Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/858—Means for heat extraction or cooling
  • H10H20/8582—Means for heat extraction or cooling characterised by their shape
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/858—Means for heat extraction or cooling
  • H10H20/8585—Means for heat extraction or cooling being an interconnection
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/851—Dispositions of multiple connectors or interconnections
  • H10W72/874—On different surfaces
  • H10W72/884—Die-attach connectors and bond wires
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
  • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

• the present invention relates to an LED and an LED mounting structure capable of safely and effectively preventing heat storage, fixing the potential of a can surface, and enabling electrically safe mounting.
• LEDs have a variety of uses as light emitting elements.
• LED molds such as resin mold type and can type.
• UV LED etc. deteriorate due to ultraviolet light and generate a large amount of heat. Therefore, in order to obtain long-term reliability, the use of can type is limited.
• This cantilever has an LED pedestal surrounded by an anode, a power source, and a reflector inside a housing, and at least a connection end of the anode and the power source is drawn out of the housing, and an anode, a power source, and a cathode are drawn from these connection ends.
• the housing is generally made of metal.
• FIG. 14 illustrates a lighting device 1 for product inspection that is suitably used when performing product inspection by reflected illumination or the like, and has a curved concave surface such as a cylindrical inner surface or a conical concave surface.
• the lighting device 1 is formed by forming a luminous body mounting surface la having a shape, and mounting a large number of LEDs 2 on this luminous body mounting surface la densely.
• LED2 located under the translucent part 2 lx is made of a material with good thermal conductivity, and one of the connection ends al and kl of the anode A or the force sword K is provided in the housing 21.
• a structure has been studied in which one of the drawer positions 21a and 21k (21k in the figure) is brought into metal contact with the housing 21 so that heat can be released from the housing 21 into the air.
• the reflector R conceptually also serves as the force sword K, and these are electrically connected to the housing main body 21b.
• a structure in which a mounting hole is provided in the main body 21b to mount the main body 21b may be adopted.
• the reflector R, the housing 21 and the force sword K are in a conductive state with each other.
• reference numerals 10a and 10b indicate wiring patterns. The effect of such a structure is the same even when the anode A side is connected to the reflector R and the housing 21.
• Patent Document 1 JP-A-10-21729
• the housing 21 is charged with either the polarity of the anode A or the power sword K.
• the reliability, durability, and safety of the device such as a short circuit or discharge between the housing 21 of the adjacent LED 2 and the connection end al, kl, etc., which may result in ignition, may occur.
• the present invention employs the following means in order to achieve the above object.
• the LED of the present invention includes an anode, a power sword, and an LED pedestal in a housing, pulls out the connection end of the anode and the power sword at least outside the housing, and connects the anode and the power sword to the anode and the power sword from these connection ends.
• the insulation between the connection end of the anode and the housing and the connection end of the force sword and the housing are both insulated. While keeping it in the state, drawer end thermally connected to the LED pedestal It is characterized by being provided outside.
• the LED pedestal includes a LED pedestal whose periphery is surrounded by a reflector.
• the heat existing in the LED pedestal which is the main heat storage portion, can be effectively taken out of the housing via the connection end.
• the external force that allows heat to escape to the appropriate part can also be used together with the force of the connection end, and if a part that is not easily restricted by space is selected as the heat radiating part, it is possible to secure a more sufficient heat radiating area. Become.
• the housing is electrically cut off from both the anode and the power source, even if the LEDs are arranged relatively densely, short-circuiting between adjacent LED housings and connection ends may occur. It is possible to effectively avoid the occurrence of a potential difference causing a discharge.
• connection ends of the anode and the force sword are made of a conductive material. It is effective to configure a part of the LED pedestal with the draw-out end of insulating material using an insulating material.
• the extraction position of the drawer end should be set to almost directly below the LED pedestal. It is preferable to set it at a position that substantially matches the center of the light-transmitting portion attached to the housing together with the LED pedestal.
• the pull-out positions of the draw-out ends are arranged substantially in a line with the pull-out positions of the connection ends of the anode and the force sword. Is effective.
• the LED elements on the LED pedestal in an electrically insulated state.
• a diode in anti-parallel between the anode and the power source in the housing.
• the diode is
• a diode is desirable.
• the Zener diode in order for the Zener diode to function properly, the Zener diode must be provided inside the housing.
• the preferable LED mounting structure is as follows.
