WO2005076473A1 - 弾性表面波フィルタおよびそれを用いたアンテナ共用器 - Google Patents
弾性表面波フィルタおよびそれを用いたアンテナ共用器 Download PDFInfo
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- WO2005076473A1 WO2005076473A1 PCT/JP2005/001859 JP2005001859W WO2005076473A1 WO 2005076473 A1 WO2005076473 A1 WO 2005076473A1 JP 2005001859 W JP2005001859 W JP 2005001859W WO 2005076473 A1 WO2005076473 A1 WO 2005076473A1
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- Prior art keywords
- acoustic wave
- surface acoustic
- filter
- dielectric film
- wave resonators
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- 238000010897 surface acoustic wave method Methods 0.000 title claims abstract description 145
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 235000012239 silicon dioxide Nutrition 0.000 claims description 5
- RDYMFSUJUZBWLH-UHFFFAOYSA-N endosulfan Chemical compound C12COS(=O)OCC2C2(Cl)C(Cl)=C(Cl)C1(Cl)C2(Cl)Cl RDYMFSUJUZBWLH-UHFFFAOYSA-N 0.000 claims description 2
- 238000003780 insertion Methods 0.000 abstract description 16
- 230000037431 insertion Effects 0.000 abstract description 16
- 230000000052 comparative effect Effects 0.000 description 15
- 229910004298 SiO 2 Inorganic materials 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- 230000001629 suppression Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000036252 glycation Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 238000004380 ashing Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000001552 radio frequency sputter deposition Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/64—Filters using surface acoustic waves
- H03H9/6423—Means for obtaining a particular transfer characteristic
- H03H9/6433—Coupled resonator filters
Definitions
- the present invention relates to a surface acoustic wave filter for use in an electronic device and an antenna duplexer using the same.
- this antenna duplexer is required to have a filter characteristic having a sharp frequency characteristic in the cross band.
- an inertial surface wave filter (hereinafter referred to as SAW filter) is well known as one of filters having steep filter characteristics.
- SAW filter has different frequency temperature characteristics depending on the piezoelectric substrate used.
- the frequency temperature characteristic of a GH Z- band SAW filter using a general lithium tantalate substrate is 40 ppm z ° C. 35 ppm ⁇ C. Therefore, PC
- the following configuration is known to obtain a surface acoustic wave device having relatively good frequency temperature characteristics and wide band characteristics. That is, in this configuration, the above-mentioned SAW filter is formed for at least one SAW filter formed on the piezoelectric substrate. A silicon dioxide (S i 0 2 ) film is formed on the surface of the free surface acoustic wave resonator that composes the surface acoustic wave resonator, and this surface acoustic wave resonator is connected by at least one of the series connection and the parallel connection method to obtain the desired elasticity. A surface wave device is realized.
- S i 0 2 silicon dioxide
- At least one surface acoustic wave filter formed on a piezoelectric substrate and a surface acoustic wave filter formed on a piezoelectric substrate The above-described surface acoustic wave is provided except for a region in which a surface acoustic wave filter is configured on a piezoelectric substrate, comprising: a one-terminal pair elastic surface acoustic wave resonator connected to a filter in series and / or in parallel by at least one method.
- a surface acoustic wave device is disclosed in which a film having a positive frequency temperature characteristic is formed to cover at least one of the resonators.
- a longitudinal mode coupled SAW filter is shown as the SAW filter configured on the piezoelectric substrate.
- the characteristics of the longitudinal mode coupled SAW filter have been significantly improved in recent years, but the insertion loss is large compared to a ladder type SAW filter using a surface acoustic wave resonator as an impedance element. Therefore, it is difficult to apply longitudinal mode coupled S AW filters to antenna duplexers that require low insertion loss.
- the silicon dioxide (S i 0 2) film surface acoustic wave resonator is formed its ⁇ loss is further increased.
- the longitudinal mode coupled S AW filter it is difficult to obtain sufficient suppression if it is configured in one stage, and generally, two or more stages are connected in many cases. However, if two or more connections are made, the insertion loss will also be doubled, making it more difficult to apply to antenna common equipment. Furthermore, in the case of the longitudinal mode coupled S AW filter, it is difficult to further increase the degree of suppression at the frequency on the high frequency side of the pass band. For this reason, it is difficult to use a longitudinal mode coupled S AW filter as the P c S transmission side filter.
