WO2007086293A1 - 情報記録媒体およびその製造方法 - Google Patents
情報記録媒体およびその製造方法 Download PDFInfo
- Publication number
- WO2007086293A1 WO2007086293A1 PCT/JP2007/050632 JP2007050632W WO2007086293A1 WO 2007086293 A1 WO2007086293 A1 WO 2007086293A1 JP 2007050632 W JP2007050632 W JP 2007050632W WO 2007086293 A1 WO2007086293 A1 WO 2007086293A1
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- WO
- WIPO (PCT)
- Prior art keywords
- film
- recording medium
- recording
- metal film
- oxide
- Prior art date
Links
- 238000000034 method Methods 0.000 title description 44
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000000463 material Substances 0.000 claims abstract description 37
- 239000010936 titanium Substances 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 14
- 229910008484 TiSi Inorganic materials 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 4
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 238000005336 cracking Methods 0.000 abstract description 5
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 abstract 2
- QDOXWKRWXJOMAK-UHFFFAOYSA-N dichromium trioxide Chemical compound O=[Cr]O[Cr]=O QDOXWKRWXJOMAK-UHFFFAOYSA-N 0.000 abstract 2
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 description 116
- 239000002184 metal Substances 0.000 description 116
- 239000007789 gas Substances 0.000 description 57
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- 239000000654 additive Substances 0.000 description 12
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- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 10
- 229910052760 oxygen Inorganic materials 0.000 description 10
- 239000001301 oxygen Substances 0.000 description 10
- 230000035945 sensitivity Effects 0.000 description 10
- 230000015572 biosynthetic process Effects 0.000 description 9
- 238000005137 deposition process Methods 0.000 description 9
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 7
- 238000004544 sputter deposition Methods 0.000 description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 6
- 150000004767 nitrides Chemical class 0.000 description 6
- 239000011651 chromium Substances 0.000 description 5
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- 239000011701 zinc Substances 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
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- 238000011156 evaluation Methods 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 229910052717 sulfur Inorganic materials 0.000 description 4
- 229910052723 transition metal Inorganic materials 0.000 description 4
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- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 3
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- 229910052787 antimony Inorganic materials 0.000 description 3
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
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- 230000001678 irradiating effect Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
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- 238000007580 dry-mixing Methods 0.000 description 2
- 238000007730 finishing process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 239000011812 mixed powder Substances 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000010955 niobium Substances 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000012782 phase change material Substances 0.000 description 2
- 230000001699 photocatalysis Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
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- 229910052697 platinum Inorganic materials 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
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- 229920005672 polyolefin resin Polymers 0.000 description 2
- 238000002310 reflectometry Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
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- 239000004332 silver Substances 0.000 description 2
- 238000005477 sputtering target Methods 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- -1 transition metal nitride Chemical class 0.000 description 2
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 229910052692 Dysprosium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 229910052771 Terbium Inorganic materials 0.000 description 1
- 229910008482 TiSiN Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 230000003292 diminished effect Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- KBQHZAAAGSGFKK-UHFFFAOYSA-N dysprosium atom Chemical compound [Dy] KBQHZAAAGSGFKK-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UIWYJDYFSGRHKR-UHFFFAOYSA-N gadolinium atom Chemical compound [Gd] UIWYJDYFSGRHKR-UHFFFAOYSA-N 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- QRXWMOHMRWLFEY-UHFFFAOYSA-N isoniazide Chemical compound NNC(=O)C1=CC=NC=C1 QRXWMOHMRWLFEY-UHFFFAOYSA-N 0.000 description 1
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- 229910052749 magnesium Inorganic materials 0.000 description 1
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- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
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- 229910052711 selenium Inorganic materials 0.000 description 1
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- 239000002356 single layer Substances 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
- G11B7/257—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of layers having properties involved in recording or reproduction, e.g. optical interference layers or sensitising layers or dielectric layers, which are protecting the recording layers
- G11B2007/25705—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of layers having properties involved in recording or reproduction, e.g. optical interference layers or sensitising layers or dielectric layers, which are protecting the recording layers consisting essentially of inorganic materials
- G11B2007/2571—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of layers having properties involved in recording or reproduction, e.g. optical interference layers or sensitising layers or dielectric layers, which are protecting the recording layers consisting essentially of inorganic materials containing group 14 elements except carbon (Si, Ge, Sn, Pb)
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
- G11B7/257—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of layers having properties involved in recording or reproduction, e.g. optical interference layers or sensitising layers or dielectric layers, which are protecting the recording layers
- G11B2007/25705—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of layers having properties involved in recording or reproduction, e.g. optical interference layers or sensitising layers or dielectric layers, which are protecting the recording layers consisting essentially of inorganic materials
- G11B2007/25715—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of layers having properties involved in recording or reproduction, e.g. optical interference layers or sensitising layers or dielectric layers, which are protecting the recording layers consisting essentially of inorganic materials containing oxygen
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
- G11B7/241—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material
- G11B7/252—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers
- G11B7/253—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates
- G11B7/2533—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates comprising resins
- G11B7/2534—Record carriers characterised by shape, structure or physical properties, or by the selection of the material characterised by the selection of the material of layers other than recording layers of substrates comprising resins polycarbonates [PC]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Definitions
- the present invention relates to an information recording medium and a manufacturing method thereof. Specifically, the present invention relates to an information recording medium capable of recording an information message by irradiating light. ⁇ Background technology
- Write-once optical recording media do not require repeated recording characteristics, but they must be erased (cannot be tampered with), have high durability, and are inexpensive.
