WO2005027206A1 - 定盤、ステージ装置及び露光装置 - Google Patents
定盤、ステージ装置及び露光装置 Download PDFInfo
- Publication number
- WO2005027206A1 WO2005027206A1 PCT/JP2004/013475 JP2004013475W WO2005027206A1 WO 2005027206 A1 WO2005027206 A1 WO 2005027206A1 JP 2004013475 W JP2004013475 W JP 2004013475W WO 2005027206 A1 WO2005027206 A1 WO 2005027206A1
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- WO
- WIPO (PCT)
- Prior art keywords
- surface plate
- stage
- mask
- substrate
- ceramics
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/14—Lapping plates for working plane surfaces characterised by the composition or properties of the plate materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/14—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings
- B24D3/16—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic ceramic, i.e. vitrified bondings for close-grained structure, i.e. of high density
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
Definitions
- the present invention relates to a surface plate, a stage device, and an exposure device.
- the step-and-scan type scanning projection exposure apparatus includes a mask stage device capable of moving a mask in the Y direction.
- stage devices are provided with a stage body for supporting a substrate or a mask, a surface plate having a support surface for supporting the stage body, and a mounting surface provided between the surface plate and the mounting surface of the surface plate. Equipped with a vibration isolator to block vibration (external vibration).
- the stage main body is provided with a fluid bearing that supports the stage main body in a non-contact manner with respect to the support surface of the surface plate. The mechanism makes it possible to move without contact with the surface plate.
- the surface plate when the surface of the surface plate is rough, the reaction force generated when air is injected onto the surface of the surface plate is not stable, and the stage body is not stable especially when the stage body moves. Failure occurs. Therefore, by making the surface plate made of ceramics, the stability of the stage body can also be improved. However, ceramics have a large heat shrinkage, and if they are to be made larger, they will crack during the firing process. For this reason, it is considered difficult to increase the size. In recent years, exposure systems have been proposed that support the two stage bodies in a non-contact manner on the support surface of a single surface plate. In the future, the size of the surface plate will increase (for example, several meters square). Is expected to advance.
- the present invention has been made in view of the above-mentioned problems, and has a flat supporting surface, and can be easily enlarged, and has improved fracture toughness.
- An object is to provide an exposure apparatus provided with the stage device.
- the surface plate according to the present invention adopting such a configuration, the surface plate is formed by a composite material of the main material made of ceramics and the auxiliary material made of metal, so that the supporting surface, which is a characteristic of ceramics, is formed.
- a platen having flatness and high fracture toughness, which is a characteristic of metal, can be obtained.
- the platen formed by the composite substance (A) with the auxiliary substance (b) is provided.
- a platen formed by the composite substance (A) with the substance (b) is provided.
- the second and third aspects of the present invention as in the first aspect, it is possible to provide a surface plate having flatness and high fracture toughness of the support surface and easy to increase in size.
- an exposure method for exposing a pattern on a substrate held in a stage comprising: a composite material of a main material made of ceramics and an auxiliary material made of metal. An exposure method is provided in which the stage is movably supported by the formed surface plate, and the pattern is exposed during the movement of the stage.
- FIG. 1 is a diagram showing a schematic configuration of an exposure apparatus EX according to an embodiment of the present invention.
- FIG. 2 is a diagram schematically showing a cross section of the mask surface plate 3 according to one embodiment of the present invention.
- FIG. 3 is an external perspective view of the mask stage device 1 according to one embodiment of the present invention.
- FIG. 4 is a diagram schematically showing a cross section of the substrate surface plate 4 according to one embodiment of the present invention.
- FIG. 5 is an external perspective view of the substrate stage device 2 according to one embodiment of the present invention.
- FIG. 6 is a flowchart illustrating an example of a semiconductor device manufacturing process. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 is a schematic configuration diagram of an exposure apparatus EX including a stage apparatus according to the present invention as a mask stage apparatus 1 and a substrate stage apparatus 2.
- the exposure apparatus EX is a so-called scanning stepper that transfers a pattern provided on the mask M onto the substrate P via the projection optical system PL while moving the mask M and the substrate P synchronously.
