WO2005101486A1 - ウエハ処理装置及びウエハ処理方法 - Google Patents
ウエハ処理装置及びウエハ処理方法 Download PDFInfo
- Publication number
- WO2005101486A1 WO2005101486A1 PCT/JP2005/007116 JP2005007116W WO2005101486A1 WO 2005101486 A1 WO2005101486 A1 WO 2005101486A1 JP 2005007116 W JP2005007116 W JP 2005007116W WO 2005101486 A1 WO2005101486 A1 WO 2005101486A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- adhesive sheet
- wafer
- temperature
- semiconductor wafer
- cutting
- Prior art date
Links
- 238000003672 processing method Methods 0.000 title claims description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 163
- 239000000853 adhesive Substances 0.000 claims abstract description 161
- 238000005520 cutting process Methods 0.000 claims abstract description 98
- 239000004065 semiconductor Substances 0.000 claims abstract description 55
- 230000001681 protective effect Effects 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 16
- 235000012431 wafers Nutrition 0.000 description 191
- 230000002093 peripheral effect Effects 0.000 description 20
- 238000003825 pressing Methods 0.000 description 18
- 230000003028 elevating effect Effects 0.000 description 9
- 230000006870 function Effects 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
- 230000037303 wrinkles Effects 0.000 description 5
- 241000920340 Pion Species 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/6839—Separation by peeling using peeling wedge or knife or bar
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/274—Manufacturing methods by blanket deposition of the material of the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
Definitions
- Wafer processing apparatus and wafer processing method Wafer processing apparatus and wafer processing method
- the present invention relates to a wafer processing apparatus and a wafer processing method, and in particular, can cut a heat-sensitive adhesive sheet according to the size of an adherend while securely bonding the adhesive sheet to the adherend.
- the present invention relates to a wafer processing apparatus and a wafer processing method.
- wafer After a semiconductor wafer on which a circuit surface is formed (hereinafter, simply referred to as a "wafer") is divided into chips, each chip is picked up and bonded (die-bonded) to a lead frame. Has been done.
- This die bonding can be performed by attaching a heat-sensitive adhesive sheet for die bonding in advance in the wafer processing step.
- Patent Document 1 An example of such an adhesive sheet sticking apparatus is disclosed in Patent Document 1.
- the bonding apparatus disclosed in this document sucks and supports a wafer and supplies a first table that is maintained at a preheating temperature at which an adhesive sheet for die bonding is temporarily attached, and an adhesive sheet on the upper surface side of the wafer.
- a sheet feeding device, a press roll for pressing the adhesive tape supplied to the upper surface side of the wafer and temporarily attaching the adhesive sheet to the wafer, a cutter for cutting the adhesive sheet along the outer peripheral edge of the wafer, and an adhesive sheet A second table that adsorbs and supports the wafer to which the wafer is temporarily attached, and a heating device that is disposed above the second table.
- the wafer supported by the second table is heated by the heating device to a temperature higher than the preheating temperature, whereby the adhesive sheet is completely bonded to the wafer.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-257898
- the first table on which the adhesive sheet is temporarily attached is kept at the preheating temperature, when the adhesive sheet larger than the plane area of the wafer is applied, the first table protrudes from the outer peripheral edge of the wafer.
- the adhesive sheet portion may strongly adhere to the table, and there is a disadvantage that it is difficult to remove the unnecessary adhesive sheet portion on the outer peripheral side after cutting the adhesive sheet along the outer edge of the wafer.
- the unnecessary adhesive sheet portion is not bonded to the first table at all, the unnecessary adhesive sheet portion is in a free state. The sheet is pulled by the tension for holding its posture and the pressing force of the press roll, and wrinkles are generated, and air bubbles are trapped between the wafer and the adhesive sheet, which is a factor that causes poor adhesion of the adhesive sheet. Become.
- Patent Document 1 a wafer to which an original sheet in a state where an adhesive sheet and a protective tape are overlapped is adhered is used to peel off the protective tape with a robot arm.
- the wafer is transferred to the table, it is necessary to return the temperature to room temperature, so that it takes time to lower the temperature, and the processing efficiency when the entire wafer processing process is captured is reduced. Inconvenience.
- the temperature is not controlled when the wafer is transferred from the first table to the second table, and the wafer is heated after the wafer is transferred to the second table. However, this point is also a factor that lowers the wafer processing efficiency.
- the present invention has been devised in view of such inconvenience, and an object thereof is to apply a heat-sensitive adhesive tape to an adherend such as a wafer so that the size of the adherent tape is increased.
- Another object of the present invention is to provide an adhesive sheet that is formed around a wafer when the adhesive sheet is attached to the wafer. While avoiding that the unneeded adhesive sheet part strongly adheres to the surface of the attaching table, when the adhesive sheet is attached to the wafer, the adhesive sheet on the wafer does not wrinkle, etc.! / ⁇ To provide a wafer processing apparatus.
