WO2004088733A1 - ダミーウエハ - Google Patents
ダミーウエハ Download PDFInfo
- Publication number
- WO2004088733A1 WO2004088733A1 PCT/JP2004/004514 JP2004004514W WO2004088733A1 WO 2004088733 A1 WO2004088733 A1 WO 2004088733A1 JP 2004004514 W JP2004004514 W JP 2004004514W WO 2004088733 A1 WO2004088733 A1 WO 2004088733A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layers
- layer
- carbon fiber
- cfrp
- tensile modulus
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims abstract description 246
- 239000004918 carbon fiber reinforced polymer Substances 0.000 claims abstract description 145
- 239000012792 core layer Substances 0.000 claims abstract description 28
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 168
- 239000004917 carbon fiber Substances 0.000 claims description 168
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 89
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- 239000004065 semiconductor Substances 0.000 claims description 13
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- 239000003795 chemical substances by application Substances 0.000 claims description 10
- 239000011247 coating layer Substances 0.000 claims description 10
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
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- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 239000002798 polar solvent Substances 0.000 claims description 6
- 238000000465 moulding Methods 0.000 abstract description 9
- 230000003287 optical effect Effects 0.000 abstract description 7
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- 239000000047 product Substances 0.000 description 16
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 15
- 238000000034 method Methods 0.000 description 14
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- 239000000463 material Substances 0.000 description 12
- 239000012783 reinforcing fiber Substances 0.000 description 11
- 239000002131 composite material Substances 0.000 description 10
- 244000062645 predators Species 0.000 description 10
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- 238000005452 bending Methods 0.000 description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 8
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- 239000002345 surface coating layer Substances 0.000 description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 5
- 230000008859 change Effects 0.000 description 5
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 5
- 239000013034 phenoxy resin Substances 0.000 description 5
- 229920006287 phenoxy resin Polymers 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 238000005728 strengthening Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
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- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical group CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
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- 229930185605 Bisphenol Natural products 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
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- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
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- 239000004113 Sepiolite Substances 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
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- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
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- 229910052582 BN Inorganic materials 0.000 description 1
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- SPANOECCGNXGNR-UITAMQMPSA-N Diallat Chemical compound CC(C)N(C(C)C)C(=O)SC\C(Cl)=C\Cl SPANOECCGNXGNR-UITAMQMPSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002430 Fibre-reinforced plastic Polymers 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
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- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
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- 229920002978 Vinylon Polymers 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000005456 alcohol based solvent Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 description 1
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- 239000002585 base Substances 0.000 description 1
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- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000012954 diazonium Substances 0.000 description 1
- AYOHIQLKSOJJQH-UHFFFAOYSA-N dibutyltin Chemical compound CCCC[Sn]CCCC AYOHIQLKSOJJQH-UHFFFAOYSA-N 0.000 description 1
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- LZFQGEMBQPYJJJ-UHFFFAOYSA-N ethanamine;trichloroborane Chemical compound CCN.ClB(Cl)Cl LZFQGEMBQPYJJJ-UHFFFAOYSA-N 0.000 description 1
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 239000011151 fibre-reinforced plastic Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- XUCNUKMRBVNAPB-UHFFFAOYSA-N fluoroethene Chemical group FC=C XUCNUKMRBVNAPB-UHFFFAOYSA-N 0.000 description 1
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
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- 239000002932 luster Substances 0.000 description 1
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- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
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- 150000002978 peroxides Chemical class 0.000 description 1
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- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
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- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
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- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
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- 150000003839 salts Chemical class 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
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- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
Definitions
- the present invention relates to a dummy wafer used in a semiconductor manufacturing process for a semiconductor integrated circuit, a semiconductor memory, and the like.
- An object of the present invention is to provide a dummy wafer which is rigid and has high strength even if it is thin and has a large diameter of up to 0.75 mm, is relatively inexpensive, and can respond to an optical sensor.
- Another object of the present invention is to provide a dummy wafer having low dust generation and a dummy wafer having heat resistance.
- the wafer substrate has a plurality of one-dimensional reinforced CFRP layers, which are layers of a carbon fiber reinforced plastic made of a cured molded product of a one-way pre-preder in which carbon fibers are oriented in one direction,
- a tensile elastic modulus of a carbon fiber in a part of the plurality of one-dimensional reinforced CFRP layers is higher than a tensile elastic modulus of a carbon fiber in another layer.
- the wafer substrate has two skin layers each located on the main surface side, and a core layer located between the two skin layers;
- Each of the two skin layers has a plurality of the one-dimensional reinforced CFRP layers,
- the orientation direction of one of the two outermost CFRP layers which is the one-dimensional reinforced CFRP layer located closest to the main surface in each of the two skin layers, is taken as a reference direction
- the other outermost CFRP layer is The orientation direction of the carbon fiber is in an angle range of 120 ° to 120 ° with respect to the reference direction
- the tensile modulus of the carbon fibers in the two outermost CFRP layers is 200 GPa to 60 OGPa
- Each of the two skin layers is oriented in an angle range of + 75 ° to 1090 ° with respect to the reference direction and has a tensile modulus of 4 OGPA to 1000 GPa, and any outermost CFRP One-dimensional reinforced CFRP layer containing carbon fibers higher than the tensile modulus of the carbon fibers in the layer, or oriented in the angle range of 1 75 ° to 1 90 ° with respect to the reference direction Z and the tensile modulus.
- the core layer is a one-dimensional reinforced CFRP layer containing carbon fibers oriented in an angle range of + 30 ° to -60 ° with respect to the reference direction and having a tensile modulus of 400 GPa to 1000 GPa, and Z or The dummy wafer according to 6), having a one-dimensional reinforced CFRP layer containing carbon fibers oriented in an angle range of 30 ° to 160 ° and having a tensile modulus of 400 GPa to 1000 GPa.
- the wafer substrate has two skin layers located on the main surface side, and a core layer located between the two skin layers,
- Each of the two skin layers is a layer made of a carbon fiber reinforced plastic made of a cured molded product of a one-way pre-preder in which carbon fibers are oriented in one direction.
- the other outermost CFRP layer is The orientation direction of the carbon fiber is 120 ° to +20 with respect to the reference direction. In the angle range of
- Each of the two outermost CFRP layers has a tensile modulus of carbon fiber of 200 GPa to 60 OGPa,
- Each of the two skin layers is oriented in an angle range of + 75 ° to + 90 ° with respect to the reference direction, and has a tensile modulus of elasticity of carbon fiber of the outermost CFRP layer included in the skin layer.
- a carbon fiber-containing one-dimensional reinforced CFRP layer having a tensile modulus of 1.5 to 3.0 times the tensile elasticity ⁇ 4 rate of the carbon fiber of the outermost CFRP layer included in the skin layer,
- the core layer has a one-dimensional reinforced CF RP layer containing carbon fibers oriented in an angle range of 120 ° to + 20 ° with respect to the reference direction and having a tensile modulus of 200 GPa to 400 GPa,
- a dummy worm characterized in that it has a one-dimensional reinforced CFRP layer containing carbon fiber oriented in the angle range of 75 ° to 190 ° and having a tensile modulus of 200 GPa to 400 GPa.
