WO2006003086A8 - Integrierte schaltungsanordnung mit pin-diode und herstellungverfahren - Google Patents
Integrierte schaltungsanordnung mit pin-diode und herstellungverfahrenInfo
- Publication number
- WO2006003086A8 WO2006003086A8 PCT/EP2005/052809 EP2005052809W WO2006003086A8 WO 2006003086 A8 WO2006003086 A8 WO 2006003086A8 EP 2005052809 W EP2005052809 W EP 2005052809W WO 2006003086 A8 WO2006003086 A8 WO 2006003086A8
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- integrated circuit
- circuit arrangement
- pin diode
- production method
- area
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/0611—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region
- H01L27/0641—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type
- H01L27/0647—Bipolar transistors in combination with diodes, or capacitors, or resistors, e.g. vertical bipolar transistor and bipolar lateral transistor and resistor
- H01L27/0652—Vertical bipolar transistor in combination with diodes, or capacitors, or resistors
- H01L27/0664—Vertical bipolar transistor in combination with diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14681—Bipolar transistor imagers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/548—Amorphous silicon PV cells
Landscapes
- Power Engineering (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Bipolar Integrated Circuits (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Semiconductor Integrated Circuits (AREA)
- Light Receiving Elements (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007518581A JP2008504705A (ja) | 2004-06-30 | 2005-06-17 | pinダイオードを備えた集積回路構造およびその製造方法 |
US11/647,550 US7495306B2 (en) | 2004-06-30 | 2006-12-28 | Integrated circuit arrangement comprising a pin diode, and production method |
US12/351,623 US8058111B2 (en) | 2004-06-30 | 2009-01-09 | Integrated circuit arrangement comprising a pin diode, and production method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004031606.6 | 2004-06-30 | ||
DE102004031606A DE102004031606B4 (de) | 2004-06-30 | 2004-06-30 | Integrierte Schaltungsanordnung mit pin-Diode und Herstellungsverfahren |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/647,550 Continuation-In-Part US7495306B2 (en) | 2004-06-30 | 2006-12-28 | Integrated circuit arrangement comprising a pin diode, and production method |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006003086A1 WO2006003086A1 (de) | 2006-01-12 |
WO2006003086A8 true WO2006003086A8 (de) | 2006-03-23 |
Family
ID=34970038
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/052809 WO2006003086A1 (de) | 2004-06-30 | 2005-06-17 | Integrierte schaltungsanordnung mit pin-diode und herstellungverfahren |
Country Status (4)
Country | Link |
---|---|
US (2) | US7495306B2 (de) |
JP (2) | JP2008504705A (de) |
DE (2) | DE102004031606B4 (de) |
WO (1) | WO2006003086A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100723137B1 (ko) * | 2005-11-24 | 2007-05-30 | 삼성전기주식회사 | 포토다이오드 소자 및 이를 이용한 광센서용 포토다이오드어레이 |
DE102006027969A1 (de) * | 2006-06-17 | 2007-12-20 | X-Fab Semiconductor Foundries Ag | Verfahren zur selektiven Entspiegelung einer Halbleitergrenzfläche durch eine besondere Prozessführung |
KR100929741B1 (ko) * | 2007-11-20 | 2009-12-03 | 주식회사 동부하이텍 | 이미지 센서 및 그 제조 방법 |
EP2216815B1 (de) | 2009-02-05 | 2014-04-02 | ams AG | Integrierte Schaltung mit PIN-Dioden |
US8101479B2 (en) * | 2009-03-27 | 2012-01-24 | National Semiconductor Corporation | Fabrication of asymmetric field-effect transistors using L-shaped spacers |
US8030151B2 (en) * | 2009-03-27 | 2011-10-04 | National Semiconductor Corporation | Configuration and fabrication of semiconductor structure having bipolar junction transistor in which non-monocrystalline semiconductor spacing portion controls base-link length |