- a material that changes at least one of the refractive index and the absorption coefficient by heat is used for the recording film of the write-once type optical recording medium.
- the recording film may undergo volume expansion after recording or substrate deformation, which may substantially change the film thickness and contribute to the reproduction signal. It is widely known that such volume changes and substrate deformations are particularly prominent when organic dyes are used as recording materials. However, even with inorganic materials, such volume changes exist to a greater or lesser extent.
- a metal film or a dielectric film is provided on both sides or one of the interfaces.
- the Zn S—Si 2 dielectric film widely used as a protective film for phase change materials is not only a protective film but also an ideal material that realizes good recording characteristics. is there. This material has low thermal conductivity, and it is possible to increase the recording sensitivity.
- the adhesiveness to the recording film is good, and in the case of a phase change material, the rewriting characteristics are good.
- the refractive index is high, it is easy to optimize the optical characteristics, and it is possible to adjust the reflectance and the modulation degree to appropriate values.
- the Z n S- S I_ ⁇ 2 is also characterized because internal stress is small cracks, cracking hardly Ji live.
- the film thickness often changes greatly before and after recording, and the protective film is cracked after recording. Serious problems may occur.
- Z n S—S i 0 2 is a material that is unlikely to cause such problems.
- Z n S—S i 0 2 is a very good dielectric film even in a write-once type optical recording medium.
- the S (sulfur) component is liberated and diffuses and reacts with the adjacent layers, causing deterioration.
- it has a light transmission layer on the recording film, such as BD-R (Blu-ray Disc-Recordable (registered trademark)), and uses a pressure sensitive adhesive (PSA) for the light transmission layer.
- PSA pressure sensitive adhesive
- an object of the present invention is to provide an information recording medium that can obtain high durability even when a material that causes large volume expansion is used as a recording film, and a method for manufacturing the information recording medium.
- a first invention is an information recording medium in which a recording film and a dielectric film are provided on a substrate,
- the recording film consists of a recording material that undergoes volume expansion when irradiated with light energy
- Dielectric film an information recording medium characterized by comprising a Z R_ ⁇ 2 and C r 2 ⁇ 3.
- a second invention is a method of manufacturing an information recording medium in which a recording film and a dielectric film are provided on a substrate.
- a method of manufacturing an information recording medium comprising: forming a dielectric film composed of Z r 0 2 and C r 2 0 3 ;
- the content of Cr 2 0 3 in the dielectric film is preferably not less than 40 atomic% and not more than 90 atomic%. It is preferable that the dielectric film further contains S i O 2 .
- the thickness of the dielectric film is preferably 2 nm or more and 20 nm or less. Between the dielectric film made of the recording layer and S I_ ⁇ 2, further it is preferred to provide a Z n S- S i 0 2 made of a dielectric film arbitrariness.
- the recording film preferably has an oxide film made of an oxide of Ge.
- the recording film is adjacent to the oxide film. It is preferable that the film further comprises an adjacent film, and the adjacent film is made of Ti or TiSi.
- the dielectric film is made of Z R_ ⁇ 2 and C r 2 ⁇ 3, even if the recording film caused the volume expansion by irradiation with light energy, cracking in the dielectric film Can be prevented. Therefore, it is possible to suppress moisture from entering the recording film.
- FIG. 1 is a schematic sectional view showing an example of the structure of a write-once optical recording medium according to the first embodiment of the present invention
- FIG. 2 is according to the second embodiment of the present invention
- FIG. 3 is a schematic sectional view showing a configuration example of a write-once optical recording medium
- FIG. 3 is a schematic sectional view showing a configuration example of a write-once optical recording medium according to the third embodiment of the present invention
- FIG. FIG. 5 is a graph showing the error rate before and after the acceleration test of the write once optical recording medium of Example 1, and FIG.
- FIG. 1 is a schematic sectional view showing an example of the structure of a write-once optical recording medium according to the first embodiment of the present invention.
- This recordable optical recording medium 10 has a configuration in which an inorganic recording film 6, a dielectric film 4, and a light transmission layer 5 are sequentially laminated on a substrate 1.
- an inorganic recording film 6 including an oxide film made of germanium (G e) oxide is used as a recording film that undergoes volume expansion upon irradiation with laser light will be described.
- recording or reproduction of information signals is performed by irradiating the inorganic recording film 6 with laser light from the light transmission layer 5 side.
- a laser beam having a wavelength in the range of 400 nm to 410 nm is condensed by an objective lens having a numerical aperture in the range of 0.84 to 0.86, and the light transmission layer
- information signals are recorded or reproduced.
- An example of such a recordable optical recording medium 10 is BD-R (Blu-ray Disc-Recordable).
- the substrate 1, the inorganic recording film 6, the dielectric film 4, and the light transmission layer 5 constituting the write-once type optical recording medium 10 will be sequentially described.
- the substrate 1 has an annular shape with an opening (hereinafter referred to as a center hole) formed in the center.
- One main surface of the substrate 1 is an uneven surface 11 1, and an inorganic recording film 6 is formed on the uneven surface 11.
- the concave portion of the uneven surface 11 is referred to as in-group 11 G, and the convex portion of the uneven surface 11 is referred to as on-group 11 L.
- Examples of the shape of the in-group 1 1 G and the on-group 1 1 L include various shapes such as a spiral shape and a concentric shape. Also, in-group 1 1 G and / or on-roll 1 1 L are wobbled to add address information.
- the amplitude of this wobble Is preferably in the range of 9 nm to 13 nm.
