WO2005056674A1 - 積層セラミック電子部品のスペーサ層用の誘電体ペースト - Google Patents
積層セラミック電子部品のスペーサ層用の誘電体ペースト Download PDFInfo
- Publication number
- WO2005056674A1 WO2005056674A1 PCT/JP2004/018628 JP2004018628W WO2005056674A1 WO 2005056674 A1 WO2005056674 A1 WO 2005056674A1 JP 2004018628 W JP2004018628 W JP 2004018628W WO 2005056674 A1 WO2005056674 A1 WO 2005056674A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- ceramic green
- layer
- acetate
- green sheet
- spacer layer
- Prior art date
Links
- 125000006850 spacer group Chemical group 0.000 title claims abstract description 163
- 239000000919 ceramic Substances 0.000 title abstract description 260
- 239000011230 binding agent Substances 0.000 claims abstract description 113
- 239000002904 solvent Substances 0.000 claims abstract description 95
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 claims abstract description 80
- 235000001510 limonene Nutrition 0.000 claims abstract description 40
- 229940087305 limonene Drugs 0.000 claims abstract description 40
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 34
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 34
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 74
- -1 carbyl acetate Chemical compound 0.000 claims description 30
- WTXBCFKGCNWPLS-UHFFFAOYSA-N (4-prop-1-en-2-yl-1-cyclohexenyl)methyl acetate Chemical compound CC(=O)OCC1=CCC(C(C)=C)CC1 WTXBCFKGCNWPLS-UHFFFAOYSA-N 0.000 claims description 16
- 239000002253 acid Substances 0.000 claims description 13
- IGODOXYLBBXFDW-UHFFFAOYSA-N alpha-Terpinyl acetate Chemical compound CC(=O)OC(C)(C)C1CCC(C)=CC1 IGODOXYLBBXFDW-UHFFFAOYSA-N 0.000 abstract description 21
- IGODOXYLBBXFDW-NSHDSACASA-N alpha-Terpinyl acetate Natural products CC(=O)OC(C)(C)[C@@H]1CCC(C)=CC1 IGODOXYLBBXFDW-NSHDSACASA-N 0.000 abstract description 7
- 230000007547 defect Effects 0.000 abstract description 7
- 239000010410 layer Substances 0.000 description 375
- 239000012790 adhesive layer Substances 0.000 description 76
- 239000003985 ceramic capacitor Substances 0.000 description 62
- 239000004020 conductor Substances 0.000 description 31
- 239000002002 slurry Substances 0.000 description 30
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 29
- 229920001577 copolymer Polymers 0.000 description 29
- 230000037303 wrinkles Effects 0.000 description 28
- 239000000654 additive Substances 0.000 description 27
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 26
- 229920005989 resin Polymers 0.000 description 23
- 239000011347 resin Substances 0.000 description 23
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 22
- 238000006116 polymerization reaction Methods 0.000 description 20
- 239000000843 powder Substances 0.000 description 18
- 239000003989 dielectric material Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 15
- 238000007639 printing Methods 0.000 description 15
- 230000000996 additive effect Effects 0.000 description 14
- 238000004519 manufacturing process Methods 0.000 description 13
- 239000002245 particle Substances 0.000 description 13
- 239000004014 plasticizer Substances 0.000 description 13
- 238000010030 laminating Methods 0.000 description 12
- 238000002156 mixing Methods 0.000 description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 description 12
- 239000005020 polyethylene terephthalate Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- 239000002270 dispersing agent Substances 0.000 description 10
- 239000003350 kerosene Substances 0.000 description 10
- 230000003287 optical effect Effects 0.000 description 9
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 8
- 239000002202 Polyethylene glycol Substances 0.000 description 8
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 8
- 229920001223 polyethylene glycol Polymers 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- 230000000295 complement effect Effects 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 238000010304 firing Methods 0.000 description 7
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 7
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 239000012046 mixed solvent Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- 239000011800 void material Substances 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 238000000137 annealing Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 239000000088 plastic resin Substances 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000007646 gravure printing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- 229910019142 PO4 Inorganic materials 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 150000002430 hydrocarbons Chemical class 0.000 description 3
- 238000004898 kneading Methods 0.000 description 3
- 235000021317 phosphate Nutrition 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- NFLGAXVYCFJBMK-BDAKNGLRSA-N (-)-menthone Chemical compound CC(C)[C@@H]1CC[C@@H](C)CC1=O NFLGAXVYCFJBMK-BDAKNGLRSA-N 0.000 description 2
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 150000002823 nitrates Chemical class 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 2
- 239000010452 phosphate Substances 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- NOOLISFMXDJSKH-UTLUCORTSA-N (+)-Neomenthol Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@@H]1O NOOLISFMXDJSKH-UTLUCORTSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- NOOLISFMXDJSKH-UHFFFAOYSA-N DL-menthol Natural products CC(C)C1CCC(C)CC1O NOOLISFMXDJSKH-UHFFFAOYSA-N 0.000 description 1
- 229910000807 Ga alloy Inorganic materials 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- XMGQYMWWDOXHJM-SNVBAGLBSA-N L-limonene Natural products CC(=C)[C@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-SNVBAGLBSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 244000137852 Petrea volubilis Species 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- SNQBQAKNKRJNGB-UHFFFAOYSA-N acetic acid 2,6,6-trimethyl-1,2-bis(2,6,6-trimethyl-1-bicyclo[3.1.1]heptanyl)bicyclo[3.1.1]heptane Chemical compound C(C)(=O)O.C12(C(CCC(C1(C)C)C2)C)C21C(CCC(C2(C)C)C1)(C)C12C(CCC(C1(C)C)C2)C SNQBQAKNKRJNGB-UHFFFAOYSA-N 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 235000013527 bean curd Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 239000002003 electrode paste Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229940041616 menthol Drugs 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- DWCZIOOZPIDHAB-UHFFFAOYSA-L methyl green Chemical compound [Cl-].[Cl-].C1=CC(N(C)C)=CC=C1C(C=1C=CC(=CC=1)[N+](C)(C)C)=C1C=CC(=[N+](C)C)C=C1 DWCZIOOZPIDHAB-UHFFFAOYSA-L 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 235000014347 soups Nutrition 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- DOMXUEMWDBAQBQ-WEVVVXLNSA-N terbinafine Chemical compound C1=CC=C2C(CN(C\C=C\C#CC(C)(C)C)C)=CC=CC2=C1 DOMXUEMWDBAQBQ-WEVVVXLNSA-N 0.000 description 1
- 229960002722 terbinafine Drugs 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/006—Other inhomogeneous material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Definitions
- the present invention relates to a dielectric paste for a spacer layer of a multilayer ceramic electronic component, and more particularly, to dissolving a binder contained in a layer adjacent to the spacer layer.
- the present invention relates to a dielectric paste for a spacer layer of a multilayer ceramic electronic component, which can effectively prevent a multilayer ceramic electronic component from becoming defective.
- a ceramic powder In order to manufacture a multilayer ceramic electronic component represented by a multilayer ceramic capacitor, first, a ceramic powder, a binder such as an acrylic resin and a petital resin, and phthalenolates, glycols, adipic acid, and phosphates are used. Is mixed with an organic solvent such as toluene, methyl ethyl ketone, and acetone to prepare a dielectric paste for a ceramic green sheet.
- a binder such as an acrylic resin and a petital resin
- phthalenolates glycols, adipic acid, and phosphates
- the dielectric paste is applied on a support sheet formed of polyethylene terephthalate (PET), polypropylene (PP), or the like using an etastrusion coater or a gravure coater, and heated. Then, the coating film is dried to produce a ceramic green sheet.
- PET polyethylene terephthalate
- PP polypropylene
- a conductive powder such as nickel paste and a binder are dissolved in a solvent such as terpionaire to prepare a conductive paste, and the conductive paste is placed on a ceramic green sheet by a screen printing machine or the like. Printing and drying are performed in a predetermined pattern to form an electrode layer.
