WO2005038847A1 - ランプ - Google Patents
ランプ Download PDFInfo
- Publication number
- WO2005038847A1 WO2005038847A1 PCT/JP2004/013474 JP2004013474W WO2005038847A1 WO 2005038847 A1 WO2005038847 A1 WO 2005038847A1 JP 2004013474 W JP2004013474 W JP 2004013474W WO 2005038847 A1 WO2005038847 A1 WO 2005038847A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- lead
- mass
- base
- free solder
- solder
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J61/00—Gas-discharge or vapour-discharge lamps
- H01J61/02—Details
- H01J61/36—Seals between parts of vessels; Seals for leading-in conductors; Leading-in conductors
- H01J61/366—Seals for leading-in conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01K—ELECTRIC INCANDESCENT LAMPS
- H01K1/00—Details
- H01K1/42—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp
- H01K1/46—Means forming part of the lamp for the purpose of providing electrical connection, or support for, the lamp supported by a separate part, e.g. base, cap
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J5/00—Details relating to vessels or to leading-in conductors common to two or more basic types of discharge tubes or lamps
- H01J5/50—Means forming part of the tube or lamps for the purpose of providing electrical connection to it
- H01J5/54—Means forming part of the tube or lamps for the purpose of providing electrical connection to it supported by a separate part, e.g. base
Definitions
- the present invention relates to lamps such as halogen lamps and HID lamps. Background art
- Lamps for example, metal halide lamps, generally have a glass bulb (outer tube pulp) having a recess formed at an end, and an eyelet and a shell fixed to the end of the glass bulb. And an E-shaped base.
- An arc tube in which electrodes are arranged is provided inside the glass bulb.
- two lead wires for supplying power to the electrodes are led out from the end of the glass bulb on the base side.
- One of the lead wires is passed through a through hole provided in the eyelet portion of the base, soldered to the outer surface of the eyelet portion, and electrically connected to the eyelet portion. I have.
- the other lead wire passes between the glass bulb and the seal portion of the base and is led out to the concave portion of the glass valve. It is electrically connected.
- the solder poured between the recess and the base is in contact with both the glass bulb and the base, and also has a function of preventing the base from rotating with respect to the glass pulp.
- the temperature of the base rises to 200 ° C. or more due to heat generated from the arc tube at the time of lighting. Therefore, as the solder used for such a base part, a solder that does not melt even at 200 ° C. or higher is used among high-temperature solders.
- the solidus temperature is the melting point of Pb-63Sn. 83 ° C or higher solder is called high temperature solder.
- the high-temperature solder used for the base of the lamp is J
- Pb—20Sn, Pb_10Sn, and the like described in ISZ3281 (19999) have been widely used. These high-temperature solders containing Pb as a main component have good solderability to a brass base or a base plated with nickel on brass.
- good solderability means that in the manufacturing process, wire solder can be used, solder can be easily supplied to the soldered parts, and solidification of the molten solder can be prevented. In terms of quality, it means that the material of the lead wire, the material of the die, and the solder form an alloy layer, respectively, and that their electrical connection is stable.
- solder that does not contain Pb is strongly demanded.
- a solder containing Sn as a main component and other elements as appropriate is being studied.
- the lead-free solder made of Sn—Cu is solid-phase as in lighting. At or above the linear temperature, the bonding strength becomes extremely weak, even if it does not melt.
- the base is cooled from a high temperature of 200 ° C or more to a very low temperature at once, and the difference between the thermal expansion coefficient of the solder and the thermal expansion coefficient of the base Therefore, it is considered that large stress is applied to the solder, and cracks and cracks are generated in the soldered part.
- the lamp using lead-free solder made of Sn—Cu also had a problem that the lead wire was easily peeled off from the solder.
- the present invention has been made to solve the above-described problems.
- the lead-free solder is prevented from peeling from the solder by improving the heat resistance of the lead-free solder.
- An object of the present invention is to provide a lamp that prevents the occurrence of cracks and cracks in a soldered portion, particularly in an environment where a temperature difference between a light-on state and a light-off state is extremely large.
- a lamp according to the present invention includes a glass bulb, a base fixed to one end of the glass bulb, a power supply lead wire, and electrically connecting the base and the lead wire.
- a lead-free solder to be connected wherein the lead-free solder contains Sn as a main component, and has at least 5% to 40% by mass of Sb and 0% to 1% by mass of Cu as a remainder. 0% by mass and a solidus temperature of not less than 235 ° C.
- the lamp according to the present invention includes a glass bulb having a concave portion, a base fixed to cover at least a part of the concave portion, and a power supply lead wire having a tip located in the concave portion.