• the connected drawer end is provided outside the housing of the LED, and a heat dissipation pattern or a cooling pattern is provided on the substrate independently of the wiring pattern, and the drawer end of the LED is thermally connected to the heat dissipation pattern or the cooling pattern.
• the cooling pattern refers to a radiation pattern in which a cooling source that actively brings in cold heat is partially connected.
• the led end of the LED mounted on the substrate is electrically connected to a heat radiation pattern or a cooling pattern of the substrate. It is desirable that
• the heat radiation pattern or the cooling pattern in order to suitably dispose the wiring pattern and the heat radiation pattern or the cooling pattern so as to effectively release the heat, the heat radiation pattern or the cooling pattern must be formed on the back surface of the substrate surface on which the wiring pattern is formed. It is desirable to form it in advance.
• LED mounting structure in which the anode and the power sword of the LED having the anode, the power sword, and the LED pedestal in the housing are connected to a wiring pattern provided on a substrate is the LED
• a drawer end thermally connected to the pedestal is provided outside the LED housing, and a heat radiating member or a cooling member is closely attached to the back surface of the substrate, and the LED drawing end is attached to the heat radiating member or the cooling member.
• Thermal connection may be made directly or indirectly via a heat radiation pattern or cooling pattern provided independently of the wiring pattern.
• the cooling member refers to a heat radiating member partially connected to a cooling source that actively brings in cold heat.
• the line width of the heat radiation pattern or the cooling pattern is effective to make the line width of the heat radiation pattern or the cooling pattern such that there is a significant difference with respect to the line width of the wiring pattern.
• the wiring pattern has the inductance ⁇ ⁇ viewpoint of heat generation, etc.
• the line width required to flow the required current is determined by itself, but the heat dissipation pattern and cooling pattern have the line width set from the waste heat effect regardless of the amount of electricity It is. Therefore, the significant difference is the radiation pattern and cooling This means that one line width is clearly defined from the reference line width corresponding to the allowable amount of current in the wiring pattern.
• the line width of the wiring pattern is set to the reference line width
• a significant difference is that the line width of the heat radiation pattern or the cooling pattern is wider than the line width of the wiring pattern.
• the line width does not need to be wide in all parts of the heat radiation pattern or the cooling pattern, and may have a narrow part in a part.
• the same effect can be achieved even if the heat is effectively transferred to a large area other than the LED mounting area.
• the average line width obtained by dividing the integrated pattern area by the integrated pattern distance is wider than that of the wiring pattern, it can be said that there is a significant difference.
• the sum of the line widths of the parts running in parallel across the slit is considered to be the line width of the present invention when viewed from the heat dissipation effect. It shall be.
• the housing and the bow I extraction end of the LED pedestal must be electrically connected. It is desirable to connect and fix the potential such as ground.
• FIG. 1 is a perspective view conceptually showing the appearance of an LED according to an embodiment of the present invention.
• FIG. 2 is a perspective view conceptually showing a heat dissipation structure of the LED together with an internal structure.
• FIG. 3 is a partial sectional view of the same.
• FIG. 4 (a) is a plan view of the same.
• FIG. 5 is a front view of the same.
• FIG. 6 is a view showing a modification of the present invention.
• FIG. 7 is a view showing another modification of the present invention.
• FIG. 8 (a) is a sectional view taken along line VIII-VIII in FIG.
• FIG. 8 (b) is a view showing a modified example of the present invention other than the above.
• FIG. 9 is a cross-sectional view schematically showing a ring-type lighting device to which an LED is attached.
• FIG. 10 is a graph showing the relationship between the amount of current and the reference line width.
• FIG. 11 is a diagram conceptually showing the appearance of a conventional LED.
• FIG. 12 is a perspective view conceptually showing the conventional heat dissipation structure of the LED together with the internal structure.
• FIG. 13 is a front view of the same.
• FIG. 14 is a cross-sectional view schematically showing a ring-shaped lighting device to which an LED is attached.
• FIG. 9 shows an illumination device 1 for product inspection by reflected illumination in which the LED 3 according to this embodiment is mounted, and a portion corresponding to a force air layer which is basically the same as that shown in FIG.
• Heat dissipating member X is filled.
• a silicon filler or the like may be used.
• the frame material lb is aluminum, the frame material lb occupies a portion substantially corresponding to the air layer.
• a heat sink can be interposed between the LED 3 and the LED 3.
