WO2005102673A1 - ポリアミド樹脂一体成形物およびその製造方法ならびにポリアミド樹脂の接合助剤 - Google Patents
ポリアミド樹脂一体成形物およびその製造方法ならびにポリアミド樹脂の接合助剤 Download PDFInfo
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- WO2005102673A1 WO2005102673A1 PCT/JP2005/001569 JP2005001569W WO2005102673A1 WO 2005102673 A1 WO2005102673 A1 WO 2005102673A1 JP 2005001569 W JP2005001569 W JP 2005001569W WO 2005102673 A1 WO2005102673 A1 WO 2005102673A1
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- polyamide resin
- weight
- bonding
- joining
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
- B29C66/1142—Single butt to butt joints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/4895—Solvent bonding, i.e. the surfaces of the parts to be joined being treated with solvents, swelling or softening agents, without adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
- B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
- B29C66/43—Joining a relatively small portion of the surface of said articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/12—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives
- C08J5/122—Bonding of a preformed macromolecular material to the same or other solid material such as metal, glass, leather, e.g. using adhesives using low molecular chemically inert solvents, swelling or softening agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2077/00—Use of PA, i.e. polyamides, e.g. polyesteramides or derivatives thereof, as moulding material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2377/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
Definitions
- the present invention relates to a polyamide resin integrated molded article, a method for producing the same, and a bonding aid suitably used for bonding a polyamide resin.
- polyamide resin a linear polymer having an amide bond as a repeating unit in a molecule
- polyamide resins resins mainly having an aliphatic chain are widely distributed as “Nylon” (trade name), and typical examples thereof include nylon 6 and nylon 66.
- Polyamide resin is a crystalline polymer in which hydrogen bonds can be formed between amide bonds of different polymer chains, and its crystal structure is such that amide bonds form regular hydrogen bonds within the same plane. At the same time, it is robust, with each plane arranged in layers.
- the polyamide resin Due to the polarity and crystal structure of the amide bond, the polyamide resin has excellent resistance to hydrocarbon solvents such as gasoline and oil, and has relatively high heat resistance and strength. I have. Therefore, it is widely used as a resin material suitable for automobile parts, mechanical parts, and the like.
- Japanese Patent Application Laid-Open Publication No. 2000-6-1983 discloses that a polyamide resin is injection-molded as a secondary molding material for a primary molded product made of a polyamide resin, and the primary molded product and the secondary molded material are injection-molded.
- a polyamide resin integrated molded product in which an additional molded portion made of a secondary molding material is welded to each other and integrated.
- a conductive wire embedded in a primary molded product made of a polyamide resin by heating a conductive wire embedded in a primary molded product made of a polyamide resin, the primary molded product is melted, and a poly'amide resin as a secondary molding material is injection-molded.
- the conventionally known molded article of a polyamide resin has a problem in that the bonding strength is not sufficient and therefore the reliability is lacking.
- the cause is presumed to be as follows.
- a primary molded product made of a polyamide resin is set in a mold, and an additional molded product part is formed with respect to the primary molded product.
- the molten polyamide resin is formed by injection molding.
- the problem of the decrease in the bonding strength as described above may also occur when manufacturing a molded article of a polyamide resin using a welding method such as ultrasonic welding or vibration welding.
- the present invention has been made in view of the above problems, and an object of the present invention is to provide a polyamide resin having high bonding strength and excellent bonding reliability.
- An object of the present invention is to provide a molded article and a method for producing the same.
- Another object of the present invention is to provide a bonding aid capable of bonding polyamide resins with high bonding strength. Disclosure of the invention
- a joining auxiliary agent is applied to a joining portion of the polyamide resin molded product, and another joining molded portion is formed at the joining site.
- a polyamide resin welded and integrated, wherein the bonding aid comprises: trihydroxybenzene and Z or trihydroxybenzoic acid as component (A); component (A) as component (B) It is intended to include an organic solvent capable of dissolving or dispersing the compound.
- a joining auxiliary agent is applied to a joining site of the polyamide resin molded article and / or a joining site of another polyamide resin molded article.
