WO2005087689A1 - 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法 - Google Patents
積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法 Download PDFInfo
- Publication number
- WO2005087689A1 WO2005087689A1 PCT/JP2005/004607 JP2005004607W WO2005087689A1 WO 2005087689 A1 WO2005087689 A1 WO 2005087689A1 JP 2005004607 W JP2005004607 W JP 2005004607W WO 2005087689 A1 WO2005087689 A1 WO 2005087689A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- acetate
- ceramic green
- spacer layer
- layer
- dielectric paste
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 395
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 125000006850 spacer group Chemical group 0.000 claims abstract description 306
- 239000011230 binding agent Substances 0.000 claims abstract description 129
- 239000002904 solvent Substances 0.000 claims abstract description 101
- 239000001856 Ethyl cellulose Substances 0.000 claims abstract description 96
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims abstract description 96
- 229920001249 ethyl cellulose Polymers 0.000 claims abstract description 96
- 235000019325 ethyl cellulose Nutrition 0.000 claims abstract description 96
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000001605 (5-methyl-2-propan-2-ylcyclohexyl) acetate Substances 0.000 claims abstract description 35
- 238000007639 printing Methods 0.000 claims abstract description 24
- YWJHQHJWHJRTAB-UHFFFAOYSA-N 4-(2-Methoxypropan-2-yl)-1-methylcyclohex-1-ene Chemical compound COC(C)(C)C1CCC(C)=CC1 YWJHQHJWHJRTAB-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims abstract description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims description 107
- 229920005989 resin Polymers 0.000 claims description 28
- 239000011347 resin Substances 0.000 claims description 28
- 238000000034 method Methods 0.000 claims description 20
- GJRQTCIYDGXPES-UHFFFAOYSA-N iso-butyl acetate Natural products CC(C)COC(C)=O GJRQTCIYDGXPES-UHFFFAOYSA-N 0.000 claims description 19
- FGKJLKRYENPLQH-UHFFFAOYSA-M isocaproate Chemical compound CC(C)CCC([O-])=O FGKJLKRYENPLQH-UHFFFAOYSA-M 0.000 claims description 19
- OQAGVSWESNCJJT-UHFFFAOYSA-N isovaleric acid methyl ester Natural products COC(=O)CC(C)C OQAGVSWESNCJJT-UHFFFAOYSA-N 0.000 claims description 19
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims description 14
- 238000006116 polymerization reaction Methods 0.000 claims description 12
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 10
- IGODOXYLBBXFDW-UHFFFAOYSA-N alpha-Terpinyl acetate Chemical compound CC(=O)OC(C)(C)C1CCC(C)=CC1 IGODOXYLBBXFDW-UHFFFAOYSA-N 0.000 abstract description 14
- IGODOXYLBBXFDW-NSHDSACASA-N alpha-Terpinyl acetate Natural products CC(=O)OC(C)(C)[C@@H]1CCC(C)=CC1 IGODOXYLBBXFDW-NSHDSACASA-N 0.000 abstract description 7
- WWJLCYHYLZZXBE-UHFFFAOYSA-N 5-chloro-1,3-dihydroindol-2-one Chemical compound ClC1=CC=C2NC(=O)CC2=C1 WWJLCYHYLZZXBE-UHFFFAOYSA-N 0.000 abstract description 2
- KGEKLUUHTZCSIP-UHFFFAOYSA-N Isobornyl acetate Natural products C1CC2(C)C(OC(=O)C)CC1C2(C)C KGEKLUUHTZCSIP-UHFFFAOYSA-N 0.000 abstract description 2
- 239000001940 [(1R,4S,6R)-1,7,7-trimethyl-6-bicyclo[2.2.1]heptanyl] acetate Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 622
- 239000012790 adhesive layer Substances 0.000 description 81
- 230000037303 wrinkles Effects 0.000 description 69
- 239000002002 slurry Substances 0.000 description 32
- 239000000654 additive Substances 0.000 description 30
- 239000004020 conductor Substances 0.000 description 30
- -1 phthalic acid ester Chemical class 0.000 description 29
- 239000003985 ceramic capacitor Substances 0.000 description 27
- 230000000052 comparative effect Effects 0.000 description 23
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 22
- 239000011800 void material Substances 0.000 description 22
- 230000000996 additive effect Effects 0.000 description 19
- 229910052799 carbon Inorganic materials 0.000 description 19
- 239000000843 powder Substances 0.000 description 19
- WTXBCFKGCNWPLS-UHFFFAOYSA-N (4-prop-1-en-2-yl-1-cyclohexenyl)methyl acetate Chemical compound CC(=O)OCC1=CCC(C(C)=C)CC1 WTXBCFKGCNWPLS-UHFFFAOYSA-N 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 15
- 239000003989 dielectric material Substances 0.000 description 14
- 238000002156 mixing Methods 0.000 description 14
- 239000004014 plasticizer Substances 0.000 description 13
- 229920000139 polyethylene terephthalate Polymers 0.000 description 13
- 239000005020 polyethylene terephthalate Substances 0.000 description 13
- 238000010030 laminating Methods 0.000 description 12
- 239000002245 particle Substances 0.000 description 12
- 230000000295 complement effect Effects 0.000 description 11
- XHXUANMFYXWVNG-ADEWGFFLSA-N (-)-Menthyl acetate Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@H]1OC(C)=O XHXUANMFYXWVNG-ADEWGFFLSA-N 0.000 description 10
- 239000002270 dispersing agent Substances 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000005259 measurement Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 8
- 239000002202 Polyethylene glycol Substances 0.000 description 8
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 8
- 238000001035 drying Methods 0.000 description 8
- 239000003350 kerosene Substances 0.000 description 8
- 229920001223 polyethylene glycol Polymers 0.000 description 8
- 238000007650 screen-printing Methods 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 238000007646 gravure printing Methods 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 230000002093 peripheral effect Effects 0.000 description 6
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 5
- XHXUANMFYXWVNG-UHFFFAOYSA-N D-menthyl acetate Natural products CC(C)C1CCC(C)CC1OC(C)=O XHXUANMFYXWVNG-UHFFFAOYSA-N 0.000 description 5
- 239000004698 Polyethylene Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000000137 annealing Methods 0.000 description 4
- 239000012298 atmosphere Substances 0.000 description 4
- 239000011324 bead Substances 0.000 description 4
- 229920002678 cellulose Polymers 0.000 description 4
- 239000001913 cellulose Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 230000032798 delamination Effects 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 235000019441 ethanol Nutrition 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229930195733 hydrocarbon Natural products 0.000 description 4
- 150000002430 hydrocarbons Chemical class 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- 239000003960 organic solvent Substances 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 230000008961 swelling Effects 0.000 description 4
- NFLGAXVYCFJBMK-BDAKNGLRSA-N (-)-menthone Chemical compound CC(C)[C@@H]1CC[C@@H](C)CC1=O NFLGAXVYCFJBMK-BDAKNGLRSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000001361 adipic acid Substances 0.000 description 3
- 235000011037 adipic acid Nutrition 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 150000002902 organometallic compounds Chemical class 0.000 description 3
- 239000000088 plastic resin Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 229940090181 propyl acetate Drugs 0.000 description 3
- 238000013138 pruning Methods 0.000 description 3
- IRIAEXORFWYRCZ-UHFFFAOYSA-N Butylbenzyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCC1=CC=CC=C1 IRIAEXORFWYRCZ-UHFFFAOYSA-N 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- QPMJENKZJUFOON-PLNGDYQASA-N ethyl (z)-3-chloro-2-cyano-4,4,4-trifluorobut-2-enoate Chemical compound CCOC(=O)C(\C#N)=C(/Cl)C(F)(F)F QPMJENKZJUFOON-PLNGDYQASA-N 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- YKYONYBAUNKHLG-UHFFFAOYSA-N propyl acetate Chemical compound CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 150000003505 terpenes Chemical class 0.000 description 2
- 235000007586 terpenes Nutrition 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- NOOLISFMXDJSKH-UTLUCORTSA-N (+)-Neomenthol Chemical compound CC(C)[C@@H]1CC[C@@H](C)C[C@@H]1O NOOLISFMXDJSKH-UTLUCORTSA-N 0.000 description 1
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- NOOLISFMXDJSKH-UHFFFAOYSA-N DL-menthol Natural products CC(C)C1CCC(C)CC1O NOOLISFMXDJSKH-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- VMHLLURERBWHNL-UHFFFAOYSA-M Sodium acetate Chemical compound [Na+].CC([O-])=O VMHLLURERBWHNL-UHFFFAOYSA-M 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- JMMWKPVZQRWMSS-UHFFFAOYSA-N isopropanol acetate Natural products CC(C)OC(C)=O JMMWKPVZQRWMSS-UHFFFAOYSA-N 0.000 description 1
- 229940011051 isopropyl acetate Drugs 0.000 description 1
- GWYFCOCPABKNJV-UHFFFAOYSA-N isovaleric acid Chemical compound CC(C)CC(O)=O GWYFCOCPABKNJV-UHFFFAOYSA-N 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 229940041616 menthol Drugs 0.000 description 1
- VNKYTQGIUYNRMY-UHFFFAOYSA-N methoxypropane Chemical compound CCCOC VNKYTQGIUYNRMY-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000002823 nitrates Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N o-dicarboxybenzene Natural products OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 150000003021 phthalic acid derivatives Chemical class 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010979 ruby Substances 0.000 description 1
- 229910001750 ruby Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000001632 sodium acetate Substances 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 239000000080 wetting agent Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/636—Polysaccharides or derivatives thereof
- C04B35/6365—Cellulose or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
- C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
- C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
- C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/6261—Milling
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62625—Wet mixtures
- C04B35/6264—Mixing media, e.g. organic solvents
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/62605—Treating the starting powders individually or as mixtures
- C04B35/62645—Thermal treatment of powders or mixtures thereof other than sintering
- C04B35/62665—Flame, plasma or melting treatment
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63404—Polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/6342—Polyvinylacetals, e.g. polyvinylbutyral [PVB]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/632—Organic additives
- C04B35/634—Polymers
- C04B35/63448—Polymers obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C04B35/63488—Polyethers, e.g. alkylphenol polyglycolether, polyethylene glycol [PEG], polyethylene oxide [PEO]
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
- C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
- C04B35/638—Removal thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/02—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances
- H01B3/12—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of inorganic substances ceramics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
- C04B2111/90—Electrical properties
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3206—Magnesium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3208—Calcium oxide or oxide-forming salts thereof, e.g. lime
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3205—Alkaline earth oxides or oxide forming salts thereof, e.g. beryllium oxide
- C04B2235/3215—Barium oxides or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
- C04B2235/3225—Yttrium oxide or oxide-forming salts thereof
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
- C04B2235/3239—Vanadium oxides, vanadates or oxide forming salts thereof, e.g. magnesium vanadate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3262—Manganese oxides, manganates, rhenium oxides or oxide-forming salts thereof, e.g. MnO
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3427—Silicates other than clay, e.g. water glass
- C04B2235/3436—Alkaline earth metal silicates, e.g. barium silicate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/30—Constituents and secondary phases not being of a fibrous nature
- C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
- C04B2235/3427—Silicates other than clay, e.g. water glass
- C04B2235/3436—Alkaline earth metal silicates, e.g. barium silicate
- C04B2235/3454—Calcium silicates, e.g. wollastonite
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
- C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
- C04B2235/54—Particle size related information
- C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
- C04B2235/5445—Particle size related information expressed by the size of the particles or aggregates thereof submicron sized, i.e. from 0,1 to 1 micron
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6562—Heating rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6565—Cooling rate
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
- C04B2235/6567—Treatment time
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
- C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
- C04B2235/658—Atmosphere during thermal treatment
- C04B2235/6582—Hydrogen containing atmosphere
Definitions
- the present invention relates to a method for manufacturing a dielectric paste for a multilayer ceramic electronic component and a multilayer unit for a multilayer ceramic electronic component, and more particularly, to a method for manufacturing a dielectric paste adjacent to a spacer layer.