- the track pitch is preferably in the range of 0.29 m or more and 0.35 m or less, and the group depth is in the range of 18 nm or more and 21.5 nm or less. preferable.
- R ON is the return light amount of the blu-ray evaluation device when tracking is applied to the on-group 1 1 L
- the return light amount R ⁇ N of the Blu-ray evaluation device is when tracking is applied to the in-group 1 1 G. It is preferable to satisfy the relationship — 0. 0 1 ⁇ 2 (R ON -R IN ) / (R ON + R IN ) !
- the diameter of substrate 1 is chosen to be 120 mm, for example.
- the thickness of the substrate 1 is selected in consideration of rigidity, preferably selected from 0.3 mm to 1.3 mm, more preferably selected from 0.6 mm to 1.3 mm, for example, 1 Selected as 1mm.
- the center hole diameter is selected to be 15 mm, for example.
- a plastic material such as a polycarbonate resin, a polyolefin resin or an acrylic resin, or glass can be used. In consideration of cost, it is preferable to use a plastic material as the material of the substrate 1.
- the inorganic recording film 6 includes a metal film 2 and an oxide film 3 that are sequentially stacked on the uneven surface 11 of the substrate 1.
- the metal film 2 is an adjacent film provided adjacent to the oxide film 3 and is substantially composed of titanium (T i). If T i is the main material, basically good recording characteristics can be obtained.
- an additive may be added to the metal film 2 for the purpose of improving optical characteristics, durability, and recording sensitivity.
- additives include aluminum (A 1), silver (A g), copper (C u), and palladium.
- P d Germanium (G e)., Ge (S i), Tin (S n), Nickel (N i), Iron (F e), Magnesium (Mg), Vanadium (V), Carbon ( C), calcium (C a), boron (B), chromium (C r), niobium (Nb), zirconium (Z r), sulfur (S), selenium (S e), manganese (Mn), gallium (G a), molybdenum (Mo), tungsten (W), terbium (Tb), dysprosium (Dy), gadolinium (Gd), neodymium (N d), zinc ( ⁇ ⁇ ), tantalum (T a) and strontium (S r 1) or more selected from the group
- the composition ratio of Si is preferably in the range of 8 atomic% to 32 atomic%. If it is less than 8 atomic%, a good jitter value cannot be obtained, and if it exceeds 32 atomic%, good recording sensitivity cannot be obtained.
- the material constituting the metal film 2 may be oxidized, and examples of such an oxide include TiSiO. This oxidation can improve jitter.
- the material constituting the metal film 2 may be nitrided, and examples of such a nitride include TiSiN. By nitriding in this way, the margin of power can be increased.
- the nitrogen composition of the metal film 2 is preferably in the range of 1 atomic% to 20 atomic%. If it is less than 1 atomic percent, the effect of improving the power margin will be diminished, and if it exceeds 20 atomic percent, the jitter will deteriorate.
- the oxide film 3 is composed of GeO which is substantially an oxide of germanium (Ge).
- the absorption coefficient k of the oxide film 3 is preferably 0.15 to 0.90, more preferably 0.20 to 0.70, and even more preferably. It is preferably in the range of 0.25 to 0.60.
- the thickness of the oxide film 3 is preferably in the range of 10 nm to 35 nm.
- the absorption coefficient in this specification is at a wavelength of 4 10 nm.
- the measured value was measured by an ellipsometer (trade name: Auto EL-462P17, manufactured by Rudolf). .
- an additive may be added to the oxide film 3.
- the additive include tellurium (T e), chromium (C r), palladium (P d), platinum (P t). , Copper (Cu), zinc (Zn), gold (Au), silver (Ag), silicon (S i), titanium (T i), iron (F e), nickel (N i), sud ( One or more selected from the group consisting of Sn) and antimony (Sb) can be used.
- Te tellurium
- C r chromium
- P d palladium
- platinum P t
- Si platinum
- S b antimony
- C r chromium
- the composition of Sb in the oxide film 3 is preferably in the range of 1 atomic% to 6 atomic%. This is because the power margin can be improved by setting this range.
- the dielectric film 4 is a first dielectric film 4 a laminated on the inorganic recording film 6 in sequence. And the second dielectric film 4b.
- the first dielectric film 4a and the second dielectric film 4b are used to improve optical and mechanical protection of the inorganic recording film 6, that is, to improve durability, and to deform the inorganic recording film 6 during recording, that is, bulge. It is intended to prevent such problems.
- the first dielectric film 4 a is formed of, for example, from Z n S- S i 0 2.
- the thickness of the first dielectric film 4a is preferably in the range of 10 nm to 58 nm, more preferably 23 nm to 53 nm.
- the film thickness 10 nm or more good jitter can be obtained, and by making the film thickness 58 8 nm or less, good reflectance can be obtained.
- the write-once optical recording medium 10 is BD-R
- the jitter of BD-R which is 6.5% or less, may be satisfied.
- the film thickness is 58 nm or less, the reflectance of 12% or less required by the BD-R standard can be satisfied. Further, when the film thickness is 23 nm or more, better jitter can be obtained, and when the film thickness is 53 ⁇ m or less, better reflectivity can be obtained.
- the second dielectric film 4 b is made of, for example, Z r 0 2 and C r 2 0 3 .
- the content of C r 2 0 3 is preferably in the range of 40 atomic% to 90 atomic%. If it is less than 40 atomic%, the durability is lowered, and if it exceeds 90 atomic%, the durability is lowered and the initial recording characteristics are also lowered.
