WO2007012271A1 - Antenne utilisable avec une carte a puce enfichable a double interface - Google Patents

Antenne utilisable avec une carte a puce enfichable a double interface Download PDF

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Publication number
WO2007012271A1
WO2007012271A1 PCT/CN2006/001840 CN2006001840W WO2007012271A1 WO 2007012271 A1 WO2007012271 A1 WO 2007012271A1 CN 2006001840 W CN2006001840 W CN 2006001840W WO 2007012271 A1 WO2007012271 A1 WO 2007012271A1
Authority
WO
WIPO (PCT)
Prior art keywords
antenna
contacts
card
plug
smart card
Prior art date
Application number
PCT/CN2006/001840
Other languages
English (en)
French (fr)
Inventor
Yong Li
Xuechao Jiang
Original Assignee
Beijing Watch Data System Co, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37198217&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=WO2007012271(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Beijing Watch Data System Co, Ltd. filed Critical Beijing Watch Data System Co, Ltd.
Priority to EP06761570.8A priority Critical patent/EP1914828B1/en
Priority to BRPI0606176-1A priority patent/BRPI0606176A2/pt
Priority to MX2007010398A priority patent/MX2007010398A/es
Priority to JP2007556482A priority patent/JP4907559B2/ja
Priority to US11/817,234 priority patent/US7742009B2/en
Publication of WO2007012271A1 publication Critical patent/WO2007012271A1/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07737—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts
    • G06K19/07739—Constructional details, e.g. mounting of circuits in the carrier the record carrier consisting of two or more mechanically separable parts comprising a first part capable of functioning as a record carrier on its own and a second part being only functional as a form factor changing part, e.g. SIM cards type ID 0001, removably attached to a regular smart card form factor
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2258—Supports; Mounting means by structural association with other equipment or articles used with computer equipment
    • H01Q1/2275—Supports; Mounting means by structural association with other equipment or articles used with computer equipment associated to expansion card or bus, e.g. in PCMCIA, PC cards, Wireless USB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q7/00—Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
    • H01Q7/04—Screened antennas

Definitions

  • the present invention relates to an antenna, and more particularly to an antenna for use with a non-contact portion of a plug-in dual interface smart card.
  • an IC card having a non-contact function such as an ID-1 size dual interface smart card
  • the dual-interface smart IC card has two working interfaces, especially its non-contact application mode, and is convenient and fast to use, so the application is more extensive.
  • it is applied to embedded devices such as mobile phones to realize mobile payment, identity authentication, etc. These applications will bring convenience to people's lives.
  • the use of dual interface smart cards in mobile phones has its own special features.
  • the SIM interface of the dual interface has a contact interface through the siM card slot, and the mobile phone provides the electrical signals required for the contact interface of vcc, ⁇ , ⁇ / ⁇ , etc.; but the non-contact of the dual interface SIM card
  • the interface needs the RF antenna to provide clock, data and other signals for its work.
  • the power signal if the mobile phone is turned on, the power is provided by vcc; if the mobile phone is turned off, the power is provided by the RF antenna.
  • the current scheme of arranging the antenna of the ID-1 card in the base of the chip cannot meet the application requirements in embedded devices such as mobile phones.
  • the present invention provides an antenna assembly attached to the surface of a plug-in smart card.
  • the plug-in smart card includes a card module and
  • the base includes an base material, an antenna coil fixed to the first surface of the base material, and first and second antenna pins.
  • the substrate includes a structure of a mating card module, first and second contacts on the second surface, and first and second vias, the first and second contacts and the structure of the mating card module being disposed at the base
  • the first and second antenna pins are connected to the first and second contacts through first and second vias, respectively, corresponding to the contacts of the plug-in smart card.
  • the structure of the above-described mating card module is formed by contacts disposed on the above-mentioned substrate and communicating with both sides of the through hole at respective positions corresponding to the contacts of the card module.
  • the contacts on the second surface of the substrate are connected to respective corresponding contacts on the plug-in smart card.
  • each contact of the card slot is in contact with a corresponding contact on the first surface of the antenna substrate, and the contact connection is connected to the plug-in through the contact of the two-sided communication On the corresponding contact of the smart card.
  • the structure of the mating card module is a window reserved for the contacts at positions corresponding to the partial contacts of the smart card and the smart card
  • the antenna is attached to the plug-in smart card by various connections such as glue, heat fusion or soldering.
