WO2004097080A1 - シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 - Google Patents
シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 Download PDFInfo
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- WO2004097080A1 WO2004097080A1 PCT/JP2004/006020 JP2004006020W WO2004097080A1 WO 2004097080 A1 WO2004097080 A1 WO 2004097080A1 JP 2004006020 W JP2004006020 W JP 2004006020W WO 2004097080 A1 WO2004097080 A1 WO 2004097080A1
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- WIPO (PCT)
- Prior art keywords
- quartz glass
- crucible
- single crystal
- glass crucible
- range
- Prior art date
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 250
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 95
- 239000013078 crystal Substances 0.000 title claims abstract description 95
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 94
- 239000010703 silicon Substances 0.000 title claims abstract description 94
- 238000000034 method Methods 0.000 title claims description 25
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000000843 powder Substances 0.000 claims abstract description 41
- 239000000377 silicon dioxide Substances 0.000 claims abstract description 26
- 239000011521 glass Substances 0.000 claims abstract description 23
- 239000010453 quartz Substances 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims abstract description 6
- 230000008018 melting Effects 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 19
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 10
- 238000005530 etching Methods 0.000 claims description 2
- 238000005488 sandblasting Methods 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 2
- 210000002784 stomach Anatomy 0.000 claims 1
- 230000000052 comparative effect Effects 0.000 description 10
- 238000010828 elution Methods 0.000 description 10
- 239000000155 melt Substances 0.000 description 6
- 238000007788 roughening Methods 0.000 description 5
- 238000002425 crystallisation Methods 0.000 description 4
- 230000008025 crystallization Effects 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000010899 nucleation Methods 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 2
- 239000000872 buffer Substances 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920005591 polysilicon Polymers 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000013138 pruning Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 210000000689 upper leg Anatomy 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
- C03B19/09—Other methods of shaping glass by fusing powdered glass in a shaping mould
- C03B19/095—Other methods of shaping glass by fusing powdered glass in a shaping mould by centrifuging, e.g. arc discharge in rotating mould
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
- C30B15/10—Crucibles or containers for supporting the melt
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T117/00—Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
- Y10T117/10—Apparatus
- Y10T117/1024—Apparatus for crystallization from liquid or supercritical state
- Y10T117/1032—Seed pulling
- Y10T117/1052—Seed pulling including a sectioned crucible [e.g., double crucible, baffle]
Definitions
- the present invention relates to a quartz glass crucible for pulling a silicon single crystal and a method for producing the same.
- CZ method Chiyoklarski method
- a silicon polycrystal is melted in a crucible made of quartz glass, a silicon single crystal seed crystal is immersed in this silicon melt, and the seed crystal is gradually pulled up while rotating the crucible to produce a silicon single crystal.
- the single crystal produced by the CZ method is required to be high-purity and capable of producing silicon wafers at a high yield.
- Quartz glass crucibles used for the production are transparent and contain no bubbles.
- a quartz glass crucible with a two-layer structure consisting of an inner layer and an opaque outer layer containing bubbles is generally used.
- the above-mentioned brown ring is considered to be generated mainly by fine scratches on the glass surface, crystalline residual parts that remain undissolved in the raw material powder, and defects in the force lath structure.
- the melting time is increased and the temperature is increased to eliminate the crystalline residual components, or the patent No. 2811 1290 and the patent No. 2933334
- An amorphous synthetic powder is used as a raw material powder to be formed on the inner surface as shown in Fig. 1.
- the synthetic quartz glass made of the amorphous synthetic powder has an extremely low impurity content.
- the transparent inner layer is made of synthetic quartz glass and the outer layer is opaque quartz made of natural quartz glass.
- the transparent inner layer and the outer layer have different properties, the difference between transparent and opaque, and the difference between synthetic and natural, the physical properties of the transparent inner layer and the outer layer are greatly different.
