WO2004106580A1 - Maskenhaltevorrichtung - Google Patents
Maskenhaltevorrichtung Download PDFInfo
- Publication number
- WO2004106580A1 WO2004106580A1 PCT/EP2004/050389 EP2004050389W WO2004106580A1 WO 2004106580 A1 WO2004106580 A1 WO 2004106580A1 EP 2004050389 W EP2004050389 W EP 2004050389W WO 2004106580 A1 WO2004106580 A1 WO 2004106580A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- mask
- frame
- leaf springs
- particular according
- spring elements
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
Definitions
- the invention relates to a device for releasably holding a mask in the form of a rectangular frame, clamping means acting on the legs of the frame at the edge of the mask being provided.
- a device is known by means of which a circular mask is held.
- the device consists of a circular frame. If a radial tension is applied to the mask held by the frame, the sagging of the mask in its center is reduced.
- aligning the mask is aligned with alignment marks on the substrate. This is done optically. In order to avoid alignment errors, the alignment marks to be aligned must be as close as possible to each other due to the limited depth of field.
- Minimizing the sag is also important for masks that are used below a substrate, so that when used as intended, their distance from the substrate or pre-structuring on the substrate is minimal.
- Devices for attaching masks are also known from DE 195 33402, US 5 186975 and US 4676193.
- the invention has for its object to provide a generic device to minimize sagging of the mask.
- Claim 1 first and foremost provides that the tensioning means have a multiplicity of individual spring elements which engage at closely adjacent locations on the edge of the mask.
- the individual spring elements develop essentially the same tension, so that an almost homogeneous tension is applied to the edge of the mask.
- the deformation of the mask associated with the application of the tension is therefore the same at every point.
- the deformation of the frame legs themselves which cannot be avoided due to the rectangularity of the frame, is largely compensated for.
- the tension of the individual spring elements is preferably applied by a common tensioning element.
- Each of the four frame legs is preferably equipped with such a tensioning aid.
- the individual spring elements can be leaf springs. These leaf springs can form the teeth of a comb.
- the attack of the individual spring elements is preferably carried out on the window of the edge of the mask.
- the edge of the mask can form a multiplicity of slit-shaped windows lying one behind the other.
- the slot length is only slightly longer than the width of the leaf springs.
- the distance between the slots corresponds approximately to the width of a leaf spring.
- the ends of the leaf springs extend approximately orthogonally to the mask plane.
- the mask can rest on an upper side of the frame.
- the leaf springs can extend at a distance along an outside of the frame.
- the comb web, with which the individual leaf springs are connected to one another, can be printed by a tensioning strip against a sloping flank of the frame leg.
- the tensioning bar forms a counter cantilever.
- the rigidity of the leaf springs is considerably lower than the spring rigidity of the frame or the mask. This compensates for an elastic deformation of the frame legs due to the tension.
- the tension applied to the mask by the leaf springs is less than the yield point of the material of the mask. But the tension is so high that the mask, its size 370 mm x 470 mm, preferably 600 mm x 720 mm, may not sag more than 0.2 mm, preferably less than 0.1 mm in the middle.
- the mask can be made of stainless steel or a molybdenum alloy.
- the mask has a large number of regularly arranged openings, through which material in the form of gases or aerosols can flow onto a pre-structured surface of a substrate, in particular a mother glass, when used as intended.
- the device is used in particular for OVPD.
- organic layers are deposited on a glass substrate that is pre-structured.
- Light-imitating fields (pixels) are generated with the layers, red-imitating and green-imitating fields lie adjacent to blue-imitating fields.
- the field size ranges between 20 and 200 ⁇ m.
- the individual fields can be separated from one another by means of spacers made of a polymer.
- Alignment before coating the mask used in the shadow casting method above the pre-structured substrate is carried out with a minimal distance from the substrate.
- the alignment marks to be aligned are then at a minimal distance from one another.