US8482078B2 (en) * | 2011-05-10 | 2013-07-09 | International Business Machines Corporation | Integrated circuit diode |
US10468543B2 (en) | 2013-05-22 | 2019-11-05 | W&Wsens Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
CN105556680B (zh) * | 2013-05-22 | 2017-12-22 | 王士原 | 微结构增强型吸收光敏装置 |
US10446700B2 (en) | 2013-05-22 | 2019-10-15 | W&Wsens Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
US10700225B2 (en) | 2013-05-22 | 2020-06-30 | W&Wsens Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
US11121271B2 (en) | 2013-05-22 | 2021-09-14 | W&WSens, Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
US9530905B2 (en) | 2014-11-18 | 2016-12-27 | W&Wsens Devices, Inc. | Microstructure enhanced absorption photosensitive devices |
US10553633B2 (en) * | 2014-05-30 | 2020-02-04 | Klaus Y.J. Hsu | Phototransistor with body-strapped base |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0353509B1 (de) * | 1988-08-04 | 1995-06-14 | Siemens Aktiengesellschaft | Verfahren zur Herstellung einer integrierten Halbleiteranord- nung mit einem Photoelement und einem npn-Bipolartransistor in einem Siliziumsubstrat |
JPH0779154B2 (ja) * | 1989-03-10 | 1995-08-23 | シャープ株式会社 | 回路内蔵受光素子 |
US5598022A (en) * | 1990-08-31 | 1997-01-28 | Hamamatsu Photonics K.K. | Optical semiconductor device |
JPH09219534A (ja) * | 1995-12-06 | 1997-08-19 | Sony Corp | 受光素子、光ピツクアツプ及び半導体装置製造方法 |
EP0778621B1 (de) * | 1995-12-06 | 2008-08-13 | Sony Corporation | Aus einer Fotodiode und einem bipolaren Element bestehende Halbleitervorrichtung und Verfahren zur Herstellung |
JP3317942B2 (ja) * | 1999-11-08 | 2002-08-26 | シャープ株式会社 | 半導体装置およびその製造方法 |
KR100477788B1 (ko) * | 1999-12-28 | 2005-03-22 | 매그나칩 반도체 유한회사 | 커패시터가 접속된 포토다이오드를 갖는 씨모스이미지센서 및 그 제조방법 |
JP3782297B2 (ja) * | 2000-03-28 | 2006-06-07 | 株式会社東芝 | 固体撮像装置及びその製造方法 |
JP2002033484A (ja) * | 2000-07-18 | 2002-01-31 | Mitsubishi Electric Corp | 半導体装置 |
CN100446264C (zh) * | 2000-10-19 | 2008-12-24 | 量子半导体有限公司 | 制作和cmos电路集成在一起的异质结光电二极管的方法 |
US6580109B1 (en) * | 2002-02-01 | 2003-06-17 | Stmicroelectronics, Inc. | Integrated circuit device including two types of photodiodes |
US6743652B2 (en) * | 2002-02-01 | 2004-06-01 | Stmicroelectronics, Inc. | Method for making an integrated circuit device including photodiodes |
DE10241156A1 (de) * | 2002-09-05 | 2004-03-18 | Infineon Technologies Ag | Verfahren zum Herstellen einer integrierten pin-Diode und zugehörige Schaltungsanordnung |
KR100446309B1 (ko) * | 2002-11-14 | 2004-09-01 | 삼성전자주식회사 | L자형 스페이서를 채용한 반도체 소자의 제조 방법 |
-
2004
- 2004-06-30 DE DE102004031606A patent/DE102004031606B4/de not_active Expired - Fee Related
- 2004-06-30 DE DE102004063997A patent/DE102004063997B4/de not_active Expired - Fee Related
-
2005
- 2005-06-17 JP JP2007518581A patent/JP2008504705A/ja active Pending
- 2005-06-17 WO PCT/EP2005/052809 patent/WO2006003086A1/de active Application Filing
-
2006
- 2006-12-28 US US11/647,550 patent/US7495306B2/en not_active Expired - Fee Related
-
2009
- 2009-01-09 US US12/351,623 patent/US8058111B2/en not_active Expired - Fee Related
-
2010
- 2010-08-31 JP JP2010193888A patent/JP5281620B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US8058111B2 (en) | 2011-11-15 |
JP2011018920A (ja) | 2011-01-27 |
US20090209057A1 (en) | 2009-08-20 |
DE102004063997B4 (de) | 2010-02-11 |
US20070187795A1 (en) | 2007-08-16 |
WO2006003086A1 (de) | 2006-01-12 |
DE102004031606A1 (de) | 2006-01-19 |
US7495306B2 (en) | 2009-02-24 |
JP2008504705A (ja) | 2008-02-14 |
DE102004031606B4 (de) | 2009-03-12 |
JP5281620B2 (ja) | 2013-09-04 |
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