- Crucibles with long contact time with the melt may have problems such as deformation and peeling of the transparent inner layer, and crucibles whose transparent inner layer is made of synthetic quartz glass are made of natural quartz glass.
- the inventor of the present invention has conducted intensive studies to solve the above-mentioned drawbacks.
- the quartz glass crucible used for pulling the silicon single crystal at least the inner surface near the curved portion is made of a transparent layer made of synthetic quartz glass, so that a high yield above the silicon single crystal bow I can be realized.
- the existence of a transparent layer made of natural quartz glass between the transparent layer made of synthetic quartz glass and the opaque outer layer made of natural quartz glass can solve problems such as deformation and peeling of the inner layer.
- natural quartz glass or a very thin synthetic quartz glass layer it is possible to suppress the occurrence of vibration on the silicon melt surface. I understood.
- the length M measured along the inner surface of the quartz glass crucible from the initial melt level of the silicon melt to the remaining melt position after the single crystal was pulled is compared with the initial melt level of the single crystal bow I. If the ratio between the number of brown rings generated in the range of 0.3 M and the number of brown rings in the range of 0.3 M from the remaining hot water position after raising the bow I is set to a specific range or more, vibration of the melt surface will increase. It was found that the yield of raising the single crystal bow I was high.
- the occurrence of vibration on the melt surface is suppressed, and the occurrence rate of the rough surface on the inner surface of the crucible is low even during long-time operation, and the silicon single crystal can be stably pulled up. It is intended to provide a quartz glass crucible for pulling a silicon single crystal. You. '
- Another object of the present invention is to provide a method for producing a quartz glass crucible for pulling a silicon single crystal having the above-mentioned excellent characteristics at a low cost. Disclosure of the invention
- the present invention firstly provides a quartz glass crucible having an opaque outer layer formed by melting natural silica powder and a transparent layer formed inside the outer layer, wherein the transparent layer has a thickness of 0.4 made of natural quartz glass.
- a layer of ⁇ 5.0 mm, and at least 0.15 to 0.55 L with respect to the distance L from the bottom center of the inner surface of the quartz glass crucible to the top surface along the crucible inner surface The present invention relates to a quartz glass crucible for pulling a silicon single crystal having a transparent layer made of synthetic quartz glass formed inside.
- the present invention relates to a quartz glass crucible having an opaque outer layer made of natural quartz glass and a transparent layer formed inside the outer layer, from the initial molten metal surface position of the silicon melt to the remaining molten metal position after the single crystal is pulled up.
- the number of brown rings per unit area (cm 2 ) observed in the range of 3 M from the initial molten metal level was 0. It relates to a quartz glass crucible for pulling a silicon single crystal, which is 1.8 times or more the number of 15 Brown rings observed up to 3 M.
- the present invention relates to a method for producing a quartz glass crucible for pulling a silicon single crystal.
- the first quartz glass crucible of the present invention has a transparent layer made of natural quartz glass provided inside an opaque outer layer made of natural quartz glass, and extends along the inner surface of the crucible from the center of the bottom of the transparent layer.
- the transparent layer made of synthetic quartz glass is formed on the inner side of at least 0.15 to 0.55 L with respect to the distance (L) to the upper end face. It is an English glass crucible that buffers distortion at the boundary with the opaque outer layer made of lath and does not deform or peel off the transparent layer.
- the thickness of the transparent layer made of natural quartz glass is 0.4 to 5.0 mm, preferably 0.7 to 4.0 mm.
- the function as a buffer portion is changed to M.
- a transparent layer made of synthetic quartz glass is formed in the range of 0.6 to 1.0 L with respect to the distance (L) from the center of the bottom surface of the crucible inner surface to the upper end surface along the crucible inner surface. If not, or if formed, the thickness should be 0.2 mm or less.
- the polysilicon is melted (menole down), and the synthetic quartz glass is removed before the pulling is started.
- the transparent layer is melted and the natural quartz glass layer is exposed, and the vibration of the silicon melt can be suppressed.