- the direction that coincides with the optical axis AX of the projection optical system PL is the Z axis direction
- the synchronous movement direction (scanning direction) in a plane perpendicular to the Z axis direction is the Y axis direction, the Z axis direction, and the Y axis.
- the direction perpendicular to the direction (non-scanning direction) is the X-axis direction.
- an exposure apparatus EX includes an illumination optical system I for illuminating a rectangular (or on an arc) illumination area on a mask (reticle) M with exposure light EL emitted from a light source (not shown).
- a mask stage apparatus 1 having a mask stage body MST that moves while holding a mask (reticle) M and a mask surface plate 3 that supports the mask stage body MST.
- the exposure apparatus EX includes a projection optical system P for projecting the exposure light EL transmitted through the mask (reticle) M onto the substrate P, a substrate stage body PST that holds and moves the substrate P, and a substrate stage body PST.
- a substrate stage device 2 having a substrate surface plate 4 that supports the PST.
- the exposure apparatus EX includes an illumination optical system I, a reaction frame 5 that supports the mask stage apparatus 1 and the projection optical system PL, and a control apparatus C0NT that controls the operation of the exposure apparatus EX. I have.
- the reaction frame 5 is installed on a base plate 6 placed horizontally on the floor, and the upper and lower sides of the reaction frame 5 have stepped portions 5a and 5b projecting inward. Each is formed.
- the mask surface plate 3 of the mask stage device 1 is configured as a surface plate according to the present invention. In each corner, a step portion 5 a of the reaction frame 5 is provided via a vibration isolating unit 8 to a reaction frame 5. It is supported almost horizontally. Further, an opening 3a through which the pattern image of the mask M passes is provided at the center of the mask base 3.
- the mask stage body MST is provided on the support surface 3 b of the mask surface plate 3, and the mask stage body MS At the center of T, there is provided an opening K which communicates with the opening 3a of the mask platen 3 and through which the pattern image of the mask ⁇ passes.
- a plurality of air bearings 9 are provided on the bottom surface of the mask stage body MST, which are fluid bearings for supporting the mask stage body MST in a non-contact manner with respect to the mask surface plate 3.
- the mask stage body MST is an air bearing. The air is blown out from the support surface 3b of the mask base 3 via a predetermined clearance by air blown out from the base plate 9.
- the anti-vibration unit 8 includes an air mount 8a (gas spring) capable of adjusting the internal pressure, and a voice coil motor 8b (for driving the mask base 3 in a direction crossing the support surface 3b of the mask base 3).
- the vibration isolating unit 8 allows micro vibration transmitted to the mask base 3 via the base plate 6 and the reaction frame 5 to be insulated at the microphone G level (G is a gravitational acceleration).
- FIG. 2 is a diagram schematically showing a cross section of the mask surface plate 3. As shown in FIG. 2, the mask surface plate 3 is formed of a composite material A (Metal Matrix Composite) including a main material a made of ceramics and an auxiliary material b made of metal.
- A Metal Matrix Composite
- the main substance a means a main component of the components constituting the surface plate, for example, a component occupying 50% or more by weight
- the auxiliary substance b means an auxiliary material among the components constituting the surface plate.
- Components for example components that account for less than 50% by weight.
- the ceramics constituting the main substance include silicon carbide, boron carbide (B 4 C, etc.), aluminum oxide (alumina), aluminum nitride (A 1 N), and the like.
- the metal constituting the auxiliary substance b include aluminum, magnesium, titanium, zirconia, and copper.
- the metal may include not only one kind but also two or more kinds at the same time. Further, the metal may be contained in the form of an alloy.
- carbon fiber may be used as the main substance, and silicon (Si), carbon, or silicon carbide may be used as the auxiliary substance.
- the main material and the auxiliary material may be composed of different ceramics.
- boron carbide can be used as the main substance and silicon carbide can be used as the auxiliary substance.
- the composite material A contains 70% of silicon carbide (SiC) as the main material a and 30% of aluminum (A1) as the auxiliary material b. .
- Such a composite material A has a rigidity (Young's modulus) of 350 GPa, a thermal conductivity of 200 W / (m ⁇ K), a specific gravity of 3.00, and a fracture toughness of 5.5MPa ⁇ m °- It is 5 .
- iron has a specific gravity of 7.8 and a Young's modulus of 210 GPa.
