten the production time (taettime) of the entire production process. In order to make this statement and other purposes, features and advantages more obvious, the following is a good example, and with the Lai diagram, the details are described [Embodiment] Uncle ▲ below, Mai Zhi Figure 1 ~ Figure 5 A base back conveying apparatus and a substrate processing apparatus according to embodiments of the present invention will be described. (First Embodiment) Fig. 1 is a view showing a schematic overall configuration of a substrate carrying/mounting substrate according to a third embodiment of the present invention. Fig. 2 is a perspective view of the swash plate portion provided in the substrate transfer device of the 1-1 embodiment. 3 (8) to 3 (i) are schematic partial configuration diagrams showing a configuration of a substrate transfer device according to the first embodiment. The substrate processing 1 includes 10 a loading chamber U, a processing chamber 12, and an unloading chamber recycling station 14. In the loading chamber ,, a gate is provided facing the outside, and a gate g2 is provided at a critical point such as the carrier chamber 11 and the processing chamber 12, and a gate G3 is provided at a critical point of the processing=12 and the unloading chamber 13 in the unloading chamber. 13. A gate 〇4 is provided for the recycling station 14. The gates &lt;31~G4 can be used as ►pif.doc. In addition, the recycle bin 14 may not constitute a chamber but only the respective trays 5 to U, the processing chamber 12, the unloading chamber 13 and the recycling station 14, the tray 15 of the board w, 16, 17 and _ plural columns of several substrates, the μ column is a plurality of rows,

According to the arrangement of the substrates W, the flat plate is opened by 4, but only the plurality of through holes 17a are placed on the tray 17 on the tray 17. The tray of the substrate A is counted or replaced with a plurality of substrates W. The substrate w f crystal __ solar cell panel, junction processing chamber 12, = nitriding frequency is formed on the surface of the board as an anti-reflection film. Normally, the battery panel is heated to about 3 〇〇 5 〇〇 ° c by parallel plate plasma CVD (chemical vapor deposition).

The respective switches form a fixed space. In the unloading chamber 13, a chuck portion 20 and a lifting plate 30 are housed, and a horizontal driving mechanism 21 for driving the chuck portion 20 and a lowering mechanism 3 for raising and lowering the lifting plate 3 are mounted by the horizontal portion. The mechanism 2 performs a right and left reciprocating motion in the drawing, and when the substrate w on the tray 17 is transported to the recovery tray 18, it enters the collection station 14 through the gate G4. The configuration of the chuck portion 20 will be described later. The elevating plate 30 is moved up and down in the figure by the elevating mechanism 31. On the upper surface of the elevating plate 30, a plurality of pins 3a and a plurality of through holes 17a of the tray 17 are inserted and inserted. Further, in the collection station 14, an elevating mechanism 32 for elevating and lowering the recovery tray 18 is provided, and in the collection station 14, a cassette portion 40 for receiving and storing the substrate w from the recovery tray 18 is housed. 8 I275132p, d〇c f The structure of the chuck portion 2A will be described with reference to Fig. 2 . The chuck portion 2 is a tubular shape having a main cross section and an open end, and the central portion of the lower portion is cut away. The end portion 2a is a portion that abuts on both ends of the substrate W# and is held to prevent the substrate W from falling. Hereinafter, the operation of holding the substrate w by the lost portion 2 is referred to as chucking. In the illustration, the distance is set to the scale of the substrate w, the distance y2 is set to be longer than the size of the wire w, and the distance yl is set to be larger than the width of the recovery tray 18 in order to pass through the recovery tray 18. 1 paper is perpendicular to the direction). The chuck portion 2. The length of the long side direction (x direction), the length ί and the number of pieces clamped. Since the chuck portion 20 has the shape shown in Fig. 2, it does not come into contact with the upper surface of the substrate W during clamping, and is not damaged. Further, at the time of clamping, the state of the substrate w is covered, so that dust can be prevented. == The chuck portion 20 is made of heat resistance such as metal or ceramics. Since the chuck portion 20 is made of metal or shouted, even if the substrate of the tray is immediately clamped and transported, it is possible to shorten the inter-substrate door of the substrate processing apparatus 10 in which the rw 珂 is very similar in production. f / r transport to the program. The unprocessed ride w is transported from the outside to the tray 15 of the 室 chamber 11, and is transported by the above-described tray 16 through the gate G2. The processing in the processing chamber 12 is performed, for example, by a film forming process of the sample-heating of the substrate w to a predetermined temperature. After the pallet 2 is transported, the raft base is transported to the unloading chamber 13 through the gate G 3, and the substrate w is formed in a high temperature state. I2751?626p, doc The substrate W after the film formation process is clamped by the chuck portion 20, and is transported from the tray 17 of the unloading chamber 13 to the recovery tray 18 of the recovery station 14. Further, the substrate W after the film formation process is transported from the recovery tray 18 to the cassette unit 40, and is housed in the cassette unit 40. This conveyance process will be described in detail using a partial configuration diagram of FIGS. 3(a) to 3(i).

