WO2006075515A1 - 表示パネルの製造装置および表示パネルの製造方法 - Google Patents
表示パネルの製造装置および表示パネルの製造方法 Download PDFInfo
- Publication number
- WO2006075515A1 WO2006075515A1 PCT/JP2005/023792 JP2005023792W WO2006075515A1 WO 2006075515 A1 WO2006075515 A1 WO 2006075515A1 JP 2005023792 W JP2005023792 W JP 2005023792W WO 2006075515 A1 WO2006075515 A1 WO 2006075515A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- stage
- packing
- display panel
- optical film
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Definitions
- the present invention relates to a display panel manufacturing apparatus and a display panel manufacturing method.
- the present invention relates to a display panel manufacturing apparatus and a display panel manufacturing method for fixing a substrate to a stage by suction.
- a typical example of a display panel is a liquid crystal display panel.
- a method for manufacturing a liquid crystal display panel there is a multi-chamfering method in which a plurality of liquid crystal display cells are formed on a large substrate and then divided into individual single liquid crystal display cells.
- a bonded substrate including a plurality of liquid crystal display cells is first formed.
- the bonded substrate includes two large glass substrates bonded to each other with a sealing material. This large bonded substrate is divided to form a strip-shaped bonded substrate.
- liquid crystal is injected into a strip-like bonded substrate, sealed, and the like, and divided into a single liquid crystal display cell.
- an optical film is attached to the main surface of each single liquid crystal display cell to manufacture a liquid crystal display panel.
- Optical films include polarizing plates and retardation plates.
- a manufacturing method is disclosed in which liquid crystal is supplied to the substrates and the substrates are bonded to each other. On this large bonded substrate, a plurality of liquid crystal display cells are formed. Next, a method is disclosed in which a large optical film is bonded together to a bonded substrate and then divided into individual liquid crystal display cells.
- An apparatus for attaching a large optical film to a laminated substrate is disclosed in, for example, Japanese Patent Application Laid-Open No. 2003-161935.
- FIG. 18 is a schematic plan view of a bonded substrate including a plurality of liquid crystal display cells
- FIG. 19 is a schematic cross-sectional view.
- the bonded substrate 34 includes two glass substrates that are shelled together so as to face each other.
- An optical film 32 is attached to the main surface of the bonded substrate 34.
- the shell-dividing substrate 34 includes a plurality of liquid crystal display cells 33.
- the liquid crystal display cells 33 are formed so that the planar shape is substantially rectangular, and each is regularly arranged.
- the respective liquid crystal display cells 33 are arranged at intervals.
- the optical film 32 is disposed so as to cover all the liquid crystal display cells 33 formed on the shell-dividing substrate 34.
- a part of the optical film 32 is removed in a band shape to form a glass substrate in a band shape.
- the excision part 39 is a part obtained by excising a part of the optical film 32.
- the cut portion 39 is formed between the liquid crystal display cells formed on the bonded substrate 34.
- the optical film 32 has a shape corresponding to each liquid crystal display cell.
- a splitting crack is formed in the cut portion 39 by a foil cutter for forming a glass scribe.
- the bonded substrate 31 is divided along the formed cracks to form individual liquid crystal display cells.
- An external driving device is connected to each divided liquid crystal display cell, and the liquid crystal display device is manufactured by being placed in a casing.
- FIG. 19 in a liquid crystal display panel, there is a force S for attaching an optical film on both sides of a substrate.
- an optical film is attached to the surfaces of the substrates on both sides.
- a cutting apparatus that cuts an optical film around a liquid crystal display cell on a bonded substrate, and then forms a crack for cutting in the cut portion to cut into individual liquid crystal display cells.
- the laminated substrate is fixed to the stage, a part of the optical film is cut with a blade, and a crack for cutting is formed in the cut portion of the optical film with a foil cutter.
- a cut portion 39 is formed, and a cut crack is formed in the cut portion 39.
- the bonded substrate is first fixed to the stage of the cutting apparatus.
- FIG. 21 shows a schematic sectional view when the bonded substrate is fixed to the stage in the cutting apparatus
- FIG. 22 shows a schematic plan view.
- a total of 20 liquid crystal display cells of 4 rows ⁇ 5 columns are formed on the bonded substrate 31 shown in FIG. 21 and FIG. 21 and 22 is formed so as to fix the bonded substrate 31 to the stage 43 by suction.
- a plurality of suction holes 8 are formed in the stage 43, and the suction holes 8 are connected to a vacuum exhaust apparatus (not shown).
- the planar shape of the stage 43 is formed to be almost rectangular.
- the bonded substrate 31 is disposed almost at the center of the stage 43.
- the stage 43 has a suction groove 9 formed on the surface of the stage 43 so as to communicate with the suction hole 8.
- the suction grooves 9 are formed in a lattice shape when viewed in plan.
- the suction holes 8 are formed at regular intervals.
- the suction hole 8 is formed at a portion where the lattice-like suction grooves 9 intersect.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2004-4636
- Patent Document 2 Japanese Patent Laid-Open No. 2003-161935
- suction is performed in the direction indicated by arrow 51 by the vacuum exhaust device.