- the mask surface plate 3 formed of the composite material A is lighter and more rigid than the surface plate formed of iron.
- Alumina (ceramics) has a specific gravity of 3.8 and a Young's modulus of 380 GPa.
- the mask surface plate 3 is lighter in weight than the surface plate formed of alumina. Therefore, the size of the air mount 8a and the voice coil motor 8b constituting the vibration isolating unit 8 can be reduced. Further, since the heat generated by the voice coil motor 8b can be suppressed, highly accurate exposure can be realized. As can be seen from the comparison of the Young's modulus described above, the rigidity of the mask surface plate 3 is lower than that of the surface plate formed of alumina. However, compared to the surface plate formed by iron, the rigidity is sufficiently improved. Further, fracture toughness of alumina 3. 5MP a ⁇ m ° - relative to a 5 is the fracture toughness of the composite substance A is 5. 5MP a ⁇ m ° 5.
- the mask platen 3 formed by the composite material A can obtain higher fracture toughness as compared with the platen formed by alumina.
- the mask platen 3 formed by the composite material A has a higher thermal conductivity than the platen formed by aluminum iron (the thermal conductivity of alumina is 20 W / (m ⁇ K), the thermal conductivity of iron 80.3 W / (m ⁇ K)). For this reason, the temperature of the mask surface plate 3 is made uniform.
- Such a mask surface plate 3 is formed by a method in which silicon carbide (S “iC) is carbonized (C) and permeated into A1Si, and aluminum (A1) is added to silicon carbide (SiC). It is formed by a method of pressing with a high-temperature press (melt forging method), a method of infiltrating A1-Si into silicon carbide (SiC) (non-pressure infiltration method), etc.
- FIG. 3 shows the exposure apparatus EX according to the present embodiment.
- Fig. 4 is an external perspective view of a mask stage device 1 provided with a mask surface plate 3.
- the mask stage body MST includes an L-shaped roughly moving stage section 70 and a rectangular frame as shown in Fig. 3. It is configured to include a fine movement stage 7 1 are arranged side by side on the support surface 3b of the mask base plate 3 having a size of about m via air bearings 9.
- Three linear motors 72 to 74 for fine movement are provided, of which two linear motors 72 and 73 are used for fine movement in the scanning direction (Y direction) during step & scan exposure.
- the linear motor 74 generates thrust for fine movement in the non-scanning direction (X direction), and a single linear motor 74 generates thrust for fine movement in the non-scanning direction (X direction).
- an extremely large thrust is generated in the scanning direction as compared with the non-scanning direction.
- the scanning direction By providing by appropriately spaced two Riniamo evening 7 2, 7 3 which generates thrust in the non-scanning direction, the coarse movement stage unit 7 0
- the fine movement stage 71 can be finely moved in the Y and 0 directions at a sufficient response speed against the acceleration.
- the permanent magnet unit is fixed to the fine movement stage 71 side
- the coil unit is fixed to the coarse movement stage 70 side. It is composed of the MM type (moving magnet type), but this is not necessarily an essential configuration. In some cases, all or some of the three units have the MC unit and the coil unit inverted. (Moving coil) type.
- a linear motor for moving the coarse movement stage 70 large ⁇ a cylindrical stator 7 in which a large number of disk-shaped or donut-shaped strong permanent magnets are stacked in the Y direction in a cylindrical case.
- a normal linear motor may be used instead of the shaft type linear motor.
- each of the stators 75b, 76b of the shaft type linear motors 75, 76 is connected to a linear slider type air bearing member 77a, 77b and an air bearing member 78.
- the masks are fixed to a and 78b, respectively, and are configured to be linearly movable in the Y direction along the surfaces of guides 3c and 3d formed on both sides of the mask surface plate 3.
- the air bearing members 77a, 77b are fixed to both ends of the stator 75b in the longitudinal direction
- the air bearing members 78a, 78b are fixed to both ends of the stator 76b in the longitudinal direction. Fixed to.
- the stator 75b and the air bearing members 77a, 77b are configured so as to be integrally movable on the mask platen 3 in the Y direction as the first counter mass 79a.
- the 76 b and the air bearing members 78 a and 78 b are configured to be integrally movable on the mask base 3 in the Y direction as a second counter mass 79 b.
