WO2006001080A1 - 固体撮像素子を使用した撮像装置 - Google Patents
固体撮像素子を使用した撮像装置 Download PDFInfo
- Publication number
- WO2006001080A1 WO2006001080A1 PCT/JP2004/009482 JP2004009482W WO2006001080A1 WO 2006001080 A1 WO2006001080 A1 WO 2006001080A1 JP 2004009482 W JP2004009482 W JP 2004009482W WO 2006001080 A1 WO2006001080 A1 WO 2006001080A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- solid
- imaging device
- state imaging
- adhesive
- holder
- Prior art date
Links
- 238000003384 imaging method Methods 0.000 title claims abstract description 94
- 239000007787 solid Substances 0.000 title abstract description 10
- 239000000853 adhesive Substances 0.000 claims abstract description 82
- 230000001070 adhesive effect Effects 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims description 14
- 239000011521 glass Substances 0.000 claims description 13
- 229910010293 ceramic material Inorganic materials 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 8
- 238000000016 photochemical curing Methods 0.000 claims description 8
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 238000000926 separation method Methods 0.000 abstract description 32
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
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- 230000003287 optical effect Effects 0.000 description 21
- 125000006850 spacer group Chemical group 0.000 description 12
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- 238000010586 diagram Methods 0.000 description 3
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- 239000005357 flat glass Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000003973 paint Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths
- G02B27/1013—Beam splitting or combining systems for splitting or combining different wavelengths for colour or multispectral image sensors, e.g. splitting an image into monochromatic image components on respective sensors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
- G02B27/145—Beam splitting or combining systems operating by reflection only having sequential partially reflecting surfaces
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/13—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with multiple sensors
- H04N23/16—Optical arrangements associated therewith, e.g. for beam-splitting or for colour correction
Definitions
- the present invention relates to an imaging apparatus in which a prism used for a television camera or the like that splits light in a plurality of directions and a solid-state imaging device disposed in the vicinity of the exit surface are bonded and fixed.
- prisms are used in color separation optical systems that split light in multiple directions for broadcasting cameras such as television cameras, commercial cameras, and measurement cameras. For example, blue, red, green
- the three primary colors are separated and an optical image is formed on a solid-state image sensor placed on each exit surface.
- the optical image formed on the solid-state image sensor is photoelectrically converted and processed by the video circuit to obtain a predetermined video signal.
- each of the three solid-state imaging devices is set to X, ⁇ , Z, ⁇ X with respect to the optical axis.
- ⁇ y, 0 z must be positioned accurately and fixed to the color separation prism.
- Fig. 10 (a) is a plan view of the color separation prism of Conventional Example 1 with a solid-state image sensor attached to the mounting plate via a spacer
- Fig. 10 (b) is the color separation prism of Conventional Example 1.
- Fig. 1 is an enlarged view of the mounting part of Conventional Example 1
- Fig. 1 2 is a modified example of the spacer of Conventional Example 1. It is an enlarged view of the attaching part which shows.
- a mounting plate 1 0 2 is attached so as to sandwich the color separation prism 1 0 1 of the color separation optical system 1 0 5, and the three solid-state imaging devices 1 0 3 position After the final adjustment, each of them is bonded and fixed to the mounting plate 10 2 through two spacers 10 4.
- the end face on the emission side of the mounting plate 10 2 attached to the color separation prism 10 1 forms an inclined surface 10 2 A inclined with respect to the outgoing optical axis.
- the spacer 10 4 is formed with a vertical surface 10 4 A on the right side and an inclined surface 10 4 B inclined with respect to the outgoing optical axis on the left side.
- the inclined surfaces 1 0 2 A and 1 0 4 B are formed with substantially the same inclination angle.
- a gap necessary for applying the adhesive is maintained between the inclined surface 10 0 2 A and the inclined surface 1 0 4 B, the vertical surface 1 0 4 A, and the light receiving surface side surface of the solid-state image sensor 10 3.
- the color separation optical system 105 is mounted on a 6-axis adjustment jig (not shown), and the solid-state image sensor 10 3 is a perspective view showing the adjustment direction of the solid-state image sensor package of FIG.
- the solid-state image sensor 10 3 is a perspective view showing the adjustment direction of the solid-state image sensor package of FIG.
