WO2007124276A2 - Light emitting diode packages - Google Patents

Light emitting diode packages Download PDF

Info

Publication number
WO2007124276A2
WO2007124276A2 PCT/US2007/066417 US2007066417W WO2007124276A2 WO 2007124276 A2 WO2007124276 A2 WO 2007124276A2 US 2007066417 W US2007066417 W US 2007066417W WO 2007124276 A2 WO2007124276 A2 WO 2007124276A2
Authority
WO
WIPO (PCT)
Prior art keywords
leds
package
led
led lighting
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/US2007/066417
Other languages
English (en)
French (fr)
Other versions
WO2007124276A3 (en
Inventor
Russell G. Villard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wolfspeed Inc
Original Assignee
Cree Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cree Inc filed Critical Cree Inc
Priority to JP2009506690A priority Critical patent/JP2009534851A/ja
Priority to EP07760470.0A priority patent/EP2010819B1/en
Publication of WO2007124276A2 publication Critical patent/WO2007124276A2/en
Anticipated expiration legal-status Critical
Publication of WO2007124276A3 publication Critical patent/WO2007124276A3/en
Ceased legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/14—Controlling the intensity of the light using electrical feedback from LEDs or from LED modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/40—Details of LED load circuits
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional [2D] array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates generally to improvements in the field of light emitting diode (LED) packages, and, in particular, to methods and apparatus for achieving color uniformity, desired brightness levels, and passive dissipation of heat when LEDs are arranged to address the varied requirements of different lighting applications.
  • LED light emitting diode
  • a common prior art LED mounting arrangement results in a substantial portion of the light output going upwardly in the direction of a normal to the top surface of a semiconductor photonic chip 12 as seen in Fig. IB.
  • Fig. IA a top view of an LED 10
  • the semiconductor photonic chip 12 is mounted on a substrate 14 which is in turn mounted on a bonding pad 16.
  • the chip 12 is encapsulated beneath an optical lens 18 which focuses the light emitted by the chip 12.
  • Fig. IB shows a side view of LED 10 with a plurality of light rays relative to a normal, N, to the top surface of chip 12 illustrating the light emitted by chip 12 as it passes out of lens 18.
  • LED 10 is an XLampTM 7090 from Cree, Incorporated.
  • Fig. 1C shows an illustrative plot of the light emitted by LED 10 with the y-axis representing the intensity, I, and the x-axis representing the angle, ⁇ , of the emitted light with respect to the normal, N, of Fig. IB. As illustrated in Fig. 1C, a substantial portion of the light emitted from the LED is along or near the normal, N. Conversely, only a small percentage is emitted sideways.
  • Angle ⁇ the angle of intensity, is equal to 2* ⁇ .
  • exemplary prior art LED packages with the bulk of the light intensity emitted near the normal, N see, for example, the product literature for the XLampTM 7090 from Cree, Incorporated.
  • a photonic chip may be specifically manufactured to primarily emit white light. Some of these photonic chips may emit a disproportionate amount of yellow light near the edges of the cone of light whereas light emitted at other angles within the angle of intensity emit primarily white light. When this emitted light strikes a diffuser, such as back lighting a curtain or a shield covering an LED light package, for example, yellow rings around a concentration of white light may be visible to the human eye, causing a degradation of color uniformity. Additionally, when LED 10 is powered on, heat from LED 10 collects along the bottom surface 15 of bonding pad 16. In general, heat radiates from the bottom of photonic chip 12.
  • an LED such as LED 10 may be driven by approximately 350 mAmps and expend 1 Watt of power where approximately 90% of the expended power is in the form of heat.
  • Conventional approaches for dissipating heat generated from an LED include active and passive techniques.
  • a conventional active technique includes employing a fan to blow cooler air onto the back surface of LED 10.
  • Several disadvantages of this conventional technique include its cost, its anaesthetic appearance, and the production of fan noise.
  • One conventional passive technique includes an aluminum panel with large aluminum extrusions emanating from an outer edge of a light fixture. At least a few of the failings of this approach include added cost for materials composing the extrusions, added weight, and limited heat dissipation due to a build up of air pressure resulting from the heated air being trapped by the extrusions.
  • the present invention recognizes the desirability of both increasing brightness and passively controlling heat dissipation of heat generated by powered LEDs and addresses a variety of techniques for addressing such ends. Further, the present invention recognizes that material cost, light weight, and ease of manufacture with a small number of parts are also highly desirable and seeks to address such ends as well.
  • Some exemplary lighting applications include lighting a horizontal surface, wall washing, back lighting a diffuser, and the like. Each of these lighting applications may have different requirements with respect to brightness levels, lighting patterns, and color uniformity. As multiple LEDs such a LED 10 are arranged to address varied requirements of different lighting applications, the brightness of the collective emitted light and the amount of heat generated per area varies with the arrangement.
  • a particular lighting application may require a high brightness level.
  • more LEDs may be arranged closer together in the same predefined area as a lighting application requiring less brightness.
  • the closer together LEDs are placed, the more heat is generated in the concentrated area containing the LEDs.
  • the present invention recognizes that an arrangement of LEDs should balance factors such as color uniformity, heat dissipation, material cost, brightness, and the ⁇ ike.
  • the present approach includes a backing of thermally conductive material and two or more arrays of LEDs attached to a printed circuit board (PCB).
  • PCB printed circuit board
  • array of LEDs means a module of one or more LEDs in various configurations and arrangements.
  • the PCB is attached to the top surface of the backing and the two or more arrays of LEDs are separated by a selected distance to balance heat dissipation and color uniformity of the LEDs.
  • Another aspect of the present invention includes a plurality of LEDs, a T-shaped bar composed of thermally conductive material, and a printed circuit board (PCB).
  • the plurality of LEDs includes a plurality of LEDs, a T-shaped bar composed of thermally conductive material, and a printed circuit board (PCB).
  • PCB printed circuit board
  • LEDS are attached to the PCB.
  • the PCB is attached to the upper surface of the T-shaped bar to dissipate heat generated from the plurality of LEDs.
  • the controls system includes a potentiometer, a plurality of direct current (DC) power supplies, and a control relay switch.
  • Each DC power supply has an analog control port and a positive output terminal.
  • the potentiometer connects to the analog control ports of the DC power supplies.
  • the control relay switch connects the positive output terminal to the plurality of LED lighting packages and controls whether a portion of the plurality of LED lighting packages are powered by the plurality of DC power supplies at any one time.
  • Figs. IA- 1C are top and side views illustrating aspects of a prior art LED packaging arrangement, and a graph illustrating how the intensity of light emission tends to vary with the angle from normal, respectively.
  • Figs. 2A and 2B show a top view of two 1 foot x 1 foot LED lighting packages in accordance with the present invention.
  • Fig. 3 shows a top view of a 1 foot x 1 foot LED lighting packages having an alternative backing arrangement to Fig. 2 in accordance with the present invention.
  • Figs. 4 A and 4B are top views illustrating aspects of two 2 feet x 2 feet LED lighting packages.
  • Figs. 4C-4E are perspective views of lighting applications employing the lighting packages of Figs. 4A, 4B, and 5C.
  • Figs. 5A-5C show T-shaped heat sinks for an array of LEDs according to the present invention.
  • Fig. 6 shows a side view of a lighting package employing the T-shaped heat sink of Fig. 5 in accordance with the present invention.
  • Figs. 7A-7D show lighting packages which dissipate heat from an array of LEDs mounted therein in accordance with the present invention.
  • Fig. 8 shows a control system for one or more LED lighting packages according to the present invention.
  • Fig. 9 illustrates various exemplary arrangements of LED module in accordance with the present invention.
  • Fig. 2A shows a top view of a 1 foot x 1 foot light emitting diode (LED) lighting package 200 in accordance with the present invention.
  • the LED lighting package 200 includes a backing 210 of thermally conductive material such as aluminum.
  • Backing 210 as shown in Fig. 2 is a planar sheet of aluminum with a thickness of approximately 1/16 inch.
  • other backing constructs may provide additional heat dissipation properties and can be employed in similar arrangements as backing 210.
  • the patent application entitled 'Light Emitting Diode Lighting Package with Improved Heat Sink” concurrently filed with this application addresses additional backing structures and is incorporated by reference herein in its entirety.
  • the LED lighting package 200 includes three columns of LEDs. Each column includes two printed circuit boards (PCBs) such as PCB 220A and 220B. On each PCB, five LEDs such as LED 10 are mounted and are electrically connected in serial with each other. Each PCB includes a positive voltage te ⁇ ninal and a negative voltage terminal (not shown). The negative voltage terminal of PCB 220A is electrically connected to the positive voltage terminal of PCB 220B so that the ten LEDs defining a column are electrically connected in serial.
  • PCBs printed circuit boards
  • PCBs are shown to construct one column of LEDs, a single PCB may be utilized for a particular column of LEDs.
  • Each column often LEDs is electrically connected in parallel to its adjacent column by wires 230A-D, respectively.
  • the backing 210 is preferably anodized with a white gloss to reflect the light emitted from the LEDs.
