WO2006054473A1 - 加熱圧着用複合シート及びその製造方法 - Google Patents
加熱圧着用複合シート及びその製造方法 Download PDFInfo
- Publication number
- WO2006054473A1 WO2006054473A1 PCT/JP2005/020575 JP2005020575W WO2006054473A1 WO 2006054473 A1 WO2006054473 A1 WO 2006054473A1 JP 2005020575 W JP2005020575 W JP 2005020575W WO 2006054473 A1 WO2006054473 A1 WO 2006054473A1
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- WIPO (PCT)
- Prior art keywords
- composite sheet
- heat
- metal foil
- thickness
- rubber layer
- Prior art date
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/06—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of natural rubber or synthetic rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/04—Layered products comprising a layer of natural or synthetic rubber comprising rubber as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B25/00—Layered products comprising a layer of natural or synthetic rubber
- B32B25/20—Layered products comprising a layer of natural or synthetic rubber comprising silicone rubber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
- B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/107—Ceramic
- B32B2264/108—Carbon, e.g. graphite particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/10—Properties of the layers or laminate having particular acoustical properties
- B32B2307/102—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/202—LCD, i.e. liquid crystal displays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
- B32B2457/204—Plasma displays
Definitions
- the present invention is a composite sheet for thermocompression bonding, which is used for bonding by heating and pressure bonding of electronic 'electronic device parts, particularly liquid crystal displays, plasma displays, etc., and for transferring the heat of a thermocompression bonding plate to a pressure-bonded body, And a method of manufacturing the same.
- thermocompression bonding operation using the apparatus shown in FIG. 4 is performed according to the process shown in FIG.
- This process includes: 1) panel transfer step for transferring the liquid crystal panel 1, 2) temporary pressure bonding step for temporarily attaching the anisotropic conductive film 2 (ACF) to the electrode forming portion la of the liquid crystal panel 1, 3) TAB3 (or CO2) G) Mounting process for mounting at bonding position 4) A main pressure bonding process with anisotropic conductive film 2
- Typical films (including sheets, etc.) and composite sheets used in this process are shown in FIGS. 5 to 7. At present, thermal compression methods using these films and the like are being performed.
- the electrode 3 a of the TAB 3 located at the upper and lower positions is electrically connected to the electrode la of the liquid crystal panel 1.
- FIG. 5 What is shown in FIG. 5 is a composite sheet obtained by integrating a PTFE film 21 or a metal foil with a fluorine resin (see, for example, Patent Document 1).
- FIG. 6 shows a combination of a PTFE film 21 and a silicone rubber sheet 22, or a composite sheet in which the PTFE film 21 and a silicone rubber sheet 22 are integrated (eg, see Patent Document 2). .
- FIG. 7 What is shown in FIG. 7 is a composite sheet in which a polyimide film 23, a silicone rubber sheet 22 and a glass cloth impregnated cloth 24 are combined or integrated.
- the type shown in FIG. 5 can not be used for large-sized parts because the type of the electronic device part becomes large as in recent years and unevenness in contact during heating and pressure bonding can occur. Re, the fault
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-100807
- Patent Document 2 Japanese Patent Application Laid-Open No. 5-315401
- an object of the present invention is to provide a composite sheet for thermocompression bonding, which has good cushioning properties, thermal conductivity and releasability, and is less likely to cause thermal deformation and interlaminar peeling, and a method for producing the same. Means to solve the problem
- the inventors of the present invention have conducted intensive studies to achieve the above object, and by setting the thickness of each layer to a predetermined range while bonding and integrating a release layer and a rubber layer via a metal foil. It has been found that the above object can be achieved, and the present invention has been completed.
- the composite sheet for heat and pressure bonding of the present invention comprises a metal foil, a release layer having a thickness of 3 to 20 ⁇ m provided on one surface side thereof and containing a fluorine-based resin, and the metal And a thermally conductive rubber layer having a thickness of 30 to 200 ⁇ m provided on the other side of the foil.
- the rubber layer preferably contains silicone rubber and metal compound particles.
- the silicone rubber has good heat resistance, and the thermal conductivity can be improved by the inclusion of metal compound particles.
- the composite sheet for heat and pressure bonding of the present invention is excellent in the antistatic function because metal foil is used, but in order to further improve this function, the carbon black may be added to the release layer. Can be added to improve the antistatic function.
- the antistatic function can effectively prevent damage to electronic parts, etc. due to static electricity, and problems caused by the adhesion of dust.
- a dispersion containing a fluorine-based resin is applied to one side of a metal foil, and the dispersion solvent is evaporated and removed, and then fired.
