WO2006070801A1 - 電子デバイスおよびその製造方法 - Google Patents
電子デバイスおよびその製造方法 Download PDFInfo
- Publication number
- WO2006070801A1 WO2006070801A1 PCT/JP2005/023898 JP2005023898W WO2006070801A1 WO 2006070801 A1 WO2006070801 A1 WO 2006070801A1 JP 2005023898 W JP2005023898 W JP 2005023898W WO 2006070801 A1 WO2006070801 A1 WO 2006070801A1
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- WO
- WIPO (PCT)
- Prior art keywords
- region
- transparent conductive
- conductive film
- electronic device
- conductive polymer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 54
- 238000000034 method Methods 0.000 title claims abstract description 47
- 229920001940 conductive polymer Polymers 0.000 claims abstract description 78
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000000862 absorption spectrum Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 43
- 229920000123 polythiophene Polymers 0.000 claims description 29
- 239000007870 radical polymerization initiator Substances 0.000 claims description 22
- 238000002835 absorbance Methods 0.000 claims description 11
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- 238000001035 drying Methods 0.000 claims description 10
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- 230000001747 exhibiting effect Effects 0.000 abstract description 2
- 230000031700 light absorption Effects 0.000 abstract 1
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- 238000010586 diagram Methods 0.000 description 12
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- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 9
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 9
- 229920000642 polymer Polymers 0.000 description 9
- HMUNWXXNJPVALC-UHFFFAOYSA-N 1-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]piperazin-1-yl]-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethanone Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)N1CCN(CC1)C(CN1CC2=C(CC1)NN=N2)=O HMUNWXXNJPVALC-UHFFFAOYSA-N 0.000 description 8
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- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 6
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- 229920000172 poly(styrenesulfonic acid) Polymers 0.000 description 6
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- 239000005020 polyethylene terephthalate Substances 0.000 description 6
- 229940005642 polystyrene sulfonic acid Drugs 0.000 description 6
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 5
- LDXJRKWFNNFDSA-UHFFFAOYSA-N 2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]ethanone Chemical compound C1CN(CC2=NNN=C21)CC(=O)N3CCN(CC3)C4=CN=C(N=C4)NCC5=CC(=CC=C5)OC(F)(F)F LDXJRKWFNNFDSA-UHFFFAOYSA-N 0.000 description 5
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 5
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- 229910052731 fluorine Inorganic materials 0.000 description 5
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 3
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 3
- 239000004721 Polyphenylene oxide Substances 0.000 description 3
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 150000001768 cations Chemical group 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 125000004216 fluoromethyl group Chemical group [H]C([H])(F)* 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
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- 238000005259 measurement Methods 0.000 description 3
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000001117 oleyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])/C([H])=C([H])\C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 239000006187 pill Substances 0.000 description 3
- 229920000570 polyether Polymers 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
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- 230000000977 initiatory effect Effects 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 150000002978 peroxides Chemical class 0.000 description 2
- 238000010526 radical polymerization reaction Methods 0.000 description 2
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- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 1
- OZAIFHULBGXAKX-VAWYXSNFSA-N AIBN Substances N#CC(C)(C)\N=N\C(C)(C)C#N OZAIFHULBGXAKX-VAWYXSNFSA-N 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 125000002877 alkyl aryl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 125000006232 ethoxy propyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- ALIFPGGMJDWMJH-UHFFFAOYSA-N n-phenyldiazenylaniline Chemical compound C=1C=CC=CC=1NN=NC1=CC=CC=C1 ALIFPGGMJDWMJH-UHFFFAOYSA-N 0.000 description 1
- VLTRZXGMWDSKGL-UHFFFAOYSA-N perchloric acid Chemical class OCl(=O)(=O)=O VLTRZXGMWDSKGL-UHFFFAOYSA-N 0.000 description 1
- JRKICGRDRMAZLK-UHFFFAOYSA-L persulfate group Chemical group S(=O)(=O)([O-])OOS(=O)(=O)[O-] JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/211—Changing the shape of the active layer in the devices, e.g. patterning by selective transformation of an existing layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/093—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antistatic means, e.g. for charge depletion
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8051—Anodes
- H10K59/80515—Anodes characterised by their shape
Definitions
- the present invention relates to an organic electroluminescence device (organic EL device), an electronic device such as a touch panel, a transparent conductive circuit board used therefor, and an electronic device manufacturing method.
- Patent Document 1 an electronic device using a transparent conductive circuit board provided with a wiring portion made of a transparent conductive film containing a conductive polymer has been widely used (see, for example, Patent Document 1).
- the wiring portion is usually formed by printing a paste in which a conductive polymer is dispersed in water on a substrate so as to have a predetermined shape (for example, a linear shape) by screen printing or inkjet printing.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2002-222056
- the shape of the wiring part may be incomplete. This is because, due to the properties (viscosity, etc.) of the paste, the shape of the wiring part is disturbed when bubbles are mixed in the paste, the paste oozes on the substrate, or the substrate repels the paste. is there.
- the electrical resistance value of the wiring part may become unstable.
- the present invention has been made in view of the above circumstances, an electronic device in which the conductivity and light transmittance of a transparent conductive film using a conductive polymer are good, and the strength and cost can be reduced. It is an object of the present invention to provide a transparent conductive circuit board used for manufacturing and an electronic device manufacturing method.
- the method for manufacturing an electronic device includes a transparent conductive film containing a conductive polymer on a base material, and the transparent conductive film includes a first region and the first region. And a second region having an electric resistance value higher than that of the first region.
- the transparent conductive film containing the conductive polymer on the substrate.
- a UV irradiation process in which a part of the transparent conductive film is irradiated with ultraviolet rays so that an irradiated part becomes the second region and a non-irradiated part becomes the first region.
- the ultraviolet ray includes a wavelength that exhibits absorption that is at least twice as large as the absorbance power S background in the absorption spectrum of the conductive polymer.
- the electronic device manufacturing method includes a curing step of drying and curing the transparent conductive film prior to the ultraviolet irradiation step in the electronic device manufacturing method.
- An electronic device includes a transparent conductive film containing a conductive polymer and a radical polymerization initiator on a base material, and the transparent conductive film includes a first region, A second region adjacent to the first region and having a higher electrical resistance than the first region.