- the ceramic green sheet on which the electrode layer is formed is placed on a support sheet. By peeling off, a laminate unit including the ceramic green sheet and the electrode layer is formed, a desired number of laminate units are laminated, and the laminate is pressed. Make a chip.
- the binder is removed from the green chip, the green chip is fired, and external electrodes are formed, whereby a multilayer ceramic electronic component such as a multilayer ceramic capacitor is manufactured.
- the electrode layers are formed in a predetermined pattern on the surface of the ceramic green sheet, the electrode layers on the surface of each ceramic green sheet are formed.
- a step is formed between the region and the region where the electrode layer is not formed, and therefore, it is required to laminate a large number of laminate units each including the ceramic green sheet and the electrode layer.
- it becomes difficult to bond the ceramic green sheets included in the multiple laminated units as desired, and the laminated body in which the multiple laminated units are laminated may be deformed.
- a dielectric paste is printed on the surface of the ceramic green sheet in a pattern opposite to the pattern of the electrode layer, and a spacer layer is formed between adjacent electrode layers.
- a method for eliminating a step on the surface of each ceramic green sheet has been proposed.
- the surface of the ceramic green sheet between the adjacent electrode layers is printed by printing.
- each of the laminate units includes a large number of laminates including a ceramic Darline sheet and an electrode layer.
- the laminated ceramic capacitors are manufactured by laminating the ceramic units, the ceramic green sheets included in a large number of the laminated units can be bonded as desired, and each of the ceramic green sheets can be laminated.
- a binder for ceramic green sheets most commonly used as a solvent for a dielectric paste for forming a spacer layer on a ceramic green sheet using butyral resin, which is widely used.
- a prepared dielectric paste is printed using a commonly used tarpionell to form a spacer layer
- the ceramic green sheet is formed by the tarpionell in the dielectric paste.
- the binder dissolves and the ceramic green sheet swells or partially dissolves to form a void at the interface between the ceramic green sheet and the spacer layer, or the surface of the spacer layer
- cracks and wrinkles are generated, and voids are generated in the multilayer ceramic capacitor manufactured by stacking and firing the multilayer units.
- Japanese Patent Application Laid-Open Nos. 5-325633, 7-21833, and 7-21832 disclose hydrogenation catalysts such as dihydrota-pioneol instead of terpioneol.
- Terpene solvents such as dihydrota-pioneer acetate and dihydrota-pioneol acetate have been proposed, but terpene-based solvents such as hydrogenated terpioneer such as dihydrota-pioneol and dihydroterpionate acetate still remain as binders for ceramic green sheets. Since it has a certain degree of solubility in a certain plastic resin, if the thickness of the ceramic green sheet is extremely small, it is necessary to prevent the occurrence of pinhole cracks in the ceramic green sheet. There was a problem that was difficult.
- the present invention effectively prevents the multilayer ceramic electronic component from having a problem in dissolving the binder contained in the layer adjacent to the spacer layer of the multilayer ceramic electronic component, thereby preventing a problem from occurring. It is an object of the present invention to provide a dielectric paste for a spacer layer of a laminated ceramic electronic component that can be used.
- a dielectric paste for a spacer layer was prepared by using at least one solvent selected from the group consisting of hydrocarbyl acetate, I-mentone, I-perilinorea acetate, I-carbyl acetate, and d-dihydrocarbyl acetate.
- the binder can be dissolved in a solvent as desired, and a dielectric paste is printed on a ceramic green sheet using a petital-based resin as a binder to form a spacer layer.
- the binder contained in the ceramic green sheet is not dissolved by the solvent contained in the dielectric paste. Therefore, the ceramic green sheet swells or partially dissolves, causing voids at the interface between the ceramic green sheet and the spacer layer, or cracks and wrinkles on the surface of the spacer layer. It has been found that it is possible to reliably prevent the occurrence of voids in a multilayer ceramic electronic component such as a multilayer ceramic capacitor.
- the object of the present invention is to include an atalylic resin as a binder, limonene, ⁇ -terpinyl acetate, I-hydrocarbyl acetate, I-menton, It contains at least one solvent selected from the group consisting of I-perylyl acetate, I-carbyl acetate and d-dihydrocarbyl acetate. This is achieved by a dielectric paste for the spacer layer.
- the dielectric paste for the spacer layer is prepared by kneading a dielectric material (ceramic powder) and an organic vehicle in which an acrylic resin is dissolved in a solvent.
- the dielectric material is appropriately selected from composite oxides and various compounds that become oxides, for example, carbonates, nitrates, hydroxides, organometallic compounds, and the like. Strength that can be obtained
- a powder of a dielectric material having the same composition as the powder of the dielectric material contained in the ceramic green sheet described later is used.
- the dielectric material is usually used as a powder having an average particle diameter of about 0.1 xm to about 3.0 m.
- the weight average molecular weight of the atalylic resin contained in the dielectric paste for the spacer layer as a binder is preferably 450,000 or more and 900,000 or less.
- Acrylic resin with a viscosity of 450,000 or more and 900,000 or less is used as a binder for the dielectric base for the spacer layer, thereby providing a conductive paste having a desired viscosity and a dielectric paste for the spacer layer.
- the atalylic resin contained in the dielectric paste for the spacer layer as a binder has an acid value of preferably 5 mgK ⁇ H / g or more and 25 mgKOH / g or less.
- an acrylic resin of 5 mgKOH / g or more and 25 mgKOH / g or less as a binder of the dielectric paste for the spacer layer, it is possible to prepare a dielectric paste for the spacer layer having a desired viscosity. it can.
- the dielectric paste for the spacer layer is preferably about 2.5 parts by weight to about 15 parts by weight, more preferably about 2.5 parts by weight, based on 100 parts by weight of the dielectric material powder.
- the dielectric paste for the spacer layer contains a plasticizer and a release agent as optional components in addition to the dielectric material powder and the acrylic resin.
- the plasticizer contained in the dielectric paste for the spacer layer is not particularly limited, and examples thereof include phthalate, adipic acid, phosphate, and glycols. .
- the plasticizer contained in the dielectric paste for the spacer layer will be described later. It may or may not be of the same type as the plasticizer contained in the ceramic green sheet.
- the dielectric paste for the spacer layer is about 0 to about 200 parts by weight, preferably about 20 to about 200 parts by weight, and more preferably about 100 parts by weight, based on 100 parts by weight of the acrylic resin. Contains from 50 to about 100 parts by weight of plasticizer.
- the release agent contained in the dielectric paste for the spacer layer is not particularly limited, and examples thereof include paraffin, wax, and silicone oil.
- the dielectric paste for the spacer layer is about 0 parts by weight to about 100 parts by weight, preferably about 2 parts by weight to about 50 parts by weight, more preferably about 100 parts by weight, based on 100 parts by weight of the acrylic resin. 5 parts by weight, containing about 20 parts by weight of release agent.
- a conductive paste for an electrode layer is printed on an extremely thin ceramic green sheet to form an electrode layer, and a dielectric paste for a spacer layer is printed to form a spacer layer.
- the solvent in the conductor paste for the electrode layer and the solvent force S in the dielectric paste for the spacer layer, and the binder component of the ceramic green sheet are dissolved or swelled.
- the electrode layer and the spacer layer are separated from each other by a separate supporting sheet. It has been found by the present inventors that it is desirable to adhere to the surface of the ceramic green sheet via an adhesive layer after being formed on the substrate and drying it.
- the spacer layer is formed on another support sheet, the same binder as that of the ceramic green sheet is applied to the surface of the support sheet so that the support sheet can be easily separated from the electrode layer and the spacer layer.
- a release layer including the conductive layer print a conductive paste on the release layer, form an electrode layer, and print a dielectric paste to form a spacer layer.