3(a) to 3(c) show the inside of the unloading chamber 13, and Fig. 3(d) to Fig. 3(f) and Fig. 3(g) to Fig. 3(〇 show the inside of the recovery station 14 Fig. 3(a) is a plan view showing the positional relationship between the tray π on which the substrate W is placed and the chuck portion 20, and Fig. 3(b) is a sectional view taken along line u of Fig. 3(a), Fig. 3 (c) 3(a) is a cross-sectional view taken along line II-II. Fig. 3(d) is a plan view showing the positional relationship between the recovery tray 18 on which the substrate W is placed and the chuck portion 20, and Fig. 3(e) is Fig. 3 (d) is a sectional view of III-III, and Fig. 3 (f) is a sectional view taken along line IV-IV of Fig. 3 (d). Fig. 3 (g) shows a recovery tray 18 and a box portion 40 on which the substrate w is placed. The plan view of the positional relationship, Fig. 3 (匕), Fig. 3 (g), vv sectional view, Fig. 3 (〇 is the %々^ sectional view of Fig. 3 (g). As shown in Fig. 3 (a) It is shown that the substrate trade is arranged on the tray 17 in units of =1. In the initial state, the upper portion of the swash plate portion 17 is previously retracted. First, as shown in Fig. 3 (b) and Fig. 3 (c) == The plate rises and the tip end of the pin 30a abuts against the back surface of the substrate W through the through hole na, and the substrate w is placed at a distance of: ^. The chuck is placed along the surface of the substrate W, in Fig. , Sliding in the i-direction, the three substrates W are located at the loss-receiving portion 2Γ, 卩' and close to the end portion 20a. By lowering the lifting plate 3〇, the clamping of the junction 1275132 16226pif.doc bundle substrate W Next, as shown in Fig. 3 (d), Fig. 3 (e), and Fig. 3 (f), the chuck portion 20 that clamps the three substrates W is moved above the recovery tray 18. When the lifting mechanism 32 is used When the recovery tray 18 is raised from the set position, the upper surface of the recovery tray 18 passes through the central opening on the lower surface of the chuck portion 20, and abuts against the back surface of the three substrates W, and the substrate W is pushed up only by a predetermined distance. W forms a kind which is separated and floated from the end 2〇a of the chuck portion 20.

status. In this state, the chuck portion 20 is slid in the direction of χ2 of Fig. 3(d), and is separated from the three substrates W to return to the initial position. With the elevator mechanism 32, the recovery tray 18 is lowered and returned to the set position. By the above process, the conveyance of the substrate w from the tray 17 to the recovery tray 18 is completed. In Fig. 3 (a), the chuck portion 2, which has returned to the initial position, is shifted upward by only one row, and then moved in the x4 direction to prepare the next substrate w to be transported. Next, the substrate w transported to the recovery tray 18 is stored in each of the sections 4, 22 (I), 3 (1), and 3 (1), and the tray is placed. The M0 direction is moved in the χ3 direction of Fig. 3 (g), and in each layer of the multi-layered box portion 4G, the substrate w is housed in the shape of each layer of i. At this time, the box portion 40 is intermittently moved in the z direction of Fig. 3 (1). This intermittent moving distance is the interlayer p of the box portion 40. Another ^曰 ==18 intermittently moves upwards and makes: part 4. The second corpse = coffee is stored in the box portion 4 °. This portion is repeatedly stored in the cassette portion 4G, and the substrate 127515132226226fif.doc on the tray 17 is additionally provided with (4) a cooling mechanism 19 for cooling the substrate w. _ is the substrate w surface temperature for film formation and addition of the secret, and for the whole scale of the brain county, it is important to do the same process. By providing the cooling mechanism 19, the substrate W on the "= can be rapidly cooled, so that it can be stored in the short-term (four) substrate "40". As the cooling mechanism 19, cooling water, cold air, or the like can be used.