- the first and second counter masses 79a and 79b are moved in one Y direction (opposite direction) by the reaction force when the mask stage body MST moves in the + Y direction based on the law of conservation of momentum. Move to By making the weight of the first and second counter masses 79a and 79b heavier than the weight of the mask stage body MST, the amount of movement of the first and second counter masses 79a and 79b is increased. Therefore, the exposure apparatus EX can be downsized.
- the exposure apparatus EX can be made more compact. be able to. Further, the vibration isolating unit 8 is not enlarged.
- a linear moving mirror (not shown) mounting part 83 and two corners are provided for length measurement by a laser interferometer which forms a part of the position measuring part. —Placement portions 84 and 85 of mirrors (not shown) are formed.
- the mask stage device 1 includes a linear encoder set 88a on an air bearing member 77a forming a part of the counter mass 79a.
- the linear encoder set 88b is attached to an air bearing member 78a which forms a part of the counter mass 79b.
- the linear encoder set 88a includes a reading head 86a and a scale 87a, and the reading head 86a is fixed to the air bearing member 77a, and the scale 8 7a is fixed to the mask surface plate 3.
- the linear encoder set 88b includes a reading head 86b and a scale 87b, and the reading head 86b is fixed to the air bearing member 78a.
- the scale part 87 b is fixed to the mask surface plate 3. Furthermore, as a linear motor for moving the counter masses 79a and 79b independently in the Y direction, linear motor sets 91a and 91b are attached to the air bearing members 77b and 78b, respectively. I have.
- the linear motor set 91a includes a stator 89a and a mover 90a, the mover 90a is fixed to the air bearing member 77b, and the stator 89a is fixed to the air bearing member 77b. It is fixed to the side of the mask surface plate 3. Further, the linear motor set 91b includes a stator 89b and a mover 90b.
- the moving element 90 b is fixed to the air bearing member 78 b, and the stator 89 b is fixed to the side of the mask platen 3.
- These linear motor sets 91a and 91b are either of the VCM (voice coil motor) type, which uses Lorentz force as a thrust, or the electromagnetic type (such as a sonar motor), which uses a reactance force as a thrust (driving force).
- the stator 89a and the mover 90a may be attached to any one of them, and the stator 49b and the mover 90b may be attached to any of them.
- the air bearing is used to make the larger one of the stators 89a and 89b and the mover 90a and 90b a part of the mass of the counter mass 79a and 79b. It is preferable to provide it on the member 78a, 78b side.
- the exposure apparatus EX measures the distance between each movable mirror using three laser interferometers (both not shown) that irradiate the movable mirror with a measurement beam, thereby obtaining the X-axis of the mask stage body MST. Axis, Y axis, and position in the 0 Z direction are detected with high accuracy.
- the controller CONT passes through mask-type linear motors 75 and 76 and fine-movement linear motors 72 to 74, and a mask supported on the fine-movement stage 71. Controls the position of M (mask stage body MST). Since the mask stage device 1 configured as described above includes the mask surface plate 3 formed of the composite substance A, the mask surface plate 3 and the mask stage body MST come into contact with each other in the event of an accident of the mask stage device 1. In this case, the damage to the mask surface plate 3 is suppressed. In addition, the mask surface plate 3 formed of the composite substance A is about 30% lighter than the surface plate formed of aluminum, so that the response of the mask surface plate 3 to the vibration isolating unit 8 is improved. You.
- the mask surface plate 3 formed of the composite material A has a high thermal conductivity, so that, for example, a linear motor for fine movement 72 to 74 or a shaft type linear motor 75 , 76 efficiently absorbs the heat generated. For this reason, the possibility of air fluctuation occurring around the mask stage device 1 is reduced, and the position of the mask stage main body MST can be measured more accurately by the laser interferometer. It is preferable that the mask stage body MST and the air bearing 9 are also formed of the composite material ⁇ . By forming the mask stage body MST and the air bearing 9 with the composite material A, the mask stage body MST can be lightened, so that the operability of the mask stage body MST can be improved.
- the mask stage body MST and the air bearing 9 are formed of the composite material A, the mask base 3, the mask stage body MST and the respective components of the composite material A forming the air bearing 9 (main substance a
- the proportions of the auxiliary substances b) need not be identical.