- the mask lies on the substrate. For this purpose, it is lowered after alignment.
- the mask is essentially mounted on the frame in two
- the tensioning bar is released, i.e. with untensioned leaf springs
- the metal mask is placed on the top of the frame.
- the ends of the leaf spring loosely reach through the associated window of the edge of the mask.
- the ridge which forms the fixed ends of the leaf springs, lies in an open, oblique gap. If the tensioning strip is moved towards the frame by applying a force, the leaf springs are bent. Along with this, a tension force, which is directed in the direction of the mask plane, is applied to the mask.
- the angle of inclination of the sloping flank against which the ridge is printed is so on the position of the window of the mask or. the stiffness of the leaf spring is adjusted so that the clamping force is sufficiently high, but below the yield point of the material of the mask.
- 1 is a top view of a mask on a frame in the tensioned position
- FIG. 2 is a side view according to arrow ⁇ in Fig. 1,
- FIG. 3 shows a section along the line 111-111 in FIG. 1, shown in broken lines the position of a leaf spring in the untensioned state
- FIG. 4 shows a representation according to FIG. 3 before tensioning, but after assembly
- Fig. 5 shows a detail according to V in Fig. 1 from the surface of the mask
- FIG. 6 shows a section along the line VI-VI in FIG. 5.
- the device that is described in the exemplary embodiment is used for the production of flat screens.
- Individual light-imitating fields are placed on a substrate in a grid that corresponds to the pixel resolution of the screen.
- the substrate which consists in particular of a mother glass, is pre-structured.
- the substrate can have a size of 370 x 470 mm 2 or 600 x 720 mm 2 .
- a rectangular field grid 14 is first applied to the substrate 15. These are elongated fields, of which three fields form a unit. One of the fields imitates red, blue or yellow. 5
- the width of the fields D can be between 20 and 200 ⁇ m.
- masks 1 are ended which have mask openings 12 which, after the position has been adjusted in the plane of the mask, lie above the fields, that is to say between the supports 14. In the case of the 10 deposition of the highly limiting layers, only a third of the fields is provided with a mask opening 12. Through this mask opening 12, organic starting materials diffuse as aerosols or gases in order to condense on the layer structure 13.
- the mask 1 lying flat on the top 2 'and made of stainless steel or a molybdenum alloy is stretched uniformly in its plane of extension. This is the only way to achieve that the mask 1 sags minimally in the middle and that the distortion generated by the application of the surface tension is homogeneous and thus in the construction of the mask.
- the edge of the mask is perforated. It has windows 6 lying one behind the other in a row. The length of the individual windows 6 essentially corresponds to their distance. The windows are approximately 10 to 25 20 mm apart.
- the outer sides 2 ′′ of the frame legs 2, 3 form oblique flanks 8 lying away from the upper side 2 ′.
- a counter-oblique 10 with the same slope, which is associated with a tensioning strip 5.
- the tensioning bar 5 lies on a step 9, which adjoins the underside of the frame leg 2.
- the ends 4 'of the leaf springs 4 pass through the windows 6 of the edge 1' of the mask 1 such that the end sections 4 'of the leaf springs 4 extend approximately orthogonally to the mask plane.
- the leaf springs 4 engage in the tensioned state, in which the comb web 7 lies flat against the oblique flank 8 or the counter bevel 10, in the windows 6.
- a non-tensioned spring is shown in dash-dotted lines. With a the span of the leaf spring 4 is designated.
- the leaf springs 4 are evenly spaced from one another. Their distance corresponds essentially to their width.
- the space between the individual leaf springs 4 has a rounded bottom 11.
- the leaf spring is made of steel or some other suitable material.
- Each of the four frame legs 2, 3 can be provided with such clamping means.
- the tensioning means which are assigned to the narrow legs 2 can have different spring stiffnesses than the tensioning means which are assigned to the longitudinal legs 3.
