WO2005012386A1 - 封止用エポキシ樹脂成形材料及び電子部品装置 - Google Patents
封止用エポキシ樹脂成形材料及び電子部品装置 Download PDFInfo
- Publication number
- WO2005012386A1 WO2005012386A1 PCT/JP2004/011088 JP2004011088W WO2005012386A1 WO 2005012386 A1 WO2005012386 A1 WO 2005012386A1 JP 2004011088 W JP2004011088 W JP 2004011088W WO 2005012386 A1 WO2005012386 A1 WO 2005012386A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- epoxy resin
- molding material
- type
- sealing
- resin molding
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a sealing epoxy resin molding material and an electronic component device provided with an element sealed with the epoxy resin molding material. More specifically, the present invention relates to an epoxy resin molding material for sealing which is excellent in moldability and reliability suitable for a thin, multi-pin, long wire, narrow pad pitch electronic component device, and a carbon encapsulated by this. The present invention relates to a thin, multi-pin, long wire, narrow pad pitch electronic component device that causes less occurrence of electrical characteristic defects.
- packages that can be used for even smaller and lighter packages such as QFP (Quad Flat Package) and SOP (Small Outline Package), have become more compatible with a larger number of pins, and are quickly and densely mounted. Is shifting to CSP (Chip Size Package) and BGA (Ball Grid Array), which are able to do this.
- CSP Chip Size Package
- BGA Ball Grid Array
- these packages have been developed with new structures such as a face-down type, a stacked (stacked) type, a flip-chip type, and a wafer-level type in order to realize high speed and multifunctionality.
- the stacked type is a structure in which multiple chips are stacked inside a package and connected by wire bonding.
- the sealing material clears a high level of reflow resistance and temperature cyclability required for reliability after mounting, which are concerns when surface mounting a semiconductor device on a printed circuit board. Therefore, the sealing material is provided with low moisture absorption and low expansion by reducing the resin viscosity and thereby increasing the filling amount of the filler.
- carbon black is generally used as a coloring agent in a sealing material for the purpose of protecting a semiconductor element from light and imparting a laser mark property. Since carbon black is conductive, the presence of coarse particles of carbon black causes the above-described electrical characteristics failure.
- the inorganic filler is mixed with carbon black in advance, and dispersed so that the maximum particle size of the aggregate of carbon black is 100 ⁇ m or less.
- a method for producing an epoxy resin molding material for semiconductor encapsulation which is mixed with another compound and then melt-kneaded (see Japanese Patent Application Laid-Open No. 2000-169676), or an average particle diameter of 10 to 50 nm and Brunauer-Emmett-Teller Agglomerates are reduced by using carbon black having a specific surface area of 80,400 m 2 / g as an essential component (see Japanese Patent Application Laid-Open No.
- a sealing epoxy resin molding material (hereinafter, also referred to as a molding material).
- an object of the present invention is to provide an epoxy resin molding compound for encapsulation having excellent insulation reliability, and to further reduce appearance of encapsulated electric characteristics, thereby further improving appearance and laser mark properties such as YAG. To provide electronic component devices.
- the present invention relates to the following epoxy resin molding material (1)-(9).
- An epoxy resin molding material for sealing containing (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a colorant, and (E) an inorganic filler as essential components.
- the colorant contains two or more selected from a black organic pigment, a phthalocyanine-based compound and a titanium-based black pigment, each in an amount of 0.01 to 1.0% by weight based on the molding material.
- Epoxy resin molding materials contains two or more selected from a black organic pigment, a phthalocyanine-based compound and a titanium-based black pigment, each in an amount of 0.01 to 1.0% by weight based on the molding material.
- n is an integer of l20.
- the curing agent is a biphenyl-type phenol resin, an aralkyl-type phenol resin, a triphenylmethane-type phenol resin, a dicyclopentadiene-type phenol resin, or a novolak.
- the epoxy resin molding material for sealing according to any one of (1) to (6) above, which comprises at least one type of phenolic resin.
- the present invention relates to an electronic component device provided with an element sealed using the sealing epoxy resin molding material according to any one of the above (1) to (9).
- the epoxy resin molding material for sealing of the present invention contributes to the improvement of insulation reliability and productivity of electronic component devices.
- the electronic component device include a semiconductor device in which a semiconductor element is arranged on a mounting substrate such as an organic substrate or an organic film having features such as thinness, multi-pin, long wire, and narrow pad pitch.
- an electronic component device such as a semiconductor device in which a semiconductor element is sealed on the mounting board as described above by the molding material according to the present invention has poor electrical characteristics.
- the appearance and the laser mark properties are further improved with a small amount.
- the epoxy resin (A) used in the present invention is not particularly limited, and examples thereof include those commonly used in epoxy resin molding materials for sealing electronic parts, and include biphenyl-type epoxy resins and biphenyl-based epoxy resins.