- the heat resistance of the lead-free solder is improved, so that peeling of the lead wire from the solder can be prevented. Also, even when used in an environment such as a cold region where the temperature difference between when lit and when turned off is severe, cracks and cracks do not occur in the soldered part over a long period of use.
- the lead-free solder has a high tensile strength (Pa), the lead-free solder is unlikely to be deformed even when a rotational force is applied between the base and the glass valve. For this reason, it is possible to reliably prevent the base from rotating with respect to the glass pulp.
- the lead-free solder is further characterized in that the total content of the components Ni, Co, Fe, Mo, Cr and Mn is 0% by mass to 0.5% by mass. I do. According to this configuration, the wettability of the solder is improved, so that the solderability can be improved.
- the lead-free solder is further characterized in that the total content of each component of Ag and Bi is 0% by mass to 1% by mass. According to this configuration, the heat resistance of the solder can be further improved.
- FIG. 1 is a partially cutaway front view of a metal halide lamp according to an embodiment of the present invention.
- FIG. 2 is an enlarged sectional view of a main part of the same metal halide lamp.
- Fig. 3 is an enlarged front view of the main part of the glass bulb used in the metal halide lamp.
- Figure 4 is a table showing the measurement results of the melting temperature and the results of the temperature cycle test when the composition of the lead-free solder was changed.
- a metal halide lamp according to an embodiment of the present invention includes a glass bulb 2 having an arc tube 6 therein and at least a part of a concave portion 1 (see FIG. 2) of the glass bulb 2. And a base 7 fixed so as to cover the base.
- the glass bulb 2 is made of, for example, hard glass or quartz glass.
- a stem portion 3 is sealed on the base side in the glass bulb 2, and two stem wires 4 a and 4 b are sealed in the stem portion 3.
- the two stem wires 4 a and 4 b are sealed in the stem portion 3, and one end extends from the stem portion 3 into the glass bulb 2.
- Lead wires 11 and 10 are connected to the ends of the stem wires 4 a and 4 b on the stem 3 side, and power supply wires 5 a and 5 b extend to the portion extending into the glass bulb 2. It is connected.
- the pair of power supply lines 5 a and 5 b supply power to the electrodes 9 a and 9 b in the arc tube 6 and support the arc tube 6.
- the light-emitting tube 6 has a light-emitting portion 18 in which a pair of electrodes 9 a and 9 b are arranged so as to face each other to form a discharge space, and is provided at both ends of the light-emitting portion 18. It has sealing portions 19a and 19b.
- a certain amount of metal iodide, mercury, rare gas, and the like are sealed in the light emitting portion 18.
- the pair of electrodes 9a and 9b are connected to the external lead wires 21a and 21b via the molybdenum foil 20a and 20b sealed in the sealing portions 19a and 19b. It is connected.
- the external leads 2 la and 21b are connected to the power supply lines 5a and 5b.
- the base 7 is a screw type (E type) base.
- a concave portion 1 and a screw portion 8 are provided on the side of the glass pulp 2 to which the base 7 is fixed.
- FIG. 2 is a view when viewed from the X direction in FIG.
- the shell part 15 of the base 7 is mechanically fixed by being screwed with the screw part 8 of the glass bulb 2.
- One lead wire 10 passes through a through hole 12 formed in the bottom surface of the base 7 and is soldered to the outer surface of the eyelet portion 13 with lead-free solder 16. .
- the other lead wire 11 extends from the other end of the glass bulb 2, passes through the gap between the glass bulb 2 and the seal part 15, and is disposed at the position of the recess 1.
- the other lead wire 11 is electrically connected to the shell 15 via lead-free solder 17 poured between the recess 1 and the base 7.
- the lead-free solder 17 is in contact with both the glass bulb 2 and the base 7 in the recess 1 and also has a function of preventing the base 7 from rotating in the opposite direction to the glass pulp 2 in particular. ing.
- the shape, depth, and the like of the concave portion 1 are appropriately determined in consideration of the pouring amount of the lead-free solder 17 described later, the workability of pouring, and the like.
- the lead-free solders 16 and 17 have S ⁇ as the main component, and at least 5% to 40% by mass of Sb and 10% by mass or less of Cu as solid components, and Temperature is 235 ° C or higher.
- solder-free solder means that no lead is added at all, but this specification includes the case where a trace amount of lead is inevitably mixed.
- the solidus temperature will be lower than 235 ° C and the heat resistance will be reduced. It turned out to be unsuitable for use.
- the content of Sb exceed 40% by mass, brittleness appeared, and it was found that when any external shock was applied to the soldered portion, the solder was easily peeled. Therefore, the content of Sb is specified as 5% by mass to 40% by mass.
- the liquidus temperature will be 450 ° C or higher, and the soldering temperature will need to be 450 ° C or higher. If the soldering temperature exceeds 450 ° C, the heat may cause distortion and damage to the glass part of the lamp, or the soldering workability may be reduced.