- An electronic device is the above electronic device, wherein the first region is a wiring portion constituting a circuit.
- the electric resistance value of the second region is 104 times more electrical resistance value of the first region.
- a transparent conductive circuit board includes a transparent conductive film containing a conductive polymer and a radical polymerization initiator on a base material, and the transparent conductive film includes a first region. And a second region that is adjacent to the first region and has a higher electrical resistance than the first region, and the first region is a wiring portion that constitutes a circuit.
- a method for manufacturing an electronic device comprises: And a transparent conductive film containing a radical polymerization initiator, the transparent conductive film having a first region and a second region that is adjacent to the first region and has a higher electrical resistance than the first region.
- a method of manufacturing an electronic device comprising: forming a transparent conductive film containing the conductive polymer on the base material; and irradiating a part of the transparent conductive film with ultraviolet rays.
- there is an ultraviolet irradiation step in which the irradiated portion is the second region and the non-irradiated portion is the first region.
- An electronic device manufacturing method includes a curing step of drying and curing the transparent conductive film prior to the ultraviolet irradiation step in the electronic device manufacturing method.
- An electronic device includes a transparent conductive film containing a polythiophene-based conductive polymer on a base material, and the transparent conductive film includes a first region and the first region. And a second region having an electrical resistance higher than that of the first region.
- An electronic device is the above electronic device, wherein the first region is a wiring portion constituting a circuit.
- the electric resistance value of the second region is 10 4 times or more the electric resistance value of the first region.
- a transparent conductive circuit board includes a transparent conductive film containing a polythiophene-based conductive polymer on a base material, the transparent conductive film including the first region and the first conductive film. And a second region that is adjacent to the first region and has a higher electrical resistance than the first region, and constitutes the first region force circuit.
- the method for manufacturing an electronic device includes a transparent conductive film containing a polythiophene-based conductive polymer on a base material, the transparent conductive film including the first region, and A method for manufacturing an electronic device having a second region adjacent to a first region and having a second region having a higher electrical resistance than the first region, the method comprising: a transparent material containing a polythiophene-based conductive polymer on a substrate; A film forming process for forming a conductive film, and an ultraviolet irradiation process in which a part of the transparent conductive film is irradiated with ultraviolet rays so that an irradiated part is the second region and a non-irradiated part is the first region. And have.
- An electronic device manufacturing method provides the above electronic device manufacturing method.
- the method includes a curing step of drying and curing the transparent conductive film prior to the ultraviolet irradiation step.
- the absorption in the absorption spectrum of the ultraviolet ray conductive polymer irradiated to the transparent conductive film in the ultraviolet irradiation step is such that the absorbance in the absorption spectrum is at least twice that of the background. Since the wavelength shown is included, the conductivity of the irradiated portion can be efficiently reduced.
- the first region and the second region can be formed by short-time ultraviolet irradiation. Therefore, production efficiency can be increased and manufacturing costs can be reduced.
- the first region and the second region can be formed by short-time ultraviolet irradiation, it is possible to prevent the conductivity of the first region, which is a non-irradiated portion, from being lowered by ultraviolet rays.
- the first region with good conductivity can be formed.
- first region and the second region are formed in the transparent conductive film by ultraviolet irradiation, the formation of the wiring part due to bleeding or the like may occur compared to the conventional technique in which the wiring part is formed by printing. A first region having a precise shape can be formed.
- the conductivity of the first region (wiring portion) can be improved.
- the transparent conductive film can be formed thin without reducing the conductivity of the first region.
- the light transmittance of the transparent conductive film can be increased.
- the transparent conductive film contains a radical polymerization initiator, the reactivity of the conductive polymer with respect to ultraviolet rays is high, and the reaction of decreasing the conductivity is promoted. .
- the first region and the second region can be formed by short-time ultraviolet irradiation. Therefore, it is possible to increase production efficiency and reduce manufacturing costs.
- the first region and the second region can be formed by short-time ultraviolet irradiation, it is possible to prevent the first region that is a non-irradiated portion from being deteriorated by ultraviolet rays. Therefore, the conductivity of the first region (wiring portion) can be improved.
- the reactivity of the conductive polymer with respect to ultraviolet rays can be increased by the radical polymerization initiator, a reaction in which the conductivity decreases can be promoted even in the deep portion of the transparent conductive film. .
- the first region having an accurate shape for example, a rectangular cross section
- the transparent conductive film can be formed thin without reducing the conductivity of the first region. Therefore, the light transmittance of the transparent conductive film can be increased.
- the transparent conductive film includes the first region (low resistance region) and the second region (high resistance region).
- the first region can be formed with an accurate shape without causing poor formation of the wiring part due to bleeding or the like. Accordingly, it is possible to improve the conductivity of the first region that becomes the wiring portion.
- both the first region and the second region are formed in the transparent conductive film, the structure is simple. For this reason, manufacture is easy and low cost is possible.
- the transparent conductive film can be formed thin without reducing the conductivity of the first region.
- the light transmittance of the transparent conductive film can be increased.
- FIG. 1 is a schematic configuration diagram showing a transparent conductive circuit board obtained by the electronic device manufacturing method according to the first embodiment of the present invention.
- FIG. 2A is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 1.
- FIG. 2A is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 1.
- FIG. 2B is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 1.
- 2C is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 1.
- FIG. 3 is a graph showing an ultraviolet absorption spectrum of a transparent conductive film.
- FIG. 4 is a schematic configuration diagram showing a transparent conductive circuit board that can be used in the electronic device of the second embodiment of the present invention.
- FIG. 5A is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 4.
- FIG. 5B is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 4.
- FIG. 5C is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 4.
- FIG. 6 is a schematic configuration diagram showing a transparent conductive circuit board that can be used in an electronic device according to a third embodiment of the present invention.
- FIG. 7A is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 6.
- FIG. 7A is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 6.
- FIG. 7B is a process diagram for explaining a manufacturing method of the transparent conductive circuit board shown in FIG. 6.
- FIG. 7C is a process diagram illustrating a method for manufacturing the transparent conductive circuit board shown in FIG. 6.