  • the contacts from the antenna pins of the plug-in smart card chip are arranged on the card module of the plug-in smart card.
  • the contacts from the antenna pins of the plug-in smart card chip are placed on the edge of the card of the plug-in smart card.
  • the outstanding advantage of the present invention is that the addition of an antenna on a plug-in (plu g _in) dual interface smart card makes it easier and faster to provide a radio frequency antenna for a non-contact interface of a plug-in dual interface smart card, and is therefore based on a non-contact application.
  • the introduction of new ways of business saves costs.
  • Figure 1 illustrates the antenna arrangement when the dual interface smart card is an ID-1 card
  • FIG. 2 is a schematic diagram of connection of an antenna pin and a module contact on a dual interface smart card chip
  • Figure 3 is a perspective view showing the configuration when both the antenna assembly and the plug-in card are not combined;
  • FIG. 4 is a plan view showing the structure of a mating card module according to the first embodiment of the present invention.
  • Figure 5 is a plan view showing the structure of a mating card module in accordance with a second embodiment of the present invention
  • Figure 6 is a perspective view showing a configuration in which an antenna assembly and a plug-in card are combined
  • Figure 7 is a top plan view of an antenna pin on a smart card chip leading to a contact in accordance with another embodiment.
  • the technical solution of the present invention is to externally connect the antenna on the surface of the plug-in dual interface smart card, thereby obtaining the energy and clock and data signals required for the non-contact part of the dual interface smart card, wherein the energy depends on whether the mobile phone is powered on by VCC or Antenna is provided.
  • Dual interface smart IC cards with non-contact function such as SIM, UIM, PI card, etc.
  • non-contact function such as SIM, UIM, PI card, etc.
  • a technical solution of attaching an antenna to the smart card is adopted to solve the normal operation of the non-contact portion.
  • the dual-interface smart card adopting the solution is used in an embedded device such as a mobile phone, the non-contact interface can realize functions such as mobile payment and short-range communication through the antenna.
  • the antenna coil needs to be attached to the plug-in card of the dual interface smart card, such as glued, hot melted, soldered or otherwise bonded to the base 22 of the smart card. It can be considered as attaching an antenna to the plug-in card.
  • Fig. 3 is a perspective view showing a configuration in which both the antenna assembly and the plug-in card are not combined.
  • the antenna assembly 1 on the left includes an antenna coil 11, a flexible or flexible substrate 12, an antenna pin 14 connected to C4, and an antenna pin 18 connected to C8.
  • the substrate 12 includes a structure 201 that mates with the card module, contacts C4b and C8b on the lower surface, and vias 204 and 208.
  • the plug-in card 2 on the right includes a card module 21 and a base 22.
  • the antenna coil 11 is printed, etched, wound, or otherwise fabricated on the upper surface of the flexible substrate 12. In the present embodiment, a film is used as the flexible substrate 12.
  • the design parameters of the antenna coil 11, such as Q, L, R and other parameters, are determined by actual experiments.
  • the parameters need to comply with IS0/IEC 14443 and the requirements of the smart card chip for the antenna. Since the film is a non-conductor, in order to make the antenna pin 14 and the antenna pin 18 contact the contacts C8 and C4 of the card module 21, respectively, the antenna pin 18 extends through the via 208 to the lower surface of the antenna substrate to the contact.
  • the position corresponding to C8, and the metal contact C8b is manufactured at this position; the antenna pin 14 extends directly on the upper surface of the antenna substrate to a position corresponding to the contact C4, and passes through the via 204, where the lower surface is fabricated.
  • Metal contact C4b is a non-conductor
  • FIG. 4 is a top plan view showing the structure of a mating card module in accordance with a first embodiment of the present invention.
  • the contacts Cl, C2 at the antenna substrate and the card module are C3, C5, C6 and C7 have contacts on both sides that meet the requirements of IS07816-1 on both sides.
  • the antenna substrate upper surface 12a has contacts C1a, C2a, C3a, C5a, C6a, and C7a, and contacts corresponding to the contacts are processed on the lower surface of the substrate, and the contacts on the upper and lower surfaces pass. Hole connection.
  • Figure 5 is a plan view showing the structure of a mating card module in accordance with a second embodiment of the present invention.
  • the antenna assembly shown in FIG. 3 is manufactured, in order to realize the contact between the IC card slot contacts (not shown) and the contacts of the card module, the position of the structure 201 of the card module is matched on the antenna substrate. Pull out a window to make room for the contacts Cl, C2, C3, C5, C6 and C7 of the card module, as shown in Figure 5. Therefore, once the antenna substrate is attached to the proper position of the plug-in card, the contacts Cl, C2, C3, C5, C6 and C7 of the card module can be exposed.