• the LED 3 of this embodiment is preferably used mainly as an ultraviolet LED, and is a so-called can type similar to that introduced in the conventional example. As shown in Figs. It has a three-pin structure to draw out three pins from the housing 31. That is, LE D3 includes an LED pedestal 31p surrounded by an anode A, a force sword K, and a reflector R in a housing 31, and a pin (commonly referred to as a lead) that is a connection end of the anode A and the force sword K.
• the kl is pulled out from the draw-out position set on the disk-shaped base 31b constituting the housing 31, and a voltage is applied between these pins al and kl between the anode A and the force sword K to apply the voltage to the housing 31.
• the boundary surface force of the PN layer of the LED element 32 disposed inside also obtains light emission, and this is reflected by the reflector R and guided to the transparent or translucent light transmitting portion 31c provided above the base 31b of the housing 31.
• the reflector R is formed by dug-out on the upper surface of the base 31b, and the light-transmitting portion 31c is a roughly spherical surface having a lens function provided at a position for sealing the base 31b. It is a body and there is a fat! / Is made of glass.
• the resin it is preferable to use silicon, composite resin (vs. UV resin) or the like.
• the insulation between the pin al of the anode A and the base 31b of the housing 31 and the connection between the pin kl of the force sword K and the base 31b of the housing 31 are maintained.
• the end of the drawer is drawn out of the housing 31 to be the third pin rl.
• through holes 31a and 31k and mounting holes 31r are provided in the drawer Lf standing on the bottom surface of the housing 31, and the pins a1 and kl of the anode A and the force sword K are passed through the corresponding through holes.
• the base 31b of the housing 31 is made of a material having excellent conductivity and heat conductivity.
• the pin rl is located directly below the LED pedestal 31p located at the center of the reflector R, and the bow I position of the pin r1 is located at the center of the disc-shaped base 3lb.
• the light projecting portion 31c that covers the base 31b of the housing 31 has a substantially spherical center 31cx at the top thereof, and the pull-out position of the pin rl is located substantially directly below the center 31cx of the light projecting portion 31c. I do.
• the pins al and kl of the anode A and the force sword K are located on both sides of the pin rl that is thermally connected to the LED pedestal 3 lp, and the pins al, kl, and rl are substantially aligned. It is in.
• the pin rl is made of a material having excellent conductivity and heat conductivity together with the housing 31.
• An insulating material such as glass or silicon rubber is provided between the pins al and kl of the anode A and the force sword K and the through-holes 31a and 31k provided at the positions where the corresponding casing 31 is pulled out to maintain the insulating state. z is packed.
• an insulating layer 33 having good thermal conductivity such as epoxy resin / imide resin or alumina / aluminum nitride is interposed.
• the conductors (bonding wires) indicated by reference numerals 34a and 34k in FIG. 5 are! /.
• a zener diode ZD is connected in anti-parallel between the anode A and the force sword K in the housing 31.
• the same figure (b) is the circuit diagram, and the self-defense ability against static electricity and surge voltage is given by the LED alone without deteriorating its characteristics.
• the Zener diode ZD is arranged in the housing 31 via a Zener diode pedestal 3 lz, and an insulating plate whose surface is treated with metal is used for the Zener diode pedestal 31z.
• the pattern substrate 100 in FIG. 5 to which the LED 3 according to the present embodiment is connected is used as the light emitting body mounting surface la in FIG. 9, and is made to have two polarities by masking copper or the like.
• a pair of corresponding wiring patterns 101 and 102 are formed, and in addition to these wiring patterns 101 and 102, a heat radiation pattern 103 obtained by masking polyimide or the like separately and independently (that is, without intersecting). Is provided.
• the heat dissipation pattern 103 has a line width that is significantly different from the line width of the wiring patterns 101 and 102.
• the relationship between the line width and the permissible energizing amount is naturally determined from the viewpoint of inductance ⁇ heat generation, but the heat dissipation pattern 103 has a line width for the waste heat effect regardless of the energizing amount. It is. Therefore, the significant difference refers to a case where the line width of the heat radiation pattern 103 is clearly defined from the reference line width corresponding to the allowable amount of current flow in the wiring patterns 101 and 102.
• the allowable current is 1A
• the reference line width is lmm when the wiring pattern material is copper and the thickness is 30 microns, and the reference line width increases or decreases in proportion to the increase or decrease in the amount of current.
• the wiring pattern material is copper foil and the thickness is 105 m
• the horizontal line indicates the reference line width and the vertical axis indicates the amount of current.