- the second dielectric film 4 b is preferably further contains the S I_ ⁇ 2. By containing S I_ ⁇ 2, the recording sensitivity, the power margin Contact and write strategy one possible to adjust the time it was recorded characteristics.
- the film thickness of the second dielectric film 4b is preferably in the range of 2 nm to 20 nm. If the thickness is less than 2 nm, the uniformity of the second dielectric film 4b is lowered, and if it exceeds 20 nm, the film formation time becomes longer and the productivity is lowered. (Light transmission layer)
- the light transmissive layer 5 includes, for example, a light transmissive sheet (film) having an annular shape and an adhesive layer for bonding the light transmissive sheet to the substrate 1.
- the adhesive layer is made of, for example, an ultraviolet curable resin or a pressure sensitive adhesive (PSA).
- PSD pressure sensitive adhesive
- the thickness of the light transmission layer 5 is preferably selected from a range of 10 m or more and 177 m or less, for example, 100 m. By combining such a thin light transmission layer 5 with an objective lens having a high NA (numerical aperture) of about 0.85, for example, high density recording can be realized.
- the light-transmitting sheet is preferably made of a material that has a low absorptivity for laser light used for recording and Z or reproduction, specifically, a material having a transmittance of 90% or more. It is preferable.
- the material of the light transmissive sheet include polycarbonate resin materials and polyolefin resins (for example, ZEONEX (registered trademark)).
- the thickness of the light transmissive sheet is preferably selected to be 0.3 mm or less, more preferably from 3 m to 177 m.
- the inner diameter (diameter) of the light transmission layer 5 is selected to be 22.7 mm, for example. ,
- a substrate 1 having an uneven surface 11 formed on one main surface is formed.
- a method for molding the substrate for example, an injection molding (injection) method, a photopolymer method (2P method: Photo Polymerization), or the like can be used.
- the substrate 1 is transferred into a vacuum chamber provided with a target made of Ti nitride, for example, and is evacuated to a predetermined pressure in the vacuum chamber. Thereafter, while introducing a process gas into the vacuum chamber, the target is sputtered to form a metal film 2 on the substrate 1.
- a process gas for example, introducing a process gas into the vacuum chamber.
- Atmosphere 0.1-0.6 Pa
- the substrate 1 is transferred into a vacuum chamber provided with a target made of, for example, Ge oxide, and evacuated in the vacuum chamber to a predetermined pressure. Thereafter, an oxide film 3 is formed on the substrate 1 by sputtering the dopant while introducing a process gas into the vacuum chamber.
- Atmosphere 0.1-0.6 Pa
- the substrate 1 is transferred into a vacuum chamber provided with a evening get made of, for example, Zn S—S i 0 2 and evacuated until a predetermined pressure is reached in the vacuum chamber. Thereafter, the target gas is sputtered while introducing the process gas into the vacuum chamber, and the first dielectric film 4 a is formed on the substrate 1. Is deposited.
- Atmosphere 0.1-0.6 Pa
- substrate 1 is transferred into a vacuum chamber equipped with an evening get consisting of, for example, S iO 2 — C r 2 0 3 — Z r 0 2 , and a predetermined pressure is reached in the vacuum chamber Vacuum until Thereafter, the target is sputtered while introducing the process gas into the vacuum chamber, and the second dielectric film 4 b is formed on the substrate 1.
- an annular light-transmitting sheet is applied to the uneven surface 11 side of the substrate 1 using, for example, a pressure-sensitive adhesive (PSA) that is uniformly applied to one main surface of the sheet in advance. to paste together.
- PSA pressure-sensitive adhesive
- the light transmission layer 5 is formed so as to cover the film laminated on the substrate 1.
- the write-once type optical recording medium 10 shown in FIG. 1 is obtained by the above process.
- (11-3) Target configuration The configuration of the evening get according to the first embodiment of the present invention will be described below. First, the structure of the target for forming the oxide film 3 will be described.
- a target for forming the oxide film 3 is obtained by pressure firing of a mixture of a Ge powder that is a semiconductor powder and a Ge oxide powder that is a semiconductor oxide powder.
- This target has a disk shape, for example, its diameter is chosen for example 200 mm and the thickness is chosen for example 6 mm.
- the oxygen content after the pressure firing is preferably in the range of 45 atomic% to 60 atomic%. 4 If it is less than 5 atomic%, the absorption coefficient k exceeds 0.9 ', so the recording characteristics and the like deteriorate. On the other hand, if it exceeds 60 atomic%, the absorption coefficient will be less than 0.15, so that the recording characteristics will deteriorate.
- the target for forming the metal film 2 is obtained by pressure firing of a mixture of a Ti metal powder that is a transition metal powder and a Ti nitride powder that is a transition metal nitride powder.
- This target has, for example, a disk shape, its diameter is chosen for example 20 O mm and its thickness is chosen for example 6 mm.
- the nitrogen content after the pressure firing is preferably in the range of 1 atomic% to 20 atomic%, and more preferably in the range of 1 atomic% to 10 atomic%.
- the margin of power can be increased and the increase in jitter can be suppressed.
- the power margin can be increased and the rise in jitter can be further suppressed.
- a predetermined amount of each of the Ge powder that is a semiconductor powder and the Ge oxide powder that is a semiconductor oxide powder is weighed, and then, for example, a dry mixing method is performed.
- the mixing ratio with the G e powder G e oxide powder is preferably adjusted so that the oxygen content after pressure firing is not less than 45 atomic% and not more than 60 atomic%.