- FIG. 8 is a graph showing changes in resistance value of a transparent conductive film due to ultraviolet irradiation.
- Transparent conductive film 33 ... Mask, 34 "" UV, 310 ... Conductive substrate, 31 1 ... ' Transparent conductive circuit board, 320 ⁇ 'Wiring portion, 321 ⁇ ' First region, 322 ⁇ 'Second region, 331 ⁇ Transparent portion, 332 ⁇ Transparent portion
- FIG. 1 is a partial cross-sectional view showing an example of a transparent conductive circuit board obtained by the manufacturing method of the first embodiment of the present invention.
- the transparent conductive circuit board 111 includes a transparent conductive film 12 containing a conductive polymer on a base material 11.
- the substrate 11 also has a transparent material, for example, polyethylene terephthalate (PET) force, and is formed in a plate shape or a film shape.
- PET polyethylene terephthalate
- the transparent conductive film 12 is made of a material containing a conductive polymer having a property of increasing an electrical resistance value when irradiated with ultraviolet rays.
- the transparent conductive film 12 has a first region 121 and a second region 122 formed adjacent to the first region 121.
- the first region 121 is a low resistance region having a relatively low electrical resistance value.
- the electric resistance value (surface resistance) of the first region 121 can be, for example, 10 3 ⁇ or less.
- the first region 121 is a wiring portion 120 that constitutes a transparent conductive circuit.
- the shape of the first region 121 is not particularly limited, but can be a line having a constant width.
- the second region 122 is a high resistance region having an electric resistance value higher than that of the first region 121.
- the electric resistance value (surface resistance) of the second region 122 is preferably 10 4 times or more (preferably 10 5 times or more) the electric resistance value of the first region 121. Specifically, it can be 10 8 ⁇ or more.
- the electrical resistance of the second region 122 by 10 4 times or more and to Rukoto electric resistance value of the first region 121, increasing the insulation between wiring sections 120 adjacent teeth force also conductive wiring part 120 The property can be improved.
- the conductive polymer is preferably a polythiophene-based conductive polymer.
- the polythiophene-based conductive polymer for example, an undoped polymer having a main chain composed of a polythiophene-based high molecule represented by the formula (1) is doped with a halogen such as iodine or another oxidizing agent.
- a polymer obtained by partially oxidizing the polymer to form a cation structure can be used.
- R 2 can be selected independently of each other. That Options include: hydrogen atom; halogen atom such as fluorine, chlorine, bromine, iodine;
- Linear alkyl groups such as methyl, ethyl, propyl, butyl (n-butyl), pentyl (n-pentyl), hexyl, octyl, dodecyl, hexadecyl, octadecyl; isopyl pill, isobutyl, sec butyl, tert Branched alkyl groups such as butyl, isopentyl, neopentyl; linear or branched alkoxy groups such as methoxy, ethoxy, propoxy, isopropoxy, butoxy, isobutoxy, sec butoxy, tert butoxy; Alkyl groups such as alkenyl groups such as alkaryl, aryl, butyr and oleyl, alkyl groups such as ethur, propiel and butur; alkoxyalkyl groups such as methoxymethyl, 2-methoxyethyl, 2-ethoxyethyl
- Polyether groups such as 2 m 2 2 3 2 2 m 2 2 or more), halogen-substituted derivatives such as fluoromethyl groups and the like, such as fluorine, and the like.
- the conductive polymer preferably contains a ⁇ -conjugated bond in the main chain.
- PEDOT polystyrene sulfonic acid
- a conductive film made of PEDOT-PSS can be produced, for example, as follows.
- Examples of commercially available products that can be used as the polythiophene-based conductive polymer include BaytronP manufactured by Starck Vittec Co., Ltd., Denatron # 5002LA manufactured by Nagase Sangyo Co., Ltd., and Orgacon S300 manufactured by Aggufage Balt.
- FIG. 2A a raw material liquid containing a conductive polymer on the entire surface of a base material 11 A transparent conductive film 123 having a substantially constant thickness is formed by applying a conductive substrate, etc. 110 is obtained (film formation process).
- the raw material solution can be applied by dip coating, spin coating, bar coating, or the like.
- the transparent conductive film 123 may be formed by a method other than coating.
- FIG. 3 shows an example of an ultraviolet absorption spectrum of a conductive polymer that can be used for the transparent conductive film 123.
- the absorbance of this conductive polymer is maximum (maximum) at a wavelength of about 240 nm, and is almost a steady value (background) in the range of 500 nm or more.
- the transparent conductive film 123 is irradiated with ultraviolet rays 14.
- a mask 13 having a non-transmissive part 131 and a transmissive part 132 is applied to the transparent conductive film 123, and ultraviolet rays 14 are irradiated through the mask 13 (ultraviolet irradiation step).
- the ultraviolet ray 14 one having an absorption wavelength at which the absorbance in this absorption spectrum is at least twice (preferably at least 2.5 times) the background is used.
- the absorbance at the knock ground is 0.18, so the absorbance corresponding to twice the knock ground is 0.36.
- the lower limit ⁇ 1 of the wavelength exhibiting absorption corresponding to an absorbance of 0.36 or more is 225 nm, and the upper limit 2 is 300 nm.
- the ultraviolet ray 14 one having a wavelength of 225 to 300 nm is used.
- the wavelength at which the absorbance is 2.5 or more times the background is 230 to 280 nm.
- the intensity of ultraviolet light 14 is preferably lOOmW or more, and the irradiation time is preferably 30 seconds or more.
- the portion irradiated with the ultraviolet light 14 through the transmission portion 132 becomes a second region 122, which is a high resistance region, with reduced conductivity.
- the portion where the ultraviolet ray 14 is blocked by the non-transmissive portion 131 (non-irradiated portion) becomes the first region 121 which is a low resistance region without causing a decrease in conductivity.
- the regions 121 and 122 When the irradiation direction of the ultraviolet light 14 is substantially perpendicular to the transparent conductive film 123, the regions 121 and 122 have a substantially rectangular cross section.
- the transparent conductive circuit board 111 shown in FIG. 1 is obtained.