• the heat dissipation pattern 103 determines the line width of the heat dissipation effect without depending on the relationship in the graph. When trying to secure an effective heat dissipation area, the line width becomes wider than this. These differences are also useful from the viewpoint of preventing mistakes in mounting the LED in order to make the heat radiation pattern 103 easier to visually distinguish from the wiring patterns 101 and 102.
• What is indicated by reference numeral 104 is an insulating coating such as an epoxy resin or an imide resin that covers the substrate surface.
• the pins al and kl of the anode A and the power source K are connected to the wiring patterns 101 and 102, respectively, and the pin rl thermally connected to the LED pedestal 31p is connected to the heat radiation pattern 103. I have.
• the insulation between the pin al of the anode A and the housing 31 and the connection between the pin kl of the power source K and the housing 31 are both maintained.
• a pin rl that is thermally connected to the LED pedestal 3 lp is provided outside the housing 31.
• the LED 3 of the present structure can effectively carry out the heat existing in the LED pedestal 3 lp, which is the main heat storage site, to the outside of the housing 31 via the pin rl as shown by the arrow in FIG. If the pin rl is pulled out, a structure that dissipates heat to an appropriate part such as the heat radiation pattern 103 can be used together as shown in the figure, so a part that is not easily restricted by space is selected as the heat radiation part. This makes it possible to secure a more sufficient heat radiation area.
• the housing 31 is electrically disconnected from both the anode A and the power sword K! /, So that even if the LED 3 is densely arranged to constitute the lighting device 1 in FIG. Effective protection of LED3 is effectively avoided by avoiding the potential difference that may cause a short circuit or discharge between housings 31 and 31 of LED3 or between housing 31 and pins al, kl, etc. As a result, the reliability of the lighting device 1 can be effectively increased.
• the potential of the housing 31 can be positively fixed by using the pin rl, and a desirable level at which discharge and the like can be avoided is achieved.
• the effect of the present invention can be achieved by reliably maintaining the potential of the housing 31.
• the position where the pin rl is pulled out is set almost directly below the LED pedestal 31p, and since this portion is closest to the LED pedestal 31p and has a small thermal resistance, heat conduction is good and heat is transferred. It can be expected that pumping will be performed effectively.
• the extraction Lf of the pin rl is set at a position substantially matching the center 31cx of the light-transmitting portion 31c attached to the housing 31 together with the LED pedestal 3lp, the light emission from the LED 3 To It is possible to efficiently guide the light to the light projecting unit 31c and to minimize the conversion of the emitted light into heat, and at the same time, to expect the generated heat to be taken out more efficiently.
• the positions of the pins rl with which the pins A 1 and kl of the anode A and the force sword K are pulled out are arranged substantially in a line, so that the mounting destination is the conical surface shown in FIG. Even if it is curved in three dimensions like this, if this LED 3 is attached so that the generatrix of the cone is aligned with the array direction, it will not be affected by the curvature, so it will be caused by the 3-pin structure It is also possible to effectively prevent the mounting condition from becoming poor.
• the LED element 32 is arranged on the LED pedestal 31p in an electrically insulated state, it is ensured that the anode A and the power sword K force affect the pin rl via the LED pedestal 3lp. Can be prevented.
• a zener diode ZD is connected in anti-parallel between the anode A and the force sword K in the housing 31, and the LED 3 protects itself against static electricity and surge voltage.
• the effect is achieved.
• the Zener diode ZD is a force that is installed in the housing 31 via the Zener diode pedestal 31z.Since the Zener diode pedestal 3 lz uses an insulating plate whose surface is treated with metal, the anode A It is possible to effectively prevent the diode characteristics from being changed due to the influence of the power source K and the effect of the above effects. Of course, even if a normal diode is used instead of the Zener diode, the same effect can be obtained.
• the wiring patterns 101 and 102 Since the LED3 is connected by applying the heat radiation pattern 103 independently, the heat radiation area can be effectively achieved by using the existing board 100 and the simple pattern formation process without bringing in a new heat radiation member. Can be effectively configured. Then, by connecting a plurality of LEDs 3 to this heat radiation pattern 103, uniform heat diffusion can be expected from any of the LEDs 3. In particular, unlike the wiring patterns 101 and 102, the heat radiation pattern 103 is cut off along the way if it can secure an effective heat radiation area and does not need to be connected as a whole. It is easy to process. Further, since the line width of the heat radiation pattern 103 is made wider than the line width of the wiring patterns 101 and 102 to provide a significant difference, a sufficient heat radiation area in the heat radiation pattern 103 is secured. It becomes possible to pump out heat more effectively.