In the present invention, the substrate (W) is mechanically fastened (held) by the heat-resistant material, so that the substrate W can be immediately transported, and the production time can be shortened. 2' By providing a cooling structure 19 for cooling the substrate W on the time store 18, even if the substrate is heated at a high temperature, it can be immediately cooled, so that the production time is shortened. Further, since the unloading portion 20, the horizontal driving mechanism 2, the lifting plate 3, and the lifting mechanism 31 are provided in the unloading chamber 13, a new space for the substrate conveying device is required, and the substrate processing apparatus is not ingested. The enlargement of the crucible '(4) handles and transports the substrate in a compact configuration. Further, in the present embodiment, the substrate transfer device is constituted by the lost disk portion 2, the horizontal drive mechanism, the lift plate 30, and the elevating mechanism 31'32. (Embodiment 2) The configuration of the substrate processing apparatus according to the second embodiment of the present invention is shown in Fig. 4 (8) to (4). The basic affair with Ming, _ only for _ will be explained.: The disk, the horizontal drive mechanism and the lifting mechanism are also the same as the 12 I275132p, d〇c substrate transport device according to the first embodiment, so the same configuration The components are given the same symbols. Fig. 4 (a) to Fig. 4 (c) show the inside of the unloading chamber 13, Fig. 4 (d) to Fig. 4 (f) and Fig. 4 (g) to Fig. 4 (i The case shown in the recovery station 14. Fig. 4(a) is a plan view showing the positional relationship between the tray 17 on which the substrate w is placed and the chuck portion 20, and Fig. 4(b) is the μ of Fig. 4(a). Fig. 4(c) is a cross-sectional view taken along line ΙΙ-Π of Fig. 4(a), and Fig. 4(d) is a plan view showing the positional relationship between the recovery tray 18 on which the substrate W is placed and the chuck portion 2〇. 4(e) is a ΙΙΙ-ΙΠ cross-sectional view of FIG. 4(d), FIG. 4(f) is a IV-IV cross-sectional view of FIG. 4(d), and FIG. 4(g) shows a mounting substrate. Plan view of the positional relationship between the recovery tray 18 and the box portion 40 Figure 4 (h) is a VV cross-sectional view of Figure 4 (g), and Figure 4 (i) is a vi_VI cross-sectional view of Figure 4 (g). Referring to Figures 4 (a) ~ 4 (i) and the i-th implementation The configuration in which the configuration is different will be described. First, the tray 117 differs from the trays of Figs. 3(8) to 3(i) in structure, as shown in Fig. 4(a), Fig. 4(b), and Fig. 4 ( c), a plurality of layered hole portions 117b having a two-layer structure are formed on the tray 117, and mounting members for mounting the substrate w are detachably provided on each of the layered hole portions η. 117a. Further, the lifting plate 13A is different from the lifting plate 3 of Figures 3(a) to 3(i). That is, the upper surface of the lifting plate|3〇 is brought into contact with the lower surface of the placing member u7a, and The structure in which the lifting plate 13 is lifted and lowered.

