JP2009538541A5 - - Google Patents

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Publication number
JP2009538541A5
JP2009538541A5 JP2009513224A JP2009513224A JP2009538541A5 JP 2009538541 A5 JP2009538541 A5 JP 2009538541A5 JP 2009513224 A JP2009513224 A JP 2009513224A JP 2009513224 A JP2009513224 A JP 2009513224A JP 2009538541 A5 JP2009538541 A5 JP 2009538541A5
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Japan
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transfer chamber
module
transfer
substrate
modules
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JP2009513224A
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Japanese (ja)
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JP5706085B2 (ja
JP2009538541A (ja
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Priority claimed from US11/442,511 external-priority patent/US8398355B2/en
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Publication of JP2009538541A5 publication Critical patent/JP2009538541A5/ja
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JP2009513224A 2006-05-26 2007-05-24 直線状に分布された半導体部品処理ツール Expired - Fee Related JP5706085B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/442,511 US8398355B2 (en) 2006-05-26 2006-05-26 Linearly distributed semiconductor workpiece processing tool
US11/442,511 2006-05-26
PCT/US2007/012582 WO2007139981A2 (en) 2006-05-26 2007-05-24 Linearly distributed semiconductor workpiece processing tool

Publications (3)

Publication Number Publication Date
JP2009538541A JP2009538541A (ja) 2009-11-05
JP2009538541A5 true JP2009538541A5 (https=) 2015-03-05
JP5706085B2 JP5706085B2 (ja) 2015-04-22

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JP2009513224A Expired - Fee Related JP5706085B2 (ja) 2006-05-26 2007-05-24 直線状に分布された半導体部品処理ツール

Country Status (5)

Country Link
US (1) US8398355B2 (https=)
JP (1) JP5706085B2 (https=)
KR (1) KR101564359B1 (https=)
TW (1) TWI497633B (https=)
WO (1) WO2007139981A2 (https=)

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