- the release layer includes the petital resin as a binder, and When the paste contains tarpionell as a solvent, the binder contained in the release layer is dissolved by the solvent contained in the dielectric paste, and the release layer swells or partially dissolves. A gap is formed at the interface between the release layer and the spacer layer, or cracks and wrinkles are generated on the surface of the spacer layer.
- the dielectric paste for the spacer layer contains an acrylic resin as a binder, and contains limonene, heterpinyl acetate, and I-dihydrocarbyl acetate.
- I-menthon, 1_perillyl acetate, 1_carbyl acetate, and d-dihydro power at least one solvent selected from the group consisting of rubry acetate, limonene, monoterpinyl acetate
- Solvents selected from the group consisting of dihydrocarbyl acetate, I-menthon, 1_perillinole acetate, I-carbyl acetate, and d-dihydrocarbyl acetate hardly dissolve the butyral-based resin contained as noinda in ceramic green sheets To form a release layer containing the same binder as the ceramic green sheet.
- the release layer swells or partially dissolves and forms an interface between the release layer and the spacer layer. It is possible to effectively prevent voids or cracks and wrinkles from being formed on the surface of the spacer layer, and to effectively prevent defects in multilayer ceramic electronic components such as multilayer ceramic capacitors. Can be prevented.
- a dielectric paste for a ceramic green sheet containing a petyral-based resin as a binder is prepared, and the paste is elongated using an etastrusion coater, a wire bar coater, or the like. It is applied on a support sheet in the form of a film to form a coating film.
- a dielectric paste for forming a ceramic green sheet is usually prepared by kneading a dielectric material (ceramic powder) and an organic vehicle in which a petital-based resin is dissolved in an organic solvent.
- the degree of polymerization of the butyral-based resin is preferably 1000 or more, and the butyralization degree of the butyral-based resin is preferably 64 mol% or more and 78 mol% or less.
- the organic solvent used for the organic vehicle is not particularly limited, and organic solvents such as terbinol, butyl carbitol, acetone, toluene, and ethyl acetate are used.
- the dielectric material is appropriately selected from composite oxides and various compounds that become oxides, for example, carbonates, nitrates, hydroxides, organometallic compounds, and the like. S can.
- the dielectric material is generally used as a powder having an average particle size of about 0.1 xm to about 3.0 xm. Preferably, the particle size of the dielectric material is smaller than the thickness of the ceramic green sheet.
- each component in the dielectric paste is not particularly limited. For example, about 2.5 parts by weight to about 10 parts by weight of a petalal-based resin with respect to 100 parts by weight of a dielectric material.
- the dielectric paste can be prepared to contain about 50 parts to about 320 parts by weight of the organic solvent.
- the dielectric paste may optionally contain additives selected from various dispersants, plasticizers, auxiliary component compounds, glass frit, insulators, and the like. When these additives are added to the dielectric paste, the total content is desirably less than about 10% by weight.
- the support sheet to which the dielectric paste is applied for example, polyethylene terephthalate film or the like is used, and in order to improve the releasability, the surface thereof is coated with a silicone resin, phenolic resin, or the like. Let's do it.
- the coating film is dried at a temperature of, for example, about 50 ° C to about 100 ° C for about 1 minute to about 20 minutes to form a ceramic green sheet on the support sheet. .
- the thickness of the ceramic green sheet after drying is preferably 3 am or less, more preferably 1.5 xm or less.
- a conductive paste for an electrode layer is printed in a predetermined pattern on a ceramic green sheet formed on the surface of the long support sheet using a screen printing machine or a gravure printing machine. Thus, an electrode layer is formed.
- the electrode layer is preferably formed to a thickness of about 0.1xm to about 1xm after drying, more preferably about 0.1xm to about 1.5xm.
- the conductive paste for the electrode layer includes conductive materials made of various conductive metals and alloys, various oxides and organic metal compounds which become conductive materials made of various conductive metals and alloys after firing. Alternatively, it is prepared by kneading a resinate or the like and an organic solvent in which an acrylic resin is dissolved in a solvent.
- the conductive paste contains an acrylic resin as a binder, and includes limonene, heartpinyl acetate, I-dihydrocarbyl acetate, I-menthone, and 1_perillyl acetate. And at least one solvent selected from the group consisting of i-carbyl acetate and d-dihydrocarbyl acetate.
- the solvent selected from the group consisting of limonene, ⁇ -terpier acetate, I-dihydrocarbyl acetate, I-menton, I-perillyl acetate, I-carbyl acetate and d-dihydrocarbyl acetate is a ceramic green sheet. Hardly dissolves the butyral-based resin contained as a binder in the conductive paste, even when the conductive paste is printed on an extremely thin ceramic green sheet to form the electrode layer. The solvent can effectively prevent the binder contained in the ceramic green sheet from being dissolved, so that even when the thickness of the ceramic green sheet is extremely thin, the pin is not attached to the ceramic green sheet. Effectively prevents holes and cracks It becomes possible to stop.
- the acrylic resin contained in the conductor paste preferably has a weight average molecular weight of 450,000 or more and 900,000 or less.
- a conductive paste having a desired viscosity can be prepared.
- the acid value of the acrylic resin contained in the conductive paste is preferably 5 mgK ⁇ H / g or more and 25 mgKOHZg or less, and the acid value is preferably 5 mgKOHZg or more and 25 mgK ⁇ H / g.
- a conductive paste having a desired viscosity can be prepared by using an acrylic resin as a binder for the conductive paste.
- the conductive material used for producing the conductive paste Ni, a Ni alloy, or a mixture thereof is preferably used.
- the shape of the conductive material is not particularly limited, and may be spherical, scaly, or a mixture of these shapes.
- the average particle size of the conductive material is not particularly limited, it is generally about 0.1 ⁇ m, preferably 2 ⁇ m, preferably 0.2 ⁇ m.
- the conductive S material layer has a thickness of about 1 ⁇ m.
- the conductive paste preferably contains about 2.5 parts by weight and about 20 parts by weight of a binder with respect to 100 parts by weight of the conductive material.
- the content of the solvent is preferably about 20% by weight to about 20% by weight based on the entire conductive paste.
- the conductor paste preferably contains a plasticizer.
- the plasticizer contained in the conductor paste is not particularly limited, and examples thereof include phthalate, adipic acid, phosphate, and glycols.
- the conductor paste preferably contains about 10 parts by weight to about 300 parts by weight, more preferably about 10 parts by weight to about 200 parts by weight, based on 100 parts by weight of the binder. If the amount of the plasticizer is too large, the strength of the electrode layer tends to be significantly reduced, which is not preferable.
- the conductor paste may optionally contain additives selected from various dispersants, subcomponent compounds, and the like.
- the mixture Prior to formation of the electrode layer, or after forming the electrode layer and drying, the mixture contains an atalinole-based resin as a binder, and contains limonene, heaterpinyl acetate, I-dihydrocarbyl acetate, 1_menthon, A dielectric paste for a spacer layer containing at least one solvent selected from the group consisting of 1_perillyl acetate, 1_carbyl acetate and d-dihydrocarbyl acetate is provided on the surface of the ceramic green sheet with an electrode.
- the spacer layer is formed by printing using a screen printing machine, a gravure printing machine, or the like with a pattern complementary to the layer pattern.
- the spacer layer on the surface of the ceramic green sheet with a pattern complementary to the pattern of the electrode layer, the surface of the electrode layer and the ceramic without the electrode layer are formed.
- a step can be prevented from forming between the surface of the green sheet and a multilayer ceramic capacitor manufactured by stacking a number of multilayer units each including a ceramic green sheet and an electrode layer. It is possible to effectively prevent the multilayer electronic component from being deformed, and to effectively prevent the occurrence of delamination.
