WO2006126551A1 - 水溶性プレフラックス及びその利用 - Google Patents
水溶性プレフラックス及びその利用 Download PDFInfo
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- WO2006126551A1 WO2006126551A1 PCT/JP2006/310271 JP2006310271W WO2006126551A1 WO 2006126551 A1 WO2006126551 A1 WO 2006126551A1 JP 2006310271 W JP2006310271 W JP 2006310271W WO 2006126551 A1 WO2006126551 A1 WO 2006126551A1
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- acid
- water
- compound
- methylethoxy
- ethoxy
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C59/00—Compounds having carboxyl groups bound to acyclic carbon atoms and containing any of the groups OH, O—metal, —CHO, keto, ether, groups, groups, or groups
- C07C59/40—Unsaturated compounds
- C07C59/58—Unsaturated compounds containing ether groups, groups, groups, or groups
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
- C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
- C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
- C23C22/52—Treatment of copper or alloys based thereon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31678—Of metal
Definitions
- the present invention relates to a water-soluble preflux used when soldering an electronic component or the like to the surface of a metal conductive portion constituting a circuit portion of a printed wiring board, and use thereof.
- Such surface mounting methods can be classified into double-sided surface mounting in which chip components are joined by cream solder, mixed mounting in which chip component cream soldering and surface mounting by discrete components are combined.
- the printed wiring board is soldered a plurality of times, so that it is exposed to a high temperature each time and receives a severe thermal history.
- the imidazole compound has excellent film-forming properties, water-soluble preflux containing various imidazole compounds has been proposed as such a surface treatment agent.
- the imidazole compound 2-alkyl imidazole compounds such as 2-undecyl imidazole, 2-phenol imidazole and 2-ferruyl 4-methyl imidazole 2
- Aryl imidazole compounds, 2 alkyl benzimidazole compounds such as 2 Noel benzimidazole, 2- (4 2-Aralkylbenzimidazole compounds such as (-methyl) benzimidazole have been disclosed.
- imidazole compounds are generally poorly soluble in water, it has been necessary in recent years to dissolve them in water using an organic acid or an inorganic acid forming a water-soluble salt as a solubilizer.
- Formic acid and acetic acid are widely used as solubilizers, which have excellent performance for dissolving imidazole compounds in water and excellent performance for forming the film formation properties of imidazole compounds.
- the compound is highly volatile and has an irritating odor, the acid concentration in the water-soluble preflux decreases, leading to the precipitation of imidazole compound or the deterioration of the working environment. There was a point.
- Lead-free solders containing metals such as zinc, bismuth, indium, antimony and copper have been proposed and some are being put into practical use.
- lead-free solder is inferior in wettability to the metal surface compared to conventional tin-lead solder, resulting in poor solderability, poor bonding such as voids, and low bonding strength. there were.
- solder alloy with better solderability and a flux suitable for lead-free solder.
- Metal conductive parts such as copper, copper alloy and silver Even for water-soluble preflux used to prevent oxidation, there is a need for a function that improves the wettability of lead-free solder and improves solderability.
- solders have a high melting point and have a soldering temperature higher than that of conventional tin-lead eutectic solders. Compared with the water-soluble preflux, it is desired to form a chemical conversion film having excellent heat resistance.
- Patent Document 1 Japanese Patent Publication No. 46-17046
- Patent Document 2 Japanese Patent Laid-Open No. 4-206681
- Patent Document 3 Japanese Patent Laid-Open No. 5-25407
- Patent Document 4 Japanese Patent Application Laid-Open No. 5-186888
- the present invention has been made in view of such circumstances, and is excellent in performance for dissolving an imidazole compound in water and exhibiting excellent film forming properties possessed by an imidazole compound.
- An object of the present invention is to provide a water-soluble preflux containing a low-volatile solubilizing agent that can be used, and to provide a surface treatment method for a metal conductive portion in which the water-soluble preflux is brought into contact with the metal conductive portion. To do.
- the printed wiring board in which the water-soluble preflux is brought into contact with the surface of the metal conductive portion constituting the circuit portion of the printed wiring board and the surface of the metallic conductive portion are brought into contact with the water-soluble preflux. Another object is to provide a soldering method for performing soldering.