The transport process of the substrate w of the substrate processing apparatus constructed as described above will be described. As shown in the plan view of Fig. 4 (a), the substrates W 13 1275132 16226 pif.doc are arranged on the tray 117 in units of three sheets. In the initial state, the chuck portion 20 is previously retracted from above the tray portion 117. First, as shown in FIGS. 4(b) and 4(C), when the lift plate 130 is raised, the upper surface of the lift plate 130 abuts against the lower surface of the mounting member 117a, and the mounting member 117a is only pushed up. distance. At this time, three substrates W are placed on the upper surface of the mounting member 117a. As described in the first embodiment, the chuck portion 2 is slid along the surface of the substrate W in the x1 direction of FIG. 4(a), and the mounting member 117a on which the three substrates W are placed is placed. The end 20a of the chuck portion 20 is tight. This clamping is the same as the method described in the first embodiment. Even if the clamping of the substrate W is completed, the lifting plate 3 is not lowered. Then, as shown in FIG. 4 (d), FIG. 4 (e), and FIG. 4 (f), the chuck portion 2 of the mounting member 117a on which the three substrates W are placed is moved to the recovery tray. Above the 18th. When the recovery tray 32 is raised from the set position by the elevating mechanism 32, the upper surface of the recovery tray 18 passes through the central opening of the lower surface of the chuck portion 2, and abuts against the lower surface of the mounting member 117a, and pushes the mounting member 117&amp; The set distance. Thereby, the placing member 117a is formed in a state in which the singularity is separated from the end portion 20a of the chuck portion 20 when the three substrates W are placed. In this state, the chuck portion 20 is slid in the χ2 direction of FIG. 4 and is detached from the placing member 117a. The recovery tray 18 is lowered by the elevating mechanism 32' and returned to the set position. The transfer from the tray 117 to the substrate w of the recovery tray 18 is completed by the above process. The three substrates W are held in a state of being placed on the mounting member. Next, the 14 1275132 16226 pif.doc substrate W carried on the placing member U7a on the recovery tray 18 is stored in the casing 40. The surface of the three substrates W is exposed by separating the chuck portion 20 from the mounting member 117a. After the adsorption unit 5G of the straight device is moved from above the three substrates w, and three sheets == simultaneously vacuum suction, the adsorption unit 5 () is removed from the mounting member (G) '... ^ ) The leaves and the U corpse are not, so that the three adsorption plates 5G whose plates are vacuum-adsorbed are directed to the box portion 4G, that is, to the soil.

The X3 direction is moved, and each of the plurality of box parts is formed inside. At this time, the cassette portion 4 is intermittently moved in the z direction of the drawing in the interval of each layer. Even if the adsorption portion 5G of the vacuum chuck device is intermittently moved upward, the cassette portion 40 is left and right. The direction w is moved back and forth, and the substrate w can be stored in the evening = 40. These series of conveyance processes are sequentially repeated. The substrates W on the tray 17 are all stored in the cassette portion 4A. When the conveyance process of these columns is completed, the chuck portion 2 () is again shifted from the upper side in Fig. 7^ and then moved in the x4 direction to carry out the next-time. Soil Before the second handling operation, there is another U7a conversion that will be left on the recovery tray 18. That is, the base 上 on the mounting member 117a is sandwiched. When the adsorption unit 5G of 2 adsorbs and moves to the side of the cartridge portion 4G, the squeegee portion 20 is slid to 'clamp only the placing member im on the recovery tray 18, and the chuck portion 20 is returned to the initial position, and the chuck portion 20 is loaded. The component core is transferred to the lift plate 13A, and the lift plate 13 is lowered (4) the mounting member im is switched to the 1275132 16226pif.doc tray 117. Further, even in the present embodiment, the cooling mechanism 19 for cooling the substrate w can be provided on the recovery tray 18. Further, in the present invention, the chuck portion 20, the horizontal drive mechanism 21, the lift plate 13A, and the elevating mechanisms 31, 32 constitute a substrate transfer device.

Even in the present embodiment, the same operational effects as those of the third embodiment can be obtained. Further, since the placing member U7a is clamped together with the substrate w, even if the paper tray 17 is transported to the collecting tray 18, the positional relationship between the substrates W is constant, and no special positioning is required, for example, the substrate is The work of storing W in the cassette portion 4 is easy. - The present invention is not limited to the embodiments described above, and may be levied as long as it is not damaged. For example, in the present embodiment, the case where the substrate w is transported in units of three sheets has been described for convenience. However, the present invention is not limited to 3 #, and may be a cymbal sheet or a plurality of sheets. Further, the substrate transfer device of the present invention is not limited to the transfer from the unloading chamber 13 to the recovery station, but may be used, for example, from the substrate 12 to the unloading chamber 13, and the substrate transfer device of the present invention may be used. After the substrate % is removed from the chamber 13 , the back (four) 14 or the substrate processing device (4), it is transported. That is, the substrate transfer device of the present invention can be used for the substrate transfer in the collection and the position of the substrate other than the substrate processing apparatus 10. As shown in Fig. 5, the (4) substrate transfer device can be set and used in the second pass. As explained above, in the case of the space of the recovery station 14, the substrate can be disposed outside the substrate processing chamber. Incidentally, in FIG. 5, members having the same configuration as that of FIG. i 1275132 16226pif.doc are denoted by the same reference numerals, and description thereof will be omitted. Although the present invention has been disclosed in the above preferred embodiments, it is intended to limit the present invention, and any of the techniques (10), Lin De:: can be used to make some changes and retouching, so the scope of the present invention is attached. The scope defined in the scope of application for patent application shall prevail. ', [Simple description of the map]