- Dielectric paste for the spacer layer of multilayer ceramic electronic components and multilayer ceramic electronic components that can effectively prevent failure of multilayer ceramic electronic components that cannot dissolve the binder
- the present invention relates to a method for manufacturing a laminate unit.
- a ceramic powder such as an acrylic resin, a petyral resin, and the like, a phthalic acid ester, a glycol, a adipic acid, and a phosphoric acid are used.
- a dielectric paste for a ceramic green sheet is prepared by mixing and dispersing a plasticizer such as an ester and an organic solvent such as toluene, methyl ethyl ketone, and acetone.
- the dielectric paste is applied to a support sheet made of polyethylene terephthalate (PET), polypropylene (PP), or the like by using an etastrusion coater or a gravure coater, and heated. Then, the coating film is dried to produce a ceramic green sheet.
- PET polyethylene terephthalate
- PP polypropylene
- a conductive paste is prepared by dissolving a conductive powder such as nickel and a binder in a solvent such as turbineol, and then applying the conductive paste on a ceramic green sheet by a screen printing machine or the like. Print and dry with the pattern of the above to form the electrode layer To do.
- the ceramic green sheet on which the electrode layer is formed is also peeled off from the supporting sheet to form a laminate unit including the ceramic green sheet and the electrode layer. Are laminated and pressurized, and the obtained laminate is cut into chips to produce green chips.
- the multilayer ceramic electronic component such as a multilayer ceramic capacitor is manufactured by removing the green chip force binder, firing the green chip, and forming an external electrode.
- the thickness of ceramic green sheets that determine the interlayer thickness of the multilayer ceramic capacitor be 3 m or less than 2 m. It is required to laminate a laminate unit including at least 300 ceramic green sheets and an electrode layer.
- the electrode layers are formed in a predetermined pattern on the surface of the ceramic green sheet, the area of the surface of each ceramic green sheet where the electrode layer is formed is formed. And a region where the electrode layer is not formed, a step is formed, and therefore, when it is required to laminate a large number of laminate units each including the ceramic green sheet and the electrode layer. It is difficult to bond the ceramic green sheets included in a large number of laminate units as desired, and a laminate in which a large number of laminate units are laminated may be deformed, There was a problem that delamination occurred.
- a dielectric paste is printed on the surface of the ceramic green sheet in a pattern opposite to the pattern of the electrode layer, and a spacer layer is formed between adjacent electrode layers.
- a method for eliminating a step on the surface of each ceramic green sheet has been proposed.
- a hydrocarbon solvent such as kerosene or decane
- Hydrocarbon solvents such as kerosene or decane are used for a dielectric paste. Since the binder component does not dissolve, the conventionally used solvents such as turbineol cannot be completely replaced by a hydrocarbon-based solvent such as kerosene or decane. It still has a certain degree of solubility in the plastic dust resin, Petilal resin, and therefore, if the ceramic green sheet is extremely thin, a pin is attached to the ceramic green sheet.
- Japanese Patent Application Laid-Open Nos. 5-325633, 7-21833 and 7-21832 disclose hydrogenated tavineol such as dihydrotavineol or dihydrotapiene instead of terbineol.
- terpene solvents such as luacetate, hydrogenated terbineol such as dihydrotavineol, and terpene solvents such as dihydroterpyl acetate are still in use as a binder for ceramic green sheets.
- it has a certain degree of solubility, so it is difficult to prevent pinholes and cracks from occurring in the ceramic green sheet when the thickness of the ceramic dust sheet is extremely small. There was a problem.
- the present invention effectively prevents the multilayer ceramic electronic component from having a problem in dissolving the binder contained in the layer adjacent to the spacer layer of the multilayer ceramic electronic component, thereby preventing a problem from occurring. It is an object of the present invention to provide a dielectric paste for a spacer layer of a laminated ceramic electronic component that can be used.
- Another object of the present invention is to provide a multilayer ceramic electronic component that can effectively prevent a failure from occurring in a multilayer ceramic electronic component and can form a spacer layer as desired. To provide a method for manufacturing a laminated unit for use.
- the present inventor has conducted intensive studies in order to achieve the object of the present invention, and as a result, using ethyl cellulose having an apparent weight average molecular weight of 110,000 and 190,000 as a binder.
- the group consisting of, isobutyl acetate, dihydrotapropyl methyl ether, terpyl methyl ether, ⁇ terpyl acetate, I dihydrocarbyl acetate, I menthyl acetate, I menthon, I perillyl acetate and I carbyl acetate
- a dielectric paste for a spacer layer is prepared using at least one solvent whose power is also selected, it is hoped that a dielectric paste having a viscosity suitable for printing can be prepared as much as possible.
- the paste of the dielectric paste can be dissolved in a solvent, and even if the dielectric paste is printed to form a spacer layer,
- the solvent contained in the paste does not dissolve the binder contained in the ceramic green sheet, so that the ceramic green sheet swells or partially dissolves, and the ceramic green sheet and the paste are dissolved.
- Voids may be formed at the interface with the spacer layer, or cracks may occur on the surface of the spacer layer. It has been found that wrinkles can be reliably prevented, and that voids can be effectively prevented from occurring in multilayer ceramic electronic components such as multilayer ceramic capacitors.
- the present invention is based on strong knowledge. Therefore, the object of the present invention is to provide, as a binder, ethyl cellulose having an apparent weight average molecular weight of 110,000 to 190,000, The strength of the group consisting of acetate, dihydropropyl methyl ether, terpyl methyl ether, ⁇ -propyl ester, I-dihydrocarbyl acetate, I-menthyl acetate, I-mentone, I-perylyl acetate and I-carbyl acetate is also selected. This is achieved by a dielectric paste comprising at least one solvent.
- the dielectric paste for the spacer layer is obtained by dissolving dielectric material (ceramic powder) and an apparent weight average molecular weight of 110,000 in a solvent, and 190,000 ethyl cellulose.
- the organic vehicle is prepared by kneading.
- the dielectric material is appropriately selected from various compounds to be complex oxides or oxides, for example, carbonates, nitrates, hydroxides, organometallic compounds, etc., and can be used by mixing them.
- a dielectric material powder having the same composition as the dielectric material powder contained in the ceramic green sheet described later is used.
- the dielectric material is usually used as a powder having an average particle size of about 0.1 ⁇ m to about 3.0 ⁇ m.
- the dielectric paste preferably contains, as a binder, an apparent weight average molecular weight of 1150,000! / And 180,000 ethyl cellulose! /.
- the apparent weight average molecular weight of ethyl cellulose contained as a binder in the dielectric paste can be determined by mixing two or more types of ethyl cellulose having different weight average molecular weights. Adjusting the weight average molecular weight to 110,000 or 190,000, or using ethyl cellulose with a weight average molecular weight of 110,000 to 190,000, the weight average molecular weight of ethyl cellulose is 110,000. And then 1
- the apparent weight average molecular weight of ethyl cellulose by mixing two or more types of ethyl cellulose having different weight average molecular weights, for example, ethyl cellulose having a weight average molecular weight of 750,000 and weight Ethyl cellulose having an average molecular weight of 130,000 is mixed, or ethyl cellulose having a weight average molecular weight of 130,000 is mixed with ethyl cellulose having a weight average molecular weight of 230,000. It can be adjusted so that the apparent weight average molecular weight of ethyl cellulose is between 130,000 and 190,000.
- the dielectric paste for the spacer layer is preferably about 4 to about 15 parts by weight, particularly preferably about 4 to about 10 parts by weight, based on 100 parts by weight of the dielectric raw material powder.
- ethyl cellulose preferably about 40 parts by weight to about 250 parts by weight, more preferably about 60 parts by weight to about 140 parts by weight, particularly preferably about 70 parts by weight to about 120 parts by weight of a solvent. Including.
- the dielectric paste for the spacer layer may contain a plasticizer and a release agent as optional components in addition to the powder of the dielectric raw material and ethyl cellulose.
- the plasticizer contained in the dielectric paste for the spacer layer is not particularly limited, and examples thereof include phthalic acid esters, adipic acid, phosphoric acid esters, and glycols.
- the plasticizer contained in the dielectric paste for the spacer layer may or may not be the same as the plasticizer contained in the ceramic green sheet described later.
- the dielectric paste for the spacer layer is used in an amount of about 0 to about 200 parts by weight, preferably about 10 to about 100 parts by weight, and more preferably about 100 parts by weight of ethyl cellulose. It contains about 20 parts by weight to about 70 parts by weight of a plasticizer.
- the release agent contained in the dielectric paste for the spacer layer is not particularly limited, and examples thereof include paraffin, wax, and silicone oil.
- the dielectric paste for the spacer layer is used in an amount of about 0 to about 100 parts by weight, preferably about 2 to about 50 parts by weight, more preferably about 5 to 100 parts by weight, based on 100 parts by weight of ethyl cellulose. Part by weight No! Contains about 20 parts by weight of release agent.
- the object of the present invention is also to provide, as a binder, an ethyl cellulose having an apparent weight average molecular weight of 110,000 to 190,000 on a ceramic darline sheet containing a petyral-based resin, and isobutyl acetate, dihydrota A group consisting of 1-propyl methyl ether, tert-propyl methyl ether, ⁇ -terpyl acetate, I-dihydrocarbyl acetate, I-menthyl acetate, I-mentone, I perillyl acetate and I-carbyl acetate
- a multilayer ceramic electronic component characterized by forming a spacer layer by printing a dielectric paste containing a kind of solvent with a predetermined pattern. This is achieved by the method for manufacturing a laminate unit of (1).
- a dielectric paste having a viscosity suitable for printing can be prepared, and as a binder, it is possible to form a spacer layer as desired. Even when a dielectric paste is printed on a very thin ceramic green sheet containing a base resin to form a spacer layer, it is still contained in the ceramic green sheet due to the solvent contained in the dielectric paste. Since the binder is not dissolved, the ceramic green sheet swells or partially dissolves to form a void at the interface between the ceramic green sheet and the spacer layer, or Since it is possible to reliably prevent cracks and wrinkles from occurring on the surface of the layer, voids can be formed in multilayer ceramic electronic components such as multilayer ceramic capacitors. It is possible to effectively prevent the occurrence.
- the dielectric paste contains, as a binder, an apparent weight average molecular weight of 1150,000! / And 180,000 ethyl cellulose! /. .
- the apparent weight average molecular weight of ethyl cellulose is determined by mixing two or more types of ethyl cellulose having different weight average molecular weights so that the apparent weight average molecular weight of ethyl cellulose is 1150,000.
- the weight-average molecular weight of ethyl cellulose is increased to 150,000 to 180,000 by adjusting the weight average molecular weight to 1180 to 180,000, or by using ethyl cellulose having a weight-average molecular weight of 1150 to 180,000. May be adjusted so that
- the degree of polymerization of butyral-based resin contained in the ceramic green sheet as the binder is preferably 1000 or more.
- the butyral resin preferably has a butyralization degree of 64 mol% or more and 78 mol% or less as a binder.
- the weight is further reduced on the ceramic green sheet.
- X is chosen to be X * MW + (1—X) * MW power of 50,000 to 250,000. )
- the electrode layer is formed by printing with a pattern complementary to the pattern of the semiconductor layer.
- a conductive paste was printed on a ceramic green sheet using the petilal-based resin as a binder, and when the electrode layer was formed, the solvent contained in the conductor paste was used.
- an electrode layer is formed.
- the dielectric paste used for this purpose is Echinoresenorelose with a weight average molecular weight of MW. Echinoresenore of weight-average molecular weight MW
- X are chosen so that X * MW + (1—X) * MW power is between 50,000 and 250,000.
- the conductive paste containing at least one solvent having a certain group strength is selected, it has a viscosity suitable for printing. Therefore, the conductive paste is formed on the ceramic green sheet in a pattern complementary to the spacer layer pattern. The paste can be printed to form the electrode layer as desired.