- This cutting apparatus is formed so that the optical film 32a formed on the surface of the bonded substrate 31 is attracted to the stage 43 and the shell-dividing substrate 31 is fixed to the stage 43. It is.
- a cut portion 39 is formed in the optical film 32a, and a portion of the optical film is cut.
- a crack 42 is formed on the surface of the bonded substrate 31 on the side of the optical film 32a.
- An object of the present invention is to provide a display panel manufacturing apparatus and a display panel manufacturing method capable of stably fixing a substrate.
- An apparatus for manufacturing a display panel according to the present invention includes a stage for fixing a substrate on which an optical film is shelled on at least one surface, and the stage has a suction hole for sucking the substrate.
- the stage has a protrusion around the area where the suction hole is formed, and the protrusion is formed in a frame shape having a closed planar shape.
- the protrusion has a flat surface
- the surface of the protrusion is parallel to the surface of the stage
- the protrusion sucks the substrate
- the surface of the optical film Has a height at which the surface of the protrusion and the surface of the substrate are in close contact with each other when the substrate is in close contact with the surface of the stage.
- the stage includes a plate-like member, and the protrusion has an interposition member formed so as to be sandwiched between the plate-like member and the substrate.
- an elastic packing is provided, the packing is disposed so as to be sandwiched between the stage and the substrate, and the packing is in a region where the suction hole is formed along the protrusion.
- the packing is arranged so that the height of the top is higher than the surface of the protrusion when no load is applied, and the same height as the surface of the protrusion when the substrate is sucked It will be transformed into.
- an elastic packing is provided, the protrusion has a recess on a surface that contacts the substrate, and the packing is disposed in the recess.
- the packing is formed so that the height of the top is higher than the surface of the protrusion where the recess is formed when there is no load, and when the substrate is suctioned, It is deformed to the same height as the surface.
- a display panel manufacturing method includes a step of disposing an optical film facing a stage in the display panel manufacturing method, and suctioning the substrate using a suction hole, thereby
- the method includes a step of adhering the surface of the optical film to the surface of the stage, wherein the surface and the surface of the substrate are in close contact to form a closed space.
- FIG. 1 is a schematic sectional view of a stage according to the first embodiment.
- FIG. 2 is a schematic plan view of a stage in the first embodiment.
- FIG. 3 is a schematic cross-sectional view when a bonded substrate is fixed to the stage in Embodiment 1. is there.
- FIG. 4 A schematic plan view when a bonded substrate is fixed to the stage in Embodiment 1.
- FIG. 4 A schematic plan view when a bonded substrate is fixed to the stage in Embodiment 1.
- FIG. 5 is a first schematic cross-sectional view of the outer periphery when a bonded substrate is placed on the stage in the first embodiment.
- FIG. 7 A perspective view of a substrate on which another optical film in Embodiment 1 is attached.
- FIG. 8] is a perspective view of a substrate on which still another optical film in Embodiment 1 is attached.
- FIG. 9 is a first schematic cross-sectional view of the outer periphery when a bonded substrate is placed on the stage in the second embodiment.
- FIG. 10 is a second schematic cross-sectional view of the outer periphery when a bonded substrate is placed on the stage in the second embodiment.
- FIG. 11 A schematic cross-sectional view of the outer periphery when a bonded substrate is fixed to the stage in the second embodiment.
- FIG. 13 A second schematic cross-sectional view of the outer periphery when a bonded substrate is placed on the stage in the third embodiment.
- FIG. 14 A schematic cross-sectional view of the outer periphery when a bonded substrate is fixed to the stage in Embodiment 3.
- FIG. 14 A schematic cross-sectional view of the outer periphery when a bonded substrate is fixed to the stage in Embodiment 3.
- FIG. 15 is a first schematic cross-sectional view of the outer periphery when a bonded substrate is placed on the stage in the fourth embodiment.
- FIG. 17 A schematic cross-sectional view of the outer periphery when a bonded substrate is fixed to the stage in the fourth embodiment.
- FIG. 18 is a schematic plan view when an optical film is attached to a bonded substrate.
- FIG. 19 is a schematic cross-sectional view when an optical film is attached to a bonded substrate.
- FIG. 20 is a schematic plan view when the optical film is cut along the liquid crystal display cell.
- FIG. 21 is a schematic cross-sectional view of a liquid crystal display panel manufacturing apparatus based on a conventional technique when a bonding substrate is disposed on a stage.
- FIG. 22 is a schematic plan view of a liquid crystal display panel manufacturing apparatus based on a conventional technique when a bonding substrate is disposed on a stage.
- a manufacturing apparatus and a manufacturing method of a liquid crystal display panel which is an example of a display panel will be described as a first embodiment based on the present invention.
- the liquid crystal display panel manufacturing apparatus in the present embodiment cuts off a part of the optical film disposed on the substrate surface in the step of dividing the bonded substrate into individual liquid crystal display cells, and then cuts off the substrate.
- This is a cutting device that forms a crack for splitting in a part and splits it into individual liquid crystal display cells.
- FIGS. 18 and 19 two glass substrates are bonded to each other so that the bonded substrates face each other.