- At least one of the two skin layers is further oriented in an angle range of + 30 ° to 1060 ° with respect to the reference direction, and has a tensile modulus of carbon of the outermost CFRP layer included in the skin layer.
- a one-dimensional reinforced CFRP layer containing carbon fiber that is 1.5 to 3.0 times the tensile modulus of the fiber or in an angle range of 30 ° to 160 ° with respect to the reference direction.
- the dummy wafer according to 9) having a one-dimensional reinforced CFRP layer containing carbon fibers having a tensile elastic modulus of 1.5 to 3.0 times the carbon fiber of the outermost CFRP layer.
- the wafer substrate has a processing surface
- a coating layer that covers the processing surface and is made of a resin that is resistant to a polar solvent and that is cured at a temperature of 70 ° C or less.
- FIG. 1 is a schematic view showing one embodiment of the dummy wafer of the present invention, in which (a) is a top view and (b) is a cross-sectional view along AA ′.
- FIGS. 2A and 2B are schematic cross-sectional views showing other forms of the dummy wafer of the present invention.
- FIG. 3 is a schematic cross-sectional view showing one form of a wafer substrate.
- FIG. 4 is a schematic cross-sectional view of the dummy wafer manufactured in Example 1.
- the shape of the dummy wafer of the present invention is not particularly limited, but is usually the same as the shape of a prime wafer used in an actual semiconductor product.
- the standard is defined as SEMI (Semi-ductor Equ imenta nt Material lnternati on al; standard). The same is true.
- CFRP Carbon fiber reinforced plastic
- CFRP can be obtained by impregnating a matrix resin into a reinforcing fiber mainly composed of carbon fiber to form a pre-preg, laminating the pre-preda as required, and then curing the matrix resin.
- thermosetting resin a thermosetting resin, a thermoplastic resin, and a mixture of two or more of them can be used, and a thermosetting resin is particularly preferably used.
- Thermosetting resins include epoxy resin, aramide resin, bismaleimide resin, phenol resin, furan resin, urea resin, unsaturated polyester resin, epoxy acrylate resin, diaryl phthalate resin, butyl ester resin, thermosetting polyimide Thermosetting resins such as resin and melamine resin can be used, and epoxy resins are preferred.
- the thermoplastic resins include nylon resin, liquid crystalline aromatic polyamide resin, polyester resin, liquid crystalline aromatic polyester resin, polypropylene resin, polyetherphone resin, polyphenylene sulfide resin, polyetheretherketone resin, polysulfone resins, polyvinylidene chloride Bulle resin, vinylon resin, Aramido; can be used Kitsuki fact, resin and fluorine resin.
- the matrix resin is preferably 5,000 to 10,000 poise at 25 ° C., more preferably 10,000 to 1,000 poise, more preferably 100,000 poise to 1.0,000. 0 voice, more preferably 50,000 voice to 150,000 voice, of 50.
- C has a viscosity of preferably from 1,000 poise to 300,000 vise, more preferably from 1,000 poise to 10,000 vise.
- the number By setting the number to 0.000 or more, it is possible to excellently prevent the prepreg once adhered at the time of laminating the prepreg from being easily peeled off at the time of laminating the prepreg and making it difficult to correct the lamination of the prepreg.
- the viscosity at 50 ° C to be not less than 1,000 voids, the resin impregnation property is good, and the resin flow property at the time of molding can be excellently prevented.
- the viscosity of the resin By setting the viscosity of the resin to be equal to or less than 30,000 voids, it is possible to excellently prevent the resin flowability at the time of molding from being small and impairing the resin impregnation.
- the amount of the matrix resin contained in the pre-preda is preferably 20% by mass based on the total amount of the reinforcing fibers and the matrix resin, irrespective of whether or not a force containing an optional component such as a filler is contained therein. To 50% by mass, more preferably 2.5% to 45% by mass. . (Heat-resistant epoxy resin composition)
- the heat resistance temperature of the dummy wafer can be raised to 230 ° C, and extremely good composite physical properties and excellent
- Art gas is a gas that comes out of the resin and can be a source of contamination in the semiconductor manufacturing process.
- epoxy resins can be used as the epoxy resin used in the above epoxy resin composition.
- Bisphenol A type epoxy resin phenol novolac type epoxy resin, glycidylamine type epoxy resin, bisphenol F type
- An epoxy resin composition comprising one or a combination of two or more selected from epoxy resins and diaminodiphenyl sulfone is preferred.
- a bisphenol A type epoxy resin which is liquid at 20 is preferably used.
- being liquid at 20 ° C. means that the viscosity of the resin at the temperature is in the range of 1 poise to 100 poise, preferably in the range of 10 poise to 500 poise.
- Illustrative examples of bisphenol A-type epoxy resin that is liquid at 20 ° C are: Epototo YD128, YD134 (manufactured by Toto Kasei Co., Ltd.), Epicot 828, 834 (or more) Bisphenol A type epoxy resin which is commercially available under a trade name or product number such as Yuka Shell Epoxy Co., Ltd.).
- the content of the bisphenol A-type epoxy resin in the epoxy resin composition is preferably 20 to 40 parts by mass, more preferably 25 to 100 parts by mass, based on 100 parts by mass of the entire epoxy resin. It is selected in the range of parts by mass to 35 parts by mass.
- the content of the bisphenol A type epoxy resin is preferably 20 to 40 parts by mass, more preferably 25 to 100 parts by mass, based on 100 parts by mass of the entire epoxy resin. It is selected in the range of parts by mass to 35 parts by mass.
- phenol novolak-type epoxy resin a phenol novolak-type epoxy resin having a viscosity at 52 ° C. of from 10 to 300, preferably from 10 to 200, is preferably used.
- resins that can be used include Epoxy Coat 152, 154 (more than oiled shell epoxyne ⁇ ), DEN 431, 438, 439 (more than Dow Chemical), Examples include phenol novolak type epoxy resins which are commercially available under trade names or product numbers such as phenothot YP50, YDPN 638 (manufactured by Toto Kasei). By using this, the composite physical properties, heat resistance and moisture resistance of the composite material can be improved.
- the content of the phenol-novolac epoxy resin in the epoxy resin composition is preferably from 40 to 60 parts by mass, more preferably from 45 to 5 parts by mass, based on 100 parts by mass of the entire epoxy resin. Selected in the range of 5 parts by weight.
- glycidylamine type epoxy resin a tetrafunctional glycidylamine type epoxy resin is preferable, and more specifically, tetraglycidyldiaminodiphenylmethane is preferable.
- This type of tetrafunctional glycidylamine type epoxy resin is available from trade names such as Yepotato YH434 (Tokyo Kasei), ELM434 (Sumitomo Chemical Co., Ltd.), and Epikote 600 (Yukasen Shell Epoxy). Or sold under the product number.
- This component is selected in a range of preferably 10 parts by mass to 30 parts by mass, more preferably 15 parts by mass to 25 parts by mass, based on 100 parts by mass of the total epoxy resin.