- the joining parts are welded to each other to be integrated, and the joining auxiliary agent comprises: (A) a component such as trihydroxybenzene and / or trihydroxybenzoic acid; (B) a component; It is intended to include an organic solvent capable of dissolving or dispersing the components.
- polyamide resin integrated molded product according to claim 3 is the one according to claim 1 or 2, wherein the component (A) further includes dihydroxybenzene and Z or dihydroxybenzoic acid. Is the gist.
- the polyamide resin integral molded product according to claim 4 is the molded product according to claim 1, wherein the content of the component (A) is 1% by weight or more and 50% by weight or less.
- the gist is that the content of the component (B) is 50% by weight or more and 99% by weight or less.
- the polyamide resin integrated molded product according to claim 5 is the one according to claims 1 to 4, wherein the component (B) is a mixed organic solvent in which a plurality of types of the organic solvent are mixed.
- the gist is that there is.
- the method for producing an integrally molded polyamide resin article according to claim 6 includes a step of applying a joining aid to a joining site of the polyamide resin molded article, and forming an additional molded article portion at the joining site. Welding another polyamide resin, wherein the bonding aid dissolves trihydroxybenzene and / or trihydroxybenzoic acid as the component (A), and dissolves the component (A) as the component (B)
- the gist of the present invention is to include a dispersible organic solvent.
- a joining aid is applied to a joint site of the polyamide resin molded product and / or a joint site of another polyamide resin molded product. And a step of welding these bonding portions to each other.
- the bonding aid comprises: (A) a component, trihydroxybenzene and / or trihydroxybenzoic acid; and (B) a component:
- the gist of the present invention is to include an organic solvent capable of dissolving or dispersing the component (A).
- the method for producing a polyamide resin integrated molded article according to claim 8 is the method according to claim 6 or 7, wherein the component (A) further comprises dihydroxybenzene and Z or dihydroxybenzoate. The point is that it contains an acid.
- the method for producing a polyamide resin integrated molded product according to claim 9 is the method according to claims 6 to 8, wherein the content of the component (A) is 1% by weight or more and 50% by weight or less.
- the gist is that the content of the component (B) is 50% by weight or more and 99% by weight or less.
- the method for producing a polyamide resin integrated molded product according to claim 10 is the method according to claims 6 to 9, wherein the component (B) is a mixture of a plurality of the organic solvents.
- the gist is that it is a mixed organic solvent.
- the bonding aid for polyamide resin according to claim 11 dissolves trihydroxybenzene and / or trihydroxybenzoic acid as the component (A), and dissolves the component (A) as the component (B). Or contains a dispersible organic solvent.
- the main point is that
- the bonding aid for polyamide resin according to claim 12 is the one according to claim 11, wherein the component (A) further comprises dihydroxybenzene and / or dihydroxybenzoic acid. It should be included.
- the bonding aid for a polyamide resin according to claim 13 is the bonding aid according to claim 11 or 12, wherein the content of the component (A) is 0.1% by weight or more.
- the gist is that the content of the component (B) is 50% by weight or more and 99% by weight or less.
- the bonding aid for polyamide resin according to claim 14 is the bonding aid according to claim 11 or 13, wherein the component (B) is a mixture of a plurality of types of the organic solvent.
- the gist is that it is a mixed organic solvent.
- the joining portion of the polyamide resin molded product is surface-modified by a joining aid, and another polyamide resin serving as an additional molded product portion is welded to the joining site.
- the joining part of the polyamide resin molded article and / or the joining part of another polyamide resin molded article is surface-modified by a joining aid, and these joining parts are mutually connected. It is welded and integrated.
- one containing trihydroxybenzene and / or trihydroxybenzoic acid as the component (A) and an organic solvent capable of dissolving or dispersing the component (A) as the component (B) is used. ing.
- the content of the component (A) is in the range of 1% to 50% by weight and the content of the component (B) is in the range of 50% to 99% by weight, The effect can be made more reliable.
- a mixed organic solvent in which a plurality of types of organic solvents capable of dissolving or dispersing the component (A) are used as the component (B) in the above-mentioned bonding aid one type of organic solvent is used.