- the solvent selected from the group consisting of the above hardly dissolves the plastic resin contained in the ceramic green sheet as a binder
- a dielectric paste is printed on an extremely thin ceramic dust sheet to form a spacer layer.
- the binder contained in the ceramic green sheet is dissolved by the solvent contained in the dielectric paste, and the ceramic green sheet swells or partially dissolves, and the ceramic green sheet and the green paste are dissolved. Voids at the interface with the support layer, or cracks on the surface of the spacer layer It is possible to reliably prevent the wrinkles may occur.
- the dielectric paste for the spacer layer is prepared in the same manner as the dielectric paste for the ceramic green sheet, except that a different binder and a different solvent are used.
- the weight average molecular weight of the acrylic resin contained in the dielectric paste for forming the spacer layer is preferably 450,000 or more and 900,000 or less, and the weight average molecular weight is 450,000 or more.
- a dielectric paste having a desired viscosity can be prepared.
- the acid value of the acrylic resin is preferably 5 mgK ⁇ HZg or more and 25 mgK ⁇ H / g or less, and the acid value of the acrylic resin is preferably 5 mgKOHZg or more and 25 mgK ⁇ H / g or less.
- a dielectric paste having a desired viscosity can be prepared by using it as a binder of the dielectric paste for the sa layer.
- the electrode layer and the spacer layer are dried, and the ceramic And a laminate unit in which an electrode layer and a spacer layer are laminated.
- a support sheet is peeled from a ceramic Darline sheet of a multilayer unit, cut into a predetermined size, and a predetermined number of the multilayer units are stacked on the outer layer of the multilayer ceramic capacitor.
- the other outer layer is laminated on the laminate unit, and the obtained laminate is pressed and cut into a predetermined size to produce a large number of ceramic green chips. Is done.
- the ceramic green chip thus manufactured is placed in a reducing gas atmosphere, the binder is removed, and the chip is fired.
- each of the multilayer units including the ceramic green sheet and the electrode layer is formed by stacking the stacked units. It is possible to effectively prevent the deformation of laminated electronic components such as ceramic capacitors and to prevent the occurrence of delamination.
- an acrylic resin is contained as a binder on a ceramic green sheet containing a petalal resin, and limonene, ⁇ -terpinyl acetate, I-dihydrocarbyl acetate, and I-mentone are provided.
- a dielectric paste containing at least one solvent selected from the group consisting of, I-perilino leacetate, I-ruby acetate and d-dihydrocarbyl acetate is printed in a pattern complementary to the pattern of the electrode layer.
- a spacer layer from limonene, hyterpinyl acetate, I-dihydrocarbyl acetate, I-mentone, I-perilino ureate, I-carbyl acetate and d-dihydrocarbyl acetate.
- Solvents selected from the group consisting of ceramic green Since the plastic resin contained as a binder in the sheet hardly dissolves, even when a dielectric paste is printed on an extremely thin ceramic green sheet to form a spacer layer, it is not included in the dielectric paste.
- Ceramic Dali by solvent The binder contained in the green sheet is dissolved, and the ceramic green sheet swells or partially melts to form a void at the interface between the ceramic green sheet and the spacer layer, or It is possible to reliably prevent cracks and wrinkles from forming on the surface of the ceramic layer, and therefore, a multilayer ceramic capacitor manufactured by laminating a large number of multilayer units including ceramic green sheets and electrode layers will generate voids. As well as cracks and wrinkles generated on the surface of the spacer layer may be lost in the process of stacking the laminate units to produce the laminate. In addition, it is possible to reliably prevent a foreign substance from being mixed in the multilayer body and causing an internal defect in the multilayer ceramic capacitor.
- an acrylic resin is contained as a binder on a ceramic Darin sheet containing a petyral resin, and limonene, heat terpinyl acetate, I-dihydrocarbyl acetate, I-menthon is provided.
- a solvent selected from the group consisting of limonene, ⁇ - terpinyl acetate, I-dihydrocarbyl acetate, I-mentone, 1_perilinorea acetate, I-carbyl acetate and d-dihydrocarbyl acetate is a ceramic Included as binder in green sheet Since the chillal resin hardly dissolves, even when the conductor paste is printed on an extremely thin ceramic green sheet to form an electrode layer, it is included in the ceramic green sheet by the solvent contained in the conductor paste. Melted binder can be effectively prevented, so that even when the thickness of the ceramic green sheet is extremely thin, pinholes and cracks are not generated in the ceramic green sheet. By effectively preventing the occurrence of short-circuit failure in the multilayer ceramic electronic component, it becomes possible to effectively prevent the occurrence of short-circuit failure.
- a second support sheet different from the long support sheet used to form the ceramic green sheet is provided, and the second long support sheet is provided.
- Particles of a dielectric material having substantially the same composition as the dielectric material contained in the ceramic green sheet on the surface of the support green sheet, and the particles contained in the ceramic green sheet A dielectric paste containing the same binder as the binder is applied using a wire bar coater or the like, and dried to form a release layer.
- the second support sheet for example, a polyethylene terephthalate film or the like is used, and in order to improve the releasability, a silicone resin, an alkyd resin or the like is coated on the surface thereof.
- a silicone resin, an alkyd resin or the like is coated on the surface thereof.
- the thickness of the release layer is preferably not more than the thickness of the electrode layer, more preferably not more than about 60% of the thickness of the electrode layer, and more preferably not more than about 30% of the thickness of the electrode layer. It is as follows.
- the conductive paste for the electrode layer prepared in the same manner as described above is applied on the surface of the release layer by using a screen printing machine, a gravure printing machine, or the like. It is printed in a predetermined pattern and dried to form an electrode layer.
- the electrode layer is preferably formed to a thickness of about 0.1 ⁇ m to about 5 ⁇ m, and more preferably, to a thickness of 1.5 x 1.5 mm. is there.
- the conductive paste contains an acrylic resin as a binder, and includes limonene, ⁇ -terpinyl acetate, I-dihydrocarbyl acetate, I-mentone, I-perillyl acetate, A group consisting of I-carbyl acetate and d-dihydrocarbyl acetate. It contains at least one selected solvent.
- the solvent selected from the group consisting of limonene, ⁇ -terpier acetate, I-dihydrocarbyl acetate, I-mentone, I-perillyl acetate, I-carbyl acetate and d-dihydrocarbyl acetate is a ceramic green sheet.
- the release layer containing the same binder as the ceramic green sheet is formed and the conductive paste is printed on the release layer to form the electrode layer, since the plastic resin contained in the binder hardly dissolves
- the release layer is effectively prevented from swelling or partially dissolving to form voids at the interface between the release layer and the electrode layer, or to generate cracks and wrinkles on the surface of the electrode layer. It becomes possible to do.
- the acrylic resin contained in the conductor paste preferably has a weight average molecular weight of 450,000 or more and 900,000 or less.
- a conductive paste having a desired viscosity can be prepared.
- the acid value of the acrylic resin contained in the conductive paste is preferably 5 mgK ⁇ H / g or more and 25 mgK ⁇ H / g or less, and the acid value is preferably 5 mgKOH / g or more and 25 mgK ⁇ H / g or less.
- an acrylic resin as a binder for the conductive paste a conductive paste having a desired viscosity can be prepared.
- the resin Prior to formation of the electrode layer or after forming the electrode layer and drying it, the resin contains an atalinole-based resin as a binder, and contains limonene, heaterpinyl acetate, I-dihydrocarbyl acetate, 1_menthon, It contains at least one solvent selected from the group consisting of 1_perillyl acetate, 1_carbyl acetate, and d-dihydrocarbyl acetate, and contains a dielectric material for the prepared spacer layer in the same manner as described above.
- the body paste is printed on the surface of the second support sheet in a pattern complementary to the pattern of the electrode layer using a screen printing machine, a gravure printing machine, or the like to form a spacer layer.