- Glycidylamine epoxy resin dicyclopentane obtained by the reaction of diglycidyl ethers such as bisphenol A, bisphenol F, bisphenol S, alkyl-substituted biphenols, diaminodiphenylmethane, isocyanuric acid and epichlorohydrin, dicyclopentane Epoxidized co-condensation resin of gen and phenols,
- Epoxy resin having a naphthalene ring Epoxy resin having a naphthalene ring
- Epoxidized naphthol'aralkyl resin Trimethylolpropane epoxy resin
- Epoxy resin containing sulfur atom Epoxy resin containing sulfur atom
- Examples include linear aliphatic epoxy resins and alicyclic epoxy resins obtained by oxidizing the olefin bond with a peracid such as peracetic acid.
- biphenyl type epoxy resins from the viewpoint of reflow resistance, biphenyl type epoxy resins, bisphenol F type epoxy resins, stilbene type epoxy resins, and sulfur atom-containing epoxy resins are preferred.
- novolak type epoxy resin from the viewpoint of low hygroscopicity, dicyclopentadiene type epoxy resin, from the viewpoint of heat resistance and low warpage, naphthalene type epoxy resin and triphenylmethane type epoxy resin, heat resistance
- biphenylene type epoxy resin is preferred. It preferably contains at least one of these epoxy resins.
- Examples of the biphenyl type epoxy resin include an epoxy resin represented by the following general formula (II), and examples of the bisphenol F type epoxy resin include an epoxy resin represented by the following general formula (III).
- the stilbene type epoxy resin includes, for example, an epoxy resin represented by the following general formula (IV), and the sulfur atom-containing epoxy resin includes, for example, an epoxy resin represented by the following general formula (V).
- R 1 to R 8 are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, all of which may be the same or different.
- ⁇ indicates an integer from 0 to 3.
- R 1 R 8 is a hydrogen atom, an alkyl group having 1-10 carbon atoms, an alkoxyl group having 1-10 carbon atoms, an aryl group having 6-10 carbon atoms, and 6 10 carbon atoms. , And all may be the same or different, and n represents an integer of 03.
- R 1 to R 8 are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 115 carbon atoms, all of which may be the same or different. Re, where n is an integer from 0 to 10.
- R 1 to R 8 are selected from a hydrogen atom, a substituted or unsubstituted alkyl group having 1 to 10 carbon atoms and a substituted or unsubstituted alkoxy group having 1 to 10 carbon atoms. , May be the same or different.
- N represents an integer of 0 to 3.
- Examples of the biphenyl type epoxy resin represented by the general formula (II) include 4,4′-bis (2,3_epoxypropoxy) biphenyl and 4,4′_bis (2,3-epoxypropoxy). ) -3,3 ', 5,5 Epoxy resin based on tetramethylbiphenyl Epoxy resins obtained by reacting phosphorus with 4,4'-biphenol or 4,4 '-(3,3', 5,5'-tetramethyl) biphenol are exemplified. Among them, epoxy resins containing 4,4'-bis (2,3-epoxypropoxy) _3,3 ', 5,5'-tetramethylbiphenyl as a main component are preferred.
- the stilbene-type epoxy resin represented by the general formula (IV) can be obtained by reacting stilbene-based phenols as raw materials and epichlorohydrin in the presence of a basic substance.
- stilbene-based phenols as the raw materials include 3_t-butyl-4,4'-dihydroxy-3 ', 5,5'-trimethylstilbene, 3_t_butyl_4,4'-dihydroxy-3', 5 ', 6 —Trimethinolestinoleben, 4, 4'-dihydroxy_3,3 ', 5,5'-tetramethinole stilbene, 4,4'-dihydroxy-3,3 g-t-butynolee 5,5'-dimethylstilbene, 4, 4'-dihydroxy-3,3'-di-butynole 6,6'-dimethylstilbene and the like, among which 3_t-butynole 4,4'-dihydroxy-3 ', 5,5'-trimethylstilbene, and And 4,4'
- R 2 , R 3 , R 6 and R 7 are hydrogen atoms
- R 2 , R 3 , R 6 and R 7 are hydrogen atoms
- R 1 and R 8 are t-butyl groups
- R 4 and R 5 are Epoxy resins that are methyl groups are more preferred.
- YSLV-120TE a trade name of Nippon Steel Chemical Co., Ltd.
- Examples of the novolak type epoxy resin include an epoxy resin represented by the following general formula (VI).
- R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 0 to 10.
- the novolak-type epoxy resin represented by the general formula (VI) can be easily obtained by reacting novolak-type phenol resin with epichlorohydrin.
- R in the general formula (VI) is an alkyl group having 110 carbon atoms such as a methynole group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isopropyl group, a methoxy group, an ethoxy group, a propoxy group.
- n is preferably an integer of 0-3.
- orthocresol novolak epoxy resins are preferred.
- a novolak-type epoxy resin When a novolak-type epoxy resin is used, its amount is preferably at least 20% by weight, more preferably at least 30% by weight, based on the total amount of the epoxy resin in order to exhibit its performance.
- Examples of the dicyclopentadiene-type epoxy resin include an epoxy resin represented by the following general formula (VII).