  • the three column arrangement of LEDs as illustrated in Fig. 2 A seeks to balance heat dissipation for the LEDs, color uniformity, brightness, and cost in an advantageous manner.
  • the LEDs are positioned in the vertical direction at equidistant spacing, v, and in the horizontal direction at equidistant spacing, d.
  • the spacing is measured from the center of two adjacent LEDs.
  • the exemplary measurements shown in Fig. 2A have the vertical equidistant spacing, v as approximately 1 inch.
  • the vertical equidistant spacing, v is typically determined by the LED mounting arrangement such as the mounting arrangement shown in Fig. IA.
  • the horizontal equidistant spacing, d is approximately 3 inches, ⁇ f the horizontal spacing is increased beyond approximately d, overall brightness will degrade due to the number of LEDs being able to fit in the 1 foot x 1 foot lighting package 200, thermal dissipation will level off, and color uniformity will degrade.
  • LED lighting package 200 For a lighting application which requires a brightness level achieved by the arrangement as shown in Fig. 2A, LED lighting package 200 satisfies the brightness requirement while also providing color uniformity and effective heat dissipation at a reasonable cost. For example, when powering LED lighting package 200 under an ambient temperature of approximately 25° C, the temperature of backing 210 at steady state was approximately 55° C.
  • Fig. 2B shows a top view of a 1 foot x 1 foot light emitted diode (LED) lighting package 240 in accordance with the present invention.
  • LED lighting package 240 addresses those applications which have low brightness level requirements and, thus, need to primarily focus on addressing color uniformity, LED lighting package 240 positions the LEDs so that each of the LEDs are approximately equidistant from an adjacent LED in every direction. As shown in Fig. 2B, eleven LEDs are equally spaced distance, d, inches apart.
  • d For example, in the 1 foot x 1 foot LED lighting package 240 which utilizes LED 10 having an angle of intensity of 100°, d equals approximately three inches. At distance, d, or closer, the intensity of primarily white light emitted from one LED absorbs the yellow light found at the edges of a cone of light emitted by an adjacent LED. Since the total number of
  • LEDs in LED lighting package 240 is eleven, heat dissipation in a 1 foot x 1 foot frame is a non- issue. Consequently, d may be decreased and more LEDs may be added without affecting color uniformity until the heat dissipation capacity of backing 210 is maximized.
  • Fig. 3 shows a top view of a 1 foot x 1 foot LED lighting package 300 employing an alternative backing arrangement 305 in accordance with the present invention.
  • Backing arrangement 305 is in the form of a ladder structure.
  • the ladder structure is composed of strips of thermally conductive material such as aluminum and preferably anodized with a white gloss.
  • the ladder structure includes an upper member 310A and a lower member 310B attached to cross members 315A-315C.
  • the cross members 315 A-315C as shown in this exemplary embodiment are approximately 1.5 inches wide, 1 foot long, and 1/16 inch thick and are spaced z or approximately 1.6 inches apart.
  • Cross members 315 A-315C are attached to members 310A- 310B and separated by free space.
  • PCBs such as PCBs 320A and 320B containing an array of five LEDs are attached to the cross members 315A-315C.
  • the combination of cross member 315C with PCBs 320A and 320B compose LED module 317.
  • the vertical equidistant spacing, v, in this exemplary embodiment is approximately 1 inch.
  • the horizontal equidistant spacing, d, in this exemplary embodiment is approximately 2.75 inches.
  • the edge distance, e, as shown in Fig. 3 is approximately 3 1/4 inches.
  • the LED lighting package 300 may now achieve higher brightness levels than LED lighting package 200 with the same heat dissipation because the LED arrays can be positioned closer. Furthermore, since the edge distance, e, is greater than the horizontal distance, d, an additional column of LEDs may be added, further increasing the brightness as will be discussed further in connection with Fig. 5C. It is noted that although the ladder structure is shown as strips of thermally conductive materially attached to support members, the present invention contemplates alternative techniques of forming a ladder structure such as by stamping out space gaps from a planar backing such as backing 210.
  • Figs. 4A and 4B are top views illustrating aspects of two 2 feet x 2 feet LED lighting packages. Fig.
  • LED lighting package 400 comprises six columns 405A-405F of twenty LEDs. Each of the LEDs in a particular column is electrically connected in serial. Each column of LEDs is electrically connected in parallel. LED lighting package 400 is composed of four 1 foot x ] foot LED lighting packages 200 fixedly attached to each other with modified wiring to maintain the parallel electrical connections between columns 405A-405F.
  • the horizontal and vertical spacing of LED lighting package 400 is the same as Fig. 2A, Rather than abutting four separate 1 foot x 1 foot LED lighting packages as illustrated in Fig. 4A, LED lighting package 400 may be alternatively constructed utilizing a planar sheet of thermally conductive material for backing 403 and the columns 405A-45F may be fixedly attached to the planar sheet.
  • Fig. 4B shows a 2 feet x 2 feet LED lighting package 410.
  • LED lighting package 410 comprises a ladder structure 415.
  • the ladder structure 415 includes an upper member 420A, an optional middle member 420B, and a lower member 420C.
  • the ladder structure 415 also includes cross members 417A-417F where each member is fixedly attached to members 420A- 420C.
  • Each cross member has a column of four PCBs with each PCB having five LEDs mounted thereon.
  • the horizontal and vertical spacing of LED lighting package 410 is the same as Fig. 3.
  • Members 420A-420B and 417A-417F are constructed from a thermally conductive material such as aluminum which is preferably anodized with a white gloss.
  • LED lighting packages are illustrative and exemplary.
  • Fig. 4C is a perspective view of an exemplary backlight lighting application 422 employing six LED lighting packages 425A-425F.
  • LED lighting packages 425A-425F may suitably be similar to LED lighting packages 200, 240, 300, 400, and 410 and the choice of which LED lighting package to deploy in the exemplary lighting application 422 depends on the brightness level required to illuminate curtain 427, a distance between lighting packages and curtain 427, and aesthetic effect to be accomplished.
  • the distance between the array of LED lighting packages 425A-425F and the curtain 427 is between 5 and 18 inches.
  • a footprint of area defined by the array of LED lighting packages 425A-425F is preferably 75% of the area of the curtain 427.
  • curtain 427 would cover eight square feet.
  • curtain 427 is one type of diffuser which may used in a back lighting application such as lighting a demonstration booth at a trade show, other diffuser types such as those made from cloth, plastics, nylon, and the like may be utilized within the scope of the present invention.
  • another back lighting application may include a screen as the diffuser and a sign being projected on the screen.
  • Fig. 4D is a perspective view of an exemplary surface lighting application 435 employing an LED lighting package 429.
  • Exemplary surface lighting application 435 illuminates a conference table 442.
  • LED lighting package 429 has a lighting cover 440 which acts a light diffuser.
  • LED lighting package 429 may suitably be similar to LED lighting packages 200, 240, 300, 400, 410, and 540 and the choice of which LED lighting package to deploy in the exemplary surface lighting application 435 depends on the brightness level required to illuminate conference table 442.
  • Fig. 4E is a perspective view of an exemplary high bay lighting application 450 employing an LED lighting fixture 455 in accordance with the teachings of the present invention.
  • LED lighting fixture 455 includes an LED lighting package such as LED lighting package 540.
  • LED lighting fixture 455 is placed a distance, h.
  • the distance, h, as shown is 20 feet.
  • a typical range for LED lighting fixture 455 is between 8 and 30 feet.
  • LED lighting package 540 will be described further in connection with the discussion of Fig. 5C.
  • Fig. 5 A shows a perspective view 500 of a T-shaped integrated support heat sink 510 for a PCB 520 having an array of LEDs such as PCB 220A according to the present invention.
  • the T-shaped integrated support heat sink 510 has a width, w, of approximately 1.5 inches and a height, h, of approximately 1 inch.
  • the length, I 5 is approximately 5.5 inches.
  • the T-shaped heat sink 510 is made from thermally conductive material and is preferably a T-shaped aluminum bar.
  • PCB 520 is fixedly attached to the T- shaped heat sink 510.
  • T-shaped heat sink 510 provides heat dissipation of the array of LEDs mounted to PCB 520.
  • Fig. 5B shows a perspective view of a T-shaped LED array module 530 in accordance with the present invention.
  • T-shaped LED array module 530 include a T-shaped heat sink 525 and a PCB 535 containing ten LEDs fixedly mounted on the top surface of the T-shaped heat sink 525.
  • the T-shaped heat sink 525 has a width of approximately 1 inch, a height of approximately 1 inch, and a length of approximately 12 inches.
  • the T-shaped heat sink 525 is made from thermally conductive material such as aluminum, is approximately 1/16 inch thick, and is optionally painted anodized black.
  • Fig. 5C shows a top view of a 1 foot x 1 foot LED lighting package 540 having nine LED lighting arrays such as T-shaped LED array module 530 for a total of 90 LEDs.
  • LED lighting package 540 includes two L-shaped support bars 545A and 545B.
  • the T-shaped LED arrays are attached to the inside surface the L-shaped support bars 545A and 545B and spaced at an equal distance, s, of approximately 1/4 inch. Since the LEDs are positioned so close to each other, color uniformity is achieved.
  • Two L-shaped support bars 545A and 545B are optionally anodized in black to help the heat be drawn from the LEDs and are made with thermally conductive material such as aluminum.
  • LED lighting package 540 allows 90 one watt LEDs to be placed in close proximity within a 1 foot x 1 foot area. LED lighting package 540 may be suitably utilized in a high intensity density (HID) lighting application such as a high bay warehouse lighting application. It is noted that although support bars 545A and 545B are shown as L-shaped, other shaped bars may be utilized such as T-shape and Z-shape support bars.