- a step of forming a release layer having a thickness of 3 to 20 / m, that a step of forming a thermally conductive rubber layer of the other thickness on the side of 30 to 200 beta m of the metal foil It features.
- thermocompression bonding which is excellent in cushioning properties, thermal conductivity and releasability as described above, and hardly causes thermal deformation and delamination.
- release layer and the rubber layer are formed on the surface of the metal foil by the above method, the adhesion between the layers can be further enhanced.
- FIG. 1 is a cross-sectional view showing an example of a composite sheet for heat and pressure bonding according to the present invention.
- FIG. 2 A schematic configuration view showing an example of an apparatus used for producing the composite sheet for heat and pressure bonding of the present invention.
- FIG. 3 A process chart showing an example of a manufacturing process using conventional ACF
- FIG. 4 A perspective view showing an example of the heat and pressure bonding process of the manufacturing process using the conventional ACF
- FIG. 5 A perspective view showing an example of the heat and pressure bonding process of the manufacturing process using the conventional ACF
- FIG. 6 A perspective view showing an example of the heat and pressure bonding process of the manufacturing process using the conventional ACF
- FIG. 7 A perspective view showing an example of a heat and pressure bonding process of a manufacturing process using conventional ACF
- FIG. 8 A schematic configuration diagram showing an example of a heat and pressure bonding apparatus used in the evaluation of the embodiment etc.
- FIG. 1 is a cross-sectional view showing an example of the composite sheet for heat and pressure bonding of the present invention.
- FIG. 2 is a schematic configuration view showing an example of an apparatus used for producing the composite sheet for heat and pressure bonding of the present invention.
- the composite sheet for heat and pressure bonding of the present invention is provided on the other side of the metal foil 12, the release layer 11 provided on one side thereof, and the other side of the metal foil 12. And a thermally conductive rubber layer 13.
- the releasing layer 11 contains a fluorine-based resin.
- a fluorine resin for example, polytetrafluoroethylene (PTFE), tetrafluoroethylene / hexafluoropropylene copolymer (FEP), tetrafluoroethylene / perfluoroalkyl vinyl ether, co-polymer Polymer (PFA), polyvinylidene fluoride and the like can be mentioned.
- the fluorine-based resin may have an antistatic function by adding a conductive substance such as carbon black or metal powder.
- a conductive substance such as carbon black or metal powder.
- the amount of addition of the conductive substance is preferably 5 to 20% by weight in the release layer 11.
- carbon black furnace black, channel black, thermal black, acetylene black etc. can be used.
- the thickness of the release layer 11 is 3 to 20 ⁇ , preferably 5 to 10 ⁇ m. If the thickness is less than 3 / im, since there is no mechanical strength of the release layer, defects such as pinholes and flaws are likely to occur, and the release effect may not be sufficiently exhibited. Also, if it exceeds 20 zm It causes a decrease in thermal conductivity, which is not preferable from the practical point of view.
- the rubber layer 13 silicone rubber, fluororubber, acrylic rubber or the like is used.
- the rubber layer 13 is thermally conductive and contains a thermally conductive material.
- metal compound particles, metal powder, glasses and the like can be mentioned.
- metal compound particles include metal nitrides such as boron nitride and aluminum nitride, metal oxides such as magnesium oxide, and metal carbides such as keyl carbide.
- content of a heat conductive substance 90 to 95 weight% in the rubber layer 13 is preferable.
- a commercially available silicone rubber heat-curing type heat-sink type Erasummer (Shin-Etsu Shi); cone KE 1867, X- 32-2020, X-32-2152, Toray -It is preferable to use Dow Corning SE4450 and GE Toshiba Silicone TSE3281-G).
- the thickness of the rubber layer 13 is 30 to 200 ⁇ , preferably 50 to 200 ⁇ m. If the thickness force S is less than 30 / m, there is a problem that the contact becomes uneven in the case of a large electronic device whose cushion effect is not sufficient. On the other hand, if it exceeds 200 ⁇ ⁇ ⁇ , the thermal conductivity will deteriorate, which is not preferable.
- the thickness of the metal foil 12 is preferably 10 to 50 ⁇ ⁇ ⁇ ⁇ ⁇ force S, preferably 20 to 30 111 degrees. There is a tendency that the workability becomes worse than 10 / im, thin lines are formed and the adhesion tends to be poor, and if it is thicker than 50 / m, the required thermal conductivity can not be secured.
- the metal foil 12 may be subjected to an adhesion improving treatment such as a surface roughening treatment or a primer treatment, if necessary.