- Another object of the present invention is to shorten the temperature control time and improve the overall processing efficiency when attaching an adhesive sheet to a wafer requiring temperature control.
- An object of the present invention is to provide a wafer processing apparatus.
- the present invention provides a table for supporting an adherend and a heat-sensitive adhesive sheet on an upper surface of the adherend, and affixes the adhesive sheet to the adherend.
- a wafer processing apparatus including an attaching unit and cutting means for cutting the adhesive sheet for each adherend;
- the table has a first temperature at which the adhesive sheet is temporarily attached, a second temperature at which the adhesive sheet is reduced in adhesiveness to cut the adhesive sheet around the adherend, and an adhesive sheet attached to the adherend.
- the configuration is such that the temperature is controlled to the third temperature for complete adhesion.
- the tables are configured as individually independent tables so as to keep the adherend at the first to third temperatures.
- the present invention provides a table for supporting a semiconductor wafer as an adherend, a sticking unit for supplying a band-shaped heat-sensitive adhesive sheet to an upper surface side of the semiconductor wafer and sticking the same, And a cutting means for cutting the semiconductor wafer into semiconductor wafers.
- the cutting means has a width direction cutting function for cutting the adhesive sheet in the width direction, and a circumferential direction cutting function for cutting the adhesive sheet along the outer periphery of the semiconductor wafer,
- the table is controlled at a first temperature to temporarily attach the adhesive sheet to the semiconductor wafer, and the adhesive table around the semiconductor wafer is controlled to a second temperature lower than the first temperature. And a bonding table that is controlled to a third temperature higher than the first temperature and completely bonds the bonding sheet to the semiconductor wafer. Has been adopted.
- the wafer processing apparatus further includes a transfer device for transferring the semiconductor wafer.
- the transfer device includes a temperature adjusting unit that adjusts the temperature of the semiconductor wafer while transferring the semiconductor wafer between the tables.
- the apparatus further includes a transfer device for transferring the semiconductor wafer on which the adhesive sheet is completely stuck to a mounting device, wherein the transfer device transfers the semiconductor wafer to the mounting device while transferring the semiconductor wafer to the mounting device.
- a transfer device for transferring the semiconductor wafer on which the adhesive sheet is completely stuck to a mounting device, wherein the transfer device transfers the semiconductor wafer to the mounting device while transferring the semiconductor wafer to the mounting device.
- the sticking table includes an inner table portion and an outer table portion surrounding the inner table portion, and the outer table portion is controlled at a lower temperature than the inner table portion.
- a heat transfer member is interposed between the inner table portion and the outer table portion, and the outer table portion is heated to a lower temperature than the inner table portion by the heat transfer member. I have.
- the temperature of the inner table portion and the temperature of the outer table portion are independently controlled.
- a die bonding sheet can be used as the adhesive sheet.
- a protective sheet that cures to form a protective film can be used.
- the cutting means includes a cutter, and a tip position of the cutter can be adjusted between a position where the adhesive sheet is cut in the width direction and a position where the adhesive sheet is cut along the outer edge of the adherend. Is provided.
- the present invention relates to a wafer processing method for attaching a band-shaped heat-sensitive adhesive sheet to an upper surface side of a semiconductor wafer,
- the wafer processing method further includes a step of transferring the semiconductor wafer to which the adhesive sheet has been completely bonded to a mounting apparatus via a transfer apparatus, and the transfer apparatus is used during the transfer step. And cooling the semiconductor wafer via the semiconductor wafer.
- temporary attachment is used when attaching an adhesive sheet to an adherend such as a wafer and cutting the adhesive sheet according to the shape of the adherend or the like. Is a state that shows initial adhesiveness to the extent that peeling or curling of the adhesive sheet does not occur in the bonded area.
- plete bonding refers to a state of stronger bonding than temporary bonding, after the dicing step, pick-up step, etc. This refers to a state in which the adhesive sheet exhibits an adhesive property to the extent that the adhesive sheet does not peel off from the adherend by the process.
- the temperature is set to the second temperature for reducing the adhesiveness of the adhesive sheet. Therefore, the process of cutting the adhesive sheet at the temperature is performed.
- the cutting operation at the time of performing can be made smooth.
- the cutting of each wafer sent as an object to be sequentially processed is such that the adhesive is transferred to the cutting edge area of the cutter. It can be performed with high accuracy.
- the attachment table includes the inner table portion and the outer table portion and is provided so as to be capable of controlling the temperature, even if the heat-sensitive adhesive sheet is larger than the plane size of the semiconductor wafer, the semiconductor table can be used.
- the area corresponding to the wafer can be kept at the temporary attachment temperature, and the inconvenience that the portion located on the outer peripheral side and removed as an unnecessary adhesive sheet portion strongly adheres to the outer table can be eliminated.
- the unnecessary adhesive sheet portion is adhered to the outer table portion to such an extent that removal or peeling is not hindered. Sa Can be avoided.