- the spacer layer on the surface of the ceramic green sheet with a pattern complementary to the pattern of the electrode layer, the surface of the electrode layer and the ceramic without the electrode layer are formed.
- a step can be prevented from forming between the surface of the green sheet and a multilayer ceramic capacitor manufactured by stacking a number of multilayer units each including a ceramic green sheet and an electrode layer. It is possible to effectively prevent the multilayer electronic component from being deformed, and to effectively prevent the occurrence of delamination.
- the weight average molecular weight of the acrylic resin contained in the dielectric paste for forming the spacer layer is preferably 450,000 or more and 900,000 or less, and the weight average molecular weight is preferably 450,000 or less.
- a dielectric paste having a desired viscosity can be prepared by using 900,000 or less of an acrylic resin as a binder for the conductive paste.
- the acrylic resin contained in the dielectric paste preferably has an acid value of 5 mgK ⁇ H / g or more and 25 mgKOHZg or less, and an acid value of 5 mgKOHZg or more and 25 mgK ⁇ H / g or less.
- a dielectric paste having a desired viscosity can be prepared.
- an elongate third support sheet is prepared, and the adhesive solution is supplied to the third support sheet by a bar coater, an ethanol coater, a reverse coater, a dip coater, a kiss coater, or the like. Is applied to the surface of the substrate and dried to form an adhesive layer.
- the adhesive solution is substantially similar to the binder similar to the binder included in the dielectric base for forming the ceramic green sheet, and the particles of the dielectric material included in the ceramic green sheet. And a particle of a dielectric material having a particle size equal to or less than the thickness of the adhesive layer, a plasticizer, an antistatic agent, and a release agent.
- the adhesive layer is preferably formed to a thickness of about 0.3 / im or less, more preferably about 0.32 / im, and more preferably about 0.3 / im. It is formed to have a thickness of about 0.02 ⁇ im ⁇ and a thickness of about 0.2 / im.
- the adhesive layer formed on the long third support sheet is formed on the electrode layer and the spacer layer or the support sheet formed on the long second support sheet.
- the third support sheet is adhered to the surface of the formed ceramic green sheet, and after adhesion, the third support sheet is peeled off from the adhesive layer, and the adhesive layer is transferred.
- the ceramic green sheet formed on the surface of the long support sheet is adhered to the surface of the adhesive layer, After the attachment, the support sheet is peeled off from the ceramic green sheet, the ceramic green sheet is transferred to the surface of the adhesive layer, and a laminate unit including the ceramic green sheet and the electrode layer and the spacer layer is prepared.
- the adhesive layer was transferred to the surface of the ceramic green sheet of the laminate unit thus obtained in the same manner as the adhesive layer was transferred to the surface of the electrode layer and the spacer layer.
- the laminate unit to which the adhesive layer has been transferred is cut into a predetermined size.
- a predetermined number of laminated units to which the adhesive layer has been transferred are produced on the surface thereof, and a prescribed number of laminated units are laminated to produce a laminated block.
- the laminate unit In manufacturing the laminate block, first, the laminate unit is placed on a support formed of polyethylene terephthalate or the like such that the adhesive layer transferred to the surface of the laminate unit is in contact with the support. After being positioned and pressed by a press or the like, the laminate unit is adhered to the support through an adhesive layer.
- the second support sheet is peeled off by the peeling layer, and the laminate unit is laminated on the support.
- a new laminate unit is positioned such that the adhesive layer formed on the surface is in contact with the surface of the release layer of the laminate unit laminated on the support.
- a new laminate unit is laminated via an adhesive layer on the release layer of the laminate unit laminated on the support under pressure, and then the second laminate unit is removed from the release layer of the new laminate unit.
- the second support sheet is peeled off.
- the adhesive layer is transferred to the surface of the ceramic green sheet, the electrode layer and the spacer layer formed on the second support sheet are adhered to the surface of the adhesive layer, After the bonding, the second support sheet is peeled from the release layer, and the electrode layer and the spacer layer and the release layer are transferred to the surface of the adhesive layer, and the ceramic green sheet and the electrode layer and the spacer layer are transferred.
- a stack unit including the stack is created.
- the adhesive layer is transferred to the surface of the release layer of the laminate unit thus obtained in the same manner as the adhesive layer is transferred to the surface of the ceramic green sheet, and the adhesive layer is transferred to the surface thereof.
- the laminated unit thus cut is cut into a predetermined size.
- a predetermined number of laminate units to which the adhesive layer has been transferred are produced on the surface thereof, and a prescribed number of laminate units are laminated to produce a laminate block.
- the laminate unit In manufacturing the laminate block, first, the laminate unit is placed on a support formed of polyethylene terephthalate or the like so that the adhesive layer transferred to the surface of the laminate unit is in contact with the support. It is positioned, pressurized by a press, etc., The laminate unit is adhered to the support via the adhesive layer.
- the support sheet is peeled off from the ceramic green sheet, and the laminate unit is laminated on the support.
- a new laminate unit is positioned such that the adhesive layer formed on the surface thereof is in contact with the surface of the ceramic green sheet of the laminate unit laminated on the support.
- a new laminate unit is laminated via an adhesive layer on the ceramic green sheet of the laminate unit that is pressed and laminated on the support, and then the support sheet is formed from the ceramic of the new laminate unit. Is peeled off.
- the laminate block including the predetermined number of laminate units thus produced was laminated on the outer layer of the multilayer ceramic capacitor, and the other outer layer was further laminated on the laminate block.
- the laminate is pressed and cut into a predetermined size to produce a number of ceramic green chips.
- an acrylic resin is contained as a binder, and limonene, ⁇ -terpininoleate acetate, I-dihydrocarbyl acetate, I-mentone, I-perillyl acetate, I-yl rubyl acetate, and d-di
- a dielectric paste containing at least one kind of solvent selected from the group consisting of hydrocarbyl acetate, a spacer layer is formed, and limonene, heaterpinyl acetate, I-dihydrocarbyl acetate, I-menthon, 1 _
- Solvents selected from the group consisting of perillyl acetate, I-carbyl acetate, and d-dihydrocarbyl acetate contain the same binder as the ceramic green sheet because they hardly dissolve the petyral-based resin contained as noinda in the ceramic green sheet Form a release layer and peel When a dielectric layer is printed on the layer to form
- the surface of the spacer layer can be effectively prevented from cracking or wrinkling.
- it can be manufactured by laminating a large number of laminate units including ceramic green sheets and electrode layers. It is possible to reliably prevent voids from being generated in the laminated ceramic capacitor, and to form cracks and wrinkles on the surface of the spacer layer by laminating the laminate unit to form a laminate.
- the process of manufacturing the multilayer ceramic capacitor it is possible to reliably prevent the chip from being dropped and mixed as a foreign substance into the multilayer body to cause an internal defect in the multilayer ceramic capacitor.
- the electrode layer and the spacer layer formed on the second support sheet are dried, they are bonded to the surface of the ceramic green sheet via the bonding layer. Since the conductive paste is printed on the surface of the ceramic green sheet to form the electrode layer, and the dielectric paste is printed on the surface of the ceramic green sheet, the conductive paste is formed as in the case of forming the spacer layer.
- the electrode layer and the spacer layer can be laminated on the ceramic green sheet as desired, so that the paste or the dielectric paste does not soak into the ceramic green sheet.
- an acrylic resin is contained as a binder, and limonene, ⁇ -ta-pinyl acetate, I-dihydrocarbyl acetate, I-mentone, I-perillyl acetate, I-carbyl acetate are used.
- an electrode layer is formed using a conductive paste containing at least one solvent selected from the group consisting of d-dihydrocarbyl acetate, limonene, ⁇ -terpinyl acetate, I-dihydrocarbyl acetate, I-menton, I Solvents selected from the group consisting of i-perylyl acetate, I-carbyl acetate, and d-dihydrocarbyl acetate hardly dissolve the petyral resin contained in the ceramic green sheet as an indica, and therefore have the same binder as the ceramic green sheet.