- the ultraviolet ray 14 that irradiates the transparent conductive film 123 in the ultraviolet ray irradiation step includes a wavelength that exhibits an absorption at which the absorbance is twice or more that of the knock ground.
- the conductivity of the part can be efficiently reduced.
- the first region 121 and the second region 122 can be formed by short-time ultraviolet irradiation. Therefore, production efficiency can be increased and manufacturing costs can be reduced.
- the conductivity of the first region 121 which is a non-irradiated portion, is reduced by the ultraviolet ray 14. Can be prevented. Therefore, the conductivity of the wiring part 120 can be improved.
- the wiring portion due to bleeding or the like is compared with the conventional technique in which the wiring portion is formed by printing. It is possible to form the first region 121 having an accurate shape that does not cause formation failure.
- the conductivity of the wiring part 120 can be improved.
- the wiring portion 120 having a narrow width can be easily formed.
- the transparent conductive film 12 can be formed thin without reducing the conductivity of the first region 121.
- the light transmittance of the transparent conductive film 12 can be improved.
- the intramolecular binding energy is in the ultraviolet energy region, it can be considered that the binding force radicals are cleaved by irradiation with ultraviolet rays, and as a result, the conductivity is lowered.
- the conductive polymer preferably has an ultraviolet absorption maximum wavelength of 380 nm or less, preferably 330 nm or less.
- the wiring part 120 having an accurate shape (for example, a rectangular cross section) can be formed.
- the conductive polymer has an ultraviolet absorption maximum wavelength of 220 nm or more.
- the ultraviolet rays easily reach the deep part of the transparent conductive film.
- the temperature condition in this step can be set to, for example, 50 to 130 ° C.
- the treatment time is preferably 1 to 10 minutes.
- the mask 13 By curing the transparent conductive film 123, the mask 13 can be brought into contact with the transparent conductive film 12 in the ultraviolet irradiation process.
- the regions 121 and 122 can be formed corresponding to the shapes of the non-transmissive portion 131 and the transmissive portion 132 accurately.
- a display device such as an organic EL device in which a light emitting element (not shown) is provided on the transparent conductive circuit substrate 111 can be exemplified.
- the transparent conductive circuit board 111 can make the thickness of the transparent conductive film 12 uniform, the light transmittance of the transparent conductive film 12 can be made uniform.
- the transparent conductive circuit substrate 111 is used for a display device such as an organic EL device, display characteristics can be improved.
- a conductive layer (not shown) is provided on the transparent conductive circuit substrate 111 with a space therebetween, and the conductive layer is brought into contact with the wiring part 120 by pressing from above.
- a touch panel that can be used.
- Transparent conductive ink containing polythiophene-based conductive polymer (Nagase Sangyo Co., Ltd .: Denatron #) on a base material 11 made of PET film (Torayen Earth: Lumirror S10) with a length of 15 cm, width of 15 cm, and thickness of 188 m
- a transparent conductive film 123 having a strength of 5002 LA) was formed by dip coating, to obtain a conductive substrate 110.
- the transparent conductive film 123 was dried at 80 ° C. for 2 minutes and cured.
- the conductive polymer one having an ultraviolet absorption spectrum shown in FIG. 3 was used.
- the ultraviolet rays 14 were irradiated with light having a predetermined wavelength or less blocked using a cut filter. Irradiation intensity of the ultraviolet rays 14 was 500mWZcm 2.
- Table 1 shows the results of measuring the surface resistance of the part irradiated with ultraviolet light 14 over time.
- the surface resistance in the first region 121 was 800 ⁇ Z at all.
- a transparent conductive circuit substrate 111 was produced in the same manner as in Example 1-1 except that a cut filter having a different cutoff wavelength was used.
- Table 1 shows the results of measuring the surface resistance of the part irradiated with ultraviolet light 14 over time.
- the surface resistance in the first region 121 was 800 ⁇ Z.
- Example 1-1 Example 1-2
- Example IV-3 Comparative Example 1-1 Cut off by a cut filter
- Comparative Example 1-1 using ultraviolet rays having a wavelength exceeding 330 nm, it took a relatively long time for the resistance value to increase.
- the first region 121 and the second region 122 are formed in a short time by irradiating with ultraviolet rays having a wavelength (225 to 300 nm) showing absorption that is more than twice the absorbance power S background.
- FIG. 4 is a partial sectional view showing an example of the transparent conductive circuit board according to the second embodiment of the present invention.
- the transparent conductive circuit board 211 includes a transparent conductive film 22 containing a conductive polymer on a base material 21.
- the substrate 21 also has a transparent material, for example, polyethylene terephthalate (PET) force, and is formed in a plate shape or a film shape.
- PET polyethylene terephthalate
- the transparent conductive film 22 has a first region 221 and a second region 222 formed adjacent to the first region 221.
- the transparent conductive film 22 is made of a material containing a conductive polymer having a property of increasing the electrical resistance value when irradiated with ultraviolet rays.
- the first region 221 is a low resistance region having a relatively low electrical resistance value.
- the electric resistance value (surface resistance) of the first region 221 can be, for example, 10 3 ⁇ or less.
- the first region 221 is a wiring part 220 that constitutes a transparent conductive circuit.
- the shape of the first region 221 is not particularly limited, but can be a line having a certain width.
- the second region 222 is a high resistance region that has a higher electrical resistance value than the first region 221.
- the electric resistance value (surface resistance) of the second region 222 is preferably 10 4 times or more (preferably 10 5 times or more) the electric resistance value of the first region 221. Specifically, it can be 10 8 ⁇ or more.
- the electrical resistance of the second region 222, to a 10 4 times the electrical resistance of the first region 221 As a result, the insulation between the adjacent wiring parts 220 can be improved, and the conductivity of the wiring part 220 can be improved.
- the conductive polymer is preferably a polythiophene-based conductive polymer.
- the polythiophene-based conductive polymer for example, an undoped polymer having a main chain composed of a polythiophene-based high molecule represented by the formula (1) is doped with a halogen such as iodine or another oxidizing agent.
- a polymer obtained by partially oxidizing the polymer to form a cation structure can be used.
- R 2 can be selected independently of each other.