- the drying time due to the volatilization of the bonding aid is easily adjusted, and the coating property of the bonding aid is excellent. Therefore, the joining aid is uniformly applied to the joining portion and the surface of the joining portion is uniformly modified, so that the joining reliability is particularly excellent.
- the method for producing a polyamide resin molded article according to the present invention includes a step of applying a joining aid to a joint portion of the polyamide resin molded article, and a step of applying another polyamide to the joint section as an additional molded article portion.
- the above-mentioned bonding aid includes those containing trihydroxybenzene and / or trihydroxybenzoic acid as the component (A) and an organic solvent capable of dissolving or dispersing the component (A) as the component (B). Used.
- the content of the component (A) is in the range of 1% to 50% by weight and the content of the component (B) is in the range of 50% to 99% by weight, The effect can be made more reliable.
- the joining aid is uniformly applied to the joining portion and the surface of the joining portion is uniformly modified, so that the joining reliability is particularly excellent.
- the bonding aid for a polyamide resin according to the present invention includes: (A) a trihydroxybenzene and / or trihydroxybenzoic acid as a component; and (B) an organic solvent capable of dissolving or dispersing the (A) component.
- the content of the component (A) is in the range of 1% to 50% by weight and the content of the component (B) is in the range of 50% to 99% by weight, The effect can be made more reliable.
- a mixed organic solvent obtained by mixing a plurality of organic solvents capable of dissolving or dispersing the component (A) is used as the component (B) in the above-mentioned bonding aid, one type of organic solvent is used.
- the bonding aid is used, the drying time due to the volatilization of the bonding aid is easily adjusted, and the coating property of the bonding aid is excellent. Therefore, the bonding aid can be uniformly applied to the bonding site, and the surface of the bonding site can be uniformly modified.
- FIG. 1 is an external perspective view of a test piece P according to the present embodiment and a primary molded part P 1 constituting the same.
- FIG. 2 is an external perspective view of a mold used when the test piece P according to the present embodiment is formed by injection molding.
- the polyamide resin integral molded product according to the present invention (hereinafter, referred to as “the present polyamide resin integral molded product”) is provided with the joining aid according to the present invention (hereinafter, referred to as “the present polyamide resin molded product”) at the joining site of the polyamide resin molded product. It is called “this joining aid”.) Is applied and another polyamide resin to be an additional molded part is welded to this joint part, or the joint part and / or another polyamide resin molded article has The present joining aid is applied to the joining parts of the molded polyimide resin, and these joining parts are welded to each other.
- a bonding aid is applied to a joint portion of the polyamide resin molded article, and is inserted into a mold. Injection of the polyamide resin causes the molded article of the polyamide resin and the additional molded article to be welded to each other to form an integral molded article that can be obtained.
- the bonding aid is applied to a joint portion of the polyamide resin molded article and / or a joint portion of another polyamide resin molded article.
- polyamide resin examples include aliphatic polyamides such as nylon 6, nylon 66, nylon MX6, nylon 11, nylon 12, nylon 46, nylon 610, and nylon 612, and aromatic polyamides. These may be used alone or in combination of two or more. Further, polymer alloy resins containing these polyamide resins may be used.
- the shapes of the polyamide resin molded article and the polyamide resin molded article may be various shapes such as a hollow shape, and can be appropriately selected according to the application.
- the polyamide resin molded product may be obtained by injection molding, blow molding, extrusion molding, transfer molding, compression molding, cutting, or the like. Further, the polyimide resin molded article may have a plurality of joining sites, and is not particularly limited.
- This bonding aid contains trihydroxybenzene and / or trihydroxybenzoic acid as the component (A) and an organic solvent capable of dissolving or dispersing the component (A) as the component (B).
- Trihydroxybenzene in the component includes 1,2,3 trihydroxybenzene (CAS number; RN [87-66-1], pyrogallol) and 1,2,4 trihydroxybenzene (CAS number; RN [533- 73- 3)), 1,3,5 trihydroxybenzene (CAS number; RN [108-73-6]), 1,3,5 trihydroxybenzene dihydrate (CAS number; RN [609 9—90—7]).