- R 1 and R 2 are each independently selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 11 to 10 carbon atoms, and ⁇ is 0 10 Indicates an integer, where m is 0—6 Indicates an integer. )
- R 1 in the above formula (VII) for example, a hydrogen atom, an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, a t-butyl group, a vinyl group, an aryl group, a butyl group Alkenyl groups, halogenated alkyl groups, amino-substituted alkyl groups, substituted or unsubstituted monovalent hydrocarbon groups having 115 carbon atoms such as mercapto-substituted alkyl groups, among which methyl groups, An alkyl group such as an ethyl group and a hydrogen atom are preferred.
- an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, a t-butyl group, a vinyl group, an aryl group, a butyl
- a methyl group and a hydrogen atom are more preferred.
- the R 2 for example, a hydrogen atom, a methyl group, Echiru group, propyl group, butyl group, an isopropyl group, an alkyl group such as t_ butyl group, a bicycloalkyl group, Ariru group, alkenyl groups such as Buteyuru group, a halogenated Examples thereof include a substituted or unsubstituted monovalent hydrocarbon group having 15 to 15 carbon atoms, such as an alkyl group, an amino group-substituted alkyl group, and a mercapto group-substituted alkyl group. Among them, a hydrogen atom is preferable.
- a dicyclopentadiene-type epoxy resin When a dicyclopentadiene-type epoxy resin is used, its amount is preferably at least 20% by weight based on the total amount of the epoxy resin in order to exhibit its performance, more preferably at least 30% by weight. preferable.
- Examples of the naphthalene type epoxy resin include an epoxy resin represented by the following general formula (VIII), and examples of the triphenylmethane type epoxy resin include an epoxy resin represented by the following general formula (IX). .
- R 1 to R 3 are selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, even if all are the same or different.
- P is 1 or 0, 1 and m are each an integer from 0 to 11, and (1 + m) is an integer from 1 to 11 and (1 + p) force-an integer from 12 I is an integer from 0-3, j is an integer from 0-2, and k is an integer from 0-4.
- the naphthalene type epoxy resin represented by the above general formula (vm) includes a random copolymer containing one constitutional unit and m constitutional units at random, an alternating copolymer containing alternately, and a copolymer containing regularly. Examples thereof include block copolymers containing in a united form and a block form. These copolymers may be used alone, or may be used alone or in combination of two or more.
- R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 1 to 10.
- biphenylene type epoxy resin is an epoxy resin represented by the following general formula (X).
- n an integer of 110.
- the epoxy resin and the triphenylmethane-type epoxy resin may be used alone or in combination of two or more, but the mixing amount is 50 to the total amount of the epoxy resin. More preferably, it is at least 60% by weight, more preferably at least 80% by weight.
- the viscosity of the epoxy resin (A) at 150 ° C used in the present invention is preferably 2 poise or less from the viewpoint of fluidity. 1. Opoise or less is more preferred and 0.5 poise or less is more preferred.
- the viscosity indicates a melt viscosity measured by an ICI cone plate viscometer, and the measurement conditions in the present invention are as follows.
- Measurement temperature 150 ° C, use of a cone plate with a cone angle of 0.5 °, rotation speed: 750 rpm.
- the curing agent (B) used in the present invention is generally used in an epoxy resin molding material for encapsulation and is not particularly limited.
- Phenols such as phenol, cresol, resorcin, catechol, bisphenol A, bisphenol F, phenolphenol, and aminophenol, and phenols such as Z or hynaphthol, / 3_naphthol, and dihydroxynaphthalene, and formaldehyde, benzaldehyde;
- a novolak-type phenol resin obtained by condensing or co-condensing a compound having an aldehyde group such as salicylaldehyde under an acidic catalyst;
- Phenols and / or naphthols and dimethoxyparaxylene or bis (methoxymethylol) biphenylca Phenols and / or naphthols and dimethoxyparaxylene or bis (methoxymethylol) biphenylca, phenolic aralkyl resins synthesized, aralkyl-type phenolic resins such as naphthol'aralkyl resins,
- Examples thereof include terpene-modified phenol resins, which may be used alone or in combination of two or more.
- biphenyl type phenolic resins are preferred from the viewpoint of flame retardancy, and aralkyl type phenolic resins are preferred from the viewpoint of low moisture absorption, from the viewpoints of reflow resistance and curability.
- aralkyl type phenolic resins are preferred from the viewpoint of low moisture absorption, from the viewpoints of reflow resistance and curability.
- the viewpoint of curability is preferred by triphenylmethane-type phenolic resins.Nopolak-type phenolic resins are preferred. At least one of these phenolic resins Le, preferably containing seeds.
- Examples of the biphenyl-type phenol resin include a phenol resin represented by the following general formula (XI).
- R 1 to R 9 may be the same or different, and may be a hydrogen atom, a methyl group, an ethyl group, a propyl group, a butyl group, an isopropyl group, an isobutyl group, or the like.
- aralkyl groups having 6 to 10 carbon atoms such as benzyl group and phenethyl group, and among them, a hydrogen atom and a methyl group are preferable.
