WO2005013189A3 - Verfahren zur herstellung von rfid etiketten - Google Patents
Verfahren zur herstellung von rfid etiketten Download PDFInfo
- Publication number
- WO2005013189A3 WO2005013189A3 PCT/EP2004/008126 EP2004008126W WO2005013189A3 WO 2005013189 A3 WO2005013189 A3 WO 2005013189A3 EP 2004008126 W EP2004008126 W EP 2004008126W WO 2005013189 A3 WO2005013189 A3 WO 2005013189A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- aim
- rfid labels
- producing rfid
- producing
- label
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F17/00—Printing apparatus or machines of special types or for particular purposes, not otherwise provided for
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/01—Tools for processing; Objects used during processing
- H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
- H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0534—Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/18—Surface bonding means and/or assembly means with handle or handgrip
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Printing Methods (AREA)
- Making Paper Articles (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006520781A JP2006528803A (ja) | 2003-08-01 | 2004-07-21 | Rfidラベルを製造する方法 |
EP04763368A EP1654125A2 (de) | 2003-08-01 | 2004-07-21 | Verfahren zur herstellung von rfid etiketten |
US10/566,594 US20070039694A1 (en) | 2003-08-01 | 2004-07-21 | Method for producing rfid labels |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10335230.9 | 2003-08-01 | ||
DE10335230A DE10335230A1 (de) | 2003-08-01 | 2003-08-01 | Verfahren zur Herstellung von RFID Etiketten |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005013189A2 WO2005013189A2 (de) | 2005-02-10 |
WO2005013189A3 true WO2005013189A3 (de) | 2005-08-18 |
Family
ID=34072017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/008126 WO2005013189A2 (de) | 2003-08-01 | 2004-07-21 | Verfahren zur herstellung von rfid etiketten |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070039694A1 (de) |
EP (1) | EP1654125A2 (de) |
JP (2) | JP2006528803A (de) |
DE (1) | DE10335230A1 (de) |
WO (1) | WO2005013189A2 (de) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004007458A1 (de) * | 2004-02-13 | 2005-09-01 | Man Roland Druckmaschinen Ag | Verfahren zur Herstellung von RFID Etiketten |
DK1699637T3 (en) | 2003-08-01 | 2015-02-16 | Manroland Web Systems Gmbh | PROCEDURE AND DEVICE FOR ADDITIONAL PRESSURE WITH ELECTRIC LEADERS |
DE102005026127B4 (de) | 2005-06-07 | 2007-02-08 | Koenig & Bauer Ag | Druckmaschine und ein Verfahren zur Herstellung eines Druckerzeugnisses |
DE102005041221A1 (de) * | 2005-08-31 | 2007-03-01 | Krones Ag | Herstellung von Etiketten mit RFID-Transpondern |
DE102007027473A1 (de) | 2007-06-14 | 2008-12-18 | Manroland Ag | Drucktechnisch hergestellte funktionale Komponenten |
FR2918485B1 (fr) * | 2007-07-04 | 2010-09-10 | Arjowiggins Licensing Sas | Support fibreux pour insert comportant une antenne |
DE102008039660A1 (de) * | 2007-09-06 | 2009-03-12 | Heidelberger Druckmaschinen Ag | Bedruckstoff bearbeitende Maschine und Verfahren in einer Bedruckstoff bearbeitenden Maschine |
DE102008001922A1 (de) | 2008-05-21 | 2009-11-26 | Manroland Ag | Integration eines RFID-Transponders in Verpackungen |
Citations (10)
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DE1245993B (de) * | 1959-08-17 | 1967-08-03 | Stanley F Reed | Verfahren und Vorrichtung zum Drucken eines Musters auf ein Traegermaterial |
DE1571834A1 (de) * | 1965-05-26 | 1971-02-18 | Formica Internat Ltd | Farbdruckverfahren |
EP0570062A1 (de) * | 1992-05-11 | 1993-11-18 | N.V. Nederlandsche Apparatenfabriek NEDAP | Konktaktlose elektronische Transponderkarte |
US5366760A (en) * | 1990-04-12 | 1994-11-22 | Matsushita Electric Industrial Co., Ltd. | Conductive ink composition and method of forming a conductive thick film pattern |
US5426074A (en) * | 1992-03-23 | 1995-06-20 | Brody; Thomas P. | Process for fabricating an active matrix circuit |
WO1996040443A1 (en) * | 1995-06-07 | 1996-12-19 | Img Group Limited | A press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid and a method for making such a press |