  • HID high intensity density
  • Fig. 6 shows a side view of a lighting package 600 employing the T-shaped heat sink 510 in accordance with the present invention.
  • the lighting package 600 includes an L-shaped bar 620 having a width of approximately 1/8 inch, a vertical length of approximately 3 inches, and a horizontal length of approximately 2.5 inches.
  • the L-shaped bar 620 is preferably constructed from thermally conductive material such as aluminum.
  • the ends of the L-shaped bar are optionally flanged to support a piece of transparent synthetic resinous material 650 such as acrylic, Plexiglas®, and the like.
  • the flanged ends are approximately .25 inches long.
  • the T* shaped heat sink 510 is fixedly mounted to the inner surfaces of the L-shaped bar 620.
  • the bottom outer surface of the L-shaped bar 620 is fixedly mounted to the outer surface of the top portion of a hinge 640.
  • the outer surface of the bottom portion of the hinge 640 is fixedly mounted to plate 630.
  • the hinge 640 allows the light emitted from the array of LEDs 520 to be adjusted and aligned with a subject.
  • the optional piece of transparent synthetic resinous material 650 is mounted on the flanged ends of the L-shaped bar 620. It should be recognized that rather than the L-shaped bar 620, an equal side comer bar may be alternatively utilized.
  • Figs. 7A-7D show lighting packages which dissipate heat from an array of LEDs mounted therein in accordance with the present invention.
  • Fig. 7 A shows a perspective view of a lighting package 700 in the shape of a trapezoidal channel 710.
  • the trapezoidal channel 710 has a base 705 at the bottom of the channel and two sides 715A-715B extending at obtuse angles from the base 705.
  • the trapezoidal channel 710 has a thickness of approximately 1/16 inch and is made from thermal conductive material such as aluminum.
  • Base 705 is approximately 2 inches.
  • the height of the top edge of sides 715A-715B as measured according to a normal line projected to a plane defined by base 705 is approximately 1 inch.
  • the distance, t, between the top edges of sides 715A-715B is approximately 3 inches.
  • the length of the trapezoidal channel 710, 1, varies with the particular type of lighting application.
  • the inside surface of the trapezoidal channel 710 is preferably anodized with a white gloss.
  • a PCB 720 containing LEDS is fixedly mounted at the top of base 705.
  • PCB 720 may suitably be similar to PCB 520.
  • Trapezoidal channel 710 serves as a heat sink as well as a LED light package. Other channel shapes may be employed as an LED lighting package.
  • Fig. 7B shows a side view of a lighting package 730 having a channel with constant curvature.
  • Fig. 7C shows a side view of a lighting package 740 in the shape of a rectangular channel.
  • Lighting package 740 has PCB 720 fixedly mounted to the base of the lighting package 740.
  • Fig. 7D shows a side view of a lighting package 740 in the shape of a parabolic channel.
  • Lighting packages 730 and 750 has PCB 720 mounted through a T-shaped heat sink such as heat sink 510.
  • transparent synthetic resinous material such as acrylic, Plexiglas®, and the like may be affixed to the top of LED lighting packages 710, 730, 740, and 750.
  • the spacing in the above packages balances color uniformity, heat dissipation, brightness, and cost for Cree's XLampTM 7090 for a particular lighting application and addresses other LEDs having similar operating characteristics of the XLampTM 7090.
  • Fig. 8 shows a control system 800 for one or more LED lighting packages according to the present invention.
  • lighting application 422 utilizes six LED lighting packages.
  • control system 800 may be suitably employed to selectively apply power to one or more of six LED lighting packages and to simultaneously vary the brightness of one or more of the six LED lighting packages. During brightness adjustment, the activated LED lighting packages are adjusted together so as to output the same brightness level.
  • Control system 800 includes six direct current (DC) power supplies 810A-810F, a potentiometer 820, and an Ethernet control relay switch. Each power supply supplies power to a corresponding LED lighting package such as lighting packages 200, 240, 300, 400, and 410.
  • DC direct current
  • power supplies 810B-810F may suitably be similar and employ similar or identical equipment.
  • power supplies 810B-810F may employ different equipment from that of the item 810A and of one another, so long as they are able to communicate with potentiometer 820.
  • Power supplies 81OA-81OF may be suitably a constant current supply with appropriate wattage such as model PS1-150W-36, manufactured by PowerSupplyl.
  • Power supplies 810A-810F have a positive DC output terminal electrically connected to Ethernet control relay switch 830 and a negative DC output terminal electrically connected to ground.
  • Power supplies 810A-810F also have an analog control port such as analog control port 815 which is electrically connected to potentiometer 820.
  • the potentiometer 820 preferably includes an Ethernet control port and is preferably connected to a wireless router 840. Potentiometer 820 is well known and may include generally available 1 kiloohm, 1 watt potentiometer having an integrated Ethernet.
  • the Ethernet control relay switch 830 includes at least six output ports such as output port 825. Each output port is electrically connected to a corresponding LED lighting package.
  • the Ethernet control relay switch 830 also includes an Ethernet control port 835 which is preferably connected to the wireless router 840.
  • Ethernet control relay switch 830 may suitably be a Smart Relay Controller, manufactured by 6Bit Incorporated having six 10 amp relays.
  • a laptop 850 with a wireless adapter wirelessly communicates with the wireless router 840 to control either the Ethernet control relay switch 830 to selectively power one or more LED lighting packages, the potentiometer 820 to vary together the brightness level of LED lighting packages, or both.
  • Power supplies 810A-810F receive input from an alternating current (AC) power source (not shown).
  • the AC power source may provide 120 volts (V) at 20 amps (A) or a range of 220 V-240V at 20A.
  • the input AC power runs between 50 and 60 hertz (Hz).
  • the output power of power supplies 810A-810F matches the DC operating conditions of at most six columns of 20 serially connected LEDs where each column is electrically connected in parallel.
  • the designed operating range for an LED such as LED 10 is to receive constant current around 350 mA. Consequently, for each power supply to power an LED lighting package such lighting packages 400 and 410, each power supply outputs 36V at 4.2 Amps.
  • the Ethernet control relay switch 830 is controlled by a laptop through its Ethernet port 835 to connect one or more power supplies 810A-810F to their corresponding LED lighting packages.
  • the potentiometer is manually controlled or controlled by laptop 850 to, in turn, vary the output voltage of power supplies 810A-810F simultaneously to the connected LED lighting packages.
  • the combination of relay control and brightness control of the LED lighting packages provides a two dimensional adjustment.
  • Laptop 850 may alternatively employ music to control both the potentiometer 820 and Ethernet control relay switch 830 so that the LED lighting packages emit lighting patterns corresponding to the beat of the music.
  • LED lighting packages have been disclosed in the context of an XLampTM 7090 from Cree, Incorporated, the dimensions disclosed within a package such as spacing between members may vary based on the operating characteristics of a particular LED such as the XLampTM 3 7090, XLampTM 4550, and the like when employed by the LED lighting packages.
  • LED lighting packages 200, 240, 300, 400, 410, and 540 and T-shaped integrated support heat sink 510 are modular components and may be combined with themselves or with each other to make various arrangements and configurations of larger LED lighting packages to meet specific lighting applications. Additionally, LED lighting packages 200, 240, 300, 400, and 410 and their combinations may be mounted and/or retrofitted into existing non-LED lamp fixtures including fluorescent ceiling fixtures. In retrofitting existing LED lighting packages to existing fluorescent lamp fixtures according to the teachings of the present invention, alternating current (AC) to DC conversion circuitry may need to be added or replaced in a manner known to one having ordinary skill in the art. Alternatively, AC may be supplied to the LED lighting packages.
  • AC alternating current
  • various layers may proximately cover LED lighting packages and integrated support heat sinks disclosed herein including diffusers, collimators, optics, lens, and the like.
  • a diffuser is generally placed approximately 4 inches from the LEDs in the LED lighting packages to blend the light emitted.
  • the spacing may be selected to achieve a desired color uniformity or appearance.
  • An LED module which includes PCB and LED combination mounted on a thermally conductive backing such as LED module 317 is modular and may be arranged to address various configurations according to a specific lighting application.
  • Fig. 9 illustrates various exemplary arrangements 900 of LED modules to define alternative LED lighting packages in accordance with the present invention.
  • the LED lighting packages may include LED modules and/or support members without LEDs.
  • the LED modules or support members have been described as strips, alternative shapes and/or lengths for the LED modules may be utilized.
  • the printed circuit boards (PCBs) containing one or more LEDs described in the above embodiments is preferably mounted to thermally conductive material utilizing a thermal apoxy such as such as Loctitc® 384, other well known techniques including utilizing screws, rivets, and the like are also contemplated by the present invention.
  • the PCBs described above may be painted white to help reflect emitted light or black to help heat dissipation depending on the particular lighting application.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
PCT/US2007/066417 2006-04-21 2007-04-11 Light emitting diode packages Ceased WO2007124276A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2009506690A JP2009534851A (ja) 2006-04-21 2007-04-11 Ｌｅｄパッケージ
EP07760470.0A EP2010819B1 (en) 2006-04-21 2007-04-11 Light emitting diode packages