- the release layer and the electrode layer are formed on the long second support sheet.
- the laminate unit is formed into an adhesive layer that is not cut.
- the ceramic green sheet, the adhesive layer, the electrode layer, the spacer layer, and the release layer are laminated on the long support sheet, and the release layer of the formed laminate unit is adhered and supported from the ceramic green sheet. The sheet is peeled off, and the two laminate units are laminated on the long second support sheet.
- the adhesive layer formed on the third support sheet is transferred onto the ceramic green sheets located on the surfaces of the two laminate units, and further, the adhesive layer is transferred onto the long support sheet. Then, the ceramic green sheet, the adhesive layer, the electrode layer, the spacer layer, and the release layer are laminated, and the release layer of the formed laminate unit is bonded, and the support sheet is released from the ceramic Darrieen sheet.
- a laminate unit set in which a predetermined number of laminate units are laminated is produced, and further, a third surface of the ceramic line sheet positioned on the surface of the laminate unit set is provided with a third After the adhesive layer formed on the support sheet is transferred, the laminate is cut into a predetermined size to produce a laminate block.
- the adhesive layer is transferred to the surface of the ceramic green sheet, the ceramic green sheet, the adhesive layer, the electrode layer, the spacer layer, and the release layer are formed on the long support sheet.
- the laminated unit is cut into an adhesive layer that is not cut, and is formed on the long second support sheet.
- the release layer, the electrode layer and the spacer layer, the adhesive layer, and the ceramic green sheet are laminated, the ceramic green sheets of the formed laminate unit are bonded, and the second support sheet is released from the release layer.
- the two laminate units are laminated on the long support sheet.
- the adhesive layer formed on the third support sheet is transferred onto the release layer located on the surface of the two laminate units, and further, the long second support sheet is attached to the adhesive layer.
- the release layer, the electrode layer and the spacer layer, the adhesive layer, and the ceramic green sheet are laminated on the sheet, and the ceramic green sheet of the formed laminate unit is bonded, and the second support sheet is formed from the release layer. Peeled off.
- a laminate unit set in which a predetermined number of laminate units are laminated is produced, and further, a third layer is placed on the surface of the release layer located on the surface of the laminate unit set. After the transfer of the adhesive layer formed on the support sheet, the adhesive sheet is cut into a predetermined size to produce a laminate block.
- a multilayer ceramic capacitor is manufactured using the multilayer block manufactured in the same manner as in the above embodiment.
- the laminate units are successively laminated on the long second support sheet or the support sheet to produce a laminate unit set including a predetermined number of laminate units. After that, the laminate unit set is cut to a prescribed size to create a laminate block, so the laminate units cut to the prescribed size are laminated one by one and laminated. Compared with the case of manufacturing a block, it becomes possible to greatly improve the manufacturing efficiency of the laminated body block.
- the release layer and the electrode are formed on the long second support sheet.
- the laminated unit is cut after the adhesive layer is transferred to the surface of the ceramic green sheet of the formed laminate unit in which the layer and the spacer layer, the adhesive layer, and the ceramic green sheet are laminated.
- the electrode layer and the spacer layer formed on the second support sheet are adhered to the adhesive layer, and the second support sheet is separated from the release layer, and the electrode layer, the spacer layer, and the release layer Is transferred to the surface of the adhesive layer.
- the adhesive layer formed on the third support sheet is transferred to the surface of the release layer transferred to the surface of the adhesive layer, and the ceramic green sheet formed on the support sheet is bonded to the adhesive layer.
- the support sheet is peeled off from the ceramic green sheet, and the ceramic Darline sheet is transferred to the surface of the adhesive layer.
- the adhesive layer formed on the third support sheet is transferred to the surface of the ceramic green sheet transferred to the surface of the adhesive layer, and the electrode layer formed on the second support sheet sheet is transferred. And the spacer layer is adhered to the adhesive layer, the second support sheet is peeled from the release layer, and the electrode layer, the spacer layer and the release layer are transferred to the surface of the adhesive layer.
- the adhesive layer is transferred to the surface of the ceramic green sheet
- the ceramic green sheet, the adhesive layer, the electrode layer, the spacer layer, and the release layer are formed on the long support sheet.
- the adhesive layer is transferred to the surface of the release layer of the laminated unit formed and laminated
- the ceramic green sheet formed on the support sheet is formed on the adhesive layer that does not cut the laminated unit.
- the support sheet is separated from the ceramic green sheet, and the ceramic green sheet is transferred to the surface of the adhesive layer.
- the adhesive layer formed on the third support sheet is transferred to the surface of the ceramic green sheet transferred to the surface of the adhesive layer, and the electrode layer and the electrode formed on the second support sheet are transferred.
- the spacer layer is adhered to the adhesive layer, the second support sheet is peeled from the release layer, and the electrode layer, the spacer layer, and the release layer are transferred to the surface of the adhesive layer.
- the adhesive layer formed on the third support sheet is transferred to the surface of the release layer transferred to the surface of the adhesive layer, and is applied to the ceramic green sheet formed on the support sheet sheet.
- the support sheet is peeled off from the ceramic green sheet, and the ceramic green sheet is transferred to the surface of the adhesive layer.
- a laminate unit set in which a predetermined number of laminate units are laminated is produced. Further, an adhesive layer is formed on the surface of the release layer located on the surface of the laminate unit set. After the transfer, the laminate is cut into a predetermined size to produce a laminate block.
- a multilayer ceramic capacitor is manufactured in the same manner as in the above embodiment using the multilayer block manufactured as described above.
- the transfer of the adhesive layer, the electrode layer and the spacer layer, and the release are performed on the surface of the long second support sheet or the laminate unit formed on the support sheet.
- the layer transfer, the adhesive layer transfer, and the ceramic green sheet transfer are repeated, and the laminate units are successively laminated to produce a laminate unit set including a predetermined number of laminate units. Cut the unit set to the specified size, and Since the blocks are made, the production efficiency of the laminated blocks is greatly improved as compared to the case where the laminated units cut into a predetermined size are laminated one by one to produce the laminated blocks. It becomes possible to do.
- the median diameter of the pulverized additive was 0.1 m.
- polybutyl butyral polymerization degree: 1450, butyralization degree: 69 mol%) was added to 50 parts by weight.
- C dissolve in 42.5 parts by weight of ethyl alcohol and 42.5 parts by weight of propyl alcohol to prepare a 15% solution of an organic vehicle, and further add 500 cc of a slurry having the following composition.
- Mixing was performed for 20 hours using a polyethylene container to prepare a dielectric paste.
- the polyethylene container was filled with 330.lg of slurry and 900 g of ZrO beads (diameter 2 mm), and the polyethylene container was rotated at a peripheral speed of 45 m / min.
- BaTiO powder manufactured by Sakai Danigaku Kogyo Co., Ltd .: trade name "BT-02": particle size 0.2 / m
- the obtained dielectric paste was applied on a polyethylene terephthalate film at a coating speed of 50 m / min using a die coater to form a coating film, which was obtained in a drying oven maintained at 80 ° C.
- the coated film was dried to form a ceramic green sheet having a thickness of 1 / m.
- a slurry was prepared by mixing 3 parts by weight of limonene and 1.5 parts by weight of a polyethylene glycol-based dispersing agent, and using a pulverizer “LMZ0.6” (trade name) manufactured by Ashiza Fine Fine Co., Ltd. The additives in the slurry were ground.
- the rotor Into the vessel so that the volume is 80% of the vessel capacity, and at a peripheral speed of 14 m / min, the rotor The slurry was circulated between the vessel and the slurry tank until all the slurry stayed in the vessel for 30 minutes to break up the additives in the slurry.