  • Figure 6 is a perspective view showing the arrangement of both the antenna assembly and the plug-in card.
  • the structure 201 of the mating card module is formed by the contacts communicating on both sides, as shown in Fig. 6, when the antenna assembly 1 is attached to the plug-in card 2, the lower surface of the antenna substrate 12 All the contacts are aligned with the 8 contacts on the card module 21, and the antenna assembly 1 and the plug-in card 2 are bonded together by means of glue, hot melt, welding, etc., in order to ensure good contact between the two contacts. .
  • the contact between the upper and lower surfaces of the antenna substrate is formed on the antenna substrate so that the contacts of the card slot and the upper surface of the antenna substrate Cla, C2a, C3a, C5a are placed when the card is inserted into the IC card slot.
  • C6a and C7a correspond to the contact
  • the contact contact of the upper surface of the antenna substrate also communicates with the corresponding contact of the lower surface of the antenna substrate through the via hole
  • the respective contacts of the lower surface of the antenna substrate are combined with the card module at the substrate Together with the C1 to C8 contacts of the card module, they are in close contact with each other. That is, the connection between the card slot contacts and the contacts of the card module is transferred through the contacts on both sides of the antenna substrate film.
  • the antenna assembly 1 is combined with the plug-in card 2 by means of glue, heat fusion, soldering, etc., and both Ensure the antenna when combining
  • the top end of the opening on the substrate 12 is aligned with the top end of the card module 21 to expose the contacts C1, C2, C5, C6 and C7 of the card module while ensuring the contacts C4, C8 of the card module and the lower surface of the antenna substrate.
  • the contacts C4b and C8b are accurately and reliably contacted. This way of opening the window on the antenna substrate, when the plug-in card is placed in the IC card slot, the contacts of the card slot directly contact the contacts C1, C2, C3, C6, C6 and C7 of the card module.
  • FIG. 7 is a top plan view of an antenna pin on a smart card chip leading to a contact in accordance with another embodiment.