- the present invention solves the above-mentioned conventional problems, and has as its object to realize an S AW filter having an excellent frequency temperature characteristic and a very good in-band insertion loss. Furthermore, by using this S AW film, it is possible to make sharp cross-bands.
- An object of the present invention is to provide an antenna duplexer which has a large suppression degree in the wave number characteristic and the band of the other side of the other party, and in which the signal does not leak in the other side band. Disclosure of the invention
- the SAW filter of the present invention is configured by connecting a plurality of inertial surface wave resonators composed of a comb electrode and a grating reflector on a piezoelectric substrate, Among the surface acoustic wave resonators, a dielectric film is formed on the surface of at least one surface acoustic wave resonator, and no dielectric film is formed on the surface of at least one surface acoustic wave resonator. It consists of
- the capacitance ratio of the surface acoustic wave resonator in which the dielectric film is formed may be larger than the capacitance ratio of the surface acoustic wave resonator in which the dielectric film is not formed.
- the resonance frequency of the surface acoustic wave resonator in which the dielectric film is formed may be set higher than the resonance frequency of the surface acoustic wave resonator in which the dielectric film is not formed.
- the resonant frequency of the surface acoustic wave resonator in which the dielectric film is formed may be set lower than the resonant frequency of the surface acoustic wave resonator in which the dielectric film is not formed.
- the steepness of the low frequency end of the passband can be improved in the filter characteristic.
- the surface acoustic wave resonators are connected in series and in parallel to form a ladder-type fitter structure, and the dielectric film is at least one or more of the surface acoustic wave resonators connected in series. It may be formed on at least one surface of the surface acoustic wave resonators connected in parallel.
- the dielectric film may be a silicon dioxide film.
- the frequency temperature characteristic can be improved, and the in-band insertion loss can be small, and the rapidity can be excellent, and a wide-band S AW filter can be obtained.
- an antenna duplexer of the present invention has a configuration using the above-mentioned S AW filter.
- a configuration using the ladder-type S AW filter described above may be used. With such a configuration, it is possible to easily realize an antenna duplexer compatible with a system having a wide band and a narrow span such as PCS.
- the antenna duplexer of the present invention includes a transmitting filter, a receiving filter, and a phaser, and the transmitting filter and the receiving filter each have surface acoustic wave resonators] 1: row connection or parallel connection Are arranged in a ladder configuration, and at least one of the series-connected surface acoustic wave resonators or in parallel, corresponding to the frequency end side where steep filter characteristics are required in each pass band.
- a dielectric film is formed on the surface of at least one of the surface acoustic wave resonators.
- the antenna duplexer is a frequency allocation in which the transmission band is on the low frequency side and the reception band is on the high frequency side, and the transmission filter is at least one of the series-connected surface acoustic wave resonators.
- the dielectric filter is formed on one of the surfaces, and the receiver filter is configured to have the dielectric film formed on at least one of the surface acoustic wave resonators connected in parallel. It is also good.
- the antenna duplexer is a frequency allocation in which the transmission band is on the high frequency side and the reception band is on the low frequency side, and the transmission filter is at least one of the surface acoustic wave resonators connected in parallel.
- Structure in which a dielectric film is formed on one surface The receiving filter may have a configuration in which a dielectric film is formed on at least one surface of the series-connected surface acoustic wave resonators.
- an antenna duplexer having good characteristics can be realized even in a system having frequency allocation in which the transmission band is on the high frequency side and the reception band is on the low frequency side.
- At least one of the surface acoustic wave resonators constituting the SAW filter on the piezoelectric substrate has an excellent frequency temperature by forming a dielectric film on the surface thereof. It has the characteristics and can realize good in-band insertion loss.
- an SAW filter it is possible to achieve a great effect of being able to realize an antenna duplexer that is excellent in steepness even in a narrow cross band and has large suppression in the other side band.
- FIG. 1 is a plan view of an SAW filter according to a first embodiment of the present invention.
- FIG. 2A to FIG. 2E are diagrams of SAW filters according to the embodiment.
- FIG. 3 is a diagram showing filter characteristics of the S AW filter of Example 1 and the S AW filter of Comparative Example 1 in the same implementation condition.