- the carboxylic acid compound power represented by the general formula of ## STR1 ## is found to have excellent performance for solubilizing imidazole compounds in water and performance for exhibiting excellent film-forming properties of imidazole compounds. It came to complete.
- R 2 is a hydrogen atom Represents a child or a methyl group.
- m represents an integer of 0 to 3
- n represents 1 or 2.
- the first invention is a water-soluble preflux containing an imidazole compound and a carboxylic acid compound represented by the general formula of Chemical Formula 1 having a carbon number power of ⁇ 16.
- the second invention contains a water-soluble preflux containing the imidazole compound in a proportion of 0.01 to 10% by weight and the carboxylic acid compound in a proportion of 0.1 to 50% by weight. It is.
- a method for treating a surface of a metallic conductive portion characterized by contacting with the water-soluble preflux of the first or second aspect of the invention.
- a fourth invention is a printed wiring board characterized in that the water-soluble preflax of the first or second invention is brought into contact with the surface of a metal conductive portion.
- a fifth invention is a soldering method, wherein soldering is performed after bringing the water-soluble preflates of the first or second invention into contact with the surface of a metal conductive portion.
- the water-soluble preflux of the present invention contains a low volatility carboxylic acid compound as a solubilizing agent for imidazole compounds! /.
- the concentration can be kept stable and no odor is generated.
- the superior film-forming property of the imidazole compound can be exhibited as compared with the case where formic acid or acetic acid is used as the solubilizer.
- the surface treatment method of the present invention since a chemical conversion film can be formed on the surface of the metal conductive portion, it is possible to prevent oxidation on the surface of the metal conductive portion.
- the metal conductive portion and the electronic component can be reliably joined by soldering.
- soldering method of the present invention it is possible to prevent the oxidation of the surface of the metal conductive portion, so that the solderability can be improved.
- the imidazole compound suitable for the practice of the present invention is not particularly limited, and examples thereof include alkyl imidazole compounds, aryl imidazole compounds, and aralkyl imidazole compounds. And alkylbenzene imidazole compounds, arylene benzimidazole compounds and aralkyl benzimidazole compounds.
- alkylimidazole compound examples include 1-decylimidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, 2-undecyl-4-methylimidazole, 4-methylimidazole. , 4-octylimidazole, 2-cyclohexylimidazole and the like.
- Examples of the aryl imidazole compound include 1-phenol imidazole, 2-phenol imidazole, 2-toluyl imidazole, 2- (4-clogous phenol) imidazole, 2-phenol-4-.
- Examples of the aralkylimidazole compound include: 1-benzylimidazole, 1- (4-chlorophenol) methyl-2-methylimidazole, 2-benzylimidazole, 2-benzyl 4-methylimidazole, 2- (2phenol) imidazole, 2- (5phenolpentyl) imidazole, 2-methyl-4,5 dibenzylimidazole, 1- (2,4-dichlorophenol) methyl-2-benzimidazole, 2- And (1 naphthyl) methyl-4-methylimidazole.
- alkylbenzimidazole compound examples include 1-dodecyl-2-methylbenzimidazole, 2-propylbenzimidazole, 2-pentylbenzimidazole, 2 Octylpenzimidazole, 2-Nolbenzimidazole, 2-Heptadecylbenzimidazole, 2-Hexiloux, 5-Methylbenzimidazole, 2-Pentyl-5,6-dichlorobenzimidazole, 2- (1 Ethenorepentinole ) Benzimidazole, 2- (2,4,4 trimethylpentyl) benzimidazole, 2-cyclohexylbenzimidazole, 2- (5 cyclohexylpentyl) benzimidazole, 2 phenoxymethyl benzimidazole, 2- (2-amino And ethyl) benzimidazole, 2,2′-ethylenedibenzimidazole, 2- (mercaptomethyl) benzimidazole, 2-
- Examples of the arylene benzimidazole compound include 1-phenol benzimidazole, 2-phenol benzimidazole, 2- (4-chlorophenol) benzimidazole, 1-benzyl-2-phenol pens.
- Aryl benzimidazo such as imidazole, 2-orthotolyl 5,6 dimethylbenzimidazole, 2- (1-naphthyl) 5-clonal benzimidazole, 5-phenol benzimidazole, 2- (2-pyridyl) benzimidazole, etc.