- a conductive paste for an electrode layer is printed on an extremely thin ceramic green sheet to form an electrode layer, and a dielectric paste for a spacer layer is printed to form a spacer layer.
- the solvent in the conductor paste for the electrode layer and the solvent force in the dielectric paste for the spacer layer dissolve or swell the binder component of the ceramic green sheet.
- the electrode layer and the spacer layer are separated from each other by a separate supporting sheet. It has been found from the studies of the present inventors that it is desirable to form the adhesive layer on the surface of the ceramic green sheet via an adhesive layer after drying on the electrode layer.
- the same binder as the ceramic green sheet is provided on the surface of the support sheet so that the support sheet can be easily separated from the electrode layer and the spacer layer.
- a release layer containing a conductive layer print a conductive paste on the release layer, form an electrode layer, and print a dielectric paste to form a spacer layer.
- the release layer contains petital resin as a binder, When the body paste contains turbineol as a solvent, the binder layer contained in the release layer is dissolved by the solvent contained in the dielectric paste, and the release layer swells or partially dissolves.
- Voids may form at the interface between the spacer layer and the spacer layer, or There has been a problem that cracks and wrinkles are generated on the surface, and voids are generated in the multilayer ceramic capacitor manufactured by stacking and firing the multilayer units. Furthermore, if cracks or wrinkles occur on the surface of the spacer layer, the cracks or wrinkles are likely to be lost, so in the process of laminating the laminate units and manufacturing the laminate, it is mixed as a foreign substance into the laminate, The problem is that voids occur in the portions where the spacer layer is missing, causing internal defects in ceramic capacitors.
- the dielectric paste for the spacer layer contains, as a binder, ethyl cellulose having an apparent weight average molecular weight of 110,000 to 190,000, and isovo-norea acetate.
- At least one solvent such as isobutyl acetate, dihydropropyl methyl ether, terpyl methyl ether, ⁇ -propyl acetate, I-dihydrocarbyl acetate, I-menthyl acetate, I-menthone.
- I perillyl acetate and I carbyl acetate Since almost no pettyral resin contained as a binder is dissolved in the ceramic green sheet, a release layer containing the same binder as the ceramic green sheet is formed, and a dielectric paste is printed on the release layer. Also when forming the spacer layer, the release layer swells or partially dissolves to form voids at the interface between the release layer and the spacer layer, or the surface of the spacer layer. Cracks and wrinkles can be effectively prevented, and failures of multilayer ceramic electronic components such as multilayer ceramic capacitors can be effectively prevented.
- the present invention it is possible to effectively prevent a failure in a multilayer ceramic electronic component that does not dissolve a binder contained in a layer adjacent to a spacer layer of the multilayer ceramic electronic component. It is possible to provide a dielectric paste having excellent printability.
- a dielectric paste for a ceramic green sheet containing a butyral-based resin as a binder is prepared, and a paste such as an etastrusion coater or a wire bar coater is prepared. It is applied on a long support sheet to form a coating film.
- a dielectric paste for forming a ceramic green sheet is usually prepared by kneading a dielectric material (ceramic powder) and an organic vehicle obtained by dissolving a petyral resin in an organic solvent.
- the degree of polymerization of the butyral-based resin is preferably 1000 or more.
- the butyral degree of the butyral-based resin is preferably 64 mol% or more and 78 mol% or less.
- the organic solvent used for the organic vehicle is not particularly limited, and organic solvents such as butyl carbitol, acetone, toluene, and ethyl acetate are used.
- the dielectric material is appropriately selected from various compounds to be a composite oxide or an oxide, for example, a carbonate, a nitrate, a hydroxide, an organometallic compound, and the like, and can be used by mixing them.
- the dielectric material is usually used as a powder having an average particle size of about 0.:m to about 3.O / zm.
- the particle size of the dielectric material is smaller than the thickness of the ceramic green sheet.
- the content of each component in the dielectric paste is not particularly limited.For example, about 2.5 parts by weight to about 10 parts by weight of a petial-based resin and 100 parts by weight of a dielectric material,
- the dielectric paste can be prepared to contain from 50 parts by weight to about 300 parts by weight of the solvent.
- the dielectric paste may contain additives such as various dispersants, plasticizers, charging aids, release agents, and wetting agents, if necessary.
- additives such as various dispersants, plasticizers, charging aids, release agents, and wetting agents.
- the total content is desirably less than about 20% by weight.
- the support sheet to which the dielectric paste is applied for example, polyethylene terephthalate film or the like is used. It can be coated with rubid resin or the like.
- the coating film is dried at a temperature of, for example, about 50 ° C to about 100 ° C for about 1 minute to about 20 minutes to form a ceramic green sheet on the support sheet. .
- the thickness of the ceramic green sheet after drying is preferably 3 ⁇ m or less, more preferably 1.5 m or less.
- a conductive paste for an electrode layer is printed in a predetermined pattern on a ceramic green sheet formed on the surface of the long support sheet using a screen printing machine or a gravure printing machine. And dried to form an electrode layer.
- the electrode layer is preferably formed to a thickness of about 0.1 m! And about 5 m, more preferably about 0.1 111 to about 1. is there.
- the conductive paste for the electrode layer is a conductive material made of various conductive metals and alloys, and various oxides, organometallic compounds, or resinates that become conductive materials made of various conductive metals and alloys after firing. And an organic vehicle in which ethyl cellulose is dissolved in a solvent.
- the conductive paste is an ethylcell port having a weight average molecular weight of MW.
- Binder (where MW, MW and X are X * MW + (1 X) * MW
- I will be chosen to be 250,000.
- isoboryl acetate, dihydroterpylmethyl enoate ether, terpinyl methyl ether, ⁇ -terpinyl acetate, I-dihydrocarbyl acetate, I-menthyl acetate, I-menthon, I-perillyl acetate and I-force rubil The group strength of acetate also contains at least one selected solvent.
- etinoresenorelose having a weight average molecular weight of MW
- echinoresenorelose having a weight average molecular weight of MW
- X are chosen so that X * MW + (1—X) * MW power is between 50,000 and 250,000.
- the conductive paste containing at least one kind of solvent which is also selected for its group strength, has a viscosity suitable for printing, it can be applied on a ceramic Darline sheet as desired using a screen printing machine or gravure printing machine.
- the electrode layer can be formed in a predetermined pattern.
- the conductive material used for producing the conductive paste Ni, a Ni alloy or a mixture thereof is preferably used.
- the shape of the conductive material is not particularly limited, and it may be spherical, scaly, or a mixture of these shapes.
- the average particle size of the conductive material is not particularly limited, but is usually about 0.1 ⁇ m, about 2 ⁇ m, and preferably about 0.2 ⁇ m. About 1 ⁇ m for conductive materials!
- the conductor paste preferably contains about 2.5 parts by weight V and about 20 parts by weight binder per 100 parts by weight of the conductor material.
- the content of the solvent is preferably from about 40% by weight to about 60% by weight based on the whole conductive paste.
- the conductor paste preferably contains a plasticizer.
- the plasticizer contained in the conductor paste is not particularly limited, and examples thereof include phthalate, adipic acid, phosphate, and glycols.
- the conductor paste preferably contains about 10 parts by weight to about 300 parts by weight, more preferably about 10 parts by weight to about 200 parts by weight, based on 100 parts by weight of the binder. Yes. If the amount of the plasticizer is too large, the strength of the electrode layer tends to be significantly reduced, which is not preferable.
- the conductor paste may optionally contain additives selected from various dispersants, subcomponent compounds, and the like.
- the binder prior to the formation of the electrode layer, or after the formation of the electrode layer and drying, contains ethyl cellulose having an apparent weight average molecular weight of 110,000 to 190,000 as a binder.
- ethyl cellulose having an apparent weight average molecular weight of 110,000 to 190,000 as a binder.
- the dielectric paste for the spacer layer containing at least one selected solvent is applied to the surface of the ceramic green sheet in a pattern complementary to the pattern of the electrode layer using a screen printing machine or gravure printing machine. And printed to form a spacer layer.
- the spacer layer on the surface of the ceramic green sheet with a pattern complementary to the pattern of the electrode layer, the surface of the electrode layer and the ceramic on which the electrode layer is not formed are formed.
- a step can be prevented from being formed between the surface of the green sheet and a multi-layered unit including a ceramic green sheet and an electrode layer. Deformation of the laminated electronic component can be effectively prevented, and delamination can be effectively prevented.
- the ceramic green sheet swells or partially dissolves due to the contained solvent, causing voids at the interface between the ceramic green sheet and the spacer layer, or cracks and wrinkles on the surface of the spacer layer. Is reliably prevented from occurring.
- ethyl acetate having an apparent weight average molecular weight of 110,000 to 190,000 is used. It contains lulose, isobutyl acetate, dihydropropyl methyl ether, terpyl methyl ether, ⁇ -terpyl acetate, I-dihydrocarbyl acetate, I-menthyl acetate, I-menthone, I-perillyl acetate and I-calcium Since the dielectric paste for the spacer layer containing at least one solvent selected from the group power of building acetate has a viscosity suitable for printing, a screen printing machine or a gravure printing machine is used. As a result, the spacer layer can be formed on the ceramic green sheet in a pattern complementary to the pattern of the electrode layer as desired.
- the dielectric paste contains, as a binder, an ethyl cellulose having an apparent weight average molecular weight of 1150,000 and 180,000.
- the dielectric paste for the spacer layer is prepared in the same manner as the dielectric paste for the ceramic green sheet, except that a different binder and a different solvent are used.
- the electrode layer or the electrode layer and the spacer layer are dried to form a laminate unit in which the ceramic green sheet and the electrode layer or the electrode layer and the spacer layer are laminated on the support sheet. Is done.
- the support sheet is peeled from the ceramic Darline sheet of the multilayer unit, cut into a predetermined size, and a predetermined number of the multilayer units are stacked on the outer layer of the multilayer ceramic capacitor. And the other outer layer is further laminated on the laminated body cut, and the obtained laminated body is pressed and cut into a predetermined size to produce a large number of ceramic green chips. Is done.
- the ceramic green chip thus manufactured is placed in a reducing gas atmosphere, the binder is removed, and the chip is fired.
- the spacer layer is formed on the ceramic green sheet in a pattern complementary to the pattern of the electrode layer, the surface of the electrode layer and the electrode layer are not formed. It is possible to prevent a step from being formed between the ceramic green sheet and the surface of the ceramic green sheet. Stacking unit units to effectively prevent the deformation of the manufactured multilayer electronic components such as multilayer ceramic capacitors, and to effectively prevent the occurrence of delamination. Becomes possible.
- ethyl cellulose having a weight average molecular weight of 110,000 to 190,000 is contained, and isobol acetate, At least one selected from the group consisting of dihydropropyl methyl ether, terpyl methyl ether, terpyl acetate, I-dihydrocarbyl acetate, I-menthyl acetate, I-menton, I-perylyl acetate and I-carbyl acetate It is designed to form a spacer layer by printing a dielectric paste containing a kind of solvent in a pattern complementary to the pattern of the electrode layer, and is composed of isoborinoleate acetate, dihydrotapinyl methyl ether , Terpinyl methyl ether, a ⁇ terpyl acetate, I dihydro Solvents selected from
- the sheet is reliably prevented from swelling or partially dissolving to form voids at the interface between the ceramic green sheet and the spacer layer, or cracks and wrinkles on the surface of the spacer layer. Can be stopped, thus the ceramic green sheet and the electrode
- the ceramic green sheet and the electrode By stacking a large number of multilayer units including the above, it is possible to reliably prevent voids from being generated in the manufactured multilayer ceramic capacitor, and to form cracks and wrinkles generated on the surface of the spacer layer. It is possible to reliably prevent a part from being lost and mixed as a foreign substance into the laminated body in the process of manufacturing the laminated body by laminating the laminated body units and causing internal defects in the laminated ceramic capacitor. Become.