- n represents an integer of 0-10.
- Examples of the biphenyl-type phenol resin represented by the general formula (XI) include compounds in which R 1 — is all hydrogen atoms. Among them, from the viewpoint of melt viscosity, a condensate in which n is 1 or more Of a condensate containing at least 50% by weight of As such a compound, MEH-7851 (trade name, manufactured by Meiwa Kasei Co., Ltd.) is commercially available.
- a biphenyl-type phenol resin When a biphenyl-type phenol resin is used, its amount is preferably at least 30% by weight, more preferably at least 50% by weight, based on the total amount of the curing agent in order to exhibit its performance. More preferably, it is 60% by weight or more.
- aralkyl type phenolic resin examples include phenol aralkyl resin, naphthyl aralkyl resin and the like, and the phenol aralkyl resin represented by the following general formula ( ⁇ ) is preferably represented by the general formula ( ⁇ ) More preferred are phenol aralkyl resins in which R is a hydrogen atom and the average value of n is 0-8. Specific examples thereof include p-xylylene-type phenol aralkyl resin, m-xylylene-type phenol aralkyl resin, and the like. When these aralkyl-type phenolic resins are used, the amount of the phenolic resin exhibits its performance. For this reason, the content is preferably 30% by weight or more based on the total amount of the curing agent, and more preferably 50% by weight or more.
- R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 0 to 10.
- Examples of the dicyclopentadiene-type phenol resin include a phenol resin represented by the following general formula (II).
- R 1 and R 2 are each independently selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n is 0 to 10 And m represents an integer of 0-6.
- a dicyclopentadiene-type phenol resin When a dicyclopentadiene-type phenol resin is used, its amount is preferably at least 30% by weight, more preferably at least 50% by weight, based on the total amount of the curing agent in order to exhibit its performance.
- triphenyl methane type phenol resin examples include a phenol resin represented by the following general formula (XIV).
- R is selected from a hydrogen atom and a substituted or unsubstituted monovalent hydrocarbon group having 1 to 10 carbon atoms, and n represents an integer of 1 to 10.
- the amount is preferably at least 30% by weight based on the total amount of the curing agent in order to exhibit its performance, and more preferably at least 50% by weight.
- the curing agents may be used alone or in combination of two or more. It is preferable to contain at least one of the phenolic resins as mentioned above.
- the equivalent ratio of the epoxy resin (A) to the curing agent (B), that is, the ratio of the number of epoxy groups in the epoxy resin / the number of hydroxyl groups in the curing agent is not particularly limited, but is not particularly limited. It is preferable to set the ratio in the range of 0.7 to 1.3 in order to reduce the amount of each unreacted component, and particularly to obtain a molding material having excellent moldability and reflow resistance in the range of 0.8-1. It is preferable to set in the range of 2.
- the curing accelerator (C) used in the present invention is generally used in an epoxy resin molding material for sealing and is not particularly limited.
- 1,8-diazabicyclo (5,4,0) indene-1,7,1,5_diaza-bicyclo (4,3,0) nonene 5,6_dibutylamino-1,8-diazabicyclo (5,4,4)
- Indecene-1 tertiary amines such as benzyldimethylamine, triethanolamine, dimethylaminoethanol, tris (dimethylaminomethyl) phenol and derivatives thereof, 2-methylimidazole, 2-phenylimidazole Imidazoles such as 1,2-phenyl-2-methylimidazole and derivatives thereof, organic phosphines such as tributylphosphine, methyldiphenylphosphine, triphenylphosphine, diphenylphosphine, phenylphosphine, and
- the inorganic filler of the component (E) in the present invention is not particularly limited, but includes fused silica, crystalline silica, alumina, zircon, calcium silicate, calcium carbonate, silicon carbide, anoremi, boron nitride, beryllia, One or more kinds of powders such as zirconia or spherical beads thereof, single crystal fibers such as potassium titanate, silicon carbide, silicon nitride, and alumina, glass fibers, and the like can be used. Further, examples of the inorganic filler having a flame-retardant effect include aluminum hydroxide, magnesium hydroxide, zinc borate and the like, and these can be used alone or in combination.
- fused silica is preferred from the viewpoint of reducing the coefficient of linear expansion, and alumina is preferred from the viewpoint of high thermal conductivity.
- the shape of the filler is preferably spherical or nearly spherical in view of fluidity during molding and mold abrasion. It is particularly preferred that 50% by weight or more is spherical.
- the average particle size of the filler is preferably 15 / im or less (50% by weight or more of the filler should have a particle size of 15 / im or less) from the viewpoint of moisture shielding properties and mold wear. It is particularly preferred that:
- the blending amount of the inorganic filler (E) is preferably 80-92% by weight or more based on the whole molding material, from the viewpoints of hygroscopicity, reduction of linear expansion coefficient and improvement of strength. It is particularly preferred. If it is less than 80% by weight, the strength tends to decrease, and if it exceeds 92% by weight, the fluidity tends to be insufficient.
