Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
  • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
  • B23P19/02—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for connecting objects by press fit or for detaching same
• • G—PHYSICS
  • G02—OPTICS
  • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
  • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
  • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
  • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
  • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
  • G02F1/1333—Constructional arrangements; Manufacturing methods
  • G02F1/1345—Conductors connecting electrodes to cell terminals
  • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
  • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
  • H05K13/04—Mounting of components, e.g. of leadless components

Definitions

• the present invention relates to a component assembling apparatus and a method for assembling components in which a circuit board is connected to a display panel via electronic components.
• a liquid crystal drive IC is first mounted on a predetermined side of the four sides of the outer periphery of the liquid crystal panel 200 by an outer lead bonder.
• an electronic component 202 such as a tab (TAB: Tape Automated Bonding) as a component 2 is mounted via a tape-like anisotropic conductive member 204 to form a liquid crystal panel 200 with the electronic component.
• the circuit board 203 as the first component is electrically connected to the portion of the electronic component 202 of the liquid crystal panel 200 with electronic components, and the liquid crystal panel 200 is assembled. It is done to meet.
• an anisotropic conductive member 204 is used as the circuit board 203 and the electronic component 202 are connected to the electronic component 202 and the liquid crystal panel 200 as shown in FIG. 5C.
• An assembling apparatus used when performing such an operation has a first stage that conveys the liquid crystal panel 200 with electronic components.
• a liquid crystal panel 200 with electronic components is supplied to the first stage, and the liquid crystal panel 200 is conveyed to the crimping section.
• the crimping section has a backup tool and a pressure tool provided above the backup tool so as to be driven up and down.
• the circuit board 203 is conveyed by the second stage.
• the circuit board 203 is positioned and held by protruding one end to which the electronic component 202 is connected.
• a tape-like anisotropic conductive member 204 is attached to the upper surface of the one end.
• the second stage conveys the circuit board 203 to the backup tool, and places one end to which the anisotropic conductive member 204 is attached on the upper end surface of the backup tool.
• the LCD panel 200 becomes a backup tool by the first stage. The one end portion of the electronic component 202 connected to one side of the liquid crystal panel 200 is superposed on the portion where the anisotropic conductive member 204 of the circuit board 203 is provided.
• the anisotropic conductive member 204 When the anisotropic conductive member 204 is pressurized and heated with a pressure tool, it is inevitable that considerable time is required until the anisotropic conductive member 204 is melted and force-cured.
• the second stage that conveys the circuit board 203 to the backup tool continues to hold the circuit board 203 in a state of being positioned with respect to the backup tool. Therefore, after the circuit board 203 is connected and fixed to the electronic component 202, the next step is performed until the circuit board 203 is unloaded with the liquid crystal panel 200 through the electronic component 202 by the first stage. I ca n’t move.
• the present invention provides an apparatus for assembling a part capable of transporting the next first part to a backup tool while pressurizing the first part and the second part, and It is to provide an assembly method.
• one end of the first part is positioned on the backup tool, the one end of the second part is superposed on the upper surface of the one end, and the superposed part is pressurized with a pressure tool.
• Conveying means for conveying the first part to the backup tool
• the present invention is a method for assembling a component in which one end of a first component is positioned on a backup tool, and the one end of the second component is connected to the upper surface of the one end.
• FIG. 1 is a side view showing a schematic configuration of an assembling apparatus according to an embodiment of the present invention.
• FIG. 2 is a perspective view showing a conveying means for conveying a circuit board and a positioning means provided in the backup tool.
• FIG. 3A is an explanatory diagram of a state in which the circuit board held on the holding table is positioned with respect to the backup tool.
• FIG. 3B is an explanatory view showing a state in which the holding table is retracted leaving the positioned substrate.
• Fig. 3C is an explanatory diagram of a state where one end of the circuit board is supported by a backup tool.
• FIG. 4A is an explanatory diagram of a state in which one end of an electronic component is in contact with the upper surface of one end of a circuit board supported by backup.
• FIG. 4B is an explanatory diagram of a state in which the circuit board supported by the backup and the overlapped portion of the electronic component are pressed with a pressure tool.