- the composition of the remainder in the lead-free solders 16 and 17 is Ni, Co, Fe to improve the wettability and the bonding strength between the base 7 and the leads 10 and 11. , Mo, Cr and Mn, the total content of each component is preferably 0.5% by mass or less.
- the total content of each component of Ag and Bi is 1% by mass or less in order to improve heat resistance.
- At least one selected from Ge and Ga is contained, and the total content of each component is 0.001% by mass to 0.05% by mass.
- a metal-halide lamp according to the embodiment of the present invention was manufactured in which the compositions of the lead-free solders 16 and 17 were variously changed as shown in FIG.
- the metal halide lamps in Comparative Examples 1 to 5 in FIG. 4 have the same configuration as the metal halide lamp according to the embodiment of the present invention except that the composition of the solder is different.
- the composition of the lead-free solders 16 and 17 is mainly composed of Sn, and the remaining composition is at least 5 mass% to 40 mass% and Cu is Cu. 10% by mass or less, for example, as in Examples 1 to 26 ,
- the solidus temperature can be raised to 235 ° C or higher, so that the heat resistance can be improved and the lead wires 10 and 11 can be separated from the lead-free solder 16 and 17 In addition to preventing cracks and cracks from occurring in the soldered part over a long period of use. As a result, the connection between the base 7 and the lead wires 10 and 11 can be prevented. It has been found that the conduction failure can be prevented and the service life can be extended.
- JIS standard stipulates that the torque endurance of the base is torsion moment and 2 Nm in the case of E26 type base. 10 N ⁇ m was set as the reference value.
- the base 7 did not rotate with respect to the glass bulb 2. This is because, in Examples 1 to 26, the lead-free solder 17 has a high tensile strength, so that a force in the direction of rotation acts on the base 7 with respect to the glass bulb 2. It is considered that lead-free solder is not deformed.
- connection between the lead wire 11 and the seal portion 15 is mainly composed of Sn, and at least Sb is 5% to 40% by mass and Cu is
- the tensile strengths of the solders of Example 1, Example 2, Example 13 and Comparative Example 1, Comparative Example 2, and Comparative Example 5 were 30 MPa, 58 MPa, 90 MPa, and 28 MPa, respectively. a, 32 MPa and 41 MPa.
- the same lead-free solder 16, 16, was used for soldering the lead wire 10 to the eyelet portion 13 and for soldering the lead wire 11 to the seal portion 15.
- No. 17 the composition of each of the lead-free solders 16 and 17 may be different.
- the lamp of the present invention can prevent the lead wire from peeling from the solder, and can be used in an environment such as a cold region where the temperature difference between when the lamp is turned on and when the lamp is turned off is severe. It can be applied to lamps and other applications that need to prevent poor contact between the lead wire and the base.
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Common Detailed Techniques For Electron Tubes Or Discharge Tubes (AREA)
- Vessels And Coating Films For Discharge Lamps (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/536,701 US7211955B2 (en) | 2003-10-15 | 2004-09-09 | Lamp |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003-354861 | 2003-10-15 | ||
JP2003354861A JP2005122970A (ja) | 2003-10-15 | 2003-10-15 | 管球 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005038847A1 true WO2005038847A1 (ja) | 2005-04-28 |
Family
ID=34463154
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/013474 WO2005038847A1 (ja) | 2003-10-15 | 2004-09-09 | ランプ |
Country Status (5)
Country | Link |
---|---|