- ethinoresenorelose having a weight average molecular weight of MW and a weight average molecular weight M
- An electrode layer is formed by printing a conductive paste containing at least one solvent selected from the group consisting of at least one solvent, in a predetermined pattern, to form an electrode layer.Isobornyl acetate, dihydropropyl methyl ether, A solvent selected from the group consisting of terpyl methyl ether, terpyl acetate, I-hydrocarbyl acetate, I-menthyl acetate, I-mentone, I-perillyl acetate and I-carbyl acetate is selected as a binder for the ceramic green sheet.
- Petitiral system included ⁇ Because it hardly dissolves the resin, it is extremely thin! ⁇ Even when printing the conductive paste on the ceramic green sheet to form the electrode layer, the solvent contained in the conductive paste In addition, the binder contained in the ceramic green sheet is dissolved, and the swelling or partial dissolution of the ceramic green sheet can be effectively prevented, so that the thickness of the ceramic green sheet is extremely small. Even when the ceramic green sheet is thin, it effectively prevents pinholes and cracks from being generated in the ceramic green sheet, and effectively prevents short-circuiting from occurring in the manufactured multilayer ceramic capacitor by stacking multilayer units. Can be prevented.
- a second support sheet different from the long support sheet used to form the ceramic green sheet is provided, and
- the same binder as the ceramic green sheet contains particles of a dielectric material having substantially the same composition as the dielectric material contained in the ceramic green sheet on the surface of the second support sheet. Is applied and dried using a wire bar coater or the like to form a release layer.
- the second support sheet for example, a polyethylene terephthalate film or the like is used, and silicon resin, alkyd resin, or the like is coated on the surface to improve the releasability! / , You can.
- the thickness of the release layer is preferably not more than the thickness of the electrode layer, preferably not more than about 60% of the thickness of the electrode layer, and more preferably not more than about 30% of the thickness of the electrode layer. It is as follows. After the release layer is dried, the conductive paste for the electrode layer prepared in the same manner as described above is coated on the surface of the release layer by using a screen printing machine, a gravure printing machine, or the like. It is printed in a predetermined pattern and dried to form an electrode layer.
- the electrode layer is preferably formed to a thickness of about 0.1 m! And about 5 Pm, more preferably about 0.1 111 to about 1. is there.
- the conductive paste is an ethylcell port having a weight average molecular weight of MW.
- Binder (where MW, MW and X are X * MW + (1X) * MW
- I will be chosen to be 250,000.
- isoboryl acetate, dihydroterpylmethyl enoate ether, terpinyl methyl ether, ⁇ -terpinyl acetate, I-dihydrocarbyl acetate, I-menthyl acetate, I-menthon, I-perillyl acetate and I-force rubil The group strength of acetate also contains at least one selected solvent.
- X are chosen so that X * MW + (1—X) * MW power is between 50,000 and 250,000.
- the conductive paste containing at least one solvent which is also selected for its group strength, has a viscosity suitable for printing, the conductive paste is screened or gravure printed using a ceramic paste as desired. It is possible to form an electrode layer in a predetermined pattern on the electrode sheet.
- the binder prior to the formation of the electrode layer, or after the formation of the electrode layer and after drying, contains ethyl cellulose having an apparent weight average molecular weight of 110,000 to 190,000, -Aluate, dihydrotapropyl methyl ether, terpyl methyl ether, tert-propyl acetate, I-dihydrocarbyl acetate, I-menthyl acetate, I-mentone, I-perillyl acetate and I-carbyl acetate
- the prepared dielectric paste for the spacer layer is screen-printed on the surface of the release layer in a pattern complementary to the pattern of the electrode layer.
- a spacer layer is formed by printing using a printing machine or a gravure printing machine.
- the spacer layer on the surface of the release layer in a pattern complementary to the pattern of the electrode layer, the surface of the electrode layer and the release layer on which the electrode layer is not formed are formed. Steps can be prevented from forming between the surface and the surface.Each of them can be a multilayer ceramic capacitor or the like manufactured by laminating a number of multilayer units including a ceramic Darline sheet and an electrode layer. Deformation of the laminated electronic component can be effectively prevented, and delamination can be effectively prevented.
- the release layer when forming a spacer layer by printing a dielectric paste on the release layer, the release layer swells or partially dissolves, and an interface between the release layer and the spacer layer is formed. It is possible to effectively prevent the formation of voids in the surface or the formation of cracks and wrinkles on the surface of the spacer layer.
- the binder contains ethyl cellulose having an apparent weight average molecular weight of 110,000 to 190,000, isobutyl acetate, dihydrota-propyl methyl ether, terpyl methyl ether, ⁇ -terpyl acetate, I dihydrocarbyl acetate, I-men
- a dielectric paste containing at least one solvent selected from the group consisting of tilacetate, I-mentone, I-perilyl acetate and I-carbyl acetate has a viscosity suitable for printing. Using a printing machine or the like, it is possible to form the spacer layer on the release layer in a pattern complementary to the pattern of the electrode layer as desired.
- a long third support sheet is prepared, and an adhesive solution is applied to the surface of the third support sheet by a bar coater, an extrusion coater, a reverse coater, a dip coater, a kiss coater, or the like. After drying, an adhesive layer is formed.
- the adhesive solution is substantially similar to the binder similar to the binder included in the dielectric base for forming the ceramic green sheet, and the particles of the dielectric material included in the ceramic green sheet. And a particle of a dielectric material having a particle size equal to or less than the thickness of the adhesive layer, a plasticizer, an antistatic agent, and a release agent.
- the adhesive layer is preferably formed to a thickness of about 0.3 m or less, more preferably from about 0.02 m to about 0.3 m, and even more preferably about 0.02 m. It is formed to have a thickness of about 0.2 m.
- the adhesive layer formed on the long third support sheet is formed by the electrode layer or the electrode layer and the spacer layer formed on the long second support sheet or the support layer.
- the third support sheet is adhered to the surface of the ceramic green sheet formed on the sheet, and after the adhesion, the third support sheet is peeled off from the adhesive layer, and the adhesive layer is transferred.
- the ceramic green sheet formed on the surface of the long support sheet adheres to the surface of the adhesive layer.
- the first support sheet is peeled off from the ceramic green sheet, the ceramic green sheet is transferred to the surface of the adhesive layer, and the ceramic green sheet and a laminate including the electrode layer or the electrode layer and the spacer layer A unit is created.
- the adhesive layer was transferred to the surface of the ceramic green sheet of the laminate unit thus obtained, to the surface of the electrode layer or the electrode layer and the spacer layer in the same manner as the adhesive layer was transferred.
- the laminate unit having the adhesive layer transferred to the surface thereof is cut into a predetermined size. [0074] Similarly, a predetermined number of laminate units to which the adhesive layer has been transferred are produced on the surface thereof, and a prescribed number of laminate units are laminated to produce a laminate block.
- a laminate unit is placed on a support formed of polyethylene terephthalate or the like so that the adhesive layer transferred to the surface of the laminate unit is in contact with the support. After being positioned and pressed by a press or the like, the laminate unit is adhered to the support through an adhesive layer.
- the second support sheet is peeled off from the release layer, and the laminate unit is laminated on the support.
- a new laminate unit is positioned such that the adhesive layer formed on the surface thereof comes into contact with the surface of the release layer of the laminate unit laminated on the support.
- a new laminate unit is laminated via an adhesive layer on the release layer of the laminate unit laminated on the support under pressure, and then the second laminate unit is removed from the release layer of the new laminate unit.
- the second support sheet is peeled off.
- the adhesive layer is transferred to the surface of the ceramic green sheet
- the adhesive layer is bonded to the surface of the electrode layer or the electrode layer and the spacer layer formed on the second support sheet.
- the second support sheet is peeled from the release layer, and the electrode layer or the electrode layer and the spacer layer and the release layer are transferred to the surface of the adhesive layer, and the ceramic Darline sheet and the electrode layer and the spacer are transferred.
- a laminate unit including the layers is created.
- the adhesive layer is transferred to the surface of the release layer of the laminate unit thus obtained in the same manner as the adhesive layer is transferred to the surface of the ceramic green sheet, and the adhesive layer is transferred to the surface thereof.
- the laminated unit thus cut is cut into a predetermined size.
- a predetermined number of laminated units to which the adhesive layer has been transferred are produced on the surface thereof, and a prescribed number of laminated units are laminated to produce a laminated block.
- the laminate unit In manufacturing a laminate block, first, the laminate unit is placed on a support formed of polyethylene terephthalate or the like so that the adhesive layer transferred to the surface of the laminate unit is in contact with the support. It is positioned, pressurized by a press, etc., The laminate unit is adhered to the support via the adhesive layer.
- the support sheet is peeled off from the ceramic green sheet, and the laminate unit is laminated on the support.
- a new laminate unit is positioned such that the adhesive layer formed on the surface thereof is in contact with the surface of the ceramic green sheet of the laminate unit laminated on the support.
- a new laminate unit is laminated via an adhesive layer on the ceramic green sheet of the laminate unit that is pressed and laminated on the support, and then the support sheet is formed from the ceramic of the new laminate unit. Is peeled off.
- the laminate block including the predetermined number of laminate units thus produced was laminated on the outer layer of the multilayer ceramic capacitor, and the other outer layer was further laminated on the laminate block.
- the laminate is pressed and cut into a predetermined size to produce a number of ceramic green chips.
- the ceramic green chip thus produced is placed in a reducing gas atmosphere, the binder is removed, and the chip is fired.
- the electrode layer and the spacer layer formed on the second support sheet are dried, they are configured to adhere to the surface of the ceramic green sheet via the adhesive layer. Therefore, the conductor paste is printed on the surface of the ceramic green sheet to form the electrode layer, the dielectric paste is printed, and the conductor paste or dielectric layer is formed as in the case of forming the spacer layer.
- the body paste does not soak into the ceramic green sheet.
- the electrode layer and the dielectric paste can be formed on the surface of the ceramic green sheet as desired.
- the binder includes ethyl cellulose having an apparent weight average molecular weight of 110,000 to 190,000, isobonyl acetate, dihydrota-propylmethyl ether, terpyrmethyl.
- Ether, ⁇ -terpyl acetate, I-dihydrocarb A group consisting of luacetate, I-menthyl acetate, I-menthon, I-perillyl acetate and I-carbyl acetate
- a spacer layer is formed using a dielectric paste containing at least one solvent selected from the group consisting of isobutyl acetate.
- ethyl cellulose having a weight average molecular weight of MW
- a binder containing ethyl cellulose having an average molecular weight of MW in a weight ratio of X: (1—X) (here,
- MW, MW and X are X * MW + (1—X) * MW Power 15,000 to 250,000
- An electrode layer is formed using a conductor paste, and isobonylacetate, dihydrotapropyl methyl ether, terpyl methyl ether, ⁇ terpyl acetate, I dihydrocarbyl acetate, I-menthyl acetate, I Solvent, which is also selected from the group consisting of menthol, I perillyl acetate and I carbyl acetate, contains the same binder as the ceramic green sheet because it hardly dissolves the butyral resin contained in the ceramic green sheet.
- the release layer When a release layer is formed and a conductive paste is printed on the release layer to form an electrode layer, the release layer swells or partially dissolves, resulting in pinholes or cracks in the release layer. Is effectively prevented from occurring, and it is possible to effectively prevent the multilayer ceramic capacitor from causing a problem.
- the peel strength or the peel strength between the peel layer and the electrode layer and the spacer layer is increased by the swelling or partial dissolution of the peel layer. It becomes possible to effectively prevent the peel strength between the two support sheets from changing and causing a problem when the laminate unit is produced.
- the adhesive layer when the adhesive layer is transferred to the surface of the electrode layer or the electrode layer and the spacer layer, the adhesive layer is peeled off on the long second support sheet.
- Layer, electrode layer or electrode layer and spacer layer, adhesive layer, and ceramic green sheet are laminated, and the adhesive layer is transferred to the surface of the ceramic green sheet of the formed laminate unit.
- the adhesive layer formed on the third support sheet is transferred onto the ceramic green sheet located on the surface of the two laminate units, and further transferred onto the long support sheet on the adhesive layer.