- FIG. 4 is a diagram showing filter characteristics of the S AW filter of the first embodiment in the same implementation condition.
- FIG. 5 is a plan view of the S AW filter according to the second embodiment of the present invention.
- FIG. 6 is a view showing the filter for the S AW filter of the second embodiment and the S AW filter of the comparative example 2 in the same embodiment. Diagram showing characteristics
- FIG. 7 is a diagram showing filter characteristics of the S AW filter of the second embodiment in the same implementation condition.
- FIG. 8 is a circuit block diagram for explaining the circuit configuration of the antenna sharing device according to the third embodiment of the present invention.
- BEST MODE FOR CARRYING OUT THE INVENTION will be described in detail with reference to the drawings.
- the same reference numerals are given to the same components, the description may be omitted.
- the plan view of the SAW filter is schematically shown, and the number of electrode fingers of the series resonator and the parallel resonator is schematically shown.
- FIG. 1 is a plan view of an S AW filter 11 according to a first embodiment of the present invention.
- a ladder type configuration in which surface acoustic wave resonators are connected in series and in parallel will be described as an example of the S AW filter 11 in which a plurality of inertial surface wave resonators are connected.
- the SAW filter 11 is a lithium tantalate (L i T a 0 3 ) substrate of 39 ° Y-cut X propagation as the piezoelectric substrate 12
- a 1-port surface acoustic wave resonator 1 5 to 20 composed of a comb-like electrode and a grating reflector is formed on the piezoelectric substrate 12, and among these, the surface acoustic wave resonators 1 to 18 Are connected in series, and connected in parallel for the surface acoustic wave resonators 1 9, 20, to form a ladder-type S AW filter 1 1.
- aluminum (A 1) is used as an electrode film for forming a one-port surface acoustic wave resonator including a comb electrode and a grating reflector.
- the input terminal 1 is connected to one of the comb electrodes of the surface acoustic wave resonator 15, and the output terminal 2 is connected to one of the comb electrodes of the surface acoustic wave resonator 18.
- the ground terminals 3 and 4 are connected to one of the comb electrodes of the surface acoustic wave resonators 19 and 20 connected in parallel.
- Wiring patterns 13 are formed to connect the surface acoustic wave resonators 15 to 20, the input terminal 1, the output terminal 2 and the ground terminals 3 and 4, respectively.
- the surface acoustic wave resonators 15 to 20 formed on the piezoelectric substrate 12 may be covered with only the surface acoustic wave resonators 15 to 18 connected in series.
- a silicon dioxide (S i 0 2 ) film was formed as 4. The thickness of this S i 0 2 film was 20% of the wavelength of the S AW filter 11.
- the film thickness of the SiO 2 film is not limited to the above-mentioned value because the optimum value varies depending on the required filter characteristics. Further, this dielectric film 14 is not limited to the above-mentioned SiO 2 film.
- Jill oxide Co - ⁇ beam Z r 0 2
- titanium oxide Ti 0 2
- magnesium oxide Mg Omicron
- silicon nitride Si 3 ⁇ 4
- a dielectric tantalum pentoxide T a 2 0 5
- the use of a SiO 2 film is a more desirable material because the frequency temperature characteristics can be significantly improved.
- FIGS. 2A to 2E are cross-sectional views schematically showing a method of selectively forming the dielectric film 14 on the surface acoustic wave resonator in the SAW filter 11.
- aluminum (A 1) is formed as an electrode film on the piezoelectric substrate 12 by sputtering or electron beam (EB) evaporation, and the photolithography and etching processes are performed to form a comb electrode. And formed an electrode pattern 21 of the grating reflector.
- EB electron beam
- a SiO 2 film is formed on the entire surface as a dielectric film 14 by using a radio frequency (RF) sputtering method.
- RF radio frequency
- the dielectric film 14 in the area not covered with the resist 24 is etched away by dry etching.
- the resist 24 is removed by ashing or the like.
- the SAW filter 11 shown in FIG. 1 can be manufactured.
- a SiO 2 film is formed as a dielectric film 14 by 1 sputtering
- the present invention is not limited to this method.
- a preparation method such as a chemical vapor deposition (CVD) method or ion plating may be used.