- the temperature of the semiconductor wafer can be controlled by the transfer device, the temperature can be easily and quickly adjusted to a preset temperature when the adherend is transferred. As for the force, it is not necessary to adjust the temperature of the semiconductor wafer in the mounting device, the mounting process can be performed immediately, and the processing efficiency of the entire wafer processing device can be improved.
- the cutter has the width direction cutting function and the circumferential direction cutting function, a single power cutter can be shared to simplify the configuration.
- FIG. 1 is a schematic plan view showing the overall configuration of a wafer processing apparatus according to the present embodiment.
- FIG. 2 is a schematic cross-sectional view for explaining a wafer processing process over time.
- [3] A front view showing an initial processing step of a wafer and an attaching device.
- FIG. 5 A schematic front view showing an initial stage of temporarily attaching an adhesive sheet.
- FIG. 7 is a schematic perspective view showing an attaching table and an interlocking mechanism.
- FIG. 8 is a partial cross-sectional view of FIG. 7.
- FIG. 9 is a schematic front view showing the operation of the cutting means.
- FIG. 10 A schematic front view showing a state in which a wafer is transferred to a table for cutting an outer periphery of a pasting table cover.
- FIG. 12 is a schematic front view showing a state where a sheet portion remaining on the outer periphery of the wafer transferred to the outer periphery cutting table is cut.
- [13] A schematic plan view showing a region where a wafer is transferred by the transfer device.
- FIG. 14 is a schematic front view of a mounting device.
- FIG. 15 is a schematic front view showing a transferred state of a work in which a wafer is mounted on a ring frame.
- FIG. 16 is a schematic plan view of a mounting device.
- FIG. 1 is a plan view of a wafer processing apparatus according to the present embodiment
- FIG. 2 is a schematic cross-sectional view for explaining a wafer processing step over time.
- the wafer processing apparatus 10 targets a wafer W on which a UV-curable protective tape PT (see FIG. 2) is adhered to a surface forming a circuit surface, and a heat-sensitive adhesive for die bonding is attached to the back surface of the wafer W.
- Adhesive sheet S (hereinafter referred to as “adhesive sheet S”), and then dicing tape DT It is configured as an apparatus that processes a series of steps for mounting the wafer W on the ring frame RF via the.
- the wafer processing apparatus 10 includes a cassette 11 for accommodating a wafer W, a robot 12 for suction-holding the wafer W taken out from the cassette 11, and a protection tape PT A UV irradiation unit 13 for irradiating the wafer W, an alignment device 14 for positioning the wafer W, a bonding device 15 for bonding the adhesive sheet S (see FIG. 2) to the back surface of the aligned wafer W, and a bonding device.
- a mounting device 18 including a tape attaching unit 16 for attaching the dicing tape DT to the wafer W after the sheet S is attached and mounting the wafer W on the ring frame RF, and a tape removing unit 17 for removing the protective tape PT; , And the storage tape 19 for storing the W from which the protection tape PT has been peeled off.
- the robot 12 includes a single-axis moving device 21, a slider 22 that moves along the single-axis moving device 21, a vertical movement mechanism 24 erected on the slider 22, and a vertical movement
- An articulated arm 26 provided at the upper end of the mechanism 24 and rotatable in a substantially horizontal plane, and a suction device having a substantially C-shaped or substantially U-shaped planar shape attached to the tip of the arm 26.
- the member 27 is used.
- the suction member 27 is connected to the distal end of the arm 26 via a rotation mechanism 28 that can turn the surface of the wafer W upside down.
- the UV irradiation unit 13 includes a suction table 30 on which the wafer W held by suction on the suction member 27 of the robot 12 is transferred and suctioned, and a suction table 30 for sucking the wafer W. And a case 32 that covers the suction table 30 and the UV lamp 31.
- the suction table 30 is provided so as to be able to reciprocate along a horizontal direction in FIG. 3 in a substantially horizontal plane via an advance / retreat mechanism (not shown).
- the alignment device 14 includes an alignment table 34 provided with an XY moving mechanism and rotatably provided, and a V notch (not shown) of the wafer W provided on the upper surface side of the alignment table 34.
- a sensor 35 that also has a camera force to detect And a uniaxial robot 37 that supports the alignment table 34 so as to be able to move forward and backward with respect to the one position.
- the lower surface of the transfer plate 36 is a suction surface, and receives the wafer W that has been irradiated with UV light through the robot 12. At this time, the wafer W is turned over so that the protective tape PT side faces the lower surface side, and is sucked on the suction surface of the transport plate 36.
- the transport plate 36 is located above the alignment table 34 and is movably provided in the horizontal direction in FIG. When the transfer plate 36 receives the wafer W after UV irradiation from the robot 12, the alignment table 34 moves to the lower surface side via the -axis robot 37 to receive the wafer W, and then the alignment is performed. Then, the wafer W is sucked again to the transfer plate 36 and transferred to the sticking device 15.