- the amount of natural quartz glass that dissolves into the silicon melt at the time of meltdown is smaller, and therefore, the penetration of impurities into the silicon melt can be reduced.
- the yield of pulling a silicon single crystal depends on the transformation of the single crystal. Most of the yield is in the latter half of the pulling process, that is, the contact time with the silicon melt is long, and the heat load from the heater is large.
- the inner surface that occurs from the curved part of the glass crucible to the bottom (at least 0.15 to 0.55 L with respect to the distance L from the center of the bottom of the inner surface of the crucible to the top surface along the inner surface) Due to rough skin and peeling of inner layer. Therefore, roughening of the skin and peeling of the inner layer can be remarkably reduced by forming the inner surface of the above range as a transparent layer made of synthetic quartz glass.
- the thickness of the transparent layer made of synthetic quartz glass is preferably in the range of 0.2 to 1.5 mm.
- the thickness is less than 0.2 mm, the effect of suppressing roughening and peeling of the inner layer is small, and even when a layer exceeding 1.5 mm is formed, the effect of suppressing roughening and peeling of the inner layer does not change. It is not preferable because the production cost of the glass crucible is increased.
- the quartz glass crucible according to the first aspect of the present invention it is desirable to reduce the OH group concentration of the opaque outer layer made of natural quartz glass in order to prevent deformation during use at high temperatures.
- the OH group concentration of the opaque outer layer is preferably set to 20 to 60 p pm at an average OH group concentration C c. Meanwhile, 0 H group concentration it is preferable to increase the 100 to 300 p pm in average OH group concentration C A in order to improve the wettability of the silicon melt of the transparent layer made of synthetic quartz glass.
- the 0 H group concentration of the transparent inner layer made of natural quartz glass provided between the outer layer and the transparent layer is set to the average 0 H of the intermediate value between the outer layer and the transparent layer.
- the second quartz glass crucible of the present invention is a quartz glass crucible having an opaque outer layer made of natural quartz glass and a transparent layer formed inside the quartz glass crucible from the initial molten metal level of the silicon melt.
- Unit area (cm 2 ) of Brown ring observed within 0.3 M from the initial molten metal level to the length M measured along the inner surface of the quartz glass crucible up to the residual molten metal level after crystal pulling Quartz glass for pulling a silicon single crystal whose number per contact is 1.8 times or more, preferably 2.5 times or more of the number of brown rings observed in the range up to 0.3 M above the remaining hot water position It is a sludge.
- the brown ring is a brown ring of cristobalite as described above.
- 17 is the crucible inner surface
- 18 is a brown ring
- 19 is a crystallized structure
- 20 is a glass elution surface.
- the number of brown rings counts the number of brown rings observed Te arbitrary three points odor Width 1 0 cm in the crucible circumferential direction, the number per unit area divided connexion calculated by the measurement area (cm 2) It is.
- the contact time of the crucible with the silicon melt is long, and the brown ring grows easily.
- L ⁇ The brown ring may fuse near the residual hot water. In this case, a single brown ring observed within the same measurement range
- the area per one piece is calculated from the average diameter of the pieces, and the value obtained by dividing the area of the S! Fe joint part by the area per one piece is defined as the number of brown rings in the fused part.
- the vibration of the silicon melt surface during the CZ method occurs particularly frequently when the melt surface is in the range from the initial molten metal level to 0.3 M.
- the vibration of the silicon melt surface can be suppressed.
- the diameter of the brown ring is small, and the state is as shown in FIG. 4a, where no glass elution surface is generated, and the number of the brown rings is increased.
- it does not affect the single crystal pulling yield.
- the number of brown rings increases from the initial molten metal level of the silicon melt.
- the number per unit area (cm 2 ) observed within the range of 0.3 M from the initial molten surface position to the remaining hot water position The number is 1.8 times or more, preferably 2.5 times or more, of the number observed in the range up to 0.3 M.