- a compound is mentioned.
- Examples of the aralkyl benzimidazole compound include: 1-benzil benzimidazole, 2-benzylbenzimidazole, 2- (4-clogous phenol) methylbenzimidazole, 2- (4 bromophenol).
- These imidazole compounds may be contained in the water-soluble preflux in a proportion of 0.01 to 10% by weight, preferably in a proportion of 0.1 to 5% by weight.
- the content of the imidazole compound is less than 0.01% by weight, the film thickness of the chemical conversion film formed on the metal surface becomes thin, and the oxidation of the metal surface cannot be sufficiently prevented.
- It also contains imidazole compounds.
- the proportion is more than 10% by weight, it becomes difficult to control the surface treatment to obtain a desired film thickness suitable for the soldering conditions.
- the carboxylic acid compound can be obtained by combining an alkoxy group (R 1 O) and a carboxymethyl group (CH COOH) or a carboxyethyl group (CH
- COOH is linked by an alkylene ether chain (-CH CH (R 2 ) -0-)
- m is more preferably 1 to 3.
- the carboxylic acid compound is methoxyacetic acid. It has been reported that this substance has testicular atrophy or teratogenicity that is difficult to be metabolized in vivo. The use of is not preferred.
- the carboxylic acid having a carbon number of ⁇ 16 represented by the general formula of 1 the carboxylic acid having a carbon number of ⁇ 15 represented by the general formula of Formula 2 when n is 1
- the compound can be synthesized according to the method described in “Oil Chemistry, Vol. 32, p. 118 (1983)”. That is, as shown in the reaction formula of Chemical Formula 3, an excess alcoholic compound is reacted with a predetermined molar amount of metallic sodium, and then 0.5 times the molar amount of monobasic acetic acid is mixed with metallic sodium and heated. Let After completion of the reaction, the excess alcohol compound is distilled off under reduced pressure, and concentrated hydrochloric acid necessary for neutralization is added, followed by extraction with ether or the like. The ether or the like in the extract is distilled off under reduced pressure, and the concentrated solution is distilled under reduced pressure to obtain the carboxylic acid compound.
- R 1 represents a linear or branched alkyl group having 1 to 4 carbon atoms
- R 2 represents a hydrogen atom or a methyl group
- m represents an integer of 0 to 3.
- R 1 represents a linear or branched alkyl group having 1 to 4 carbon atoms
- R 2 represents a hydrogen atom or a methyl group
- m represents an integer of 0 to 3.
- the carboxylic acid compound in the case of m force ⁇ represented by the chemical formula 2 is ethoxyacetic acid, propoxyacetic acid, isopropoxyacetic acid, butoxyacetic acid, isobutoxyacetic acid, sec-butoxyacetic acid, and ter t-butoxyacetic acid. .
- carboxylic acid compounds are 2- (2-methoxyethoxy) acetic acid, 2- (2-ethoxyethoxy) acetic acid, 2- ( 2-propoxyethoxy) acetic acid, 2- (2-isopropoxyethoxy) acetic acid, 2- (2-butoxyethoxy) acetic acid, 2- (2-isobutoxyethoxy) acetic acid, 2- (2-sec-butoxyethoxy) acetic acid 2- (2-tert-butoxyethoxy) acetic acid.
- the carboxylic acid compound is 2- (2-methoxy 1-methylethoxy) acetic acid, 2- (2-ethoxy 1-methylethoxy) acetic acid, 2 mono (2-propoxy 1 methyl ethoxy) acetic acid, 2- (2-isopropoxy 1 methyl ethoxy) acetic acid, 2- (2-butoxy 1 methyl ethoxy) acetic acid, 2- (2-isobutoxy 1 methyl ethoxy) acetic acid, 2 — (2— sec-butoxy-1-methylethoxy) acetic acid, 2- (2-tert-butoxy-1-methylethoxy) acetic acid.
- the carboxylic acid having a carbon number power of ⁇ 16 represented by the general formula of 1 the carboxylic acid having a carbon power of ⁇ 16 represented by the general formula of Formula 4 when n is 2
- the compound can be synthesized according to the method using the cyanoethyl ether compound described in “JA m. Chem. Soc., No. 70, p. 1333 (1948)” as a raw material. .