- Bisphenol F-type epoxy is a condensation product of bisphenol F and epichlorohydrin.
- Bisphenol F type epoxy with an epoxy equivalent in the range of 150 to 190 and a viscosity at 25 ° C in the range of 4.0 to 4.5 voids It is preferable to use xylyl butter.
- Commercially available products include Epikote 807 (manufactured by Yuka Shell Epoxy), Epotote YDF170 (manufactured by Toto Kasei), Epicron 830 (manufactured by Dainippon Ink and Chemicals).
- the blending amount is preferably 50 parts by mass or less, more preferably 40 parts by mass or less, based on 100 parts by mass of the total epoxy resin. Preferably it is selected from a range of 15 parts by mass or less.
- a phenoxy resin can be used as another component.
- a phenoxy resin represented by the following formula or an epoxy-modified phenoxy resin can be used.
- Specific examples of the phenoxy resin include those commercially available under the trade name or the product number such as YP50 (Tohto Kaseinet: h) and PKHH (manufactured by Phenoxyssiacs).
- the content can be selected in the range of preferably 5 to 20 parts by mass, more preferably 7 to 18 parts by mass, based on 100 parts by mass of the total epoxy resin. .
- diaminodiphenylsulfone 4,4, diaminodiphenylsulfone and 3,3,1-diaminodiphenylsulfone can be used, and 4,4, diaminodiphenylsulfone is preferred.
- This is a component that functions as a curing agent.
- Seika Cure-1 S (trade name, manufactured by Wakayama Kasei Kogyo Co., Ltd.) can be suitably used.
- Seika Cure S is a powder having an average particle size of 8 ⁇ to 9 ⁇ .
- the amount used is preferably in the range of 30 parts by mass to 50 parts by mass, more preferably 35 parts by mass to 45 parts by mass, based on 100 parts by mass of the total epoxy resin in the epoxy resin composition. Selected in the range of parts.
- the content is set to 30 parts by mass or more, the material properties, heat resistance, and flexibility when CFRP is formed are excellent, and by setting the content to 50 parts by mass or less, the epoxy resin composition can be easily formed into a fiber bundle. Can be impregnated.
- diaminodiphenyl sulfone is fine particles having a diameter of from 0.1 ⁇ m to 10 m dispersed in the epoxy resin composition.
- the epoxy resin composition may contain, if necessary, an epoxy resin, a toughness-imparting agent, a filler, a colorant, etc. other than those described above as long as the 'I' viability is not impaired.
- the amount of filler added is the above epoxy resin Usually about 5 to 60 parts by mass with respect to 100 parts by mass of the total epoxy resin in the composition Door can be.
- Examples of usable coloring agents include azo pigments, phthalocyanine-based pigments, quinacridone-based pigments, and anthraquinone-based pigments as organic pigments, and titanium dioxide, graphite, cobalt violet, and red iron oxide as inorganic pigments.
- a curing agent or a curing accelerator other than the above diaminodiphenyl sulfone can be added to the epoxy resin composition as necessary.
- the hardening agent include diaminodiphenylsulfone and diaminogetylbenzene
- examples of the curing accelerator include boron trifluoride monoethylamine complex and boron trichloride monoethylamine complex. it can.
- pitch-based carbon fibers and polyacrylonitrile (PAN) -based carbon fibers can be used.
- the tensile elastic modulus of the carbon fiber used is preferably 40 OGPa or more, more preferably 50 OGPa or more, and still more preferably 60 OGPa or more.
- the tensile modulus of the carbon fiber used is preferably 1 OOOGPa or less, more preferably 90 OGPa or less, and even more preferably 800 GPa or less.
- Pitch-based carbon fibers can be suitably used as the carbon fibers having such a tensile modulus. It is preferable to use pitch carbon fibers also from the viewpoint of cost.
- the pitch-based carbon fiber is a carbon fiber obtained from pitch
- the PAN-based carbon fiber is a carbon fiber obtained from polyacrylonitrile.
- the carbon fiber may be glass fiber, aramide fiber, stainless steel fiber, copper fiber, nickel fiber, titanium fiber, tungsten fiber, silicon carbide fiber, alumina fiber, titanium carbide. It can also be used in combination with fiber, boron nitride or other fibers.
- the form of the above-mentioned reinforcing fiber is not particularly limited, and can be appropriately selected according to the purpose such as one-dimensional reinforcement, two-dimensional reinforcement, three-dimensional reinforcement, and random reinforcement.
- reinforced fibers are staple fibers, woven fabrics, non-woven fabrics, unidirectional materials, two-dimensional fabrics, three-dimensional fabrics, etc. More specifically, felts, mats, braids, perif, pseudo-isotropic materials, plain weaves, satin weaves Materials such as twill weave, mosaic weave, leno weave and the like can be laminated and used.
- CFRP can be manufactured by a generally known method.
- CFRP can be obtained by impregnating a thermosetting resin into a reinforcing fiber added to the above-described form with a matrix resin to form a pre-preda, and then laminating and curing and molding, that is, curing molding. it can.
- the so-called hot menoleto method in which the reinforcing fibers are impregnated by heating to 60 ° C to 90 ° C, can be preferably used.
- the content of the matrix resin in the produced pre-preda is preferably in the range of 20% by mass to 50% by mass, more preferably 25% by mass to 45% by mass, based on the total amount of the reinforcing fiber and the matrix.
- Fillers can be added to the matrix resin as desired.
- the filler include myriki, alumina, talc, finely divided silica, wollastonite, sepiolite, base magnesium sulfate, calcium carbonate, and polytetrafluoroethylene.
- Fluoroethylene powder, zinc powder, aluminum powder, organic fine particles, that is, acrylic fine particles, epoxy resin fine particles, polyamide fine particles, polyurethane fine particles, and the like can be given.
- the prepreg is finally formed into CFRP.
- an autocrepe molding method, a sheet rolling molding method, or the like can be used as the molding method.
- the pre-preda is laminated so as to have a shape suitable for the dummy wafer, and is usually heated at 110 ° C to 150 ° C for 30 minutes in an autoclave or by a press. By heating and curing for 3 hours, CFRP can be obtained.
- the obtained CFRP is stable in quality and has less voids.
- Preferred molding conditions when the above epoxy resin composition is used are a heating temperature of 150 ° C. to 200 ° C. and a curing time of 30 minutes to 2 hours.
- FIG. 1 is a schematic view showing one embodiment of the dummy wafer of the present invention, and FIG. Top view, (b) is AA, sectional view.
- This dummy wafer is composed of a wafer substrate 1.
- the wafer substrate is in the form of a plate, in particular a disk, and has a main surface 2a on the upper surface side, a main surface 2b inverted from the lower surface, and an end surface 3, and a notch 4 which is a notch for alignment. Having.
- the dummy wafer does not need to be composed of only the wafer substrate, and for example, may have a coating layer on the wafer substrate according to a desired purpose such as dust generation prevention and scratch prevention.