- the vertical surface of the spacer 1 0 4 1 0 4 A after adjusting in the three axis directions of X, , and Z and in the three axis rotation directions of 0 x, ⁇ y, and 0 z, the vertical surface of the spacer 1 0 4 1 0 4 A, the inclined surface 1 0 4 Apply adhesive to B and insert it into the gap between the inclined surface 10 02 A of the mounting plate 10 2 and the solid-state image sensor 10 3.
- At least one side surface of the spacer 10 4 is an inclined surface.
- the inclined surface 1 0 4 B of the spacer 1 0 4 and the inclined surface 1 0 2 A of the mounting plate 1 0 2 are in surface contact with each other, and a pair of spacers 1 0 4 Can be glued to.
- FIG. 13 shows the configuration of the solid-state imaging device of Conventional Example 2
- Fig. 14 shows an enlarged cross-sectional view of the mounting part of Conventional Example 2
- Fig. 15 shows a modification of the solid-state imaging device of Conventional Example 2. It is an expanded sectional view of an attaching part.
- a solid-state image sensor is provided on each exit surface of the color separation prism 2 0 1.
- the color separation prism 20 1 is coated with a light shielding coating 2 0 2 except for the exit surface.
- the connecting fixing member 204 for connecting and fixing the color separation prism 20 1 and the solid-state image sensor 2 0 3 disposed in the vicinity of the exit surface thereof has ultraviolet selective permeability.
- An optical multilayer film is deposited on filter glass, white plate glass, or blue plate glass to form an ultraviolet selective transmission film, and only the light necessary for curing the ultraviolet curable adhesive is transmitted.
- Light in the sensitivity area of the color separation prism 2 0 1 and the connecting and fixing member 2 0 4 and the connecting and fixing member 2 0 4 and the solid-state image sensor 2 0 3 are coated with UV curable adhesive 2 0 5 As shown in Fig.
- the solid-state image sensor 20 3 is adjusted in the X,, and Z triaxial directions and the 0 ⁇ , ⁇ y and 0 ⁇ triaxial directions using a 6-axis adjusting jig (not shown). Irradiate ultraviolet rays to cure adhesive 205, color separation prism ⁇ ⁇ 2 0 1, connecting fixing member 2 0 4 and solid-state image sensor Connect 2 0 3 together. In addition, as shown in 15th IV, as a result of adjustment using a 6-axis adjustment jig (not shown), the applied UV curable adhesive 205 was deformed even when the solid-state image sensor 20 3 was tilted, and ultraviolet rays were absorbed. Irradiation can cure the adhesive 205 and connect and fix the color separation prism 2 0 1, the connecting and fixing member 2 0 4, and the solid-state imaging device 2 0 3.
- the adhesive has a so-called curing shrinkage property that the volume is reduced by several percent when cured, which deteriorates the positional accuracy at the time of fixation. It can be tracked by movement, and can be cured while maintaining accuracy without changing the positional relationship between the solid-state image sensor and the prism block.
- the amount of UV-curing adhesive applied was not uniform, and the UV irradiation of the 6-axis adjustment jig was uneven.
- the curing shrinkage of the UV curable adhesive was also biased, and had a problem that the solid-state imaging device was fixed at a position deviated from the position where it was initially aligned.
- the area of one pixel is reduced by increasing the number of pixels in the solid-state imaging device, and the imaging area is also 2 Z 3 mm, 1/2 mm, 1 Z 3 mm.
- miniaturization has further progressed, and it has been difficult to maintain high-accuracy images by suppressing positioning errors due to curing shrinkage of the adhesive and position fluctuations due to changes in ambient temperature during operation.
- the present invention can be applied even if the amount of the applied adhesive is uneven, or the ultraviolet irradiation is biased and the curing shrinkage of the UV curable adhesive is biased.
- the color separation prism and solid-state image sensor can be connected and fixed so that the position of the body image sensor can be prevented, and a special member such as filter glass is not used.
- An object is to provide an imaging device. Disclosure of the invention
- the present inventor has solved this problem by the following means as a result of arbitrary research.
- An image pickup apparatus using a solid-state image pickup device characterized in that it is made of an adhesive that is filled and cured in a gap.
- the plate-shaped holder is placed on both sides of the prism so that a plurality of the same-shaped plate-shaped holders are stacked and each wedge-shaped tip is in contact with the light-receiving surface side surface of the solid-state imaging device package.
- the adhesive is filled and cured in each gap formed between the surface of the solid-state image pickup device package and the wedge-shaped surface of each plate-like holder tip.