- the attaching device 15 receives the wafer W from the transport plate 36 and supports the wafer W, and the attaching table 40 is attracted to the attaching table 40.
- a bonding unit 41 for temporarily attaching the adhesive sheet S to the back side (upper side) of the wafer W, cutting means 43 for cutting the adhesive sheet S in the width direction for each wafer W, and a wafer W from the attaching table 40.
- a transfer device 45 that adsorbs and transfers the wafer, and an unnecessary adhesive sheet portion S1 that supports the wafer W transferred via the transfer device 45 by suction and protrudes from the outer periphery of the wafer W (see FIG. 4).
- the attachment table 40 has an upper surface formed as an adsorption surface, and is capable of melting the adhesive sheet S to a certain extent and temporarily attaching to the wafer W. Is maintained at approximately 110 ° C. in this embodiment.
- the sticking table 40 includes a base table 40B, an inner table 40C provided on the upper surface side of the base table 40B, and an outer table 40D surrounding the inner table 40C. It is configured with.
- the inner table 40C is The wafer W is provided in substantially the same plane shape as the supporting surface so as to form a supporting surface, and a heater 1H is arranged inside the wafer w to keep the wafer W at approximately 110 ° C.
- a heat transfer member 44 is disposed in a clearance C formed between the inner table portion 40C and the outer table portion 40D, and the outer table portion 40D is formed by the heat transfer member 44.
- the temperature is set to be maintained at a temperature lower than the above temperature, that is, about 40 ° C. Therefore, the unnecessary adhesive sheet portion S1 protruding outside the wafer W is bonded to the outer table portion 40D with a weak adhesive force, and wrinkles and the like are generated on the wafer when the adhesive sheet S is attached to the wafer W. Flower ,.
- the pasting table 40 is provided at a position where wafers W can be received from the transport plate 36 via a moving device 52 and at a position below the pasting unit 41 where the outer peripheral cutting table 47 passes. It is provided so as to be able to reciprocate between a position reaching upward and to be able to move up and down through an elevating device 53.
- the sticking table 40 may be provided with the inner table portion 40C and the outer table portion 40D rotatably in a plane.
- the moving device 52 penetrates a pair of rails 54, 54, a slide plate 55 guided by the rails 54 and moving on the rails 54, and a screwed-in state to a bracket 57 fixed to the slide plate 55.
- the ball spline shaft 58 is provided with a motor M (see FIG.
- the elevating device 53 includes an up-and-down moving mechanism 62 arranged at the center of the lower surface of the attaching table 40, a guide block 63 fixed on the slide plate 55, and four elevating and lowering members along the guide block 63.
- a cutter receiving groove 40A for cutting the band-shaped adhesive sheet S fed from the attaching unit 41 in the width direction is formed, and the attaching table 40 is moved.
- a rack 65 A guide bar 67 is provided on the outer surface of the rack 65.
- the attaching unit 41 is provided in a region of a plate-like frame F arranged above the attaching table 40.
- the sticking unit 41 includes a support roll 70 that supports the adhesive sheet S wound in a roll shape so as to be able to be supplied, a drive roll 71 and a pinch roll 72 that apply a feeding force to the adhesive sheet S, and an adhesive sheet.
- the dancer roll 75, the pressing member 76 for pressing the lead end area of the adhesive sheet S from which the release sheet PS has been released onto the upper surface of the attaching table 40 and sandwiching the adhesive sheet S, and the adhesive sheet S on the back side of the wafer W (FIG.
- the press roll 78 has a built-in heater as a heating means.
- the lower surface side of the pressing member 76 has an adsorbing portion so as to adsorb and hold an end of the adhesive sheet S.
- the drive roll 71, the pinch roll 72, and the take-up roll 73 constitute a peeling section that peels off the adhesive sheet S and the release sheet PS in the original state.
- the rolls 71 and 73 are rotationally driven by motors Ml and M2 provided on the rear side of the frame F, respectively.
- the pressing member 76, the press roll 78, and the tension roll 79 are provided so as to be vertically movable via cylinders 82, 83, 84, respectively.
- both ends of the press roll 78 are connected to a cylinder 83 via brackets 85, and both ends of a rotation center shaft 86 are mutually connected to the rack 65.
- a pair of pions 88, 88 acting to form an interlocking mechanism, and a pair of rollers 89, 89 as a rotating body are arranged at positions further outside the pions 88.
- the pions 88, 88 are provided so as to be able to engage with the rack 65, while the rollers 89, 89 are configured to roll on the guide bar 67 independently of the rotation of the press roll 78. ! RU
- the cutting means 43 includes an arm portion 90 extending along the moving direction of the attaching table 40, and a lower end side (left end side in FIG. 5) of the arm portion 90. And a cutter unit 92 provided to be able to advance and retreat via a single-axis robot 91 installed in the robot.
- the cutter unit 92 is composed of a power cutter vertical cylinder 95 supported by a bracket 94 that moves along the single-axis robot 91, and a cutter 96 attached to the tip of the cutter vertical cylinder 95.