- trihydroxybenzoic acid includes 2,3,4 trihydroxybenzoic acid (CAS number; RN [610-10-2-6]), 2,4,6 trihydroxybenzoic acid (CAS number;; RN [83-30-79]), 2,4,6 trihydroxybenzoic acid monohydrate (CAS number; RN [71 89 9-93-0]), 3,4,5 Trihydroxybenzoic acid (CAS number; RN [149-91-17], gallic acid), 3,4,5 Trihydroxybenzoic acid monohydrate (CAS number; RN [599 5—86—8]).
- the present bonding assistant may further contain dihydroxybenzene and / or dihydroxybenzoic acid in the component (A).
- dihydroxybenzene examples include 1,2 dihydroxybenzene (CAS number; RN [1 20—80—9]) 1,3 dihydroxybenzene (CAS number; RN [1 08—46—3 )) And 1,4-dihydroxybenzene (CAS number; RN [123-31-9]).
- dihydroxybenzoic acid examples include 2,3 dihydroxybenzoic acid (CAS number; RN [303-38-8]) and 2,4 dihydroxybenzoic acid (CAS number; RN [89-86-). 1)), 2,5-dihydroxybenzoic acid (CAS number; RN [490-79-9]), 2,6-dihydroxybenzoic acid (CAS number; RN [303-07-1]) 3 , 4 dihydroxybenzoic acid (C AS number; RN [99-50-3]) and 3,5 dihydroxybenzoic acid (CAS number; RN [99-1 10-5]).
- any of a volatile solvent and a nonvolatile solvent may be used, but a volatile solvent is preferably used.
- an organic solvent that can slightly dissolve the polyamide resin can be suitably used.
- organic solvent examples include alcohols having 1 to 6 carbon atoms, ketones or aldehydes having 1 to 6 carbon atoms, nitriles having 1 to 6 carbon atoms, and more specifically, , Methanol, ethanol, isopropyl alcohol, acetone, and acetonitrile, and these may be used alone or in combination of two or more.
- the bonding assistant should be used immediately after application to the joint site, taking into account the temperature environment and working environment in which the bonding assistant is used. There is an advantage that the drying time can be adjusted appropriately so as not to dry.
- the mixing ratio of the above components (A) and (B) is such that the content of the above component (A) is 1% by weight or more and 50% by weight or less from the viewpoint of obtaining high bonding strength.
- the content of the component should be within the range of 50% by weight or more and 99% by weight or less.
- the content of the component (A) is 5% by weight or more and 25% by weight or less, and the content of the component (B) is 75% by weight or more and 95% by weight or less, more preferably, the component (A) It is preferable that the content is in the range of 5% by weight to 15% by weight, and the content of the component (B) is in the range of 85% by weight to 95% by weight.
- the joining strength of the polyamide resin molded article tends to decrease. Is not preferred because
- the present bonding aid may be produced by any method capable of uniformly dissolving or dispersing the component (A) in the component (B), and is particularly limited. It is not done.
- the above-mentioned bonding resin may be added with the above-mentioned polyamide resin, dye, thickener, antioxidant, and the like, as long as the surface modifying action on the polyamide resin is not impaired.
- the method of applying the present bonding aid to the bonding site is not particularly limited as long as it can be spread thinly to the bonding site and applied in a constant amount.
- various coating methods such as coating with a brush and coating with a sponge can be used.
- the bonding aid when applied to the bonding site of the polyamide resin molded product, the polyamide resin on the surface of the bonding site is activated by the reducing action of the component (A).
- the molten polyamide resin is applied to the activated joint, or when the joints are welded to each other, the molten polymer is melted.
- the two are firmly linked mainly by chemical bonding and are integrated.
- a bonding aid according to the present example was produced by the following procedure. That is, as shown in Tables 1 to 15 below, (A) components include 1,2,3 trihydroxybenzene (pyrogallol), 3,4,5 trihydroxybenzoic acid (gallic acid) ), 1,3 dihydroxy benzene, 3,5 dihydroxy benzoic acid, and methanol and isopropyl alcohol as the component (B) so as to have a predetermined weight ratio. After mixing, a bonding aid according to the present example was obtained.
- the joining aids according to Examples 35 to 68 have the same composition as the joining aids according to Examples 1 to 34.