- the rod is similar to the thermal expansion coefficient of the prism, and is a transparent glass material,
- the cross-section of the tip that contacts the side surface is a semicircular shape, each of the two plate-like holders adhered to both sides of the prism, the surface of the solid-state imaging device package, and the semicircular shape of the tip of the plate-like holder
- An image pickup apparatus using a solid-state image pickup device characterized by comprising: a hardened adhesive filled in a gap formed by a surface.
- the plate-shaped holder approximate to the thermal expansion coefficient of the prism, and is one or more selected from a transparent glass material, a ceramic material, or a metal material.
- the adhesive is a photo-curing adhesive, which is irradiated with light to cure the photo-curing adhesive, and the plate-like holder and the prism ridge, the plate-like holder, and the solid-state imaging device package, An image pickup apparatus using the solid-state image pickup device according to any one of (1) to (6) above, wherein the two are connected and fixed.
- the adhesive is a thermosetting adhesive, and the thermosetting adhesive is cured with a heat source, and the plate holder, the prism, the plate holder, and the solid-state imaging device package are connected and fixed.
- FIG. 1 (a) is a block diagram of a color separation prism plate holder and a solid-state image sensor package according to an embodiment of the present invention
- FIG. 1 (b) is a plate holder and solid-state image sensor package according to Embodiment 1 of the present invention. It is A, A 'side view which attached A.
- FIG. 2 is a perspective view showing the adjustment direction of the solid-state imaging device package.
- FIG. 3 is a side view of A and A ′ of Modification 1 in which the plate-like holder and the solid-state imaging device package of Embodiment 1 of the present invention are attached.
- FIG. 4 is a plan view of A and A ′ of Modification 2 in which the plate holder and the solid-state imaging device package of Embodiment 1 of the present invention are attached.
- FIG. 5 is a side view of A and A ′ with the plate holder and the solid-state imaging device package of Example 2 of the invention attached.
- FIG. 6 is a side view of A and A ′ with the plate holder and the solid-state image sensor package of Example 3 of the invention attached.
- FIG. 7 is a side view of A, A ′ with the plate-shaped holder and the solid-state imaging device package of Example 4 of the invention attached.
- FIG. 8 is a side view of A and A ′ with the plate holder and the solid-state imaging device package of Example 5 of the present invention attached.
- FIG. 9 is an enlarged cross-sectional view of a fixing portion between the plate holder and the solid-state image pickup device package of Example 6 of the invention.
- Fig. 10 (a) is a plan view of a solid-state image sensor attached to a mounting plate via a spacer to the color separation prism of Conventional Example 1, and (b) is a plan view of the color separation prism of Conventional Example 1. It is the side view which attached the solid-state image sensor to the attachment plate via the spacer.
- FIG. 11 is an enlarged view of the mounting portion of Conventional Example 1.
- FIG. 11 is an enlarged view of the mounting portion of Conventional Example 1.
- FIG. 12 is an enlarged view of a mounting portion showing a modified example of the spacer of the first conventional example.
- FIG. 13 is a configuration diagram of the solid-state imaging device of Conventional Example 2.
- FIG. 14 is an enlarged cross-sectional view of the mounting portion of Conventional Example 2.
- FIG. 15 is an enlarged cross-sectional view of a mounting portion showing a modification of the solid-state imaging device of Conventional Example 2.
- Fig. 1 (a) is a block diagram of a color separation prism plate holder solid-state image pickup device according to an embodiment of the present invention
- Fig. 1 (b) is an embodiment 1 of the same invention
- Fig. 2 is a perspective view showing the adjustment direction of the koto body image pickup device package.
- Fig. 3 is a view of attaching the plate-like holder and solid-state image pickup device package of Example 1 of the invention.
- A, A, side view of Modified Example 1 and FIG. 4 are side views of A, A ′ of Modified Example 2 with the plate holder and solid-state image sensor package of Example 1 of the invention attached, and FIG.
- FIG. 6 shows A, A with the plate-shaped holder and solid-state image sensor package of Example 3 of the invention attached.
- Fig. 7 shows A, A' with the plate holder and solid imaging package of Example 4 of the invention attached
- Fig. 8 is a side view
- Fig. 8 is A and A 'side with the plate-shaped holder and solid-state image sensor package of Example 5 of the invention attached
- Fig. 9 is the plate-shaped holder and solid-state image sensor package of Example 6 of the same embodiment FIG.