- the cyanoethyl ether compound can be synthesized according to the methods described in "UK Patent No. 544421” and "US Patent No. 2280792".
- an alcohol compound and acrylonitrile are reacted in the presence of an alkali catalyst such as sodium ethoxide, neutralized, and then distilled under reduced pressure to synthesize a cyanoethyl ether compound.
- the cyanoethyl ether compound was heated and reacted in an aqueous solution of strong acid such as hydrochloric acid, the reaction mixture was concentrated, the precipitated ammonium salt such as ammonium salt was filtered off, and the filtrate was distilled under reduced pressure.
- an alkali catalyst such as sodium ethoxide
- R 1 is a linear or branched alkyl group having 1 to 4 carbon atoms
- R 2 is a hydrogen atom. Represents a child or a methyl group.
- m represents an integer of 0 to 3.
- the carboxylic acid compound in the case where m is 0 represented by Chemical Formula 4 is 3 ethoxypropionic acid, 3-propoxypropionic acid, 3-isopropoxypropionic acid, 3-butoxypropionic acid, 3-isobutoxy Propionic acid, 3-sec-butoxypropionic acid, 3-tert-butoxypropionic acid.
- the carboxylic acid compound is 3- (2-methoxyethoxy) propionic acid, 3- (2 ethoxyethoxy) propionic acid, 3- ( 2-poxyethoxy) propionic acid, 3- (2 isopropoxyethoxy) propionic acid, 3- (2 butoxyethoxy) propionic acid, 3- (2 isobutoxyethoxy) propionic acid, 3 (2 sec-butoxyethoxy) propionate Acid, 3- (2 tert-butoxyethoxy) propionic acid.
- the carboxylic acid compound is 3- (2-methoxy 1-methylethoxy) propionic acid, 3- (2 ethoxy 1-methylethoxy) Propionic acid, 3- (2 Propoxy 1-methylethoxy) propionic acid, 3- (2 Isopropoxy 1-methylethoxy) propionic acid, 3- (2 Butoxy 1-methylethoxy) propionic acid, 3- (2 Isobutoxy 1-methylethoxy) propionate Acid, 3- (2-sec-butoxy-1-methylethoxy) propionic acid, 3- (2-tert-butoxy-1-methylethoxy) propionic acid.
- the carboxylic acid compound is 3— ⁇ 2—
- carboxylic acid compounds may be contained in the water-soluble preflux in a proportion of 0.1 to 50% by weight, preferably 1 to 30% by weight.
- the content of carboxylic acid compound is When the amount is less than 1% by weight, the imidazole compound cannot be sufficiently soluble, and when the amount is more than 50% by weight, the drug cost of the carboxylic acid compound is low. Since it increases, it is not preferable.
- a conventionally known organic acid, inorganic acid or organic solvent may be used in combination with the carboxylic acid compound as a solubilizer.
- Typical organic acids used in this case include formic acid, acetic acid, propionic acid, butyric acid, glyoxylic acid, pyruvic acid, acetoacetic acid, levulinic acid, heptanoic acid, strength prillic acid, strength puric acid, lauric acid, Glycolic acid, glyceric acid, lactic acid, acrylic acid, benzoic acid, para-trobenzoic acid, p-toluenesulfonic acid, salicylic acid, picric acid, oxalic acid, succinic acid, maleic acid, fumaric acid, tartaric acid, adipic acid, etc.
- inorganic acids include hydrochloric acid, phosphoric acid, sulfuric acid, nitric acid and the like.
- organic solvent examples include lower alcohols such as methanol, ethanol, and isopropyl alcohol that are freely miscible with water, acetone, N, N-dimethylformamide, and ethylene glycol.
- a copper compound can be added to the water-soluble preflux of the present invention in order to increase the rate of formation of the chemical conversion film on the surface of the metal conductive portion, and the heat resistance of the formed chemical conversion film can be further increased.
- a zinc compound may be added.
- the copper compound include copper acetate, cuprous chloride, cupric chloride, cuprous bromide, cupric bromide, copper iodide, copper hydroxide, copper phosphate, copper sulfate.
- Typical examples of the zinc compounds include zinc oxide, zinc formate, zinc acetate, zinc oxalate, zinc lactate, zinc citrate, zinc sulfate, zinc nitrate, and phosphoric acid. zinc and the like, both the content of 0.01 to 10 weight 0/0 in a water-soluble preflux, preferably good be added so that the proportion of 0.02 to 5 by weight%.