  • the antenna pins of the smart card chip are taken out in a different manner than the solution described above.
  • the antenna pins LA, LB are led to the card edge of the plug-in smart card 2, and contacts C4', C8' are formed which are separate from the card module 21.
  • the position of the contacts of the antenna assembly needs to be changed accordingly.
  • the plug-in smart card Since the plug-in smart card is placed in the card slot during operation, this requires that the total thickness of the plug-in card and the attached antenna be less than one leg.

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Engineering & Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Support Of Aerials (AREA)
  • Details Of Aerials (AREA)

Description

供插入式双界面智能卡使用的天线 技术领域
本发明涉及一种天线， 尤其涉及一种供插入式（plug-in)双界面智能卡的非接触部分使 用的天线。
背景技术
目前具有非接触功能的 IC卡， 例如 ID- 1尺寸的双界面智能卡， 其射频天线线圈 111通 常布置在卡片片基 122内， 天线线圈 111的两个接点直接与智能卡的芯片 123引线连接， 如 图 1所示。
目前随着智能 IC卡应用的不断深入， 双界面智能 IC卡由于具有两个工作界面， 特别是 其非接触应用方式， 使用方便、 快捷， 所以应用更加广泛。 特别是将其应用于手机等嵌入式 设备实现移动支付、 身份认证等， 这些应用将给人们的生活带来便利。
双界面智能卡在手机中的使用有其特殊之处。 以 SIM卡为例， 双界面的 SIM卡， 其接触 界面通过 siM卡槽， 由手机为其提供 vcc、 κ、 ι/ο等接触界面工作所需的电信号； 但双界 面 SIM卡的非接触界面需要射频天线为其工作提供时钟、 数据等信号， 对于电源信号， 若手 机处于开机状态， 电源由 vcc提供； 若手机处于关机状态， 电源则由射频天线提供。 然而现 行的将 ID- 1卡片的天线布置在片基内的方案已不能满足在手机等嵌入式设备中的应用要求。
目前， 在日本、韩国等国家开展的基于手机的移动支付方案中， 采用了改造手机的方案。 将具有消费功能的智能 ic卡置于手机内，其射频天线布置在手机的主板或专用的手机电池背 面，天线与智能 IC卡通过专门设计的触点连接在一起。这是一种成本较高的解决方案， 它涉 及手机的改造。 这种方案在中国的移动通信应用环境下， 手机的改造成本显得很明显， 若用 户要使用移动支付功能就需要重新购买有移动支付功能的手机。因此，用户的使用成本很高， 也就限制了移动支付业务的幵展。
发明内容
为解决手机改造成本高的问题， 本发明提供一种附加在插入式（plug- in)智能卡表面的 天线组件。
在这种供插入式双界面智能卡的非接触界面使用的天线中， 插入式智能卡包括卡模块和 片基； 天线包括基材、 固定在基材第一表面上的天线线圈、 以及第一和第二天线引脚。 上述 基材包括配合卡模块的结构、 第二表面上的第一和第二触点、 以及第一和第二过孔， 第一和 第二触点和配合卡模块的结构布置在所述基材与插入式智能卡的触点对应的位置上， 第一和 第二天线引脚分别通过第一和第二过孔连接到第一和第二触点上。
上述配合卡模块的结构是由布置在上述基材上与卡模块的触点对应的各个位置上通过过 孔两面连通的触点形成的。
当天线附着到插入式智能卡上时， 上述基材第二表面上的触点与插入式智能卡上各个对 应触点相连接。
当附有天线的插入式智能卡插入卡槽时， 卡槽各触点与天线基材第一表面上的对应触点 相接触， 所述的接触连接通过所述两面连通的触点连接到插入式智能卡的对应触点上。
配合卡模块的结构是在上述基材与智能卡的部分触点对应的位置上为这些触点留出的窗
□。
当天线附着到插入式智能卡上时， 上述智能卡的部分触点通过所述窗口暴露出来。
当附有天线的插入式智能卡插入卡槽时， 卡槽各触点与插入式智能卡上的对应触点直接 接触。 '
上述天线通过粘胶、 热熔或焊接等各种连接方式附着到插入式智能卡上。
插入式智能卡芯片的天线引脚引出的触点布置在插入式智能卡的卡模块上。
插入式智能卡芯片的天线引脚引出的触点布置在插入式智能卡的卡片边缘。
本发明的突出优点在于， 在插入式（plug_in)双界面智能卡上附加天线， 使为 plug - in 双界面智能卡的非接触界面提供射频天线变得更为方便快捷， 进而为基于非接触应用方式的 新业务的引入节约了成本。
附图说明
图 1说明双界面智能卡为 ID- 1卡片时的天线布置方式；
图 2是双界面智能卡芯片上的天线引脚与模块触点的连接示意图；
图 3是天线组件和插入式卡片两者还未结合时的配置透视图；