- a color separation optical system 1 used for a TV camera or the like includes a prism 2 that separates colors in three directions, three solid-state image pickup device packages 3 disposed near the exit surface, and
- the front end portion of the solid-state imaging device package 3 that contacts the light receiving surface side package surface 5 is wedge-shaped and is in the form of two plates each attached to both sides of the prism 2 and approximates the thermal expansion coefficient of the prism 2
- a transparent glass plate holder 4 that has a triangular shape formed by the surface 6 of the solid-state imaging device package surface 5 and the front surface of the holder 4 whose wedge-shaped inclined surface faces outward.
- Adhesive 7 is filled in the gap, and the holder 4 and the solid image are taken.
- the image element package 3 is configured to be connected and fixed, and is attached to the rear surface of the front panel of a TV camera casing (not shown) via a mounting plate 9.
- a flexible light shielding screen is arranged between the prisms 2 so as to surround the light receiving surface of the solid-state image sensor package 3 in order to prevent harmful light from entering the light-receiving surface of the solid-state image sensor package 3 from the surroundings. It is preferable to install.
- each of the three solid-state image pickup devices is set to X, ⁇ , Z, It is necessary to accurately position the 6 axes of ⁇ X, ⁇ y, and 0 z and fix them to the color separation prism 1 0 1.
- the color separation optical system 1 is fixed to a 6-axis adjusting jig main body (not shown) by a mounting plate 9 and disposed on the surfaces of the R, G, B channel solid-state image pickup device package 3 and the holder 4.
- the 6-axis adjustment jig of the solid-state imaging element package 3 and the holder 4 is integrally operated by a 6-axis adjustment signal.
- FIG. 3 is a side view of the A, A ′ side of Modification 1 with the holder 4 and the solid-state imaging device package 3 of Example 1 of the invention attached, and the adjustment results of the 6-axis adjustment jig (not shown), R, G, If any of the B-channel solid-state image sensor package 3 needs to be adjusted in the left-right direction, the tilt adjustment of the solid-state image sensor package 3 will cause 6 axes. While maintaining the center of the optical axis of the solid-state image pickup device package 3 with the adjusting jig, the solid-state image pickup device package 3 is tilted by moving the holder 4A and the holder 4B back and forth with respect to each other, thereby performing the registration adjustment.
- Fig. 4 is a front view of ⁇ , ⁇ 'of the modified example 2 with the holder of Example 1 of the invention attached and the solid-state imaging device package.
- the adjustment results of the 6-axis adjustment jig not shown above, R, G, B channel When the solid-state image sensor package 3 is tilted, the center of the optical axis of the solid-state image sensor package 3 is maintained by the 6-axis adjustment jig.
- the holder 4 A and the holder 4 B are simultaneously tilted with respect to the optical axis to adjust the registration of the solid-state imaging device package 3.
- the adhesive 7 is cured by irradiating ultraviolet rays, and the wooden holder 4 and the solid-state image pickup device package 3 are connected and fixed.
- the prism applied by the adhesive applied around each of the two holders 4 2 and holder 4 are connected and fixed.
- a light-shielding paint (not shown) around the periphery of the prism 2 except the exit surface.
- holders 4A and 4B shown in Example 1 are respectively attached with holders 4A and 4B 'via an adhesive (or by applying an adhesive around the holder).
- the wedge-shaped surfaces 6 and 6 ′ are stacked in the same direction, and after the 6-axis adjustment, the adhesives 7 and 7 ′ are irradiated with ultraviolet rays and cured to form two layers of holders 4 and 4.
- the solid-state image sensor package 3 is fixed in a fixed manner, and in the same way two holders 4 each The prism 2 and the holder 4 are connected and fixed.
- Other configurations and operations are the same as in Example 1. [Example 3]
- holders 4 A and 4 B shown in Example 1 are respectively attached with holders 4 A and 4 B ′ via an adhesive (or by applying an adhesive around the holders).
- each adhesive 7 and 7 ′ is irradiated with ultraviolet rays and cured, and the two stacked holders 4 and The solid-state image pickup device package 3 is connected and fixed.
- the bonding between the two holders 4 and the prism 2 and the holder 4 are connected and fixed.
- Other configurations and operations are the same as those in the first embodiment.
- the holders 4 A and 4 B shown in the first embodiment are integrated with the holders 4 A and 4 B ′ to form a holder 4, and the wedge-shaped surfaces 6 and 6 ′ at the tip end are inclined.
- the adhesives 7 and 7 ′ are irradiated with ultraviolet rays to be cured, and the holder 4 and the solid-state imaging element package 3 are connected and fixed.