- the composite sheet for heat and pressure bonding of the present invention is produced by applying a dispersion containing a fluorocarbon resin on one side of the metal foil, ie, after the evaporation of the dispersion solvent. Baking to form a release layer having a thickness of 3 to 20 x m, and forming a thermally conductive rubber layer having a thickness of 30 to 200 m on the other surface of the metal foil It can be suitably produced by the production method. Hereinafter, the manufacturing method of the present invention will be described.
- the dispersion used in the step of forming the release layer contains an aqueous dispersion solvent.
- Evaporative removal of the dispersion solvent is preferably carried out at a temperature near the boiling point of the dispersion solvent .
- the firing is preferably performed at a temperature equal to or higher than the melting point of the fluorine-based resin.
- Either of the step of forming the release layer and the step of forming the rubber layer may be performed first, but it is preferable to form the release layer first from the relationship of the firing temperature.
- coating by means of dipping, it is possible to use a method in which two stacked metal foils are used and the two are peeled off after coating.
- the step of forming the rubber layer may, for example, be a method of coating a rubber component dissolved in a solvent on one surface of a metal foil and then heating to disperse the solvent. If necessary, crosslinking (vulcanization) is performed in this heating step.
- the rubber layer which has been finished in the form of a film (sheet) in advance is heat-pressed using an adhesive and aluminum foil It may be pasted together.
- the adhesive used in this case include epoxy, silicone and rubber.
- a coating / heating apparatus using various coaters can be used.
- a continuous apparatus shown in FIG. 2 can be used.
- the rubber component is applied by the comma roll coater 33 via the guide roll R while feeding out the metal foil 12 (or the laminate of the metal foil 12 and the release layer 11) from the delivery roll 31
- the product is nipped and fed by the nip roll 35, and the product is scraped by the take-up roll 36.
- the composite sheet for thermocompression bonding thus obtained can be suitably used in a process of joining electronic 'electronic device parts, particularly liquid crystal displays, plasma displays and the like by thermocompression bonding using ACF.
- thermocompression bonding was performed by laminating the flexible wiring board 5, the ACF 2, and the glass plate 6 using the thermocompression bonding apparatus shown in FIG.
- the thermocompression bonding was performed via the composite sheet S.
- set temperature 300 C., set pressure 3.0 MPa, set time 20 seconds, size of composite sheet S 25 mm x 100 mm, and the temperature on the lower side of ACF 2 is a digital thermometer (manufactured by Rika Kogyo Co., Ltd., DP-500) was measured with a thermocouple.
- the thermal conductivity was evaluated by the temperature reached at a set temperature of 300 ° C.
- thermocompression bonding test of the above (1) evaluation was made by observing the deformation of the conductive particles in ACF from the back side of the glass plate with a microscope. ⁇ indicates that the conductive particles in the ACF are uniformly deformed, and X indicates that the conductive particles in the ACF are not uniformly deformed.
- the degree of deformation of the composite sheet S was evaluated visually in the above-mentioned heat and pressure bonding test (1).
- ⁇ means that the thermal deformation is completely
- X is the case where the thermal deformation occurs.
- An aqueous solution of fluorocarbon resin PTFE (Fluon AD-938, manufactured by Asahi Glass Co., Ltd.) is applied to the two stacked aluminum foils (thickness 25 / im) by dipping (immersion) and heated at 100 ° C. for 4 minutes. The water was evaporated off. After that, heating was performed at about 400 ° C., and the double-layered aluminum foil paste was peeled off to form a 5 / m-thick fluorine resin release layer on one surface of the aluminum foil.
- a rubber component silicone rubber for heat radiation, heat-curable silicone elastomer, Shin-Etsu Silicone KE1867, dilution base concentration 90 weight.
- Example 2 to 5 A composite sheet for thermocompression bonding was produced in the same manner as in Example 1 except that the thickness of each layer was set to the value shown in Table 1 in Example 1. Note that the thickness of the fluorine resin release layer is 10
- a composite sheet for thermocompression bonding was produced in the same manner as in Example 1 except that the thickness of each layer was set to the value shown in Table 1 in Example 1.
- the thickness of the fluorine resin release layer was 30 z m, the coating, drying and firing were repeated four times.
- Comparative Examples 1 and 3 have releasability because the thickness of the PTFE layer is 3 / im.
- Comparative Examples 1 and 4 since the silicone rubber layer is 20 ⁇ , there is no tension property.
- Comparative Examples 2 and 3 since the silicone rubber layer is 220 / im, no heat conductivity occurs, and the force S is strong.