• FIG. 4C is an explanatory diagram showing a state in which the liquid crystal panel to which the circuit board is connected is retracted and the next circuit board is supplied.
• FIG. 5A is a plan view of a state in which electronic components are connected to a liquid crystal panel.
• FIG. 5B is a plan view in which a circuit board is connected to an electronic component connected to a liquid crystal panel.
• FIG. 5C is a side view in which a circuit board is connected to an electronic component connected to a liquid crystal panel.
• FIG. 1 is a schematic configuration diagram of an assembling apparatus according to the present invention, which includes a base 1.
• the base 1 is provided with a table unit 2.
• the table unit 2 is provided on the base 1 so as to be movable along the X direction, and has an X table 3.
• the X table 3 is driven in the X direction indicated by an arrow in the figure by an X drive source 4 provided at one end of the base 1.
• a Y table 5 is provided so as to be movable along the Y direction intersecting the X direction.
• the Y table 5 is driven in the Y direction by a Y drive source 6 provided on one side of the X table 3!
• the Y table 5 is provided with a ⁇ table 7 as a first stage so as to be rotatable on a horizontal plane.
• the ⁇ table 7 is driven in the rotational direction by a ⁇ drive source 8 provided on one side of the Y table 5. Therefore, the ⁇ table 7 can be driven in the X, Y and ⁇ directions.
• the ⁇ table 7 is supplied with a liquid crystal panel 200 in which an electronic component 202 as a second component is connected and fixed to one side surface by an anisotropic conductive member 204, For example, it is held and fixed so as not to move by means such as vacuum suction.
• the liquid crystal panel 200 also projects the outer peripheral surface force of the ⁇ table 7 at the peripheral portion including one side to which the electronic component 202 is connected.
• a circuit board 203 which is a first component, is connected and fixed to the electronic component 202 by a crimping portion 11 as described later.
• the crimping part 11 has a long and plate-like backup tool 12 along the Y direction.
• the backup tool 12 can be driven in the Z direction, which is the vertical direction, by the first Z drive source 13.
• a first heater 14 is built in the upper part of the backup tool 12.
• the lower end surface is the upper end surface of the backup tool 12.
• a pressurizing tool 15 is disposed so as to face the surface.
• the pressurizing tool 15 is provided with a second heater 16 at the lower end, and is driven by a second Z drive source 17 in the Z direction indicated by the arrow in the drawing, that is, in the vertical direction. ! /
• the circuit board 203 and the electronic component 202 are superposed on the upper end surface of the backup tool 12 via the anisotropic conductive member 204, and the overlapped portion is pressurized with the pressure tool 15.
• the anisotropic conductive member 204 can be melted and cured to connect and fix the circuit board 203 and the electronic component 202.
• the circuit board 203 is transported to the backup tool 12 by a transport table 21 that constitutes transport means.
• the transfer table 21 is provided with one end portion along the X direction fixed to the upper end surface of the movable body 22 having a side-faced force-like shape.
• a pair of sliders 23 are provided at both ends in the Y direction intersecting the X direction on the lower end surface of the movable body 22, and these sliders 23 are movably engaged with the pair of guide rails 25. .
• the guide rail 25 is provided on the base 1 along the X direction via a mount 24.
• the movable body 22 is driven to reciprocate along the X direction.
• a driving means for reciprocatingly driving the movable body 22 along the X direction a screw shaft or cylinder that is rotationally driven by a driving source may be used, but in this embodiment, it is arranged on the guide rail 25 at predetermined intervals.
• the motor is driven by a large number of magnets and a linear motor having a force with an electromagnetic coil (both not shown) provided on the slider 23.
• a pair of rectangular recesses 26 are formed at both end portions in the width direction of one end portion of the transfer table 21 protruding from one side force of the movable body 22 so as to open to the end surfaces. ing.
• the circuit board 203 is supplied and mounted as shown by a chain line in FIG. One end of the circuit board 203 is supplied with the end surface force of the transfer table 21 protruding, and in this state, the circuit board 203 is pressed and held by the three holding members 27 in an inertial manner.
• a tape-shaped anisotropic conductive member 204 is attached in advance to the upper surface of one end of the circuit board 203 over the entire length in the width direction.