- the mixed powder obtained as described above is put into a carbon mold and, for example, subjected to pressure firing with a hot press apparatus to obtain a fired body.
- a hot press apparatus may be generally used, and using this apparatus, firing is performed for a predetermined time in a non-oxygen atmosphere at a constant pressure and a constant firing temperature.
- the fired body obtained as described above is machined so as to have a disk shape of a predetermined size. As described above, the target can be obtained. Next, a method for manufacturing a target for forming the metal film 2 will be described.
- the mixing ratio of the Ti powder and the Ti nitride powder is preferably adjusted so that the nitrogen content after pressure firing is in the range of 1 atomic% to 20 atomic%, It is more preferable to adjust so that it is in the range of 5 atomic% to 15 atomic%. (Pressurized firing)
- the mixed powder obtained as described above is put into a carbon mold and subjected to pressure firing, for example, using a hot press apparatus.
- a hot press apparatus may be generally used, and by using this apparatus, firing is performed for a predetermined time in a non-oxygen atmosphere at a constant pressure and a constant firing temperature.
- the fired body obtained as described above is machined so as to have a disk shape of a predetermined size. As a result, the target can be obtained.
- the write-once type optical recording medium 10 can be manufactured simply by sequentially laminating the metal film 2, the oxide film 3, the dielectric film 4, and the light transmission layer 5 on the substrate 1. Therefore, a high recording density write-once optical recording medium 10 having a simple film configuration can be provided. That is, an inexpensive write-once optical recording medium with a small total number of films can be provided.
- the inorganic recording film 6 includes the oxide film 3 made of an oxide of Ge and the metal film 2 adjacent to the oxide film 3, when the inorganic recording film 6 is irradiated with laser light, the metal film Due to the photocatalytic effect of the film 2, the oxide film 3 is separated so that the oxygen in the metal film 2 increases.
- the oxide film 3 is separated into a layer having a high oxygen concentration and a layer having a low oxygen concentration, and the optical constant of the oxide film 3 is greatly changed. Therefore, a reproduction signal having a large modulation degree can be obtained, so that good recording characteristics can be realized.
- the second dielectric film 4 b made of S i 0 2 — C r 2 0 3 — Z r 0 2 is replaced with the first dielectric layer 5 made of light transmitting layer 5 having PSA and Zn S—S 1 0 2 .
- the dielectric film 4 by providing between a, can suppress the deterioration of the anti-Ide PSA adjacent the Z n S- S I_ ⁇ 2 and PSA. Therefore, large aberration in the light spot This can prevent the playback signal from deteriorating.
- S I_ ⁇ 2 - C r 2 0 3 - Z R_ ⁇ a second dielectric film 4 b made of 2, 'S I_ ⁇ 2 - C r 2 ⁇ 3 - compared to Z r 0 2
- the dielectric film 4 is composed of two layers of Z n S— ⁇ S i ⁇ 2 with the fastest speed, the dielectric film 4 is composed of only S i 0 2 — C r 2 0 3 — Z r 0 2
- the tact time can be reduced as compared with the case where the system is configured. That is, productivity can be improved.
- the oxide film 3 is formed by sputtering a target made of Ge oxide, the oxide film 3 having a constant oxygen concentration, that is, a constant absorption coefficient can be formed during mass production. .
- the metal film 2 is formed by sputtering a target made of Ti nitride, it is not necessary to perform a difficult operation of controlling a small amount of nitrogen gas at a constant level. Therefore, the metal film 2 can be stably formed during mass production.
- FIG. 2 is a schematic cross-sectional view showing an example of the structure of a write-once optical recording medium according to the second embodiment of the present invention.
- This recordable optical recording medium 10 has a configuration in which an inorganic recording film 6, a dielectric film 4, and a light transmission layer 5 are sequentially laminated on a substrate 1.
- the inorganic recording film 6 has a configuration in which a metal film 2 and an oxide film 3 are sequentially laminated on a substrate 1. Since the parts other than the oxide film 3 are the same as those in the first embodiment, the description of the parts other than the oxide film 3 is omitted.
- the oxide film 3 includes a first oxide film 3a and a second oxide film 3b.
- the first oxide film 3a is provided on the side adjacent to the metal film 2, and the second oxide film 3a
- An oxide film 3 b is provided on the side adjacent to the dielectric film 4.
- the first oxide film 3a and the second oxide film 3b are made of an oxide of Ge, and the oxygen compositions of the first oxide film 3a and the second oxide film 3b are different from each other. That is, the absorption coefficients of the first oxide film 3a and the second oxide film 3b are different from each other.
- the absorption coefficient k kk 2 satisfies the relationship k> k 2 .
- a substrate 1 provided with a metal film 2 is transported into a vacuum chamber equipped with a Ge oxide evening get, and the inside of the vacuum chamber is brought to a predetermined pressure. Apply vacuum until Thereafter, a target is sputtered while introducing Ar gas, for example, into the vacuum chamber, and a first oxide film 3 a made of, for example, Ge oxide is formed on the metal film 2.
- the substrate 1 is transferred into a vacuum chamber provided with a target made of, for example, Ge oxide, and the vacuum chamber is evacuated to a predetermined pressure.
- Ar gas is introduced into the vacuum chamber while sputtering the sputtering target to form a second oxide film 3b made of, for example, Ge oxide on the first oxide film 3a.
- Film. -An example of film forming conditions in this film forming process is shown below.