- a plurality of liquid crystal display cells are formed between the two glass substrates.
- the liquid crystal display cells are formed so that the planar shape is almost rectangular, and are regularly arranged.
- Optical films are affixed to the main surfaces on both sides of the shellfish occupying substrate.
- the cutting device cuts the optical film between the liquid crystal display cells in the form of a strip, forms the optical film into the shape of the liquid crystal display panel, and cuts the cut portion at the cut portion. To form individual cracks and split into individual liquid crystal display cells It is a device for.
- FIG. 1 shows a schematic cross-sectional view of a stage portion of the cutting apparatus according to the present embodiment
- FIG. 2 shows a schematic plan view of the stage.
- the stage 3 for fixing the bonded substrate board has a plate-like member 17 and an interposition member 10.
- a total of 20 liquid crystal display cells of 4 rows ⁇ 5 columns are formed on the bonded substrate illustrated, but the present invention can be applied regardless of the number of liquid crystal display cells.
- the plate member 17 is formed in a flat plate shape so that the planar shape is substantially rectangular.
- the plate-like member 17 has a suction hole 8 for performing suction.
- the plate-like member 17 has a suction groove 9 formed in a linear shape when viewed in plan on the surface on the side where the bonded substrate is disposed.
- the suction hole 8 is connected to a vacuum exhaust device (not shown).
- the suction hole 8 in the present embodiment is formed so as to penetrate the plate-like member 17.
- the suction holes 8 are arranged at equal intervals when viewed in plan.
- the suction groove 9 in the present embodiment is formed so that the extending direction is substantially parallel to the outer edge of the stage 3.
- the suction grooves 9 are formed in a lattice shape when viewed in plan.
- the suction hole 8 is formed at a portion where the suction grooves 9 intersect.
- the suction hole 8 communicates with the suction groove 9.
- the suction hole 8 and the suction groove 9 are formed in a region where the optical film disposed on the substrate is in close contact.
- the suction hole 8 is connected to a vacuum exhaust device (not shown) on the side (hereinafter referred to as the back side) opposite to the side (hereinafter referred to as the front side) where the substrate of the plate-like member 17 is disposed.
- the stage 3 has an interposition member 10 formed around a region where the suction hole 8 is formed.
- the intervening member 10 is formed as a protrusion protruding from the surface of the stage.
- the interposed member 10 is made of aluminum.
- the interposition member 10 is fixed to the plate-like member 17 with a bolt, and is formed so that air does not flow through the joint portion between the interposition member 10 and the plate-like member 17.
- the interposition member 10 is formed to have a rectangular cross-sectional shape, and has a frame shape that is closed when viewed in plan.
- the suction hole 8 and the suction groove 9 are disposed inside the interposed member 10 when viewed in plan.
- interposition member 10 is disposed so as to be sandwiched between a bonded substrate to be disposed and plate member 17.
- the plate-like member 17 is formed with a notch 20 having a shape with the surface notched on the entire outer periphery, and the interposition member 10 is disposed in the notch 20.
- the intervening member 10 is configured such that the surface of the interposing member 10 and the surface of the bonded substrate are separated when the shell-dividing substrate is sucked to the stage 3 and the surface of the optical film is brought into close contact with the surface of the stage 3. It is formed to be in close contact.
- the surface of the interposition member 10 on which the bonded substrate is disposed (hereinafter referred to as the front surface side) is increased by the thickness of the optical film from the surface of the plate-like member 17 with which the optical film contacts. It is formed.
- FIG. 3 shows a schematic cross-sectional view when the shell-growing substrate is fixed to the stage
- FIG. 4 shows a schematic plan view when the bonded substrate is fixed to the stage.
- Fig. 3 shows a part of one of the front and back optical films 32a cut into a band shape to form a cut portion 39, and further formed a splitting crack 42, and then a part of the other optical film 32b.
- FIG. 2 is a schematic cross-sectional view when cutting a crack to form a splitting crack.
- the laminated substrate 31 is inverted so that the optical film 32a contacts the plate-like member 17 of the stage 3 And arrange.
- the optical film 32b of the shell-dividing substrate 31 is further attracted to another plate-like member (not shown).
- stage 3 the alignment of the bonded substrate 31 is performed. In the alignment of the bonded substrate 31, for example, the air is blown from the suction holes 8 and the bonded substrate 31 is floated, and the alignment is performed using a positioning pin (not shown).
- an evacuation device (not shown) is driven, and through the suction hole 8 as shown by an arrow 51.
- the shell-dividing board 31 is sucked.
- the blade 19 is moved horizontally in the direction orthogonal to the arrows 52 and 52, and a part of the optical film 32b is cut into a strip shape.
- the foil cutter 23 is moved horizontally in the cut portion of the optical film 32b to form a splitting crack. This operation is repeated between adjacent liquid crystal display cells in the row and column directions, and then divided into individual liquid crystal display cells.
- FIG. 5 shows a schematic enlarged cross-sectional view in which the vicinity of the portion where the interposition member is formed during suction fixation is enlarged.