- the colorant of the component (D) two or more selected from a black organic pigment, a phthalocyanine-based compound, and a titanium-based black pigment are contained, each of which is 0.01 to 1.0% by weight based on all the molding materials. contains.
- the black organic pigment is not particularly limited, but an anilino-based pigment represented by the following general formula (I) is preferably used as a representative structure.
- n is an integer of 110, preferably n is 110.
- This black organic pigment is generally known as diamond black, and is obtained by oxidative condensation of aniline alone. Since copper and chromium compounds are used as oxidizing agents, they usually contain several tens of percent of copper and chromium. As a result, a molding material containing 1.0% by weight of ordinary diamond black contains about 100 ppm of chromium, and the policy of reducing environmentally hazardous substances in recent years is not preferable.
- the diamond black used therefor preferably has a chromium content of 1% or less, more preferably 100 ppm or less.
- the chromium content in the molding material is preferably 100 ppm or less, more preferably 100 ppm or less in all the molding materials.
- the chromium content in the molding material can be measured by the following method.
- the content is 0.01 to 1.0% by weight based on all the molding materials.
- the content is 0.01% by weight or more, the coloring property is sufficient, and when the content is 1.0% by weight or less, the curability is good.
- the phthalocyanine-based compound is represented by the following general formula (XV) as a representative structure.
- the central metal M include Fe, Ni, V, V ⁇ , Cu, Co and the like, and among them, V and VO are preferable in terms of laser markability.
- R1, R2, R3, and R4 include conjugated ⁇ -electron-based substituents such as phenyl group and naphthylazo group, and electron-donating substituents such as alkoxy group and alkylthio group. -SO Cl, -CH, -CH CH CH CH and the like are preferred. Also, phthalocyanine
- the system compound can absorb a wavelength of about 800 nm to 1200 nm, and in particular, a compound that absorbs a wavelength of 1000 ⁇ m lOO nm is more suitable in terms of laser markability.
- the phthalocyanine compound When the phthalocyanine compound is contained, the content is 0.01 to 1.0% by weight based on all the molding materials. If the content is 0.01% by weight or more, the sealability is sufficient, and 1.0% by weight.
- the titanium-based black pigment is represented by the following general formula (XVI) as a representative structure.
- n is an integer of 1 to 10.
- Titanium oxide of the general formula (XVI) has excellent dispersibility in resin and good heat resistance. It is good.
- the particle diameter of the titanium-based black pigment is preferably 2.0 / im or less, more preferably 1.0 ⁇ or less, from the viewpoints of coloring and shielding properties.
- the maximum particle size is arbitrarily favored especially 10 beta m or less or less preferably tool 5 mu m from the viewpoint of insulating properties.
- the particle size of the titanium-based black pigment can be measured with a laser diffraction / scattering particle size distribution analyzer (for example, model number LA-920, manufactured by Horiba, Ltd.).
- a laser diffraction / scattering particle size distribution analyzer for example, model number LA-920, manufactured by Horiba, Ltd.
- the content is 0.01 to 1.0% by weight based on all the molding materials. If it is 0.01% by weight or more, the coloring property is sufficient, and if it is 1.0% by weight or less, the sensitivity to the YAG laser is not too high.
- component (D) By using two or more of these colorants as component (D), it is possible to obtain a molding material having a good balance of coloring properties, light-shielding properties, YAG markability, insulating properties, and the like.
- carbon black can be used as the coloring agent.
- the carbon black is not particularly limited, and commercially available furnace black, channel black, and the like can be used. Specific examples include Mitsubishi Chemical Corporation product names MA-100, MA-100R, MA-600, # 25, # 3230, 33250, Asahi Carbon Corporation product names Asahi Thermal, Cabot REGAL99R, Colombia Raven860U and Raven780ULTRA manufactured by N Chemicals, Prix 25 manufactured by Degussa, and HTC # 100 manufactured by Nippon Steel Chemical Co., Ltd. can be used. Further, from the viewpoint of insulating properties, it is desirable to use carbon black having a poorly developed graphite structure and a large electric resistance.
- carbon black is CB-3-500 (trade name, manufactured by Mitsui Mining Materials Co., Ltd.).
- the form of the carbon black can be used in the form of powder or beads.
- the content is preferably 0.1% by weight or less based on the total molding material. More preferably, the content is 0.05% by weight or less.
- the sealing epoxy resin molding material of the present invention may use a component other than the (A) component (E), for example, a coupling agent.
- a component other than the (A) component (E) for example, a coupling agent.
- isopropyl triisostearoyl titanate isopropyl tris (dioctylpyrophosphate) titanate, isopropyl tri ( ⁇ -aminoethyl-aminoethyl) titanate, tetraoctylbis (ditridecyl phosphite) titanate, tetra (2,2_diarinoleoxymethyl) titanate 1-butyl) bis (ditridecyl) phosphite titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, bis (dioctylpyrophosphate) ethylene titanate, isopropyltrioctanoyl titanate, isopropyl dimethacrylate, isopropyl tridodecyl Benzenesulfonyl titanate, isopropyl, tri (dioctyl phosphate) titanate,
- R1 represents an alkyl group or phenyl group having 11 to 10 carbon atoms
- R2 represents a methyl group or an ethyl group.