- the median diameter of the additives after pulverization was 0. 1 ⁇ m.
- BaTiO powder manufactured by Sakai Danigaku Kogyo Co., Ltd .: trade name "BT-02": particle size 0.2 / m
- Dioctyl phthalate (plasticizer) 2. 61 parts by weight
- acetone was evaporated from the slurry thus obtained and removed from the mixture using a stirring device equipped with an evaporator and a heating mechanism to obtain a dielectric paste.
- the dielectric paste thus prepared is printed in a predetermined pattern on a ceramic green sheet using a screen printer, dried at 90 ° C for 5 minutes, and placed on a ceramic green sheet. A spacer layer was formed.
- a slurry was prepared by mixing 3 parts by weight of limonene and 1.5 parts by weight of a polyethylene glycol-based dispersing agent, and using a pulverizer “LMZ0.6” (trade name) manufactured by Ashiza Fine Fine Co., Ltd. The additives in the slurry were ground.
- the median diameter of the pulverized additive was 0.1 ⁇ .
- BaTiO powder manufactured by Sakai Chemical Industry Co., Ltd .: particle diameter 0.05 urn
- Polyethylene glycol dispersant 1 Dioctyl phthalate (plasticizer) 2.25 parts by weight
- acetone was evaporated from the slurry thus obtained and removed from the mixture using a stirring device equipped with an evaporator and a heating mechanism to obtain a conductor paste.
- the conductive material concentration in the conductive paste was 47% by weight.
- the conductive paste thus prepared is printed on a ceramic green sheet using a screen printer in a pattern complementary to the spacer layer pattern, and dried at 90 ° C for 5 minutes. Then, an electrode layer having a thickness of lxm was formed, and a laminate unit in which a ceramic green sheet, an electrode layer, and a spacer layer were laminated on the surface of a polyethylene terephthalate film was produced.
- the prepared dielectric paste is applied to the surface of the polyethylene terephthalate film using a die coater to form a coating film, and the coating film is dried to have a thickness of 10 ⁇ .
- a ceramic green sheet was formed.
- the thus-produced ceramic green sheet having a thickness of 10 ⁇ m was peeled off from the polyethylene terephthalate film, cut, and the cut five ceramic green sheets were laminated to form a 50 / im thickness. Then, the laminate unit was peeled off from the polyethylene terephthalate film, cut, and the cut 50 laminate units were laminated on the cover layer.
- the ceramic green sheet having a thickness of 10 zm was peeled from the polyethylene terephthalate film, cut, and the cut five ceramic green sheets were laminated on the laminated unit.
- a laminated body was prepared in which the effective layer having the thickness and the upper cover layer having a thickness of 50 ⁇ m were laminated.
- the laminate thus obtained was subjected to press molding under a temperature condition of 70 ° C by applying a pressure of lOOMPa, and was cut into a predetermined size by a dicing machine to produce a ceramic Darline chip. did.
- the ceramic green chip thus produced was treated in air under the following conditions to remove the binder.
- Heating rate 50 ° C / hour
- the ceramic green chip was treated and fired under the following conditions in an atmosphere of a mixed gas of nitrogen gas and hydrogen gas controlled at a dew point of 20 ° C.
- the contents of nitrogen gas and hydrogen gas in the mixed gas were 95% by volume and 5% by volume.
- Heating rate 300 ° C / hour
- Cooling rate 300 ° C / hour
- the fired ceramic green chips were subjected to an annealing treatment under an atmosphere of nitrogen gas controlled at a dew point of 20 ° C. under the following conditions.
- Heating rate 300 ° C / hour
- Cooling rate 300 ° C / hour
- the anneal-treated ceramic green chip is put into a two-component curable epoxy resin so that the side surface is exposed, and the two-component curable epoxy resin is cured. Polished only 6mm. # 400 as sandpaper Sandpaper, # 800 sandpaper, # 1000 sandpaper and # 2
- the polished surface was mirror-polished using a 1 ⁇ m diamond paste, and the polished surface of the ceramic green chip was magnified 400 times with an optical microscope.
- the resistance values of the 50 multilayer ceramic capacitor samplers thus manufactured were measured by a multimeter, and the multilayer ceramic capacitor samples were inspected for short-circuit failure.
- a spacer layer and an electrode layer were formed on a ceramic green sheet in the same manner as in Example 1, and the surfaces of the electrode layer and the spacer layer were magnified 400 times using a metallographic microscope. Upon observation, no cracks or wrinkles were observed.
- a spacer layer and an electrode layer were formed on a ceramic green sheet in the same manner as in Example 1, and the surfaces of the electrode layer and the spacer layer were magnified 400 times using a metallographic microscope. Upon observation, no cracks or wrinkles were observed.
- the resistance value of the 50 multilayer ceramic capacitor samplers was measured by a multimeter, and the short-circuit rate of the multilayer ceramic capacitor sampler was 18%.
- Example 1 except that l-mentone was used in place of limonene as a solvent for preparing the dielectric paste for the spacer layer and a solvent for preparing the conductor base for the electrode layer.
- a spacer layer and an electrode layer were formed on the ceramic green sheet, and the surface of the electrode layer and the spacer layer was observed using a metallographic microscope at a magnification of 400 times. No cracks or wrinkles were observed.
- Example 5 The resistance value of the 50 multilayer ceramic capacitors Sampnoré was measured with a multimeter, and the short-circuit rate of the multilayer ceramic capacitor Sampnoré was measured. The short-circuit rate was 10%.
- a spacer layer and an electrode layer were formed on a ceramic green sheet in the same manner as in Example 1, and the surfaces of the electrode layer and the spacer layer were observed at 400 times magnification using a metallographic microscope. However, no cracks or wrinkles were observed.
- Example 2 Next, in the same manner as in Example 1, a total of 50 ceramic green chips were produced, and the side surfaces of the fired and annealed ceramic green chips were polished, and the polished surface was observed with an optical microscope. Upon observation, the presence of voids was not observed.
- the resistance value of the 50 multilayer ceramic capacitors Sampnoré was measured with a multimeter, and the short-circuit rate of the multilayer ceramic capacitor Sampnoré was measured to be 16%.
- a spacer layer and an electrode layer were formed on a ceramic green sheet in the same manner as in Example 1, and the surfaces of the electrode layer and the spacer layer were observed at 400 times magnification using a metallographic microscope. However, no cracks or wrinkles were observed.
- the short-circuit rate of the multilayer ceramic capacitor sampler was measured by using a multimeter to measure the resistance value of the 50 multilayer ceramic capacitor samplers, and the short-circuit rate was 8%.
- Solvent for preparing dielectric paste for spacer layer and conductor for electrode layer A spacer layer and an electrode layer were formed on a ceramic green sheet in the same manner as in Example 1 except that d-dihydrocarbyl acetate was used instead of limonene as a solvent for preparing the first paste.
- the surface of the electrode layer and the spacer layer was observed at a magnification of 400 times using a metallographic microscope, and no cracks or wrinkles were observed.
- Example 2 50 multilayer ceramic capacitor samples were prepared, and the resistance values of the 50 multilayer ceramic capacitor samplers were measured with a multimeter. When the short ratio was measured, the short ratio was 10%.
- a mixed solvent of terpionel and kerosene (mixing ratio (%)) was used as a solvent for preparing the dielectric paste for the spacer layer and a solvent for preparing the conductive paste for the electrode layer.
- a spacer layer and an electrode layer were formed on a ceramic green sheet in the same manner as in Example 1 except that a mass ratio of 50:50) was used. When the surfaces of the electrode layer and the spacer layer were observed under magnification, cracks and wrinkles were observed on the surfaces of the electrode layer and the spacer layer.