• the holding member 27 is bent by an elastic band plate, and the front end elastically presses the upper surface of the circuit board 203, and the rear end is a side surface of the movable body 22.
• the holding member 27 rises as shown by a chain line in FIG.
• the circuit board 203 is released from the state of being separated from the circuit board 203. Thereby, the circuit board 203 can be attached to and detached from the transfer table 21.
• a pair of second Z cylinders 31 having an axis line perpendicular to each other are spaced at intervals corresponding to the pair of recesses 26 formed in the transfer table 21. Is provided.
• a receiving member 30 is attached to the rod 31a of the second Z cylinder 31 with its upper surface horizontal. The receiving member 30 is rectangular and is sized to enter a recess 26 formed in the transport table 21.
• a pair of Y cylinders 32 each having a shaft edge along the Y direction are provided at both ends outside the pair of second Z cylinders 31.
• An L-shaped Y movable member 33 is slidably provided on the upper surface of the Y cylinder 32, and one side of the Y movable member 33 is connected to a rod (not shown) of the Y cylinder 32.
• a third Z cylinder 34 is provided with its axis perpendicular.
• One end of a presser member 35 having a crank-like side surface is attached and fixed to the rod 34a of the third Z cylinder 34. Therefore, the pair of pressing members 35 can be driven in the Y direction and driven in the Z direction, which are close to each other.
• the shape of the presser member 35 is a crank shape, when the pair of presser members 35 are driven in the approaching Y direction, they are supplied onto the backup tool 12 by the vertical intermediate side of the pair of presser members 35. Press both ends of the printed circuit board 203 so that the circuit board 203 faces the Y direction.
• the other horizontal side of the pressing member 35 is engaged with the upper surfaces of both end portions of the circuit board 203.
• the pressurizing tool 15 that pressurizes and heats the overlapping portion of the circuit board 203 and the electronic component 202 rises
• the electronic component 202 adheres to the pressurizing tool 15, and If the circuit board 203 is to rise through the electronic component 202, the circuit board 203 is prevented from engaging and rising. Accordingly, the electronic component 202 is peeled off from the pressing tool 15.
• the intermediate side of the pressing member 35 is a positioning part that positions the circuit board 203 in the Y direction, and the other side is a holding part that prevents the circuit board 203 from rising together with the electronic component 202.
• a pair of receiving members 30 provided on the side surfaces of the backup tool 12 are positioned opposite to a pair of recesses 26 formed open on the end surface of the transfer table 21. . That is, the pair of receiving members 30 are opposed to the lower surface of the portion located in the recess 26 of the circuit board 203.
• the circuit board 203 has one end portion from which the end surface force of the transfer table 21 protrudes, that is, the lower surface of the end portion where the anisotropic conductive member 204 is attached to the upper surface is the upper end surface of the backup tool 12. Positioned to be located above. That is, the circuit board 203 is positioned in the X direction by the transport tape 21.
• the second Z cylinder 31 and the third Z cylinder 34 are operated, and the receiving member 30 and The presser member 35 is raised.
• the receiving member 30 supports the lower surface of the circuit board 203, and the other end of the pressing member 35 is substantially the same height as the circuit board 203.
• the Y cylinder 32 is actuated to drive the pair of pressing members 35 in the Y direction approaching each other, and press and hold both ends of the circuit board 203 in the longitudinal direction along the Y direction.
• the circuit board 203 is positioned in the Y direction by the pressing member 35.
• the rod 29a of the first Z cylinder 29 is driven in the protruding direction.
• the holding member 27 rises as shown by a chain line in FIG. 1 to release the holding state of the circuit board 203.
• the second Z cylinder 31 and the third Z cylinder 34 operate to support the lower surface of the circuit board 203.
• the pair of receiving members 30 and the pair of pressing members 35 supporting both ends in the width direction of the circuit board 203 are simultaneously lowered.
• the anisotropic conductive member 204 is adhered to the upper surface of the circuit board 203 and is supported by the upper end surface of the lower surface force backup tool 12 at one end.
• the table unit 2 is driven in a direction approaching the backup tool 12 in the X direction.
• One end of the liquid crystal panel 200 to which the electronic component 202 is connected is imaged by a camera (not shown) at a predetermined position in the X direction.