- the ceramic green sheet, the adhesive layer, the electrode layer or the electrode layer, the spacer layer, and the release layer are laminated on each other, the release layer of the formed laminate unit is bonded, and the support sheet is released from the ceramic green sheet.
- a laminated sheet set in which a predetermined number of laminated units are laminated is produced, and a third surface of the ceramic line sheet located on the surface of the laminated unit set is further provided with a third sheet. After the adhesive layer formed on the support sheet is transferred, the laminate is cut into a predetermined size to produce a laminate block.
- the adhesive layer is transferred to the surface of the ceramic green sheet, the ceramic green sheet, the adhesive layer, the electrode layer, or the electrode layer and the metal sheet are formed on the long support sheet.
- the adhesive layer is transferred to the surface of the release layer of the laminated unit formed by laminating the adhesive layer and the release layer.
- a release layer, an electrode layer or an electrode layer and a spacer layer, an adhesive layer, and a ceramic green sheet are laminated on the second support sheet, and the ceramic green sheets of the formed laminate unit are adhered to each other, and the release layer is formed. Then, the second support sheet is peeled off, and the two laminate units are stacked on the long support sheet.
- the adhesive layer formed on the third support sheet is transferred onto the release layer located on the surface of the two laminate units, and further, the long second support sheet is further transferred to the adhesive layer.
- the release layer, the electrode layer or the electrode layer and the spacer layer, the adhesive layer, and the ceramic Darline sheet are laminated on the sheet, and the ceramic green sheet of the formed laminate unit is bonded, and the second support from the release layer is formed. The sheet is peeled.
- a laminated unit set in which a predetermined number of laminated units are laminated is produced, and further, a third layer is provided on the surface of the release layer located on the surface of the laminated unit set. After the transfer of the adhesive layer formed on the support sheet, the adhesive sheet is cut into a predetermined size to produce a laminate block.
- a multilayer ceramic capacitor is manufactured in the same manner as in the above embodiment.
- a laminate unit set including a predetermined number of laminate units is produced by sequentially laminating the laminate units on the long second support sheet or the support sheet. After that, the laminate unit set is cut to a prescribed size to create a laminate block, so the laminate units cut to the prescribed size are laminated one by one and laminated. Compared with the case of manufacturing a block, it is possible to greatly improve the manufacturing efficiency of the laminate block.
- the adhesive layer when the adhesive layer is transferred to the surface of the electrode layer or the electrode layer and the spacer layer, the adhesive layer is formed on the long second support sheet.
- a release layer, an electrode layer or an electrode layer and a spacer layer, an adhesive layer, and a ceramic green sheet are laminated, and the adhesive layer is transferred onto the surface of the ceramic green sheet of the formed laminate unit.
- a second support sheet is applied to the adhesive layer to prevent the unit from being cut.
- the electrode layer or the electrode layer and the spacer layer formed thereon are adhered to each other, the second support sheet is peeled off from the release layer, and the electrode layer or the electrode layer, the spacer layer and the release layer are bonded to the adhesive layer. Is transferred to the surface.
- the adhesive layer formed on the third support sheet is transferred to the surface of the release layer transferred to the surface of the adhesive layer, and the ceramic green sheet formed on the support sheet is attached to the adhesive layer.
- the support sheet is peeled off from the ceramic green sheet, and the ceramic Darline sheet is transferred to the surface of the adhesive layer.
- the adhesive layer formed on the third support sheet is transferred to the surface of the ceramic green sheet transferred to the surface of the adhesive layer, and the electrode layer formed on the second support sheet sheet is transferred.
- the electrode layer and the spacer layer are adhered to the adhesive layer, the second support sheet is peeled from the release layer, and the electrode layer or the electrode layer, the spacer layer, and the release layer are transferred to the surface of the adhesive layer. Is done.
- a laminated body set set in which a predetermined number of laminated body units are laminated is produced, and further, an adhesive layer is formed on the surface of the ceramic dale sheet positioned on the surface of the laminated body unit set. After being transferred, the laminate is cut into a predetermined size to produce a laminate block.
- the adhesive layer is transferred to the surface of the ceramic green sheet
- the ceramic green sheet, the adhesive layer, the electrode layer or the electrode layer and the spacer layer and the ceramic green sheet are placed on the long support sheet.
- the release layer is laminated and the adhesive layer is transferred to the surface of the release layer of the formed laminate unit
- the ceramic layer formed on the support sheet is formed on the adhesive layer that is not cut by the laminate unit.
- the green sheet is adhered, the support sheet is separated from the ceramic green sheet, and the ceramic green sheet is transferred to the surface of the adhesive layer.
- the adhesive layer formed on the third support sheet is transferred to the surface of the ceramic green sheet transferred to the surface of the adhesive layer, and the electrode layer or the electrode formed on the second support sheet is transferred.
- the layer and the spacer layer are adhered to the adhesive layer, the second support sheet is peeled from the release layer, and the electrode layer or the electrode layer and the spacer layer and the release layer are transferred to the surface of the adhesive layer.
- the surface of the release layer transferred to the surface of the adhesive layer was formed on the third support sheet.
- the adhered adhesive layer is transferred and the ceramic green sheet formed on the support sheet sheet is adhered to the adhesive layer, the support sheet is peeled off from the ceramic green sheet, and the ceramic green sheet is transferred to the surface of the adhesive layer. Is done.
- a laminated unit set in which a predetermined number of laminated units are laminated is produced, and further, an adhesive layer is formed on the surface of the release layer located on the surface of the laminated unit set. After the transfer, the laminate is cut into a predetermined size to produce a laminate block.
- a multilayer ceramic capacitor is manufactured using the multilayer block manufactured in the same manner as in the above embodiment.
- the transfer of the adhesive layer, the electrode layer or the electrode layer, and the spacer are formed on the surface of the long second support sheet or the laminate unit formed on the support sheet.
- the laminate units are successively laminated to produce a laminate unit set including a predetermined number of laminate units, and thereafter, Since the laminate unit set is cut into a predetermined size to form a laminate block, the laminate cuts cut into a predetermined size are laminated one by one to form a laminate block. It is possible to greatly improve the manufacturing efficiency of the laminated body block as compared with the case of manufacturing a laminated body.
- the median diameter of the crushed additive was 0.1 ⁇ m.
- polybutyral polymerization degree: 1450, butyralization degree: 69 mol%
- C dissolve in 42.5 parts by weight of ethyl alcohol and 42.5 parts by weight of propyl alcohol to prepare a 15% solution of an organic vehicle, and further add 500 cc of a slurry having the following composition.
- Mixing was performed for 20 hours using a polyethylene container to prepare a dielectric paste.
- the polyethylene container is filled with 330.lg of slurry and 900 g of ZrO beads (diameter 2 mm), and the polyethylene container is rotated at a peripheral speed of 45 mZ.
- BaTiO powder manufactured by Sakai-Danigaku Kogyo Co., Ltd .: trade name "BT-02": particle size 0.2 ⁇
- Polyethylene glycol dispersant 2.36 weight%
- the obtained dielectric paste was applied on a polyethylene terephthalate film at a coating speed of 50 mZ using a die coater to form a coating film, which was obtained in a drying oven maintained at 80 ° C.
- the coated film was dried to form a ceramic green sheet having a thickness of 1 ⁇ m.
- a slurry is prepared by mixing 3 parts by weight of isobonyl acetate and 1.5 parts by weight of a polyethylene glycol-based dispersing agent, and using a crusher “LMZ0.6” (trade name) manufactured by Ashiza Finetech Co., Ltd. The additives in the slurry were ground.
- the median diameter of the pulverized additive was 0.1 l / z m.
- BaTiO powder manufactured by Sakai Chemical Industry Co., Ltd .: particle size 0.05 m
- Polyethylene glycol dispersant 1.00 parts by weight Dioctyl phthalate (plasticizer) 2.61 parts by weight
- a slurry is prepared by mixing 3 parts by weight of isobonyl acetate and 1.5 parts by weight of a polyethylene glycol-based dispersing agent, and using a crusher “LMZ0.6” (trade name) manufactured by Ashiza Finetech Co., Ltd. The additives in the slurry were ground. [0132] To grind the admixture in the slurry, ZrO beads (0.1 mm in diameter) were used.
- the median diameter of the pulverized additive was 0.1 ⁇ m.
- Ethyl cellulose (8 parts by weight) was dissolved in 92 parts by weight of isobutyl acetate at 70 ° C. to prepare an 8% solution of an organic vehicle, and a slurry having the following composition was further added to a ball mill. For 16 hours. Dispersion conditions were ZrO (diameter 2.Omm
- Nickel powder manufactured by Kawatetsu Kogyo Co., Ltd. particle size: 0.2 ⁇ 100 parts by weight
- BaTiO powder manufactured by Sakai Chemical Industry Co., Ltd .: particle size 0.05 m
- Polyethylene glycol dispersant 1.19 parts by weight
- the conductive paste prepared as described above was printed on a ceramic green sheet in a pattern complementary to the spacer layer pattern using a screen printer, and at 90 ° C, After drying for 5 minutes, an electrode layer having a thickness of 1 m was formed, and a laminate unit in which a ceramic green sheet, an electrode layer, and a spacer layer were laminated on the surface of a polyethylene terephthalate film was produced.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- the prepared dielectric paste for ceramic green sheets is applied to the surface of a polyethylene terephthalate film using a die coater to form a coating, and the coating is dried to a thickness of 10 m. Was formed.
- the thus-produced ceramic green sheet having a thickness of 10 ⁇ m was peeled off by a polyethylene terephthalate film, cut, and the cut five ceramic green sheets were laminated to form a 50-m thick sheet.
- the laminate unit was further cut off with the polyethylene terephthalate film strength removed, and the cut 50 laminate units were laminated on the cover layer.
- the ceramic green sheet having a thickness of 10 ⁇ m was cut off by peeling the polyethylene terephthalate film force, and the cut five ceramic green sheets were placed on the laminated unit.
- a lower cover layer having a thickness of 50 ⁇ m, a ceramic green sheet having a thickness of 1 m, an electrode layer having a thickness of 1 ⁇ m, and a spacer having a thickness of 1 ⁇ m Create a laminate in which an effective layer with a thickness of 100 ⁇ m, in which 50 laminate units including layers are laminated, and an upper cover layer, with a thickness of 50 m, are laminated did.
- the laminate thus obtained was press-molded under a temperature condition of 70 ° C while applying a pressure of 100MPa, cut into a predetermined size by a die-sinker machine, and cut into ceramic green chips.
- a pressure of 100MPa 100 MPa
- Each of the ceramic green chips thus manufactured was treated in air under the following conditions to remove the binder.
- Heating rate 50 ° CZ time
- each of the ceramic green chips was treated and fired under the following conditions in an atmosphere of a mixed gas of nitrogen gas and hydrogen gas controlled at a dew point of 20 ° C.
- the contents of nitrogen gas and hydrogen gas in the mixed gas were 95% by volume and 5% by volume.
- Heating rate 300 ° CZ time
- Cooling rate 300 ° CZ time
- the fired ceramic green chips were each subjected to an annealing treatment under a nitrogen gas atmosphere controlled at a dew point of 20 ° C under the following conditions.
- Heating rate 300 ° CZ time
- Cooling rate 300 ° CZ time
- Each of the ceramic green chips subjected to the annealing treatment is embedded in a two-component curable epoxy resin so that the side surfaces thereof are exposed, and the two-component curable epoxy resin is embedded.
- a 3.2 mm X 1.6 mm shape sample was polished by 1.6 mm using sandpaper so that the central portion could be observed.
- a sandpaper of # 400, a sandpaper of # 800, a sandpaper of # 1000 and a sandpaper of # 2000 were used in this order.
- the polished surface was mirror-polished using a 1 ⁇ m diamond paste, and the polished surface of the ceramic green chip was magnified 400 times with an optical microscope to reduce voids. The presence or absence was observed.