- the number of brown rings observed from the initial surface level to the range of 0.3 M is 2.0 to 5.0 / cm 2 , vibration of the silicon melt surface can be reliably suppressed. Can be.
- the yield of silicon single crystal becomes high water level if the number of Buraunri ring observed in the extent of up to the remaining hot water position on 0. 3 M is 0.0 2 is zero. 9 / cm 2 or less .
- the crystal may be melted again and the pulling may be repeated, so-called menoleto back may be performed.
- FIG. 1 is a schematic sectional view of a quartz glass crucible of the first invention.
- FIG. 2 is a schematic sectional view of a quartz glass crucible of the second invention.
- FIG. 3 is a schematic view of an apparatus for producing the quartz glass crucible.
- FIG. 4 is a partial plan view of the inner surface of a quartz glass crucible showing the occurrence of brown rings occurring during the CZ method.
- 1 is a quartz glass crucible
- 2 is the bottom of the crucible
- 3 is a straight body
- 4 is an opaque outer layer made of natural quartz glass
- 5 is a transparent layer made of natural quartz glass
- 6 is a synthetic layer.
- 7 is a curved portion.
- the first quartz glass crucible of the present invention has an opaque outer layer formed by melting a natural silica powder and a thickness of 0.4 to 5 consisting of a natural quartz glass formed inside the outer layer.
- the distance from the bottom center of the inner surface of the quartz glass crucible to the upper end surface along the crucible inner surface is at least 0.15 to 0.55 L.
- This is a quartz glass crucible with a transparent layer made of synthetic quartz glass formed inside of the range.
- the second quartz glass crucible of the present invention comprises an opaque layer made of natural quartz glass and a transparent layer made of quartz glass inside the opaque layer as shown in FIG.
- the inner surface in the range of 0.3 M from the initial surface level is a transparent layer made of natural quartz glass or natural synthetic mixed quartz glass, and the inner surface in the range up to 0.3 M above the remaining hot water position is synthesized.
- the transparent layer made of quartz glass, and the inner surface in the other area is a quartz glass crucible formed with a transparent layer made of any of natural, natural and synthetic, and synthetic.
- the first and second quartz glass crucibles are manufactured using the apparatus shown in FIG. That is, natural silica powder is introduced into a rotating mold 8 and molded into a crucible shape, and then an arc electrode 14 is inserted into the crucible shape, and the opening of the crucible-shaped molded body is covered with a plate-like lid 11.
- the internal cavity of the crucible-shaped molded body is made into a high-temperature gas atmosphere 16 by the arc electrode 14 to at least partially melt vitrify to form an opaque crucible substrate, and then supply synthetic silica powder with silica powder. It is supplied to the high-temperature atmosphere 16 from the means 15 to form a transparent glass layer 6 made of synthetic quartz glass on the inner surface of the crucible by being melted into glass.
- High-purity natural siliceous powder or natural synthetic mixed siliceous power is supplied to the high-temperature atmosphere 16 while adjusting the supply amount from the supply means 10 with the flow rate regulating valve 12, and the vitrified natural silica glass or natural synthetic Mixed quartz gas
- a transparent layer 5 made of glass is formed at least within the range of 0.3 M from the initial molten metal level, and synthetic silica powder is supplied from a silicon powder supply means 15 to a high-temperature atmosphere 16 and is melted and vitrified to synthesize.
- This is a method in which the transparent layer 6 made of quartz glass is formed in a range of at least 0.3 M above the remaining molten metal position except for the range of 0.3 M from the initial molten metal surface position on the crucible surface.
- the entire inner layer of the crucible is made of synthetic quartz glass, and the inner surface within a range of 0.3 M from the initial molten metal level of the crucible is etched.
- the ratio of the number of brown rings can be adjusted to 1.8 times or more, preferably 2.5 times or more.