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/379,709 2006-04-21
US11/379,709 US7648257B2 (en) 2006-04-21 2006-04-21 Light emitting diode packages

Publications (2)

Publication Number Publication Date
WO2007124276A2 true WO2007124276A2 (en) 2007-11-01
WO2007124276A3 WO2007124276A3 (en) 2009-03-05

Family

ID=38619304

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/066417 Ceased WO2007124276A2 (en) 2006-04-21 2007-04-11 Light emitting diode packages

Country Status (4)

Country Link
US (2) US7648257B2 (https=)
EP (1) EP2010819B1 (https=)
JP (1) JP2009534851A (https=)
WO (1) WO2007124276A2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2219066A1 (en) * 2009-02-13 2010-08-18 LG Innotek Co., Ltd. Light emitting module, and light source and display device having the same

Families Citing this family (133)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7564180B2 (en) 2005-01-10 2009-07-21 Cree, Inc. Light emission device and method utilizing multiple emitters and multiple phosphors
US8125137B2 (en) 2005-01-10 2012-02-28 Cree, Inc. Multi-chip light emitting device lamps for providing high-CRI warm white light and light fixtures including the same
EP1963740A4 (en) 2005-12-21 2009-04-29 Cree Led Lighting Solutions LIGHTING DEVICE AND LIGHTING METHOD
TWI421438B (zh) 2005-12-21 2014-01-01 克里公司 照明裝置
KR20090009772A (ko) 2005-12-22 2009-01-23 크리 엘이디 라이팅 솔루션즈, 인크. 조명 장치
US8513875B2 (en) 2006-04-18 2013-08-20 Cree, Inc. Lighting device and lighting method
TWI460880B (zh) 2006-04-18 2014-11-11 Cree Inc 照明裝置及照明方法
US9084328B2 (en) 2006-12-01 2015-07-14 Cree, Inc. Lighting device and lighting method
EP2008019B1 (en) 2006-04-20 2015-08-05 Cree, Inc. Lighting device and lighting method
US7648257B2 (en) * 2006-04-21 2010-01-19 Cree, Inc. Light emitting diode packages
CN101589268A (zh) 2006-05-31 2009-11-25 科锐Led照明科技公司 照明装置和照明方法
JP4729441B2 (ja) * 2006-06-09 2011-07-20 スタンレー電気株式会社 車両用灯具
JP2010500720A (ja) * 2006-08-11 2010-01-07 エルジー イノテック カンパニー リミテッド ライトユニット及びこれを備えた液晶表示装置
US7665862B2 (en) 2006-09-12 2010-02-23 Cree, Inc. LED lighting fixture
US7766508B2 (en) * 2006-09-12 2010-08-03 Cree, Inc. LED lighting fixture
JP4981390B2 (ja) * 2006-09-20 2012-07-18 オスラム・メルコ株式会社 Ｌｅｄランプ
US9564070B2 (en) * 2006-10-05 2017-02-07 GE Lighting Solutions, LLC LED backlighting system for cabinet sign
US8029155B2 (en) 2006-11-07 2011-10-04 Cree, Inc. Lighting device and lighting method
EP2420721B1 (en) * 2006-11-14 2016-03-30 Cree, Inc. Lighting assemblies and components for lighting assemblies
WO2008061082A1 (en) 2006-11-14 2008-05-22 Cree Led Lighting Solutions, Inc. Light engine assemblies
US9441793B2 (en) 2006-12-01 2016-09-13 Cree, Inc. High efficiency lighting device including one or more solid state light emitters, and method of lighting
CN101611259B (zh) 2006-12-07 2012-06-27 科锐公司 照明装置和照明方法
US8258682B2 (en) * 2007-02-12 2012-09-04 Cree, Inc. High thermal conductivity packaging for solid state light emitting apparatus and associated assembling methods
US7922360B2 (en) * 2007-02-14 2011-04-12 Cree, Inc. Thermal transfer in solid state light emitting apparatus and methods of manufacturing
JP5476128B2 (ja) 2007-02-22 2014-04-23 クリー インコーポレイテッド 照明装置、照明方法、光フィルタ、および光をフィルタリングする方法
US7824070B2 (en) 2007-03-22 2010-11-02 Cree, Inc. LED lighting fixture
US7690802B2 (en) * 2007-04-17 2010-04-06 Cree, Inc. Light emitting diode emergency lighting methods and apparatus
ES1065356Y (es) * 2007-04-24 2007-11-01 Luxintec S L Regleta para iluminacion con fuentes de luz led
US7744243B2 (en) 2007-05-08 2010-06-29 Cree Led Lighting Solutions, Inc. Lighting device and lighting method
EP2156090B1 (en) 2007-05-08 2016-07-06 Cree, Inc. Lighting device and lighting method
CN101755164B (zh) 2007-05-08 2013-03-27 科锐公司 照明装置和照明方法
CN101711325B (zh) 2007-05-08 2013-07-10 科锐公司 照明装置和照明方法
US7901107B2 (en) 2007-05-08 2011-03-08 Cree, Inc. Lighting device and lighting method
US8042971B2 (en) 2007-06-27 2011-10-25 Cree, Inc. Light emitting device (LED) lighting systems for emitting light in multiple directions and related methods
US20090002979A1 (en) * 2007-06-27 2009-01-01 Cree, Inc. Light emitting device (led) lighting systems for emitting light in multiple directions and related methods
US7863635B2 (en) 2007-08-07 2011-01-04 Cree, Inc. Semiconductor light emitting devices with applied wavelength conversion materials
US8143777B2 (en) * 2007-08-23 2012-03-27 Stanley Electric Co., Ltd. LED lighting unit with LEDs and phosphor materials
CN101821544B (zh) 2007-10-10 2012-11-28 科锐公司 照明装置及制造方法
US8118447B2 (en) 2007-12-20 2012-02-21 Altair Engineering, Inc. LED lighting apparatus with swivel connection
US8322881B1 (en) 2007-12-21 2012-12-04 Appalachian Lighting Systems, Inc. Lighting fixture
US7712918B2 (en) 2007-12-21 2010-05-11 Altair Engineering , Inc. Light distribution using a light emitting diode assembly
US8360599B2 (en) 2008-05-23 2013-01-29 Ilumisys, Inc. Electric shock resistant L.E.D. based light
US8439524B2 (en) * 2008-06-05 2013-05-14 Relume Technologies, Inc Light emitting assembly with independent heat sink LED support
US8240875B2 (en) 2008-06-25 2012-08-14 Cree, Inc. Solid state linear array modules for general illumination
US7976196B2 (en) 2008-07-09 2011-07-12 Altair Engineering, Inc. Method of forming LED-based light and resulting LED-based light
US7946729B2 (en) 2008-07-31 2011-05-24 Altair Engineering, Inc. Fluorescent tube replacement having longitudinally oriented LEDs
US8674626B2 (en) 2008-09-02 2014-03-18 Ilumisys, Inc. LED lamp failure alerting system
US8256924B2 (en) 2008-09-15 2012-09-04 Ilumisys, Inc. LED-based light having rapidly oscillating LEDs
US8214084B2 (en) 2008-10-24 2012-07-03 Ilumisys, Inc. Integration of LED lighting with building controls
US8324817B2 (en) 2008-10-24 2012-12-04 Ilumisys, Inc. Light and light sensor
US8901823B2 (en) 2008-10-24 2014-12-02 Ilumisys, Inc. Light and light sensor
US7938562B2 (en) 2008-10-24 2011-05-10 Altair Engineering, Inc. Lighting including integral communication apparatus
US8653984B2 (en) 2008-10-24 2014-02-18 Ilumisys, Inc. Integration of LED lighting control with emergency notification systems
US8444292B2 (en) 2008-10-24 2013-05-21 Ilumisys, Inc. End cap substitute for LED-based tube replacement light
KR101308752B1 (ko) * 2008-12-31 2013-09-12 엘지디스플레이 주식회사 액정표시장치
US8556452B2 (en) 2009-01-15 2013-10-15 Ilumisys, Inc. LED lens
US8362710B2 (en) 2009-01-21 2013-01-29 Ilumisys, Inc. Direct AC-to-DC converter for passive component minimization and universal operation of LED arrays
US8664880B2 (en) 2009-01-21 2014-03-04 Ilumisys, Inc. Ballast/line detection circuit for fluorescent replacement lamps
US8330381B2 (en) 2009-05-14 2012-12-11 Ilumisys, Inc. Electronic circuit for DC conversion of fluorescent lighting ballast
US8921876B2 (en) 2009-06-02 2014-12-30 Cree, Inc. Lighting devices with discrete lumiphor-bearing regions within or on a surface of remote elements
US8299695B2 (en) 2009-06-02 2012-10-30 Ilumisys, Inc. Screw-in LED bulb comprising a base having outwardly projecting nodes
KR101660721B1 (ko) * 2009-06-15 2016-09-29 엘지전자 주식회사 발광 다이오드 패키지 및 이를 포함하는 백라이트 유닛과 디스플레이장치
CA2765200A1 (en) 2009-06-23 2011-01-13 Altair Engineering, Inc. Illumination device including leds and a switching power control system