- the pattern image of the mask M that has passed through the opening K and the opening 3a enters the projection optical system PL.
- the projection optical system PL is composed of a plurality of optical elements, and these optical elements are supported by a lens barrel.
- the projection optical system PL is a reduction system having a projection magnification of, for example, 1/4 or 1/5.
- the projection optical system PL may be either a unity magnification system or a magnification system.
- a flange 10 integrated with the lens barrel is provided on the outer circumference of the lens barrel of the projection optical system PL.
- the projection optical system PL has a flange portion 10 engaged with a lens barrel base plate 12 supported substantially horizontally by a step portion 5b of the reaction frame 5 via an anti-vibration unit 11.
- the configuration of the vibration isolation unit 11 is basically the same as the configuration of the vibration isolation unit 8.
- the substrate stage device 2 guides the substrate stage main body PS and the substrate stage main body PST movably in a two-dimensional direction along the XY plane and the substrate stage main body PST in the X-axis direction.
- the X guide stage 35 which is movably supported while moving, and the X linear motor 40 (drive mechanism), which is provided on the X guide stage 35 and can move the substrate stage body PST in the X-axis direction, It has a pair of Y linear motors 30 and 30 (drive mechanism) that can move the guide stage 35 in the Y-axis direction.
- the substrate stage body PST has a substrate holder PH for holding the substrate P by vacuum suction, and the substrate P is supported by the substrate stage body PST via the substrate holder PH.
- a plurality of air bearings 37 which are fluid bearings for supporting the substrate stage body PST in a non-contact manner with respect to the substrate surface plate 4, are provided on the bottom surface of the substrate stage body PST, and are ejected from these air bearings 37.
- the substrate stage PST is floated and supported on the supporting surface 4a of the substrate surface plate 4 via a predetermined clearance by the air.
- the substrate surface plate 4 has a size of about 1 mx 1 m, and is supported substantially horizontally above the base plate 6 via a vibration isolating unit 13.
- the anti-vibration unit 13 includes an air mount 13 a (gas spring) whose internal pressure can be adjusted, and a voice coil motor 13 3 that drives the board surface plate 4 in a direction intersecting the support surface 4 a of the board surface plate 4. b (work overnight) are arranged in parallel on the base plate 6.
- the micro vibration transmitted to the substrate surface plate 4 via the base plate 6 is insulated at the microphone ⁇ G level.
- FIG. 4 is a diagram schematically showing a cross section of the substrate surface plate 4.
- the substrate surface plate 4 is formed of a composite material A including a main material a made of ceramics and an auxiliary material b made of metal.
- FIG. 5 is a schematic perspective view of the substrate stage device 2 having the substrate surface plate 4.
- the substrate stage device 2 has an X guide stage 35 having a long shape along the X-axis direction, and a PST body PST guided by the X guide stage 35.
- the X guide motor 35 is provided at both ends in the longitudinal direction of the X linear motor 40 that can move at a predetermined stroke in the X axis direction, and the X guide stage 35 is attached to the Y axis together with the substrate stage body PST. And a pair of Y linear motors 30 and 30 movable in the directions.
- the X linear motor 40 is provided with a stator 41 composed of a coil unit provided on the X guide stage 35 so as to extend in the X-axis direction, and is provided corresponding to the stator 41, and includes a substrate stage body.
- a mover 42 made of a magnet unit fixed to the PST is provided.
- a moving magnet type linear motor 40 is composed of the stator 41 and the mover 42, and the moving element 42 is driven by electromagnetic interaction with the stator 41.
- the board stage body PST moves in the X-axis direction.
- the substrate stage body PST is supported in a non-contact manner by a magnetic guide comprising a magnet and an actuator that maintains a predetermined gap in the Z-axis direction with respect to the X guide stage 35.
- Each of the pair of Y linear motors 30 includes a mover 32 formed of a magnet unit provided at both ends in the longitudinal direction of an X guide stage 35, and a coil unit provided corresponding to the mover 32. And a stator 3 1 consisting of Here, the stator 31 is provided on a support portion 36 (see FIG. 1) projecting from the base plate 6. In FIG. 1, the stator 31 and the mover 32 are illustrated in a simplified manner.