- the silane compound represented by the general formula (XVII) contributes to improving the adhesion to the lead frame and is effective in preventing moisture from entering from the interface between the sealing epoxy resin molding material and the lead frame. It is a target. Examples thereof include dimethyldimethoxysilane, dimethyljetoxysilane, diphenyldimethoxysilane, diphenyljethoxysilane, methylphenyldimethoxysilane, methylphenyljethoxysilane, and the like. Is preferred.
- flame retardants such as brominated epoxy resins, antimony trioxide, phosphate esters, red phosphorus, and nitrogen-containing compounds such as melamine resins, natural butter, synthetic wax, oxidized or
- a release agent such as non-oxidized polyolefin, a coloring agent other than carbon black, a stress relieving agent such as silicone oil or silicone rubber powder, and an ion trapping agent such as hydrotalcite and antimony bismuth can be used as necessary. Wear.
- the epoxy resin molding material for encapsulation in the present invention can be prepared by any method as long as various raw materials can be uniformly dispersed and mixed. After sufficiently mixing the mixture with a mixer or the like, melt kneading with a mixing roll, an extruder, or the like, and then cooling and pulverizing the mixture. Tablets with dimensions and weights that match the molding conditions make it easy to use.
- the electronic component device of the present invention includes an element sealed using the epoxy resin molding material for sealing of the present invention.
- a low-pressure transfer molding method is the most common method for sealing an element using the sealing epoxy resin molding material of the present invention.
- an injection molding method, a compression molding method, or the like may be used.
- Yore When the sealing epoxy resin molding material is in a liquid or paste state at room temperature, a dispense method, a casting method, a printing method, and the like can be used.
- the electronic component device obtained by encapsulating the element with the epoxy resin molding material for encapsulation obtained in the present invention includes a lead frame, a wired tape carrier, a wiring board, glass, and a silicon wafer.
- a lead frame for components, semiconductor chips, transistors, diodes, thyristors, etc.
- a semiconductor element is fixed on a lead frame, and a terminal portion of an element such as a bonding pad and a lead portion are connected by a wire bonding bump, and then the sealing epoxy of the present invention is used.
- DIP Device Inline Package
- PLCC Physical Leaded Chip Carrier
- QFP Quad Flat Package
- SOP Small Outline Package
- SOJ Small Outline
- TCP Teape Carrier Package
- active elements such as diodes and thyristors and / or passive elements such as capacitors, resistors, and coils are sealed with the epoxy resin molding material of the present invention.
- the sealing epoxy resin molding of the present invention After mounting the element on the organic substrate on which the terminals for connecting the chip module and the wiring board are formed, and connecting the element and the wiring formed on the organic substrate by bump or wire bonding, the sealing epoxy resin molding of the present invention is performed.
- Examples include BGA (ball grid array) and CSP (chip size package) in which elements are sealed with materials.
- the epoxy resin molding material for sealing of the present invention can be effectively used for printed circuit boards.
- epoxy resin a biphenyl-type epoxy resin having an epoxy equivalent of 192 and an epoxybis-type brominated epoxy resin having an epoxy equivalent of 400 and a bromine content of 49% were used.
- resin a phenol aralkyl resin represented by the following general formula (XVIII) having a hydroxyl equivalent of 175 was used.
- n a positive number of 1 to 8.
- Molding materials of Examples 7-16 and Comparative Examples 7-16 were prepared in the same manner as in Example 1 except that the compositions shown in Table 2-6 were used.
- Molding was performed using a spiral flow measurement mold according to EMM G116, and the flow distance was determined.
- the hardness of the molded product immediately after opening of the mold was measured using a Shore D hardness meter.
- a disk having a diameter of 100 mm and a thickness of 3 mm is formed using the epoxy resin molding material, and concentric electrodes having a diameter of 50 mm and an inner diameter of 70 mm and a width of 5 mm are formed on the surface of the disk using conductive silver paint, and a diameter is formed on the back surface.
- An 80 mm electrode was formed.
- the volume resistivity was measured with a volume resistance meter TR-8601 manufactured by Takeda Riken Industry Co., Ltd.
- a surface matte disk having a diameter of 100 mm and a thickness of 2 mm was formed.
- the color tone (L *) was measured using an SM color computer (SM-5-1S2B) manufactured by Suga Test Instruments Co., Ltd. L * 30 or more was judged as NG.
- a mirror disk having a diameter of 100 mm and a thickness of 2 mm was formed, and printing was performed using a YAG laser one marker SL478B manufactured by NEC Corporation at an output of 5 J.
- the printing depth was measured with a surface roughness meter, and 5 ⁇ m or less was judged as NG.