US (1) | US7211955B2 (ja) |
JP (1) | JP2005122970A (ja) |
KR (1) | KR20060130548A (ja) |
CN (1) | CN1868022A (ja) |
WO (1) | WO2005038847A1 (ja) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070020330A1 (en) | 2004-11-24 | 2007-01-25 | Medpointe Healthcare Inc. | Compositions comprising azelastine and methods of use thereof |
KR200450613Y1 (ko) * | 2010-04-21 | 2010-10-15 | 공기영 | 램프 |
CN102896439B (zh) * | 2011-07-28 | 2015-08-26 | 北京有色金属研究总院 | 一种Sn-Sb-X系高温无铅焊料 |
TWI431219B (zh) | 2011-08-03 | 2014-03-21 | Cal Comp Electronics & Comm Co | 燈頭、使用此燈頭的燈具、燈頭及燈具的組裝方法 |
JP5807169B2 (ja) * | 2011-09-12 | 2015-11-10 | パナソニックIpマネジメント株式会社 | ランプ |
JP5847520B2 (ja) * | 2011-09-30 | 2016-01-20 | エナジーサポート株式会社 | 磁器と金具との固着用合金及び配電機器 |
JP2013076143A (ja) * | 2011-09-30 | 2013-04-25 | Energy Support Corp | 磁器と金具との固着用合金及び配電機器 |
TWI437185B (zh) | 2011-10-04 | 2014-05-11 | Cal Comp Electronics & Comm Co | 燈頭及使用此燈頭的燈具以及燈頭的組裝方法 |
CN102321831B (zh) * | 2011-10-24 | 2012-11-28 | 南京信息工程大学 | 一种高铺展性锡锑稀土无铅焊料合金及其制备方法 |
JP6319659B2 (ja) * | 2014-07-23 | 2018-05-09 | 岩崎電気株式会社 | 片口金型ランプの製造方法及び装置 |
FR3087368B1 (fr) * | 2018-10-19 | 2020-10-30 | Dehon Sa | Alliage de brasure sans plomb et utilisation d'un tel alliage |
JP7474797B2 (ja) | 2021-03-30 | 2024-04-25 | 株式会社タムラ製作所 | はんだ合金 |
WO2022210271A1 (ja) * | 2021-03-30 | 2022-10-06 | 株式会社タムラ製作所 | はんだ合金 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5185286A (ja) * | 1975-01-24 | 1976-07-26 | Hitachi Ltd | |
JPS54129770A (en) * | 1978-03-30 | 1979-10-08 | Toshiba Corp | Lamp |
JPH0234295A (ja) * | 1988-07-19 | 1990-02-05 | Jw Harris Co Inc | ソルダーコンポジション及びその使用方法 |
JPH03255637A (ja) * | 1990-02-28 | 1991-11-14 | Toshiba Corp | ダイボンディング用半田 |
JPH11151591A (ja) * | 1997-11-19 | 1999-06-08 | Tdk Corp | 高温無鉛はんだ合金 |
JP2002001575A (ja) * | 2000-06-15 | 2002-01-08 | Matsushita Electric Ind Co Ltd | 無鉛半田合金およびこの無鉛半田合金を搭載した回路基板ならびに管球 |
JP2002239781A (ja) * | 2001-02-16 | 2002-08-28 | Ishikawa Kinzoku Kk | 無鉛はんだ合金 |
JP2002245974A (ja) * | 2001-02-16 | 2002-08-30 | Matsushita Electric Ind Co Ltd | 管 球 |
JP2002321084A (ja) * | 2001-04-26 | 2002-11-05 | Sumitomo Metal Mining Co Ltd | 電子部品接合用はんだ合金 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4758407A (en) * | 1987-06-29 | 1988-07-19 | J.W. Harris Company | Pb-free, tin base solder composition |
-
2003
- 2003-10-15 JP JP2003354861A patent/JP2005122970A/ja active Pending
-
2004
- 2004-09-09 CN CNA2004800301889A patent/CN1868022A/zh active Pending
- 2004-09-09 WO PCT/JP2004/013474 patent/WO2005038847A1/ja active Application Filing
- 2004-09-09 US US10/536,701 patent/US7211955B2/en not_active Expired - Fee Related
- 2004-09-09 KR KR1020067006585A patent/KR20060130548A/ko not_active Application Discontinuation
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5185286A (ja) * | 1975-01-24 | 1976-07-26 | Hitachi Ltd | |
JPS54129770A (en) * | 1978-03-30 | 1979-10-08 | Toshiba Corp | Lamp |
JPH0234295A (ja) * | 1988-07-19 | 1990-02-05 | Jw Harris Co Inc | ソルダーコンポジション及びその使用方法 |
JPH03255637A (ja) * | 1990-02-28 | 1991-11-14 | Toshiba Corp | ダイボンディング用半田 |
JPH11151591A (ja) * | 1997-11-19 | 1999-06-08 | Tdk Corp | 高温無鉛はんだ合金 |
JP2002001575A (ja) * | 2000-06-15 | 2002-01-08 | Matsushita Electric Ind Co Ltd | 無鉛半田合金およびこの無鉛半田合金を搭載した回路基板ならびに管球 |
JP2002239781A (ja) * | 2001-02-16 | 2002-08-28 | Ishikawa Kinzoku Kk | 無鉛はんだ合金 |
JP2002245974A (ja) * | 2001-02-16 | 2002-08-30 | Matsushita Electric Ind Co Ltd | 管 球 |
JP2002321084A (ja) * | 2001-04-26 | 2002-11-05 | Sumitomo Metal Mining Co Ltd | 電子部品接合用はんだ合金 |
Also Published As
Publication number | Publication date |
---|---|
CN1868022A (zh) | 2006-11-22 |
JP2005122970A (ja) | 2005-05-12 |
US7211955B2 (en) | 2007-05-01 |
KR20060130548A (ko) | 2006-12-19 |
US20060061281A1 (en) | 2006-03-23 |
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