- the cutter vertical cylinder 95 is mounted on the bracket 94 so as to be rotatable in a substantially vertical plane, so that the position of the tip of the cutter 96 is substantially in a vertical plane along an arc locus.
- the angle of the blade can be adjusted so that the adhesive sheet S does not protrude from the wafer W at the time of circumferential cutting described later, and the uniaxial robot 91 advances and retreats along the extending direction of the arm section 90. It is possible. As shown in FIG. 1, the cutting means 43 can move on a guide 97 oriented in a direction (Y direction in FIG. 1) orthogonal to the moving direction of the attaching table 40 by driving the motor M3. Supported. Accordingly, the function of cutting the adhesive sheet S in the width direction is achieved when the tip of the cutter 96 is in a position to enter the power receiving groove 40A of the attaching table 40 and the entire cutting means 43 moves along the guide 97. The Rukoto.
- the transfer device 45 includes a plate-shaped suction plate 100 for sucking the wafer W on the lower surface side, and a temperature provided on the upper surface side of the suction plate 100. It includes an adjustment unit 101, an arm 102 supporting the suction plate 100, and a uniaxial robot 105 for moving the arm 102 in the Y direction.
- the suction plate 100 sucks the wafer W after the adhesive sheet S has been cut in the width direction on the attaching table 40 (see FIG. 10)
- the first temperature which is the temperature at the time of temporary attachment (110 ° C.).
- the transfer device 45 transfers the wafer W from the attaching table 40 to the outer peripheral cutting table 47, and also transfers the wafer W after the unnecessary adhesive sheet portion S1 has been cut by the outer peripheral cutting table 47.
- the wafer W is transferred to the bonding table 48, and the wafer W after the bonding sheet S is completely bonded by the bonding table 48 is transferred to the next step.
- the transfer device 45 is moved from the bonding table 40 to the bonding table 48 by the temperature adjustment unit 101 during the transfer from the attaching table 40 to the outer peripheral cutting table 47, and from the bonding table 48 to the mounting device while being transferred from the outer peripheral cutting table 47 to the bonding table 48.
- the temperature of the wafer W is adjusted, so that the time for adjusting the temperature after transferring the wafer is not required, or shortening can be achieved.
- Te ru As shown in FIG. 4, the uniaxial robot 105 is disposed above the guide 97 of the cutting means 43 and substantially parallel to the guide 97.
- This single-axis robot 105 is provided with a cylinder 106 extending in a direction perpendicular to the vertical direction, and a lifting slider 108 that can be raised and lowered via the cylinder 106.
- the lifting slider 108 is attached to the base end side of the arm 102 (FIG. 9). The middle right end is connected!
- the outer periphery cutting table 47 receives the wafer W from the sticking table 40 via the transfer device 45, and sucks the wafer W to rotate around the wafer W.
- 6 is a table for cutting the unnecessary adhesive sheet portion S1 of FIG.
- the outer periphery cutting table 47 is maintained at room temperature as the second temperature, has an upper surface formed as a suction surface, and has a circumferential groove corresponding to the periphery of the outer periphery of the wafer W. It is configured with 47A.
- the outer periphery cutting table 47 is supported on a lifting plate 111 via a rotating mechanism 110 on the lower surface side.
- the rotating mechanism 110 includes a rotating shaft 112 whose axis is oriented vertically, a rotating bearing 103 that supports the rotating shaft 112, a driven pulley 114 fixed around the rotating shaft 112, and a side of the driven pulley 114.
- a pulley 115 fixed to the output shaft of the motor M4 and a belt 117 wound around the pulleys 114 and 115 are provided.
- a cutting table 47 is provided rotatably in a plane. Therefore, the function of cutting the adhesive sheet S in the circumferential direction, that is, the circumferential cutting, is achieved by the cutter 96 entering the circumferential groove 47A and rotating the outer periphery cutting table 47.
- the cutting in the circumferential direction can also be achieved by configuring the cutter unit 92 to be rotatable in a horizontal plane.
- the elevating plate 111 that supports the outer circumference cutting table 47 is provided to be able to elevate and lower via an elevating device 120.
- the elevating device 120 is connected to a block 123 attached to the rear side of a substantially L-shaped support body 122 that supports the elevating plate 111, and is connected to both sides of the support body 122.
- the bonding table 48 is arranged on the upper side of the outer peripheral cutting table 47 via a frame (not shown).
- the upper surface of the bonding table 48 is configured as a suction surface, and the wafer W on which the wafer W is transferred from the outer peripheral cutting table 47 via the transfer device 45 and the adhesive sheet S is temporarily attached is formed. By heating, the adhesive sheet S is completely bonded to the wafer W.
- the bonding table 48 is controlled at about 180 ° C. as the third temperature.
- the collecting device 50 is a device that sucks and collects the unnecessary adhesive sheet portion S1 around the wafer W on the cutting table 47.