- amines such as ammonia, monoethanolamine, diethanolamine, and triethanolamine are used. It is preferable to stabilize the pH of the water-soluble preflux by adding a substance having a buffering action.
- the water-soluble preflux of the present invention includes the rate of formation of the chemical conversion film and the heat resistance of the film.
- a halogen compound can be added so as to have a content of 0.001 to 1% by weight, preferably 0.01 to 0.5% by weight.
- halogen compounds include sodium fluoride, potassium fluoride, ammonium fluoride, salt sodium trim, salt potassium, salt ammonium, sodium bromide, potassium bromide, Ammonium bromide, sodium iodide, potassium iodide, ammonium iodide and the like can be mentioned.
- the conditions for treating the surface of the metal conductive part of the printed wiring board using the water-soluble preflux of the present invention are as follows: the water temperature of the water-soluble preflux is 10 to 70 ° C, and the contact time is It is preferably 1 second to 10 minutes. Examples of the contact method include dipping, spraying, and coating methods.
- rosin derivatives such as rosin, rosin ester, terpene resin derivatives such as terpene resin, terpene phenol resin, aromatic hydrocarbon resin, Hydrophobic resin such as aliphatic hydrocarbon resin is dissolved in a solvent such as toluene, ethyl acetate, isopropyl alcohol, etc., and is mixed with a roll coater. It may be applied uniformly on the film so as to have a thickness of 1 to 30 m to form a double structure of the chemical film and the thermoplastic resin.
- the soldering method of the present invention is a flow in which a printed wiring board is poured over a solder bath containing heated and melted liquid solder, and soldering is performed on the joint between the electronic component and the printed wiring board. Or a reflow method in which paste-like cream solder is printed on a printed wiring board according to a circuit pattern, electronic components are mounted on the printed wiring board, the printed wiring board is heated to melt the solder, and soldering is performed. It can be adapted to.
- solder suitable for the soldering of the present invention Sn-Ag-Cu system, Sn-Ag-Bi system, Sn-Bi system, Sn-Ag-Cu system, Sn-Ag-Cu system, Sn-Ag-Cu system, Sn-Ag-Cu system, Sn-Ag-Cu system, Examples include lead-free solders such as Sn—Ag—Bi—In, Sn—Zn, and Sn—Cu.
- the imidazole compounds, carboxylic acid compounds and evaluation test methods used in Examples and Comparative Examples are as follows.
- 2-Fe-Lu (3,4-dichlorophenol) imidazole 0.20 g is dissolved in the carboxylic acid compound used in the present invention 2. Og, and then added until ion-exchanged water is added until it becomes cloudy. The amount of water (mL) measured was measured. It is determined that the higher the amount of water, the better the soluble property of the imidazole compound possessed by the carboxylic acid compound.
- a printed wiring board made of glass epoxy resin of 120 mm (vertical) XI 50 mm (horizontal) X I. 6 mm (thickness) having 300 copper through holes having an inner diameter of 0.80 mm was used.
- This test piece was degreased, soft-etched and washed with water, and then the water solution maintained at a predetermined liquid temperature.
- the film was immersed in a preflux for a predetermined time, then washed with water and dried to form a chemical conversion film having a thickness of about 0.10 to 0.50 m on the copper surface.
- the surface-treated test piece was reflowed 3 times with a peak temperature of 240 ° C using an infrared reflow device (product name: MULTI-PRO-306, manufactured by Vitoguchi-Tas).
- the soldering was performed using a flow soldering device (conveyor speed: 1. OmZ).
- the solder used was tin-lead eutectic solder (trade name: H63A, manufactured by Senju Metal Industry) having a composition of 63 tin-37 lead (weight%). — 64MSS (manufactured by Hiroki).
- the solder temperature was 240 ° C.
- the test piece subjected to the surface treatment was soldered using lead-free solder in the same manner as in the case of tin-lead eutectic solder.
- the solder used was a lead-free solder (trade name: H705 “Ecosoldaichi”, manufactured by Senju Metal Industry) having a composition of 96.5 tin-3.0 silver-0.5 copper (% by weight) Flux used in soldering ⁇ O S—E—09 (manufactured by Hiroki).
