WO2006022257A1 - Composant électronique en céramique - Google Patents

Composant électronique en céramique Download PDF

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Publication number
WO2006022257A1
WO2006022257A1 PCT/JP2005/015269 JP2005015269W WO2006022257A1 WO 2006022257 A1 WO2006022257 A1 WO 2006022257A1 JP 2005015269 W JP2005015269 W JP 2005015269W WO 2006022257 A1 WO2006022257 A1 WO 2006022257A1
Authority
WO
WIPO (PCT)
Prior art keywords
external electrode
comb
electronic component
ceramic electronic
terminal member
Prior art date
Application number
PCT/JP2005/015269
Other languages
English (en)
Japanese (ja)
Inventor
Yoshihiro Omura
Original Assignee
Murata Manufacturing Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co., Ltd. filed Critical Murata Manufacturing Co., Ltd.
Priority to JP2006531914A priority Critical patent/JPWO2006022257A1/ja
Publication of WO2006022257A1 publication Critical patent/WO2006022257A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads

Definitions

  • the present invention relates to a ceramic electronic component, and more particularly to a ceramic electronic component having a structure in which a terminal member having a metal plate force is joined to an external electrode.
  • Ceramic electronic components that are of interest to the present invention include multilayer ceramic capacitors for large currents that are mounted on automobiles and the like.
  • Multilayer ceramic capacitors intended for such applications usually have a plurality of internal electrodes stacked so that external electrodes are formed at opposite ends and are electrically connected to specific external electrodes.
  • a metal plate-powered terminal member that is formed by soldering to hold the capacitor body with the external electrode sandwiched therebetween and to be electrically connected to each external electrode. It is composed with.
  • the external electrode side joint portion of the terminal member that is to be joined to the external electrode is formed in a comb-like shape, and further, the external electrode side joint portion is bent so that the external electrode side is bent. Reduce the contact area of the joint with the external electrode, and thereby reduce the contact area of the conductive joint material such as solder applied between the external electrode side joint and the external electrode to the external electrode.
  • Patent Document 1 Has been proposed (for example, see Patent Document 1).
  • the conductive bonding material is reduced in the bonding area of the conductive bonding material to the external electrode. If the area of the external electrode constrained by the composite material is reduced, the stress caused by electrostriction can be reduced, making it difficult to cause breakage of the joint portion and cracking of the capacitor body.
  • the above problems are not limited to the multilayer ceramic capacitor having the above-described structure, and a structure in which a terminal member made of a metal plate and having a comb-like joint is joined to an external electrode by soldering or the like. Can be encountered in all of the ceramic electronic components having
  • Patent Document 1 JP 2000-235931 A
  • an object of the present invention is to provide a ceramic electronic component that can solve the above-described problems.
  • the present invention includes a ceramic electronic comprising: an electronic component main body configured with ceramic and having external electrodes formed at opposite ends thereof; and a terminal member electrically connected to the external electrode.
  • the terminal member is composed of a metal plate made of copper-based metal force, and is connected to the external electrode side joint portion that is a portion joined to the external electrode by the conductive joint material, and the external electrode side joint portion.
  • the external electrode side joint portion has a mounting side end portion that is electrically connected to a mounting conductor portion such as a conductor portion on a mounting wiring board, and the external electrode side joint portion has a plurality of comb teeth. It has a comb-like shape that forms a piece.
  • the stress exerted by the terminal member on the electronic component main body is Focusing on the restraining force of the terminal member itself, the “cross-sectional area of the terminal member external electrode side joint” related to the magnitude of the restraining force and the restraint area of the electronic component body “
  • each comb-like piece is A
  • each conductive joining material that joins each comb-like piece to the external electrode is B
  • A is 0.021-0.090 mm 2
  • the A / B ratio is 0.03 to 0.15.
  • each comb-like piece is formed with a protrusion protruding toward the external electrode!
  • a rounded chamfered portion is formed at a portion where a connecting portion for connecting a plurality of comb-shaped pieces and a base portion of each comb-shaped piece intersect.
  • the conductive bonding material is preferably solder.
  • the terminal member is made of a copper-based metal having good conductivity, it is possible to ensure sufficient mechanical strength in the terminal member without reducing the current resistance performance. it can.
  • the copper-based metal oxygen-free copper, brass, beryllium copper, phosphor bronze, or the like can be used, but oxygen-free copper is particularly preferable.
  • each comb-like piece is formed with a protrusion that protrudes toward the external electrode, the bonding area of the conductive bonding material to the external electrode can be easily controlled.
  • FIG. 1 is a perspective view showing a mounting state of a ceramic electronic component 1 according to a first embodiment of the present invention.
  • FIG. 2 is an enlarged perspective view showing a part of a terminal member 4 provided in the ceramic electronic component 1 shown in FIG.
  • FIG. 3 is a graph showing the crack generation rate and bonding strength obtained in an experiment conducted to find out the condition that the AZB ratio is 0.03 to 0.15, which prescribes the present invention.
  • FIG. 3 is a graph showing the crack generation rate and bonding strength obtained in an experiment conducted to find out the condition that the AZB ratio is 0.03 to 0.15, which prescribes the present invention.
  • FIG. 4 is a front view showing a part of a ceramic electronic component la according to a second embodiment of the present invention.
  • FIG. 5 is a front view showing a part of a ceramic electronic component lb according to a third embodiment of the present invention.
  • FIG. 6 is a front view showing a part of a ceramic electronic component lc according to a fourth embodiment of the present invention.