- the recovery device 50 includes a cross arm 130 having a substantially X-shape in plan view and a lower surface of each end having a suction function, a connecting arm 131 supporting a substantially center position of the cross arm 130, and a base of the connecting arm 131.
- a cylinder 132 disposed in a direction substantially orthogonal to the guide 97 of the cutting means 43 in a plane while supporting the end side, a slider 133 movable along the cylinder 132, and an unnecessary adhesive sheet.
- a collection box 135 for collecting the portion S1.
- the cross arm 130 is provided so as to be able to reciprocate between a position above the outer periphery cutting table 47 and a position above the collection box 135, and by releasing suction to the unnecessary adhesive sheet portion S1 on the collection box 135. However, the unnecessary adhesive sheet portion S1 can be dropped into the collection box 135.
- the tape applying unit 16 mounts the mounting table 137 for adsorbing the ring frame RF and the wafer W and the tape applying unit 138 for applying the dicing tape DT. It comprises a pair of rails 139 for moving the table 137.
- the mounting table 137 employs substantially the same configuration as that of the attaching table 40 described above, which is schematically illustrated here, so that the mounting table 137 can be moved up and down and the rails 139 are used. It is possible to move along.
- the tape affixing portion 138 includes a support roll 140 provided in the plane of the plate-like support frame F1 and supporting the dicing tape DT wound in a roll shape so as to be able to be fed out.
- a pressing roll 144 for pressing and attaching to the upper surface of the frame RF and the adhesive sheet S. Therefore, as shown in FIG.
- the mount table 137 is moved to the tape attaching portion 138 side, the upper surface position of the mount table 137 is raised, and the mount table 137 is moved in the direction shown by the solid line position on the left side in the figure. Is moved, the dicing tape DT is attached to the upper surfaces of the ring frame RF and the adhesive sheet S, whereby the wafer W can be mounted on the ring frame RF.
- the ring frame RF is housed in a frame stopping force 145 and is transferred onto the mount table 137 via a transfer arm 147.
- the work K mounted on the ring frame RF on the mount table 137 is held by the transfer arm 147 by suction.
- the transfer arm 147 transfers the work K to the transfer arm 149 in a state where the work K is turned upside down, and the work K held by the transfer arm 149 is transferred to the processing position of the next process.
- the Rukoto is
- the transfer arm 147 includes a slider 151 provided so as to be able to move up and down along a guide column 150, an arm 152 supported by the slider 151, and the arm 152. And a branch arm 153 that extends in four directions from the ring frame RF to adsorb the ring frame RF.
- the arm 152 is provided rotatable about its axis, so that the work K can be transferred to the transfer arm 149 in a state where the protective tape PT is on the upper surface side.
- the transfer arm 149 is provided movably in the left-right direction in FIG. 15 via a cylinder device 155.
- the transfer arm 149 does not have a rotation function,
- the configuration is substantially the same as that of the memory 147.
- the tape peeling unit 17 includes a peeling table 156 and, as shown in FIG. 16, a tape peeling unit 157 for peeling the protective tape PT from the work K transferred to the peeling table 156.
- the peeling table 156 is provided so as to be movable along the rail 160, and the protective tape PT on the upper surface side is peeled during the moving process.
- the work K from which the protective tape PT has been peeled off by the tape peeling section 157 is transferred to the transfer rail 162 by a transfer mechanism (not shown), moved on the transfer rail 162 via the work transfer cylinder 161 and stored in the stocker 19. You. Then, the work K stored in the stocker 19 is diced to a chip size in a later process, and is heated and then picked up and bonded to a lead frame.
- a large number of wafers W each having a protective tape PT affixed to the circuit surface are accommodated in the cassette 11.
- the wafer W is transferred to the UV irradiation unit 13 by the robot 12 and subjected to a predetermined UV process.
- the wafer W after the UV curing process is transferred to the transfer plate 36 via the robot 12.
- the wafer W is transferred to the attachment table 40 via the transfer plate 36 again.
- the attachment table 40 is controlled so that the inner table 40C maintains approximately 110 ° C. as the first temperature at which the adhesive sheet S can be temporarily attached, while the outer table 40D
- the temperature is controlled to about 40 ° C., which is the temperature at which bonding is performed with adhesive force.
- the wafer W is sucked in a state where the protective tape PT is in contact with the table surface, so that the back surface of the wafer W is in the upper surface side.
- the rollers 89 provided at both ends of the press roll 78 contact the upper surface of the guide bar 67, and at the same time, the pin 88 engages with the rack 65, and the pin 88 moves along the rack 65. It becomes a state in which it can move.
- the attaching table 40 moves to the right in FIG. 5, and the press roll 78 rotates by the engagement of the rack 65 and the pinion 88, and the roller 89 rolls on the guide bar 67 as a guide surface.
- the adhesive sheet S that moves and is sequentially fed out is attached to the upper surface of the wafer W.