- Fig. 6 shows a cross-sectional view taken along the line VI-VI in Fig. 5.
- interposition member 10 is disposed around a region of stage 3 where suction hole 8 is formed, and has a closed frame shape. For this reason, the space surrounded by the bonded substrate 31, the interposition member 10, and the plate-like member 17 becomes a closed space connected to the vacuum evacuation device, and the inflow of air can be prevented. As a result, the bonded substrate 31 can be stably fixed to the stage 3 by suction. That is, air can be prevented from flowing into the suction holes 8 of the stage 3 through the cut portions 39 and the suction grooves 9 formed in the optical film 32a, and the shell-occupying substrate 31 is stably sucked into the stage 3. Can be fixed.
- the interposition member 10 has a flat surface parallel to the surface of the stage 3, and is a bonded substrate.
- the height at which the surface of the interposition member 10 and the surface of the bonded substrate 31 are in close contact with each other is set.
- the contact area between the surface of the interposition member 10 and the surface of the bonded substrate 31 can be increased, and the inflow of air can be prevented more reliably.
- the shell-dividing substrate 31 can be prevented from being bent.
- the bonded substrate 31 can be fixed horizontally, and the optical film 32 can be excised reliably. In addition, it is possible to reliably perform the division by the foil cutter 23.
- a liquid crystal display panel manufacturing apparatus was manufactured.
- the force S which could not sufficiently suck and fix the shell-dividing substrate to the stage, was formed by forming the notch on the stage and arranging the interposition member.
- the shell-dividing substrate could be sufficiently sucked and fixed.
- the stage has a plate-like member, and has an interposition member formed so as to be sandwiched between the plate-like member and the substrate as a protruding portion of the stage.
- the projecting portion of the stage is not limited to this form.
- the plate-like member and the projecting portion may be integrally formed from one member.
- the force in which the interposition member is made of aluminum is not limited to this form, and it is sufficient if it is made of a material that does not allow air to flow in between the substrate and the interposition member.
- the interposition member may be formed of a salty bull.
- the interposition member is formed so that the cross-sectional shape thereof is substantially rectangular.
- the cross-sectional shape of the interposition member is not limited to a rectangle, and any shape can be adopted.
- the interposition member is formed in a planar shape parallel to the partial force S stage on which the substrate of the interposition member is disposed. If this is the case, the substrate does not warp, which is more preferable.
- the suction hole formed in the stage can be formed at any position inside the projection of the stage, and the suction groove can be formed in any shape inside the projection of the stage. Can do.
- suction grooves may be formed radially, and suction holes may be formed at equal intervals along the suction grooves.
- a cutting device that cuts off a part of an optical film disposed on the surface of a substrate and then cuts into individual liquid crystal display cells by forming a crack for cutting in the cut portion.
- the present invention is not limited to an apparatus that performs both cutting of an optical film and formation of a crack in the substrate.
- an optical film cutting apparatus that cuts a part of the optical film disposed on the surface of the substrate or simply on the surface of the substrate. It can also be applied to a cutting device that forms cracks.
- the suction hole or the suction groove communicates with the edge of the optical film in plan view. If it is, it is not restricted to an above-described apparatus, This Embodiment is applicable.
- FIG. 7 there is also an apparatus for adhering and fixing a bonded substrate 31 in which a plurality of relatively small optical films 35 are bonded to at least one surface by adsorbing the optical film 35 on a stage. Applicable. Even in this case, the substrate can be stably sucked and fixed because the optical film is placed when the substrate is sucked onto the stage and the outside air does not enter from the portion.
- an apparatus for adhering and fixing the bonded substrate 31 in which a portion of the optical film 36 cut out on at least one surface is shelled to the stage by adsorbing the optical film 36 on the stage It can also be applied.
- the substrate can be stably sucked and fixed because outside air does not enter from the portion where the optical film is cut when the substrate is sucked.
- the substrate is not limited to a bonded substrate for a liquid crystal display panel, and the display panel manufacturing apparatus of the present embodiment can be used for any substrate to which an optical film is attached. For example, even when an organic EL display panel having an optical film is manufactured, the display panel manufacturing apparatus of the present embodiment can be used.
- the apparatus for manufacturing a liquid crystal display panel in the present embodiment cuts off a part of the optical film disposed on the surface of the bonded substrate, and then forms a splitting crack in the cut portion to form individual liquid crystal display cells.
- This is a dividing device that divides into two parts.
- the suction hole and the absorption groove are formed in the stage, and the suction hole is connected to the vacuum exhaust device as in the first embodiment.
- FIG. 9 shows a schematic enlarged cross-sectional view of the outer periphery of the stage before the substrate is placed and suction fixed.
- FIG. 10 shows a cross-sectional view taken along the line X_X in FIG.
- the stage 4 in the present embodiment includes a plate-like member 17 and an interposed member 11.
- the plate-like member 17 has a notch 20 formed on the entire outer periphery.
- An interposed member 11 and a packing 15 are disposed on the surface of the notch 20.
- the interposition member 11 is smaller in the horizontal direction than the notch 20 so that the packing 15 can be accommodated. Intervention
- the member 11 is formed so that the cross-sectional shape is substantially rectangular.