- the prism 2 and the holder 4 are connected and fixed.
- Other configurations and operations are the same as those in the first embodiment.
- the holders 4A and 4B shown in Example IV are replaced with a wedge-shaped surface at the tip thereof so that a semicircular surface 11 is formed.
- the adhesives 7 and 7 'are irradiated with ultraviolet rays to be cured and the holder 4 and the solid-state imaging device package 3 are connected and fixed.
- the prism 2 and the holder 4 are connected and fixed.
- Other configurations and operations are the same as those in the first embodiment.
- the light receiving surface side package surface 5 of the solid-state imaging device package 3 A transparent glass material holder 4 that has a wedge-shaped tip and is attached to the side surface of the prism 2 and is close to the thermal expansion coefficient of the prism 2, and the solid-state imaging device package.
- the triangular gap formed by the surface 5 and the surface 6 with the wedge-shaped inclined surface at the tip of the holder 4 facing outwards is a transparent glass material that approximates the thermal expansion coefficient of the prism 2 and is cylindrical.
- Bar 10 is placed in contact with each surface, and adhesive 7 is applied. Similar to the above, after adjusting 6 axes, adhesive 7 is irradiated with ultraviolet rays and cured, and wood holder 4 and the solid-state imaging device are applied.
- Package 3 is connected and fixed, and prism 2 and holder 4 are connected and fixed in the same way.
- Other configurations and operations are the same as those in the first embodiment.
- the adhesive is described using an ultraviolet curable adhesive, but in addition to this, a light source for bonding work of a 6-axis adjusting jig is used as a diffusion metal octaride lamp or the like.
- a photo-curing adhesive that can be re-cured and fixed may be used.
- the adhesive contains a light-transmitting spherical filler, mechanical properties such as hardness can be improved, polymerization shrinkage can be reduced, and a thermal expansion coefficient can be expected to be reduced.
- the rod 10 and the holder 4 are made of a glass material, but may also be a ceramic material or a metal material such as titanium that approximates the thermal expansion coefficient of the prism 2, and in this case, an adhesive is used.
- a thermosetting adhesive is used for the adhesive, and the adhesive is cured by a hot air source or a heat ray source, and the holder 4 and the solid-state imaging device package 3 are connected and fixed. Similarly, the prism 2 and the holder 4 are connected and fixed. You may do it.
- the plate-shaped holder since the plate-shaped holder is in contact with the light-receiving surface side surface of the solid-state image sensor package, it is not affected by adhesive shrinkage due to changes in ambient temperature even during operation. It is possible to provide a high-accuracy image.
- the adhesive since the plate-shaped holder is in contact with the light receiving surface side surface of the solid-state imaging device package, the adhesive does not protrude to the light receiving surface side of the solid-state imaging device during the application of the adhesive. It is possible to prevent contamination and irregular reflection of the optical image by the adhesive.
- each wedge-shaped tip is attached to the side of the prism so as to contact the light-receiving surface side surface of the solid-state imaging device package.
- Adhesive is applied to each triangular gap formed by the element package surface and the wedge-shaped surface of each plate holder tip, and the plurality of plate holders and the solid-state image sensor package are connected and fixed. Because the bonding area is
- the re-adhesion strength that is twice or more is enhanced, so that even a combination of an extremely small prism and a small solid-state image sensor package can be firmly fixed.
- the amount of adhesive applied is small and the adhesive is dispersed, and the surface of the solid-state imaging device package and the plate-like holder A bar is inserted into a triangular gap formed by the wedge-shaped surface of the tip so as to contact each surface, and the plate holder and the solid-state imaging element package are connected and fixed. Therefore, even if there is curing shrinkage of the adhesive, it is not affected.
- the rod material can be any of transparent glass material, ceramic material, or metal material that approximates the thermal expansion coefficient of the prism
- the plate holder of the 6-axis adjustment jig of the solid-state image sensor is fixed to the prism.
- the material to be used can be selected according to the bonding method.
- the application amount of the thermosetting or photo-curing adhesive is uneven, the heat distribution or the irradiation of light is biased, and the curing shrinkage of the adhesive is biased Even if this occurs, the tip of the semicircular surface of the cross section of the plate-shaped holder is in contact with the light-receiving surface side surface of the solid-state imaging device package, so that it is not affected even if there is curing shrinkage of the adhesive. Since the position of the solid-state image sensor package can be prevented, the solid-state image sensor can be connected and fixed with high precision to cope with an increase in the number of pixels and downsizing.