KR101628366B1 (ko) * 2009-07-06 2016-06-08 엘지전자 주식회사 광학 어셈블리, 이를 구비한 백라이트 유닛 및 디스플레이 장치
RU2507441C2 (ru) * 2009-07-31 2014-02-20 Шарп Кабусики Кайся Устройство задней подсветки, устройство отображения и телевизионный приемник
KR20120094477A (ko) 2009-09-25 2012-08-24 크리, 인코포레이티드 낮은 눈부심 및 높은 광도 균일성을 갖는 조명 장치
US20110080108A1 (en) * 2009-10-06 2011-04-07 Walsin Lihwa Corporation Color tunable light emitting diode
JP5340879B2 (ja) * 2009-10-13 2013-11-13 スタンレー電気株式会社 発光装置
EP2354817A1 (en) * 2009-12-14 2011-08-10 Lg Electronics Inc. Backlight unit, and display apparatus including the backlight unit
US9275979B2 (en) 2010-03-03 2016-03-01 Cree, Inc. Enhanced color rendering index emitter through phosphor separation
JP5571419B2 (ja) * 2010-03-24 2014-08-13 スタンレー電気株式会社 車両用前照灯
CA2794512A1 (en) 2010-03-26 2011-09-29 Ilumisys, Inc. Led light tube with dual sided light distribution
EP2553320A4 (en) 2010-03-26 2014-06-18 Ilumisys Inc LED LIGHT WITH THERMOELECTRIC GENERATOR
WO2011119958A1 (en) 2010-03-26 2011-09-29 Altair Engineering, Inc. Inside-out led bulb
US20110254470A1 (en) * 2010-04-19 2011-10-20 Gregory James Penoyer Collapsible Lighting Device
US8454193B2 (en) 2010-07-08 2013-06-04 Ilumisys, Inc. Independent modules for LED fluorescent light tube replacement
EP2593714A2 (en) 2010-07-12 2013-05-22 iLumisys, Inc. Circuit board mount for led light tube
US8414153B2 (en) 2010-08-05 2013-04-09 Access 2 Communications, Inc. High powered universal LED lamp
US20120036748A1 (en) * 2010-08-13 2012-02-16 Yu-Chung Yen DIY LED sign panel arrangement
FR2964176B1 (fr) * 2010-09-01 2015-10-16 Saint Gobain Panneau decoratif et eclairant a diodes electroluminescentes
KR101220834B1 (ko) * 2011-02-16 2013-01-21 (주)라이트스탠다드 방열성능의 향상 및 전압강하의 방지를 위한 고광력 엘이디 광원 구조체
US8035284B2 (en) * 2010-09-22 2011-10-11 Bridgelux, Inc. Distributed LED-based light source
JP2012069834A (ja) * 2010-09-27 2012-04-05 Toshiba Lighting & Technology Corp 発光装置及び照明装置
WO2012058556A2 (en) 2010-10-29 2012-05-03 Altair Engineering, Inc. Mechanisms for reducing risk of shock during installation of light tube
US8870415B2 (en) 2010-12-09 2014-10-28 Ilumisys, Inc. LED fluorescent tube replacement light with reduced shock hazard
US11251164B2 (en) 2011-02-16 2022-02-15 Creeled, Inc. Multi-layer conversion material for down conversion in solid state lighting
US9072171B2 (en) 2011-08-24 2015-06-30 Ilumisys, Inc. Circuit board mount for LED light
EP2745289A1 (en) * 2011-09-06 2014-06-25 Koninklijke Philips N.V. Topology of distributing and connecting leds in a large area matrix
US8307547B1 (en) 2012-01-16 2012-11-13 Indak Manufacturing Corp. Method of manufacturing a circuit board with light emitting diodes
US8733969B2 (en) 2012-01-22 2014-05-27 Ecolivegreen Corp. Gradient diffusion globe LED light and fixture for the same
US9184518B2 (en) 2012-03-02 2015-11-10 Ilumisys, Inc. Electrical connector header for an LED-based light
US8888313B2 (en) * 2012-03-07 2014-11-18 Harris Manufacturing, Inc. Light emitting diode troffer door assembly
US10347609B2 (en) * 2012-05-04 2019-07-09 Micron Technology, Inc. Solid-state transducer assemblies with remote converter material for improved light extraction efficiency and associated systems and methods
USD701342S1 (en) 2012-05-25 2014-03-18 Joshua David Company Light fixture assembly
US9163794B2 (en) 2012-07-06 2015-10-20 Ilumisys, Inc. Power supply assembly for LED-based light tube
US9271367B2 (en) 2012-07-09 2016-02-23 Ilumisys, Inc. System and method for controlling operation of an LED-based light
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source
JP6024957B2 (ja) * 2012-09-24 2016-11-16 東芝ライテック株式会社 発光装置および照明装置
US9285084B2 (en) 2013-03-14 2016-03-15 Ilumisys, Inc. Diffusers for LED-based lights
US20140286005A1 (en) * 2013-03-20 2014-09-25 Independence Led Lighting, Llc Lighting Device Having Optimized Placement of Light-Emitting Elements for Parabolic Fixtures
CN104241262B (zh) 2013-06-14 2020-11-06 惠州科锐半导体照明有限公司 发光装置以及显示装置
CN103322534A (zh) * 2013-06-21 2013-09-25 深圳市华星光电技术有限公司 直下型背光模组灯条装配结构、组装方法及液晶显示器
SG10201801865SA (en) * 2013-08-26 2018-04-27 Delta T Corp Tunable luminaire and related methods to control light output
US9267650B2 (en) 2013-10-09 2016-02-23 Ilumisys, Inc. Lens for an LED-based light
WO2015084851A1 (en) 2013-12-04 2015-06-11 3M Innovative Properties Company Flexible light emitting semiconductor device with large area conduit
JP2017504166A (ja) 2014-01-22 2017-02-02 イルミシス, インコーポレイテッドiLumisys, Inc. アドレス指定されたｌｅｄを有するｌｅｄベース電灯
US9903540B2 (en) * 2014-02-06 2018-02-27 Appalachian Lighting Systems, Inc. LED light emitting apparatus having both reflected and diffused subassemblies
US9510400B2 (en) 2014-05-13 2016-11-29 Ilumisys, Inc. User input systems for an LED-based light
US12372219B2 (en) * 2014-05-30 2025-07-29 Cree Lighting Usa Llc LED luminaire with a cavity, finned interior, and a curved outer wall extending from a surface on which the light source is mounted
WO2015191869A1 (en) * 2014-06-12 2015-12-17 Westland Jones Technologies, Llc System, devices, and methods for illumination including solid-state light emitting devices
EP3174612B1 (en) 2014-08-01 2019-09-04 Smart Billiard Lighting LLC Billiard table lighting and game play monitor
US9827483B2 (en) 2014-08-01 2017-11-28 Smart Billiard Lighting LLC Billiard table lighting and game play monitor
US10149439B2 (en) 2014-12-18 2018-12-11 Spectra Harvest Lighting, LLC LED grow light system
US10161568B2 (en) 2015-06-01 2018-12-25 Ilumisys, Inc. LED-based light with canted outer walls
USD835652S1 (en) 2015-12-10 2018-12-11 Smart Billiard Lighting LLC Display screen with transitional graphical user interface of a billiard game
DE102016203883A1 (de) * 2016-03-09 2017-09-14 Osram Gmbh Leuchtdiodenanordnung für eine Flächenleuchte
WO2017210361A1 (en) * 2016-05-31 2017-12-07 Air Motion Systems, Inc. Air cooled array and system for cooling light emitting diode systems
USD822890S1 (en) 2016-09-07 2018-07-10 Felxtronics Ap, Llc Lighting apparatus
CN106444158A (zh) * 2016-12-07 2017-02-22 超亮显示系统（深圳）股份有限公司 一种大尺寸液晶屏led矩阵直下式高亮背光模组
CN107068006A (zh) * 2017-03-22 2017-08-18 四川蓝景光电技术有限责任公司 Led灯箱及显示装置
US10775030B2 (en) 2017-05-05 2020-09-15 Flex Ltd. Light fixture device including rotatable light modules
USD872319S1 (en) 2017-08-09 2020-01-07 Flex Ltd. Lighting module LED light board
USD877964S1 (en) 2017-08-09 2020-03-10 Flex Ltd. Lighting module
USD846793S1 (en) 2017-08-09 2019-04-23 Flex Ltd. Lighting module locking mechanism
USD832494S1 (en) 2017-08-09 2018-10-30 Flex Ltd. Lighting module heatsink
USD862777S1 (en) 2017-08-09 2019-10-08 Flex Ltd. Lighting module wide distribution lens
USD833061S1 (en) 2017-08-09 2018-11-06 Flex Ltd. Lighting module locking endcap
USD832495S1 (en) 2017-08-18 2018-10-30 Flex Ltd. Lighting module locking mechanism
USD862778S1 (en) 2017-08-22 2019-10-08 Flex Ltd Lighting module lens
USD888323S1 (en) 2017-09-07 2020-06-23 Flex Ltd Lighting module wire guard
USD856569S1 (en) * 2017-11-09 2019-08-13 Illum Horticulture Llc Light fixture
WO2021209492A1 (en) * 2020-04-15 2021-10-21 CommScope Connectivity Belgium BV Device and method for sealing cables in telecommunications enclosures
US12338960B1 (en) * 2025-02-24 2025-06-24 Jiawei WANG IC control light bulb, LED light strip and IC controller