- the dummy wafer shown in FIG. 2A has an end face coating layer 4 on the end face of the wafer substrate 1 to cover the end face.
- the dummy wafer shown in FIG. 2 (b) has main surface coating layers 5a and 5b on the main surface of the wafer substrate 1 to cover the respective main surfaces.
- the coating layer can be formed of, for example, a resin. In the case where the notch is provided by a mechanical machine, a coating layer can be provided on the processed surface.
- the wafer substrate can be made of a single plate-like carbon fiber reinforced plastic (CFRP).
- CFRP carbon fiber reinforced plastic
- CFRP layer may be a plate-like laminate that is S-welded and laminated in the thickness direction.
- the wafer substrate can be bonded to the CFRP layer and have another layer that is the same shape as the wafer substrate but with a reduced thickness.
- other layers include a layer made of a resin and a layer made of a fiber-reinforced plastic without using carbon fibers as main reinforcing fibers.
- the wafer substrate having a plurality of CFRP layers may have a CFRP layer of the same shape, dimensions and material all laminated with the same orientation, but this is not necessarily required.
- the multiple CFRP layers may differ in one or more of thickness, material, and orientation.
- the wafer substrate may be formed by laminating CFRP layers of the same shape, size, and material with different orientations.
- CFRP has the property that it is difficult to bend in the direction of orientation of the carbon fiber and easily bends in the direction perpendicular to it. It is preferable that a plurality of CFRPs have different orientations in that the isotropic 1 "life of the wafer substrate on which these are laminated is improved.
- the wafer substrate has a plurality of one-dimensional reinforced CFRP layers, which are layers of a carbon fiber reinforced plastic made of a cured molded product of a one-way pre-preder in which the carbon fibers are oriented in the negative direction, and a plurality of one-dimensional reinforced layers.
- CFRP layers the tensile modulus of carbon fibers in some layers is higher than the tensile modulus of carbon fibers in other layers.
- FIG. 3 schematically shows a wafer substrate having skin layers 11a and 11b located on the two main surface sides, respectively, and a core layer 12 sandwiched therebetween.
- the properties of the skin layer and the outermost layer are more important than the core layer for the bending resistance of the dummy wafer.
- the carbon fibers to be laminated have different elastic moduli.
- the outermost layer of the skin layer (the reinforcing direction, that is, the orientation direction of the carbon fibers is the reference direction of the dummy wafer) is medium or highly elastic.
- the angle display is defined as a counterclockwise direction as a + direction.
- the wafer substrate has two skin layers located on the main surface side, respectively, and a core layer located between the two skin layers.
- Each of the two skin layers has a plurality of CFRP layers, and the orientation direction of one of the two outermost CFRP layers, which is the one-dimensional reinforced CFRP layer located closest to the main surface, in each of the two skin layers.
- the orientation direction of the carbon fiber of the other outermost CFRP layer is in an angle range of 20 ° to + 20 ° with respect to the reference direction
- the tensile modulus of the carbon fibers in the two outermost CFRP layers is 200 GPa to 6 O OGPa
- Each of the two skin layers is oriented in an angle range of + 75 ° to + 90 ° with respect to the reference direction, has a tensile modulus of 4 O OGPa to 1000 GPa, and has any outermost CFRP layer.
- the core layer is a one-dimensional reinforced CFRP layer containing carbon fibers oriented in an angle range of + 30 ° to + 60 ° with respect to the reference direction and having a tensile modulus of 400 GPa to 1000 GPa, and Z or Dummy wafers having a one-dimensional reinforced CFRP layer containing carbon fibers oriented in the angular range of 30 ° to 160 ° and having a tensile modulus of 400 GPa to 1000 GPa.
- the bending stiffness is obtained by multiplying the bending elastic modulus of the layer by the cube of the distance from the neutral axis and the thickness of the layer, so the outermost layer is most likely to be affected by the distance from the neutral axis.
- the thickness of each of the two skin layers is 10% to 45% of the total thickness of the two skin layers and the core layer.
- a dummy wafer having a wafer substrate including carbon fiber reinforced plastic,
- the wafer substrate has two skin layers located on the main surface side, and a core layer located between the two skin layers,
- Each of the two skin layers is a unidirectional pre-preparer in which carbon fibers are oriented in a negative direction.
- the orientation direction of one of the two outermost CFRP layers which is the one-dimensional reinforced CFRP layer located closest to the main surface, in each of the two skin layers is taken as a reference direction
- the other outermost CFRP layer The orientation direction of the carbon fiber is within an angle range of 20 ° to + 20 ° with respect to the reference direction.
- Each of the two outermost CFRP layers has a tensile modulus of carbon fiber of 20 OGPa to 60 OGPa,
- Each of the two skin layers is oriented in an angle range of + 75 ° to 1090 ° with respect to the reference direction, and has a tensile modulus of elasticity of carbon fiber of the outermost CFRP layer included in the skin layer.
- the layer has a one-dimensional reinforced CFRP layer containing carbon fibers oriented in an angle range of 120 ° to 120 ° with respect to the reference direction and having a tensile modulus of 20 OGPa to 400 GPa,
- At least one of the two skin layers further has an outermost CFRP layer oriented in an angle range of + 30 ° to + 60 ° with respect to the reference direction and having a tensile modulus of elasticity in the skin layer.
- a carbon fiber cloth layer is further provided on each main surface from the viewpoint of preventing peeling of the surface layer during machining.
- the wafer substrate can be manufactured, for example, by machining a plate-shaped CRFP into a desired shape such as a circle. Alternatively, it can be manufactured by joining a plurality of plate-shaped CFRPs as necessary to form an integrated sheet-like member having a desired thickness, and machining this into a desired shape. It can be manufactured by combining and joining at least one plate-like C FRP and a plate-like member made of another material to form an integrated plate-like member, and machining this into a desired shape.
- SEMI Ml. 14-95 specifies guidelines for 300 mm to 400 mm mirror-finished single-crystal silicon wafers. The requirements for dimensions and tolerances described in these guidelines are summarized in Table 1.
- the dummy wafer used in place of such a silicon wafer should have the same shape and dimensions as the silicon wafer, but as shown in Table 1, its thickness is as thin as 0.8 mm, and in some cases, it is 0 mm. It is required to be as thin as 5 mm.
- quasi-isotropic lamination for example, 0/90/45 ° It is more preferable that the elastic modulus of each reinforcing fiber is appropriately changed.
- CFRP flexural rigidity
- the processed surface is coated with a resin that is resistant to polar solvents and that cures at a low temperature of 70 ° C or less (hereinafter referred to as coating resin).
- coating resin a resin that is resistant to polar solvents and that cures at a low temperature of 70 ° C or less
- machined surface refers to a portion where carbon fibers in CFRP are exposed by machining such as machining, and specifically, a cut surface, a polished surface, an R-machined surface, a hole-machined surface, a thin-machined surface, etc. .
- machining such as machining, and specifically, a cut surface, a polished surface, an R-machined surface, a hole-machined surface, a thin-machined surface, etc.
- the end surface of the wafer substrate is a machined surface formed by machining, it is preferable to provide a coating layer on the end surface as shown in FIG.