- the interposition member 11 is formed in a frame shape when seen in a plan view. The interposition member 11 is arranged and placed so as to be sandwiched between the plate-like member 17 and the bonded substrate 31 to be fixed.
- the packing 15 is formed to have a circular cross-sectional shape.
- the packing 15 is formed so that the planar shape is linear.
- the packing 15 is formed to have elasticity.
- the packing 15 is made of silicone rubber.
- the packing 15 is disposed so as to be sandwiched between the plate-like member 17 and the bonded substrate 31.
- the packing 15 is disposed inside the interposition member 11 when viewed in plan and between the step at the inner end of the notch 20 and the interposition member 11.
- the packing 15 is disposed along the interposed member 11.
- the packing 15 is formed in a frame shape.
- the packing 15 has a suction hole and a suction groove formed therein, and is disposed so as to surround a region where the packing 15 is formed.
- the intervening member 11 sucks the bonded substrate 31 toward the stage 4, and when the surface of the optical film 32 a is brought into close contact with the surface of the stage 4, the surface of the intervening member 11 and the bonded substrate It has a height that closely contacts the surface of 31.
- the packing 15 has a portion (hereinafter referred to as a top) that comes in contact with the substrate most quickly when the substrate is disposed, and is higher than the surface of the interposition member 11 when no substrate is disposed. It is formed to increase the height. Specifically, the packing 15 has a force that the height of the top of the packing 15 is equal to the height of the surface of the interposition member 11 when the substrate is arranged, or the bonded substrate 31 is not sucked. Sometimes, the height of the top of the packing 15 is formed to be higher than the height of the surface of the interposition member 11.
- the top of the packing 15 is compressed to the same height as the surface of the interposition member 11 together with the arrangement of the substrate in the former, and in the latter, when the shell-occupying substrate 31 is sucked.
- the top of the packing 15 is formed so as to be compressed to the same height as the surface of the interposition member 11.
- the force with which the packing is arranged inside the interposition member is not particularly limited to this form, and the packing may be arranged outside the interposition member.
- the notch and the interposition member are formed so that the packing contacts the bonded substrate, and the packing is disposed.
- the bonded substrate is sucked through the suction holes and the suction grooves formed in the stage and is fixed to the stage. This is the same as in the first embodiment.
- FIG. 11 shows a schematic cross-sectional view of the end of the stage when the shell-dividing substrate is sucked and fixed to the stage. As the suction starts, the bonded substrate 31 is drawn toward the stage 4. The packing 15 is sandwiched between the plate member 17 and the bonded substrate 31 and compressed.
- the optical film 32a is in close contact with the surface of the plate-like member 17, and the shell-dividing substrate 31 is in close contact with the surface of the interposing member 11.
- the first sealing portion is formed by the interposition member 11 and the bonded substrate 31 being in close contact with each other. Furthermore, when the packing 15 is in close contact with the plate-like member 17 and the bonded substrate 31, the second sealing portion can be formed. As described above, in the present embodiment, air can be prevented from flowing in with the double sealing portion, and the force S for strongly sucking and fixing the bonded substrate can be achieved.
- the packing is formed so that the cross-sectional shape thereof is circular.
- the present invention is not limited to this form, and any shape of packing can be used as long as it functions to prevent the inflow of air. Can be used.
- the packing 15 was formed in such a size that the height of the top portion was about 100 ⁇ m higher than the surface of the interposed member 11 when no load was applied.
- the packing 15 was formed of silicone rubber, and the interposed member 11 was formed of aluminum. Further, in addition to the cutting device in which the packing 15 is arranged inside the interposed member 11, the performance test was also conducted on the cutting device in which the packing 15 was arranged outside the interposed member 11.
- the apparatus for manufacturing a liquid crystal display panel in the present embodiment cuts off a part of the optical film disposed on the surface of the bonded substrate, and then splits into individual liquid crystal display cells by forming splitting cracks. It is a cutting device.
- the suction hole and the absorption groove are formed in the stage, and the suction hole is connected to the vacuum exhaust device as in the first embodiment.
- FIG. 12 shows a schematic cross-sectional view of the outer periphery of the stage before the shell-dividing substrate is placed on the stage and suction fixed.
- FIG. 13 is a cross-sectional view taken along line XIII-XIII in FIG.
- the stage 5 in the present embodiment includes a plate-like member 17 and an interposed member 12.
- the plate-like member 17 has a notch 20 formed on the entire outer periphery.
- an interposition member 12 and a packing 16 are arranged on the surface of the notch portion 20, so that the cross-sectional shape is substantially rectangular.
- the interposition member 12 is formed in a frame shape when seen in a plan view.
- the intervening member 12 is arranged and sandwiched between the plate-like member 17 and the bonded substrate 31 to be fixed.
- the interposition member 12 includes a recess 21 in a region that contacts the substrate.
- the recess 21 is formed in a linear shape when seen in a plan view.
- the depression 21 is formed so as to be along the direction in which the interposition member 12 extends when seen in a plan view.
- a packing 16 is disposed inside the recess 21.