- the peak temperature of reflow heating was 245 ° C, and the solder temperature was 245 ° C.
- the number of through holes in which the solder rose to the upper land portion of the copper through hole (soldered) was measured, and the ratio to the total number of through holes (300 holes) (% ) was calculated.
- test piece is degreased, soft-etched and washed with water, then immersed in a water-soluble preflux maintained at a predetermined liquid temperature for a predetermined time, then washed with water and dried to a thickness of about 0.1 to 10 on the copper surface. A 50 m conversion coating was formed.
- the reflow heating whose peak temperature is 240 degreeC was performed once using the infrared reflow apparatus (Product name: MULTI-PRO-306, the product made from Vitoguchi-tas). After that, using a methanol mask with an opening diameter of 1.2 mm and a thickness of 150 m, tin-lead cream solder was printed at the center of the copper circuit, and reflow heating was performed under the same conditions as in the previous period, followed by soldering.
- the tin-lead cream solder used was eutectic solder (trade name: OZ-63-330F-40-10, manufactured by Senju Metal Industry Co., Ltd.) composed of 63 tin-37 lead (wt%).
- test piece subjected to the surface treatment was soldered using a lead-free cream solder in the same manner as in the case of the tin-lead cream solder.
- the lead-free cream solder used was a lead-free solder composed of 96.5 tin-3.0 silver-0.5 copper (wt%) (trade name: M705-221BM5-42-11, manufactured by Senju Metal Industry Co., Ltd.) ).
- the reflow heating performed before and after the cream solder printing was set so that the peak temperature was 245 ° C.
- 2-Undecylimidazole as the imidazole compound, ethoxyacetic acid as the solubilizer, copper acetate as the metal salt, and salt ammonium as the halogen compound each have the composition shown in Table 5.
- water-soluble preflux was prepared by dissolving in ion exchange water and adjusting the pH to 3.7 with aqueous ammonia.
- test piece of the printed wiring board was immersed in a water-soluble preflux adjusted to 40 ° C. for 60 seconds, washed with water and dried, and the solder finish and solder spreadability were measured. These test results are shown in Table 5.
- the water-soluble preflux prepared in the examples was odorless
- the water-soluble preflux of the comparative example had a unique irritating odor due to volatilization of acetic acid or formic acid.
- the water-soluble preflux of the present invention contains a low volatility carboxylic acid compound as a solubilizer for the imidazole compound! /.
- the concentration can be kept stable and no odor is generated.
- the superior film-forming property of the imidazole compound can be exhibited as compared with the case where formic acid or acetic acid is used as the solubilizer.
- the surface treatment method of the present invention since a chemical conversion film can be formed on the surface of the metal conductive portion, it is possible to prevent oxidation on the surface of the metal conductive portion.
- the metal conductive portion and the electronic component can be reliably joined by soldering.
- soldering method of the present invention it is possible to prevent the oxidation of the surface of the metal conductive portion, so that the solderability can be improved.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06746755.5A EP1886759B1 (en) | 2005-05-24 | 2006-05-23 | Water-soluble preflux and use thereof |