- a purified high-purity natural silica powder is charged into a rotating mold 8 to form a crucible-like molded body 9 by centrifugal force, and an arc electrode 14 is inserted therein.
- the opening was covered with a plate-shaped lid 11, and the inside of the inner cavity was turned into a high-temperature gas atmosphere by an arc electrode 14, melted and vitrified, and cooled to form an opaque outer layer 4 having a thickness of 8 to 1 Omm. .
- the internal cavity of the opaque outer layer 4 is brought into a high-temperature atmosphere 16 with the arc electrode 14, and then the natural silicate powder is supplied at 100 g / min from the silicate powder supply nozzle 15, and the opaque outer layer 4
- a transparent layer 5 made of natural quartz glass with a thickness of 0.9 to 2 mm was melted on the surface.
- synthetic powder is supplied at a rate of 100 g / min from the powder supply nozzle 15, and the distance (L) from the center of the bottom of the transparent layer to the upper end surface along the inner surface of the crucible is 0.55.
- the transparent layer 6 made of synthetic quartz glass has a thickness of 0.5 to: 1.2 mm, and 0.55 to 0.5.
- the obtained quartz glass crucible has a diameter of 24 inches, the average opacity of the opaque outer layer 4 made of natural quartz glass 4 is 40 cpm, and the transparent layer made of natural quartz glass is 40 ppm.
- Average OH group concentration C B of 5 1 10 p pm, average 0 H group concentration C A in the transparent layer 6 made of a synthetic quartz glass was 220 p pm.
- Example 1 the transparent layer 5 made of natural quartz glass and the transparent layer 6 made of synthetic quartz glass formed on the inner surface of the quartz glass crucible were fused and integrated to the thicknesses shown in Table 1, respectively, to form a 24-inch quartz glass crucible.
- the average OH group concentration of each layer of the manufactured quartz glass crucible was as shown in Table 1.
- Example 1 a transparent layer 5 made of natural quartz glass and a transparent layer 6 made of synthetic quartz glass formed on the inner surface of the quartz glass crucible were fused and integrated to a thickness shown in Table 2, respectively.
- Crucibles were manufactured.
- Table 2 shows the average OH group concentration of each layer of the manufactured quartz glass crucible. Using this quartz glass crucible, a silicon single crystal was pulled in the same manner as in Example 1. Table 2 shows the results.
- high-purity natural silica powder that has been purified is put into a rotating mold 8 and formed into a quartz glass crucible-like molded body 9 by centrifugal force. Then, the opening is covered with a plate-like lid 11, the inside of the inner cavity is made to have a high-temperature gas atmosphere by an arc electrode 14, and is melt-vitrified to form an opaque quartz glass outer layer 4, and silica powder is supplied.
- the natural silica powder was supplied at 10 Og / min from the means 10, and the transparent layer 5 made of natural quartz glass was integrated with the inner surface of the opaque quartz glass outer layer 4.
- the silicon single crystal pulled had us after use, after the single crystal pulled up from the initial melt surface position of the silicon melt ⁇ residue
- a transparent layer 6 made of synthetic quartz glass is fused to the inside of a range of 0.5 to 1.0 mm from the initial molten metal level to the length ⁇ measured along the inner surface of the quartz glass crucible up to the hot water position.
- An integrated quartz glass crucible with an outer diameter of 22 inches was manufactured. Using this quartz glass crucible, a silicon single crystal was pulled by the C ⁇ method. Table 3 shows the results of pulling the silicon single crystal and the number of brown rings measured on the inner surface of the crucible.
- high-purity natural silica powder that has been purified is put into a rotating mold 8, formed into a crucible-like molded body 8 by centrifugal force, and an arc electrode 14 is inserted therein. Then, the opening is covered with a plate-shaped lid 11, the inside of the inner cavity is made into a high-temperature gas atmosphere by an arc electrode 14, and is melt-vitrified to form an opaque outer layer 4, and is synthesized from silica powder supply means 15. Dust powder was supplied at 100 / min, and a transparent layer made of synthetic quartz glass was fused and integrated over the entire inner surface of the opaque outer layer 4.