  • FIG. 7 is a front view showing a part of a ceramic electronic component Id according to a fifth embodiment of the present invention.
  • FIG. 1 is a perspective view showing a mounting state of the ceramic electronic component 1 according to the first embodiment of the present invention.
  • the ceramic electronic component 1 is made of ceramic and has an external electrode 2 formed at opposite ends thereof, and is electrically connected to the electronic component body 3 and the external electrode 2.
  • Member 4 is provided.
  • Each of the terminal members 4 is bonded to each of the external electrodes 2 by a conductive bonding material 5 such as a solder or a conductive adhesive.
  • the electronic component main body 3 constitutes a multilayer ceramic capacitor, and although not shown in the drawing, for example, a plurality of ceramic layers and dielectric layers having a dielectric ceramic force such as a barium titanate ceramic are used. It has a laminated structure including a plurality of internal electrodes arranged along a specific interface. The internal electrode is electrically connected to a specific one of the external electrodes 2, and the internal electrode connected to one external electrode 2 and the internal electrode connected to the other external electrode 2 are the electronic component body. The three layers are arranged alternately.
  • the terminal member 4 is made of a metal plate made of a copper-based metal such as oxygen-free copper, brass, beryllium copper, or phosphor bronze.
  • a copper-based metal such as oxygen-free copper, brass, beryllium copper, or phosphor bronze.
  • oxygen-free copper having particularly good conductivity as the copper-based metal.
  • the terminal member 4 is subjected to, for example, nickel plating with a thickness of about 1 to 2 ⁇ m and tinning with a thickness of about 1 to 2 ⁇ m thereon as required! /, obviously!
  • FIG. 2 is an enlarged perspective view showing a part of the terminal member 4, and shows a surface facing the electronic component main body 3 side facing forward.
  • the terminal member 4 becomes a portion bonded to the external electrode 2 by the conductive bonding material 5.
  • the external electrode side joint 6 has a comb-like shape in which a plurality of comb-like pieces 9 are formed.
  • the mounting-side end 8 of the terminal member 4 has a comb shape in this embodiment.
  • the comb-like piece 10 formed on the mounting-side end 8 is located at the same position as the comb-like piece 9 formed on the external electrode-side joining portion 6. It has a form that extends continuously from the piece 9.
  • the comb-like piece 10 formed on the mounting side end 8 is inserted into the through hole 11 provided in the mounting wiring board 7 shown in FIG. An electrical connection is achieved.
  • the comb-like piece 10 formed on the mounting-side end portion 8 was also bent on the state force shown in FIG. 2 by 90 degrees and was formed on the main surface of the mounting wiring board (not shown). It may be electrically connected to a mounting conductor such as a conductive land.
  • each comb-like piece 9 formed in the external electrode side joint 6 of the terminal member 4 forms a protrusion 12 that protrudes toward the external electrode 2.
  • each comb-tooth piece 9 is bent along a fold line extending in the width direction thereof, whereby the protrusion 12 is formed. Therefore, the conductive bonding material 5 for bonding the external electrode side bonding portion 6 to the external electrode 2 extends substantially on a line substantially parallel to the extending direction of the internal electrode (not shown) provided in the electronic component main body 3. It has a form.
  • the bonding area of the conductive bonding material 5 to the external electrode 2 can be easily controlled.
  • a round chamfered portion 14 is formed in the portion.
  • each comb-tooth shape at the external electrode side joint 6 The cross-sectional area of the piece 9 is A (see Fig. 2), and the bonding area of each conductive bonding material 5 that joins each comb-like piece 9 to the external electrode 2 is B (see Fig. 2).
  • A is set to 0.021 to 0.090 mm 2 and the A / B specific power 0.03 to 0.15.
  • the A is chosen in the range of 0. 021 ⁇ 0. 090mm 2, if A is less than 0. 021mm 2, sufficient strength can be obtained at the comb-tooth pieces 9 It not, on the other hand, if a exceeds 0. 090m m 2, is in the range of AZB ratio from 0.03 to 0.15, on whether Chikararu stress electronic component body 3 becomes too strong, the electronic component body This is because cracks are likely to occur in 3.
  • the AZB ratio is selected in the range of 0.03 to 0.15. If the AZB ratio is less than 0.03, the joining area B is too large. This is because cracks are likely to occur in the main body 3, and on the other hand, if the AZB ratio exceeds 0.15, a situational force S is produced where the joint area B is too small and sufficient joint strength cannot be obtained.
  • FIG. 3 is a diagram showing data on the crack generation rate and the bonding strength obtained in an experiment conducted to find out the condition that the AZB ratio is 0.03-0.15.
  • the crack generation rate is obtained by giving a thermal shock of 55 ° C to 125 ° C to a ceramic electronic component as a sample for 3000 cycles and determining the ratio of the number of samples in which cracks occurred.
  • FIG. 4, FIG. 5, FIG. 6 and FIG. 7 respectively show ceramic electronic components la, lb, lc, and Id according to the second, third, fourth, and fifth embodiments of the present invention, respectively. It is a front view which shows a part, respectively. 4 to 7, the elements shown in FIGS. 1 and 2 are denoted by the same reference numerals, and redundant description is omitted. 4 to 7, the terminal member 4 is shown in cross section.
  • the second to fifth embodiments provide modified examples of the protrusions 12 formed on the comb-like piece 9 of the external electrode side joint 6 in the first embodiment.
  • the protrusion 12a is formed at the tip of the bent portion of the comb-like piece 9.
  • a projection 12b is formed by forming an intermediate portion of the comb-like piece 9 in a C-shaped bent portion.
  • the protrusion 12 c is formed at the bent end of the comb-like piece 9.
  • the protrusion 12d is formed by deep-drawing the intermediate portion of the comb-like piece 9 with a press.
  • the mounting-side end 8 of the terminal member 4 is 90 degrees with respect to the base of the comb-like piece 9. It is bent and is configured to be electrically connected to a mounting conductor portion such as a conductive land formed on the main surface of the mounting wiring board.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