- 1,2,3 trihydroxybenzene, 3,4,5 trihydroxybenzoic acid, 1,3 dihydroxybenzene, 3,5 dihydroxybenzoic acid, methanol and isopropyl alcohol are all Wako Pure. It is manufactured by Yakuhin Kogyo Co., Ltd. -(Preparation of test piece according to this example)
- FIG. 1 is an external perspective view of a test piece P and a primary molded part P1 constituting the same.
- FIG. 2 is an external perspective view of a mold used when forming the test piece P by injection molding.
- a test piece P made of a polyamide resin was prepared by injection molding according to the following procedure. That is, after the joining aid according to the present embodiment is uniformly applied to the joining end face 1 of the primary molded portion P 1 previously formed by injection molding with a brush, It was set in dies 2 and 3, and the additional molding part P2 was added by injection. Thus, a test piece P according to the present example in which the primary molded portion P1 and the additional molded portion P2 were welded and integrated was produced.
- test piece P is formed in a strip shape and has a uniform thickness.
- the material of the test piece P is nylon 6 resin (Amilan CM 1026, manufactured by Toray Industries, Inc.), nylon 66 resin (Zytel 101 L, manufactured by Dupont, Inc.) or nylon 12 resin. ("Diamid L 1640", manufactured by Daicel Degussa Co., Ltd.).
- the injection molding conditions were as follows. That is, “SE-18S” manufactured by Sumitomo Heavy Industries, Ltd. was used as the injection molding device.
- the molding temperature was 240-245-240-235 ° C for nylon 6 in order from the injection nozzle.
- nylon 66 the temperature was set to 290-295-290-285 ° C from the injection nozzle.
- Nylon 12 was set at 230-235-230-225 ° C from the injection nozzle.
- the mold temperature for nylon 6 and nylon 66 was set to 65 ° C when molding the primary molded part P1, and was set to 95 ° C when molding the secondary molded part P2.
- the temperature of nylon 12 was set to 50 ° C. for both the primary molding Pl and the secondary molding P2.
- Tables 1 to 15 show the test results of the joining aid and the test piece according to this example.
- the test pieces according to Examples 1 to 34 are made of nylon 6 resin
- the test pieces according to Examples 35 to 68 are made of nylon 66 resin
- the test pieces according to Examples 69 to 71 are used.
- Such a test piece is made of nylon 12 resin.
- test piece according to Comparative Example 1 was produced in the same manner as the test piece according to the example, except that the whole was molded into the same shape as the test piece P by a single injection molding using nylon 6 resin.
- the tensile strength of the test piece according to Comparative Example 1 was 76.3 MPa, and the standard deviation was 0.8 MPa.
- test piece according to Comparative Example 2 was produced in the same manner as the test piece according to the example, except that no joining aid was applied to the joining end surface 1 of the primary molded part P1.
- the test piece was made of nylon 6 resin.
- the tensile strength of the test piece according to Comparative Example 2 was 13.3 MPa, and the standard deviation was 9.2 MPa.
- a test piece according to Comparative Example 3 was produced in the same manner as the test piece according to the example, except that the whole was formed into the same shape as the test piece P by one injection molding.
- the test piece according to Comparative Example 3 had a tensile strength of 78.8 MPa and a standard deviation of 1.8 MPa.
- a test piece according to Comparative Example 4 was produced in the same manner as the test piece according to the example, except that no joining aid was applied to the joining end surface 1 of the primary molded part P1.
- nylon 66 resin was used as the material of the test piece.
- the tensile strength of the test piece according to Comparative Example 4 was 6. IMPa, and the standard deviation was 1.5 MPa.
- test piece according to Comparative Example 5 was produced in the same manner as the test piece according to the example except that the whole was molded into the same shape as the test piece P by a single injection molding using nylon 12 resin.
- the test piece according to Comparative Example 5 had a tensile strength of 43. IMP a and a standard deviation of 0.3 MPa.
- test piece according to Comparative Example 6 was produced in the same manner as the test piece according to the example, except that no joining aid was applied to the joining end surface 1 of the primary molded part P1.
- nylon 12 resin was used for the material of the test piece.