- This coating also has the effect of protecting the end face, such as preventing scratches.
- the coating resin examples include an acrylic resin, an ultraviolet-curable epoxy resin, a room-temperature / medium-temperature-curable epoxy resin, a moisture-curable silicone resin, and a mixture of two or more resins selected from these.
- the mixing mass ratio of two resins selected from these resins is preferably from 1: 0.05 to 0.05: 1.
- the resin is resistant to polar solvents, it means that the coated surface does not easily melt, swell, or stick when wiped with a cloth soaked in a polar solvent. This means that dust and dust such as carbon fine particles derived from carbon fibers are not substantially scattered. Furthermore, it means that the cloth used for wiping the resin-coated surface is not substantially contaminated with the fine carbon particles.
- electrolyte 14 refers to an acetone-based or alcohol-based solvent and the like, for example, acetone, getyl ketone, methyl ethyl ketone, methanol, ethanol, isopropyl alcohol, and mixtures thereof.
- acrylic resin examples include polyester acrylate, urethane acrylate, polyether acrylate, epoxy acrylate, polybutadiene acrylate, silicone acrylate, acrylic acrylate, and mixtures thereof.
- a peroxide for room temperature curing or a catalyst for UV curing Can be added to cure the resin at room temperature or by irradiation with ultraviolet light.
- the room temperature / medium temperature curable epoxy resin is an epoxy resin which is usually cured at 10 ° C to 90 ° C, preferably at 20 ° C to 80 ° C. Curing at 90 ° C or lower can prevent thermal deformation of the CFRP member.
- an epoxy resin obtained by reacting an alicyclic amine and / or an aromatic amamine with an epoxy resin can be preferably used.
- the ultraviolet-curable epoxy resin for example, a liquid bisphenol-type epoxy resin, an alicyclic epoxy resin, or a mixture thereof can be used.
- An aromatic diazonium salt, an aromatic rhododium salt, an aromatic sulfonium salt, a methazine compound or a mixture thereof can be added to a UV-curable epoxy resin as a curing catalyst.
- silicone resin an alkyd-modified silicone resin, an epoxy-modified silicone resin, a moisture-curable alcohol-type silicone resin, a moisture-curable oxime-type silicone resin, and an addition-reaction-type silicone resin can be used.
- Moisture-curable alcohol-type silicone resin, moisture Cured oxime-type silicone resins are preferred.
- moisture-curable alcohol-type silicone resin examples include SR240, SR240, SR240, and SR216 (trade names, manufactured by Toray Dow Koung Silicone Co., Ltd.). And KE 4895 (trade name, manufactured by Shin-Etsu Chemical Co., Ltd.) can be used. ,
- dibutyltin diacetate, dibutyltin diallate, and a mixture thereof are used as a curing catalyst for the moisture-curable alcohol-type silicone resin.
- the moisture-hardened oxime-type silicone resin include SR2405 and SR2411 (trade names, manufactured by Toray Dow Corning Silicone Co., Ltd.) and KE444 (trade names) And Shin-Etsu Chemical Co., Ltd.) can be used.
- dibutyltin diacetate and dibutyltin dilaurate are used similarly to the moisture-curable alcohol-type silicone resin. And mixtures thereof.
- a coating resin diluted to 5 to 60 parts by mass with a solvent is applied to the processed surface of a single wafer, and the applied resin is heated and cured at 70 ° C or less. Is preferably used. According to this method, a dummy wafer having a processing surface covered with a resin (coating resin) that is resistant to a polar solvent and that cures at a low temperature of 70 ° C. or less can be obtained.
- the concentration of the coating resin diluted with the solvent By setting the concentration of the coating resin diluted with the solvent to 5 parts by mass or more, the coating obtained by applying the diluted coating resin to the processed surface can be prevented from becoming thin.By setting the concentration to 60 parts by mass or less, It is possible to excellently prevent unevenness due to uneven coating on the surface of the member after the applied coating resin is cured.
- the method of applying the coating resin is not particularly limited, and any method can be used as appropriate. However, any method can be used as long as it can be applied and coated on the processed surface of the dummy wafer, and brush coating, spray spraying, roll coating, and the like can be employed.
- the thickness of the coating layer obtained by applying and curing the coating resin diluted with a solvent is, for example, 5 ⁇ ! 330 ⁇ .
- the thickness is, for example, 5 ⁇ ! 330 ⁇ .
- the curing temperature of the coating resin is preferably 20 ° C. to 70 ° C., and by curing at 70 ° C. or lower, it is possible to prevent the dummy wafer from being warped or deformed by heat during curing. Can be prevented.
- Example 1 Stacking of dummy wafer
- the dummy wafer shown in Fig. 4 was created by the following procedure.
- Bisphenol A type epoxy resin Yepototo YD128 (trade name, Toto i ⁇ M) 30 parts by mass, phenol nopolak type epoxy resin Yepotote YDPN 638 (trade name, Toto Kaseinet: fc). 50 parts by mass, phenoxy resin 10 parts by mass of Enototo YP50 (trade name, manufactured by Toto Kasei Co., Ltd.) were mixed at 200 ° C for 1.5 hours and cooled to 90 ° C.
- Epototo YH434 (trade name, manufactured by Toto Kasei Co., Ltd.), which is a glycidylamine type epoxy resin, and 4,4'-diaminodiphenyl sulfone (DDS), which is a curing agent (trade name: Seika Cure I S, 40 parts by mass were uniformly mixed under vacuum degassing to obtain a heat-resistant epoxy resin composition, which was then transferred to another container and cooled.
- Unidirectional prepreg sheet obtained by impregnating the pitch-based carbon fibers having a tensile modulus of 80 OGP a in one direction and impregnating with the epoxy resin composition obtained in (1) above (fiber mass per unit area: 70 gZm 2.
- Resin content 38 mass%, thickness 0.067mm
- the volume ratio in the skin layer of the cured product of the former pre-predder using pitch-based carbon fibers was 43%, and the remaining 57% was the cured product of the latter pre-predder using PAN-based carbon fibers.
- the pre-prepared sheet containing the pitch-based carbon fibers becomes CFRP layers 22a and 22b containing the pitch-based carbon fibers, and the pre-prepared sheet containing the PAN-based carbon fibers contains the PAN-based carbon fibers.
- the CFRP layers are 21a and 21b (these are the outermost CFRP layers).
- Unidirectional prepreg sheet obtained by uniformly arranging pitch-based carbon fibers having a tensile modulus of 60 OGPa in one direction and impregnating the epoxy resin composition (fiber mass per unit area) : 50 g / m Resin content: 38% by mass, thickness: 0.048 mm) and a glass fiber fabric having glass fibers in two orthogonal directions are impregnated with the epoxy luster composition obtained in (1) above.
- the unidirectional prepreg sheet having the pitch-based carbon fiber having a tensile modulus of 600 GPa was set so that the reinforcing direction was + 45 ° with respect to the reference direction of the dummy wafer.
- the reinforcement direction is -45 with respect to the reference direction of the dummy wafer.