La présente invention concerne un composant électronique en céramique ayant une structure dans laquelle un élément terminal en une feuille de métal est assemblé à une électrode externe, et excellent quant à la résistance aux chocs mécaniques, à la performance du cycle de chauffage et la performance de la résistance au courant. Un élément terminal (4) est composé d'une feuille de métal en un métal à base de cuivre et comprend une partie assemblée à une électrode externe (6) destinée à servir de partie assemblée à une électrode externe (2) avec un matériau d'assemblage conducteur (5) de type métal d'apport de brasage, et d'une partie d'extrémité de montage (8) destinée à servir de partie en continuité avec la partie assemblée à une électrode externe (6) et connectée électriquement à une partie formant conducteur de montage (7). La partie assemblée à une électrode externe (6) a une forme de peigne ayant des pièces en dents de peigne (9). La zone A de la coupe transversale de chaque partie en dent de peigne (9) mesure de 0,021 à 0,090 mm2. Le rapport A/B est de 0,03 à 0,15 où B est la zone de la partie assemblée de chaque matériau d'assemblage conducteur (5) adapté pour assembler chaque partie en dent de peigne (9) à l'électrode externe (2) quand la partie assemblée est assemblée à l'électrode externe (2).
PCT/JP2005/015269 2004-08-25 2005-08-23 Composant électronique en céramique WO2006022257A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006531914A JPWO2006022257A1 (ja) 2004-08-25 2005-08-23 セラミック電子部品