- the options are as follows: hydrogen atom; halogen atom such as fluorine, chlorine, bromine, iodine; cyano group; methyl, ethyl, propyl, butyl (n-butyl), pentyl (n-pentyl), hexyl, octyl, dodecyl Linear alkyl groups such as hexadecyl and octadecyl; branched alkyl groups such as isopyl pill, isobutyl, sec-butyl, tert-butyl, isopentyl, neopentyl, etc .; methoxy, ethoxy, propoxy, isopropoxy, butoxy, isobutoxy , Sec-butoxy, tert-butoxy and other linear or branched alkoxy groups; alkenyl groups such as bulle, probe, allyl,
- Polyether groups such as 2 m 2 2 3 2 2 m 2 2 or more); fluoromethyl groups, etc. Examples thereof include halogen-substituted derivatives.
- the conductive polymer preferably contains a ⁇ -conjugated bond in the main chain.
- PEDOT polystyrene sulfonic acid
- a conductive film made of PEDOT-PSS can be produced, for example, as follows.
- Examples of commercially available products that can be used as the polythiophene-based conductive polymer include BaytronP manufactured by Starck Vittec Co., Ltd., Denatron # 5002LA manufactured by Nagase Sangyo Co., Ltd., and Orgacon S300 manufactured by Aggufage Balt.
- a radical polymerization initiator is added to the transparent conductive film 22.
- the radical polymerization initiator is generally used for initiating radical polymerization, and has a function of generating radicals by energy such as light and initiating radical polymerization.
- radical polymerization initiator examples include azo compounds, organic peroxides, and inorganic peroxides.
- azo compounds examples include azoamide compounds, azobisisobutyryl-tolyl (AIBN), and diazoaminobenzene.
- organic peroxides examples include benzoyl peroxide (BPO) and diisopropyl peroxydicarbonate.
- Inorganic peroxides include persulfates and perchlorates.
- an azamide compound because of its high water solubility.
- the addition amount of the radical polymerization initiator is preferably 0.1% by mass or more. By setting the addition amount within this range, it is possible to increase the reaction rate at which the conductivity of the transparent conductive film 2 is reduced by ultraviolet rays. This addition amount is more preferably 0.5% by mass or more, and more preferably 1% by mass or more. Is preferred.
- the addition amount of the radical polymerization initiator is preferably 10% by mass or less because if the amount is too large, the above-described conductivity lowering reaction may not easily occur.
- a method for producing the transparent conductive circuit substrate 211 of the second embodiment of the present invention will be described.
- a raw material liquid containing a conductive polymer over the entire surface of a base material 21 Is applied to form a transparent conductive film 223 having a substantially constant thickness to obtain a conductive substrate 210 (film formation step).
- the raw material solution can be applied by dip coating, spin coating, bar coating, or the like.
- the transparent conductive film 223 may be formed by a method other than coating.
- the transparent conductive film 223 is irradiated with ultraviolet rays 24.
- the transparent conductive film 223 is provided with a mask 23 having a non-transmissive portion 231 and a transmissive portion 232, and ultraviolet rays 24 are irradiated through the mask 23 (ultraviolet irradiation step).
- the wavelength of the ultraviolet light 24 is, for example, 230 to 280 nm.
- the intensity of UV light 24 is preferably lOOmW or more, and the irradiation time is preferably 30 seconds or more.
- the portion irradiated with the ultraviolet ray 24 through the transmission portion 232 (irradiation portion) becomes a second region 222, which is a high resistance region, with reduced conductivity.
- the transparent conductive film 22 contains a radical polymerization initiator, the reactivity of the conductive polymer with respect to ultraviolet rays is high, and the reaction that lowers the conductivity is promoted.
- the first region 221 and the second region 222 can be formed by short-time ultraviolet irradiation. Therefore, it is possible to increase production efficiency and reduce manufacturing costs. In addition, since the first region 221 and the second region 222 can be formed by short-time ultraviolet irradiation, the first region 221 that is a non-irradiation portion can be prevented from being deteriorated by ultraviolet rays.
- the conductivity of the first region 221 (wiring portion 220) can be improved.
- the portion where the ultraviolet ray 24 is blocked by the non-transmissive portion 231 becomes the first region 221 which is a low-resistance region without causing a decrease in conductivity.
- the regions 221 and 222 have a substantially rectangular cross section.
- the transparent conductive circuit substrate 211 shown in FIG. 4 is obtained.
- the radical polymerization initiator can increase the reactivity of the conductive polymer with respect to ultraviolet rays, and therefore promotes the reaction of decreasing the conductivity even in the deep part of the transparent conductive film 22. can do.
- the first region 221 having an accurate shape for example, a rectangular cross section
- the shape of the first region 221 can be accurately formed in which the formation failure of the wiring part due to bleeding or the like does not occur as compared with the conventional product in which the wiring part is formed by printing. Therefore, the transparent conductive film 22 can be formed thin without reducing the conductivity of the first region 221.
- the light transmittance of the transparent conductive film 22 can be improved.
- the ultraviolet ray 24 is irradiated onto a part of the transparent conductive film 223, the irradiated portion is the second region 222, and the non-irradiated portion is the first region 221.
- the first region 221 and the second region 222 can be formed.
- the yield can be increased.
- the amount of waste liquid discharged can be reduced, which is also suitable from the viewpoint of environmental conservation.
- the intramolecular binding energy is in the ultraviolet energy region, it can be considered that the binding force radicals are cleaved by irradiation with ultraviolet rays, and as a result, the conductivity is lowered.
- the number of transparent conductive films may be plural. That is, a transparent conductive circuit board in which two or more transparent conductive films are provided on a substrate is also included in the scope of the present invention.
- the reactivity of the conductive polymer with respect to ultraviolet rays can be increased. Therefore, when a plurality of transparent conductive films are provided, the transparent conductive film on the lower side also has an accurate shape. A first region can be formed.
- the transparent conductive film 223 is dried and cured.
- the temperature condition in this step can be set to, for example, 50 to 130 ° C.
- the treatment time is preferably 1 to 10 minutes.
- the mask 23 can be brought into contact with the transparent conductive film 22 in the ultraviolet irradiation process.
- the regions 221 and 222 can be formed corresponding to the shapes of the non-transmissive portion 231 and the transmissive portion 232 accurately.