- Atmosphere 0.1-0.6 Pa
- the first oxide film 3 a made of an oxide of Ge and the first oxide film 3 a have different oxygen composition ratios. Since the oxide film 3 is composed of the second oxide film 3b made of the above oxide, the absorption coefficient of the first oxide film 3a is different from that of the second oxide film 3b. Can be made. This increases the power margin.
- FIG. 3 is a schematic cross-sectional view showing an example of the structure of a write-once optical recording medium according to the third embodiment of the present invention.
- This recordable optical recording medium 10 has a configuration in which an inorganic recording film 6, a dielectric film 4, and a light transmission layer 5 are sequentially laminated on a substrate 1.
- the inorganic recording film 6 has a configuration in which a metal film 2 and an oxide film 3 are sequentially laminated on a substrate 1. Since the parts other than the metal film 2 are the same as those in the first embodiment, the description of the parts other than the metal film 2 is omitted.
- the metal film 2 is composed of a first metal film 2a and a second metal film 2b, the first metal film 2a is provided on the substrate 1 side, and the second metal film 2b is an oxide. Provided on the membrane 3 side.
- the first metal film 2a is made of, for example, T i and S i.
- the second metal film 2b is made of Ti, for example.
- an additive may be further added to the first metal film 2a and Z or the second metal film 2b.
- the same additive as in the first embodiment described above can be used.
- the material forming the first metal film 2a and Z or the second metal film 2b may be oxidized. This oxidation can improve the jitter.
- the materials constituting the first metal film 2a and the second metal film 2b may be nitrided. By nitriding in this way, the power margin can be expanded.
- the thickness of the first metal film 2a is preferably in the range of 2 nm or more and 10 nm or less. If the film thickness is less than 2 nm, the effect of providing the first metal film 2a is reduced, and the power margin and the combination of the metal film 2 formed of a single layer of the second metal film 2b alone are reduced. Because they will be almost the same.
- the composition of Si in the first metal film 2 a is 8 atomic% or more and 3 2 atomic% or less. It is preferable to be within the lower range. This is because if it is less than 8 atomic%, a good jitter value cannot be obtained, and if it exceeds 32 atomic%, good recording sensitivity cannot be obtained.
- the substrate 1 is transported into a vacuum chamber equipped with a target made of TiSi, and the vacuum chamber is evacuated to a predetermined pressure. ! Then, while introducing example A r gas into the vacuum chamber, the sputtering target, for example, forming a T i S i first metal film 2 a made of on the base plate 1.
- Atmosphere 0.1-0.6 Pa
- Input power 1 to 3 kW (D C)-Gas type: Ar gas
- the substrate 1 is transferred into a vacuum chamber provided with an evening get made of Ti, and the inside of the vacuum chamber is evacuated to a predetermined pressure. Thereafter, the target is sputtered while introducing Ar gas, for example, into the vacuum chamber, and a second metal film 2 b made of Ti, for example, is formed on the substrate 1.
- Atmosphere 0.1 to 0.6 Pa
- Input power 1 to 3 kW (DC)
- the metal film 2 is composed of the first metal film 2a made of TiSi and the second metal film 2b made of Ti, and the second Since the metal film 2b is provided on the oxide film 3 side, the power margin can be widened.
- the write once optical recording medium 10 according to the fourth embodiment is the same as the third embodiment except for the first metal film 2a and the second metal film 2b. Description of portions other than the first metal film 2a and the second metal film 2b is omitted.
- the metal film 2 includes a first metal film 2 a made of A 1 and a second metal film 2 b made of Ti Si, so that the second metal film 2 b is adjacent to the oxide film. Provided.
- the film thickness of the first metal film 2a is preferably 7 nm or less.
- the first metal film 2a and Z or the second metal film 2b may further contain an additive. Examples of the additive include the same as in the first embodiment described above. Can be used. Further, the first metal film 2a and / or the second metal film 2b may be nitrided and / or oxidized.
- the substrate 1 is transferred into a vacuum chamber equipped with a target made of A1, and the vacuum chamber is evacuated to a predetermined pressure. Then, while introducing the process gas into the vacuum chamber, The first metal film 2 a is formed on the substrate 1 by sputtering.
- Atmosphere 0.1-0.6 Pa
- the base plate 1 is transferred into a vacuum chamber equipped with a target made of T i S i, and the vacuum chamber is evacuated to a predetermined pressure. After that, while introducing the process gas into the vacuum chamber, the target is sputtered to form the second metal film 2 b on the substrate 1.
- Atmosphere 0.1-0.6 Pa-Input power: 1-3 kW (DC)
- the metal film 2 is composed of the first metal film made of A 1 and the second metal film 2 b made of Ti Si, and the second metal film Since 2b is provided on the oxide film 3 side, the recording sensitivity can be improved.
- the write-once type optical recording medium 10 according to the fifth embodiment is the same as the third embodiment except for the first metal film 2a and the second metal film 2b. Other than the metal film 2a and the second metal film 2b Will not be described.
- the first metal film 2a and the second metal film 2b are made of TiSi.
- composition of the metal film 2a and the second metal film 2b of T is the composition of the metal film 2a and the second metal film 2b of T
- T i S i x, T i S i y is preferably a Mitasuko the relation x ⁇ y.
- first metal film 2a and Z or the second metal film 2b may further contain an additive.
- the additive may be the same as that in the first embodiment described above. Things can be used. Also the first gold
- the metal film 2 a and / or the second metal film 2 b may be nitrided and / or oxidized.
- the substrate 1 is transported into a vacuum chamber provided with an evening get made of TiSi, and the vacuum chamber is evacuated until a predetermined pressure is reached. After that, while introducing the process gas into the vacuum chamber, the target is sputtered to form the first metal film 2 a on the substrate 1.