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060061539A1 (en) 2004-09-23 2006-03-23 Samsung Electronics Co., Ltd. Light generating device, backlight assembly having the same, and display apparatus having the backlight assembly

Family Cites Families (118)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1565500A (en) 1924-12-03 1925-12-15 Ritter Edward Electric vaporizer
US1775619A (en) * 1927-10-07 1930-09-09 Redirected Light Corp Of Ameri Headlight
GB1494493A (en) 1974-03-05 1977-12-07 Thorn Electrical Ind Ltd Lamp-holder with heat-sink
US3927290A (en) 1974-11-14 1975-12-16 Teletype Corp Selectively illuminated pushbutton switch
US4163277A (en) 1977-08-12 1979-07-31 Altman Charles W Spotlight
US4165851A (en) 1977-09-28 1979-08-28 Slater Electric Inc. Adjustably lockable bar hanger for ceiling boxes and the like
US4219871A (en) 1978-05-22 1980-08-26 The United States Of America As Represented By The Secretary Of The Navy High intensity navigation light
US4388677A (en) 1981-01-02 1983-06-14 Prescolite, A Div. Of U.S. Industries Recessed lighting unit
JPS58144885U (ja) * 1982-03-26 1983-09-29 株式会社日立製作所 発光体の固定装置
US4480291A (en) * 1983-09-14 1984-10-30 Dranginis William M Headlights for streamlined vehicles
AT396675B (de) * 1985-12-04 1993-11-25 Zizala Lichtsysteme Gmbh Fahrzeugleuchte
CA2005294C (en) 1988-12-14 1994-11-15 Raymond S. Laughlin Box support
US5264997A (en) 1992-03-04 1993-11-23 Dominion Automotive Industries Corp. Sealed, inductively powered lamp assembly
KR970006293B1 (ko) 1992-10-06 1997-04-25 캐논 가부시끼가이샤 원고 조명 장치
US5632551A (en) 1994-07-18 1997-05-27 Grote Industries, Inc. LED vehicle lamp assembly
US5537301A (en) 1994-09-01 1996-07-16 Pacific Scientific Company Fluorescent lamp heat-dissipating apparatus
JPH08116096A (ja) * 1994-10-14 1996-05-07 Hamamatsu Photonics Kk 発光装置
US5588737A (en) 1994-11-10 1996-12-31 Thomas Industries, Inc. Modular recessed lighting system
DE19528459C2 (de) 1995-08-03 2001-08-23 Garufo Gmbh Kühlung für ein mit LED's bestücktes Leuchtaggregat
US5834889A (en) 1995-09-22 1998-11-10 Gl Displays, Inc. Cold cathode fluorescent display
CA2161051A1 (en) 1995-10-20 1997-04-21 Howard Sirkin Pot light mounting clip
US6076936A (en) 1996-11-25 2000-06-20 George; Ben Tread area and step edge lighting system
US5934788A (en) 1997-03-10 1999-08-10 Prescolite-Moldcast Lighting Company Recessed lighting trim structure
US6441943B1 (en) * 1997-04-02 2002-08-27 Gentex Corporation Indicators and illuminators using a semiconductor radiation emitter package
US5850126A (en) 1997-04-11 1998-12-15 Kanbar; Maurice S. Screw-in led lamp
US6292901B1 (en) 1997-08-26 2001-09-18 Color Kinetics Incorporated Power/data protocol
US6211626B1 (en) 1997-08-26 2001-04-03 Color Kinetics, Incorporated Illumination components
US7014336B1 (en) 1999-11-18 2006-03-21 Color Kinetics Incorporated Systems and methods for generating and modulating illumination conditions
GB2329238A (en) 1997-09-12 1999-03-17 Hassan Paddy Abdel Salam LED light source
US6186650B1 (en) * 1997-12-09 2001-02-13 Cooper Automotive Products, Inc. Vehicle headlamp with beamforming waveguide
JPH11208020A (ja) * 1998-01-23 1999-08-03 Canon Inc 露光装置
US6076788A (en) 1998-06-22 2000-06-20 Cooper Industries Reinforced hanger bar
US6278607B1 (en) * 1998-08-06 2001-08-21 Dell Usa, L.P. Smart bi-metallic heat spreader
USD417306S (en) 1998-09-24 1999-11-30 Prescolite-Moldcast Lighting Company Recessed lighting fixture trim
USD417305S (en) 1998-09-24 1999-11-30 Prescolite-Moldcast Lighting Company Recessed lighting fixture trim
USD417307S (en) 1998-09-24 1999-11-30 Prescolite-Moldcast Lighting Company Recessed lighting fixture trim
USD417747S (en) 1998-10-14 1999-12-14 Prescolite-Moldcast Lighting Company Recessed lighting fixture trim
USD417746S (en) 1998-10-14 1999-12-14 Prescolite-Moldcast Lighting Company Recessed lighting fixture trim
DE29921156U1 (de) 1998-12-02 2000-04-20 ERCO Leuchten GmbH, 58507 Lüdenscheid Leuchte nach Art einer Signal- und/oder Orientierungsleuchte
US6095671A (en) 1999-01-07 2000-08-01 Hutain; Barry Actively cooled lighting trim apparatus
USD443949S1 (en) 1999-05-26 2001-06-19 Focal Point, Llc Lighting fixture die-cast corner
USD428516S (en) 1999-05-26 2000-07-18 Focal Point, Llc Lighting fixture quadra-partite dome reflector
USD430339S (en) 1999-05-26 2000-08-29 Focal Point Llc Lighting fixture perforated lamp shield
USD437446S1 (en) 1999-05-26 2001-02-06 Focal Point, Llc Lighting fixture
US6256200B1 (en) * 1999-05-27 2001-07-03 Allen K. Lam Symmetrical package for semiconductor die
US6335538B1 (en) 1999-07-23 2002-01-01 Impulse Dynamics N.V. Electro-optically driven solid state relay system
US6504301B1 (en) 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
US6712486B1 (en) 1999-10-19 2004-03-30 Permlight Products, Inc. Mounting arrangement for light emitting diodes
US6357889B1 (en) 1999-12-01 2002-03-19 General Electric Company Color tunable light source
US6566808B1 (en) 1999-12-22 2003-05-20 General Electric Company Luminescent display and method of making
US6482520B1 (en) * 2000-02-25 2002-11-19 Jing Wen Tzeng Thermal management system
US6428189B1 (en) 2000-03-31 2002-08-06 Relume Corporation L.E.D. thermal management
US6517218B2 (en) 2000-03-31 2003-02-11 Relume Corporation LED integrated heat sink
US6350043B1 (en) 2000-07-21 2002-02-26 Aerospace Lighting Corporation Behind panel mount, directional lighting bracket
US6547416B2 (en) * 2000-12-21 2003-04-15 Koninklijke Philips Electronics N.V. Faceted multi-chip package to provide a beam of uniform white light from multiple monochrome LEDs
US6624350B2 (en) 2001-01-18 2003-09-23 Arise Technologies Corporation Solar power management system
US6684573B2 (en) * 2001-05-04 2004-02-03 Thyssen Elevator Capital Corp. Elevator door sill assembly
US6578986B2 (en) 2001-06-29 2003-06-17 Permlight Products, Inc. Modular mounting arrangement and method for light emitting diodes
US6889943B2 (en) 2001-07-06 2005-05-10 Thomas & Betts International, Inc. Hanger bar assembly
TW567619B (en) * 2001-08-09 2003-12-21 Matsushita Electric Industrial Co Ltd LED lighting apparatus and card-type LED light source