- the adhesive is applied when the press roll 78 is rotationally moved on the wafer W. There is no inconvenience that wrinkles are generated by the sheet S being pulled by the tension of the sheet S and the pressing force of the press roll 78.
- the press roll 78 is controlled by a heater as a built-in heating means so as to maintain approximately 110 ° C.
- the attaching table 40 becomes substantially the same as the outer periphery cutting table 47. It will reach the position directly above. Then, the pressing member 76 is lowered to bring the bonding sheet S into contact with the attaching table 40 (see FIG. 6). Thereafter, the cutter 96 of the cutting means 43 enters the cutter receiving groove 40A, and the arm 90 supporting the cutter unit 92 moves in the direction perpendicular to the paper surface of FIG. Cut into pieces.
- the pressing member 76 attracts the adhesive sheet S located on the lower surface side of the pressing member 76, returns to the raised position, and prepares for bonding to the next Ueno and W. Further, the cutting means 43 is displaced to a position where the cutting edge position of the cutter 96 is raised by the raising of the cutter vertical cylinder 95, and moves away from the upper surface position of the attaching table 40, that is, in the upper direction in FIG. And will be evacuated.
- the suction plate 100 of the transfer device 45 is moved by the operation of the monoaxial robot 105 and the lowering of the cylinder 106 so as to be located above the attaching table 40, and the cylinder 107 is moved.
- the surface position of the suction plate 100 is lowered by G holds the wafer W to which the S is attached.
- the attaching table 40 moves to a position where the next processing target wafer W is sucked and held, and at the same time, the outer peripheral cutting tape 47 rises and the upper surface of the cutting table 47 is attached to the suction plate 100. The sucked wafer W is transferred.
- Ueno and W which have reached the temporary attachment temperature at the attaching table 40, are subjected to a temperature adjusting action (cooling action) while being adsorbed on the adsorption plate 100, and are kept at a temperature substantially lowered to a normal temperature. It is.
- the transfer device 45 is moved away from the upper position of the outer peripheral cutting table 47. While moving, the cutting means 43 moves on the outer periphery cutting table 47 (see FIG. 12). Then, the single-axis robot 91 is moved by a predetermined amount, and the cutter vertical cylinder 95 is lowered, so that the cutter 96 penetrates downward at a position substantially corresponding to the outer peripheral edge of the eno and W, and the tip enters the circumferential groove 47A. Accepted.
- the outer periphery cutting table 47 is rotated in the horizontal plane by the rotating mechanism 110, and the unnecessary adhesive sheet portion S1 protruding outside the outer periphery of the wafer W is cut along the circumferential direction.
- the cutting means 43 moves from the position above the outer periphery cutting table 47 to a position where it is retracted again, while the cross arm 130 of the collecting device 50 moves onto the unnecessary adhesive sheet portion S1 to cause the unnecessary cutting.
- the adhesive sheet portion S1 is absorbed and moved onto the collection box 135 to drop the unnecessary adhesive sheet portion S1.
- the transfer device 45 is moved onto the outer periphery cutting table 47 so that the cross arm 130 is moved to the collection box 135 side, sucks the wafer W again, and then transfers the wafer W via the temperature adjustment unit.
- the substrate is transferred onto the upper surface of the bonding table 48 while raising the temperature required for complete bonding.
- the wafer W transferred to the bonding table 48 is controlled such that the bonding table 48 is maintained at approximately the third temperature of approximately 180 ° C, so that the bonding sheet S becomes a wafer. , W will be completely adhered to the action. Then, after a lapse of a predetermined time, the wafer W is sucked by the suction plate 100 of the transfer device 45 and subjected to a temperature adjustment operation for returning to the normal temperature again.
- the wafer W After being transferred to the mounting table 137 which is attracted, it is mounted on the ring frame RF via the dicing tape DT.
- the mount table 137 When the wafer W is an aggregate of chips W1 singulated by pre-dicing, the mount table 137 is rotated at a predetermined angle in a horizontal plane, and the center axis of the pressing roll 144 is shifted to any chip.
- the dicing tape (mounting tape) DT is affixed on the adhesive sheet S in such a state that it is controlled so that it is not parallel to any side of W. As a result, the wafer W is not inclined by the pressing force of the pressing roll 144, and the mounting tape can be accurately applied.
- the work K in which the wafer W is mounted on the ring frame RF is transferred to the separation table 156 in a state where the work W is turned upside down, and after the protective tape PT is separated, is stored in the stocker 19.
- the temperature of the wafer W is controlled.
- the mounting apparatus 18 does not need to perform temperature adjustment in the mounting table 137.
- the mounting process can be performed without complicating the structure on the side of the mounting apparatus 18. Also, since the wafer transferred between the tables is subjected to a temperature adjusting action at the time of the transfer, the wafer processing efficiency can be improved from this point as well.
- the sticking table 40 is configured to include the inner table portion 40C and the outer table portion 40D. As shown in FIG. A heater built-in type that can be maintained can also be used.