BRPI0610168-2B1A BRPI0610168B1 (pt) | 2005-05-24 | 2006-05-23 | Pré-fluxo solúvel em água |
US11/914,138 US7754105B2 (en) | 2005-05-24 | 2006-05-23 | Water-soluble preflux and usage of the same |
CN2006800183913A CN101228000B (zh) | 2005-05-24 | 2006-05-23 | 水溶性预焊剂及其应用 |
KR1020077027339A KR101180280B1 (ko) | 2005-05-24 | 2006-05-23 | 수용성 프리플럭스 및 이의 용도 |
HK08112276A HK1120464A1 (en) | 2005-05-24 | 2008-11-07 | Water-soluble preflux and use thereof |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-150279 | 2005-05-24 | ||
JP2005150279 | 2005-05-24 | ||
JP2005355985A JP4883996B2 (ja) | 2005-05-24 | 2005-12-09 | 水溶性プレフラックス及びその利用 |
JP2005-355985 | 2005-12-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006126551A1 true WO2006126551A1 (ja) | 2006-11-30 |
Family
ID=37451976
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2006/310271 WO2006126551A1 (ja) | 2005-05-24 | 2006-05-23 | 水溶性プレフラックス及びその利用 |
Country Status (9)
Country | Link |
---|---|
US (1) | US7754105B2 (ja) |
EP (1) | EP1886759B1 (ja) |
JP (1) | JP4883996B2 (ja) |
KR (1) | KR101180280B1 (ja) |
CN (1) | CN101228000B (ja) |
BR (1) | BRPI0610168B1 (ja) |
HK (1) | HK1120464A1 (ja) |
TW (1) | TW200706694A (ja) |
WO (1) | WO2006126551A1 (ja) |
Cited By (1)
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---|---|---|---|---|
WO2011074351A1 (ja) * | 2009-12-17 | 2011-06-23 | コーア株式会社 | 電子部品の実装構造 |
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JP2009057596A (ja) * | 2007-08-31 | 2009-03-19 | Shikoku Chem Corp | 金めっき皮膜の封孔処理剤およびその利用 |
JP5301218B2 (ja) * | 2008-08-25 | 2013-09-25 | 四国化成工業株式会社 | 銅または銅合金の表面処理剤及びその利用 |
US8263177B2 (en) * | 2009-03-27 | 2012-09-11 | Kesheng Feng | Organic polymer coating for protection against creep corrosion |
WO2010140469A1 (ja) * | 2009-06-01 | 2010-12-09 | 住友電気工業株式会社 | 接続方法,接続構造および電子機器 |
CN102766874A (zh) * | 2012-08-20 | 2012-11-07 | 合肥奥福表面处理科技有限公司 | Osp铜面保护剂 |
TWI639603B (zh) * | 2013-11-25 | 2018-11-01 | 四國化成工業股份有限公司 | 含有烯丙基乙炔脲類的組成物 |
CN104470202B (zh) * | 2014-12-31 | 2017-10-24 | 上海创功通讯技术有限公司 | 用于移动终端的印刷电路板及其焊盘表面处理方法 |
JP6835707B2 (ja) | 2016-04-05 | 2021-02-24 | 株式会社Moresco | オキサ酸化合物 |
US11337970B2 (en) | 2016-08-26 | 2022-05-24 | Bristol-Myers Squibb Company | Inhibitors of indoleamine 2,3-dioxygenase and methods of their use |
JP7053247B2 (ja) * | 2017-12-21 | 2022-04-12 | 東京応化工業株式会社 | 表面処理液、表面処理方法、及びパターン倒れの抑制方法 |
JP6916731B2 (ja) | 2017-12-28 | 2021-08-11 | 東京応化工業株式会社 | 基板の撥水化方法、表面処理剤、及び基板表面を洗浄液により洗浄する際の有機パターン又は無機パターンの倒れを抑制する方法 |
CN114932335B (zh) * | 2022-05-13 | 2024-03-26 | 深圳市荣昌科技有限公司 | 一种大功率led封装用水溶性固晶锡膏及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09176524A (ja) * | 1995-12-25 | 1997-07-08 | Tamura Kaken Kk | 水溶性プリフラックス、プリント回路基板及びプリント回路基板の金属の表面処理方法 |
JP2005068530A (ja) * | 2003-08-28 | 2005-03-17 | Tamura Kaken Co Ltd | 表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法 |
JP2005226082A (ja) * | 2004-02-10 | 2005-08-25 | Tamura Kaken Co Ltd | 金属の表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法 |
JP2005349439A (ja) * | 2004-06-10 | 2005-12-22 | Shikoku Chem Corp | 銅または銅合金の表面処理剤及び半田付け方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3801573A (en) * | 1971-08-24 | 1974-04-02 | Hoffmann La Roche | Substituted aminospirothiazines |
US4631139A (en) * | 1985-08-08 | 1986-12-23 | Texaco Inc. | Corrosion inhibiting metal working fluid |