- the RF sputtering method is characterized in that the film thickness can be easily controlled since the film forming rate is stable, and is a desirable film forming method for producing the dielectric film 14.
- the S i 0 2 film which is the dielectric film 14 is dry etched has been described, but it may be removed by wet etching or the like. Since Dora Ietsuchingu is a dry process, the liquid when etching S i 0 2 film The body is not exposed to the A1 film of the electrode pattern 21 or the like. As a result, corrosion of the A 1 film does not easily occur, and the S AW filter 11 can be manufactured with high yield.
- the result of comparison of the characteristics of the S AW filter 11 of the present embodiment with the S AW filter of the conventional configuration will be described.
- a ladder-type SAW filter achieves desired characteristics by superposing the characteristics of surface acoustic wave resonators. For this reason, in the configuration shown in FIG. 1, an S A W filter that does not form a S i 0 2 film that is a dielectric film 14 on the surface of a surface acoustic wave resonator 15 5 20 and an S of this embodiment The characteristics of the AW filter 11 were compared.
- the SAW filter 11 of the present embodiment is characterized by the following configuration. That is, the first reason is that the S i 0 2 film which is the dielectric film 14 is formed on the surface of the surface acoustic wave resonators 15 to 18. Second, the resonant frequencies of these surface acoustic wave resonators 15 to 18 are set higher than the resonant frequencies of the surface acoustic wave resonators 1 9 and 20 on which the dielectric film 14 is not formed. It is that you are.
- S AW filter 11 of the present embodiment will be referred to as S AW filter of Example 1
- S AW filter of Comparative Example 1 the S AW filter of Comparative Example 1.
- FIG. 3 is a diagram showing filter characteristics of the S A W filter of Example 1 and the S A W filter of Comparative Example 1.
- 3 shows the surface acoustic wave resonators of the surface acoustic wave resonators 15 to 18 connected in series in the configuration of the S AW filter of Example 1 and the S AW filter of Comparative Example 1.
- the admittance characteristics of the surface acoustic wave resonator 19 among the surface acoustic wave resonators 19 and 20 connected in parallel with 15 are shown.
- the S AW filter of Example 1 and the S AW filter of Comparative Example 1 are connected in parallel, although there is a difference in the presence or absence of the dielectric film 14 with respect to the surface acoustic wave resonators 19 connected in series.
- the surface acoustic wave resonator 15 has the same configuration.
- the horizontal axis is frequency
- the vertical axis is admittance.
- the S AW filter of Comparative Example 1 is indicated by a solid line, and the S AW filter of Example 1 is indicated by a dotted line.
- the admittance characteristic on the low frequency side is the characteristic of the surface acoustic wave resonator 19 connected in parallel.
- the admittance characteristics on the high frequency side are the characteristics of the surface acoustic wave resonator 15 connected in series.
- S AW filter of Example 1 11 11.
- a dielectric S i 0 2 film is formed in the surface acoustic wave resonators 15 to 18 connected in series.
- the capacitance ratio of the inertial surface wave resonator 15 in which the S i 0 2 film which is the dielectric film 14 is formed is the capacitance ratio of the surface acoustic wave resonator 19 in which the dielectric film 14 is not formed. It is because it becomes bigger than it.
- the capacitance ratio increases, the frequency difference between the resonant frequency and the antiresonant frequency decreases, and a steep admittance characteristic can be obtained.
- the SiO 2 film which is the dielectric film 14 is formed only on the surface acoustic wave resonators 15 to 18 connected in series, these surface acoustic wave resonators 15 to 1 are formed.
- the resonance frequency of 8 is set higher than the resonance frequency of the surface acoustic wave resonators 19 and 20 in which the dielectric film 14 is not formed.
- FIG. 4 is a view showing filter characteristics of the SAW filter of the first embodiment.
- the vertical axis is penetration loss and the horizontal axis is frequency.
- the SAW filter 11 of the first embodiment can secure a sufficient bandwidth of 65 MHz. This is because, among the surface acoustic wave resonators 1 5 to 20 constituting the ladder type, only the surface acoustic wave resonators 1 5 to 18 connected in series are the S i 0 2 films which are the dielectric films 14. By forming.
- the SAW filter of the first embodiment is a filter using the surface acoustic wave resonators 15 to 20 as an impedance element, the insertion loss in the passband is also 2.43 dB, and the low insertion loss is obtained. It has been realized.