- a moving magnet type linear motor 30 is constituted by the stator 31 and the mover 32, and is driven by electromagnetic interaction between the mover 32 and the stator 31.
- the X guide stage 35 moves in the Y axis direction. Further, by adjusting the drive of each of the Y linear motors 30 and 30, the X guide stage 35 can be rotated in the ⁇ Z direction. Therefore, this Y linear motor 30 Thus, the substrate stage body PST can move in the ⁇ -axis direction and the ⁇ -axis direction almost integrally with the X guide stage 35. Since the substrate stage device 2 configured as described above includes the substrate surface plate 4 formed of the composite material ⁇ ⁇ , the substrate surface plate 3 and the substrate stage main body PST come into contact with each other in an accidental accident of the substrate stage device 2. Even in this case, breakage of the substrate surface plate 4 is suppressed.
- the board surface plate 4 formed of the composite material A is about 30% lighter than the surface plate formed of alumina, so that the board surface plate 4 for the vibration isolation unit 13 (see Fig. 1) is used. Responsiveness is improved.
- the substrate stage body PST and the air bearing 37 are also formed of the composite material A. By forming the substrate stage main body PST and the air bearing 37 from the composite material A, the substrate stage main body PST can be lightened, so that the operability of the substrate stage main body PST can be improved.
- each component of the composite material A forming the substrate surface plate 4, the substrate stage body PST and the air bearing 37 (mainly The proportions of substance a and auxiliary substance b) need not be identical. Further, it is not necessary that the components and ratios of the composite substances A forming the mask surface plate 3 and the substrate surface plate 4 are the same. It is effective to use composite substance A for a surface plate exceeding 1 m 2 , such as a mask surface plate 3 or a substrate surface plate 4.
- an X-moving mirror 51 extending along the Y-axis direction is provided at a side edge on the X side of the substrate stage body PST, and a laser is provided at a position facing the X-moving mirror 51.
- the laser interferometer 50 irradiates laser light (detection light) to each of the reflecting surface of the X-moving mirror 51 and the reference mirror 52 provided at the lower end of the projection optical system PL tube.
- a Y movable mirror 53 (not shown in FIG. 1, see FIG. 5) is provided.
- ⁇ A laser interferometer (not shown) is provided at a position facing the movable mirror 53.
- the laser interferometer irradiates laser light toward each of the reflecting surface of the moving mirror 53 and a reference mirror (not shown) provided at the lower end of the lens barrel of the projection optical system PL, and reflects the reflected light and the incident light.
- ⁇ ⁇ By measuring the relative displacement between the moving mirror and the reference mirror based on the interference with the ⁇ , the position of the substrate stage body PS ⁇ and thus the substrate ⁇ in the ⁇ axis direction is detected in real time with a predetermined resolution.
- the detection result of the laser interferometer is output to the control device C ⁇ ⁇ ⁇ , and the control device CON ⁇ is controlled based on the detection result of the laser interferometer via the linear motors 30 and 40 to control the board stage PST. Is performed.
- the substrate surface plate 4 formed of the composite material A has a high thermal conductivity. For this reason, the substrate surface plate 4 efficiently absorbs, for example, heat generated in the linear motors 30, 40, and reduces the possibility of air fluctuations around the base stage device 2. Therefore, the position of the substrate stage body PST can be measured more accurately by the laser interferometer.
- the preferred embodiments of the exposure apparatus according to the present invention have been described with reference to the accompanying drawings, but it is needless to say that the present invention is not limited to the above embodiments. It is obvious that a person skilled in the art can come up with various changes or modifications within the scope of the technical idea described in the claims, and such changes and modifications are naturally within the technical scope of the present invention. It is understood to belong.
- the auxiliary substance b includes aluminum.
- the surface plate according to the present invention is not limited to this, and the auxiliary substance b may include magnesium.
- the configuration is adopted in which the Y linear motors 30 and 30 are supported by the base plate 6 via the support portions 36 and 36.
- the stage device according to the present invention is not limited to this.
- a configuration may be adopted in which the Y linear motors 30, 30 are directly supported by the board surface plate 4 without going through.
- a counter mass for absorbing a reaction force generated when the linear motors 30 move may be provided on the substrate surface plate 4 of the substrate stage device 2.