- the plate-like holder can be any of a transparent glass material, a ceramic material, or a metal material that approximates the thermal expansion coefficient of the prism
- the plate-like holder of the 6-axis adjustment jig of the solid-state image sensor is used as the prism.
- the material used can be selected according to the bonding method to be fixed.
- thermosetting adhesive is applied to the plate-like holder and the bar using a ceramic material or a metal material, the heat-ray-curable adhesive is cured by a heat source, the plate-like holder and the prism, and the plate-like holder
- a system that connects and fixes the solid-state image sensor package can also be used. Therefore, it becomes easy to cope with the fixing method of the 6-axis adjusting jig. 9. According to the invention of claim 9 of the present invention,
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Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/592,794 US20080136946A1 (en) | 2004-06-29 | 2004-06-29 | Imaging Apparatus Using Solid-State Image Pickup Element |
DE112004002901.5T DE112004002901B4 (de) | 2004-06-29 | 2004-06-29 | Abbildungsvorrichtung unter Verwendung eines Festkörper-Bildaufnahmeelements |
PCT/JP2004/009482 WO2006001080A1 (ja) | 2004-06-29 | 2004-06-29 | 固体撮像素子を使用した撮像装置 |
US12/659,206 US8063974B2 (en) | 2004-06-29 | 2010-03-01 | Method for fixing a prism and a solid-state image pickup element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2004/009482 WO2006001080A1 (ja) | 2004-06-29 | 2004-06-29 | 固体撮像素子を使用した撮像装置 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US10/592,794 A-371-Of-International US20080136946A1 (en) | 2004-06-29 | 2004-06-29 | Imaging Apparatus Using Solid-State Image Pickup Element |
US12/659,206 Continuation US8063974B2 (en) | 2004-06-29 | 2010-03-01 | Method for fixing a prism and a solid-state image pickup element |
Publications (1)
Publication Number | Publication Date |
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WO2006001080A1 true WO2006001080A1 (ja) | 2006-01-05 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2004/009482 WO2006001080A1 (ja) | 2004-06-29 | 2004-06-29 | 固体撮像素子を使用した撮像装置 |
Country Status (3)
Country | Link |
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US (2) | US20080136946A1 (ja) |
DE (1) | DE112004002901B4 (ja) |
WO (1) | WO2006001080A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008103846A (ja) * | 2006-10-17 | 2008-05-01 | Sony Corp | 撮像装置及びその製造方法 |
CN103514913A (zh) * | 2012-06-19 | 2014-01-15 | 日立视听媒体股份有限公司 | 光学元件的粘合结构、粘合方法以及光拾取装置 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5041925B2 (ja) * | 2007-08-31 | 2012-10-03 | オリンパスメディカルシステムズ株式会社 | 撮像ユニット |
JP5776006B2 (ja) * | 2011-12-09 | 2015-09-09 | パナソニックIpマネジメント株式会社 | 三板カメラ装置 |
JP6288995B2 (ja) * | 2013-09-06 | 2018-03-07 | キヤノン株式会社 | 光走査装置及び画像形成装置 |
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CN111112945B (zh) * | 2019-11-26 | 2022-06-14 | 天津津航技术物理研究所 | 光电成像设备用成像组件安装框架及其加工方法 |
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2004
- 2004-06-29 DE DE112004002901.5T patent/DE112004002901B4/de not_active Expired - Fee Related
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- 2004-06-29 WO PCT/JP2004/009482 patent/WO2006001080A1/ja active Application Filing
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2010
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JPH0937275A (ja) * | 1995-07-13 | 1997-02-07 | Sony Corp | 固体撮像装置及び固体撮像素子部取付方法 |
JPH09163389A (ja) * | 1995-12-08 | 1997-06-20 | Fuji Photo Optical Co Ltd | 固体撮像素子の取付構造 |
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JP2008103846A (ja) * | 2006-10-17 | 2008-05-01 | Sony Corp | 撮像装置及びその製造方法 |
CN103514913A (zh) * | 2012-06-19 | 2014-01-15 | 日立视听媒体股份有限公司 | 光学元件的粘合结构、粘合方法以及光拾取装置 |
Also Published As
Publication number | Publication date |
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DE112004002901B4 (de) | 2016-05-19 |
US20100212825A1 (en) | 2010-08-26 |
DE112004002901T5 (de) | 2007-05-16 |
US8063974B2 (en) | 2011-11-22 |
US20080136946A1 (en) | 2008-06-12 |
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