- the packing 16 is formed to have a circular cross-sectional shape.
- the packing 16 is formed in a linear frame shape in plan view.
- the recess 21 is formed in a semicircle so that the bottom is along the circular shape of the cross section of the packing 16.
- the intervening member 12 is bonded to the surface of the interposing member 12 when the shell-dividing substrate 31 is sucked toward the stage 5 and the surface of the optical film 32a is brought into close contact with the surface of the stage 5. It has a height at which the surface of the substrate 31 is in close contact.
- the packing 16 is formed such that the height of the top of the packing 16 is higher than the surface of the interposition member 12 in which the recess 21 is formed when no substrate is disposed. . Specifically, the packing 16 is not subjected to the force that the height of the top of the packing 16 is equal to the height of the surface of the interposition member 12 when the substrate is disposed, or the shell-occupying substrate 31 is not sucked.
- the height of the top of the packing 16 is formed to be higher than the height of the surface of the interposition member 12.
- the top of the packing 16 is compressed to the same height as the surface of the interposition member 12 together with the arrangement of the board in the former, and in the latter, when the shell-occupying board 31 is sucked.
- the top of the packing 16 is formed so as to be compressed to the same height as the surface of the interposed member 12.
- the bonded substrate is sucked through the suction holes and suction grooves formed in the stage, and is fixed to the stage. This is the same as in the first embodiment.
- FIG. 14 shows a schematic cross-sectional view of the end portion of the stage when the shell-dividing substrate is sucked and fixed to the stage.
- the bonded substrate 31 is sucked toward the stage 6 by being sucked by the vacuum exhaust device.
- the knock 16 is compressed and comes into close contact with the recess 21 and the bonded substrate 31.
- the optical film 32a is in close contact with the surface of the plate-like member 17, and the surface of the shell-dividing substrate 31 is in close contact with the surface of the interposing member 12.
- the bonded substrate 31 and the interposition member 12 are brought into close contact with each other, whereby the first sealing portion can be formed.
- a second sealing portion can be formed.
- the double sealing portion can prevent the inflow of air, and the shell-occupying substrate can be sucked and fixed more strongly.
- the force formed so that the cross-sectional shape of the knockin is circular is not limited to this form, and any force can be used as long as it functions to prevent the inflow of air.
- Shaped packing can be used. It is preferable that the bottom of the recess is formed so as to follow the shape of the packing. By adopting this configuration, the contact area between the recessed portion and the packing can be increased, and the inflow of air can be prevented more reliably.
- a liquid crystal display panel manufacturing apparatus in the present embodiment was actually formed and a performance test was performed.
- the interposing member 12 was formed using aluminum, and the packing 16 was formed using silicone rubber.
- the packing 16 was formed in such a size that the height of the top portion was about 100 ⁇ m higher than the surface of the interposed member 12 when no load was applied.
- the bonded substrate that could not be sufficiently fixed by suction due to the inflow of air could be sufficiently fixed by suction.
- a liquid crystal display panel manufacturing apparatus according to Embodiment 4 of the present invention will be described with reference to FIGS.
- the apparatus for manufacturing a liquid crystal display panel according to the present embodiment cuts off a part of the optical film disposed on the surface of the shell-dividing substrate, and then forms a crack for splitting into individual liquid crystal display cells. It is a cutting device.
- the suction hole and the absorption groove are formed on the stage, and the suction hole is connected to the vacuum evacuation device as in the first embodiment.
- FIG. 15 is a schematic cross-sectional view of the outer periphery of the stage before the shell-dividing substrate is placed on the stage and suction fixed.
- FIG. 16 shows a cross-sectional view taken along the line XVI-XVI in FIG.
- the stage 6 in the present embodiment includes a plate-like member 17 and an interposed member 13.
- the plate-like member 17 has a notch 20 formed on the entire outer periphery.
- An interposed member 13 is disposed on the surface of the notch 20.
- the interposition member 13 is formed so that the cross-sectional shape is substantially rectangular, and a recess 22 is formed at one corner of the four corners of the rectangle.
- the interposition member 13 is formed in a frame shape when seen in a plan view.
- the interposed member 13 is disposed so as to be sandwiched between the plate-like member 17 and the bonded substrate 31 to be fixed.
- the recess 22 is formed inside the interposed member 13.
- the recess 22 has a packing 16 Is arranged.
- the packing 16 is formed to have a circular cross-sectional shape.
- the recess 22 has an arc-shaped portion so as to follow the circular shape of the cross section of the knockin 16.
- the recess 22 and the packing 16 are formed in a linear frame shape when viewed in plan.
- the interposing member 13 is bonded to the surface of the interposing member 13 when the shell-dividing substrate 31 is sucked toward the stage 6 and the surface of the optical film 32a is brought into close contact with the surface of the stage 6. It has a height at which the surface of the substrate 31 is in close contact.
- the packing 16 is formed such that the height of the top of the packing 16 is higher than the surface of the interposition member 13 in which the recess 22 is formed when no substrate is placed. .
- the force at which the height of the top of the packing 16 is equal to the height of the surface of the interposition member 13 when the substrate is disposed, or the shell-occupying substrate 31 is not sucked.