- the substrate stage device 2 is not limited to one having a single substrate stage body PST, and may be a so-called twin stage device having two substrate stage bodies.
- the structure and the exposure operation of a twin-stage type exposure apparatus are described in, for example, Japanese Patent Application Laid-Open Nos. 10-163099 and 10-214783 (corresponding to US Pat. Nos. 6,341,007, 6,400,441,6).
- both the mask surface plate 3 and the substrate surface plate 4 are formed of the composite material A, but only one of them may be formed of the composite material A. Also, all of the mask surface plate 3 and the substrate surface plate 4 may not be formed of the composite material A.For example, only the portions corresponding to the supporting surfaces 3b and 4a may be formed of the composite material A. Is also good.
- the substrate P of the above embodiment is not limited to a semiconductor wafer for a semiconductor device, but also a glass substrate for a liquid crystal display device, a ceramic wafer for a thin-film magnetic head, or a mask or reticle used in an exposure apparatus.
- Original plate synthetic quartz, silicon wafer
- the exposure apparatus EX includes a step-and-scan type scanning exposure apparatus that scans and exposes the pattern of the mask M by synchronously moving the mask M and the substrate P.
- the mask M and the substrate P are stationary.
- the method can be applied to a step-and-repeat type projection exposure apparatus in which the pattern of the mask M is exposed in this state and the substrate P is sequentially stepped.
- the type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor device that exposes a semiconductor device pattern onto a substrate P, but is used for manufacturing a liquid crystal display element that exposes a liquid crystal display element pattern onto a square glass plate.
- the present invention can be widely applied to an exposure apparatus, an exposure apparatus for manufacturing a thin-film magnetic head, an imaging device (CCD), a mask, and the like.
- emission lines g-line (436 nm), h-line (404.7 nm), i-line (365 nm)
- a r F excimer laser (1 93 nm) not only the F 2 laser (1 57 nm)
- Ru can be uses charged particle beams such as X-ray or electron beam.
- thermionic emission type lanthanum hexaborite (LaB6) or tantalum (Ta) can be used as the electron gun.
- a structure using a mask M may be used, or a pattern may be formed directly on the substrate P without using the mask M.
- a high frequency such as a YAG laser or a semiconductor laser may be used.
- the projection optical system PL using a material which transmits far ultraviolet rays such as quartz and fluorite as the glass material when using far ultraviolet rays such as excimer one
- an optical system of a refraction system is used (a mask M is also of a reflection type).
- an electron optical system including an electron lens and a deflector may be used as the optical system.
- the present invention can also be applied to a proximity exposure apparatus that exposes the pattern of the mask M by bringing the mask M and the substrate P into close contact.
- the exposure apparatus EX of the present embodiment as described above performs various subsystems including each component listed in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. It is manufactured by assembling. Before and after this assembly, adjustments to achieve electrical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electrical systems before and after assembly to ensure these various accuracy levels Adjustments are made to achieve electrical accuracy.
- the process of assembling the exposure device from the various subsystems includes the mechanical connection, the wiring connection of the electric circuit, and the wiring connection of the pneumatic circuit among the various subsystems. It goes without saying that there is an individual assembly process for each subsystem before the assembly process from these various subsystems to the exposure apparatus EX. After the assembly of the various subsystems into the exposure apparatus EX is completed, comprehensive adjustments are made to ensure the various accuracy of the entire exposure apparatus EX. It is desirable that the manufacture of the exposure apparatus EX be performed in a clean room in which the temperature, cleanliness, etc. are controlled. Then, as shown in Fig.
- a device such as a semiconductor element is subjected to step 201 for designing the function and performance of the device, step 202 for creating a mask (reticle) based on this design step, and silicon material.
- step 2 of manufacturing a wafer from a wafer Wafer processing step 204 of exposing a reticle pattern to a wafer by the exposure apparatus according to the present invention, Device assembling step (including dicing step, bonding step, and package step) 2 0 5, inspection step 206, etc.
- INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a surface plate that has a flat supporting surface, can be easily increased in size, and has improved fracture toughness.