- a display device such as an organic EL device in which a light emitting element (not shown) is provided on the transparent conductive circuit substrate 211 can be exemplified.
- the transparent conductive circuit board 211 can make the thickness of the transparent conductive film 22 uniform, the light transmittance of the transparent conductive film 22 can be made uniform.
- the transparent conductive circuit substrate 211 is used for a display device such as an organic EL device, display characteristics can be improved.
- a conductive layer (not shown) is provided on the transparent conductive circuit board 211 with a space therebetween, and the conductive layer is brought into contact with the wiring part 220 by pressing from above.
- a touch panel that can be used.
- This raw material solution was applied to a PET film (made by Torayen Earth: Lumi, 15 cm long, 15 cm wide, and 188 ⁇ m thick).
- a transparent conductive film 223 was formed on the base material 1 made of a glass S10) by dip coating to obtain a conductive substrate 210.
- the transparent conductive film 223 was dried at 80 ° C. for 2 minutes and hardened.
- a transparent conductive circuit board 211 was obtained.
- the irradiation intensity of ultraviolet rays 24 was 500 mWZcm 2 .
- Tables 3 and 4 show the results of measuring the surface resistance of the part irradiated with ultraviolet light 24 over time.
- the surface resistance at the area where the UV light was applied was the same as the surface resistance at the start of irradiation.
- the resistance value increases in a short time by adding radical polymerization initiator. To do it.
- Table 2 also shows that the resistance value was obtained even when the transparent conductive film was thick by adding the radical polymerization initiator.
- the first region 221 and the second region 222 having a high resistance value ratio can be formed in a short time by using the radical polymerization initiator.
- FIG. 6 is a partial cross-sectional view showing an example of the transparent conductive circuit board according to the third embodiment of the present invention.
- the transparent conductive circuit board 311 includes a transparent conductive film 32 containing a conductive polymer on a base material 31.
- the substrate 31 also has a transparent material, for example, polyethylene terephthalate (PET) force, and is formed into a plate shape or a film shape.
- PET polyethylene terephthalate
- the transparent conductive film 32 has a material strength including a polythiophene-based conductive polymer having a property of increasing an electrical resistance value by irradiation with ultraviolet rays.
- the transparent conductive film 32 has a first region 321 and a second region 322 formed adjacent to the first region 321.
- the first region 321 is a low resistance region having a relatively low electrical resistance value.
- the electric resistance value (surface resistance) of the first region 321 can be, for example, 10 3 ⁇ or less.
- the first region 321 is a wiring part 320 constituting a transparent conductive circuit.
- the shape of the first region 321 is not particularly limited, but can be a line having a certain width.
- the second region 322 is a high-resistance region having a higher electrical resistance value than the first region 321.
- the electric resistance value (surface resistance) of the second region 322 is preferably 10 4 times or more (preferably 10 5 times or more) the electric resistance value of the first region 321. Specifically, it can be 10 8 ⁇ or more.
- the electrical resistance of the second region 322, by 10 4 times or more and to Rukoto electric resistance value of the first region 321, increasing the insulation between the adjacent wiring portion 320, the tooth forces is also conductive wiring part 320
- the property can be improved.
- Examples of the polythiophene-based conductive polymer include polythiophene-based high polymers represented by the formula (1).
- An undoped polymer having a main chain composed of molecules is doped with a halogen such as iodine, or other oxidizing agent, whereby the polymer is partially oxidized to form a cation structure.
- a halogen such as iodine, or other oxidizing agent
- the groups RR 2 can be selected independently of each other.
- the options are as follows: hydrogen atom; halogen atom such as fluorine, chlorine, bromine, iodine; cyano group; methyl, ethyl, propyl, butyl (n-butyl), pentyl (n-pentyl), hexyl, octyl, dodecyl Linear alkyl groups such as hexadecyl and octadecyl; branched alkyl groups such as isopyl pill, isobutyl, sec-butyl, tert-butyl, isopentyl, neopentyl, etc .; methoxy, ethoxy, propoxy, isopropoxy, butoxy, isobutoxy , Sec-butoxy, tert-butoxy and other linear or branched alkoxy groups; alkenyl groups such as bur, probe, allyl, butyl,
- Polyether groups such as 2 m 2 2 3 2 2 m 2 2 or more), halogen-substituted derivatives such as fluoromethyl groups and the like, such as fluorine, and the like.
- the conductive polymer preferably contains a ⁇ -conjugated bond in the main chain.
- polystyrene-based conductive polymer 3 4-ethylenedioxythiophene ( ⁇ DOT) is preferred.
- PEDOT was doped with polystyrene sulfonic acid (PSS)
- a conductive film made of PEDOT-PSS can be produced, for example, as follows.
- Examples of commercially available products that can be used as the polythiophene-based conductive polymer include BaytronP manufactured by Starck Vittec Co., Ltd., Denatron # 5002LA manufactured by Nagase Sangyo Co., Ltd., and Orgacon S300 manufactured by Aggufage Balt.
- the base material 31 contains polythiophene-based conductive polymer over the entire surface.
- a transparent conductive film 323 having a substantially constant thickness is formed by applying a raw material liquid or the like to obtain a conductive substrate 310 (film formation process).
- the raw material solution can be applied by dip coating, spin coating, bar coating, or the like.
- the transparent conductive film 323 may be formed by a method other than coating.
- the transparent conductive film 323 is irradiated with ultraviolet rays 34.
- a mask 33 having a non-transmissive portion 331 and a transmissive portion 332 is applied to the transparent conductive film 323, and ultraviolet rays 34 are irradiated through the mask 33 (ultraviolet irradiation step).
- the wavelength of the ultraviolet light 34 is, for example, 230 to 280 nm.
- the intensity of ultraviolet light 34 is preferably lOOmW or more, and the irradiation time is preferably 1 minute or more.
- the portion irradiated with the ultraviolet ray 34 through the transmission portion 332 becomes a second region 322, which is a high resistance region, with reduced conductivity.
- the portion where the ultraviolet ray 34 is blocked by the non-transmissive portion 331 does not cause a decrease in conductivity, and becomes the first region 321 that is a low resistance region.