- the frequency temperature characteristic of the SAW filter of the first embodiment 1 22 p pmZ ° C. was obtained.
- the frequency temperature characteristic of the SAW filter of Comparative Example 1 is-40 pp m / ° C. to 35 ppm / ° C. As a result, it was confirmed that the frequency temperature characteristic is significantly improved in the S AW filter of the first embodiment.
- the S i 0 2 film which is the dielectric film 14 is formed on all of the surface acoustic wave resonators 15 to 18 connected in series, they are connected in series.
- the dielectric film 14 may be formed on some of the elastic surface acoustic wave resonators 15 to 18.
- FIG. 1 four surface acoustic wave resonators 1 to 18 connected in series, and two surface acoustic wave resonators 19 and 20 connected in parallel, a total of six surface acoustic wave resonators.
- the ladder type S AW filter 11 consisting of 15 to 20 has been described as an example, the present invention is not limited to this.
- the configuration of the present invention can be applied by applying the configuration of the present invention in any case. It is possible to obtain the same effect as the AW filter 11.
- ladder-type S AW filter has been described as an example in the present embodiment, the same effect can be obtained with a mode-coupled S A W filter or the like.
- FIG. 5 is a plan view of the SAW filter 31 according to the second embodiment of the present invention.
- S AW filter 31 according to the present embodiment as in the first embodiment, a ladder type configuration in which the surface acoustic wave resonators 3 5 to 40 are connected in parallel in the ill series is taken as an example and described. Do.
- a 39 ° Y-cut X-propagation L i T a O 3 substrate is used as the piezoelectric substrate 32.
- This 1-port surface acoustic wave resonator 35-5 is formed of a comb-shaped electrode and a sagitating reflector on the piezoelectric substrate 32. Among them, the surface acoustic wave resonators 35-5 are connected in series. By connecting the surface acoustic wave resonators 3 9, 40 in parallel, a ladder-type S AW filter 31 is formed.
- aluminum (A 1) is used as an electrode film for forming a one-port surface acoustic wave resonator including a comb electrode and a grating reflector.
- the input terminal 5 is connected to one of the comb electrodes of the surface acoustic wave resonator 35, and the output terminal 6 is connected to one of the comb electrodes of the surface acoustic wave resonator 38.
- the grand terminals 7 and 8 are connected to one of the comb-shaped electrodes of the surface acoustic wave resonators 39 and 40 connected in parallel.
- Wiring patterns 33 are formed to connect the surface acoustic wave resonators 35 to 40, the input terminal 5, the output terminal 6, and the ground terminals 7 and 8, respectively.
- a SiO 2 film was formed as the dielectric film 34.
- the film thickness of this S i 0 2 film was 2 °% of the wavelength of the S AW filter.
- the film thickness of the SiO 2 film is not limited to the above values because the optimum value differs depending on the required filter characteristics.
- the dielectric film 34 is not limited to the above SiO 2 film, and the material described in the first embodiment may be used.
- the S AW filter 31 of the present embodiment can be manufactured by the same method as the manufacturing method described in the first embodiment. Therefore, in the present embodiment, the description of the manufacturing method is omitted.
- an S i 0 2 film which is a dielectric film 34 is formed on the surface of a surface acoustic wave resonator 3 9, 40, and these surface acoustic wave resonators 3
- the resonance frequency of 9 and 40 is set to be lower than the resonance frequency of the surface acoustic wave resonators 35 to 38 in which the dielectric film 34 is not formed.
- the S AW filter 31 of the present embodiment will be referred to as the S AW filter of the second embodiment, and the S AW filter of the conventional configuration in which the dielectric film 34 is not formed will be referred to as the S AW filter / letter of the comparative example 2. .
- FIG. 6 is a diagram showing filter characteristics of the SAW filter 31 of the second embodiment and the SAW filter of the second comparative example. Also, FIG. 6 shows the S AW fill of Example 2.
- the bow single surface acoustic wave resonator 35 out of the surface acoustic wave resonators 3 5 to 3 8 connected in series and the elastic surface wave resonances connected in parallel The admittance characteristics of the surface acoustic wave resonator 39 out of the elements 39 and 40 are also shown.