JP2003059313A (ja) * 2001-08-15 2003-02-28 Koito Mfg Co Ltd 車両用灯具
DE60223050T2 (de) * 2001-08-31 2008-07-17 Gentex Corp., Zeeland Fahrzeuglampenanordnung mit kühlkörper
JP4013507B2 (ja) * 2001-09-17 2007-11-28 シーシーエス株式会社 発光パネル装置
US6851834B2 (en) 2001-12-21 2005-02-08 Joseph A. Leysath Light emitting diode lamp having parabolic reflector and diffuser
US6874911B2 (en) 2002-04-09 2005-04-05 Ccs, Inc. Light irradiating unit, lighting unit and method for manufacturing lighting unit
US7093958B2 (en) 2002-04-09 2006-08-22 Osram Sylvania Inc. LED light source assembly
JP4080780B2 (ja) * 2002-04-23 2008-04-23 株式会社小糸製作所 光源ユニット
JP4068387B2 (ja) * 2002-04-23 2008-03-26 株式会社小糸製作所 光源ユニット
JP4360481B2 (ja) * 2002-07-10 2009-11-11 株式会社小糸製作所 車両用灯具
JP4083516B2 (ja) * 2002-09-03 2008-04-30 株式会社小糸製作所 車両用前照灯
JP4024628B2 (ja) * 2002-09-03 2007-12-19 株式会社小糸製作所 車両用前照灯
JP4002159B2 (ja) * 2002-09-03 2007-10-31 株式会社小糸製作所 車両用前照灯
US6787999B2 (en) 2002-10-03 2004-09-07 Gelcore, Llc LED-based modular lamp
AU2003296485A1 (en) * 2002-12-11 2004-06-30 Charles Bolta Light emitting diode (l.e.d.) lighting fixtures with emergency back-up and scotopic enhancement
JP4047185B2 (ja) * 2003-02-06 2008-02-13 株式会社小糸製作所 車両用前照灯及び発光モジュール
WO2004071143A1 (en) 2003-02-07 2004-08-19 Matsushita Electric Industrial Co., Ltd. Socket for led light source and lighting system using the socket
JP4083593B2 (ja) * 2003-02-13 2008-04-30 株式会社小糸製作所 車両用前照灯
JP4037289B2 (ja) * 2003-03-06 2008-01-23 株式会社小糸製作所 車両用前照灯
JP4102240B2 (ja) * 2003-04-08 2008-06-18 株式会社小糸製作所 車両用前照灯
US6964507B2 (en) 2003-04-25 2005-11-15 Everbrite, Llc Sign illumination system
US7178941B2 (en) * 2003-05-05 2007-02-20 Color Kinetics Incorporated Lighting methods and systems
US6864573B2 (en) 2003-05-06 2005-03-08 Daimlerchrysler Corporation Two piece heat sink and device package
US6999318B2 (en) * 2003-07-28 2006-02-14 Honeywell International Inc. Heatsinking electronic devices
DE10341219A1 (de) 2003-09-04 2005-03-31 Erco Leuchten Gmbh Leuchte zur Anbringung an einer Gebäudefläche oder Gebäudeteilfläche
US7329024B2 (en) 2003-09-22 2008-02-12 Permlight Products, Inc. Lighting apparatus
JP2005134858A (ja) * 2003-10-07 2005-05-26 Seiko Epson Corp 光学装置及びリアプロジェクタ
US7102172B2 (en) * 2003-10-09 2006-09-05 Permlight Products, Inc. LED luminaire
DE20315543U1 (de) 2003-10-09 2004-02-12 Peters Design Gmbh LED Einbauleuchtenprofil
JP2005159262A (ja) * 2003-10-30 2005-06-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに照明装置
JP2005144679A (ja) 2003-11-11 2005-06-09 Roland Dg Corp インクジェットプリンタ
US7144135B2 (en) 2003-11-26 2006-12-05 Philips Lumileds Lighting Company, Llc LED lamp heat sink
US7329887B2 (en) 2003-12-02 2008-02-12 3M Innovative Properties Company Solid state light device
DE102004001940B4 (de) 2004-01-14 2006-12-07 Centrotherm Systemtechnik Gmbh Leuchtbaustein und Verfahren zu seiner Herstellung
US20050168986A1 (en) 2004-01-30 2005-08-04 Scott Wegner Reflector assemblies for luminaires
JP4339143B2 (ja) * 2004-02-10 2009-10-07 株式会社小糸製作所 車両用灯具ユニット
US7121688B2 (en) * 2004-03-01 2006-10-17 Rempel Lee W Box light
DE202004003793U1 (de) 2004-03-11 2004-05-13 Hella Kg Hueck & Co. Leuchtdiodenanordnung, insbesondere zum Einbau in Fahrzeuge
US20050247842A1 (en) 2004-05-10 2005-11-10 Grzegorz Wronski Hanger bar assemblies for recessed luminaires
DE102004019137A1 (de) 2004-04-16 2005-11-17 Trilux-Lenze Gmbh + Co Kg Leuchtenfeld
US7210817B2 (en) 2004-04-27 2007-05-01 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Method, system and device for delivering phototherapy to a patient
US20050243556A1 (en) 2004-04-30 2005-11-03 Manuel Lynch Lighting system and method
EP1600691A1 (en) 2004-05-05 2005-11-30 Lumodan ApS Lamps and lamp assemblies
US8188503B2 (en) 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
KR100665298B1 (ko) 2004-06-10 2007-01-04 서울반도체 주식회사 발광장치
WO2006026575A2 (en) * 2004-08-31 2006-03-09 Herman Miller, Inc. Visual shields with technology including led ladder, network connections and concertina effects
US7575354B2 (en) 2004-09-16 2009-08-18 Magna International Inc. Thermal management system for solid state automotive lighting
ITFI20040269A1 (it) 2004-12-23 2005-03-23 Belisario Pini Supporto contenitore orientabile
TWI262342B (en) * 2005-02-18 2006-09-21 Au Optronics Corp Device for fastening lighting unit in backlight module
CN100468795C (zh) 2005-06-03 2009-03-11 新灯源科技有限公司 整合导热/散热模块的半导体发光装置
US6998650B1 (en) * 2005-03-17 2006-02-14 Jiahn-Chang Wu Replaceable light emitting diode module
US7510159B2 (en) 2005-04-28 2009-03-31 Genlyte Thomas Group Llc Hanger bar centering mechanism
US7918591B2 (en) 2005-05-13 2011-04-05 Permlight Products, Inc. LED-based luminaire
ES2855400T3 (es) 2005-05-23 2021-09-23 Signify North America Corp Aparato de iluminación modulares basados en led para el acoplamiento de tomas, accesorios de iluminación que incorporan los mismos y procedimientos de montaje, instalación y extracción de los mismos
US7766518B2 (en) 2005-05-23 2010-08-03 Philips Solid-State Lighting Solutions, Inc. LED-based light-generating modules for socket engagement, and methods of assembling, installing and removing same
US7213940B1 (en) 2005-12-21 2007-05-08 Led Lighting Fixtures, Inc. Lighting device and lighting method
US7648257B2 (en) * 2006-04-21 2010-01-19 Cree, Inc. Light emitting diode packages
US7777166B2 (en) 2006-04-21 2010-08-17 Cree, Inc. Solid state luminaires for general illumination including closed loop feedback control
US7815341B2 (en) 2007-02-14 2010-10-19 Permlight Products, Inc. Strip illumination device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060061539A1 (en) 2004-09-23 2006-03-23 Samsung Electronics Co., Ltd. Light generating device, backlight assembly having the same, and display apparatus having the backlight assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2219066A1 (en) * 2009-02-13 2010-08-18 LG Innotek Co., Ltd. Light emitting module, and light source and display device having the same
CN101922653A (zh) * 2009-02-13 2010-12-22 Lg伊诺特有限公司 发光模块、以及具有该发光模块的光源和显示装置
US8267539B2 (en) 2009-02-13 2012-09-18 Lg Innotek Co., Ltd. Light emitting module, and light source and display device having the same