图 4是根据本发明第一个实施例的配合卡模块的结构的俯视图；
图 5是根据本发明第二个实施例的配合卡模块的结构的俯视图； 图 6是天线组件和插入式卡片两者结合起来的配置透视图；
图 7是智能卡芯片上的天线引脚按照另一个实施例引出触点的俯视图。
具体实施方式
本发明的技术方案是， 在插入式（plug- in)双界面智能卡表面外接天线， 从而获得双界 面智能卡非接触部分工作所需的能量及时钟、 数据信号， 其中能量视手机是否开机由 VCC或 天线提供。 具有非接触功能的双界面智能 IC卡， 例如 SIM、 UIM、 PI 卡等， 它们均为符合 IS07816-1规范的 plug-in类型的小卡。 将这样的智能卡用于手机时， 为解决非接触部分的 正常工作而采取在智能卡上附加天线的技术方案。 当采用该方案的双界面智能卡用于手机等 嵌入式设备中的时候， 其非接触界面通过天线， 可以实现移动支付、 近距离通信等功能。
在现行智能 IC卡规范（如 IS0/IEC 7816-3)中， C4、 C8脚保留。这为插入式（plug- in) 的非接触式 IC卡的天线线圈的接入提供了通路。现在参照图 2来描述双界面智能卡芯片上的 天线引脚与模块触点的连接。 在将智能卡芯片 23封装为智能卡 2上的模块 21的过程中， 芯 片 23的天线引脚 LA、 LB分别通过引线 24、 28与模块 21的 C4、 C8脚连接。封装后的结果如 图 2中 plug- in尺寸的卡片 2所示。 而后， 非接触部分所需的天线线圈通过下面将要描述的 方式与模块 21的触点 C4、 C8连接， 从而实现为非接触部分提供射频信号。
天线线圈需要附着在双界面智能卡的插入式卡片上， 比如采用胶粘、 热熔、 焊接或者其 他方式与智能卡的片基 22结合在一起。 可视为在插入式卡片上附着一层天线。
图 3是天线组件和插入式卡片两者还未结合时的配置透视图。 如图所示， 左侧的天线组 件 1包括天线线圈 11、 柔性或软性基材 12、 接 C4的天线引脚 14和接 C8的天线引脚 18。 进 一步地， 基材 12包括配合卡模块的结构 201、 下表面上的触点 C4b和 C8b、 过孔 204和 208。 右侧的插入式卡片 2包括卡模块 21和片基 22。 天线线圈 11是以印刷、 蚀刻、 线绕或者其他 方式制造在软性基材 12上表面的， 在本实施例中采用薄膜作为软性基材 12。 天线线圈 11的 设计参数， 如 Q、 L、 R等参数， 通过实际实验来确定， 参数需要符合 IS0/IEC 14443及智能 卡芯片对于天线的要求。 由于薄膜是非导电体， 为了实现天线引脚 14和天线引脚 18分别与 卡模块 21的触点 C8和 C4接触， 天线引脚 18穿过过孔 208在天线基材下表面延伸至与触点 C8对应的位置，并在此位置制造金属触点 C8b;天线引脚 14则在天线基材上表面直接延伸至 与触点 C4对应的位置， 并穿过过孔 204， 在此位置下表面制造金属触点 C4b。 图 4是根据本发明第一个实施例的配合卡模块的结构的俯视图。 制造好如图 3所示的天 线组件后， 为实现 IC卡卡槽触点（图中未示出）与卡模块的各触点接触， 在天线基材与卡模 块的触点 Cl、 C2、 C3、 C5、 C6和 C7对应的各个位置上带有两面连通的符合 IS07816- 1要求 的触点。 如图 4所示， 天线基材上表面 12a具有触点 Cla、 C2a、 C3a、 C5a、 C6a和 C7a， 在 基材下表面加工与这些触点相对应的触点， 上下表面的触点通过过孔连接。 因此， 当天线基 材下表面的各个触点分别与插入式卡片模块的各个触点接触时， 一旦天线基材上表面的各个 触点分别与 IC卡卡槽的各触点接触， 就建立起 IC卡卡槽上各个触点与插入式卡片模块上的 触点 Cl、 C2、 C3、 C5、 C6和 C7之间的对应连接。 其中， 触点 C4和 C8用于与天线的两个接 点连接。 可见， 由这些两面连通的触点形成的配合卡模块的结构 201， 是在原 IC卡卡槽触点 与卡模块的各触点之间增加的续接导电体。
图 5是根据本发明第二个实施例的配合卡模块的结构的俯视图。 制造好如图 3所示的天 线组件后， 为实现 IC卡卡槽触点（图中未示出）与卡模块的各触点接触， 在天线基材上配合 卡模块的结构 201所在的位置铳出一个窗口， 给卡模块的触点 Cl、 C2、 C3、 C5、 C6和 C7留 出空间， 如图 5所示。 因此， 一旦天线基材附着到插入式卡片的恰当位置上， 卡模块的触点 Cl、 C2、 C3、 C5、 C6和 C7就可以暴露出来。
图 6是天线组件和插入式卡片两者结合起来的配置透视图。
按照第一个实施例， 在配合卡模块的结构 201 由两面连通的触点形成的情况下， 如图 6 所示， 当天线组件 1附着在插入式卡片 2上时， 天线基材 12下表面的所有触点与卡模块 21 上的 8个触点分别对齐， 在保证两方触点良好接触的情况下， 天线组件 1和插入式卡片 2通 过粘胶、热熔、焊接等方式结合在一起。这种在天线基材上制造上下表面连通的触点的方式， 使插入式卡片置入 IC卡槽时，卡槽的各个触点与天线基材上表面的触点 Cla、 C2a、 C3a、 C5a、 C6a和 C7a对应接触， 天线基材上表面的触点接触也通过过孔与天线基材下表面的相应触点 连通， 而天线基材下表面的各个触点在基材与卡模块结合在一起时与卡模块的 C1至 C8触点 紧密地对应接触。 也就是说， 卡槽触点与卡模块的触点之间的连接是通过天线基材薄膜上两 面连通的触点来转接的。 .