- a TEG chip with a pad pitch of 80 ⁇ m is bonded to the lead frame using Ag paste (trade name: EN-4000, manufactured by Hitachi Chemical Co., Ltd.), and a wire is attached using a Tanaka Electronics Co., Ltd. ⁇ 30 ⁇ m gold wire. Bonding was performed. This was molded into a QFP1420 (2m mt) package by transfer molding, and after confirming that there was no short circuit due to wire deformation using a soft X-ray device, the presence or absence of conduction between the leads was measured, and conduction was observed at one location. The sample was determined to be NG.
- Biphenyl type epoxy resin Product name manufactured by Japan Epoxy Co., Ltd. YX-4000H Bisphenol F type epoxy resin: Product name manufactured by Nippon Steel Chemical Co., Ltd. YSLV-80XY Sulfur atom-containing epoxy resin: Product name YSLV manufactured by Nippon Steel Chemical Co., Ltd. -120TE Novolak type epoxy resin: Sumitomo Chemical Co., Ltd. product name ESCN— 190 Dicyclopentadiene type epoxy resin: Dainippon Ink and Chemicals Co., Ltd. product name HP
- Aralkyl type phenolic resin Product name: XL—225—3L manufactured by Mitsui Chemicals, Inc.
- Biphenyl-type curing agent MEH-7851 (trade name, manufactured by Meiwa Kasei Co., Ltd.)
- Dicyclopentadiene type curing agent Nippon Petrochemical Co., Ltd. product name DPP-L Triphenylmethane curing agent: Meiwa Kasei Co., Ltd. product name MEH-7500
- Novolac curing agent HP-850N, manufactured by Hitachi Chemical Co., Ltd.
- Polyethylene wax Product name PED-191, manufactured by Clariant Japan KK
- Epoxysilane (* 2) Product name A-187 manufactured by Nippon Tunicer Co., Ltd.
- Phthalocyanine compound (YKR-3082, trade name, manufactured by Yamamoto Kasei Co., Ltd.)
- Diamond black product name: NCC # 319BS, manufactured by Noma Chemical Industry Co., Ltd., chromium content: lOOppm or less.
- Titanium oxide (Titanium black pigment: Ako Kasei Co., Ltd. product name: Tilack D)
- Carbon black (trade name: CB—3—500, manufactured by Mitsui Mining Materials Co., Ltd.)
- Fused silica (spherical silica): (* 3) Micron Corporation product name S_C ⁇ [filament content]
- the epoxy resin molding material for sealing of the present invention contributes to the improvement of insulation reliability and productivity of electronic component devices.
- the electronic component device include a semiconductor device in which a semiconductor element is arranged on a mounting substrate such as an organic substrate or an organic film having features such as thinness, multi-pin, long wire, and narrow pad pitch.
- an electronic component device such as a semiconductor device in which a semiconductor element is sealed on the mounting substrate as described above by the molding material according to the present invention is less likely to cause poor electrical characteristics. Appearance and laser markability are improved.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Epoxy Resins (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003285771A JP2005054045A (ja) | 2003-08-04 | 2003-08-04 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2003-285771 | 2003-08-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005012386A1 true WO2005012386A1 (ja) | 2005-02-10 |
Family
ID=34113899
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/011088 WO2005012386A1 (ja) | 2003-08-04 | 2004-08-03 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2005054045A (ja) |
TW (1) | TWI310393B (ja) |
WO (1) | WO2005012386A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110211948A (zh) * | 2011-08-17 | 2019-09-06 | 英特赛尔美国有限公司 | 背对背堆叠芯片 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4623449B2 (ja) * | 2005-11-08 | 2011-02-02 | 東海カーボン株式会社 | 半導体封止材用着色剤及び樹脂組成物 |
JP5509514B2 (ja) * | 2005-11-21 | 2014-06-04 | 日立化成株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
JP2009046606A (ja) * | 2007-08-21 | 2009-03-05 | Sumitomo Bakelite Co Ltd | 熱硬化性液状封止樹脂組成物及び半導体装置 |
KR101279973B1 (ko) | 2009-12-31 | 2013-07-05 | 제일모직주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용한 반도체 소자 패키지 |
WO2011148627A1 (ja) * | 2010-05-28 | 2011-12-01 | 住友ベークライト株式会社 | エステル化物の製造方法 |
KR101283474B1 (ko) | 2011-12-23 | 2013-07-12 | 금호석유화학 주식회사 | 액정 표시 소자용 흑색 실란트 조성물 |