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Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-334694 | 2004-11-18 | ||
JP2004334694A JP2006142611A (ja) | 2004-11-18 | 2004-11-18 | 加熱圧着用複合シート及びその製造方法 |
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WO2006054473A1 true WO2006054473A1 (ja) | 2006-05-26 |
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PCT/JP2005/020575 WO2006054473A1 (ja) | 2004-11-18 | 2005-11-10 | 加熱圧着用複合シート及びその製造方法 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7834430B2 (en) | 2007-11-16 | 2010-11-16 | Stats Chippac Ltd. | Drop-mold conformable material as an encapsulation for an integrated circuit package system |
CN110435193A (zh) * | 2019-07-09 | 2019-11-12 | 苏州泽成电子科技有限公司 | 一种恒温热压机配件及其生产方法 |
CN112789150A (zh) * | 2018-10-04 | 2021-05-11 | 日东电工株式会社 | 耐热脱模片和热压接方法 |
Families Citing this family (4)
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CN107107475B (zh) * | 2014-12-26 | 2019-03-12 | Agc株式会社 | 层叠板和柔性印刷基板的制造方法 |
JP6994578B2 (ja) * | 2018-08-30 | 2022-01-14 | 三井化学東セロ株式会社 | 離型フィルム |
JP7393874B2 (ja) * | 2019-03-29 | 2023-12-07 | 三井化学東セロ株式会社 | 離型フィルムおよび電子装置の製造方法 |
JP2023062208A (ja) * | 2020-02-07 | 2023-05-08 | 三井化学東セロ株式会社 | 離型フィルムおよび電子装置の製造方法 |
Citations (3)
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JPS61158153A (ja) * | 1984-12-28 | 1986-07-17 | Matsushita Electric Ind Co Ltd | 熱圧着装置 |
JP2001018330A (ja) * | 1999-07-07 | 2001-01-23 | Shin Etsu Chem Co Ltd | 耐熱熱伝導性シリコーンゴム複合シート及びその製造方法 |
JP2003100807A (ja) * | 2001-09-27 | 2003-04-04 | Nitto Denko Corp | 導電接続方法及びそれに用いる離型シート |
Family Cites Families (4)
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JPH05315401A (ja) * | 1992-05-07 | 1993-11-26 | Matsushita Electric Ind Co Ltd | 電子部品の接続装置 |
JP3169501B2 (ja) * | 1994-01-27 | 2001-05-28 | 東海ゴム工業株式会社 | 電子・電気機器部品圧着接合用熱伝導性ゴム部材 |
JPH10296767A (ja) * | 1997-02-28 | 1998-11-10 | Chuko Kasei Kogyo Kk | プレスクッション材 |
JP2001232712A (ja) * | 2000-02-24 | 2001-08-28 | Tokai Rubber Ind Ltd | 熱伝導性部材 |
-
2004
- 2004-11-18 JP JP2004334694A patent/JP2006142611A/ja active Pending
-
2005
- 2005-11-10 WO PCT/JP2005/020575 patent/WO2006054473A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61158153A (ja) * | 1984-12-28 | 1986-07-17 | Matsushita Electric Ind Co Ltd | 熱圧着装置 |
JP2001018330A (ja) * | 1999-07-07 | 2001-01-23 | Shin Etsu Chem Co Ltd | 耐熱熱伝導性シリコーンゴム複合シート及びその製造方法 |
JP2003100807A (ja) * | 2001-09-27 | 2003-04-04 | Nitto Denko Corp | 導電接続方法及びそれに用いる離型シート |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7834430B2 (en) | 2007-11-16 | 2010-11-16 | Stats Chippac Ltd. | Drop-mold conformable material as an encapsulation for an integrated circuit package system |
US7923846B2 (en) | 2007-11-16 | 2011-04-12 | Stats Chippac Ltd. | Integrated circuit package-in-package system with wire-in-film encapsulant |
US8049314B2 (en) | 2007-11-16 | 2011-11-01 | Stats Chippac Ltd. | Integrated circuit package system with insulator over circuitry |
US8368188B2 (en) | 2007-11-16 | 2013-02-05 | Stats Chippac Ltd. | Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof |
US8492204B2 (en) | 2007-11-16 | 2013-07-23 | Stats Chippac Ltd. | Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof |
CN112789150A (zh) * | 2018-10-04 | 2021-05-11 | 日东电工株式会社 | 耐热脱模片和热压接方法 |
CN110435193A (zh) * | 2019-07-09 | 2019-11-12 | 苏州泽成电子科技有限公司 | 一种恒温热压机配件及其生产方法 |
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