- the frame is fitted in the released position of the leaf spring shown in FIG. 4.
- the clamping bar 5 is displaced back in such a way that the inclined gap between the inclined flank 8 and the counter bevel 10 is wider than the thickness of the comb web 7.
- the comb web 7 lies here loosely in the inclined slot. If the mask 1 is now on the top 2 ', 3' Frame legs placed, the ends 4 'of the leaf springs 4 can be loosely threaded into the associated window 6. Then the clamping strips 5 are acted on in the direction of the arrow shown in FIG. 4. This can be done simultaneously on all frame legs 2, 3. Along with the displacement of the tensioning strips 5 in the direction of the arrow, the leaf spring 4 is bent.
- the comb web 7 can also be angled at an angle to the leaf springs 4.
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physical Vapour Deposition (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Formation Of Various Coating Films On Cathode Ray Tubes And Lamps (AREA)
- Respiratory Apparatuses And Protective Means (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006530164A JP2007505222A (ja) | 2003-05-28 | 2004-03-29 | マスク保持装置 |
EP04724026A EP1639148A1 (de) | 2003-05-28 | 2004-03-29 | Maskenhaltevorrichtung |
US11/286,170 US20060124055A1 (en) | 2003-05-28 | 2005-11-23 | Mask-retaining device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10324202.3 | 2003-05-28 | ||
DE10324202A DE10324202A1 (de) | 2003-05-28 | 2003-05-28 | Maskenhaltevorrichtung |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US11/286,170 Continuation US20060124055A1 (en) | 2003-05-28 | 2005-11-23 | Mask-retaining device |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2004106580A1 true WO2004106580A1 (de) | 2004-12-09 |
WO2004106580B1 WO2004106580B1 (de) | 2005-01-27 |
Family
ID=33441400
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2004/050389 WO2004106580A1 (de) | 2003-05-28 | 2004-03-29 | Maskenhaltevorrichtung |
Country Status (8)
Country | Link |
---|---|
US (1) | US20060124055A1 (de) |
EP (1) | EP1639148A1 (de) |
JP (1) | JP2007505222A (de) |
KR (1) | KR20060003103A (de) |
CN (1) | CN100489146C (de) |
DE (1) | DE10324202A1 (de) |
TW (1) | TW200501308A (de) |
WO (1) | WO2004106580A1 (de) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008049639A1 (de) * | 2008-09-30 | 2010-04-08 | Airbus Deutschland Gmbh | Lastpfadoptimierte schwenkbare Gepäckablage (Hatrack) |
JP2011195907A (ja) * | 2010-03-19 | 2011-10-06 | Tokyo Electron Ltd | マスク保持装置及び薄膜形成装置 |
KR101740487B1 (ko) * | 2015-10-20 | 2017-05-29 | 삼성디스플레이 주식회사 | 박막 증착용 마스크 인장 용접 장치 |
CN107354427B (zh) * | 2017-09-06 | 2023-10-13 | 京东方科技集团股份有限公司 | 掩膜板载台和蒸镀系统 |
CN109844164B (zh) * | 2017-09-27 | 2021-05-25 | 应用材料公司 | 用于掩蔽基板的掩模布置、用于处理基板的设备及其方法 |
CN107761051B (zh) * | 2017-11-14 | 2019-08-27 | 合肥鑫晟光电科技有限公司 | 一种掩模版、掩模蒸镀组件及蒸镀装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0569660A1 (de) * | 1992-05-15 | 1993-11-18 | Leybold Aktiengesellschaft | Vorrichtung zum Halten von Substraten |
US5485495A (en) * | 1992-03-31 | 1996-01-16 | Canon Kabushiki Kaisha | X-ray mask, and exposure apparatus and device production using the mask |
DE19533402A1 (de) * | 1995-09-09 | 1997-03-13 | Leybold Ag | Substrat- und Maskenhaltevorrichtung |