- a purified high-purity natural silica powder is put into a rotating mold 8 and formed into a crucible-like molded body 9 by centrifugal force, in which an arc electrode 14 is placed. Then, the opening is covered with a plate-like lid 11, the inside of the inner cavity is made into a high-temperature gas atmosphere by an arc electrode 14, and is melt-vitrified to form an opaque outer layer 4, and the silica powder supply means 15 is used.
- Synthetic silica powder was supplied at 100 g / min, and a transparent layer made of synthetic quartz glass was fused and integrated over the entire inner surface of the opaque outer layer 4 to form a quartz glass crucible having an outer diameter of 22 inches. Manufactured.
- the purified high-purity natural silica powder is put into the rotating mold 8 and formed into a crucible-like molded body 9 by centrifugal force, into which the arc electrodes 14 are inserted. Then, the opening is covered with a plate-shaped lid 11, the inside of the inner cavity is made into a high-temperature gas atmosphere by an arc electrode 14, and is melt-vitrified to form an opaque outer layer 4.
- Synthetic silica powder is supplied at 100 g / min, and the entire inner surface of the opaque outer layer 4 is made of synthetic quartz glass. The transparent layer was fused and integrated to produce a quartz glass crucible with an outer diameter of 22 inches. Using this quartz glass crucible, a silicon single crystal was pulled by the CZ method. Table 3 shows the results of pulling the silicon single crystal and the results of measuring the number of brown rings on the inner surface of the crucible. Comparative Example 5
- the purified high-purity natural silica powder is put into a rotating mold 8 and formed into a crucible-like molded body 9 by centrifugal force, in which the arc electrodes 14 are placed. It is inserted, the opening is covered with a plate-like lid 11, the inside of the inside cavity is made into a high-temperature gas atmosphere by the arc electrode 14, and is melt-vitrified to form an opaque outer layer, and the silica powder supply means 10 is used.
- Natural silica powder was supplied at 100 g / min, and a transparent layer made of natural quartz glass was integrated over the entire inner surface of the opaque outer layer 4 to produce a quartz glass crucible having an outer diameter of 22 inches. . Using this quartz glass crucible, a silicon single crystal was pulled by the CZ method. Table 3 shows the results of pulling the silicon single crystal and measuring the number of brown rings on the inner surface of the crucible.
- the second quartz glass crucible of the present invention is a single crystal with no vibration of the silicon melt and a level of no problem if any. Conversion rate.
- the conventional quartz glass crucible shown in Comparative Example 4 suffered a large amount of disturbance due to the vibration of the silicon melt during seeding and formation of the shoulder, resulting in a large time gap due to meltback and a long operating time.
- the conventional quartz glass crucible although the number of brown rings was small, the area was large, and the generation rate of the glass elution surface was increased, so that the single crystal ratio was low.
- the quartz glass crucible of the present invention has no vibration on the silicon melt surface and has rough skin. There is no peeling of the inner layer and there is no roughening of the inner surface and no peeling of the inner layer even when used for a long time, and it is possible to pull up the silicon single crystal stably for a long time, and it is useful as a quartz glass crucible for pulling up a silicon single crystal .