- the tensile strength of the test piece according to Comparative Example 6 was 5.9 MPa, and the standard deviation was 0.9 MPa.
- test pieces using nylon 6) according to Examples 1 to 34 have the same bonding strength as the test piece according to Comparative Example 1 manufactured by one injection molding.
- test pieces according to Examples 35 to 68 (using nylon 66) have a bonding strength comparable to that of the test piece according to Comparative Example 3 manufactured by one injection molding. I understand.
- test pieces according to Examples 69 to 71 (using Nia zipper 12) have a joining strength comparable to that of the test piece according to Comparative Example 5 manufactured by one injection molding. You can see that. In addition, it can be seen that the test pieces according to Examples 1 to 34 have extremely superior bonding strength as compared with the test piece according to Comparative Example 2 which was bonded without using the bonding aid. .
- test pieces according to Examples 35 to 68 have extremely superior bonding strength as compared with the test piece according to Comparative Example 4 which was bonded without using a bonding aid. I understand.
- test pieces according to Examples 69 to 71 have extremely superior bonding strength as compared with the test piece according to Comparative Example 6 which was bonded without using a bonding aid. I understand.
- the present invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the present invention.
- the case where the polyimide resin integral molded article is manufactured by using the injection welding method has been described.
- the ultrasonic resin welding method, the vibration welding method, or the like may be used to form the polyamide resin molding.
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- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05709663A EP1757431A4 (en) | 2004-04-26 | 2005-01-27 | INTEGRATED MOLDINGS OF A POLYAMIDE RESIN, METHOD OF MANUFACTURING SAME, AND SEALING ASSISTANCE FOR THE POLYAMIDE RESIN |
KR1020067024711A KR20070034997A (ko) | 2004-04-26 | 2005-01-27 | 폴리아미드 수지의 일체형 성형물, 이의 제조방법 및폴리아미드 수지용 접합 조제 |
US11/587,919 US20070225417A1 (en) | 2004-04-26 | 2005-01-27 | Polyamide Resin Integrally Molded Product, a Method for Manufacturing the Same, and a Joining Auxilary for Polyamide Resin |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-129387 | 2004-04-26 | ||
JP2004129387A JP4451200B2 (ja) | 2004-04-26 | 2004-04-26 | ポリアミド樹脂一体成形物およびその製造方法ならびにポリアミド樹脂の接合助剤 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005102673A1 true WO2005102673A1 (ja) | 2005-11-03 |
Family
ID=35196820
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/001569 WO2005102673A1 (ja) | 2004-04-26 | 2005-01-27 | ポリアミド樹脂一体成形物およびその製造方法ならびにポリアミド樹脂の接合助剤 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20070225417A1 (ja) |
EP (1) | EP1757431A4 (ja) |
JP (1) | JP4451200B2 (ja) |
KR (1) | KR20070034997A (ja) |
CN (1) | CN1984765A (ja) |
WO (1) | WO2005102673A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4677215B2 (ja) * | 2004-09-09 | 2011-04-27 | 康治 友田 | 歯車 |
EP2374593A1 (de) * | 2010-04-06 | 2011-10-12 | nolax AG | Spritzgussverfahren zur Modifizierung einer Oberfläche eines apolaren Polymerformkörpers sowie für dieses Verfahren geeignete Mehrschichtfolie |
EP2896656B1 (en) * | 2012-09-14 | 2019-05-08 | Toray Industries, Inc. | Polyamide resin composition and molded article |