- the height of the top of the packing 16 is formed to be higher than the height of the surface of the interposition member 13.
- the top of the packing 16 is compressed to the same height as the interposition member 13 together with the arrangement of the substrate in the former, and in the latter, when the bonded substrate 31 is sucked, the top of the packing 16 is compressed.
- the height of the intermediate member 13 is compressed to the same height as the height of the surface of the interposition member 13.
- the recess 22 in the present embodiment is formed inside the interposed member 13, but may be formed outside the interposed member 13.
- the bonded substrate is sucked through the suction holes and suction grooves formed in the stage, and is fixed to the stage. This is the same as in the first embodiment.
- FIG. 17 shows a schematic cross-sectional view of the end of the stage when the shell-dividing substrate is sucked and fixed to the stage.
- the bonded substrate 31 is sucked toward the stage 6 by being sucked by the vacuum exhaust device.
- the packing 16 is compressed and comes into close contact with the recess 22 and the bonded substrate 31.
- the optical film 32a is in close contact with the plate-like member 17 of the stage 6.
- the surface of the shell-dividing substrate 31 and the surface of the interposition member 13 are in close contact with each other.
- the interposed member 13 and the bonded substrate 31 can be in close contact to form a first sealed portion, and the packing 16 is formed in the recessed portion 22 and The second sealing portion can be formed by being in close contact with the bonded substrate 31.
- air can be prevented from flowing in with the double sealing portion, and the shell-occupying substrate can be sucked and fixed more strongly.
- the knock section is formed to have a circular cross-sectional shape.
- the present invention is not limited to this form, and any shape can be used as long as it functions to prevent the inflow of air.
- the packing can be used. It is preferable that the bottom of the recess is formed so as to follow the shape of the packing. By adopting this configuration, the contact area between the recessed portion and the packing can be increased, and the inflow of air can be prevented more reliably.
- the interposition member 13 was formed using aluminum, and the packing was formed using silicone rubber.
- the packing 16 was formed in such a size that the height of the top portion was about 100 / m higher than the surface of the interposed member 13 when no load was applied.
- a similar performance test was performed on a hollow portion formed on the outside of the interposed member and a packing disposed in the hollow portion. As a result of the performance test, both the cutting device in which the hollow portion is arranged inside the interposed member and the cutting device in which the hollow portion is arranged outside the interposed member could not be sufficiently sucked and fixed by the conventional technology. The bonded substrate could be sufficiently sucked and fixed.
- the present invention can be advantageously applied to the manufacture of display panels.
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mathematical Physics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006552884A JPWO2006075515A1 (ja) | 2005-01-13 | 2005-12-26 | 表示パネルの製造装置および表示パネルの製造方法 |
US11/661,459 US7868964B2 (en) | 2005-01-13 | 2005-12-26 | Display panel manufacturing apparatus including vacuum controlled panel holder and method of using same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005-006569 | 2005-01-13 | ||
JP2005006569 | 2005-01-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006075515A1 true WO2006075515A1 (ja) | 2006-07-20 |
Family
ID=36677545
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/023792 WO2006075515A1 (ja) | 2005-01-13 | 2005-12-26 | 表示パネルの製造装置および表示パネルの製造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7868964B2 (ja) |
JP (1) | JPWO2006075515A1 (ja) |
KR (1) | KR20070094658A (ja) |
CN (1) | CN100492105C (ja) |
WO (1) | WO2006075515A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018079158A1 (ja) * | 2016-10-26 | 2018-05-03 | 旭硝子株式会社 | 積層体の製造方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6057599B2 (ja) * | 2012-08-09 | 2017-01-11 | タツモ株式会社 | 吸着定盤及びその製造方法 |
CN104122710B (zh) * | 2013-04-27 | 2017-08-08 | 北京京东方光电科技有限公司 | 一种显示面板及其制造方法 |