- the attaching device 15 has been illustrated and described as an apparatus for attaching the adhesive sheet S for die bonding to the wafer W, but other sheets may be used as long as they have heat-sensitive adhesive properties.
- the present invention can be applied to a case where a dry resist film, a sheet for forming a protective film, or the like is attached to the wafer W.
- the temperatures of the attaching table 40, the outer peripheral cutting table 47, and the bonding table 48 are changed according to the characteristics of the heat-sensitive adhesive sheet used, which does not limit the present invention.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05730386A EP1729336A1 (en) | 2004-04-14 | 2005-04-13 | Wafer processing device and wafer processing method |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-119567 | 2004-04-14 | ||
JP2004119567A JP4371890B2 (ja) | 2004-04-14 | 2004-04-14 | 貼付装置及び貼付方法 |
JP2004-133069 | 2004-04-28 | ||
JP2004133069A JP4452549B2 (ja) | 2004-04-28 | 2004-04-28 | ウエハ処理装置 |
JP2004-155595 | 2004-05-26 | ||
JP2004155595A JP4773063B2 (ja) | 2004-05-26 | 2004-05-26 | 貼付テーブル |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005101486A1 true WO2005101486A1 (ja) | 2005-10-27 |
Family
ID=35150254
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/007116 WO2005101486A1 (ja) | 2004-04-14 | 2005-04-13 | ウエハ処理装置及びウエハ処理方法 |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1729336A1 (ja) |
KR (1) | KR20070028341A (ja) |
TW (1) | TW200539331A (ja) |
WO (1) | WO2005101486A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7503365B2 (en) | 2005-11-25 | 2009-03-17 | Tokyo Seimitsu Co., Ltd. | Dicing tape attaching apparatus and dicing tape attaching method |
JP2009059778A (ja) * | 2007-08-30 | 2009-03-19 | Tokyo Ohka Kogyo Co Ltd | 基板保持装置、基板処理装置および基板処理方法 |
US7757741B2 (en) | 2005-11-29 | 2010-07-20 | Tokyo Seimitsu Co., Ltd. | Apparatus for attaching a peeling tape |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201112343A (en) * | 2009-09-30 | 2011-04-01 | C Sun Mfg Ltd | Film cutting device of wafer film laminator |
KR101896383B1 (ko) * | 2016-10-04 | 2018-09-07 | 주식회사 대성엔지니어링 | 진공 라미네이터용 비젼 얼라인장치 |
KR102409260B1 (ko) * | 2020-05-19 | 2022-06-17 | 주식회사 에이엘티 | 타이코 웨이퍼 링 제거장치 및 타이코 웨이퍼 링 제거방법 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02142156A (ja) * | 1988-11-22 | 1990-05-31 | Takatori Haitetsuku:Kk | ウエハートレーのテープ貼着装置 |
JPH03127849A (ja) * | 1989-10-13 | 1991-05-30 | Nitto Denko Corp | ウエハの移送装置 |
JPH05323583A (ja) * | 1992-05-15 | 1993-12-07 | Fujitsu Ltd | ペリクル貼り付け装置 |
JPH05326698A (ja) * | 1992-05-18 | 1993-12-10 | Oki Electric Ind Co Ltd | 半導体素子製造方法 |
-
2005
- 2005-04-13 WO PCT/JP2005/007116 patent/WO2005101486A1/ja not_active Application Discontinuation
- 2005-04-13 EP EP05730386A patent/EP1729336A1/en not_active Withdrawn
- 2005-04-13 KR KR1020067020086A patent/KR20070028341A/ko not_active Application Discontinuation
- 2005-04-13 TW TW094111689A patent/TW200539331A/zh unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02142156A (ja) * | 1988-11-22 | 1990-05-31 | Takatori Haitetsuku:Kk | ウエハートレーのテープ貼着装置 |
JPH03127849A (ja) * | 1989-10-13 | 1991-05-30 | Nitto Denko Corp | ウエハの移送装置 |
JPH05323583A (ja) * | 1992-05-15 | 1993-12-07 | Fujitsu Ltd | ペリクル貼り付け装置 |
JPH05326698A (ja) * | 1992-05-18 | 1993-12-10 | Oki Electric Ind Co Ltd | 半導体素子製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7503365B2 (en) | 2005-11-25 | 2009-03-17 | Tokyo Seimitsu Co., Ltd. | Dicing tape attaching apparatus and dicing tape attaching method |
US7757741B2 (en) | 2005-11-29 | 2010-07-20 | Tokyo Seimitsu Co., Ltd. | Apparatus for attaching a peeling tape |
JP2009059778A (ja) * | 2007-08-30 | 2009-03-19 | Tokyo Ohka Kogyo Co Ltd | 基板保持装置、基板処理装置および基板処理方法 |
Also Published As
Publication number | Publication date |
---|---|
TW200539331A (en) | 2005-12-01 |
KR20070028341A (ko) | 2007-03-12 |
EP1729336A1 (en) | 2006-12-06 |
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