Fig. 1 is a schematic overall configuration diagram of a substrate processing apparatus having a substrate transfer device according to an embodiment of the present invention. Fig. 2 is a perspective view showing a chuck portion provided in the substrate transfer device according to the first embodiment of the present invention. 3(a) to 3(1) are schematic configuration diagrams showing a configuration of a substrate transfer device according to the first embodiment of the present invention. 4(a) to 4(1) are schematic configuration diagrams showing a configuration of a substrate transfer device according to a second embodiment of the present invention. Fig. 5 is a schematic overall configuration diagram when the substrate transfer device according to the embodiment of the present invention is provided outside the substrate processing apparatus. [Description of main component symbols] 10, 10A: substrate processing apparatus 11: loading chamber 12: processing chamber 13: unloading chamber 14: recycling stations 15 to 17: tray 17 I275132pif, oc 17a: through hole 18: recovery tray 19: cooling mechanism 20: chuck portion 20a: end portion 21: horizontal drive mechanism 30 · lifting plate 30a: pin 31, 32: lifting mechanism 40: box portion 50: suction portion 117: tray 117a: mounting member 117b: layered hole Part 130: lifting plate

Gl, G2, G3, G4: gate W: substrate yl, y2: distance 隹 18

Claims (1)

1275132 16226pif.doc X. Patent application scope: The substrate that is placed on the processing tray and placed on the high-level substrate is transported to the substrate of the next recycling tray, which is characterized by 'including : shifting unit 'transferring the aforementioned substrate on the processing tray from the processing tray to the component _ member; returning:: Describing: moving the holding member from the processing tray to the front receiving cup # #? #单 7° 'moving the moving unit to the substrate held by the above-mentioned returning member, shifting to the substrate in the above-mentioned retracement, and the special transfer unit includes a lifting pin for lifting and lowering the beacon hole provided in the processing tray, and a supporting plate which protrudes from the surface of the processing tray by a through hole, and which floats from the processing tray The rear end portion is joined to the aforementioned simple member to hold the member. The stomach through hole is withdrawn, and the substrate is transferred to the aforementioned substrate. The substrate handling device according to claim 2 is characterized in that: the component SI 2 transfer includes a lifting of the aforementioned recovery tray. The second lifting is transferred to the recovery tray by the second lifting member before and after the lifting and lowering of the member and moving to the aforementioned upper plate. In the case of the soil, please refer to the substrate in the first paragraph of the patent scope, and the special handling method has a partial surface and can be raised (4) to be placed on the substrate; the loading; the processing tray is raised and lowered to the tray = After the carrier holding member is accessed, the rear end portion of the placing member is extended to the holding member by the above-described tantalum member, and then the lower lifting member lower core mounting member and the substrate are transferred to the holding member. According to the fourth aspect, the second lifting member front/two transfer unit includes the lifting and lowering of the recovery tray, and the second lifting member is lifted and lowered by the second lifting member. The tray, the member on the recovery tray, is placed on the recovery tray. The substrate 6 according to any one of the preceding claims, wherein the substrate is transported from the processing tray, and the substrate is transported from the processing tray. Cooling unit for cooling. # · Y The substrate transfer device according to the first aspect of the invention is characterized in that the heat-resistant material of the member is made of metal or ceramic. 8. If the section of the special plane (4) is rectangular and the ends are open, the shape of the tube is cut off and has a central opening. 9. If the scope of the patent application is 8th, the center of the above-mentioned holding member is 2, the second is the size of the substrate, and the length y2 of the holding member is greater than the base = the ruler is characterized in that it includes ············································ The substrate conveyance described in any one of claims 1 to 9