CN1017324B (zh) * | 1989-05-09 | 1992-07-08 | 化学工业部晨光化工研究院一分院 | 一种印制线路板软钎焊用钎剂 |
JPH04206681A (ja) | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 印刷配線板の表面処理方法及び印刷配線板 |
JP2575242B2 (ja) | 1991-07-17 | 1997-01-22 | タムラ化研株式会社 | プリント配線板用表面保護剤 |
JP3112744B2 (ja) | 1991-09-12 | 2000-11-27 | タムラ化研株式会社 | プリント配線板用表面保護剤 |
US5985043A (en) * | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
US6217987B1 (en) * | 1996-11-20 | 2001-04-17 | Ibiden Co. Ltd. | Solder resist composition and printed circuit boards |
ID23177A (id) * | 1997-03-14 | 2000-03-23 | Otsuka Pharma Co Ltd | Turunan pirimidin baru |
ATE315886T1 (de) * | 1999-07-08 | 2006-02-15 | Sunstar Engineering Inc | Unterfüllmaterial für halbleitergehäuse |
AU2002245103A1 (en) * | 2000-11-14 | 2002-07-30 | Henkel Loctite Corporation | Wafer applied fluxing and underfill material, and layered electronic assemblies manufactured therewith |
US20030111519A1 (en) | 2001-09-04 | 2003-06-19 | 3M Innovative Properties Company | Fluxing compositions |
US7213739B2 (en) * | 2004-04-02 | 2007-05-08 | Fry's Metals, Inc. | Underfill fluxing curative |
WO2005121101A1 (en) * | 2004-06-10 | 2005-12-22 | Shikoku Chemicals Corporation | Phenylnaphthylimidazoles for use on copper surfaces during soldering |
-
2005
- 2005-12-09 JP JP2005355985A patent/JP4883996B2/ja not_active Expired - Fee Related
-
2006
- 2006-05-23 CN CN2006800183913A patent/CN101228000B/zh not_active Expired - Fee Related
- 2006-05-23 US US11/914,138 patent/US7754105B2/en active Active
- 2006-05-23 KR KR1020077027339A patent/KR101180280B1/ko active IP Right Grant
- 2006-05-23 EP EP06746755.5A patent/EP1886759B1/en not_active Expired - Fee Related
- 2006-05-23 BR BRPI0610168-2B1A patent/BRPI0610168B1/pt not_active IP Right Cessation
- 2006-05-23 WO PCT/JP2006/310271 patent/WO2006126551A1/ja active Application Filing
- 2006-05-24 TW TW095118393A patent/TW200706694A/zh not_active IP Right Cessation
-
2008
- 2008-11-07 HK HK08112276A patent/HK1120464A1/xx not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09176524A (ja) * | 1995-12-25 | 1997-07-08 | Tamura Kaken Kk | 水溶性プリフラックス、プリント回路基板及びプリント回路基板の金属の表面処理方法 |
JP2005068530A (ja) * | 2003-08-28 | 2005-03-17 | Tamura Kaken Co Ltd | 表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法 |
JP2005226082A (ja) * | 2004-02-10 | 2005-08-25 | Tamura Kaken Co Ltd | 金属の表面処理剤、プリント回路基板およびプリント回路基板の金属の表面処理方法 |
JP2005349439A (ja) * | 2004-06-10 | 2005-12-22 | Shikoku Chem Corp | 銅または銅合金の表面処理剤及び半田付け方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1886759A4 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011074351A1 (ja) * | 2009-12-17 | 2011-06-23 | コーア株式会社 | 電子部品の実装構造 |
US8895869B2 (en) | 2009-12-17 | 2014-11-25 | Koa Corporation | Mounting structure of electronic component |
Also Published As
Publication number | Publication date |
---|---|
EP1886759A1 (en) | 2008-02-13 |
CN101228000A (zh) | 2008-07-23 |
KR101180280B1 (ko) | 2012-09-07 |
BRPI0610168A2 (pt) | 2010-06-01 |
US20080318070A1 (en) | 2008-12-25 |
JP2007000928A (ja) | 2007-01-11 |
HK1120464A1 (en) | 2009-04-03 |
KR20080021610A (ko) | 2008-03-07 |
EP1886759B1 (en) | 2016-10-05 |
CN101228000B (zh) | 2010-06-09 |
TW200706694A (en) | 2007-02-16 |
EP1886759A4 (en) | 2010-04-28 |
BRPI0610168B1 (pt) | 2015-03-10 |
TWI359207B (ja) | 2012-03-01 |
US7754105B2 (en) | 2010-07-13 |
JP4883996B2 (ja) | 2012-02-22 |
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