• the X table 5, Y table 5 and ⁇ table 7 are driven based on the imaging result, and one end of the electronic component 202 is positioned on the upper surface of one end of the circuit board 203 positioned on the backup tool 12. Positioned to polymerize through a forceful interval.
• the backup tool 12 is driven in the upward direction by the first Z drive source 13.
• the receiving member 30 and the holding member 35 provided integrally with the backup tool 12 are lifted together with the backup tool 12 while holding the circuit board 203, the circuit board as shown in FIG. 4A.
• One end of the electronic component 202 is in contact with the anisotropic conductive member 204 provided at one end of the 203.
• the receiving member 30 and the holding member 35 are provided integrally with the backup tool 12, even if the knock-up tool 12 is raised, the circuit board 203 and the backup tool 12 are in the X and Y directions. The relative position does not shift.
• the pressurizing tool 15 is moved downward by the second Z drive source 17. Driven.
• the overlapping partial force of the circuit board 203 and the electronic component 202 is pressurized and heated by the S backup tool 12 and the pressure tool 15, so that the anisotropic conductive member 204 is melted and cured, and the circuit board 203 is It is fixedly connected to the part 202.
• both ends of the circuit board 203 are held by the other side of the crank-shaped pressing member 35 so as not to float upward. For this reason, even when the electronic component 202 rises together with the pressurizing tool 15, the electronic component 202 can be peeled from the pressurizing tool 15 by the holding force of the pressing member 35.
• the assembling apparatus having such a configuration, when the pressure bonding between the circuit board 203 and the electronic component 202 by the pressing tool 15 is completed, the next circuit board 203 is transferred to the backup tool with almost no waiting time. Since it can be supplied to 12, the cycle time can be shortened.
• the transfer table 21 that constitutes a transfer means for transferring the circuit board 203, and the receiving member 30 and the presser that position and hold the circuit board 203 transferred by the transfer table 21 with respect to the backup tool 12.
• the positioning means consisting of member 35 was separated.
• the transfer table 21 delivers the circuit board 203 to the receiving member 30, this The transfer table 21 can be retracted freely. That is, while the circuit board 203 and the electronic component 202 are being crimped by the pressurizing tool 15, the transfer table 21 is returned to the supply section of the circuit board 203 and a new circuit board 203 is supplied to the transfer table 21 It is possible to wait in the vicinity of the knock-up tool 12 in parallel.
• the cycle time can be shortened by the time required to supply a new circuit board 203 to the transfer table 21 by the supply unit and to transfer the circuit board 203 to the vicinity of the backup tool 12 by the transfer table 21. It becomes.
• the first and second components are the circuit board and the electronic component.
• the first part is a liquid crystal panel
• the second part is an electronic part.
• one end of two parts is superposed, and the superposed part is pressurized and pressed. If so, the present invention can be applied.
• the second Z cylinder, the Y cylinder, and the third Z cylinder for driving the receiving member and the pressing member constituting the positioning means may be provided on the force base provided on the side surface of the backup tool. Good.
• the conveyance of the first part with respect to the knock-up tool and the positioning and holding of the first part with respect to the backup tool can be performed separately, the first part is connected to the second part. In the meantime, the next first part can be transported to the backup tool and put on standby.

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• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Nonlinear Science (AREA)
• Mechanical Engineering (AREA)
• Liquid Crystal (AREA)
• Chemical & Material Sciences (AREA)
• Mathematical Physics (AREA)
• Crystallography & Structural Chemistry (AREA)
• Microelectronics & Electronic Packaging (AREA)
• General Physics & Mathematics (AREA)
• Optics & Photonics (AREA)
• Manufacturing & Machinery (AREA)
• Devices For Indicating Variable Information By Combining Individual Elements (AREA)
• Automatic Assembly (AREA)

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• 2004
  • 2004-12-09 JP JP2004357022A patent/JP4627654B2/ja active Active
• 2005
  • 2005-09-13 KR KR1020077012474A patent/KR100890925B1/ko active IP Right Grant
  • 2005-09-13 CN CNB2005800419813A patent/CN100519059C/zh active Active
  • 2005-09-13 WO PCT/JP2005/016790 patent/WO2006061933A1/ja active Application Filing

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