- the unidirectional pre-predator sheet having the pitch-based carbon fiber having a tensile modulus of 60 OGP a is laminated one by one so that the reinforcing direction is + 45 ° with respect to the reference direction of the dummy wafer, and the auto pre-prepared sheet is auto-stacked. It was cured by crepe to produce a 0.258 mm thick core layer.
- the volume ratio in the core layer of the cured product of the former pre-preda using pitch-based carbon fibers was 74%, and the remaining 26% was the cured product of the latter pre-preda using glass fibers.
- the laminate of the pre-prepared sheet containing the pitch-based carbon fiber becomes CFRP layers 23a and 23b containing the pitch-based carbon fiber when the dummy wafer is completed, and the pre-prepared sheet containing the glass fiber is made of glass fiber-reinforced plastic containing the glass fiber. Layer 24.
- Two skin layers are prepared, and the core layer is arranged and joined between the two skin layers. Further, a carbon fiber woven fabric having a tensile modulus of 230 GPa (satin weave, thickness 1mm) to form a carbon fiber cloth layer, and the thickness is 0. A 77 Omm CFRP plate was obtained. This cloth layer becomes carbon fiber cloth layers 31a and 3 lbs when completed. A disk-shaped wafer substrate with a diameter of 300 mm was obtained from the CFRP plate by machining. Note that the orientation directions of the carbon fibers of the outermost CF RP layers existing in the two skin layers were aligned.
- a moisture-curing alcohol-type silicone coating agent SR2410 (trade name, Toray Dow Koyung) 'Silicon Corporation, resin concentration 20 parts by mass, solvent: rig mouth-in') was applied to the caro surface using a brush. After drying the applied silicone coating agent, it was cured in a drying oven at 50 ° C. for 1 hour to form a coating layer 4 to obtain a dummy wafer, in order to further sufficiently cure the coating agent.
- a strip-shaped test piece having a width of 2 Omm and a length of 8 Omm (X thickness of 0.770 mm) was cut out.
- the cut-out direction of the test piece is such that the reference direction of the dummy wafer matches the length direction of the test piece (0 ° test piece), and the direction of the test piece is 90 ° with respect to the reference direction of the dummy wafer. It was classified into two types, one that matches the direction (90 ° test piece).
- the flexural modulus was measured by a three-point bending test. The distance between the fulcrums in the three-point bending test was 6 Omm.
- Table 2 the dummy wafer in Example 1 was isotropic with a small difference in the bending elasticity at 90 ° with respect to the reference direction and the reference direction.
- a graphite plate (mass: lkg) with almost the same shape as the dummy wafer was placed on the dummy wafer, and then placed in an electric furnace at 200 ° C in air for 10 minutes. Thereafter, the sample was taken out of the furnace, left at room temperature for 10 minutes and air-cooled, and subjected to 50 thermal shock tests. As a result, no abnormality such as warpage or peeling occurred. In addition, there was no change in mass before and after the test.
- Example 2 The vacuum degree 7. 0X 10- 3 P a following conditions to evaluate the outgas JP ⁇ production.
- the dummy wafer of Example 1 had good art gas characteristics with respect to the mass loss and the deviation of the recondensable substance amount ratio.
- Example 2
- An epoxy resin composition was prepared in the same manner as in Example 1.
- PAN-based carbon fibers having a tensile modulus of 23 OGPa are unidirectionally aligned and unidirectionally prepreg sheet obtained by impregnating the epoxy resin composition obtained in (1) above (fiber mass per unit area: Three types of unidirectional carbon fiber pre-predator sheets of 45 g / m 2 , resin content: 38% by mass, and thickness of 0.047 mm) were used.
- a one-way pre-predeer sheet having a pitch-based carbon fiber having a bow I tension elasticity of 50 OGPa and a one-way pre-predeer sheet having a pitch-based carbon fiber having a bow I tension elasticity of 80 OGP a are used.
- a unidirectional pre-predesheet having a PAN-based carbon fiber having a tensile modulus of 23 OGPa is used.
- one unidirectional pre-predator sheet (pitch-reinforced carbon fiber with a tensile modulus of 50 OGPa) (the reinforcement direction is the reference direction of the dummy wafer) is placed, and the tensile elasticity is placed on it.
- One-way pre-prepared sheets having a pitch-based carbon fiber with a rate of 80 OGP a were laminated one by one so that the reinforcing direction was 90 °, + 45 °, and -45 ° in order with respect to the reference direction of the dummy wafer. .
- a unidirectional pre-predator sheet having a PAN-based carbon fiber having a tensile modulus of 23 OGPa is laminated from above, so that the reinforcing direction is the reference direction of the dummy wafer, and a tensile modulus of elasticity of 23 ′ is placed thereon.
- Two unidirectional pre-prepared sheets with PAN-based carbon fiber of OGP a are laminated so that the reinforcing direction is orthogonal to the reference direction of the dummy wafer, and PAN-based carbon fiber with a tensile modulus of 23 OGP a is further placed thereon.
- One unidirectional pre-preda sheet having the following was laminated so that the strengthening direction was the reference direction of the dummy wafer.
- a unidirectional pre-predator sheet having pitch-based carbon fibers having a tensile modulus of 800 GPa is further placed thereon so that the reinforcing direction is set at 1 45 °, + 45 °, and 90 ° in order with respect to the reference direction of the dummy evaporator.
- a unidirectional pre-predacy with pitch-based carbon fibers with a tensile modulus of 50 OGPa One sheet was laminated so that the strengthening direction was the reference direction of the dummy wafer.
- the laminated structure of the dummy wafer according to Example 2 includes (500 GPa, 0 °, 1 layer), (800 GPa, 90 °, 1 layer), (800 GPa, + 45 °, (1 layer), (800GPa, 45 °, 1 layer), (230GPa, 0 °, 1 layer), (230GPa, 90 °, 2 layers), (230GPa, 0 °, 1 layer), (800GPa, -45 °, 1st layer), (800GPa, + 45 °, 1st layer), (800GPa, 90., 1st layer) and (500GPa, 0 °, 1st layer).
- (500 GPa, 0 °, one layer) indicates that there is one one-dimensional reinforced CFRP layer in which carbon fibers having a tensile modulus of 500 GPa are oriented in the 0 ° direction (the same applies hereinafter).
- Example 2 After providing a carbon fiber cloth layer on each of the main surfaces of the above-mentioned prepredder laminate in the same manner as in Example 1, it was cured by autoclaving. From this CFRP plate, a 0.772 mm thick, 300 mm diameter was obtained. A disk-shaped wafer substrate was obtained.
- a dummy wafer was prepared in the same manner as in Example 1 except that this wafer substrate was used.
- a strip-shaped test piece having a width of 2 Omm and a length of 8 Omm (thickness of 0.772 mm) was cut out.