- FIG. 8 shows an example of a change with time of the surface resistance values of the irradiated part and the non-irradiated part. As shown in this figure, the change in resistance is small in the non-irradiated part, whereas in the irradiated part, The resistance value gradually increases with the irradiation of the outside line 34.
- the regions 321, 322 have a substantially rectangular cross section.
- the transparent conductive circuit board 311 shown in FIG. 6 is obtained.
- the transparent conductive circuit board 311 includes a first region 321 (low resistance region) and a second region 322 (high resistance region) in which the transparent conductive film 32 becomes the wiring section 320! .
- the first region 321 having an accurate shape can be formed in which the formation failure of the wiring portion due to bleeding or the like does not occur, compared to the conventional product in which the wiring portion is formed by printing. Therefore, the conductivity of the wiring part 320 can be improved. In addition, the narrow wiring portion 320 can be easily formed.
- the transparent conductive circuit board 311 has a simple structure because both the first region 321 and the second region 322 are formed in the transparent conductive film 32. For this reason, manufacturing is easy and cost reduction is possible.
- the transparent conductive film 32 can be formed thin without reducing the conductivity of the first region 321.
- the light transmittance of the transparent conductive film 32 can be improved.
- the first region 321 and the second region 322 are both formed in the transparent conductive film 32 in the transparent conductive circuit substrate 311, the surface thereof becomes flat. For this reason, it is easy to make the wiring part 320 multi-layered compared to the conventional product in which the wiring part is formed by printing.
- a part of the transparent conductive film 323 is irradiated with the ultraviolet rays 34, the irradiated portion is the second region 322, and the non-irradiated portion is the first region 321, so that the first operation can be performed easily.
- One region 321 and a second region 322 can be formed.
- the yield can be increased.
- the amount of waste liquid discharged can be reduced, which is also suitable from the viewpoint of environmental conservation.
- polythiophene-based conductive polymers have an intramolecular bond energy of ultraviolet. Since it is in the energy region of the line, it can be considered that the bond is radically cleaved by irradiation with ultraviolet rays, and as a result, the conductivity is lowered.
- the temperature condition in this step can be set to, for example, 50 to 130 ° C.
- the treatment time is preferably 1 to 10 minutes.
- the mask 33 can be brought into contact with the transparent conductive film 32 in the ultraviolet irradiation step.
- the regions 321 and 322 can be formed corresponding to the shapes of the non-transmissive portion 331 and the transmissive portion 332 accurately.
- a display device such as an organic EL device in which a light emitting element (not shown) is provided on the transparent conductive circuit substrate 311 can be exemplified.
- the transparent conductive circuit board 311 can make the thickness of the transparent conductive film 32 uniform, the light transmittance of the transparent conductive film 32 can be made uniform.
- the transparent conductive circuit board 311 is used for a display device such as an organic EL device, display characteristics can be improved.
- a conductive layer (not shown) is provided on the transparent conductive circuit board 311 with a space therebetween, and the conductive layer is brought into contact with the wiring part 320 by pressing from above.
- a touch panel that can be used.
- a transparent conductive ink containing a polythiophene-based conductive polymer (Nagase Sangyo Co., Ltd .: Denatron #)
- a transparent conductive film 323 having a strength of 5002LA) was formed by dip coating to obtain a conductive substrate 310.
- the transparent conductive film 323 was dried at 80 ° C. for 2 minutes and cured.
- the irradiation intensity of ultraviolet ray 34 was 500 mWZcm 2 and the irradiation time was 15 minutes.
- the transparent conductive circuit board 311 was evaluated for appearance, surface resistance, and light transmittance. The evaluation results are shown in Table 1.
- Example 3-1 Using a paste containing a polythiophene-based conductive polymer, a wiring part was formed on a substrate by screen printing to obtain a transparent conductive circuit board. Other conditions were the same as in Example 3-1.
- the transparent conductive circuit board was evaluated for appearance, surface resistance, and light transmittance. Table 4 shows the evaluation results.
- Example 3-1 in which the first region 321 and the second region 322 are formed in the transparent conductive film 32 and the first region 321 is the wiring section 320, wiring is performed by a printing method. Compared to Comparative Example 31 in which the portion is formed, it can be seen that the defective shape of the wiring portion 320 does not occur and good conductivity is obtained.
- Example 3-1 a result superior to Comparative Example 3-1 was also obtained in terms of light transmittance.
- Example 3-2 A conductive substrate 310 was produced in the same manner as in Example 3-1.
- a transparent conductive circuit board 311 was produced in the same manner as in Example 3-2 except that the ultraviolet irradiation time was 3 minutes, 5 minutes, or 10 minutes. Table 5 shows the evaluation results.
- the method for manufacturing an electronic device according to the present invention can give good conductivity to a transparent conductive film, and therefore can be applied to a precise electronic device such as an organic EL device, a touch panel, and an integrated circuit.