- Atmosphere 0.1-0.6 Pa
- the substrate 1 is transferred into a vacuum chamber equipped with an evening gate made of TiSi, for example, and the vacuum chamber is evacuated to a predetermined pressure. To do. After that, while introducing a process gas into the vacuum chamber, the second gate film 2 b is formed on the substrate 1 by sputtering the evening gate. Note that, in the film formation step of the second metal film 2b, a target having a composition different from that of the target used in the film formation step of the first metal film 2a is used. Further, the target used in the film forming process of the second metal film 2b has a higher Si content than that used in the film forming process of the first metal film 2a.
- the composition of the evening get for forming the first metal film 2 a and the second metal film 2 b is expressed as T i S ix and T i S iy, respectively, 'T i S ix, T i S iy satisfies the relationship x ⁇ y.
- Atmosphere 0.1-0.6 Pa
- the metal film 2 is replaced with the first metal film 2 a made of TiSi and the first metal film 2.
- the second metal film 2 b is composed of T i S i having a composition different from that of b, and the Si content of the first metal film 2 a is changed to the Si content of the second metal film. Therefore, the recording sensitivity can be improved. This ensures a wide margin on the high power side and widens the OPC (Optimum Power Control, drive recording range optimization) range. Furthermore, it is easy to handle high linear velocity recording and high capacity multilayer media with two or more layers.
- Comparative Example 1 the case where Si N, which has a problem in durability, is used as the second dielectric film (protective film) will be described.
- a substrate having an in-group and an on-group on one main surface was formed by injection molding.
- This substrate is a ⁇ D substrate with a thickness of 1. lmm, a track pitch of 0.32 m, and a group depth of 20 nm.
- a metal film, an oxide film, a first dielectric film, and a second dielectric film were sequentially formed on the substrate by sputtering.
- Sprint registered trademark manufactured by Unax i ⁇ s was used.
- an annular polycarbonate sheet is laminated on the substrate 1 with a pressure-sensitive adhesive (PSA) pre-applied to the main surface of the sheet, and the thickness is 0.1 mm.
- PSA pressure-sensitive adhesive
- a light transmissive layer was formed. This light transmission layer is compliant with the BD standard, and the light transmission layer side serves as an incident surface for recording / reproducing light. Thus, the intended write-once type optical recording medium was obtained.
- Example 1 Next, as the second dielectric film, (S i 0 2 ) 15 (C r 2 0 3 ) 7 .
- a write-once type optical recording medium was obtained in the same manner as in Comparative Example 1 except that (Z r 0 2 ) 15 was used. Then, in the same manner as in Comparative Example 1, (a) to (e) were evaluated.
- the initial recording characteristics were almost the same as Comparative Example 1 or better. That is, the reflectivity, recording sensitivity, and bottom jitter were almost the same as in Comparative Example 1, and the recording power margin was slightly wider in Example 1 than in Comparative Example 1, and a slight improvement was observed in terms of recording characteristics. From the results of the accelerated test, as shown in Fig. 5, the deterioration of SER was almost completely improved.
- a write-once optical recording medium was obtained in the same manner as in Comparative Example 1 except that the material shown in Table 1 was used as the material for the second dielectric film. Then, in the same manner as in Comparative Example 1, (a) to (e) were evaluated.
- Comparative Example 1 0 As shown in Table 1, a write-once type optical recording medium was obtained in the same manner as in Comparative Example 1 except that the formation of the second dielectric film was omitted. In the same manner as in Comparative Example 1, (a) to (e) were evaluated.
- Table 1 shows Examples 1 to 8 and Comparative Examples 1 to 10 (a) S ER immediately after recording, (b) 'S ER after accelerated test by thermostat, (c) Judgment of durability,
- SER is the average value of all data when the symbolic rate is measured from the inner circumference to the outer circumference.
- Table 1 shows the following.
- the recording characteristics are affected even though it is not in direct contact with the metal film or oxide film. It can be seen that it is greatly related to durability. This is thought to be related to mechanical properties such as the hardness of the second dielectric film. Since the film thickness of the recording film changes greatly after recording, the recording characteristics particularly on the high power side are affected.
- the second dielectric film containing C r 2 0 3 and Z r 0 2 exhibits good characteristics, particularly when the Cr 2 0 3 composition is 40 atomic percent or more and 90 atomic percent or less. ⁇ Excellent durability improvement effect. This is an inherent feature when using a recording film with such a large volume expansion, and presents a range in which good characteristics can be obtained as a protective film.
- the present invention is applied to the write-once type optical recording medium 10 having the inorganic recording film 6 made of an inorganic material has been described. It can also be applied to a write once optical recording medium.
- the oxide film 3 is composed of one or two oxide films.
- the oxide film 3 is composed of three or more layers. May be.
- the metal film 2 is composed of one or two layers of metal films has been described.
- the metal film 2 may be composed of three or more layers. .
- the metal film 2 is composed of Ti.
- the metal film 2 is composed of a metal material that exhibits a photocatalytic effect other than Ti. It is considered that a write-once optical recording medium capable of recording an information signal can be obtained in the same manner as in the embodiments and examples.