- the cut-out direction of the test piece is such that the reference direction of the dummy wafer matches the length direction of the test piece (0 ° test piece), and the direction of the test piece is 90 ° with respect to the reference direction of the dummy wafer. What matches the direction
- Example 2 (90 ° test piece). Using the test piece, the flexural modulus was measured by a three-point bending test. The distance between the fulcrums in the three-point bending test was 6 Omm. As shown in Table 1, the dummy wafer in Example 2 was isotropic with a small difference in flexural modulus at 90 ° with respect to the reference direction and the reference direction.
- a graphite plate (mass: l kg) with almost the same shape as the dummy wafer was placed on the dummy wafer, and then placed in an electric furnace at 200 ° C for 10 minutes in the atmosphere. After that, they were taken out of the furnace and left at room temperature for 10 minutes to be cooled by air. As a result, no abnormality such as warpage or peeling occurred. There was no change in mass before and after the test.
- the vacuum degree 7. 0 X 10- 3 P a following conditions to evaluate the outgassing characteristics.
- the dummy wafer of Example 2 had good gas gas characteristics with respect to mass loss, resimulated substance amount ratio, and deviation.
- An epoxy resin composition was prepared in the same manner as in Example 1.
- the skin layer includes a 0.052 mm-thick pre-prepared sheet and a PAN-based carbon fiber having a tensile modulus of 38 OGPa.
- a unidirectional pre-predeer sheet having a tensile modulus of 23 OGPa and a PAN-based carbon fiber having a tensile modulus of 23 OGPa is used as the core layer.
- a substrate having a skin layer and a core layer was integrally molded.
- the laminating order first, of the unidirectional pre-prepared sheets containing PAN-based carbon fibers with a tensile modulus of 23 OGPa, a 0.052 mm-thick pre-prepared sheet (the reinforcing direction is the 0 ° direction of the dummy wafer) ), And a unidirectional pre-predator sheet having PAN-based carbon fiber with a tensile modulus of 38 OGPa is placed on it, and the strengthening direction is 90 °, + 45 ° in order to the 0 ° direction of the dummy wafer. One sheet each was stacked so that it would be 45 °.
- One pre-prepader sheet of 052 mm was laminated so that the strengthening direction was the 0 ° direction of the dummy wafer.
- the laminated structure of the dummy wafer according to the third embodiment is, in order from one main surface side, (230 GPa, 0 °, 1 layer), (380 GPa, 90 °, 1 layer), (380 GPa, + 45 ° , 1 layer), (380GPa, 45 °, 1 layer), (230GPa, 0 °, 1 layer), (230GPa, 90 °, 2 layers), (230GPa, 0 °, 1 layer) , (380GPa, 45 °, 1st layer), (380GPa, + 45 °, 1st layer), (380GPa, 90 °, 1st layer) and (230GPa, 0 °, 1st layer).
- a carbon fiber cloth layer was provided on each of the main surfaces of the prepreg laminate in the same manner as in Example 1 and then hardened by autoclave. From this CFRP plate, a 0.74 mm thick, 300 mm diameter plate was obtained. A disk-shaped wafer substrate was obtained.
- a dummy wafer was prepared in the same manner as in Example 1 except that this wafer substrate was used.
- a strip-shaped test piece having a width of 2 Omm and a length of 80 mm (X thickness of 0.774 mm) was cut out.
- the cut-out direction of the test piece is that the reference direction of the dummy wafer is the same as the length direction of the test piece (0 ° test piece), and the direction of the test piece is 90 ° with respect to the reference direction of the dummy wafer.
- the direction (90 ° test piece) that coincided with the vertical direction was used.
- the flexural modulus was measured by a three-point bending test. The distance between the fulcrums in the three-point bending test was 6 Omm.
- Table 2 the dummy wafer in Example 2 was isotropic, with a small difference in flexural modulus at 90 ° with respect to the reference direction and the reference direction.
- Thickness change The thickness of the center of the dummy wafer and the circumference of 3 Omm, 6 Omm, 90 mm, 120 mm, and 15 Omm (circumferential portion of the dummy wafer) in the radial direction from the center were measured every 15 °. The number of thickness measurement points was 121. The difference between the maximum thickness and the minimum thickness was 0.02 mm, and the dummy wafer of Example 3 had a uniform thickness.
- & plate (mass: l kg) with almost the same shape as the dummy wafer was placed on the dummy wafer, and then placed in an electric furnace at 200 ° C in air for 10 minutes. Thereafter, the sample was taken out of the furnace, left at room temperature for 10 minutes and air-cooled, and subjected to 50 thermal shock tests. As a result, no abnormality such as warpage or peeling occurred. In addition, there was no change in mass before and after the test.
- Example 4 Outgassing characteristics were evaluated under the conditions of a vacuum degree of 7.0 X 10-3 Pa or less.
- the dummy wafer of Example 3 had good art gas characteristics with respect to the mass loss and the deviation of the recondensable substance amount ratio.
- Example 4
- An epoxy resin composition was prepared in the same manner as in Example 1.
- Unidirectional prepreg sheet obtained by pulling PAN-based carbon fibers having a tensile modulus of 23 OGP a in one direction and impregnating the epoxy resin composition obtained in (1) above (fiber mass per unit area: 70 g / m 2, resin content: 37 mass 0/0, were used thickness 0. 072mm).
- the unidirectional pre-prepared sheet with AN-based carbon fiber is reinforced in order with the reinforcing direction to the reference direction of the dummy wafer.
- a total of eight sheets were stacked, one each at 0 °, 90 °, + 45 °, -45 °, one 45 °, + 45 °, 90 ° and 0 °.
- a carbon fiber cloth layer was provided on each of the main surfaces of the pre-preda laminate in the same manner as in Example 1 and then cured by autoclaving. From this CFRP plate, a thickness of 0.776 mm and a diameter of 300 mm were obtained. Was obtained.
- a dummy wafer was prepared in the same manner as in Example 1, except that this wafer substrate was used, and that no coating layer was provided on the processed surface.
- Example 1 the processed surface was wiped with a dust-free clean cloth impregnated with ethanol, and black stains were observed on the clean cloth. No such phenomenon was observed on surfaces other than the machined surface.
- a strip-shaped test piece having a width of 20111111 and a length of 80111111 (X thickness: 0.776 mm) was cut out.
- the cut-out direction of the test piece is such that the reference direction of the dummy wafer matches the length direction of the test piece (0 ° test piece), and the direction of the test piece is 90 ° with respect to the reference direction of the dummy wafer.
- the flexural modulus was measured by a three-point bending test. The distance between the fulcrums in the three-point bending test was 6 Omm.
- Example 4 had a larger difference in flexural modulus at 90 ° with respect to the reference direction and the reference direction as compared with Examples 1 to 3, and anisotropy was observed in rigidity.
- J'I4 had enough to be used as a dummy wafer.
- Table 2 Mechanical property tests
- a dummy wafer which is rigid, has high strength, is relatively inexpensive, and is responsive to an optical sensor.
- dummy wafers with low dust generation and dummy wafers with heat resistance were provided.