按照第二个实施例， 在配合卡模块的结构 201是开口的情况下， 同样参照图 6， 天线组 件 1通过粘胶、 热熔、 焊接等方式与插入式卡片 2结合起来， 而且在两者结合时要保证天线 基材 12上的开口的顶端对齐卡模块 21的顶端， 以便露出卡模块的触点 Cl、 C2、 C3、 C5、 C6 和 C7， 同时保证卡模块的触点 C4、 C8与天线基材下表面的触点 C4b、 C8b对位准确并可靠接 触。这种在天线基材上开窗口的方式， 使插入式卡片置入 IC卡槽时， 卡槽的触点直接与卡模 块的触点 Cl、 C2、 C3、 C5、 C6和 C7对应接触。
图 7是智能卡芯片上的天线引脚按照另一个实施例引出触点的俯视图。 在该实施例中， 智能卡芯片的天线引脚通过与如上所述的方案不同的方式引出。将天线引脚 LA、 LB引至插入 式智能卡 2的卡片边缘， 并形成与卡模块 21分开的触点 C4' 、 C8' 。 在这种情况下， 设计 天线组件的时候需要相应地改变天线组件的触点位置。
由于插入式智能卡工作时置于卡槽内， 这要求插入式卡片与附着的天线叠加在一起的总 厚度小于 1腿。
显然， 本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范 围。 这样， 倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内， 则 本发明也意图包含这些改动和变型在内。

Claims

权利要求书
1、一种供插入式双界面智能卡的非接触界面使用的天线，插入式智能卡包括卡模块（21 ) 和片基（22)， 天线包括基材（12)、 固定在基材（12)第一表面上的天线线圈 （11 )、 以及第 一和第二天线引脚 （14和 18)， 其特征在于： 基材（12) 包括配合卡模块的结构 （201 )、 第 二表面上的第一和第二触点 （C4b和 C8b；)、 以及第一和第二过孔 （204和 208)， 第一和第二 触点 （C4b和 C8b)和配合卡模块的结构（201 )布置在所述基材与插入式智能卡的触点对应 的位置上， 第一和第二天线引脚（14和 18)分别通过第一和第二过孔（204和 208)连接到 第一和第二触点 （C4b和 C8b)上。
2、 如权利要求 1所述的天线， 其特征在于： 配合卡模块的结构 （201 ) 是由布置在基材 ( 12)上与卡模块的触点（Cl、 C2、 C3、 C5、 C6和 C7)对应的各个位置上通过过孔两面连通 的触点形成的。
3、如权利要求 2所述的天线，其特征在于： 当天线附着到插入式智能卡上时，基材（12 ) 第二表面上的各个触点与插入式智能卡上的对应触点相连接。
4、如权利要求 3所述的天线， 其特征在于： 当附有天线的插入式智能卡插入卡槽时， 卡 槽各触点与天线基材（12)第一表面上的对应触点 （Cla、 C2a、 C3a、 C5a、 C6a和 C7a)相接 触， 所述的接触连接通过所述两面连通的触点连接到插入式智能卡的对应触点（Cl、 C2、 C3、 C5、 C6和 C7)上。
5、 如权利要求 1所述的天线， 其特征在于： 配合卡模块的结构 （201 )是在基材（12) 与卡模块的触点 （Cl、 C2、 C3、 C5、 C6和 C7) 对应的位置上为这些触点留出的窗口。
6、如权利要求 5所述的天线， 其特征在于： 当天线附着到智能卡上时， 基材（12)第二 表面上的第一和第二触点（C4b和 C8b)与插入式智能卡上的对应触点相连接， 智能卡的触点
(Cl、 C2、 C3、 C5、 C6和 C7)通过所述窗口暴露出来。
7、如权利要求 6所述的天线， 其特征在于： 当附有天线的插入式智能卡插入卡槽时， 卡 槽各触点与智能卡上的对应触点 （Cl、 C2、 C3、 C5、 C6和 C7)直接接触。
8、如权利要求 3或 6所述的天线， 其特征在于： 所述天线通过粘胶、热熔或焊接的连接 方式附着到插入式智能卡上。
9、如权利要求 1所述的天线，其特征在于： 插入式智能卡芯片上的天线引脚引出的触点 (C4和 C8) 布置在插入式智能卡的卡模块 (21 ) 上。
10、 如权利要求 1所述的天线， 其特征在于： 插入式智能卡芯片上的天线引却引出的触 点 （C4' 和 C8， ) 与卡模块 （21 )分开布置。
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