- Solvent for preparing dielectric paste for spacer layer and conductor for electrode layer A spacer layer and an electrode layer were formed on a ceramic green sheet in the same manner as in Example 1, except that tarpionell was used in place of limonene as a solvent for preparing the first paste. Using a metallurgical microscope, the surface of the electrode layer and the spacer layer was observed at a magnification of 400 times, and cracks and wrinkles were observed on the surfaces of the electrode layer and the spacer layer.
- Example 2 50 multilayer ceramic capacitor samples were prepared, and the resistance values of the 50 multilayer ceramic capacitor samples were measured with a multimeter. When the short ratio was measured, the short ratio was 88%.
- a spacer layer containing a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder, and a mixed solvent of terpionel and kerosene (mixing ratio (mass ratio) 50:50).
- the electrode layer is formed by printing a conductive paste containing phenol as a solvent, polybutyral (degree of polymerization 1450, On a ceramic green sheet formed using a dielectric paste containing a 69% thermoplastic resin, a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder, and terpionel as a solvent.
- a conductive paste containing a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and terpionel as a solvent is printed. Therefore, when the electrode layer is formed, cracks and wrinkles are generated on the surface of the spacer layer and the surface of the electrode layer, and the fired ceramic layer is formed. While the generation of voids was observed in the green chip, the weight was reduced on a ceramic green sheet formed using a dielectric paste containing polyvinyl butyral (degree of polymerization 1450, degree of chirality of 69%) as a binder.
- a dielectric layer containing a copolymer of methyl methacrylate and butyl acrylate having an average molecular weight of 700,000 as a binder and limonene as a solvent is printed to form a spacer layer, and a weight average molecular weight of 700,000 is formed.
- the binder is polyvinyl butyral (degree of polymerization 1450, degree of butyralization 69). %) On a ceramic green sheet formed using a dielectric paste containing a copolymer of methyl methacrylate and butyl acrylate with a weight average molecular weight of 700,000 as a binder, and a dihydrohydrocarbyl acetate as a solvent.
- the paste is printed to form a spacer layer, and the weight average
- the electrode layer is formed by printing a conductive paste containing a copolymer of methyl methacrylate and butyl acrylate in a quantity of 700,000 as a binder and dihydrocarbyl acetate as a solvent, polybierptylal is used as a binder.
- a conductive paste containing a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and a copolymer containing I-menthone as a solvent is formed by printing a dielectric paste containing menthol as a solvent.
- the A copolymer of methyl methacrylate and butyl acrylate with a weight-average molecular weight of 700,000 was placed on a ceramic green sheet formed using a dielectric paste containing butyral (degree of polymerization 1450, degree of butyralization 69%).
- a binder layer is formed by printing a dielectric paste containing perillyl acetate as a solvent to form a spacer layer, and a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 is included as a binder.
- a dielectric paste containing A dielectric paste containing a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and I-carbyl acetate as a solvent is printed on the ceramic green sheet formed by the above method.
- a dielectric base containing polybutylbutyral (polymerization degree 1450, petilalization degree 69%) is used as a binder.
- a dielectric paste containing a copolymer of methyl methacrylate and butyl acrylate having a weight-average molecular weight of 700,000 as a binder and d-dihydrocarbyl acetate as a solvent is printed on a ceramic green sheet formed by using a single process.
- a spacer layer Forming a spacer layer, printing a conductive paste containing a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and d-dihydrocarbyl acetate as a solvent,
- a conductive paste containing a copolymer of methyl methacrylate and butyl acrylate having a weight average molecular weight of 700,000 as a binder and d-dihydrocarbyl acetate as a solvent
- the weight average molecular weight was determined on a ceramic green sheet formed using a dielectric paste containing polybutyral (polymerization degree: 1450, petitlary dagger degree: 69%) as a binder.
- a multilayer ceramic capacitor is fabricated by laminating 50 laminate units, and a multilayer ceramic capacitor is produced, as well as a dielectric containing polybierptylal (polymerization degree 1450, butyralization degree 69%) as a binder
- Methacrylic acid with a weight average molecular weight of 700,000 was placed on a ceramic green sheet
- a dielectric unit and a conductor paste containing butyl and butyl acrylate as binders and terpionel as a solvent are printed to produce a laminate unit, and 50 laminate units are laminated.
- the dielectric paste containing polyvinyl butyral degree of polymerization 1450, degree of petitialization 69%) is used as a binder.
- a dielectric paste and a conductor paste containing a copolymer of methyl methacrylate and butyl acrylate with a weight-average molecular weight of 700,000 as a binder and limonene as a solvent are printed and laminated on a ceramic Darline sheet formed using Body unit, and laminate 50 units to form a laminated ceramic core.
- a methyl green methacrylate having a weight average molecular weight of 700,000 is placed on a ceramic green sheet formed using a dielectric paste containing polybutyral (degree of polymerization: 1450, degree of petitalization: 69%) as a binder.
- a polyvinyl butyral degree of polymerization 1450, A dielectric paste containing a copolymer of methyl methacrylate and butyl acrylate with a weight-average molecular weight of 700,000 as a binder and I-dihydrocarbyl acetate as a solvent on a ceramic green sheet formed using a dielectric paste containing
- a polybutyral degree of polymerization 1450, butyralized
- Ceramics formed using a dielectric paste containing A dielectric paste and a conductor paste containing a copolymer of methyl methacrylate and butyl acrylate having a weight-average molecular weight of 700,000 as a binder and I-menton as a solvent are printed on the adhesive sheet to form a laminate unit.
- a ceramic green formed using a dielectric paste containing polyvinyl butyral (polymerization degree 1450, butyralization degree 69%) as a binder
- a dielectric paste and a conductor paste containing a copolymer of methyl methacrylate and butyl acrylate having a weight-average molecular weight of 700,000 as a binder and containing I perillyl acetate as a solvent are printed on the sheet to form a laminate unit.
- Hydrocarbyl acetate, I-menthone, 1_perillyl acetate, 1_carbyl acetate and d-dihydride Carbyl acetate hardly dissolves the polybutyral contained in the dielectric paste used to form the ceramic green sheets, and therefore swells or partially dissolves the ceramic green sheets. It is considered that pinholes and cracks were prevented from being generated in the ceramic green sheet.
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Abstract
Description
Claims
Priority Applications (1)
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US10/582,994 US20070149666A1 (en) | 2003-12-15 | 2004-12-14 | Dielectric paste for spacer layer of a multi-layered ceramic electronic component |
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JP2003416158A JP2005171178A (ja) | 2003-12-15 | 2003-12-15 | 積層セラミック電子部品のスペーサ層用の誘電体ペースト |
JP2003-416158 | 2003-12-15 |
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US (1) | US20070149666A1 (ja) |
JP (1) | JP2005171178A (ja) |
KR (1) | KR100766320B1 (ja) |
CN (1) | CN1894334A (ja) |
TW (1) | TWI250540B (ja) |
WO (1) | WO2005056674A1 (ja) |
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CN110171971A (zh) * | 2019-06-24 | 2019-08-27 | 深圳市森世泰科技有限公司 | 陶瓷粘合浆料及多层陶瓷及其制作方法及电子器件 |
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- 2004-12-14 WO PCT/JP2004/018628 patent/WO2005056674A1/ja active Application Filing
- 2004-12-14 CN CNA2004800375204A patent/CN1894334A/zh active Pending
- 2004-12-14 KR KR1020067011790A patent/KR100766320B1/ko not_active IP Right Cessation
- 2004-12-14 US US10/582,994 patent/US20070149666A1/en not_active Abandoned
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CN1894334A (zh) | 2007-01-10 |
US20070149666A1 (en) | 2007-06-28 |
KR20060103918A (ko) | 2006-10-04 |
TWI250540B (en) | 2006-03-01 |
JP2005171178A (ja) | 2005-06-30 |
TW200523959A (en) | 2005-07-16 |
KR100766320B1 (ko) | 2007-10-12 |
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