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- Inorganic Chemistry (AREA)
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Abstract
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JP2005513950A JPWO2005027206A1 (ja) | 2003-09-11 | 2004-09-09 | 定盤、ステージ装置及び露光装置 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170087953A (ko) * | 2014-11-28 | 2017-07-31 | 에이에스엠엘 네델란즈 비.브이. | 인코더, 위치 측정 시스템 및 리소그래피 장치 |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60144689A (ja) * | 1984-01-09 | 1985-07-31 | 株式会社ミツトヨ | 定盤およびその製造方法 |
JPH06331870A (ja) * | 1993-05-25 | 1994-12-02 | Nippon Oil Co Ltd | 光学機器用定盤 |
JPH07142558A (ja) * | 1994-03-14 | 1995-06-02 | Canon Inc | ステージ装置 |
JPH10303112A (ja) * | 1997-04-22 | 1998-11-13 | Canon Inc | 投影露光装置 |
JP2000182945A (ja) * | 1998-12-18 | 2000-06-30 | Kyocera Corp | 半導体露光装置用部材 |
JP2000288916A (ja) * | 1999-04-05 | 2000-10-17 | Ngk Insulators Ltd | 研磨処理用治具 |
JP2001358178A (ja) * | 2000-06-13 | 2001-12-26 | Taiheiyo Cement Corp | Xyステージ |
JP2002167291A (ja) * | 2000-11-28 | 2002-06-11 | Taiheiyo Cement Corp | ステージ部材 |
JP2003179127A (ja) * | 2001-12-11 | 2003-06-27 | Taiheiyo Cement Corp | 静電チャック用給電端子 |
JP2003232352A (ja) * | 2002-02-06 | 2003-08-22 | Nikon Corp | エアパッド、このエアパッドを用いたステージ装置及びこのステージ装置を備える露光装置 |
-
2004
- 2004-09-09 JP JP2005513950A patent/JPWO2005027206A1/ja active Pending
- 2004-09-09 WO PCT/JP2004/013475 patent/WO2005027206A1/ja active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60144689A (ja) * | 1984-01-09 | 1985-07-31 | 株式会社ミツトヨ | 定盤およびその製造方法 |
JPH06331870A (ja) * | 1993-05-25 | 1994-12-02 | Nippon Oil Co Ltd | 光学機器用定盤 |
JPH07142558A (ja) * | 1994-03-14 | 1995-06-02 | Canon Inc | ステージ装置 |
JPH10303112A (ja) * | 1997-04-22 | 1998-11-13 | Canon Inc | 投影露光装置 |
JP2000182945A (ja) * | 1998-12-18 | 2000-06-30 | Kyocera Corp | 半導体露光装置用部材 |
JP2000288916A (ja) * | 1999-04-05 | 2000-10-17 | Ngk Insulators Ltd | 研磨処理用治具 |
JP2001358178A (ja) * | 2000-06-13 | 2001-12-26 | Taiheiyo Cement Corp | Xyステージ |
JP2002167291A (ja) * | 2000-11-28 | 2002-06-11 | Taiheiyo Cement Corp | ステージ部材 |
JP2003179127A (ja) * | 2001-12-11 | 2003-06-27 | Taiheiyo Cement Corp | 静電チャック用給電端子 |
JP2003232352A (ja) * | 2002-02-06 | 2003-08-22 | Nikon Corp | エアパッド、このエアパッドを用いたステージ装置及びこのステージ装置を備える露光装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170087953A (ko) * | 2014-11-28 | 2017-07-31 | 에이에스엠엘 네델란즈 비.브이. | 인코더, 위치 측정 시스템 및 리소그래피 장치 |
JP2017537314A (ja) * | 2014-11-28 | 2017-12-14 | エーエスエムエル ネザーランズ ビー.ブイ. | エンコーダ、位置測定システム、及びリソグラフィ装置 |
US10768025B2 (en) | 2014-11-28 | 2020-09-08 | Asml Netherlands B.V. | Encoder, position measurement system and lithographic apparatus involving an enclosing device |
KR102548833B1 (ko) * | 2014-11-28 | 2023-06-28 | 에이에스엠엘 네델란즈 비.브이. | 인코더, 위치 측정 시스템 및 리소그래피 장치 |
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JPWO2005027206A1 (ja) | 2006-11-24 |
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