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Abstract
Description
Claims
Priority Applications (3)
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JP2005504241A JP4599293B2 (ja) | 2003-03-31 | 2004-03-30 | ダミーウエハ |
US10/549,981 US20060186404A1 (en) | 2003-03-31 | 2004-03-30 | Dummy wafer |
EP04724415A EP1610360A4 (en) | 2003-03-31 | 2004-03-30 | FICTIVE PLATE |
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JP2003-096293 | 2003-03-31 | ||
JP2003096293 | 2003-03-31 |
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WO2004088733A1 true WO2004088733A1 (ja) | 2004-10-14 |
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PCT/JP2004/004514 WO2004088733A1 (ja) | 2003-03-31 | 2004-03-30 | ダミーウエハ |
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US (1) | US20060186404A1 (ja) |
EP (1) | EP1610360A4 (ja) |
JP (1) | JP4599293B2 (ja) |
KR (1) | KR20050113267A (ja) |
CN (1) | CN1768414A (ja) |
TW (1) | TW200511473A (ja) |
WO (1) | WO2004088733A1 (ja) |
Cited By (1)
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WO2018127976A1 (ja) * | 2017-01-06 | 2018-07-12 | 株式会社ジャムコ | ディスペンサ装置を用いて、複合材部品の炭素繊維露出端部をシールする絶縁被覆方法 |
Families Citing this family (5)
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US20090142645A1 (en) * | 2007-11-30 | 2009-06-04 | Valtion Teknillinen Tutkimuskeskus | Bipolar plate, method for producing bipolar plate and PEM fuel cell |
JP6993092B2 (ja) * | 2017-03-27 | 2022-02-04 | 本田技研工業株式会社 | 繊維強化樹脂製品 |
CN108666233B (zh) * | 2017-03-31 | 2021-02-05 | 上海新昇半导体科技有限公司 | 一种可用作挡片或控片的晶片制备方法及晶片 |
JP7116549B2 (ja) * | 2018-02-06 | 2022-08-10 | 信越ポリマー株式会社 | ダミーウェーハ |
US11192988B2 (en) * | 2019-02-13 | 2021-12-07 | Kompozitor Kft. | Phenol-furan resin composition |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091171A (ja) * | 1998-09-09 | 2000-03-31 | Bridgestone Corp | ウェハ |
JP2002274948A (ja) * | 2001-03-23 | 2002-09-25 | Toshiba Ceramics Co Ltd | 半導体熱処理用シリコン−炭化ケイ素複合部材 |
JP2003068594A (ja) * | 2001-08-29 | 2003-03-07 | Tokai Carbon Co Ltd | SiCダミーウエハ及びその製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4956411A (en) * | 1988-02-05 | 1990-09-11 | Mitsubishi Rayon Company, Ltd. | Epoxy resin composition for composite material from m- or o-substituted triglycidylaminophenols, diaminodiphenylsulfone and latent curing agents |
US5151327A (en) * | 1990-03-15 | 1992-09-29 | Nitto Denko Corporation | Adhesive sheet for reinforcing thin rigid plates |
TW252128B (ja) * | 1992-02-07 | 1995-07-21 | Nippon Steel Corp | |
US5447785A (en) * | 1993-03-02 | 1995-09-05 | Toray Industries, Inc. | Cloth prepreg, process for producing the same and reinforcing fabric |
JPH1012692A (ja) * | 1996-06-25 | 1998-01-16 | Nisshinbo Ind Inc | ダミーウエハ |
JPH11124693A (ja) * | 1997-10-20 | 1999-05-11 | Nippon Steel Corp | 精密機器用部材 |
JP3641553B2 (ja) * | 1998-06-16 | 2005-04-20 | 新日本石油株式会社 | 繊維強化複合材料成形体 |
US6177143B1 (en) * | 1999-01-06 | 2001-01-23 | Allied Signal Inc | Electron beam treatment of siloxane resins |
JP3211203B2 (ja) * | 1999-03-29 | 2001-09-25 | 川崎重工業株式会社 | 高強度繊維強化複合材料及びその製造方法 |
JP2000343476A (ja) * | 1999-06-09 | 2000-12-12 | Nippon Mitsubishi Oil Corp | 搬送用部材 |
DE10018290B4 (de) * | 2000-04-13 | 2004-07-15 | Elringklinger Ag | Zylinderkopfdichtung und Verfahren zu ihrer Herstellung |
US6841273B2 (en) * | 2000-12-27 | 2005-01-11 | Toshiba Ceramics Co., Ltd. | Silicon/silicon carbide composite and process for manufacturing the same |
US6815037B2 (en) * | 2001-09-19 | 2004-11-09 | Nippon Mitsubishi Oil Corporation | Carrier member made of a UV resistant fiber-reinforced composite material and process for producing thereof |
US6703116B2 (en) * | 2001-09-19 | 2004-03-09 | Nippon Mitsubishi Oil Corporation | CFRP component for use in conveyor with its processed surface coated and method of coating |
-
2004
- 2004-03-29 TW TW093108555A patent/TW200511473A/zh unknown
- 2004-03-30 JP JP2005504241A patent/JP4599293B2/ja not_active Expired - Fee Related
- 2004-03-30 CN CNA2004800090784A patent/CN1768414A/zh active Pending
- 2004-03-30 EP EP04724415A patent/EP1610360A4/en not_active Withdrawn
- 2004-03-30 WO PCT/JP2004/004514 patent/WO2004088733A1/ja active Application Filing
- 2004-03-30 US US10/549,981 patent/US20060186404A1/en not_active Abandoned
- 2004-03-30 KR KR1020057018403A patent/KR20050113267A/ko not_active Application Discontinuation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000091171A (ja) * | 1998-09-09 | 2000-03-31 | Bridgestone Corp | ウェハ |
JP2002274948A (ja) * | 2001-03-23 | 2002-09-25 | Toshiba Ceramics Co Ltd | 半導体熱処理用シリコン−炭化ケイ素複合部材 |
JP2003068594A (ja) * | 2001-08-29 | 2003-03-07 | Tokai Carbon Co Ltd | SiCダミーウエハ及びその製造方法 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1610360A4 * |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018127976A1 (ja) * | 2017-01-06 | 2018-07-12 | 株式会社ジャムコ | ディスペンサ装置を用いて、複合材部品の炭素繊維露出端部をシールする絶縁被覆方法 |
JP6367487B1 (ja) * | 2017-01-06 | 2018-08-01 | 株式会社ジャムコ | ディスペンサ装置を用いて、複合材部品の炭素繊維露出端部をシールする絶縁被覆方法 |
US10618068B2 (en) | 2017-01-06 | 2020-04-14 | Jamco Corporation | Method for applying insulative coating to carbon-fiber exposed end of composite material part using dispenser device |
Also Published As
Publication number | Publication date |
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KR20050113267A (ko) | 2005-12-01 |
JPWO2004088733A1 (ja) | 2006-07-06 |
TW200511473A (en) | 2005-03-16 |
EP1610360A1 (en) | 2005-12-28 |
JP4599293B2 (ja) | 2010-12-15 |
EP1610360A4 (en) | 2010-07-14 |
CN1768414A (zh) | 2006-05-03 |
US20060186404A1 (en) | 2006-08-24 |
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