- the S AW filter 31 of the second embodiment and the S AW filter of the second comparative example have the same configuration with respect to the surface acoustic wave resonator 35 connected in series, but the surface acoustic wave resonators connected in parallel As for 15, there is a difference due to the presence or absence of the dielectric film 34.
- the horizontal axis is frequency, and the vertical axis is admittance.
- the S AW filter of Comparative Example 2 is indicated by a solid line, and the S AW filter of Example 2 is indicated by a dotted line.
- the admittance characteristic on the low frequency side is the characteristic of the surface acoustic wave resonator 39 connected in parallel. Further, the admittance characteristic on the high frequency side is the characteristic of the surface acoustic wave resonator 35 connected in series.
- the S i 0 2 film which is the dielectric film 34 is formed only on the surface acoustic wave resonators 3 9 and 40 connected in parallel.
- FIG. 6 it was found that forming the dielectric film 34 improves the steepness of the admittance characteristic on the low frequency side. This is because the surface acoustic wave resonators 3 and 4 having the dielectric film 34 and the SiO 2 film formed thereon have a capacitance ratio of the elastic surface wave resonance in which the dielectric film 34 is not formed. It is because the capacity of the children 35 to 38 is larger than that of the rat.
- the capacitance ratio increases, the frequency difference between the resonant frequency and the antiresonant frequency decreases, and a sharp admittance characteristic can be obtained.
- the SiO 2 film which is the dielectric film 34 is formed only on the surface acoustic wave resonators 3 9 and 40 connected in parallel, these surface acoustic wave resonators 3 9 and 4 are formed.
- the resonance frequency of 0 is set lower than the resonance frequencies of the surface acoustic wave resonators 35 to 38 in which the dielectric film 34 is not formed.
- FIG. 7 is a view showing filter characteristics of the S AW filter of the second embodiment.
- the vertical axis is penetration loss, and the horizontal axis is frequency.
- the pole of the low frequency ⁇ J in the passband becomes sharp.
- the bandwidth of the S AW filter tends to narrow as the capacity ratio increases, but the S AW filter of the second embodiment can secure a sufficient bandwidth of 6 O MH z. .
- the S AW filter of the second embodiment is a filter using the surface acoustic wave resonators 35 to 40 as an impedance element, the insertion loss in the passband is also as low as 3.4 3 d B. did it.
- the frequency temperature characteristic of the SAW filter of this example 2 was 12 2 p p m / ° C.
- the frequency temperature characteristics were in the range of 1 40 p p m ⁇ C to 1 35 p p m ⁇ C. As a result, it was confirmed that the frequency temperature characteristic is greatly improved in the S A W filter of the second embodiment.
- S i 0 2 film is formed dielectric film 3 is 4 to both of the two surface acoustic wave resonator 3 9, 4 0, which is connected in parallel.
- the dielectric film 34 may be formed on only one of the surface acoustic wave resonators 39 and 40 connected in parallel. By so doing, a plurality of poles can be formed on the low frequency side, so it is possible to easily secure a sufficient amount of attenuation in the band on the other side.
- the number of elastic surface acoustic wave resonators connected in parallel is not limited to two, and more may be provided.
- the dielectric film 34 may be provided on the surface of one or more surface acoustic wave resonators among the plurality of surface acoustic wave resonators provided in parallel.
- the present embodiment there are four surface acoustic wave resonators connected in series and two surface acoustic wave resonators connected in parallel, a total of six surface acoustic wave resonators.
- the S AW filter has been described as an example, the present invention is not limited thereto.
- the present embodiment can be implemented by applying the configuration of the present invention in any case. It is possible to obtain an effect similar to that of the SAW filter 31 in the situation.
- FIG. 8 is a circuit block diagram for explaining a circuit configuration of the antenna duplexer according to the third embodiment of the present invention.
- the basic configuration of this antenna duplexer is composed of a transmitting filter 41, a receiving filter 42 and a phase shifter 43, and a transmitting terminal 44 is connected to the transmitting filter 41, and a receiving filter 4 Receiving terminal 4 to 2 It is connected, and an antenna terminal 46 is provided between the transmitting filter 41 and the receiving filter 45.
- the filter on the high frequency side is required to have a filter characteristic steeper on the high frequency side.