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004-244737 2004-08-25
JP2004244737 2004-08-25

Publications (1)

Publication Number Publication Date
WO2006022257A1 true WO2006022257A1 (fr) 2006-03-02

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PCT/JP2005/015269 WO2006022257A1 (fr) 2004-08-25 2005-08-23 Composant électronique en céramique

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JP (1) JPWO2006022257A1 (fr)
WO (1) WO2006022257A1 (fr)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102011107193A1 (de) * 2011-07-13 2013-01-17 Epcos Ag Elektrische Vorrichtung
JP2015135985A (ja) * 2015-03-16 2015-07-27 太陽誘電株式会社 セラミックコンデンサ
JP2018510507A (ja) * 2015-02-27 2018-04-12 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ セラミック素子用の電気接続用接点、セラミック素子および素子システム
JP2019121645A (ja) * 2017-12-28 2019-07-22 Tdk株式会社 電子部品
JP2021027053A (ja) * 2019-07-31 2021-02-22 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板
JP2021077769A (ja) * 2019-11-08 2021-05-20 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188810A (ja) * 1990-11-22 1992-07-07 Mitsubishi Materials Corp 複合セラミックコンデンサ
JP2000235931A (ja) * 1998-12-15 2000-08-29 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP2004172562A (ja) * 2002-11-21 2004-06-17 Maruwa Co Ltd 複合電子部品
JP2004200252A (ja) * 2002-12-17 2004-07-15 Sanyo Electric Co Ltd 固体電解コンデンサ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04188810A (ja) * 1990-11-22 1992-07-07 Mitsubishi Materials Corp 複合セラミックコンデンサ
JP2000235931A (ja) * 1998-12-15 2000-08-29 Murata Mfg Co Ltd 積層セラミックコンデンサ
JP2004172562A (ja) * 2002-11-21 2004-06-17 Maruwa Co Ltd 複合電子部品
JP2004200252A (ja) * 2002-12-17 2004-07-15 Sanyo Electric Co Ltd 固体電解コンデンサ

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9620266B2 (en) 2011-07-13 2017-04-11 Epcos Ag Electrical device
DE102011107193A1 (de) * 2011-07-13 2013-01-17 Epcos Ag Elektrische Vorrichtung
US10395843B2 (en) 2015-02-27 2019-08-27 Epcos Ag Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement
JP2018510507A (ja) * 2015-02-27 2018-04-12 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ セラミック素子用の電気接続用接点、セラミック素子および素子システム
US20180247768A1 (en) * 2015-02-27 2018-08-30 Epcos Ag Electrical component and a method for producing an electrical component
JP2019176164A (ja) * 2015-02-27 2019-10-10 ティーディーケイ・エレクトロニクス・アクチェンゲゼルシャフトＴｄｋ Ｅｌｅｃｔｒｏｎｉｃｓ Ａｇ 電気素子および電気素子の製造方法
US10943740B2 (en) 2015-02-27 2021-03-09 Epcos Ag Electrical connection contact for a ceramic component, a ceramic component, and a component arrangement
US11342126B2 (en) * 2015-02-27 2022-05-24 Epcos Ag Electrical component and a method for producing an electrical component
JP2015135985A (ja) * 2015-03-16 2015-07-27 太陽誘電株式会社 セラミックコンデンサ
JP2019121645A (ja) * 2017-12-28 2019-07-22 Tdk株式会社 電子部品
JP7004151B2 (ja) 2017-12-28 2022-01-21 Tdk株式会社 電子部品
JP2021027053A (ja) * 2019-07-31 2021-02-22 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板
JP7319133B2 (ja) 2019-07-31 2023-08-01 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板
JP2021077769A (ja) * 2019-11-08 2021-05-20 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板
JP7353141B2 (ja) 2019-11-08 2023-09-29 太陽誘電株式会社 積層セラミック電子部品及び電子部品実装基板

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