HUE045126T2 (hu) | 2015-10-16 | 2019-12-30 | Henkel Ag & Co Kgaa | Eljárás két poliamid mûanyag egymáshoz történõ hegesztésére egy primer alkalmazásával és az eljárással elõállítható tárgy |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08267585A (ja) * | 1995-03-31 | 1996-10-15 | Toray Ind Inc | 溶着樹脂成形品およびその製造方法 |
JPH11240073A (ja) * | 1998-02-26 | 1999-09-07 | Toray Ind Inc | 溶着樹脂成形品の製造方法およびその溶着樹脂成形品 |
JP2000061983A (ja) | 1998-06-08 | 2000-02-29 | Mitsubishi Engineering Plastics Corp | ポリアミド樹脂製一体成形品 |
EP1195419A2 (en) | 2000-10-05 | 2002-04-10 | Ube Industries, Ltd. | Joint for nylon resin moldings |
JP2002188786A (ja) * | 2000-10-05 | 2002-07-05 | Ube Ind Ltd | ナイロン樹脂成形品の接着用継手及び接着方法 |
JP2003089783A (ja) * | 2001-09-18 | 2003-03-28 | Ube Ind Ltd | ナイロン樹脂成形品用接着剤 |
US20030085489A1 (en) | 2001-07-09 | 2003-05-08 | Kumeo Kondou | Injection molding method of polyamide resin molded article |
JP2003261847A (ja) | 2002-03-07 | 2003-09-19 | Hitachi Kasei Polymer Co Ltd | 接着剤組成物 |
JP2004231942A (ja) * | 2003-01-10 | 2004-08-19 | I Oi:Kk | ポリアミド樹脂の接合助剤、及びこれを用いた接合方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL294035A (ja) * | 1962-06-18 | |||
US3432464A (en) * | 1966-12-27 | 1969-03-11 | Continental Can Co | Polyhydroxy aromatic compounds in polyamide cements as adhesion promoters |
JP4024046B2 (ja) * | 2002-01-10 | 2007-12-19 | 宇部興産株式会社 | ナイロン樹脂パイプとナイロン樹脂継手の接着方法 |
US7588659B2 (en) * | 2003-01-10 | 2009-09-15 | Kabushiki Kaisha Katazen | Bonding aid for polyamide resin and method of bonding with the same |
-
2004
- 2004-04-26 JP JP2004129387A patent/JP4451200B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-27 CN CNA2005800132014A patent/CN1984765A/zh active Pending
- 2005-01-27 US US11/587,919 patent/US20070225417A1/en not_active Abandoned
- 2005-01-27 KR KR1020067024711A patent/KR20070034997A/ko not_active Application Discontinuation
- 2005-01-27 EP EP05709663A patent/EP1757431A4/en not_active Withdrawn
- 2005-01-27 WO PCT/JP2005/001569 patent/WO2005102673A1/ja active Application Filing
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08267585A (ja) * | 1995-03-31 | 1996-10-15 | Toray Ind Inc | 溶着樹脂成形品およびその製造方法 |
JPH11240073A (ja) * | 1998-02-26 | 1999-09-07 | Toray Ind Inc | 溶着樹脂成形品の製造方法およびその溶着樹脂成形品 |
JP2000061983A (ja) | 1998-06-08 | 2000-02-29 | Mitsubishi Engineering Plastics Corp | ポリアミド樹脂製一体成形品 |
EP1195419A2 (en) | 2000-10-05 | 2002-04-10 | Ube Industries, Ltd. | Joint for nylon resin moldings |
JP2002188786A (ja) * | 2000-10-05 | 2002-07-05 | Ube Ind Ltd | ナイロン樹脂成形品の接着用継手及び接着方法 |
US20030085489A1 (en) | 2001-07-09 | 2003-05-08 | Kumeo Kondou | Injection molding method of polyamide resin molded article |
JP2003089783A (ja) * | 2001-09-18 | 2003-03-28 | Ube Ind Ltd | ナイロン樹脂成形品用接着剤 |
JP2003261847A (ja) | 2002-03-07 | 2003-09-19 | Hitachi Kasei Polymer Co Ltd | 接着剤組成物 |
JP2004231942A (ja) * | 2003-01-10 | 2004-08-19 | I Oi:Kk | ポリアミド樹脂の接合助剤、及びこれを用いた接合方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1757431A4 |
Also Published As
Publication number | Publication date |
---|---|
KR20070034997A (ko) | 2007-03-29 |
JP2005305953A (ja) | 2005-11-04 |
EP1757431A1 (en) | 2007-02-28 |
EP1757431A4 (en) | 2008-02-13 |
US20070225417A1 (en) | 2007-09-27 |
JP4451200B2 (ja) | 2010-04-14 |
CN1984765A (zh) | 2007-06-20 |
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