Also Published As

Publication number Publication date
EP2010819A2 (en) 2009-01-07
EP2010819B1 (en) 2018-03-07
JP2009534851A (ja) 2009-09-24
US7648257B2 (en) 2010-01-19
US20100090606A1 (en) 2010-04-15
US8192056B2 (en) 2012-06-05
WO2007124276A3 (en) 2009-03-05
US20070247847A1 (en) 2007-10-25
EP2010819A4 (en) 2013-09-11

Similar Documents

Publication Publication Date Title
US7648257B2 (en) Light emitting diode packages
US7824070B2 (en) LED lighting fixture
KR101799504B1 (ko) 고체-상태 조명 디바이스
JP5227948B2 (ja) 改良されたヒートシンクを備えた発光ダイオード照明パッケージ
US9441818B2 (en) Uplight with suspended fixture
US9913339B2 (en) Dimmable lighting devices and methods for dimming same
CN102356268B (zh) 具有至少一个半导体发光装置的支架和支架系统
US9661715B2 (en) Solid state light emitting devices including adjustable melatonin suppression effects
KR20140038460A (ko) 평면 패널 조명 장치 및 구동 회로
JP2012181982A (ja) Ｌｅｄ照明器具
US20140268750A1 (en) Lighting fixture with reflector and template pcb
KR20140107902A (ko) 조명 장치
US10612735B2 (en) Lighting device on grid sheet carrier
JP2020502743A (ja) Ｌｅｄベースの照明器具
US10588192B2 (en) Multi-color light fixtures
JP2011049123A (ja) 照明装置
CN203322847U (zh) 发光装置及照明装置
US20060126330A1 (en) Luminous floor with a change of light sources
JP5876599B2 (ja) Ｌｅｄ照明器具
EP3217078A1 (en) Luminaire, lighting system and paneled ceiling arrangement

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 07760470

Country of ref document: EP

Kind code of ref document: A2

WWE Wipo information: entry into national phase

Ref document number: 2007760470

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2009506690

Country of ref document: JP

NENP Non-entry into the national phase

Ref country code: DE