KR102671371B1 (ko) * | 2016-10-07 | 2024-06-04 | 삼성디스플레이 주식회사 | 플렉시블 디스플레이 장치 및 그 제조방법 |
KR102552270B1 (ko) * | 2018-11-22 | 2023-07-07 | 삼성디스플레이 주식회사 | 원장보호필름의 박리방법 및 유기발광 표시장치의 제조방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0584682A (ja) * | 1991-03-29 | 1993-04-06 | Hitachi Ltd | 真空チヤツク装置 |
JPH11326856A (ja) * | 1998-05-12 | 1999-11-26 | Hitachi Ltd | 液晶表示装置の製造方法および製造装置 |
JP2004004636A (ja) * | 2002-04-02 | 2004-01-08 | Sharp Corp | 液晶パネル、液晶パネルの製造方法および液晶パネル製造装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0765925A (ja) * | 1993-08-23 | 1995-03-10 | Casio Comput Co Ltd | 部品搭載ステージおよびそれを用いた熱圧着装置 |
JP2000028980A (ja) * | 1998-07-09 | 2000-01-28 | Matsushita Electric Ind Co Ltd | 液晶表示パネルの製造方法 |
JP2001242432A (ja) * | 2000-02-25 | 2001-09-07 | Sharp Corp | 液晶パネル用吸着機構 |
CN1297844C (zh) * | 2001-11-27 | 2007-01-31 | 夏普株式会社 | 液晶板、液晶板制造方法、液晶板制造设备和偏振片粘结设备 |
US7202923B2 (en) * | 2001-11-27 | 2007-04-10 | Sharp Kabushiki Kaisha | Liquid crystal display with polarizer with inclined edge portion |
JP2003161935A (ja) | 2001-11-27 | 2003-06-06 | Sharp Corp | 偏光板貼付装置 |
JP2003167223A (ja) * | 2001-11-29 | 2003-06-13 | Sharp Corp | 基板搬送用治具及びこれを用いた電気表示装置の製造方法 |
JP4028752B2 (ja) * | 2002-04-24 | 2007-12-26 | キヤノンアネルバ株式会社 | 統合型液晶ディスプレイパネル組立装置及び基板重ね合わせ装置 |
-
2005
- 2005-12-26 WO PCT/JP2005/023792 patent/WO2006075515A1/ja not_active Application Discontinuation
- 2005-12-26 CN CNB2005800297661A patent/CN100492105C/zh not_active Expired - Fee Related
- 2005-12-26 US US11/661,459 patent/US7868964B2/en not_active Expired - Fee Related
- 2005-12-26 KR KR1020077018383A patent/KR20070094658A/ko not_active Application Discontinuation
- 2005-12-26 JP JP2006552884A patent/JPWO2006075515A1/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0584682A (ja) * | 1991-03-29 | 1993-04-06 | Hitachi Ltd | 真空チヤツク装置 |
JPH11326856A (ja) * | 1998-05-12 | 1999-11-26 | Hitachi Ltd | 液晶表示装置の製造方法および製造装置 |
JP2004004636A (ja) * | 2002-04-02 | 2004-01-08 | Sharp Corp | 液晶パネル、液晶パネルの製造方法および液晶パネル製造装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018079158A1 (ja) * | 2016-10-26 | 2018-05-03 | 旭硝子株式会社 | 積層体の製造方法 |
JPWO2018079158A1 (ja) * | 2016-10-26 | 2019-09-12 | Agc株式会社 | 積層体の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100492105C (zh) | 2009-05-27 |
CN101010711A (zh) | 2007-08-01 |
US7868964B2 (en) | 2011-01-11 |
JPWO2006075515A1 (ja) | 2008-06-12 |
US20070259589A1 (en) | 2007-11-08 |
KR20070094658A (ko) | 2007-09-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2005098522A1 (ja) | 粘着チャック装置 | |
WO2006075515A1 (ja) | 表示パネルの製造装置および表示パネルの製造方法 | |
JP2002090759A (ja) | 液晶表示素子の製造装置および製造方法 | |
TWI466224B (zh) | 基板貼合裝置 | |
US20200361110A1 (en) | Sheet for forming pillar for glass panel unit, pillar mounting device for manufacturing glass panel unit, glass panel unit manufacturing method, and glass window manufacturing method | |
KR101038026B1 (ko) | 기판 지지 구조 | |
JP2006201276A (ja) | 液晶表示パネルの製造方法 | |
JP2008225398A (ja) | 液晶表示素子の製造方法 | |
KR102042574B1 (ko) | 필름 절단 장치 | |
JP2020061265A (ja) | 膜電極接合体プレートの製造装置 | |
JP2010111534A (ja) | 基板切断方法および基板切断装置 | |
CN116978811A (zh) | 键合方法以及键合设备 | |
JP2007248594A (ja) | 液晶装置の製造方法 | |
JP2004354836A (ja) | ガラス基板分断方法及びその装置 | |
JP4933892B2 (ja) | 液晶表示素子の製造方法 | |
JP2022058206A (ja) | 貼り合わせ基板の加工方法 | |
JP2008225397A (ja) | 液晶表示素子の製造方法 | |
JP2012178471A (ja) | シート貼付装置および貼付方法 | |
CN108365116B (zh) | 一种离心膜及其贴合方法及oled面板 | |
JP2003291096A (ja) | プラスチックを主成分とするシートを構成部材とするセルの分割加工方法 | |
JP2000249999A (ja) | 液晶パネルの製造方法 | |
JP2002148642A (ja) | 液晶表示パネルとその製造方法 | |
JP2858309B1 (ja) | 半導体ウエハの可撓性シート貼着方法 | |
JP2001242432A (ja) | 液晶パネル用吸着機構 | |
JP4037659B2 (ja) | 基板貼合装置および基板貼合方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 2006552884 Country of ref document: JP |
|
WWE | Wipo information: entry into national phase |
Ref document number: 11661459 Country of ref document: US |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200580029766.1 Country of ref document: CN |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 1020077018383 Country of ref document: KR |
|
WWP | Wipo information: published in national office |
Ref document number: 11661459 Country of ref document: US |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 05819567 Country of ref document: EP Kind code of ref document: A1 |
|
WWW | Wipo information: withdrawn in national office |
Ref document number: 5819567 Country of ref document: EP |