- the filter 4 2 on the receiving side is required to have a filter characteristic that is steep on the low frequency side. Therefore, if the SAW filter according to the first embodiment is used for the transmission filter 41 and the SAW filter according to the second embodiment is used for the reception filter 42, such a request can be made. Can meet
- the insertion loss of the S AW filter 11 used as the transmitting filter 4 1 is as small as 2.4 3 dB, and the attenuation on the high frequency side is It is about 5 O d B, which can realize large suppression in the other band.
- the transmission side filter 41 of the antenna duplexer has sufficient characteristics.
- the insertion loss of the S AW filter 31 used as the receiving filter is as small as 3.4 3 dB, and the attenuation on the low frequency side is 50 dB. Large suppression can be realized in the side band. As a result, it has sufficient characteristics as the reception side filter 42 of the antenna duplexer.
- the filter characteristic on the low frequency side is required of the transmission filter 41 and the filter on the reception filter 42 is required.
- the filter characteristic is required to be steep on the high frequency side.
- the transmitter filter 41 uses the S AW filter of the second embodiment
- the receiver filter 42 uses the first embodiment.
- An antenna duplexer with good characteristics can be realized by using a form of S AW filter.
- the S AW filter of the present invention and the antenna duplexer using the same have excellent frequency temperature characteristics and good in-band insertion loss, a narrow cross band can be obtained by using this S AW filter. Also in this case, it is possible to realize a high performance antenna duplexer having a steep and large suppression in the other side band, which is useful in the mobile communication field such as portable telephone.
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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CN2005800038385A CN1914801B (zh) | 2004-02-06 | 2005-02-02 | 声表面波滤波器和使用该滤波器的天线共用器 |
JP2005517794A JP4333673B2 (ja) | 2004-02-06 | 2005-02-02 | アンテナ共用器 |
EP05709911A EP1713179A4 (en) | 2004-02-06 | 2005-02-02 | SURFACE ACOUSTIC WAVE FILTERS AND A COMMON ANTENNA UNIT USING THE SAME |
US10/587,240 US7498898B2 (en) | 2004-02-06 | 2005-02-02 | Surface acoustic wave filter, and saw duplexer |
Applications Claiming Priority (2)
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JP2004030327 | 2004-02-06 | ||
JP2004-030327 | 2004-02-06 |
Publications (1)
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WO2005076473A1 true WO2005076473A1 (ja) | 2005-08-18 |
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PCT/JP2005/001859 WO2005076473A1 (ja) | 2004-02-06 | 2005-02-02 | 弾性表面波フィルタおよびそれを用いたアンテナ共用器 |
Country Status (6)
Country | Link |
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US (1) | US7498898B2 (ja) |
EP (1) | EP1713179A4 (ja) |
JP (1) | JP4333673B2 (ja) |
KR (1) | KR100797833B1 (ja) |
CN (1) | CN1914801B (ja) |
WO (1) | WO2005076473A1 (ja) |
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JPWO2007055077A1 (ja) * | 2005-11-14 | 2009-04-30 | 株式会社村田製作所 | 弾性表面波装置の製造方法及び弾性表面波装置 |
US7741931B2 (en) * | 2006-09-25 | 2010-06-22 | Fujitsu Media Devices Limited | Acoustic wave device, resonator and filter |
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- 2005-02-02 CN CN2005800038385A patent/CN1914801B/zh active Active
- 2005-02-02 KR KR1020067015824A patent/KR100797833B1/ko active IP Right Grant
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US10886892B2 (en) | 2017-02-20 | 2021-01-05 | Murata Manufacturing Co., Ltd. | Filter apparatus, multiplexer, radio-frequency front end circuit, and communication apparatus |
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Also Published As
Publication number | Publication date |
---|---|
CN1914801B (zh) | 2011-11-23 |
EP1713179A4 (en) | 2009-03-25 |
EP1713179A1 (en) | 2006-10-18 |
KR20060121950A (ko) | 2006-11-29 |
JPWO2005076473A1 (ja) | 2007-08-02 |
US7498898B2 (en) | 2009-03-03 |
US20070152774A1 (en) | 2007-07-05 |
JP4333673B2 (ja) | 2009-09-16 |
CN1914801A (zh) | 2007-02-14 |
KR100797833B1 (ko) | 2008-01-24 |
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