- a dielectric paste was prepared in the same manner as in Example 1 except that ethyl cellulose having a weight average molecular weight of 130,000 was used as a binder for the dielectric paste for the spacer layer.
- the viscosity of the body paste 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheets using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- the electrode layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 3 Further, 30 anneal-treated ceramic green chips were produced in the same manner as in Example 1, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip. [0163] Example 3
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 130,000 and ethyl cellulose having a weight average molecular weight of 230,000 in a volume ratio of 75:25, that is, an apparent weight average molecular weight
- a dielectric paste was prepared in the same manner as in Example 1 except that 15,000 ethyl cellulose was used, and the viscosity of the thus prepared dielectric paste was changed to 25 ° C and a shear rate of 8 sec. - with measured at 1, 25 ° C, measured at pruning cross rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- Example 2 a conductive paste for an electrode was prepared and printed on a ceramic dalene sheet, and a laminate in which a ceramic green sheet, an electrode layer, and a spacer layer were laminated was prepared. A unit was made.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 1 Further, as in Example 1, 30 pieces of annealed ceramic green chips were manufactured, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 130,000 and ethyl cellulose having a weight average molecular weight of 230,000 in a volume ratio of 50:50, that is, an apparent weight average molecular weight
- a dielectric paste was prepared in the same manner as in Example 1, except that 180,000 ethyl cellulose was used.
- the viscosity of the dielectric paste thus prepared was 25 ° C., and the shear rate was 8 sec. In addition to the measurement at 1 , the measurement was performed at 25 ° C and a shear rate of 50 sec- 1 .
- the viscosity at a shear rate 8Sec- 1 is 19. 9 ps 's
- the viscosity at a shear rate 50sec- 1 10. 6Ps' was s.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- the electrode layer thus formed was magnified 400 times using a metal microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 1 Further, as in Example 1, 30 pieces of annealed ceramic green chips were produced, and the presence or absence of voids was observed in the same manner as in Example 1. A total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 750,000 and ethyl cellulose having a weight average molecular weight of 130,000 in a volume ratio of 50:50, that is, A dielectric paste was prepared in the same manner as in Example 1 except that ethyl cellulose having an apparent weight average molecular weight of 10.250,000 was used, and the viscosity of the thus prepared dielectric paste was 25%. ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- Ethyl with a weight average molecular weight of 130,000 is used as a binder for the dielectric paste for the spacer layer.
- Example 1 was repeated except that a binder containing cellulose and ethyl cellulose having a weight average molecular weight of 230,000 in a volume ratio of 25:75, that is, ethyl cellulose having an apparent weight average molecular weight of 250,000 was used.
- the viscosity of the prepared dielectric paste thus, 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at pruning cross rate 50Sec- 1 .
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer. Since the viscosity of the body paste was too high, the mesh of the screen plate was clogged, and it was impossible to form a continuous spacer layer.
- a dielectric paste was prepared in the same manner as in Example 1, except that ethyl cellulose having a weight average molecular weight of 230,000 was used as a binder for the dielectric paste for the spacer layer.
- the viscosity of the body paste 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer. Since the viscosity of the body paste was too high, the mesh of the screen plate was clogged, and it was impossible to form a continuous spacer layer.
- Example 1 As in Example 1, a ceramic green sheet was used as the binder of the dielectric paste for forming the ceramic green sheet, except that a plastic resin having a degree of polymerization of S800 and a degree of petitial Louis of 69 mol% was used. A dielectric paste for sheet formation was prepared to produce a ceramic green sheet.
- Example 4 the prepared dielectric paste was applied using a screen printing machine. In the same manner as in Example 1, printing was performed on the formed ceramic green sheet to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer.
- Example 2 a conductive paste for an electrode was prepared and printed on a ceramic dalene sheet, thereby forming a laminate in which a ceramic green sheet, an electrode layer, and a spacer layer were laminated. A unit was made.
- the electrode layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the electrode layer was observed. Cracks and wrinkles were observed on the surface of the electrode layer.
- a dielectric paste was prepared in the same manner as in Example 1 except that dihydropropyl methyl ether was used as a solvent when preparing a dielectric paste for the spacer layer, instead of isobutyl acetate. It was prepared and the viscosity of the prepared dielectric paste thus, 25 ° C, with measured by pruning cross rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet in the same manner as in Example 1 using a screen printer to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared in the same manner as in Example 1 except that dihydrotapinyl methyl ether was used instead of isobonyl acetate as a solvent for preparing the conductive paste.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 2 Further, as in Example 1, 30 pieces of annealed ceramic green chips were produced, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a dielectric paste was prepared in the same manner as in Example 5, except that ethyl cellulose having a weight average molecular weight of 130,000 was used as a binder for the dielectric paste for the spacer layer.
- the viscosity of the body paste 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- a conductive paste for an electrode was prepared in the same manner as in Example 1 except that dihydrotapinyl methyl ether was used instead of isobonyl acetate as a solvent for preparing the conductive paste.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 2 Further, as in Example 1, 30 pieces of annealed ceramic green chips were produced, and the presence or absence of voids was observed in the same manner as in Example 1. A total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a dielectric paste was prepared in the same manner as in Example 5, except that a binder, that is, ethyl cellulose having an apparent weight average molecular weight of 150,000 was used, and the viscosity of the thus prepared dielectric paste was adjusted.
- a binder that is, ethyl cellulose having an apparent weight average molecular weight of 150,000
- the dielectric paste thus prepared was printed on the formed ceramic green sheets using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared in the same manner as in Example 1 except that dihydrotapinyl methyl ether was used instead of isobonyl acetate as a solvent for preparing a conductive paste.
- a body paste was prepared and printed on a ceramic green sheet to produce a laminate unit in which a ceramic drain sheet, an electrode layer, and a spacer layer were laminated.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 130,000 and ethyl cellulose having a weight average molecular weight of 230,000 in a volume ratio of 50:50, that is, an apparent weight average molecular weight
- a dielectric paste was prepared in the same manner as in Example 5, except that 180,000 ethyl cellulose was used.
- the viscosity of the dielectric paste thus prepared was 25 ° C., and the shear rate was 8 sec. In addition to the measurement at 1 , the measurement was performed at 25 ° C and a shear rate of 50 sec- 1 .
- the viscosity at a shear rate of 8 sec- 1 was 19. OPs's, and the viscosity at a shear rate of 50 sec- 1 was 11.2 Ps's.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared in the same manner as in Example 1 except that dihydrotapinyl methyl ether was used instead of isobonyl acetate as a solvent for preparing the conductive paste.
- the electrode layer thus formed was magnified 400 times using a metal microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 2 Further, as in Example 1, 30 pieces of annealed ceramic green chips were manufactured, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 750,000 and ethyl cellulose having a weight average molecular weight of 130,000 in a volume ratio of 50:50, that is, A dielectric paste was prepared in the same manner as in Example 5, except that ethyl cellulose having an apparent weight average molecular weight of 10.250,000 was used, and the viscosity of the thus prepared dielectric paste was 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- ethyl cellulose with a weight average molecular weight of 130,000 and ethyl cellulose with a weight average molecular weight of 230,000 as a binder for the dielectric paste for the spacer layer in a volume ratio of 25:75.
- a dielectric paste was prepared in the same manner as in Example 5 except that a binder, that is, ethyl cellulose having an apparent weight average molecular weight of 250,000 was used, and the viscosity of the dielectric paste thus prepared was Was measured at 25 ° C at a shear rate of 8 sec- 1 and at 25 ° C at a shear rate of 50 sec- 1 .
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer. Since the viscosity of the body paste was too high, the mesh of the screen plate was clogged, and it was impossible to form a continuous spacer layer.
- a dielectric paste was prepared in the same manner as in Example 5, except that ethyl cellulose having a weight average molecular weight of 230,000 was used as a binder for the dielectric paste for the spacer layer.
- the viscosity of the body paste 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the viscosity at a shear rate 8Sec- 1 is 32. 2Ps 's, the viscosity at a shear rate 50sec- 1 18. 8Ps' was s.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer. Since the viscosity of the body paste was too high, the mesh of the screen plate was clogged, and it was impossible to form a continuous spacer layer.
- Example 1 As in Example 1, a ceramic green sheet was used as the binder of the dielectric paste for forming the ceramic green sheet, except that a plastic resin having a degree of polymerization of S800 and a degree of petitial Louis of 69 mol% was used. A dielectric paste for sheet formation was prepared to produce a ceramic green sheet.
- Example 8 the dielectric paste prepared in the same manner as in Example 8 was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, and the spacer was printed. A layer was formed.
- the spacer layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer.
- Example 2 Next, in the same manner as in Example 1, a conductive paste for an electrode was prepared and printed on a ceramic dalene sheet to form a laminate in which a ceramic green sheet, an electrode layer, and a spacer layer were laminated. A unit was made.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. Cracks and wrinkles were observed on the surface of the electrode layer.
- a dielectric paste was prepared in the same manner as in Example 1 except that terpinyl methyl ether was used instead of isobol acetate as a solvent when preparing a dielectric paste for the spacer layer.
- the viscosity of the prepared dielectric paste thus, 25 ° C, as well as measured at a shear speed 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared in the same manner as in Example 1 except that terpyl methyl ether was used instead of isobonyl acetate as a solvent for preparing the conductive paste.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was enlarged. When the surface was observed, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 2 Further, as in Example 1, 30 pieces of annealed ceramic green chips were produced, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a dielectric paste was prepared in the same manner as in Example 9 except that ethyl cellulose having a weight average molecular weight of 130,000 was used as a binder for the dielectric paste for the spacer layer.
- the viscosity of the body paste 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the viscosity at a shear rate 8Sec- 1 is 10. 6 ps 's, the viscosity at a shear rate 50sec- 1 6. 34Ps' was s.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 1 As in Example 1, 30 anneal-treated ceramic green chips were manufactured, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 130,000 and ethyl cellulose having a weight average molecular weight of 230,000 in a volume ratio of 75:25, that is, an apparent weight average molecular weight Uses 150,000 ethyl cellulose
- a dielectric paste was prepared in the same manner as in Example 9, except that the viscosity of the dielectric paste thus prepared was measured at 25 ° C and a shear rate of 8 sec- 1 . It was measured at a shear rate of 50 sec- 1 .
- the dielectric paste thus prepared was printed on the formed ceramic green sheets using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared in the same manner as in Example 1 except that terpyl methyl ether was used instead of isobonyl acetate as a solvent for preparing a conductive paste.
- a body paste was prepared and printed on a ceramic green sheet to prepare a laminate unit in which the ceramic green sheet, the electrode layer, and the spacer layer were laminated.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 130,000 and ethyl cellulose having a weight average molecular weight of 230,000 in a volume ratio of 50:50, that is, an apparent weight average molecular weight
- a dielectric paste was prepared in the same manner as in Example 9 except that 180,000 ethyl cellulose was used.
- the viscosity of the dielectric paste thus prepared was 25 ° C., and the shear rate was 8 sec. In addition to the measurement at 1 , the measurement was performed at 25 ° C and a shear rate of 50 sec- 1 .
- the dielectric paste thus prepared was used as in Example 1 by using a screen printing machine. Similarly, printing was performed on the formed ceramic green sheet to form a spacer layer.
- the spacer layer formed in this manner was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared in the same manner as in Example 1 except that terpyl methyl ether was used instead of isobonyl acetate as a solvent for preparing a conductive paste.
- a body paste was prepared and printed on a ceramic green sheet to prepare a laminate unit in which the ceramic green sheet, the electrode layer, and the spacer layer were laminated.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 1 As in Example 1, 30 pieces of annealed ceramic green chips were produced, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 750,000 and ethyl cellulose having a weight average molecular weight of 130,000 in a volume ratio of 50:50, that is, A dielectric paste was prepared in the same manner as in Example 9 except that ethyl cellulose having an apparent weight average molecular weight of 10.250,000 was used, and the viscosity of the thus prepared dielectric paste was 25%. ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- a binder for the dielectric paste for the spacer layer a binder containing ethyl cellulose having a weight average molecular weight of 130,000 and ethyl cellulose having a weight average molecular weight of 230,000 in a volume ratio of 25:75, that is, an apparent weight average molecular weight Uses 20.000 ethyl cellulose
- a dielectric paste was prepared in the same manner as in Example 9, except that the viscosity of the dielectric paste thus prepared was measured at 25 ° C and a shear rate of 8 sec- 1 . It was measured at a shear rate of 50 sec- 1 .