Abstract
Description
Claims
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
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CA002592277A CA2592277A1 (en) | 2004-12-27 | 2005-12-27 | Electronic device and manufacturing method therefor |
KR1020077014330A KR101177087B1 (ko) | 2004-12-27 | 2005-12-27 | 전자 디바이스 및 그 제조방법 |
CN2005800439836A CN101084558B (zh) | 2004-12-27 | 2005-12-27 | 电子装置及其制造方法 |
EP05822381A EP1835513A4 (en) | 2004-12-27 | 2005-12-27 | ELECTRONIC DEVICE AND METHOD FOR THE PRODUCTION THEREOF |
US11/768,399 US8018146B2 (en) | 2004-12-27 | 2007-06-26 | Electronic device and manufacturing method therefor |
US12/548,262 US8007335B2 (en) | 2004-12-27 | 2009-08-26 | Manufacturing method for electronic device |
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JP2004376276A JP4583917B2 (ja) | 2004-12-27 | 2004-12-27 | 電子デバイスの製造方法および透明導電回路基板の製造方法 |
JP2004376277A JP2006185675A (ja) | 2004-12-27 | 2004-12-27 | 電子デバイスおよびその製造方法 |
JP2004376275A JP2006185673A (ja) | 2004-12-27 | 2004-12-27 | 電子デバイスの製造方法 |
JP2004-376277 | 2004-12-27 | ||
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US11/768,399 Continuation US8018146B2 (en) | 2004-12-27 | 2007-06-26 | Electronic device and manufacturing method therefor |
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WO2006070801A1 true WO2006070801A1 (ja) | 2006-07-06 |
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PCT/JP2005/023898 WO2006070801A1 (ja) | 2004-12-27 | 2005-12-27 | 電子デバイスおよびその製造方法 |
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US (2) | US8018146B2 (ja) |
EP (1) | EP1835513A4 (ja) |
KR (1) | KR101177087B1 (ja) |
CA (1) | CA2592277A1 (ja) |
WO (1) | WO2006070801A1 (ja) |
Cited By (3)
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WO2009003776A1 (de) * | 2007-06-29 | 2009-01-08 | Evonik Degussa Gmbh | Verfahren zum herstellen einer aus leitfähigen polymeren bestehenden speicherstruktur |
US8350238B2 (en) | 2004-12-30 | 2013-01-08 | E.I. Du Pont De Nemours And Company | Device patterning using irradiation |
WO2014045541A1 (ja) * | 2012-09-19 | 2014-03-27 | アルプス電気株式会社 | 静電容量式センサ |
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JP5250981B2 (ja) * | 2007-02-21 | 2013-07-31 | セイコーエプソン株式会社 | 有機デバイスの製造方法並びに電子機器 |
JP5063500B2 (ja) | 2008-02-08 | 2012-10-31 | 富士通コンポーネント株式会社 | パネル型入力装置、パネル型入力装置の製造方法、及びパネル型入力装置を備えた電子機器 |
US8257830B2 (en) * | 2008-07-31 | 2012-09-04 | Ppg Industries Ohio, Inc. | Electrically conductive protective liner and method of manufacture |
US20100028684A1 (en) * | 2008-07-31 | 2010-02-04 | Jose Mariscal | Conductive multilayer stack |
DE102009022902B4 (de) | 2009-03-30 | 2023-10-26 | Pictiva Displays International Limited | Organisches optoelektronisches Bauteil und Verfahren zur Herstellung eines organischen optoelektronischen Bauteils |
US9309589B2 (en) | 2011-06-21 | 2016-04-12 | Ppg Industries Ohio, Inc. | Outboard durable transparent conductive coating on aircraft canopy |
CN103649832A (zh) * | 2011-07-08 | 2014-03-19 | 赫劳斯贵金属有限两和公司 | 制备层状体的方法和可由其获得的层状体 |
US9546300B2 (en) | 2012-09-28 | 2017-01-17 | Ppg Industries Ohio, Inc. | Coating composition for coated substrates and methods of making the same |
US8956730B2 (en) | 2012-09-28 | 2015-02-17 | Ppg Industries Ohio, Inc. | Conductive multilayer stack, coated substrates including the same, and methods of making the same |
US9326327B2 (en) | 2013-03-15 | 2016-04-26 | Ppg Industries Ohio, Inc. | Stack including heater layer and drain layer |
EP2873520B1 (en) * | 2013-10-15 | 2017-08-02 | Heraeus Deutschland GmbH & Co. KG | Security feature based on a polymer layer comprising a first area and a further area |
CN105813835B (zh) * | 2013-10-15 | 2018-04-17 | 贺利氏德国有限两合公司 | 基于包含第一区域和另外区域的聚合物层的安全结构体 |
US9545042B2 (en) | 2014-03-14 | 2017-01-10 | Ppg Industries Ohio, Inc. | P-static charge drain layer including carbon nanotubes |
DE102015103651B4 (de) * | 2015-03-12 | 2017-11-16 | Osram Oled Gmbh | Verfahren zur Herstellung von elektrisch leitenden Strukturen und organische Leuchtdiode |
US10442549B2 (en) | 2015-04-02 | 2019-10-15 | Ppg Industries Ohio, Inc. | Liner-type, antistatic topcoat system for aircraft canopies and windshields |
DE102019107423B4 (de) * | 2019-03-22 | 2021-04-22 | Pas Deutschland Gmbh | Verfahren zur Herstellung einer Sensorvorrichtung, Sensorvorrichtung, Bedienblende und Haushaltsgerät |
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2005
- 2005-12-27 EP EP05822381A patent/EP1835513A4/en not_active Withdrawn
- 2005-12-27 WO PCT/JP2005/023898 patent/WO2006070801A1/ja active Application Filing
- 2005-12-27 CA CA002592277A patent/CA2592277A1/en not_active Abandoned
- 2005-12-27 KR KR1020077014330A patent/KR101177087B1/ko not_active IP Right Cessation
-
2007
- 2007-06-26 US US11/768,399 patent/US8018146B2/en not_active Expired - Fee Related
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2009
- 2009-08-26 US US12/548,262 patent/US8007335B2/en not_active Expired - Fee Related
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JP2003331662A (ja) * | 2002-05-10 | 2003-11-21 | Seiko Epson Corp | 薄膜のパターニング方法、有機エレクトロルミネッセンス装置、回路基板及び電子機器 |
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Cited By (3)
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US8350238B2 (en) | 2004-12-30 | 2013-01-08 | E.I. Du Pont De Nemours And Company | Device patterning using irradiation |
WO2009003776A1 (de) * | 2007-06-29 | 2009-01-08 | Evonik Degussa Gmbh | Verfahren zum herstellen einer aus leitfähigen polymeren bestehenden speicherstruktur |
WO2014045541A1 (ja) * | 2012-09-19 | 2014-03-27 | アルプス電気株式会社 | 静電容量式センサ |
Also Published As
Publication number | Publication date |
---|---|
KR101177087B1 (ko) | 2012-08-24 |
EP1835513A4 (en) | 2011-11-09 |
CA2592277A1 (en) | 2006-07-06 |
KR20070089822A (ko) | 2007-09-03 |
US20070249088A1 (en) | 2007-10-25 |
EP1835513A1 (en) | 2007-09-19 |
US20090317563A1 (en) | 2009-12-24 |
US8007335B2 (en) | 2011-08-30 |
US8018146B2 (en) | 2011-09-13 |
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