WO2001037623A1 (de) * | 1999-11-17 | 2001-05-25 | Stork Gmbh | Verfahren zum herstellen von leiterbildern |
WO2002058080A1 (en) * | 2001-01-22 | 2002-07-25 | Metso Corporation | Layered structure, sensor and method of producing and use of the same |
EP1295733A1 (de) * | 2001-09-24 | 2003-03-26 | Gather Formulare | Formblatt, sowie Verfahren zum Herstellen eines Formblattes mit integriertem RFID-Transponder |
WO2003030300A1 (fr) * | 2001-09-28 | 2003-04-10 | Mitsubishi Materials Corporation | Bobine antenne et etiquette d'utilisation rfid l'utilisant, antenne d'utilisation de transpondeur |
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FR2610571B1 (fr) * | 1987-02-10 | 1989-07-13 | Sarda Jean Claude | Presse a imprimer offset permettant d'imprimer simultanement ou successivement en feuille a feuille ou en bande continue |
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JP2002308257A (ja) * | 2001-04-10 | 2002-10-23 | Oji Paper Co Ltd | データキャリア搭載段ボール |
JP4694735B2 (ja) * | 2001-08-21 | 2011-06-08 | 住友ゴム工業株式会社 | 導電性パターンの作製方法 |
JP2003147252A (ja) * | 2001-08-27 | 2003-05-21 | Toyo Ink Mfg Co Ltd | 水性印刷インキ組成物及び印刷方法 |
ATE395193T1 (de) * | 2001-09-05 | 2008-05-15 | Asahi Kasei Chemicals Corp | Lichtempfindliche harzzusammensetzung und lasergravierbares druckelement |
US6614392B2 (en) * | 2001-12-07 | 2003-09-02 | Delaware Capital Formation, Inc. | Combination RFID and GPS functionality on intelligent label |
JP3898610B2 (ja) * | 2002-09-18 | 2007-03-28 | 本田技研工業株式会社 | トルクセンサ |
US6966232B2 (en) * | 2002-12-06 | 2005-11-22 | Honda Motor Co., Ltd. | Torque sensor |
JP4516281B2 (ja) * | 2003-04-02 | 2010-08-04 | 本田技研工業株式会社 | トルクセンサ |
DE102004005082B4 (de) * | 2004-02-02 | 2006-03-02 | Infineon Technologies Ag | Kondensator mit einem Dielektrikum aus einer selbstorganisierten Monoschicht einer organischen Verbindung und Verfahren zu dessen Herstellung |
-
2003
- 2003-08-01 DE DE10335230A patent/DE10335230A1/de not_active Withdrawn
-
2004
- 2004-07-21 US US10/566,594 patent/US20070039694A1/en not_active Abandoned
- 2004-07-21 WO PCT/EP2004/008126 patent/WO2005013189A2/de active Application Filing
- 2004-07-21 JP JP2006520781A patent/JP2006528803A/ja active Pending
- 2004-07-21 EP EP04763368A patent/EP1654125A2/de not_active Withdrawn
-
2010
- 2010-12-03 JP JP2010270569A patent/JP2011054207A/ja not_active Withdrawn
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1245993B (de) * | 1959-08-17 | 1967-08-03 | Stanley F Reed | Verfahren und Vorrichtung zum Drucken eines Musters auf ein Traegermaterial |
DE1571834A1 (de) * | 1965-05-26 | 1971-02-18 | Formica Internat Ltd | Farbdruckverfahren |
US5366760A (en) * | 1990-04-12 | 1994-11-22 | Matsushita Electric Industrial Co., Ltd. | Conductive ink composition and method of forming a conductive thick film pattern |
US5426074A (en) * | 1992-03-23 | 1995-06-20 | Brody; Thomas P. | Process for fabricating an active matrix circuit |
EP0570062A1 (de) * | 1992-05-11 | 1993-11-18 | N.V. Nederlandsche Apparatenfabriek NEDAP | Konktaktlose elektronische Transponderkarte |
WO1996040443A1 (en) * | 1995-06-07 | 1996-12-19 | Img Group Limited | A press for printing an electrical circuit component directly onto a substrate using an electrically-conductive liquid and a method for making such a press |
WO2001037623A1 (de) * | 1999-11-17 | 2001-05-25 | Stork Gmbh | Verfahren zum herstellen von leiterbildern |
WO2002058080A1 (en) * | 2001-01-22 | 2002-07-25 | Metso Corporation | Layered structure, sensor and method of producing and use of the same |
EP1295733A1 (de) * | 2001-09-24 | 2003-03-26 | Gather Formulare | Formblatt, sowie Verfahren zum Herstellen eines Formblattes mit integriertem RFID-Transponder |
WO2003030300A1 (fr) * | 2001-09-28 | 2003-04-10 | Mitsubishi Materials Corporation | Bobine antenne et etiquette d'utilisation rfid l'utilisant, antenne d'utilisation de transpondeur |
Also Published As
Publication number | Publication date |
---|---|
WO2005013189A2 (de) | 2005-02-10 |
JP2011054207A (ja) | 2011-03-17 |
US20070039694A1 (en) | 2007-02-22 |
EP1654125A2 (de) | 2006-05-10 |
JP2006528803A (ja) | 2006-12-21 |
DE10335230A1 (de) | 2005-02-17 |
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