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer. Since the viscosity of the body paste was too high, the mesh of the screen plate was clogged, and it was impossible to form a continuous spacer layer.
- a dielectric paste was prepared in the same manner as in Example 9 except that ethyl cellulose having a weight average molecular weight of 230,000 was used as a binder for the dielectric paste for the spacer layer.
- the viscosity of the body paste 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer. Since the viscosity of the body paste was too high, the mesh of the screen plate was clogged, and it was impossible to form a continuous spacer layer.
- Example 1 As in Example 1, a ceramic green sheet was used as the binder of the dielectric paste for forming the ceramic green sheet, except that a plastic resin having a degree of polymerization of S800 and a degree of petitial Louis of 69 mol% was used. A dielectric paste for sheet formation was prepared to produce a ceramic green sheet.
- the prepared dielectric paste was printed on the formed ceramic green sheets using a screen printer in the same manner as in Example 12 to form a spacer layer in the same manner as in Example 12. .
- the spacer layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer.
- the electrode layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the electrode layer was observed. Cracks and wrinkles were observed on the surface of the electrode layer.
- Example 2 Further, as in Example 1, 30 pieces of annealed ceramic green chips were fabricated, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. Of the green chips, two ceramic green chips were found to have voids.
- the dielectric paste was prepared in the same manner as in Example 2 except that ⁇ -terpinyl acetate was used instead of isobutyl acetate as a solvent when preparing the dielectric paste for the spacer layer.
- the viscosity of the prepared dielectric paste thus, 25 ° C, as well as measured at a shear rate 8 sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was enlarged. When the surface was observed, no cracks or wrinkles were observed on the surface of the electrode layer.
- a dielectric paste was prepared in the same manner as in Example 2 except that I-dihydrocarbyl acetate was used instead of isobol acetate as a solvent for preparing the dielectric paste for the spacer layer. and the viscosity of the prepared dielectric paste thus, 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- the electrode layer thus formed was magnified 400 times with a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- a dielectric paste was prepared in the same manner as in Example 2, except that I-menthyl acetate was used instead of isobutyl acetate as a solvent for preparing the dielectric paste for the spacer layer. Then, the viscosity of the dielectric paste thus prepared was adjusted to 25 ° C and a shear rate of 8se C _ In addition to the measurement at 1 , the measurement was performed at 25 ° C and a shear rate of 50 sec- 1 .
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductor paste for an electrode was prepared and printed on a ceramic green sheet in the same manner as in Example 1, except that I-menthyl acetate was used, and the ceramic green sheet, the electrode layer and the spacer were prepared. A laminate unit in which the layers were laminated was produced.
- the electrode layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 2 Further, as in Example 1, 30 pieces of annealed ceramic green chips were manufactured, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip.
- a dielectric paste was prepared in the same manner as in Example 2, except that I-menthone was used in place of isobol acetate as a solvent for preparing the dielectric paste for the spacer layer.
- the viscosity of the prepared dielectric paste thus, 25 ° C, the rewritable measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheets using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared and printed on a ceramic green sheet in the same manner as in Example 1 except for using I-menton, and the ceramic green sheet, the electrode layer, and the spacer layer were formed. A laminated unit was produced.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- a dielectric paste was prepared in the same manner as in Example 2 except that I-perillyl acetate was used instead of isobutyl acetate as a solvent when preparing the dielectric paste for the spacer layer.
- I-perillyl acetate was used instead of isobutyl acetate as a solvent when preparing the dielectric paste for the spacer layer.
- the viscosity of the dielectric paste thus prepared was measured at 25 ° C. at a shear rate of 8 sec- 1 and at 25 ° C. at a shear rate of 50 sec- 1 .
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared and printed on a ceramic green sheet in the same manner as in Example 1 except that I-perillyl alcohol and I-perillyl alcohol were used. A laminate unit in which a sublayer was laminated was produced.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 18 Further, as in Example 1, 30 pieces of annealed ceramic green chips were manufactured, and the presence or absence of voids was observed in the same manner as in Example 1. A total of 30 ceramic green chips were obtained. No void was found in the gap of the green chip. Example 18
- a dielectric paste was prepared in the same manner as in Example 2 except that I-carbyl acetate was used instead of isobol acetate as a solvent when preparing the dielectric paste for the spacer layer. Te, the viscosity of the prepared dielectric paste thus, 25 ° C, as well as measured at a shear rate 8 sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Power
- a conductive paste for an electrode was prepared in the same manner as in Example 1 except that I-carbyl acetate was used instead of isobonyl acetate as a solvent for preparing the conductive paste. It was prepared and printed on a ceramic green sheet to produce a laminate unit in which the ceramic green sheet, the electrode layer, and the spacer layer were laminated.
- the electrode layer thus formed was magnified 400 times using a metal microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- the viscosity at a shear rate of 8 sec- 1 was 10.
- the viscosity at a shear rate of 50 sec- 1 was 6.43 Ps's.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the electrode layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 2 Furthermore, 30 pieces of annealed ceramic green chips were manufactured in the same manner as in Example 1, and the presence or absence of voids was observed in the same manner as in Example 1. A total of 30 ceramic green chips were obtained. Of the green chips, eight ceramic green chips were found to have voids.
- a dielectric paste was prepared in the same manner as in Example 2 except that terbineol was used instead of isobol acetate as a solvent for preparing the dielectric paste for the spacer layer.
- the viscosity of the dielectric paste 25 ° C, as well as measurement at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1, to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Was.
- the electrode layer thus formed was magnified 400 times using a metallographic microscope, and the surface of the electrode layer was enlarged. When the surface was observed, no cracks or wrinkles were observed on the surface of the electrode layer.
- a dielectric paste was prepared in the same manner as in Example 2, except that butyl carbitol acetate was used instead of isobol acetate as a solvent for preparing the dielectric paste for the spacer layer.
- the viscosity of the prepared dielectric paste thus, 25 ° C, as well as measured at a shear rate 8sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet in the same manner as in Example 1 using a screen printer to form a spacer layer.
- the viscosity of the body paste was too low to form a spacer layer.
- a dielectric paste was prepared in the same manner as in Example 2 except that dihydrotavineol was used in place of isobutyl acetate as a solvent for preparing the dielectric paste for the spacer layer.
- the viscosity of the prepared dielectric paste thus, 25 ° C, as well as measured at a shear rate 8 sec- 1, 25 ° C, measured at a shear rate 50sec- 1.
- the dielectric paste thus prepared was printed on the formed ceramic green sheet using a screen printer in the same manner as in Example 1 to form a spacer layer.
- the spacer layer thus formed was magnified 400 times using a metallurgical microscope, and the surface of the spacer layer was observed. Cracks and wrinkles were observed on the surface of the spacer layer. Was.
- the electrode layer thus formed was magnified 400 times with a metallographic microscope, and the surface of the electrode layer was observed. As a result, no cracks or wrinkles were observed on the surface of the electrode layer.
- Example 2 Further, as in Example 1, 30 pieces of annealed ceramic green chips were produced, and the presence or absence of voids was observed in the same manner as in Example 1. As a result, a total of 30 ceramic green chips were obtained. Of the green chips, nine ceramic green chips were found to have voids.
- a ceramic green chip is produced by printing a dielectric paste to produce a laminate unit and laminating 50 laminate units, is it possible to form the spacer layer itself? Alternatively, even though the spacer layer could be formed, cracks and wrinkles were generated on the surface of the spacer layer, and voids were observed in the fired ceramic green chip, whereas the binder was not.
- the ceramic green sheet swells or dissolves partially due to dissolution.
- voids may be formed at the interface between the ceramic green sheet and the spacer layer, or cracks and wrinkles may occur on the surface of the spacer layer.
- voids are generated, and the cracked and wrinkled portions of the spacer layer are missing, and the voids are likely to be generated in the fired ceramic green chip.
- isobonyl acetate, dihydropropyl methyl ether, terpyl methyl ether, and ⁇ terpyl used as solvents for the dielectric paste for the spacer layer were used.
- Acetate, I-dihydrocarbyl acetate, I-menthyl acetate, I-mentone, I-perillyl acetate and I-carbyl acetate are ceramics
- the dielectric paste used to form the green sheet hardly dissolves the polybutyral contained as a binder, thus effectively preventing cracks and wrinkles on the surface of the spacer layer It is considered that voids were prevented from being generated in the fired ceramic green chip.
- the viscosity of the dielectric paste for the spacer layer is too low to form the spacer layer, on the other hand, poly Bulle butyral (polymerization degree 1450, butyralization degree 69 mol 0/0) on the ceramic green sheet formed with including dielectric paste, Isoboniruasete over preparative, Jihidorota Ichipi - there methyl ether
- the dielectric paste for the spacer layer is also used.
- polyvinyl butyral (polymerization degree 80 0, 69 mole 0/0 degree butyral) when the is formed by using a dielectric paste containing a binder, a dielectric for forming the ceramic green sheet Partial force of the paste's solder Swelled by the solvent contained in the dielectric paste used to form the spacer layer and the conductor paste for the electrode layer ,
- the air gap is formed at the interface between the ceramic green sheet and the spacer layer and the electrode layer, or cracks and wrinkles are generated on the surface of the spacer layer and the electrode layer.