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Glass Melting And Manufacturing (AREA)
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP04729527A EP1632592B1 (en) | 2003-05-01 | 2004-04-26 | Quartz glass crucible for pulling up silicon single crystal and method for manufacture thereof |
US10/555,853 US8277559B2 (en) | 2003-05-01 | 2004-04-26 | Quartz glass crucible for pulling up silicon single crystal and method for manufacture thereof |
JP2005505906A JP4166241B2 (ja) | 2003-05-01 | 2004-04-26 | シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 |
NO20055685A NO20055685L (no) | 2003-05-01 | 2005-12-01 | Kvartsglassmeltedigel for a trekke opp enkle silisiumkrystaller og fremstilling av denne |
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JP2003-126490 | 2003-05-01 | ||
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US (1) | US8277559B2 (ja) |
EP (2) | EP1632592B1 (ja) |
JP (2) | JP4166241B2 (ja) |
KR (2) | KR100774606B1 (ja) |
NO (1) | NO20055685L (ja) |
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JP2009051729A (ja) * | 2003-05-01 | 2009-03-12 | Shinetsu Quartz Prod Co Ltd | シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 |
JP2005343774A (ja) * | 2004-06-07 | 2005-12-15 | Shinetsu Quartz Prod Co Ltd | シリコン単結晶引上げ用石英ガラスルツボ及びその製造方法 |
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JP2009161364A (ja) * | 2007-12-28 | 2009-07-23 | Japan Siper Quarts Corp | 内面結晶化ルツボおよび該ルツボを用いた引上げ方法 |
JP2009161363A (ja) * | 2007-12-28 | 2009-07-23 | Japan Siper Quarts Corp | シリコン単結晶引上げ用石英ガラスルツボ |
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JP2011068522A (ja) * | 2009-09-28 | 2011-04-07 | Covalent Materials Corp | シリコン単結晶引上げ用シリカガラスルツボ |
WO2013140706A1 (ja) | 2012-03-23 | 2013-09-26 | 信越石英株式会社 | 単結晶シリコン引き上げ用シリカ容器及びその製造方法 |
WO2013171955A1 (ja) * | 2012-05-16 | 2013-11-21 | 信越石英株式会社 | 単結晶シリコン引き上げ用シリカ容器及びその製造方法 |
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CN104662210A (zh) * | 2012-09-27 | 2015-05-27 | 赫罗伊斯石英玻璃股份有限两合公司 | 根据切克劳斯基法提拉半导体单晶和适用于其的石英玻璃坩埚 |
US9856576B2 (en) | 2012-09-27 | 2018-01-02 | Heraeus Quarzglas Gmbh & Co. Kg | Pulling a semiconductor single crystal according to the Czochralski method |
DE102012109181B4 (de) | 2012-09-27 | 2018-06-28 | Heraeus Quarzglas Gmbh & Co. Kg | Ziehen eines Halbleiter-Einkristalls nach dem Czochralski-Verfahren und dafür geeigneter Quarzglastiegel |
US10287705B2 (en) | 2012-09-27 | 2019-05-14 | Heraeus Quarzglas Gmbh & Co. Kg | Pulling a semiconductor single crystal according to the Czochralski method and silica glass crucible suitable therefor |
JP2020063160A (ja) * | 2018-10-15 | 2020-04-23 | 株式会社Sumco | 石英るつぼ内周面の評価方法及び石英るつぼ内周面の評価装置 |
Also Published As
Publication number | Publication date |
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EP1632592A1 (en) | 2006-03-08 |
JP4948504B2 (ja) | 2012-06-06 |
KR20050087881A (ko) | 2005-08-31 |
US20060236916A1 (en) | 2006-10-26 |
NO20055685D0 (no) | 2005-12-01 |
JP2009051729A (ja) | 2009-03-12 |
TW200426257A (en) | 2004-12-01 |
EP1632592A4 (en) | 2011-04-13 |
JPWO2004097080A1 (ja) | 2006-07-13 |
KR100718314B1 (ko) | 2007-05-15 |
TWI275669B (en) | 2007-03-11 |
NO20055685L (no) | 2006-01-19 |
KR100774606B1 (ko) | 2007-11-09 |
KR20060129107A (ko) | 2006-12-14 |
EP1632592B1 (en) | 2012-06-20 |
EP2484814A1 (en) | 2012-08-08 |
US8277559B2 (en) | 2012-10-02 |
JP4166241B2 (ja) | 2008-10-15 |
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