JP2014152302A (ja) * | 2013-02-13 | 2014-08-25 | Sumitomo Bakelite Co Ltd | 半導体封止用エポキシ樹脂組成物、半導体装置の製造方法及び半導体装置 |
KR20170036975A (ko) * | 2015-09-24 | 2017-04-04 | 삼성에스디아이 주식회사 | 반도체 소자 밀봉용 에폭시 수지 조성물 및 이를 이용하여 밀봉된 반도체 소자 |
JP2018053111A (ja) * | 2016-09-29 | 2018-04-05 | 株式会社ノリタケカンパニーリミテド | 熱硬化型絶縁性組成物 |
JP2020132750A (ja) * | 2019-02-19 | 2020-08-31 | 住友ベークライト株式会社 | 封止用樹脂組成物およびそれを用いた電子装置 |
EP4029896A4 (en) * | 2019-09-09 | 2023-07-05 | Adeka Corporation | CURING RESIN COMPOSITION |
CN111394031B (zh) * | 2020-04-10 | 2022-03-22 | 烟台德邦科技股份有限公司 | 一种高电绝缘性能底部填充胶的制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60119760A (ja) * | 1983-11-30 | 1985-06-27 | Nitto Electric Ind Co Ltd | 樹脂封止半導体装置 |
JP2001335677A (ja) * | 1999-09-17 | 2001-12-04 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
JP2002201371A (ja) * | 2000-12-28 | 2002-07-19 | Nippon Kayaku Co Ltd | 黒色フタロシアニン化合物及び樹脂組成物 |
JP2002348439A (ja) * | 2001-05-24 | 2002-12-04 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2003327792A (ja) * | 2002-05-16 | 2003-11-19 | Kyocera Chemical Corp | 封止用樹脂組成物および半導体封止装置 |
-
2003
- 2003-08-04 JP JP2003285771A patent/JP2005054045A/ja active Pending
-
2004
- 2004-08-03 WO PCT/JP2004/011088 patent/WO2005012386A1/ja active Application Filing
- 2004-08-04 TW TW93123410A patent/TWI310393B/zh not_active IP Right Cessation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60119760A (ja) * | 1983-11-30 | 1985-06-27 | Nitto Electric Ind Co Ltd | 樹脂封止半導体装置 |
JP2001335677A (ja) * | 1999-09-17 | 2001-12-04 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂組成物及び電子部品装置 |
JP2002201371A (ja) * | 2000-12-28 | 2002-07-19 | Nippon Kayaku Co Ltd | 黒色フタロシアニン化合物及び樹脂組成物 |
JP2002348439A (ja) * | 2001-05-24 | 2002-12-04 | Sumitomo Bakelite Co Ltd | エポキシ樹脂組成物及び半導体装置 |
JP2003327792A (ja) * | 2002-05-16 | 2003-11-19 | Kyocera Chemical Corp | 封止用樹脂組成物および半導体封止装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110211948A (zh) * | 2011-08-17 | 2019-09-06 | 英特赛尔美国有限公司 | 背对背堆叠芯片 |
Also Published As
Publication number | Publication date |
---|---|
TW200508316A (en) | 2005-03-01 |
JP2005054045A (ja) | 2005-03-03 |
TWI310393B (en) | 2009-06-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6372351B1 (en) | Encapsulant epoxy resin composition and electronic device | |
KR101081723B1 (ko) | 에폭시 수지 조성물 및 반도체장치 | |
TWI589617B (zh) | 密封用環氧樹脂組成物及電子零件裝置 | |
JP5509514B2 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP4470887B2 (ja) | 封止用エポキシ樹脂成形材料および電子部品装置 | |
TWI568788B (zh) | 密封用環氧樹脂成形材料、及具備以此成形材料所密封之元件的電子零件裝置 | |
CN107250235B (zh) | 用于封装半导体装置的组成物及使用其封装的半导体装置 | |
JP2003321594A (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
WO2005012386A1 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
JPWO2019131095A1 (ja) | ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置 | |
US6284818B1 (en) | Encapsulant composition and electronic device | |
JP2008235669A (ja) | 半導体装置及びその製造方法 | |
JPWO2019131097A1 (ja) | ボールグリッドアレイパッケージ封止用エポキシ樹脂組成物、エポキシ樹脂硬化物及び電子部品装置 | |
JP6277611B2 (ja) | 素子封止用エポキシ樹脂成形材料及び電子部品装置 | |
JP6372967B2 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
WO2019054217A1 (ja) | エポキシ樹脂組成物、及び電子部品装置 | |
WO2018181384A1 (ja) | エポキシ樹脂組成物、硬化性樹脂組成物、及び電子部品装置 | |
JP2008208222A (ja) | 半導体封止用エポキシ樹脂組成物及び半導体装置 | |
JP2001302885A (ja) | 封止用エポキシ樹脂組成物及び電子部品装置 | |
TW202225244A (zh) | 半導體密封用樹脂組成物及半導體裝置 | |
JP2008121010A (ja) | 封止用エポキシ樹脂組成物及び電子部品装置 | |
JP2001302886A (ja) | 封止用エポキシ樹脂組成物及び電子部品装置 | |
JP4366972B2 (ja) | 封止用エポキシ樹脂成形材料及び電子部品装置 | |
KR100384273B1 (ko) | 반도체 소자 봉지용 에폭시 수지 조성물 | |
JP4788034B2 (ja) | エポキシ樹脂組成物及び半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AK | Designated states |
Kind code of ref document: A1 Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS KE KG KP KR KZ LC LK LR LS LT LU LV MA MD MG MK MN MW MX MZ NA NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW |
|
AL | Designated countries for regional patents |
Kind code of ref document: A1 Designated state(s): BW GH GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LU MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application | ||
122 | Ep: pct application non-entry in european phase |