- Voids are generated in the ceramic green chip produced by laminating and sintering, or cracks and wrinkles are formed in the spacer layer and electrode layer in the process of laminating the laminated unit. It was found that voids were likely to occur in the ceramic green chip after firing due to chipping.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Ceramic Capacitors (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
- Conductive Materials (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/592,967 US20080233270A1 (en) | 2004-03-16 | 2005-03-16 | Dielectric Paste for a Multi-Layered Ceramic Electronic Component and a Method for Manufacturing a Multi-Layered Unit for a Multi-Layered Ceramic Electronic Component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004073664A JP4412013B2 (ja) | 2004-03-16 | 2004-03-16 | 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法 |
JP2004-073664 | 2004-03-16 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005087689A1 true WO2005087689A1 (ja) | 2005-09-22 |
Family
ID=34975495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/004607 WO2005087689A1 (ja) | 2004-03-16 | 2005-03-16 | 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20080233270A1 (ja) |
JP (1) | JP4412013B2 (ja) |
KR (1) | KR100769470B1 (ja) |
CN (1) | CN100497258C (ja) |
TW (1) | TWI262518B (ja) |
WO (1) | WO2005087689A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101141442B1 (ko) * | 2009-12-30 | 2012-05-03 | 삼성전기주식회사 | 내부전극용 도전성 페이스트 조성물 및 이를 이용한 적층 세라믹 커패시터의제조방법 |
JP5929279B2 (ja) * | 2012-02-10 | 2016-06-01 | Tdk株式会社 | 積層コンデンサ |
KR101761940B1 (ko) | 2012-05-04 | 2017-07-26 | 삼성전기주식회사 | 적층형 전자 부품 및 이의 제조방법 |
CN112142480B (zh) * | 2020-09-22 | 2022-06-21 | 中国振华(集团)新云电子元器件有限责任公司(国营第四三二六厂) | 一种湿法工艺多层片式瓷介电容器的瓷浆及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH056709A (ja) * | 1991-06-20 | 1993-01-14 | Hitachi Ltd | セラミツク多層配線基板製作用ペースト |
JPH06502966A (ja) * | 1991-09-13 | 1994-03-31 | イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー | 改善された低温焼成キャパシター誘電体 |
JPH06236827A (ja) * | 1993-02-10 | 1994-08-23 | Sumitomo Metal Mining Co Ltd | 積層セラミックコンデンサー内部電極用ペースト |
JPH06321619A (ja) * | 1993-05-11 | 1994-11-22 | Asahi Glass Co Ltd | 誘電体ペースト |
JPH08111346A (ja) * | 1994-10-06 | 1996-04-30 | Sumitomo Metal Mining Co Ltd | 積層セラミックコンデンサー内部電極用ペースト |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4415703A (en) * | 1981-01-13 | 1983-11-15 | Daicel Chemical Industries, Ltd. | Aqueous dispersion of a cellulose derivative |
US4959330A (en) * | 1989-06-20 | 1990-09-25 | E. I. Du Pont De Nemours And Company | Crystallizable glass and thick film compositions thereof |
JP2702796B2 (ja) * | 1990-02-23 | 1998-01-26 | 旭化成工業株式会社 | 銀合金導電性ペースト |
US5283007A (en) * | 1992-04-28 | 1994-02-01 | E. I. Du Pont De Nemours And Company | Conductive polymer compositions |
US5412865A (en) * | 1991-08-30 | 1995-05-09 | Murata Manufacturing Co., Ltd. | Method of manufacturing multilayer electronic component |
US5179773A (en) * | 1991-08-30 | 1993-01-19 | Bmc Technology Corporation | Process of manufacturing multilayer ceramic capacitors |
US5766392A (en) * | 1993-01-08 | 1998-06-16 | Murata Manufacturing Co., Ltd. | Method of manufacturing a multilayer ceramic electronic component |
US5480503A (en) * | 1993-12-30 | 1996-01-02 | International Business Machines Corporation | Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof |
US5716481A (en) * | 1994-10-31 | 1998-02-10 | Tdk Corporation | Manufacturing method and manufacturing apparatus for ceramic electronic components |
JPH08148787A (ja) * | 1994-11-21 | 1996-06-07 | Sumitomo Kinzoku Ceramics:Kk | 厚膜ペースト |
EP0732735B1 (en) * | 1995-03-16 | 2005-12-14 | Murata Manufacturing Co., Ltd. | Monolithic ceramic electronic device and method of manufacturing same |
US6007900A (en) * | 1995-04-28 | 1999-12-28 | Murata Manufacturing Co., Ltd. | Dielectric paste and thick-film capacitor using same |
US5603147A (en) * | 1995-06-07 | 1997-02-18 | Microelectronic Packaging, Inc. | Method of making a high energy multilayer ceramic capacitor |
US6197480B1 (en) * | 1995-06-12 | 2001-03-06 | Toray Industries, Inc. | Photosensitive paste, a plasma display, and a method for the production thereof |
SE505546C2 (sv) * | 1995-12-11 | 1997-09-15 | Moelnlycke Ab | Metod att åstadkomma en svets eller ett klipp medelst ultraljud |
US5718722A (en) * | 1996-09-11 | 1998-02-17 | Kiefer; John Steven | Lower back heater mat with a leg support |
US6054368A (en) * | 1997-06-30 | 2000-04-25 | Taiwan Semiconductor Manufacturing Company | Method of making an improved field oxide isolation structure for semiconductor integrated circuits having higher field oxide threshold voltages |
US5840107A (en) * | 1998-03-25 | 1998-11-24 | Motorola, Inc. | Binder solution for a sealing composition and method of use |
JP3080922B2 (ja) * | 1998-04-13 | 2000-08-28 | 富山日本電気株式会社 | 固体電解コンデンサ及びその製造方法 |
US5935358A (en) * | 1998-04-17 | 1999-08-10 | New Create Corporation | Method of producing a laminate ceramic capacitor |
US6245171B1 (en) * | 1998-11-23 | 2001-06-12 | International Business Machines Corporation | Multi-thickness, multi-layer green sheet lamination and method thereof |
US6641933B1 (en) * | 1999-09-24 | 2003-11-04 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting EL display device |
JP2001237140A (ja) * | 1999-12-13 | 2001-08-31 | Murata Mfg Co Ltd | 積層型セラミック電子部品およびその製造方法ならびにセラミックペーストおよびその製造方法 |
US20020056641A1 (en) * | 1999-12-15 | 2002-05-16 | December Timothy S. | Cured multilayer coating providing improved edge corrosion resistance to a substrate and a method of making same |
JP3734662B2 (ja) * | 2000-02-16 | 2006-01-11 | 太陽誘電株式会社 | 積層セラミックコンデンサとその製造方法 |
JP3633435B2 (ja) * | 2000-04-10 | 2005-03-30 | 株式会社村田製作所 | 多層セラミック基板、その製造方法および設計方法、ならびに電子装置 |
KR100737652B1 (ko) * | 2000-04-17 | 2007-07-09 | 마츠시타 덴끼 산교 가부시키가이샤 | 표시패널용 잉크 및 그 잉크를 이용한 플라즈마디스플레이 패널의 제조방법 |
TW504719B (en) * | 2000-05-30 | 2002-10-01 | Tdk Corp | Multilayer ceramic capacitor and production method thereof |
JP3722275B2 (ja) * | 2000-06-15 | 2005-11-30 | Tdk株式会社 | 金属粒子含有組成物、導電ペースト及びその製造方法 |
US7052824B2 (en) * | 2000-06-30 | 2006-05-30 | E. I. Du Pont De Nemours And Company | Process for thick film circuit patterning |
US20030138635A1 (en) * | 2000-07-11 | 2003-07-24 | Naoya Haruta | Multi-layer application film and method of laminating the same |
TW543052B (en) * | 2001-03-05 | 2003-07-21 | Nitto Denko Corp | Manufacturing method of ceramic green sheet, manufacturing method of multilayer ceramic electronic components, and carrier sheet for ceramic green sheets |
DE10113361A1 (de) * | 2001-03-20 | 2002-09-26 | Andreas Roosen | Verfahren zur Verbindung keramischer Grünkörper unter Verwendung eines Transfertapes und Überführung dieser verklebten Grünkörper in einen Keramikkörper |
TWI228733B (en) * | 2002-12-27 | 2005-03-01 | Tdk Corp | Manufacturing method of electronic component having internal electrode |
CN1784756A (zh) * | 2003-03-31 | 2006-06-07 | Tdk株式会社 | 制造多层陶瓷电子部件的方法 |
KR100733125B1 (ko) * | 2003-03-31 | 2007-06-27 | 티디케이가부시기가이샤 | 적층 세라믹 전자부품의 제조방법 |
US7402220B2 (en) * | 2003-04-18 | 2008-07-22 | Tdk Corporation | Method for manufacturing multi-layered unit for multi-layered ceramic electronic component |
TW200519148A (en) * | 2003-07-24 | 2005-06-16 | Nitto Denko Corp | Inorganic powder-containing resin composition, film-forming material layer, transfer sheet, method for producing substrate with dielectric layer, and substrate with dielectric layer |
KR100853278B1 (ko) * | 2003-09-30 | 2008-08-20 | 티디케이가부시기가이샤 | 적층 세라믹 전자 부품용 유전체 페이스트의 제조 방법 |
CN1860569A (zh) * | 2003-09-30 | 2006-11-08 | Tdk株式会社 | 多层陶瓷电子元件的内部电极用导电糊的制备方法 |
JP4487595B2 (ja) * | 2004-02-27 | 2010-06-23 | Tdk株式会社 | 積層セラミック電子部品用の積層体ユニットの製造方法 |
JP4487596B2 (ja) * | 2004-02-27 | 2010-06-23 | Tdk株式会社 | 積層セラミック電子部品用の積層体ユニットの製造方法 |
JP4412012B2 (ja) * | 2004-03-16 | 2010-02-10 | Tdk株式会社 | 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法 |
US20080053593A1 (en) * | 2004-06-28 | 2008-03-06 | Tdk Corporation | Production Method of Multilayer Electronic Device |
JP2007214452A (ja) * | 2006-02-10 | 2007-08-23 | Tdk Corp | 剥離層用ペースト及び積層型電子部品の製造方法 |
-
2004
- 2004-03-16 JP JP2004073664A patent/JP4412013B2/ja not_active Expired - Fee Related
-
2005
- 2005-03-14 TW TW094107725A patent/TWI262518B/zh not_active IP Right Cessation
- 2005-03-16 KR KR1020067018662A patent/KR100769470B1/ko not_active IP Right Cessation
- 2005-03-16 WO PCT/JP2005/004607 patent/WO2005087689A1/ja active Application Filing
- 2005-03-16 US US10/592,967 patent/US20080233270A1/en not_active Abandoned
- 2005-03-16 CN CNB2005800116505A patent/CN100497258C/zh not_active Expired - Fee Related
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH056709A (ja) * | 1991-06-20 | 1993-01-14 | Hitachi Ltd | セラミツク多層配線基板製作用ペースト |
JPH06502966A (ja) * | 1991-09-13 | 1994-03-31 | イー・アイ・デュポン・ドゥ・ヌムール・アンド・カンパニー | 改善された低温焼成キャパシター誘電体 |
JPH06236827A (ja) * | 1993-02-10 | 1994-08-23 | Sumitomo Metal Mining Co Ltd | 積層セラミックコンデンサー内部電極用ペースト |
JPH06321619A (ja) * | 1993-05-11 | 1994-11-22 | Asahi Glass Co Ltd | 誘電体ペースト |
JPH08111346A (ja) * | 1994-10-06 | 1996-04-30 | Sumitomo Metal Mining Co Ltd | 積層セラミックコンデンサー内部電極用ペースト |
Also Published As
Publication number | Publication date |
---|---|
JP2005263502A (ja) | 2005-09-29 |
US20080233270A1 (en) | 2008-09-25 |
JP4412013B2 (ja) | 2010-02-10 |
TWI262518B (en) | 2006-09-21 |
CN1942414A (zh) | 2007-04-04 |
CN100497258C (zh) | 2009-06-10 |
KR20060129457A (ko) | 2006-12-15 |
KR100769470B1 (ko) | 2007-10-24 |
TW200540890A (en) | 2005-12-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100734783B1 (ko) | 적층 세라믹 전자 부품용 도전체 페이스트 및 적층 세라믹전자 부품용 적층체 유닛의 제조 방법 | |
KR100734785B1 (ko) | 적층 세라믹 전자 부품용 도전체 페이스트 및 적층 세라믹전자 부품용 적층체 유닛의 제조 방법 | |
WO2006001358A1 (ja) | 積層型電子部品の製造方法 | |
JP4357531B2 (ja) | 積層型電子部品の製造方法 | |
WO2005087689A1 (ja) | 積層セラミック電子部品用の誘電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法 | |
KR100769471B1 (ko) | 적층 세라믹 전자 부품용 유전체 페이스트 및 적층 세라믹전자 부품용 적층체 유닛의 제조 방법 | |
JP4487542B2 (ja) | 積層セラミック電子部品用の導電体ペーストおよび積層セラミック電子部品用の積層体ユニットの製造方法 | |
JP4662298B2 (ja) | 積層セラミック電子部品のスペーサ層用の誘電体ペースト | |
KR100816787B1 (ko) | 적층 세라믹 전자 부품의 전극층용 도전체 페이스트 및적층 세라믹 전자 부품용 적층체 유닛의 제조 방법 | |
KR100766320B1 (ko) | 적층 세라믹 전자부품의 스페이서층용 유전체 페이스트 | |
KR100863398B1 (ko) | 적층형 전자부품의 제조방법 | |
JP2006013246A (ja) | 積層型電子部品の製造方法 | |
JP2006013247A (ja) | 積層型電子部品の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
WWE | Wipo information: entry into national phase |
Ref document number: 1020067018662 Country of ref document: KR |
|
WWE | Wipo information: entry into national phase |
Ref document number: 10592967 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
WWW | Wipo information: withdrawn in national office |
Country of ref document: DE |
|
WWE | Wipo information: entry into national phase |
Ref document number: 200580011650.5 Country of ref document: CN |
|
WWP | Wipo information: published in national office |
Ref document number: 1020067018662 Country of ref document: KR |
|
122 | Ep: pct application non-entry in european phase |