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- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Optical Record Carriers And Manufacture Thereof (AREA)
- Manufacturing Optical Record Carriers (AREA)
- Thermal Transfer Or Thermal Recording In General (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/910,426 US20090130461A1 (en) | 2006-01-30 | 2007-01-11 | Information recording medium and its manufacturing method |
JP2007555895A JP4618300B2 (ja) | 2006-01-30 | 2007-01-11 | 情報記録媒体およびその製造方法 |
EP07706939A EP1981028A4 (en) | 2006-01-30 | 2007-01-11 | INFORMATION RECORDING MEDIUM AND METHOD FOR THE PRODUCTION THEREOF |
Applications Claiming Priority (2)
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JP2006-021502 | 2006-01-30 | ||
JP2006021502 | 2006-01-30 |
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WO2007086293A1 true WO2007086293A1 (ja) | 2007-08-02 |
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PCT/JP2007/050632 WO2007086293A1 (ja) | 2006-01-30 | 2007-01-11 | 情報記録媒体およびその製造方法 |
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Country | Link |
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US (1) | US20090130461A1 (ja) |
EP (1) | EP1981028A4 (ja) |
JP (1) | JP4618300B2 (ja) |
KR (1) | KR20080090959A (ja) |
CN (1) | CN101322191A (ja) |
TW (1) | TW200805360A (ja) |
WO (1) | WO2007086293A1 (ja) |
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JP2007141417A (ja) * | 2005-11-22 | 2007-06-07 | Sony Corp | 追記型光記録媒体およびその製造方法 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6417234A (en) * | 1987-07-10 | 1989-01-20 | Fuji Photo Film Co Ltd | Optical information recording method and information recording medium |
JPH05169819A (ja) * | 1990-09-06 | 1993-07-09 | Hitachi Maxell Ltd | 光情報記録媒体及び情報の記録再生方法並びに情報記録装置 |
JP2004030864A (ja) * | 2002-05-10 | 2004-01-29 | Ricoh Co Ltd | 追記型光記録媒体 |
JP2005056545A (ja) * | 2003-07-24 | 2005-03-03 | Matsushita Electric Ind Co Ltd | 情報記録媒体とその製造方法 |
JP2005108338A (ja) * | 2003-09-30 | 2005-04-21 | Ricoh Co Ltd | 光情報記録媒体及び記録方法 |
JP2005149588A (ja) * | 2003-11-13 | 2005-06-09 | Matsushita Electric Ind Co Ltd | 情報記録媒体およびその製造方法 |
JP2005209252A (ja) * | 2004-01-21 | 2005-08-04 | Renesas Technology Corp | 相変化メモリ及び相変化記録媒体 |
JP2005293821A (ja) * | 2004-03-10 | 2005-10-20 | Matsushita Electric Ind Co Ltd | 情報記録媒体とその製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3912058B2 (ja) * | 2001-08-21 | 2007-05-09 | ソニー株式会社 | 光ディスクおよびその製造方法 |
TW200428382A (en) * | 2003-05-09 | 2004-12-16 | Matsushita Electric Ind Co Ltd | Optical information recording medium |
US7427431B2 (en) * | 2004-04-28 | 2008-09-23 | Sony Corporation | Write once optical recording medium |
-
2006
- 2006-12-28 TW TW95149378A patent/TW200805360A/zh unknown
-
2007
- 2007-01-11 EP EP07706939A patent/EP1981028A4/en not_active Withdrawn
- 2007-01-11 JP JP2007555895A patent/JP4618300B2/ja not_active Expired - Fee Related
- 2007-01-11 WO PCT/JP2007/050632 patent/WO2007086293A1/ja active Application Filing
- 2007-01-11 US US11/910,426 patent/US20090130461A1/en not_active Abandoned
- 2007-01-11 CN CNA200780000480XA patent/CN101322191A/zh active Pending
- 2007-01-11 KR KR1020077022332A patent/KR20080090959A/ko not_active Application Discontinuation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6417234A (en) * | 1987-07-10 | 1989-01-20 | Fuji Photo Film Co Ltd | Optical information recording method and information recording medium |
JPH05169819A (ja) * | 1990-09-06 | 1993-07-09 | Hitachi Maxell Ltd | 光情報記録媒体及び情報の記録再生方法並びに情報記録装置 |
JP2004030864A (ja) * | 2002-05-10 | 2004-01-29 | Ricoh Co Ltd | 追記型光記録媒体 |
JP2005056545A (ja) * | 2003-07-24 | 2005-03-03 | Matsushita Electric Ind Co Ltd | 情報記録媒体とその製造方法 |
JP2005108338A (ja) * | 2003-09-30 | 2005-04-21 | Ricoh Co Ltd | 光情報記録媒体及び記録方法 |
JP2005149588A (ja) * | 2003-11-13 | 2005-06-09 | Matsushita Electric Ind Co Ltd | 情報記録媒体およびその製造方法 |
JP2005209252A (ja) * | 2004-01-21 | 2005-08-04 | Renesas Technology Corp | 相変化メモリ及び相変化記録媒体 |
JP2005293821A (ja) * | 2004-03-10 | 2005-10-20 | Matsushita Electric Ind Co Ltd | 情報記録媒体とその製造方法 |
Non-Patent Citations (1)
Title |
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See also references of EP1981028A4 * |
Also Published As
Publication number | Publication date |
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JPWO2007086293A1 (ja) | 2009-06-18 |
KR20080090959A (ko) | 2008-10-09 |
TW200805360A (en) | 2008-01-16 |
CN101322191A (zh) | 2008-12-10 |
JP4618300B2 (ja) | 2011-01-26 |
EP1981028A1 (en) | 2008-10-15 |
EP1981028A4 (en) | 2009-07-15 |
US20090130461A1 (en) | 2009-05-21 |
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