• the housing may be formed of an insulating material together with the pin rl which is the end of the ledge 31p.
• it is also effective to form the heat radiation pattern 103 on the back surface 100b of the substrate surface 100a on which the wiring patterns 101 and 102 are formed. In this way, it is possible to prevent surface contact between the wiring patterns 101 and 102 and the heat radiation pattern 103, secure a sufficient heat radiation area, and achieve effective heat radiation.
• a heat dissipation member 40 may be attached to the back surface of the substrate 100 in close contact with the heat dissipation member 40 and a pin rl may be connected to the heat dissipation member 40 as a heat dissipation area.
• a pin rl may be connected to the heat dissipation member 40 as a heat dissipation area.
• reference numeral 103 denotes a heat radiation pattern
• reference numerals 101 and 102 denote wiring patterns.
• the heat dissipation member 40 is disposed on an aluminum base 400.
• the substrate 400 is used as a heat sink and a heat dissipation structure 400x such as a fin is adopted for the substrate 400, heat transmitted from the heat dissipation member 40 to the substrate 400 can be efficiently released.
• the base member 400 has It is also effective to provide a water jacket and configure the cooling structure 400y.
• the heat-dissipating member 40 includes a cooling source, it corresponds to a cooling member according to the present invention rather than a heat-dissipating member.
• a cooling source may be connected to the heat radiation pattern 103 to function as the cooling pattern of the present invention.
• the pin rl which is the lead end of the LED 3 mounted on the board, is electrically connected to the heat dissipation pattern 103 of the board or a cooling pattern in which a cooling source is added thereto, thereby fixing the potential. It is also an effective configuration to achieve this. Furthermore, the pin rl, which is the lead end of the LED 3, may be connected to the heat radiating member / cooling member via a heat radiating pattern or a cooling pattern.
• FIG. 8A is an enlarged cross-sectional view corresponding to line VIII-VIII in FIG. 7 in a case where a plurality of LEDs 3 are arranged in all directions.
• the heat radiation patterns 103 to which the pins rl of each LED 3 are connected are connected to each other, and the heat radiation patterns 103 of the brackets are at least the pins A and kl of the anode A of each LED 3 and the force sword K. Are formed avoiding a portion penetrating through the substrate 100.
• the heat radiation pattern 103 has a lattice or similar pattern as shown in the figure, and the pins al and kl of the anode A and the force sword K are connected to the substrate.
• the portion penetrating through 100 is in an island state with an edge cut off from the heat radiation pattern 103, and exhibits spots or a similar pattern in the whole.
• the heat radiation pattern 103 uses the available surface area of the substrate 100 as much as possible to secure a heat radiation area, and it is clear from the figure that the line width is wider than the line width of the wiring patterns 101 and 102. It will be clear. Of course, these are exactly the same when a cooling pattern is configured.
• a force in which the pull-out position of the pin rl is arranged substantially in line with the pull-out position of each of the pins al and kl of the anode A and the force sword K has the basic operation and effect of the present invention. As shown in FIG. 8 (b), this does not prevent the pins rl, a1, and kl from being arranged in a triangular relationship with each other in order to increase the mounting strength in the range shown in FIG.
• the present invention even when the LEDs are relatively densely arranged, it is possible to effectively eliminate the internal heat storage while effectively avoiding short discharge, breakage, ignition, and the like. It is possible to reliably improve the reliability, durability and safety of the equipment in which this type of LED is used.

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• Led Device Packages (AREA)
• Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
• Fastening Of Light Sources Or Lamp Holders (AREA)

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Citations (10)

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• 2004
  • 2004-12-22 CA CA2553576A patent/CA2553576C/en not_active Expired - Fee Related
  • 2004-12-22 KR KR1020067015374A patent/KR101139181B1/ko not_active Expired - Fee Related
  • 2004-12-22 WO PCT/JP2004/019213 patent/WO2005074044A1/ja not_active Ceased
  • 2004-12-22 US US10/587,363 patent/US7589356B2/en not_active Expired - Fee Related
  • 2004-12-22 JP JP2005517388A patent/JP4928784B2/ja not_active Expired - Lifetime
  • 2004-12-22 EP EP04807570A patent/EP1710845A4/en not_active Withdrawn
  • 2004-12-22 CN CNB2004800411338A patent/CN100454589C/zh not_active Expired - Fee Related
  • 2004-12-31 TW TW093141784A patent/TW200526900A/zh not_active IP Right Cessation
• 2005
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