WO2005040459B1 - Procedes et compositions pour galvanoplastie - Google Patents

Procedes et compositions pour galvanoplastie

Info

Publication number
WO2005040459B1
WO2005040459B1 PCT/US2004/033229 US2004033229W WO2005040459B1 WO 2005040459 B1 WO2005040459 B1 WO 2005040459B1 US 2004033229 W US2004033229 W US 2004033229W WO 2005040459 B1 WO2005040459 B1 WO 2005040459B1
Authority
WO
WIPO (PCT)
Prior art keywords
copper
seed layer
electroplating
sulfuric acid
deposition
Prior art date
Application number
PCT/US2004/033229
Other languages
English (en)
Other versions
WO2005040459A2 (fr
WO2005040459A3 (fr
Filing date
Publication date
Priority claimed from US10/688,420 external-priority patent/US20050081744A1/en
Application filed filed Critical
Priority to JP2006535564A priority Critical patent/JP2007508461A/ja
Priority to EP04794546A priority patent/EP1680535A4/fr
Publication of WO2005040459A2 publication Critical patent/WO2005040459A2/fr
Publication of WO2005040459A3 publication Critical patent/WO2005040459A3/fr
Publication of WO2005040459B1 publication Critical patent/WO2005040459B1/fr

Links

Abstract

La présente invention concerne des procédés et compositions de galvanoplastie permettant de combler de métallisation des microstructures évidées dans une pièce micro-électronique telle qu'une plaquette de semi-conducteurs. Ces compositions sont généralement un mélange de cuivre et d'acide sulfurique, à raison de 0,3 à 0,5 g de cuivre pour 11 g de litre de solution. On peut également pousser à la limite de saturation la concentration du cuivre dans l'acide sulfurique, c'est-à-dire entre environ 65 et environ 150 g/l. Ces compositions admettent éventuellement les additifs conventionnels tels que les accélérateurs, les suppresseurs, les halogénures et/ou les niveleurs. L'invention concerne ainsi des procédés de dépôt électrochimique de matériaux conducteurs dans des structures telles que des tranchées et/ou des trous de contact réalisés sur des pièces semi-conductrices, et notamment des procédés convenant particulièrement dans les réacteurs à anodes multiples utilisant les solutions de galvanoplastie de l'invention.
PCT/US2004/033229 2003-10-16 2004-10-08 Procedes et compositions pour galvanoplastie WO2005040459A2 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2006535564A JP2007508461A (ja) 2003-10-16 2004-10-08 電気鍍金組成物及び電気鍍金方法
EP04794546A EP1680535A4 (fr) 2003-10-16 2004-10-08 Procedes et compositions pour galvanoplastie

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/688,420 US20050081744A1 (en) 2003-10-16 2003-10-16 Electroplating compositions and methods for electroplating
US10/688,420 2003-10-16

Publications (3)

Publication Number Publication Date
WO2005040459A2 WO2005040459A2 (fr) 2005-05-06
WO2005040459A3 WO2005040459A3 (fr) 2006-01-12
WO2005040459B1 true WO2005040459B1 (fr) 2006-03-02

Family

ID=34521165

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/033229 WO2005040459A2 (fr) 2003-10-16 2004-10-08 Procedes et compositions pour galvanoplastie

Country Status (6)

Country Link
US (1) US20050081744A1 (fr)
EP (1) EP1680535A4 (fr)
JP (1) JP2007508461A (fr)
CN (1) CN1867703A (fr)
TW (1) TW200516176A (fr)
WO (1) WO2005040459A2 (fr)

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