US5682228A (en) * | 1993-06-02 | 1997-10-28 | Sanei Giken Co., Ltd. | Alignment method and apparatus in an exposing process |
JPH10121241A (ja) * | 1996-10-17 | 1998-05-12 | Nec Corp | 真空蒸着装置 |
US6440219B1 (en) * | 2000-06-07 | 2002-08-27 | Simplus Systems Corporation | Replaceable shielding apparatus |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3745401A (en) * | 1972-02-15 | 1973-07-10 | Atomic Energy Commission | Filament support structure for large electron guns |
US4676193A (en) * | 1984-02-27 | 1987-06-30 | Applied Magnetics Corporation | Stabilized mask assembly for direct deposition of a thin film pattern onto a substrate |
US5186975A (en) * | 1987-10-14 | 1993-02-16 | Enichem S.P.A. | Process and machinery for step-and-repeat vacuum-deposition of large-area thin-film-electronics matrix-circuits on monolithic glass panes through small perforated metal masks |
US5681195A (en) * | 1993-09-30 | 1997-10-28 | Matsushita Electric Industrial Co., Ltd. | Flat display device and manufacturing method thereof |
JP3390142B2 (ja) * | 1998-08-26 | 2003-03-24 | 松下電器産業株式会社 | カラー陰極線管の製造方法及びその製造装置 |
US6878208B2 (en) * | 2002-04-26 | 2005-04-12 | Tohoku Pioneer Corporation | Mask for vacuum deposition and organic EL display manufactured by using the same |
-
2003
- 2003-05-28 DE DE10324202A patent/DE10324202A1/de not_active Withdrawn
-
2004
- 2004-03-29 WO PCT/EP2004/050389 patent/WO2004106580A1/de active Application Filing
- 2004-03-29 EP EP04724026A patent/EP1639148A1/de not_active Withdrawn
- 2004-03-29 KR KR1020057021758A patent/KR20060003103A/ko not_active Application Discontinuation
- 2004-03-29 CN CN200480014707.2A patent/CN100489146C/zh not_active Expired - Fee Related
- 2004-03-29 JP JP2006530164A patent/JP2007505222A/ja active Pending
- 2004-04-30 TW TW093112117A patent/TW200501308A/zh unknown
-
2005
- 2005-11-23 US US11/286,170 patent/US20060124055A1/en not_active Abandoned
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5485495A (en) * | 1992-03-31 | 1996-01-16 | Canon Kabushiki Kaisha | X-ray mask, and exposure apparatus and device production using the mask |
EP0569660A1 (de) * | 1992-05-15 | 1993-11-18 | Leybold Aktiengesellschaft | Vorrichtung zum Halten von Substraten |
US5682228A (en) * | 1993-06-02 | 1997-10-28 | Sanei Giken Co., Ltd. | Alignment method and apparatus in an exposing process |
DE19533402A1 (de) * | 1995-09-09 | 1997-03-13 | Leybold Ag | Substrat- und Maskenhaltevorrichtung |
JPH10121241A (ja) * | 1996-10-17 | 1998-05-12 | Nec Corp | 真空蒸着装置 |
US6440219B1 (en) * | 2000-06-07 | 2002-08-27 | Simplus Systems Corporation | Replaceable shielding apparatus |
Non-Patent Citations (1)
Title |
---|
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 10 31 August 1998 (1998-08-31) * |
Also Published As
Publication number | Publication date |
---|---|
CN100489146C (zh) | 2009-05-20 |
JP2007505222A (ja) | 2007-03-08 |
DE10324202A1 (de) | 2004-12-16 |
TW200501308A (en) | 2005-01-01 |
EP1639148A1 (de) | 2006-03-29 |
WO2004106580B1 (de) | 2005-01-27 |
KR20060003103A (ko) | 2006-01-09 |
CN1795283A (zh) | 2006-06-28 |
US20060124055A1 (en) | 2006-06-15 |
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